WO2011010489A1 - 封着材料層付きガラス部材の製造方法及び製造装置、並びに電子デバイスの製造方法 - Google Patents
封着材料層付きガラス部材の製造方法及び製造装置、並びに電子デバイスの製造方法 Download PDFInfo
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- WO2011010489A1 WO2011010489A1 PCT/JP2010/056035 JP2010056035W WO2011010489A1 WO 2011010489 A1 WO2011010489 A1 WO 2011010489A1 JP 2010056035 W JP2010056035 W JP 2010056035W WO 2011010489 A1 WO2011010489 A1 WO 2011010489A1
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- WIPO (PCT)
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- sealing material
- irradiation
- laser
- coating layer
- glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
Definitions
- the present invention relates to a method and apparatus for manufacturing a glass member with a sealing material layer, and a method for manufacturing an electronic device.
- FPDs such as organic EL displays (Organic Electro-Luminescence Display: OELD) and plasma display panels (PDPs) have a glass substrate for elements and a glass substrate for sealing formed opposite to each other.
- the light-emitting element is sealed with a glass package in which these two glass substrates are sealed (see Patent Document 1).
- a liquid crystal display device (LCD) also has a structure in which liquid crystal is sealed with two glass substrates.
- solar cells such as dye-sensitized solar cells, it has been studied to apply a glass package in which a solar cell element (photoelectric conversion element) is sealed with two glass substrates (see Patent Document 2).
- sealing glass excellent in moisture resistance and the like is being promoted as a sealing material for sealing between two glass substrates. Since the sealing temperature with the sealing glass is about 400 to 600 ° C., the characteristics of the electronic element portion such as the OEL element are deteriorated when baked using a normal heating furnace. Therefore, a sealing material layer including sealing glass (glass frit) and a laser absorbing material is disposed between the sealing regions provided in the periphery of the two glass substrates, and this is irradiated with laser light. Attempts have been made to heat and melt the sealing material layer for sealing (see Patent Documents 1 and 2).
- a sealing material is mixed with a vehicle to prepare a sealing material paste, which is applied to the sealing region of one glass substrate, and then the firing temperature of the sealing material (The sealing glass is melted and baked on a glass substrate to form a sealing material layer. Further, the organic binder is thermally decomposed and removed in the process of raising the sealing material to the firing temperature. Next, after laminating the glass substrate having the sealing material layer and the other glass substrate through the sealing material layer, the laser material is irradiated from one glass substrate side, and the sealing material layer is heated and melted. The electronic element part provided between the glass substrates is sealed.
- Patent Document 3 describes that a first temperature raising process for removing the organic binder in the sealing material layer forming step and a second temperature raising process for baking the sealing material are performed.
- the glass substrate is heated from the back side thereof using a hot plate, an infrared heater, a heating lamp, laser light, or the like.
- the second temperature raising process the entire glass substrate is heated using the heater in the heating furnace, as in the normal baking process.
- the sealing material is baked by heating the entire glass substrate using a heating furnace.
- an organic resin film such as a color filter is formed not only on an element glass substrate but also on a sealing glass substrate.
- a general heating furnace is used even when the sealing material layer is formed on the sealing glass substrate.
- the used baking process cannot be applied.
- an element film or the like is formed also on the counter substrate side, it is required to suppress thermal deterioration of the element film or the like in the firing process.
- the baking process using a heating furnace usually requires a long time and consumes a large amount of energy, improvements are required from the viewpoint of reducing the number of manufacturing steps, manufacturing costs, and energy saving.
- Patent Document 4 describes that a sealing material made of a paste in which a low melting point glass (sealing glass), a binder and a solvent are mixed is applied to one panel substrate, and then the sealing material is laser-annealed. Yes.
- the sealing glass may not be uniformly melted simply by laser annealing the sealing material. That is, only the vicinity of the surface of the coating layer of the sealing material is melted, which may hinder the melting of the sealing glass of the entire coating layer.
- the sealing material layer has defects such as internal bubbles and surface deformation. It tends to occur. Such a defect in the sealing material layer causes a decrease in the airtightness and bonding strength of the panel.
- An object of the present invention is to provide a manufacturing method and a manufacturing method for a glass member with a sealing material layer that can form a good sealing material layer with good reproducibility even when the entire glass substrate cannot be heated. It is to provide an apparatus and a method for manufacturing an electronic device.
- a step of preparing a glass substrate having a sealing region, and a sealing material including a sealing glass and a laser absorber are mixed with an organic binder.
- the laser light is applied to the coating layer of the frame-shaped sealing material paste so that the heating temperature of the dressing material is in the range of (T + 213 ° C.) to (T + 480 ° C.).
- An apparatus for producing a glass member with a sealing material layer is a frame shape of a sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorber with an organic binder.
- a scanning control unit for controlling, and an output density at the irradiation start timing and irradiation end timing of the laser light irradiated from the laser irradiation head to the frame-shaped coating layer, the irradiation start timing and the irradiation end timing are determined.
- Ku to be higher than the output density in the scanning irradiation time along the frame-shaped coating layer of the laser beam, it is characterized by comprising an output control section for controlling the output of the laser beam.
- An apparatus for manufacturing a glass member with a sealing material layer is a frame shape of a sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorber with an organic binder.
- An electronic device manufacturing method corresponds to the step of preparing a first glass substrate having a first surface provided with a first sealing region, and the first sealing region.
- a step of preparing a second glass substrate having a second surface provided with a second sealing region, and a sealing material prepared by mixing a sealing material containing a sealing glass and a laser absorber with an organic binder A step of applying a bonding material paste in a frame shape on the second sealing region of the second glass substrate, and heating the sealing material with respect to a glass softening temperature T (° C.) of the sealing glass
- T glass softening temperature
- the sealing material is fired to form a sealing material
- a good sealing material layer can be formed with good reproducibility even when the entire glass substrate cannot be heated. . Therefore, even when such a glass substrate is used, it is possible to manufacture an electronic device excellent in reliability, sealing performance, and the like with high reproducibility.
- FIG. 3 is a cross-sectional view taken along line AA in FIG. 2.
- FIG. 5 is a cross-sectional view taken along line AA in FIG. 4.
- FIG. 4 It is sectional drawing which shows the formation process of the sealing material layer to the 2nd glass substrate in the manufacturing process of the electronic device shown in FIG. It is a top view which shows the manufacturing apparatus of the glass member with a sealing material layer by 1st Embodiment.
- FIG. 1 It is a front view of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG. It is a figure which shows the example of control of the output density of the laser beam in the manufacturing apparatus of the glass member with a sealing material layer of 1st Embodiment. It is a figure which shows the example of control of the output of the laser beam in the manufacturing apparatus of the glass member with a sealing material layer of 1st Embodiment. It is a figure which shows the other scanning example of the laser beam in the manufacturing apparatus of the glass member with a sealing material layer of 1st Embodiment. It is a top view which shows the manufacturing apparatus of the glass member with a sealing material layer by 2nd Embodiment.
- FIG. It is a front view of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG. It is a top view which shows the modification of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG. It is a front view of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG. It is a top view which shows the other modification of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG. It is a front view of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG. It is a side view of the manufacturing apparatus of the glass member with a sealing material layer shown in FIG.
- FIG. 1 to 6 are views showing a manufacturing process of an electronic device according to an embodiment of the present invention.
- a lighting device using a light emitting element such as an FPD such as an OELD, PDP, or LCD, or an OEL element, or a dye-sensitized solar cell is used as an electronic device to which the manufacturing method of the embodiment of the present invention is applied.
- a lighting device using a light emitting element such as an FPD such as an OELD, PDP, or LCD, or an OEL element, or a dye-sensitized solar cell is used.
