WO2011059186A3 - 솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 - Google Patents
솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 Download PDFInfo
- Publication number
- WO2011059186A3 WO2011059186A3 PCT/KR2010/007297 KR2010007297W WO2011059186A3 WO 2011059186 A3 WO2011059186 A3 WO 2011059186A3 KR 2010007297 W KR2010007297 W KR 2010007297W WO 2011059186 A3 WO2011059186 A3 WO 2011059186A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- soldered
- soldering jig
- objects
- production method
- array antenna
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
솔더링 지그가 개시된다. 복수의 솔더링 대상물이 수용되는 복수의 수용홀이 일면에서 타면으로 관통되게 형성된 장착블록, 장착블록의 일면에 결합되며 복수의 수용홀에 수용된 복수의 솔더링 대상물을 지지하는 지지부를 구비한 제1커버블록, 장착블록의 타면에 결합되며 복수의 수용홀 각각에 대향되게 돌출되어 복수의 솔더링 대상물 각각을 탄성적으로 지지하는 복수의 가압돌기를 구비한 제2커버블록을 포함하는 솔더링 지그는, 솔더링 공정에서 솔더링 대상물에 대한 압력 및 열전달을 균일하게 유지시켜, 균일한 품질로 솔더링된 건다이오드 패키지를 얻을 수 있다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/468,652 US20120217285A1 (en) | 2009-11-10 | 2012-05-10 | Soldering jig |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090108186A KR100948660B1 (ko) | 2009-11-10 | 2009-11-10 | 솔더링 지그 |
KR10-2009-0108186 | 2009-11-10 | ||
KR10-2009-0114800 | 2009-11-25 | ||
KR1020090114800 | 2009-11-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/468,652 Continuation US20120217285A1 (en) | 2009-11-10 | 2012-05-10 | Soldering jig |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011059186A2 WO2011059186A2 (ko) | 2011-05-19 |
WO2011059186A3 true WO2011059186A3 (ko) | 2011-09-09 |
Family
ID=43992176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/007297 WO2011059186A2 (ko) | 2009-11-10 | 2010-10-22 | 솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120217285A1 (ko) |
WO (1) | WO2011059186A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103008814B (zh) * | 2012-12-14 | 2015-09-16 | 中国电子科技集团公司第三十八研究所 | 一种天线子阵的真空钎焊方法 |
CN106654578A (zh) * | 2016-12-13 | 2017-05-10 | 惠州Tcl移动通信有限公司 | 一种提高天线接触性能的移动终端 |
TWI712139B (zh) * | 2019-11-19 | 2020-12-01 | 虹晶科技股份有限公司 | 封裝天線、封裝天線陣列及封裝天線的製作方法 |
KR102564798B1 (ko) * | 2020-10-30 | 2023-08-08 | 주식회사 아모센스 | 레이더 안테나 |
CN114905219B (zh) * | 2022-05-11 | 2023-12-22 | 京信射频技术(广州)有限公司 | 用于通信器件焊接的辅助工装 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148723A (ja) * | 1995-11-17 | 1997-06-06 | Nec Corp | 半田ボール転写治具 |
JPH1197349A (ja) * | 1997-09-19 | 1999-04-09 | Toshiba Corp | 化合物半導体装置およびその製造方法 |
KR100585215B1 (ko) * | 2005-06-20 | 2006-06-08 | 주식회사 명성기기 | 인쇄회로기판의 고정을 위한 지그장치 |
JP2007096465A (ja) * | 2005-09-27 | 2007-04-12 | Clarion Co Ltd | アンテナ装置 |
KR20070082316A (ko) * | 2006-02-16 | 2007-08-21 | 삼성전자주식회사 | 솔더 볼 고정 판을 이용한 솔더 볼 부착 방법 |
JP2008171992A (ja) * | 2007-01-11 | 2008-07-24 | Funai Electric Co Ltd | 半導体部品の実装方法 |
KR20090083362A (ko) * | 2006-10-04 | 2009-08-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 디바이스 및 이의 제작 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587366A (ja) * | 1981-07-08 | 1983-01-17 | Toshiba Corp | 位置合わせ治具 |
JPS6142476A (ja) * | 1984-08-07 | 1986-02-28 | Fujitsu Ltd | 半田付け方法及び半田付け治具 |
JPH0897551A (ja) * | 1994-09-26 | 1996-04-12 | Nec Kansai Ltd | 基板保持治具 |
US8118074B2 (en) * | 2007-04-10 | 2012-02-21 | Altair Technologies, Inc | Apparatus and method of material bonding using captive plungers |
US20080314735A1 (en) * | 2007-06-22 | 2008-12-25 | Weihs Timothy P | Reactive Multilayer Joining To Control Thermal Stress |
JP4994985B2 (ja) * | 2007-07-24 | 2012-08-08 | 本田技研工業株式会社 | 翼体保護部材製造用の二次プレス金型 |
JP5242201B2 (ja) * | 2008-03-13 | 2013-07-24 | 日本碍子株式会社 | 接合治具およびそれを用いた異種材料接合体の製造方法 |
-
2010
- 2010-10-22 WO PCT/KR2010/007297 patent/WO2011059186A2/ko active Application Filing
-
2012
- 2012-05-10 US US13/468,652 patent/US20120217285A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148723A (ja) * | 1995-11-17 | 1997-06-06 | Nec Corp | 半田ボール転写治具 |
JPH1197349A (ja) * | 1997-09-19 | 1999-04-09 | Toshiba Corp | 化合物半導体装置およびその製造方法 |
KR100585215B1 (ko) * | 2005-06-20 | 2006-06-08 | 주식회사 명성기기 | 인쇄회로기판의 고정을 위한 지그장치 |
JP2007096465A (ja) * | 2005-09-27 | 2007-04-12 | Clarion Co Ltd | アンテナ装置 |
KR20070082316A (ko) * | 2006-02-16 | 2007-08-21 | 삼성전자주식회사 | 솔더 볼 고정 판을 이용한 솔더 볼 부착 방법 |
KR20090083362A (ko) * | 2006-10-04 | 2009-08-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 디바이스 및 이의 제작 방법 |
JP2008171992A (ja) * | 2007-01-11 | 2008-07-24 | Funai Electric Co Ltd | 半導体部品の実装方法 |
Also Published As
Publication number | Publication date |
---|---|
US20120217285A1 (en) | 2012-08-30 |
WO2011059186A2 (ko) | 2011-05-19 |
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