WO2012104989A1 - 薄板ガラス基板貼合体およびその製造方法 - Google Patents
薄板ガラス基板貼合体およびその製造方法 Download PDFInfo
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- WO2012104989A1 WO2012104989A1 PCT/JP2011/052006 JP2011052006W WO2012104989A1 WO 2012104989 A1 WO2012104989 A1 WO 2012104989A1 JP 2011052006 W JP2011052006 W JP 2011052006W WO 2012104989 A1 WO2012104989 A1 WO 2012104989A1
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- WIPO (PCT)
- Prior art keywords
- glass substrate
- film
- substrate
- temporarily attached
- peeled
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/06—Substrate layer characterised by chemical composition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
Definitions
- the present invention relates to a thin glass substrate bonded body having a low thickness and capable of guarding almost 100% of permeation of gas and water vapor, and a method for producing the same.
- the resistance value of the electrode must be lowered when high performance characteristics are required. In that case, processing at a high temperature is required, and there is a limit in the film.
- the present inventors invented the flexible glass substrate described in Patent Document 1.
- the demands of the above market have increased further, and it has been desired to develop a touch panel that is thinner and lighter and has high permeability, high performance, and high reliability in order to extend the life and life of the battery.
- the glass thinned to the maximum is the flexible glass described in Patent Document 1 invented by the present inventors, and it is extremely difficult to make the glass thinner than this.
- the base film is adhered because it is easily broken when the glass is thinned, the base film is an essential component. Therefore, in order to simply thin the flexible glass, the current situation is that the thickness of the base film must be reduced. This is because if the thickness of the base film is reduced, the thickness is reduced as a whole, and the transparency as an optical characteristic is increased.
- the present invention is as follows to meet the further demands of the market. That is, the present invention is to provide a thin glass substrate laminate and a method for producing the same, which can guard almost 100% of gas and water vapor permeation, and have higher transparency and thickness than conventional ones.
- the method for producing a laminated thin glass substrate according to the present invention comprises forming a pattern on one surface of a glass substrate, then temporarily attaching a support to this one surface, The glass substrate is thinned by etching the surface, the film base is temporarily attached to the other surface after the etching treatment, the support temporarily attached to one surface of the glass substrate is peeled off, and the support is Bond one surface after peeling and one surface of cover glass, cover film or display panel, The temporarily attached film base material is peeled off from the other surface.
- the manufacturing method of the thin glass substrate sticking united body of this invention is, after forming a pattern in one surface of a glass substrate, a support body is temporarily attached to this one surface, and the other surface of this glass substrate is etched.
- the glass substrate is thinned, a film base is temporarily attached to the other surface after the etching treatment, the support temporarily attached to one surface of the glass substrate is peeled off, and the second film is applied to the one surface.
- a base material is temporarily attached, a film base material temporarily attached to another surface is peeled off, a surface exposed by peeling the film base material, and one surface of a cover glass, a cover film or a display panel,
- the second film base material bonded and temporarily attached is peeled off from one surface.
- a COG substrate having an FPC or IC bonded thereto may be attached to one surface of the glass substrate.
- the glass substrate is a large glass substrate, and the film base and the second film base have a size corresponding to the large glass, and after the support is peeled off or the second film is temporarily attached. Later, it may be cut into product sizes.
- FIG. 1 is a diagram for explaining a method for producing a thin glass substrate bonded body of the present invention, an explanatory view showing a thinning step and a base film bonding step
- FIG. 2 is a production of a thin glass substrate bonded body of the present invention.
- FIG. 3 is explanatory drawing which shows the thin glass substrate bonding process in the other manufacturing method of the thin glass substrate bonding body of this invention.
- the glass substrate shown in FIG. 1 (f) is after being thinned by etching
- the glass substrate shown in FIG. 1 (a) is different in configuration in terms of thickness, but only in thickness. Therefore, the same reference numerals are given.
- the thin glass substrate bonding body of this invention is demonstrated as an electrostatic capacitance type touch panel (henceforth only a "touch panel”), it is not limited to this.
- the glass substrate 1 thinned in the process of the method for producing the thin glass substrate bonded body of the present invention and the cover glass 6 are bonded by an adhesive 7. .
- the adhesion surface is a surface on which the pattern P of the glass substrate 1 is formed.
- the touch panel of the present invention is used when manufacturing a thin display such as a liquid crystal display, an organic EL display, a plasma panel display, and electronic paper, and other keyboard substitutes.
- the method for forming the pattern P on the glass substrate various existing methods can be applied.