- a sealed solar cell can be mentioned.
- a first glass substrate 1 and a second glass substrate 2 are prepared.
- glass substrates formed of alkali-free glass or soda lime glass having various known compositions are used for the first and second glass substrates 1 and 2, for example, glass substrates formed of alkali-free glass or soda lime glass having various known compositions are used.
- the alkali-free glass has a thermal expansion coefficient of about 35 to 40 ⁇ 10 ⁇ 7 / ° C.
- Soda lime glass has a thermal expansion coefficient of about 80 to 90 ⁇ 10 ⁇ 7 / ° C.
- the 1st glass substrate 1 has the surface 1a in which the element area
- the element region 3 is provided with an electronic element unit 4 corresponding to the electronic device that is the object.
- the electronic element unit 4 is, for example, an OEL element for OELD or OEL illumination, a plasma light-emitting element for PDP, a liquid crystal display element for LCD, and a dye-sensitized solar cell element (dye-sensitized type for solar cells). Photoelectric conversion element).
- the electronic element unit 4 including a light emitting element such as an OEL element, a dye-sensitized solar cell element, and the like has various known structures. This embodiment is not limited to the element structure of the electronic element unit 4.
- a first sealing region 5 is provided along the outer periphery of the element region 3 on the surface 1 a of the first glass substrate 1.
- the first sealing region 5 is provided so as to surround the element region 3.
- the second glass substrate 2 has a surface 2 a that faces the surface 1 a of the first glass substrate 1.
- a second sealing region 6 corresponding to the first sealing region 5 is provided on the surface 2 a of the second glass substrate 2.
- the first and second sealing regions 5 and 6 serve as a sealing layer forming region (a sealing material layer forming region for the second sealing region 6).
- the electronic element unit 4 is provided between the surface 1 a of the first glass substrate 1 and the surface 2 a of the second glass substrate 2.
- the first glass substrate 1 constitutes a glass substrate for an element, and an element structure such as an OEL element or a PDP element is formed as an electronic element portion 4 on the surface 1a.
- the second glass substrate 2 constitutes a glass substrate for sealing the electronic element portion 4 formed on the surface 1 a of the first glass substrate 1.
- the configuration of the electronic element unit 4 is not limited to this.
- the electronic element unit 4 is a dye-sensitized solar cell element or the like
- a wiring film or an electrode film that forms an element structure on each of the surfaces 1a and 2a of the first and second glass substrates 1 and 2 is used.
- An element film is formed.
- the element film constituting the electronic element unit 4 and the element structure based thereon are formed on at least one of the surfaces 1a and 2a of the first and second glass substrates 1 and 2.
- an organic resin film such as a color filter may be formed on the surface 2a of the second glass substrate 2 constituting the sealing glass substrate.
- the manufacturing method of this embodiment is particularly effective when an organic resin film, an element film, or the like is formed on the surface 2a of the second glass substrate 2.
- a frame-shaped sealing material layer 7 is formed as shown in FIGS. 1 (a), 4 and 5.
- the sealing material layer 7 is a fired layer of a sealing material containing sealing glass and a laser absorbing material.
- the sealing material is obtained by blending a sealing material as a main component with a laser absorbing material and, if necessary, an inorganic filler such as a low expansion filler.
- the sealing material may contain other fillers and additives as necessary.
- sealing glass for example, low-melting glass such as tin-phosphate glass, bismuth glass, vanadium glass, lead glass or the like is used.
- tin-phosphate glass is used in consideration of sealing properties (adhesiveness) to glass substrates 1 and 2, reliability thereof (adhesion reliability and sealing properties), and influence on the environment and human body. It is preferable to use a low-melting sealing glass made of bismuth-based glass.
- Tin-phosphate glass (glass frit) is composed of 55 to 68% by mass of SnO, 0.5 to 5% by mass of SnO 2 , and 20 to 40% by mass of P 2 O 5. 100% by mass). SnO is a component for lowering the melting point of glass. When the SnO content is less than 55% by mass, the viscosity of the glass becomes high and the sealing temperature becomes too high, and when it exceeds 68% by mass, it does not vitrify.
- SnO 2 is a component for stabilizing the glass.
- SnO 2 is a component for stabilizing the glass.
- SnO 2 is separated and precipitated in the glass that has been softened and melted during the sealing operation, the fluidity is impaired and the sealing workability is lowered. If the content of SnO 2 exceeds 5% by mass, SnO 2 is likely to precipitate during melting of the low-melting glass.
- P 2 O 5 is a component for forming a glass skeleton. When the content of P 2 O 5 is less than 20% by mass, vitrification does not occur, and when the content exceeds 40% by mass, the weather resistance, which is a disadvantage specific to phosphate glass, may be deteriorated.
- the ratio (mass%) of SnO and SnO 2 in the glass frit can be determined as follows. First, after the glass frit (low melting point glass powder) is acid-decomposed, the total amount of Sn atoms contained in the glass frit is measured by ICP emission spectroscopic analysis. Next, since Sn 2+ (SnO) is obtained by acidimetric decomposition, the amount of Sn 2+ determined there is subtracted from the total amount of Sn atoms to obtain Sn 4+ (SnO 2 ).
- the glass formed of the above three components has a low glass transition point and is suitable for a low-temperature sealing material.
- a component that forms a glass skeleton such as SiO 2 , ZnO, B 2 O 3 , Al 2 O 3, WO 3, MoO 3, Nb 2 O 5, TiO 2, ZrO 2, Li 2 O, stabilizing Na 2 O, K 2 O, Cs 2 O, MgO, CaO, SrO, the glass BaO, etc.
- the component to be made may be contained as an optional component. However, if the content of any component is too large, the glass becomes unstable and devitrification may occur, and the glass transition point and softening point may increase. Therefore, the total content of any component is 30% by mass. The following is preferable.
- the glass composition in this case is adjusted so that the total amount of the basic component and the optional component is basically 100% by mass.
- Bismuth-based glass (gas frit) is composed of 70 to 90% by mass of Bi 2 O 3 , 1 to 20% by mass of ZnO, and 2 to 12% by mass of B 2 O 3 (basically, the total amount is 100% by mass). It is preferable to have a composition of Bi 2 O 3 is a component that forms a glass network. When the content of Bi 2 O 3 is less than 70% by mass, the softening point of the low-melting glass becomes high and sealing at a low temperature becomes difficult. When the content of Bi 2 O 3 exceeds 90% by mass, it becomes difficult to vitrify and the thermal expansion coefficient tends to be too high.
- ZnO is a component that lowers the thermal expansion coefficient and the like. Vitrification becomes difficult when the content of ZnO is less than 1% by mass. When the content of ZnO exceeds 20% by mass, stability during low-melting glass molding is lowered, and devitrification is likely to occur.
- B 2 O 3 is a component that forms a glass skeleton and widens the range in which vitrification is possible. When the content of B 2 O 3 is less than 2% by mass, vitrification becomes difficult, and when it exceeds 12% by mass, the softening point becomes too high, and even if a load is applied during sealing, sealing is performed at a low temperature. It becomes difficult.
- the glass formed of the above three components has a low glass transition point and is suitable for a low-temperature sealing material, but Al 2 O 3 , CeO 2 , SiO 2 , Ag 2 O, MoO 3 , Nb 2 O 3 , Ta 2 O 5 , Ga 2 O 3 , Sb 2 O 3 , Li 2 O, Na 2 O, K 2 O, Cs 2 O, CaO, SrO, BaO, WO 3 , P 2 O 5 , SnO x
- An optional component such as (x is 1 or 2) may be contained. However, if the content of any component is too large, the glass becomes unstable and devitrification may occur, and the glass transition point and softening point may increase. Therefore, the total content of any component is 30% by mass. The following is preferable.
