WO2011059186A3 - 솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 - Google Patents

솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 Download PDF

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Publication number
WO2011059186A3
WO2011059186A3 PCT/KR2010/007297 KR2010007297W WO2011059186A3 WO 2011059186 A3 WO2011059186 A3 WO 2011059186A3 KR 2010007297 W KR2010007297 W KR 2010007297W WO 2011059186 A3 WO2011059186 A3 WO 2011059186A3
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WO
WIPO (PCT)
Prior art keywords
soldered
soldering jig
objects
production method
array antenna
Prior art date
Application number
PCT/KR2010/007297
Other languages
English (en)
French (fr)
Other versions
WO2011059186A2 (ko
Inventor
이진구
Original Assignee
동국대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090108186A external-priority patent/KR100948660B1/ko
Application filed by 동국대학교 산학협력단 filed Critical 동국대학교 산학협력단
Publication of WO2011059186A2 publication Critical patent/WO2011059186A2/ko
Publication of WO2011059186A3 publication Critical patent/WO2011059186A3/ko
Priority to US13/468,652 priority Critical patent/US20120217285A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

솔더링 지그가 개시된다. 복수의 솔더링 대상물이 수용되는 복수의 수용홀이 일면에서 타면으로 관통되게 형성된 장착블록, 장착블록의 일면에 결합되며 복수의 수용홀에 수용된 복수의 솔더링 대상물을 지지하는 지지부를 구비한 제1커버블록, 장착블록의 타면에 결합되며 복수의 수용홀 각각에 대향되게 돌출되어 복수의 솔더링 대상물 각각을 탄성적으로 지지하는 복수의 가압돌기를 구비한 제2커버블록을 포함하는 솔더링 지그는, 솔더링 공정에서 솔더링 대상물에 대한 압력 및 열전달을 균일하게 유지시켜, 균일한 품질로 솔더링된 건다이오드 패키지를 얻을 수 있다.
PCT/KR2010/007297 2009-11-10 2010-10-22 솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 WO2011059186A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/468,652 US20120217285A1 (en) 2009-11-10 2012-05-10 Soldering jig

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020090108186A KR100948660B1 (ko) 2009-11-10 2009-11-10 솔더링 지그
KR10-2009-0108186 2009-11-10
KR10-2009-0114800 2009-11-25
KR1020090114800 2009-11-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/468,652 Continuation US20120217285A1 (en) 2009-11-10 2012-05-10 Soldering jig

Publications (2)

Publication Number Publication Date
WO2011059186A2 WO2011059186A2 (ko) 2011-05-19
WO2011059186A3 true WO2011059186A3 (ko) 2011-09-09

Family

ID=43992176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/007297 WO2011059186A2 (ko) 2009-11-10 2010-10-22 솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법

Country Status (2)

Country Link
US (1) US20120217285A1 (ko)
WO (1) WO2011059186A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103008814B (zh) * 2012-12-14 2015-09-16 中国电子科技集团公司第三十八研究所 一种天线子阵的真空钎焊方法
CN106654578A (zh) * 2016-12-13 2017-05-10 惠州Tcl移动通信有限公司 一种提高天线接触性能的移动终端
TWI712139B (zh) * 2019-11-19 2020-12-01 虹晶科技股份有限公司 封裝天線、封裝天線陣列及封裝天線的製作方法
KR102564798B1 (ko) * 2020-10-30 2023-08-08 주식회사 아모센스 레이더 안테나
CN114905219B (zh) * 2022-05-11 2023-12-22 京信射频技术(广州)有限公司 用于通信器件焊接的辅助工装

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148723A (ja) * 1995-11-17 1997-06-06 Nec Corp 半田ボール転写治具
JPH1197349A (ja) * 1997-09-19 1999-04-09 Toshiba Corp 化合物半導体装置およびその製造方法
KR100585215B1 (ko) * 2005-06-20 2006-06-08 주식회사 명성기기 인쇄회로기판의 고정을 위한 지그장치
JP2007096465A (ja) * 2005-09-27 2007-04-12 Clarion Co Ltd アンテナ装置
KR20070082316A (ko) * 2006-02-16 2007-08-21 삼성전자주식회사 솔더 볼 고정 판을 이용한 솔더 볼 부착 방법
JP2008171992A (ja) * 2007-01-11 2008-07-24 Funai Electric Co Ltd 半導体部品の実装方法
KR20090083362A (ko) * 2006-10-04 2009-08-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 디바이스 및 이의 제작 방법

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JPS587366A (ja) * 1981-07-08 1983-01-17 Toshiba Corp 位置合わせ治具
JPS6142476A (ja) * 1984-08-07 1986-02-28 Fujitsu Ltd 半田付け方法及び半田付け治具
JPH0897551A (ja) * 1994-09-26 1996-04-12 Nec Kansai Ltd 基板保持治具
US8118074B2 (en) * 2007-04-10 2012-02-21 Altair Technologies, Inc Apparatus and method of material bonding using captive plungers
US20080314735A1 (en) * 2007-06-22 2008-12-25 Weihs Timothy P Reactive Multilayer Joining To Control Thermal Stress
JP4994985B2 (ja) * 2007-07-24 2012-08-08 本田技研工業株式会社 翼体保護部材製造用の二次プレス金型
JP5242201B2 (ja) * 2008-03-13 2013-07-24 日本碍子株式会社 接合治具およびそれを用いた異種材料接合体の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148723A (ja) * 1995-11-17 1997-06-06 Nec Corp 半田ボール転写治具
JPH1197349A (ja) * 1997-09-19 1999-04-09 Toshiba Corp 化合物半導体装置およびその製造方法
KR100585215B1 (ko) * 2005-06-20 2006-06-08 주식회사 명성기기 인쇄회로기판의 고정을 위한 지그장치
JP2007096465A (ja) * 2005-09-27 2007-04-12 Clarion Co Ltd アンテナ装置
KR20070082316A (ko) * 2006-02-16 2007-08-21 삼성전자주식회사 솔더 볼 고정 판을 이용한 솔더 볼 부착 방법
KR20090083362A (ko) * 2006-10-04 2009-08-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 디바이스 및 이의 제작 방법
JP2008171992A (ja) * 2007-01-11 2008-07-24 Funai Electric Co Ltd 半導体部品の実装方法

Also Published As

Publication number Publication date
US20120217285A1 (en) 2012-08-30
WO2011059186A2 (ko) 2011-05-19

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