- a method of forming a film of an indium-tin composite oxide (ITO) by a dry process such as a vacuum evaporation method or a sputtering method.
- ITO indium-tin composite oxide
- the material of the film substrate 5 used in the present invention is not particularly limited.
- a glass substrate 1 is prepared.
- the thickness of the glass substrate 1 is not particularly limited, but a thickness of 0.2 to 0.7 mm is preferable in consideration of workability.
- the size of the glass substrate 1 for example, if the plate thickness is 0.2 mm, 300 mm square, 400 mm square, and 1 mm square can be used if the plate thickness is 0.7 mm.
- the size of 1 is appropriately determined in relation to the plate thickness in consideration of handleability.
- a film P is formed on one surface (the upper surface in FIG. 1B) of the glass substrate 1 by CVD, sputtering, vapor deposition, plating, etc., and then a pattern P is formed by photoetching or printing.
- the pattern P may have either a single layer structure or a multilayer structure.
- the substrate size can be increased.
- a high temperature process of 150 ° to 350 ° is required when forming a pattern, there is a problem in heat resistance if it is a plastic film.
- the glass before the film substrate 5 is bonded is used. Since pattern processing is performed on the substrate 1, there is no problem in terms of heat resistance.
- the support 3 is temporarily attached to the surface of the glass substrate 1 on which the pattern P is formed via the adhesive 2.
- the support 3 can be a glass plate or a resin plate, but may be a film material if it has a certain degree of waist.
- the adhesive 2 is applied to the periphery of the glass substrate 1 so that the support 3 can be easily peeled later.
- the adhesive 2 functions to prevent the etchant from entering between the glass substrate 1 and the support 3 during etching, and is therefore acid-resistant.
- the other surface (the lower surface in FIG. 1 (d)) of the glass substrate 1 is etched by hydrofluoric acid or the like to be thinned.
- the glass substrate 1 is shaved until the plate thickness becomes 2 to 50 ⁇ m.
- etching can be performed in a state where the glass substrate 1 is supported by the support 3, so that a thin plate can be achieved. This is the effect of the invention described in Patent Document 1.
- the plate thickness is not limited to this.
- the thickness of the glass substrate 1 is cut to a desired thickness by the etching process, then, as shown in FIG. 1 (e), a film is formed on the other surface of the glass substrate 1 (the lower surface in FIG. 1 (e)).
- the substrate 5 is temporarily attached with the slightly adhesive tape 4.
- the film base 5 is to hold the thinned glass substrate 1 so as not to be broken, but is also peeled off after the glass substrate 1 is bonded to the cover glass 6. Therefore, as long as the film base material 5 can be hold
- UV curable dicing tape such as Sumilite (registered trademark) FSL manufactured by Sumitomo Bakelite Co., Ltd., slightly adhesive film made of silicon / urethane / acrylic, self-adsorption of peel strength of 0.01 to 0.20 (N / 25mm)
- Adhesive films that do not use a bonding agent such as FIXFILM (registered trademark) manufactured by Fujiko Pian Co., Ltd. are applicable.
- the support 3 temporarily attached to one surface of the glass substrate 1 is peeled off from the glass substrate 1.
- the film base temporary attachment substrate 10 in a state where the pattern P is formed and the thinned glass substrate 1 and the film base 5 are temporarily attached by the slightly adhesive tape 4 shown in FIG. Manufactured.
- methods such as softening by heat or decomposition by light, and peeling by a blade can be applied.
- a thin glass substrate transfer step shown in FIG. 2 is performed.
- the film base temporary substrate 10 manufactured as described above is cut into a product size as shown in FIG.
- the glass plate is transferred to the cover glass after the large plate is cut to the product size, but the large plate size is transferred to the cover glass or the display cell before the product is cut and then the product is transferred. You may cut to size.
- the pattern P forming surface side of the film base material temporary attachment substrate 100 cut to the product size is adhered to the cover glass 6 having the adhesive 7 on the surface (see FIGS. 2B and 2C).
- the adhesive 7 is applied to the cover glass 6 side, but the adhesive 7 may be applied to the film base temporary substrate 100 side.
- an FPC (flexible printed circuit board) 8 on which an IC 9 is mounted is attached.
- the thickness of the adhesive 7 is 5 to 200 ⁇ m and varies depending on the thickness of the FPC 8, but is generally 50 to 125 ⁇ m, preferably 75 to 125 ⁇ m, but is not limited thereto.
- a COG substrate to which an IC is bonded may be attached instead of the FPC.