- the glass composition in this case is adjusted so that the total amount of the basic component and the optional component is basically 100% by mass.
- the sealing material contains a laser absorber.
- a laser absorber a compound such as at least one metal selected from Fe, Cr, Mn, Co, Ni, and Cu or an oxide containing the metal is used. Also, other pigments may be used.
- the content of the laser absorber is preferably in the range of 0.1 to 10% by volume with respect to the sealing material. If the content of the laser absorber is less than 0.1% by volume, the sealing material layer 7 may not be sufficiently melted. If the content of the laser absorbing material exceeds 10% by volume, there is a risk of locally generating heat in the vicinity of the interface with the second glass substrate 2, and the fluidity at the time of melting of the sealing material deteriorates to cause the first There exists a possibility that adhesiveness with the glass substrate 1 may fall.
- the sealing material may contain a low expansion filler as required.
- Low expansion filler selected from silica, alumina, zirconia, zirconium silicate, aluminum titanate, mullite, cordierite, eucryptite, spodumene, zirconium phosphate compounds, quartz solid solution, soda lime glass, and borosilicate glass It is preferable to use at least one selected from the above.
- the zirconium phosphate-based compound include (ZrO) 2 P 2 O 7 , NaZr 2 (PO 4 ) 3 , KZr 2 (PO 4 ) 3 , Ca 0.5 Zr 2 (PO 4 ) 3 , and NbZr (PO 4 ). 3 , Zr 2 (WO 3 ) (PO 4 ) 2 , and composite compounds thereof.
- the low expansion filler has a lower thermal expansion coefficient than the sealing glass.
- the content of the low expansion filler is appropriately set so that the thermal expansion coefficient of the sealing glass approaches the thermal expansion coefficient of the glass substrates 1 and 2.
- the low expansion filler is preferably contained in the range of 5 to 50% by volume with respect to the sealing material, depending on the thermal expansion coefficient of the sealing glass and the glass substrates 1 and 2.
- the glass substrates 1 and 2 are formed of alkali-free glass (thermal expansion coefficient: 30 to 40 ⁇ 10 ⁇ 7 / ° C.)
- a relatively large amount for example, a range of 30 to 50% by volume
- a low expansion filler is used. It is preferable to add.
- the glass substrates 1 and 2 are formed of soda lime glass (thermal expansion coefficient: 80 to 90 ⁇ 10 ⁇ 7 / ° C.), a relatively small amount (for example, a range of 5 to 40% by volume) of a low expansion filler is used. It is preferable to add.
- the sealing material layer 7 is formed as follows. The formation process of the sealing material layer 7 is demonstrated with reference to FIG. FIG. 6 shows an embodiment of the method for producing a glass member with a sealing material layer of the present invention. First, a sealing material is prepared by blending a sealing glass with a laser absorbing material or a low expansion filler, and this is mixed with a vehicle to prepare a sealing material paste.
- Examples of the vehicle include those obtained by dissolving a resin such as methyl cellulose, ethyl cellulose, carboxymethyl cellulose, oxyethyl cellulose, benzyl cellulose, propyl cellulose, and nitrocellulose in a solvent such as terpineol, butyl carbitol acetate, and ethyl carbitol acetate.
- a resin such as methyl cellulose, ethyl cellulose, carboxymethyl cellulose, oxyethyl cellulose, benzyl cellulose, propyl cellulose, and nitrocellulose
- a solvent such as terpineol, butyl carbitol acetate, and ethyl carbitol acetate.
- Acrylic resins such as acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl methacrylate, etc. dissolved in a solvent such as methyl ethyl
- the resin component in the vehicle functions as an organic binder for the sealing material and must be removed before firing the sealing material.
- the viscosity of the sealing material paste may be adjusted to the viscosity corresponding to the apparatus applied to the glass substrate 2, and is adjusted by the ratio of the resin component (organic binder) and the solvent (organic solvent, etc.) and the ratio of the sealing material and the vehicle. can do.
- a known additive may be added to the sealing material paste as a glass paste such as an antifoaming agent or a dispersing agent.
- a known method using a rotary mixer equipped with a stirring blade, a roll mill, a ball mill, or the like can be applied.
- a sealing material paste is applied to the sealing region 6 of the second glass substrate 2 and dried to form a coating layer 8.
- the sealing material paste is applied onto the second sealing region 6 by applying a printing method such as screen printing or gravure printing, or is applied along the second sealing region 6 using a dispenser or the like. To do.
- the coating layer 8 is preferably dried at a temperature of 120 ° C. or more for 10 minutes or more, for example. The drying step is performed to remove the solvent in the coating layer 8. If the solvent remains in the coating layer 8, the organic binder may not be sufficiently removed in the subsequent firing step (laser firing step).
- the coating layer (dry film) 8 of the sealing material paste is irradiated with a laser beam 9 for firing.
- a laser beam 9 for firing By irradiating laser beam 9 along coating layer 8 and selectively heating, sealing material is baked to form sealing material layer 7 while removing the organic binder in coating layer 8 (FIG. 6 (c)).
- the laser light 9 for firing is not particularly limited, and laser light from a semiconductor laser, carbon dioxide laser, excimer laser, YAG laser, HeNe laser or the like is used. The same applies to sealing laser light described later.
- the laser light 9 for firing is applied to the coating layer 8 so that the heating temperature of the coating layer 8 is not less than (T + 213 ° C.) and not more than (T + 480 ° C.) with respect to the softening temperature T (° C.) of the sealing glass. Irradiate along.
- the laser beam 9 is preferably irradiated while scanning along the coating layer 8. In this case, the scanning speed of the laser beam 9 is preferably in the range of 0.1 mm / second to 5 mm / second.
- the softening temperature T of the sealing glass indicates a temperature at which it softens and flows but does not crystallize.
- the temperature of the coating layer 8 when irradiated with the laser light 9 is a value measured with a radiation thermometer.
- the sealing glass in the sealing material is melted and rapidly cooled and solidified. Are baked onto the second glass substrate 2 to form the sealing material layer 7.
- the temperature of the coating layer 8 is preferably in the range of (T + 220 ° C.) to (T + 450 ° C.). Under the irradiation condition of the laser beam 9 such that the temperature of the coating layer 8 does not reach (T + 213 ° C.), only the surface portion of the coating layer 8 is melted, and the entire coating layer 8 cannot be melted uniformly. On the other hand, under the irradiation condition of the laser light 9 such that the temperature of the coating layer 8 exceeds (T + 480 ° C.), the glass substrate 2 and the sealing material layer (firing layer) 7 are likely to be cracked or broken.
- the organic binder in the coating layer 8 is thermally decomposed and removed by irradiating the laser beam 9 for firing while scanning so that the temperature of the coating layer 8 becomes the heating temperature described above. Since the laser beam 9 is irradiated while scanning along the coating layer 8, the portion located in front of the traveling direction of the laser beam 9 is preheated appropriately.
- the thermal decomposition of the organic binder proceeds not only when the corresponding portion of the coating layer 8 is directly irradiated with the laser beam 9, but also with a preheated portion in front of the traveling direction of the laser beam 9. By these, the organic binder in the coating layer 8 can be removed effectively and efficiently. Specifically, the amount of residual carbon in the sealing material layer 7 can be reduced. Residual carbon becomes a factor that increases the concentration of impurity gas in the glass panel.
- the laser beam 9 is preferably irradiated while scanning at a scanning speed in the range of 0.1 mm / second to 5 mm / second, and from 1 mm / second to 5 mm / second.
- the range of is more preferable.
- the scanning speed of the laser light 9 is less than 0.1 mm / second, the glass substrate 2 is excessively heated and cracks and cracks are likely to occur. If the scanning speed of the laser beam 9 exceeds 5 mm / second, only the surface portion is melted and vitrified before the entire coating layer 8 is uniformly heated, so that the outside of the gas generated by the thermal decomposition of the organic binder. Release to the water is reduced.
- sealing material layer 7 having a poor organic binder removal state is used to seal between the glass substrates 1 and 2, the bonding strength between the glass substrates 1 and 2 and the sealing layer is reduced, or the airtightness of the glass panel is reduced. descend.
- the heating speed of the coating layer 8 is set in the range of (T + 213 ° C.) to (T + 480 ° C.) with the laser light 9 having a scanning speed of 0.1 mm / second or more and 5 mm / second or less
- the laser light is used.
- 9 preferably has a power density in the range of 200 ⁇ 900W / cm 2, more preferably in the range of 300 ⁇ 800W / cm 2. If the output density of the laser light 9 is less than 200 W / cm 2 , the entire coating layer 8 cannot be heated uniformly. If the output density of the laser light 9 exceeds 900 W / cm 2 , the glass substrate 2 is excessively heated and cracks, cracks, etc. are likely to occur.
- the laser beam 9 may be irradiated to the coating layer 8 through the glass substrate 2.
- the high-power laser beam 9 is irradiated from above the coating layer 8
- only the surface portion of the coating layer 8 may be vitrified. Vitrification of only the surface portion of the coating layer 8 causes various problems as described above.
- the gas generated by the thermal decomposition of the organic binder is applied even if the portion irradiated with the laser beam 9 is vitrified. It can escape from the surface of the layer 8. Furthermore, it is also effective to irradiate the laser beam 9 from the upper and lower surfaces of the coating layer 8.
- the shape of the irradiation spot of the laser beam 9 is not particularly limited.
- the irradiation spot of the laser beam 9 is generally circular, but is not limited to a circle.
- the irradiation spot of the laser beam 9 may be an ellipse having a minor axis in the width direction of the coating layer 8. According to the laser beam 9 in which the irradiation spot is shaped into an ellipse, the irradiation area of the laser beam 9 on the coating layer 8 can be enlarged, and the scanning speed of the laser beam 9 can be further increased. As a result, the firing time of the coating layer 8 can be shortened.
- the firing process of the coating layer 8 by the laser light 9 is not necessarily limited to the film thickness of the coating layer 8, but the thickness after firing (the thickness of the sealing material layer 7) is 20 ⁇ m or less. This is effective for the coating layer 8 having a film thickness.
- the sealing material layer 7 preferably has a thickness of 20 ⁇ m or less. In the coating layer 8 having a film thickness such that the thickness after firing exceeds 20 ⁇ m, the entire coating layer 8 may not be uniformly heated by the laser light 9. In such a case, only the surface portion of the coating layer 8 is melted and vitrified, and the removability of the organic binder and its pyrolysis gas tends to be lowered. Practically, the thickness of the sealing material layer 7 is preferably 5 ⁇ m or more.
- the coating layer 8 of the sealing material paste is selectively heated by irradiating the laser beam 9 for firing. Therefore, even when an organic resin film such as a color filter or an element film is formed on the surface 2a of the second glass substrate 2, the organic resin film or the element film is not damaged by heat.
- the sealing material layer 7 can be formed satisfactorily. Furthermore, since it is excellent also in the removal property of an organic binder, the sealing material layer 7 excellent in sealing property, reliability, etc. can be obtained.
- the step of forming the sealing material layer 7 with the laser beam 9 for firing is applicable even when an organic resin film, an element film, or the like is not formed on the surface 2a of the second glass substrate 2, Even in such a case, the sealing material layer 7 excellent in sealing property, reliability, etc. can be obtained. Furthermore, the firing process using the laser beam 9 consumes less energy than the firing process using the conventional heating furnace, and contributes to the reduction of manufacturing steps and manufacturing costs. Therefore, the process of forming the sealing material layer 7 using the laser light 9 is also effective from the viewpoint of energy saving and cost reduction.
- the sealing glass contracts due to surface tension, void reduction, etc. at the end of the irradiation of the laser beam 9, thereby causing a gap at the irradiation end position. (Gap) may occur.
- the sealing material layer 7 having a gap can be hermetically sealed by setting conditions or process settings (for example, preheating) of the sealing process, but the number of manufacturing steps and manufacturing are reduced due to the complexity of the sealing process. Cost may increase.
- Specific methods for increasing the fluidity of the sealing glass include (1) increasing the output density at the irradiation start timing and irradiation end timing of the laser beam 9, and (2) at least a pair of laser beams as the laser beam 9. Used, overlapping two laser beams at the irradiation start timing and irradiation end timing, (3) laminating a plate on the coating layer 8 of the sealing material paste, and irradiating the laser beam 9 in this state, etc. Can be mentioned.
- the method of suppressing the gap generated in the sealing material layer 7 is not limited to the method of increasing the fluidity of the sealing glass.
- a simultaneous heating method using a galvano scanner or the like can be used. According to the galvano scanner, since the entire coating layer 8 of the sealing material paste can be heated simultaneously and uniformly, the occurrence of a gap can be prevented.
- the output density at the irradiation start time and the irradiation end time of the laser light 9 is set so that the scanning irradiation time (irradiation start time and irradiation time) along the coating layer 8 of the frame-shaped sealing material paste of the laser light 9 is determined.
- the output density of the laser light 9 is controlled so as to be higher than the output density at the time (except for the irradiation end time).
- the sealing glass at the irradiation start position has already been cooled, so that the sealing glass heated and melted by the laser light 9 It is considered that when the surface tension is superior to the fluidity, the sealing glass contracts at the irradiation end position of the laser light 9 and a gap is generated.
- FIGS. 7 and 8 show an apparatus for producing a glass member with a sealing material layer according to the first embodiment of the present invention.
- a laser baking apparatus (manufacturing apparatus for a glass member with a sealing material layer) 21 shown in these drawings includes a glass substrate 2 (not shown in FIGS. 7 and 8) having a frame-shaped coating layer 8 of a sealing material paste.
- a sample stage 22, a laser light source 23, and a laser irradiation head 24 that irradiates the coating layer 8 with laser light emitted from the laser light source 23 are provided.
- the output of the laser light emitted from the laser light source 23 is controlled by the output control unit 25.
- the output control unit 25 controls the output of the laser light by controlling the power input to the laser light source 23, for example.
- the output control unit 25 may include an output modulator that controls the output of the laser light emitted from the laser light source 23.
- the laser irradiation head 24 has an optical system that condenses the laser light emitted from the laser light source 23, shapes the laser light into a predetermined irradiation spot, and irradiates the coating layer 8. The optical system will be described later.
- the laser irradiation head 24 can be moved in the X direction by the X stage 26.
- the sample stage 22 can be moved in the Y direction by a Y stage 27.
- the X stage 26 is fixed above the sample stage 22 so as to travel in a direction orthogonal to the traveling direction of the Y stage 27.
- the laser irradiation head 24 is installed on the X stage 26.
- the positional relationship between the laser irradiation head 24 and the sample stage 22 is relatively movable by the X stage 26 and the Y stage 27. That is, the X stage 26 and the Y stage 27 can irradiate the laser light 9 from the laser irradiation head 24 while scanning along the frame-shaped coating layer 8.
- the X stage 26 and the Y stage 27 constitute a moving mechanism.
- the X stage 26 and the Y stage 27 are controlled by a scanning control unit 28.