- the film substrate 5 meaning cut here
- the glass substrate 1 meaning glass substrate cut into a product size here
- the peeling method of the film base material 5 changes with the raw materials of the slightly adhesive tape 4 to be used, respectively.
- a touch panel that does not use a film base material, which has been an indispensable structure in the past, can be manufactured. Furthermore, since a film base material is not used, it has excellent thermal characteristics.
- the film base 5B is temporarily attached to the surface from which the support 3 shown in FIG.
- the film base 5A and the slightly adhesive tape 4A are shown. And the same as the slightly adhesive tape 4.
- the materials of the fine adhesive tape 4A and the fine adhesive tape 4B may be the same, but it is preferable that the slightly adhesive tape 4B has a slightly higher adhesive strength. This is because the film base 5A is peeled off before the film base 5B.
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Abstract
Description
仮着されたフィルム基材を他の面から剥離してなることを特徴とする。
まず、上述のようにして製造されたフィルム基材仮着基板10を図2(a)に示すように製品サイズにカットする。なお、本実施形態においては、大板を製品サイズにカットしてからカバーガラスにガラス基板を転写しているが、大板サイズのままカバーガラスあるいは製品カット前の表示体セルに転写しその後製品サイズにカットしてもよい。
2 接着剤
3 支持体
4、4A、4B 微粘着テープ
5、5A、5B フィルム基材
6 カバーガラス
7 接着剤
8 FPC(フレキシブルプリント基板)
9 IC
10 フィルム基材仮着基板
P パターン
Claims (5)
- ガラス基板の一の面にパターン形成後、この一の面に支持体を仮着し、
該ガラス基板の他の面をエッチング処理して該ガラス基板を薄肉化し、このエッチング処理後の他の面にフィルム基材を仮着し、
ガラス基板の一の面に仮着された支持体を剥離し、
支持体が剥離された後の一の面と、カバーガラス,カバーフィルムあるいは表示パネルの一の面と、を貼合し、
仮着されたフィルム基材を他の面から剥離してなること
を特徴とする薄板ガラス基板貼合体の製造方法。 - ガラス基板の一の面にパターン形成後、この一の面に支持体を仮着し、
該ガラス基板の他の面をエッチング処理して該ガラス基板を薄肉化し、このエッチング処理後の他の面にフィルム基材を仮着し、
ガラス基板の一の面に仮着された支持体を剥離し、
この一の面に第2のフィルム基材を仮着し、
他の面に仮着されたフィルム基材を剥離し、
フィルム基材が剥離されて表出した面と、カバーガラス,カバーフィルムあるいは表示パネルの一の面と、を貼合し、
仮着された第2のフィルム基材を一の面から剥離してなること
を特徴とする薄板ガラス基板貼合体の製造方法。 - 前記ガラス基板の一の面にはFPCまたはICがボンディングされたCOG基板が取り付けてなることを特徴とする請求項1あるいは2に記載の薄板ガラス基板貼合体の製造方法。
- 前記ガラス基板は大板ガラス基板であり、前記フィルム基材及び前記第2のフィルム基材は大板ガラスに対応するサイズであり、支持体が剥離された後あるいは前記第2のフィルムが仮着された後に、製品サイズにカットされることを特徴とする請求項1~3に記載の薄板ガラス基板貼合方法。
- ガラス基板の一の面にパターン形成後、この一の面に支持体を仮着し、該ガラス基板の他の面をエッチング処理して該ガラス基板を薄肉化し、このエッチング処理後の他の面にフィルム基材を仮着し、ガラス基板の一の面に仮着された支持体を剥離してなるフィルム基材仮着基板と、
フィルム基材仮着基板のパターン形成面である一の面と、カバーガラス,カバーフィルムあるいは表示パネルの一の面と、を貼合し、仮着されたフィルム基材をフィルム基材仮着基板の他の面から剥離してなること
を特徴とする薄板ガラス基板貼合体。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180003861XA CN102548758B (zh) | 2011-02-01 | 2011-02-01 | 薄板玻璃基板贴合体及其制造方法 |
CA2772110A CA2772110C (en) | 2011-02-01 | 2011-02-01 | Thin-sheet glass substrate laminate and method of manufacturing the same |
PCT/JP2011/052006 WO2012104989A1 (ja) | 2011-02-01 | 2011-02-01 | 薄板ガラス基板貼合体およびその製造方法 |
JP2011523637A JP4845232B1 (ja) | 2011-02-01 | 2011-02-01 | 薄板ガラス基板貼合体およびその製造方法 |
KR1020127006956A KR101211961B1 (ko) | 2011-02-01 | 2011-02-01 | 박판 글라스 기판 첩합체 및 그 제조방법 |
EP11824254.4A EP2641883A4 (en) | 2011-02-01 | 2011-02-01 | THIN-PLATED GLASS SUBSTRATE BONDED BODY AND METHOD FOR MANUFACTURING THE SAME |
US13/496,609 US8398873B2 (en) | 2011-02-01 | 2011-02-01 | Thin-sheet glass substrate laminate and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/052006 WO2012104989A1 (ja) | 2011-02-01 | 2011-02-01 | 薄板ガラス基板貼合体およびその製造方法 |