- the laser baking apparatus 21 includes a main control system 29 that comprehensively controls the output control unit 25 and the scanning control unit 28. Further, the laser baking device 21 includes a radiation thermometer (not shown) that measures the baking temperature (heating temperature) of the frame-shaped coating layer 8.
- the laser baking apparatus 21 preferably includes a suction nozzle, a blower nozzle, and the like that prevent the organic binder removed from the frame-shaped coating layer 8 from adhering to the optical system and the glass substrate 2.
- the output density at the irradiation start timing and irradiation end timing of the laser light 9 irradiated from the laser irradiation head 24 follows the frame-shaped coating layer 8 of the laser light 9 except for the irradiation start timing and the irradiation end timing.
- the output of the laser beam 9 is controlled so as to be higher than the output density at the scanning irradiation time.
- FIG. 9 shows an example of control of the output density of the laser light 9 by the output control unit 25.
- the output density of the laser beam 9 is controlled by the output of the laser beam 9 when the area of the irradiation spot of the laser beam 9 is constant.
- FIG. 10 shows a control example of the output of the laser beam 9.
- scanning is started by irradiating the irradiation start position of the frame-shaped coating layer 8 with laser light 9 having an output density D1 (output P1).
- the output density D1 is set only during the irradiation start timing M1, and after the irradiation start timing M1 has passed, the output density is reduced to P2 (the output of the laser light 9 is reduced to P2).
- the laser beam 9 with this output density D2 (output P2) is irradiated while scanning along the coating layer 8 (scanning irradiation timing M2).
- the output density is increased again to D1 (the output of the laser beam 9 is increased to P1).
- the laser light 9 having the output density D1 is made to reach the irradiation end position (the same position as the irradiation start position), and the irradiation of the laser light 9 is ended.
- the output density D1 of the laser light 9 is such that the heating temperature of the coating layer 8 at the irradiation start timing M1 and the irradiation end timing M3 is (T + 350 ° C.) or more and (T + 550 ° C.) or less with respect to the softening temperature T (° C.) of the sealing glass. It is preferable to set so as to be in the range.
- the output density D2 of the laser beam 9 is such that the heating temperature of the sealing material at the scanning irradiation timing M2 is (T + 213 ° C.) or more and (T + 480 ° C.) or less with respect to the softening temperature T (° C.) of the sealing glass. It is preferable to set to.
- the scanning speed of the laser beam 9 is as described above.
- the ratio of the output density D1 and the output density D2 of the laser light 9, D1 / D2, is preferably 1.1 to 3.0, and more preferably 1.2 to 2.0.
- the shrinkage of the sealing glass at the irradiation end timing M3 of the laser light 9 can be suppressed with good reproducibility by setting the temperature of the coating layer 8 at the irradiation start timing M1 and the irradiation end timing M3 to (T + 350 ° C.) or higher.
- the temperature of the coating layer 8 at the irradiation start time M1 and the irradiation end time M3 is too high, the glass substrate 2 and the sealing material layer (firing layer) 7 are likely to be cracked or cracked.
- the temperature of the coating layer 8 at the irradiation end timing M3 is preferably (T + 550 ° C.) or lower.
- the temperature of the coating layer 8 at the scanning irradiation time M2 is relative to the softening temperature T (° C.) of the sealing glass in order to suppress cracks and cracks of the glass substrate 2 and the sealing material layer (firing layer) 7 with good reproducibility. It is preferable that the temperature be in the range of (T + 213 ° C.) to (T + 480 ° C.).
- the specific values of the output density D1 at the irradiation start timing M1 and the irradiation end timing M3 and the output density D2 at the scanning irradiation timing M2 are 200 described above in consideration of the heating temperature of the coating layer 8 and the scanning speed of the laser light 9. It is preferable to select appropriately from a range of ⁇ 900 W / cm 2 .
- the irradiation start timing M1 of the laser light 9 is preferably within 5 seconds from the start of irradiation. If the period of the output density D1 is too long, the glass substrate 2 and the sealing material layer (fired layer) 7 are likely to be cracked or broken. However, if the irradiation start time M1 of the laser light 9 is too short, vitrification of the sealing glass (glass frit) by the high-power laser light 9 cannot be sufficiently increased. For this reason, it is preferable that the irradiation start timing M1 of the laser beam 9 be 1 second or longer from the start of irradiation. Similarly, the irradiation end timing M3 is preferably in the range of 1 second to 5 seconds with reference to the irradiation end time of the laser light 9.
- the irradiation start timing M1 and the irradiation end timing M3 of the laser light 9 are preferably set according to the scanning speed of the laser light 9.
- the laser beam 9 having the output P1 corresponding to the irradiation start timing M1 is irradiated to a distance L1 from the irradiation start position to a position 0.1 to 25 times the spot diameter of the laser beam 9. It is preferable.
- the laser beam 9 of output P1 corresponding to the irradiation end timing M3 is relative to the distance L2 from the position 0.1 to 25 times the spot diameter of the laser beam 9 to the irradiation end position with reference to the irradiation end position. Irradiation is preferred.
- the heating temperature of the coating layer 8 at the irradiation start timing M1 and the irradiation end timing M3 is set higher than the heating temperature of the coating layer 8 at the scanning irradiation timing M2.
- the coating layer 8 at the irradiation start timing M1 and the irradiation end timing M3 is The heating temperature can be made higher than the heating temperature of the coating layer 8 at the scanning irradiation timing M2.
- the laser beam 9 applied to the sealing material paste coating layer 8 is not limited to one, and a plurality of laser beams 9 may be irradiated to the coating layer 8.
- FIG. 11 shows an example of scanning with two laser beams 9A and 9B.
- the coating layer 8 is divided into two regions. An irradiation start position and an irradiation end position are set in a portion where the two areas are adjacent to each other. The irradiation start position and the irradiation end position of each region are reversed.
- the laser beams 9A and 9B are irradiated while scanning from the irradiation start position of each region to the irradiation end position that is the same position as the irradiation start position of the other regions. The same applies when three or more laser beams are used.
- FIG. 12 and FIG. 13 show an example of a laser baking apparatus applied to the method (2).
- FIG.12 and FIG.13 shows the manufacturing apparatus of the glass member with a sealing material layer by 2nd Embodiment.
- a laser baking apparatus (manufacturing apparatus for a glass member with a sealing material layer) 31 shown in these drawings includes a glass substrate 2 (not shown in FIGS. 12 and 13) having a frame-shaped coating layer 8 of a sealing material paste.
- the first and second laser irradiation heads 34A and 34B each collect the laser light emitted from the laser light source 33, shape it into a predetermined irradiation spot, and irradiate the coating layer 8 An optical system.
- the optical system will be described in detail later.
- the laser light emitted from the laser light source 33 is sent to the first and second laser irradiation heads 34A and 34B via a duplexer (not shown), for example.
- the output of the laser light emitted from the laser light source 33 is controlled by the output control unit 35.
- the output control unit 35 controls the output of the laser light by controlling the power input to the laser light source 33, for example. Further, the output control unit 35 may have an output modulator that controls the output of the laser light emitted from the laser light source 33.
- the output of the laser beam may be individually controlled according to the first and second laser irradiation heads 34A and 34B.
- the first and second laser irradiation heads 34A and 34B are movable in the X direction by the X stage 36.
- the sample stage 32 can be moved in the Y direction by a Y stage 37.
- the positional relationship between the first and second laser irradiation heads 34 ⁇ / b> A and 34 ⁇ / b> B and the sample stage 32 is relatively movable by the X stage 36 and the Y stage 37.
- the X stage 36 and the Y stage 37 constitute a moving mechanism.
- the first and second laser irradiation heads 34A and 34B are installed on the X stage 36, respectively.
- the X stage 36 is fixed above the sample stage 32 so that the first and second laser irradiation heads 34 ⁇ / b> A and 34 ⁇ / b> B travel in a direction orthogonal to the traveling direction of the Y stage 37.
- the first and second laser irradiation heads 34 ⁇ / b> A and 34 ⁇ / b> B may be installed above and below the glass substrate 2.
- the X stage 36 and the Y stage 37 are controlled by a scanning control unit 38.
- the first and second laser irradiation heads 34 ⁇ / b> A and 34 ⁇ / b> B are installed in an oblique direction so that the laser beams 9 ⁇ / b> A and 9 ⁇ / b> B from which the frame-shaped coating layer 8 is irradiated overlap with each other on the frame-shaped coating layer 8. ing.
- the first and second laser irradiation heads 34A and 34B are inclined in the X direction.
- 12 and 13 show a configuration in which the sample stage 32 is moved by the Y stage 37, but the configuration of the moving mechanism is not limited to this.
- 14 and 15 show a configuration in which the X stage 36 disposed above the fixed sample stage 32 is moved in the Y direction by two Y stages 37A and 37B.
- the moving mechanism can be configured to move the X stage 36 that moves the first and second laser irradiation heads 34A and 34B in the X direction by the two Y stages 37A and 37B in the Y direction. It is.
- the first and second laser irradiation heads 34A and 34B may be installed on the two X stages 36A and 36B, as shown in FIGS.
- the first and second X stages 36A and 36B are arranged in parallel to the X direction.
- the first and second laser irradiation heads 34A and 34B are inclined in a direction orthogonal to the X direction.
- the laser beams 9 ⁇ / b> A and 9 ⁇ / b> B are overlapped at the irradiation start position and the irradiation end position, and can be irradiated while scanning along the frame-shaped coating layer 8.
- the laser baking apparatus 31 includes a main control system 39 that comprehensively controls the output control unit 35 and the scanning control unit 38. Further, the laser baking apparatus 31 includes a radiation thermometer (not shown) that measures the baking temperature (heating temperature) of the frame-shaped coating layer 8.
- the laser baking apparatus 31 preferably includes a suction nozzle, a blower nozzle, and the like that prevent the organic binder removed from the frame-shaped coating layer 8 from adhering to the optical system and the glass substrate 2.
- the scanning control unit 38 irradiates at least one of the first and second laser beams 9A and 9B while scanning along the frame-shaped coating layer 8 from the irradiation start position to the irradiation end position where they overlap.
- the X stage 36 and the Y stage 37 (movement mechanism) are controlled.
- one laser irradiation head is fixed so as to continue to irradiate the irradiation start position.
- the first laser beam 9A and the second laser beam 9B are irradiated so as to overlap the irradiation start position of the coating layer 8 of the frame-shaped sealing material paste.
- at least one of the first laser beam 9A and the second laser beam 9B is irradiated while scanning along the coating layer 8 of the frame-shaped sealing material paste.
- the first laser beam 9A and the second laser beam 9B are overlapped at the irradiation end position of the coating layer 8 of the frame-shaped sealing material paste, and irradiation of the laser beams 9A and 9B is completed in this state. .
- a gap is generated at the irradiation end position by the shrinkage of the sealing glass at the end of the laser beam irradiation.
- the heating temperature of the coating layer 8 at this time is (T + 213 ° C.) or higher with respect to the softening temperature T (° C.) of the sealing glass, including the portion where the first laser light 9A and the second laser light 9B overlap. And (T + 480 ° C.) or less is preferable.
- the glass substrate 2 and the sealing material layer (firing layer) 7 are cracked or broken. It becomes easy.
- the temperature of the coating layer 8 when the first and second laser beams 9A and 9B are irradiated is lower than (T + 213 ° C.), the entire coating layer 8 cannot be uniformly melted.
- the heating temperature of the portion irradiated with the first and second laser beams 9A and 9B simultaneously and the portion irradiated with only one may be the same, and the heating temperature of the simultaneously irradiated portion is high within the above range.
- the outputs of the laser beams 9A and 9B may be controlled so that In this case, the set temperature is preferably the same as that in the method (1).
- the scanning speed of the laser beams 9A and 9B is as described above.
- At least one of the first and second laser beams 9A and 9B is scanned along the frame-shaped coating layer 8.
- a frame-shaped coating layer from the irradiation start position S to the irradiation end position (the same position as the irradiation start position) F is irradiated with the second laser beam 9B.
- 8 shows an example of irradiation while scanning along the line 8.
- the first laser beam 9A and the second laser beam 9B are irradiated so as to overlap at the irradiation start position S.
- the first laser beam 9A continues to irradiate the irradiation start position S, while the second laser beam 9B is scanned along the coating layer 8 from the irradiation start position S to the irradiation end position F.
- the second laser beam 9B overlaps the first laser beam 9A at the irradiation end position F (the same position as the irradiation start position S). Since the irradiation start position S of the coating layer 8 continues to be irradiated with the first laser light 9A, the sealing glass in that portion is maintained in a heated and melted state. For this reason, the sealing glass heated and melted by the second laser beam 9B and the sealing glass maintained in the heated and melted state by the first laser beam 9A are fused in a fluid state. Accordingly, it is possible to suppress the shrinkage of the sealing glass and the occurrence of a gap based on the shrinkage of the melted / cooled portion when the laser beam is irradiated again.
- FIG. 20 shows an example in which the first laser beam 9A and the second laser beam 9B are irradiated while scanning from the irradiation start position S to the irradiation end position F along the frame-shaped coating layer 8 in the opposite direction.
- the first laser beam 9A and the second laser beam 9B are irradiated so as to overlap at the irradiation start position S.
- the first laser beam 9 ⁇ / b> A and the second laser beam 9 ⁇ / b> B are scanned in the opposite directions, and independently scanned to the irradiation end position F along the coating layer 8.
- the first laser beam 9A and the second laser beam 9B merge at the irradiation end position F and overlap. Therefore, since the sealing glass heated and melted by the first laser beam 9A and the sealing glass heated and melted by the second laser beam 9B are fused, generation of a gap at the irradiation end position F can be suppressed. It becomes possible.
- the temperature of the portion where the first laser beam 9A and the second laser beam 9B overlap is the first laser beam 9A that is fixed point irradiation.
- the output density of the second laser light 9B is controlled within a range in which the coating layer 8 can be melted alone. Even when the second laser beam 9B and the first laser beam 9A are simultaneously irradiated, the output density of the first laser beam 9A is set so that the temperature of the simultaneous irradiation portion does not exceed a predetermined temperature range. To control. Further, the output density of the second laser light 9B may be controlled so as to decrease only near the start of irradiation and near the end of irradiation.
- the output density is controlled so that the coating layer 8 can be melted independently.
- the output density of at least one laser beam is set near the irradiation start and irradiation end Only control to lower.
- the output densities of the first laser beam 9A and the second laser beam 9B may be modulated simultaneously, or only one of them may be modulated.
- the modulation may be performed with a time difference.
- the laser beams 9A and 9B applied to the coating layer 8 of the sealing material paste are not limited to a pair, and a plurality of pairs of laser beams can be used.
- the frame-shaped coating layer 8 of the sealing material paste is divided into a plurality of regions corresponding to the number of pairs of laser beams (number of pairs).
- an irradiation start position and an irradiation end position in each region are set in a portion where a plurality of regions are adjacent to each other.
- the other laser beam is scanned along the frame-shaped coating layer 8 from the irradiation start position to the irradiation end position in each region. Irradiate while.
- the scanned laser beam is overlapped with another pair of laser beams that irradiate the irradiation start position at the irradiation end position.