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WO2012104989A1 true WO2012104989A1 (ja) | 2012-08-09 |
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PCT/JP2011/052006 WO2012104989A1 (ja) | 2011-02-01 | 2011-02-01 | 薄板ガラス基板貼合体およびその製造方法 |
Country Status (7)
Country | Link |
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US (1) | US8398873B2 (ja) |
EP (1) | EP2641883A4 (ja) |
JP (1) | JP4845232B1 (ja) |
KR (1) | KR101211961B1 (ja) |
CN (1) | CN102548758B (ja) |
CA (1) | CA2772110C (ja) |
WO (1) | WO2012104989A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016536663A (ja) * | 2013-09-29 | 2016-11-24 | ティーピーケイ タッチ ソリューションズ(シアメン)インコーポレーテッド | タッチパネルの製造方法 |
JP2021120341A (ja) * | 2014-11-04 | 2021-08-19 | コーニング インコーポレイテッド | 無アルカリガラス要素による屈曲可能なガラス物品 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4565670B1 (ja) * | 2009-10-09 | 2010-10-20 | 株式会社ミクロ技術研究所 | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
JP2012051777A (ja) * | 2010-09-03 | 2012-03-15 | Micro Gijutsu Kenkyusho:Kk | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
WO2013054503A1 (ja) * | 2011-10-12 | 2013-04-18 | シャープ株式会社 | 薄膜状電子回路を備えた表示装置の製造方法 |
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CN103631456B (zh) * | 2012-08-24 | 2017-07-04 | 深圳欧菲光科技股份有限公司 | 薄膜感应器、包含该感应器的电容触摸屏及其制作方法和终端产品 |
US11074025B2 (en) | 2012-09-03 | 2021-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US9510456B2 (en) | 2012-11-09 | 2016-11-29 | Shenzhen O-Film Tech Co., Ltd. | Transparent conductor and preparation method thereof |
CN103838407B (zh) * | 2012-11-22 | 2018-01-16 | 宸鸿科技(厦门)有限公司 | 单片玻璃触控板及其制作方法 |
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US9448666B2 (en) | 2013-06-08 | 2016-09-20 | Microsoft Technology Licensing, Llc | Dark film lamination for a touch sensor |
KR20150016791A (ko) | 2013-08-05 | 2015-02-13 | 삼성디스플레이 주식회사 | 액정 표시 패널의 제조 방법 및 이를 위한 기판 적층체 |
JP6222816B2 (ja) * | 2013-08-28 | 2017-11-01 | 藤森工業株式会社 | 化学研磨処理用表面保護フィルム |
KR102087193B1 (ko) * | 2013-09-09 | 2020-04-16 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치의 제조 방법 및 터치 패널의 제조 방법 |
CN106132688B (zh) | 2014-01-27 | 2020-07-14 | 康宁股份有限公司 | 用于薄片与载体的受控粘结的制品和方法 |
US9321677B2 (en) | 2014-01-29 | 2016-04-26 | Corning Incorporated | Bendable glass stack assemblies, articles and methods of making the same |
JP2017518954A (ja) | 2014-04-09 | 2017-07-13 | コーニング インコーポレイテッド | デバイスで改質された基体物品、およびそれを製造する方法 |
JP6711824B2 (ja) * | 2014-11-05 | 2020-06-17 | コーニング インコーポレイテッド | 非平面状の構造的特徴および無アルカリガラス要素を有するガラス物品 |
CN104943320B (zh) * | 2015-05-18 | 2017-03-08 | 京东方科技集团股份有限公司 | 一种基板的贴合方法 |
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KR102524620B1 (ko) | 2015-06-26 | 2023-04-21 | 코닝 인코포레이티드 | 시트 및 캐리어를 포함하는 방법들 및 물품들 |
TW201737766A (zh) * | 2016-01-21 | 2017-10-16 | 康寧公司 | 處理基板的方法 |
TW201825623A (zh) | 2016-08-30 | 2018-07-16 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
CN106354319B (zh) * | 2016-08-31 | 2019-07-05 | 京东方科技集团股份有限公司 | 触摸屏的制备方法、及触控显示装置的制备方法 |
TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
JP7260523B2 (ja) | 2017-08-18 | 2023-04-18 | コーニング インコーポレイテッド | ポリカチオン性高分子を使用した一時的結合 |
US11331692B2 (en) | 2017-12-15 | 2022-05-17 | Corning Incorporated | Methods for treating a substrate and method for making articles comprising bonded sheets |
CN110556345B (zh) * | 2018-05-31 | 2020-12-15 | 浙江清华柔性电子技术研究院 | 柔性器件的制作方法 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06262743A (ja) * | 1993-03-11 | 1994-09-20 | Seiko Epson Corp | 接合装置 |
JP2003222842A (ja) * | 2002-01-31 | 2003-08-08 | Hitachi Ltd | 液晶表示装置 |
JP2008037094A (ja) * | 2006-07-11 | 2008-02-21 | Nippon Synthetic Chem Ind Co Ltd:The | 積層体、その製造方法、及びその用途 |
JP4565670B1 (ja) * | 2009-10-09 | 2010-10-20 | 株式会社ミクロ技術研究所 | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2391745C (en) * | 2002-06-25 | 2012-08-14 | Albert Mark David | Touch screen display using ultra-thin glass laminate |
JP4063082B2 (ja) * | 2003-01-10 | 2008-03-19 | 日本電気株式会社 | フレキシブル電子デバイスとその製造方法 |
JP2006049800A (ja) * | 2004-03-10 | 2006-02-16 | Seiko Epson Corp | 薄膜デバイスの供給体、薄膜デバイスの供給体の製造方法、転写方法、半導体装置の製造方法及び電子機器 |
JP2006059535A (ja) * | 2004-08-17 | 2006-03-02 | Seiko Instruments Inc | 有機電子デバイスの製造方法 |
WO2007129554A1 (ja) * | 2006-05-08 | 2007-11-15 | Asahi Glass Company, Limited | 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板 |
JP4327180B2 (ja) * | 2006-07-24 | 2009-09-09 | 株式会社東芝 | 表示装置 |
-
2011
- 2011-02-01 CA CA2772110A patent/CA2772110C/en active Active
- 2011-02-01 KR KR1020127006956A patent/KR101211961B1/ko active IP Right Grant
- 2011-02-01 EP EP11824254.4A patent/EP2641883A4/en not_active Withdrawn
- 2011-02-01 US US13/496,609 patent/US8398873B2/en active Active
- 2011-02-01 CN CN201180003861XA patent/CN102548758B/zh active Active
- 2011-02-01 JP JP2011523637A patent/JP4845232B1/ja active Active
- 2011-02-01 WO PCT/JP2011/052006 patent/WO2012104989A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06262743A (ja) * | 1993-03-11 | 1994-09-20 | Seiko Epson Corp | 接合装置 |
JP2003222842A (ja) * | 2002-01-31 | 2003-08-08 | Hitachi Ltd | 液晶表示装置 |
JP2008037094A (ja) * | 2006-07-11 | 2008-02-21 | Nippon Synthetic Chem Ind Co Ltd:The | 積層体、その製造方法、及びその用途 |
JP4565670B1 (ja) * | 2009-10-09 | 2010-10-20 | 株式会社ミクロ技術研究所 | フレキシブルガラス基板の製造方法及びフレキシブルガラス基板 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2641883A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016536663A (ja) * | 2013-09-29 | 2016-11-24 | ティーピーケイ タッチ ソリューションズ(シアメン)インコーポレーテッド | タッチパネルの製造方法 |
JP2021120341A (ja) * | 2014-11-04 | 2021-08-19 | コーニング インコーポレイテッド | 無アルカリガラス要素による屈曲可能なガラス物品 |
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CN102548758A (zh) | 2012-07-04 |
CN102548758B (zh) | 2013-11-20 |
CA2772110A1 (en) | 2012-06-06 |
US8398873B2 (en) | 2013-03-19 |
EP2641883A1 (en) | 2013-09-25 |
US20120223049A1 (en) | 2012-09-06 |
KR20120099210A (ko) | 2012-09-07 |
JP4845232B1 (ja) | 2011-12-28 |
CA2772110C (en) | 2013-07-23 |
JPWO2012104989A1 (ja) | 2014-07-03 |
KR101211961B1 (ko) | 2012-12-18 |
EP2641883A4 (en) | 2014-10-01 |
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