- the frame-shaped coating layer 8 is divided into a plurality of regions corresponding to the number of pairs of laser beams (number of pairs).
- An irradiation start position is set for each of the intermediate portions of the plurality of regions, and an irradiation end position is set for each of the portions adjacent to the plurality of regions.
- a plurality of pairs of laser beams are irradiated to irradiation start positions in a plurality of regions, respectively.
- Each pair of laser beams is irradiated along the frame-shaped coating layer in the opposite direction from the irradiation start position.
- Each laser beam is overlapped with another pair of laser beams at the irradiation end position.
- FIG. 21 shows a scanning example when two pairs of laser beams (a first pair of laser beams 91A and 91B and a second pair of laser beams 92A and 92B) are used.
- the coating layer 8 is divided into first and second regions 8A and 8B.
- Irradiation start positions S1 and S2 are set at intermediate portions of the regions 8A and 8B, respectively, and irradiation end positions F1 and F2 are set at portions where the plurality of regions 8A and 8B are adjacent to each other.
- the irradiation end position F1 is the irradiation end position of the first laser beam 91A in the first pair and the first laser beam 92A in the second pair.
- the irradiation end position F2 is the irradiation end position of the second laser beam 91B in the first pair and the second laser beam 92B in the second pair.
- the first pair of laser beams 91A and 91B are irradiated so as to overlap each other at the irradiation start position S1, and are scanned along the frame-shaped coating layer 8 from the irradiation start position S1 in the opposite direction.
- scanning is performed along the frame-shaped coating layer 8 from the irradiation start position S2 in the opposite direction.
- the first laser beam 91A in the first pair and the first laser beam 92A in the second pair overlap at the irradiation end position F1.
- the second laser beam 91B in the first pair and the second laser beam 92B in the second pair overlap at the irradiation end position F2.
- FIG. 22 shows four pairs of laser beams (first pair of laser beams 91A and 91B, second pair of laser beams 92A and 92B, third pair of laser beams 93A and 93B, and fourth pair of laser beams 94A and 94B).
- the scanning example when using is shown.
- the coating layer 8 is divided into first, second, third, and fourth regions 8A, 8B, 8C, and 8D.
- Irradiation start positions S1, S2, S3, and S4 are set at intermediate portions of the regions 8A, 8B, 8C, and 8D, respectively, and irradiation end positions F1 and F4 are adjacent to portions adjacent to the regions 8A, 8B, 8C, and 8D, respectively.
- F2, F3, and F4 are set.
- the scanning of each pair of laser beams is performed in the same manner as when two pairs of laser beams are used, and overlaps with adjacent pairs of laser beams at the irradiation end position.
- the firing time of the frame-shaped coating layer 8 can be shortened by using a plurality of pairs of laser beams.
- an address plate having peelability with respect to the sealing glass is disposed on the coating layer 8 of the frame-shaped sealing material paste, and in this state, laser light is applied to the coating layer 8 from the glass substrate 2 side. 9 is irradiated.
- the address plate has translucency, the laser beam 9 may be irradiated from the address plate side.
- the contact plate for example, a substrate made of metal, semiconductor, non-oxide ceramics (nitride ceramics, carbide ceramics, etc.) is used. Since these have poor wettability with glass, they exhibit peelability with respect to the sealing glass. Therefore, even if the laser beam 9 is irradiated in a state where the coating layer 8 of the sealing material paste and the contact plate are laminated, the contact plate is not bonded to the sealing material layer 7. That is, a sound sealing material layer 7 can be obtained.
- the OELD, PDP, Electronic devices such as FPDs such as LCDs, lighting devices using OEL elements, and solar cells such as dye-sensitized solar cells are manufactured. That is, as shown in FIG. 1B, the first glass substrate 1 and the second glass substrate 2 are laminated via the sealing material layer 7 so that the surfaces 1a and 2a face each other. . A gap is formed between the first glass substrate 1 and the second glass substrate 2 based on the thickness of the sealing material layer 7.
- the sealing material layer 7 is irradiated with the sealing laser beam 10 through the second glass substrate 2.
- the sealing laser beam 10 may be applied to the sealing material layer 7 through the first glass substrate 1.
- the sealing laser beam 10 is irradiated while scanning along the frame-shaped sealing material layer 7.
- the sealing material layer 7 is melted in order from the portion irradiated with the laser light 10, and is rapidly cooled and solidified upon completion of the irradiation with the laser light 10 to be fixed to the first glass substrate 1.
- the sealing layer 11 to be formed is formed.
- the glass panel of this embodiment is not restricted to the component of the electronic device 12, It can be applied also to glass members (building materials etc.) like a sealing body of electronic components, or vacuum pair glass. is there.
- the manufacturing process of the electronic device 12 of this embodiment even when an organic resin film, an element film, or the like is formed on the surface 2a of the second glass substrate 2, there is no thermal damage to them.
- the sealing material layer 7 and the sealing layer 11 can be formed satisfactorily. Therefore, the electronic device 12 having excellent hermetic sealing properties and reliability can be manufactured with good reproducibility without deteriorating the function of the electronic device 12 and its reliability.
- Example 1 Bi 2 O 3 83.2% by mass, B 2 O 3 5.6% by mass, ZnO 10.7% by mass, Al 2 O 3 0.5% by mass, and an average particle diameter of 1 ⁇ m bismuth glass Frit (softening temperature: 450 ° C.), cordierite powder having an average particle size of 2 ⁇ m as a low expansion filler, Fe 2 O 3 —Cr 2 O 3 —MnO—Co 2 O 3 composition, average particle size was prepared with a 1 ⁇ m laser absorber.
- a sealing material paste was prepared by mixing 80% by mass of the sealing material with 20% by mass of the vehicle.
- the vehicle is obtained by dissolving ethyl cellulose (2.5% by mass) as a binder component in a solvent (97.5% by mass) made of terpineol.
- a second glass substrate (dimension: 90 ⁇ 90 ⁇ 0.7 mmt) made of alkali-free glass (thermal expansion coefficient: 38 ⁇ 10 ⁇ 7 / ° C.) is prepared and sealed in a sealing region of this glass substrate.
- the coating material paste was applied by screen printing and then dried at 120 ° C. for 10 minutes.
- the sealing material paste was applied so that the film thickness after drying was 20 ⁇ m and the line width was 1 mm.
- a resin color filter is formed on the surface of the second glass substrate, and it is necessary to form a sealing layer in the sealing region of the second glass substrate without causing thermal damage to the color filter.
- an alkali-free glass substrate on which a sealing material paste coating layer is formed is disposed on a sample holder of a laser irradiation device via a 0.5 mm thick alumina substrate, and the wavelength of the sealing material paste coating layer is 940 nm.
- a laser beam semiconductor laser having a spot diameter of 1.6 mm and an output density of 249 W / cm 2 was irradiated at a scanning speed of 0.5 mm / second.
- the temperature of the coating layer was 600 ° C.
- the sealing material layer having a film thickness of 12 ⁇ m was formed by firing the sealing material paste coating layer by irradiating laser light under such conditions.
- the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well.
- the sealing material layer no bubbles or surface deformation due to the organic binder was observed.
- the residual carbon amount of the sealing material layer was measured, it was confirmed that it was the same as the residual carbon amount when the coating layer of the same sealing material paste was baked in an electric furnace (250 ° C. ⁇ 40 minutes). Furthermore, it was confirmed that the color filter formed on the surface of the glass substrate was not damaged by heat.
- the above-described firing process of the sealing material paste coating layer with laser light was carried out by changing the laser light output so that the output density was 348 W / cm 2 and 448 W / cm 2.
- a sealing material layer vitrified was obtained.
- the temperature of the coating layer was 673 ° C. and 871 ° C.
- the firing process was carried out while reducing the output of the laser beam, only the surface of the coating layer could be vitrified.
- the output density of the laser beam was 199 W / cm 2
- the temperature of the coating layer was 491 ° C.
- the output density of the laser beam was 497 W / cm 2
- the temperature of the coating layer was 965 ° C.
- the heating temperature of the coating layer is preferably in the range of 600 to 900 ° C. when the scanning speed of the laser beam is 0.5 mm / second.
- the heating temperature of the coating layer corresponds to a range of + 150 ° C. to + 450 ° C. with respect to the softening temperature (450 ° C.) of the sealing glass.
- a second glass substrate having the above-described sealing material layer and a first glass substrate having an element region (region in which an OEL element is formed) (an alkali-free glass having the same composition and shape as the second glass substrate) Substrate).
- the sealing material layer is irradiated with a laser beam (semiconductor laser) having a wavelength of 940 nm, an output of 60 W, and a spot diameter of 1.6 mm through the second glass substrate at a scanning speed of 10 mm / s.
- the first glass substrate and the second glass substrate were sealed by melting and rapid solidification.
- the appearance of the glass panel thus produced was evaluated by observing cracks and cracks in the glass substrate and the sealing layer, the bonding state of the sealing layer, etc. with an optical microscope, and all were confirmed to be good. It was.
- the hermeticity of the glass panel was measured by a helium leak test, it was confirmed that a good hermetic state was obtained.
- the joining strength of a glass substrate and a sealing layer was measured, it was confirmed that the intensity
- Example 2 The firing process of the coating layer of the sealing material paste in the same manner as in Example 1 except that the output density of the laser light applied to the coating layer of the sealing material paste is changed to 298 W / cm 2 and the scanning speed is changed to 1 mm / second. Carried out. The temperature of the coating layer at this time was 637 ° C. A sealing material layer having a thickness of 12 ⁇ m was formed by firing the sealing material paste coating layer by irradiating laser light under such conditions. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. In addition, no bubbles or surface deformation due to the organic binder was observed in the sealing material layer. Furthermore, when the amount of residual carbon in the sealing material layer was measured, it was confirmed that it was the same as the amount of residual carbon when the coating layer of the same sealing material paste was baked in an electric furnace (250 ° C. ⁇ 40 minutes). It was.
- the above baking process by laser irradiation of the coating layer of the sealing material paste was carried out by changing the output of the laser beam so that the output density was 398 W / cm 2 and 497 W / cm 2.
- a sealing material layer vitrified was obtained.
- the temperature of the coating layer was 768 ° C. and 887 ° C.
- the firing process was carried out while reducing the output of the laser beam, only the surface of the coating layer could be vitrified.
- the output density of the laser beam was 249 W / cm 2
- the temperature of the coating layer was 560 ° C.
- the output density of the laser beam was 547 W / cm 2
- the temperature of the coating layer was 955 ° C.
- the heating temperature of the coating layer is preferably in the range of 630 to 900 ° C. when the scanning speed of the laser beam is 1 mm / second.
- the heating temperature of the coating layer corresponds to a range of + 180 ° C. to + 450 ° C. with respect to the softening temperature (450 ° C.) of the sealing glass.
- the laser is applied to the sealing material layer through the second glass substrate.
- the first and second glass substrates are made of alkali-free glass as in the first embodiment.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 3 The firing process of the coating layer of the sealing material paste in the same manner as in Example 1 except that the output density of the laser light applied to the coating layer of the sealing material paste is changed to 448 W / cm 2 and the scanning speed is changed to 3 mm / second. Carried out. The temperature of the coating layer at this time was 666 ° C. A sealing material layer having a thickness of 12 ⁇ m was formed by firing the sealing material paste coating layer by irradiating laser light under such conditions. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. In addition, no bubbles or surface deformation due to the organic binder was observed in the sealing material layer. Furthermore, when the amount of residual carbon in the sealing material layer was measured, it was confirmed that it was the same as the amount of residual carbon when the coating layer of the same sealing material paste was baked in an electric furnace (250 ° C. ⁇ 40 minutes). It was.
- the firing process by laser irradiation of the sealing material paste coating layer described above was carried out by changing the output of the laser light so that the output density was 647 W / cm 2 and 746 W / cm 2.
- a sealing material layer vitrified was obtained.
- the temperature of the coating layer was 790 ° C. and 897 ° C.
- the output density of the laser beam was 398 W / cm 2
- the temperature of the coating layer was 646 ° C.
- the output density of the laser beam was 846 W / cm 2
- the temperature of the coating layer was 1044 ° C.
- the heating temperature of the coating layer is preferably in the range of 660 to 900 ° C. when the scanning speed of the laser beam is 3 mm / second.
- the heating temperature of this coating layer corresponds to a range of + 210 ° C. to + 450 ° C. with respect to the softening temperature (450 ° C.) of the sealing glass.
- the laser is applied to the sealing material layer through the second glass substrate.
- the first and second glass substrates are made of alkali-free glass as in the first embodiment.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 4 The firing process of the coating layer of the sealing material paste in the same manner as in Example 1 except that the output density of the laser light applied to the coating layer of the sealing material paste is changed to 497 W / cm 2 and the scanning speed is changed to 5 mm / second. Carried out. The temperature of the coating layer at this time was 663 ° C. A sealing material layer having a thickness of 12 ⁇ m was formed by firing the sealing material paste coating layer by irradiating laser light under such conditions. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. In addition, no bubbles or surface deformation due to the organic binder was observed in the sealing material layer. Furthermore, when the amount of residual carbon in the sealing material layer was measured, it was confirmed that it was the same as the amount of residual carbon when the coating layer of the same sealing material paste was baked in an electric furnace (250 ° C. ⁇ 40 minutes). It was.
- the firing process by laser irradiation of the coating layer of the sealing material paste described above was carried out by changing the output of the laser light so that the output density was 746 W / cm 2 and 846 W / cm 2.
- a sealing material layer vitrified was obtained.
- the temperature of the coating layer was 803 ° C. and 858 ° C.
- the output density of the laser beam was 448 W / cm 2
- the temperature of the coating layer was 631 ° C.
- the output density of the laser beam was 995 W / cm 2
- the temperature of the coating layer was 1043 ° C.
- the heating temperature of the coating layer is preferably in the range of 680 to 900 ° C. when the scanning speed of the laser beam is 5 mm / second.
- the heating temperature of this coating layer corresponds to a range of + 230 ° C. to + 450 ° C. with respect to the softening temperature (450 ° C.) of the sealing glass.
- the laser is applied to the sealing material layer through the second glass substrate.
- the first and second glass substrates are made of alkali-free glass as in the first embodiment.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 5 In the same manner as in Example 1, a coating layer of the sealing material paste was formed on an alkali-free glass substrate (first glass substrate). Such a glass substrate was placed on a sample holder of the same laser irradiation apparatus as in Example 1 with an alumina substrate having a thickness of 0.5 mm interposed therebetween. Next, a first laser beam having a wavelength of 808 nm and an output density of 194 W / cm 2 is applied to the coating layer of the sealing material paste at a fixed point, and at the same time, a second laser beam having a wavelength of 940 nm and an output density of 298 W / cm 2 is placed at the same position. Irradiation was further performed along the coating layer with a second laser beam at a scanning speed of 1 mm / second. Irradiation of the second laser beam was terminated when it overlapped with the irradiation position of the first laser beam.
- the first laser beam has a coating layer heating temperature of 637 ° C. during fixed point irradiation.
- the heating temperature of the coating layer becomes 637 ° C.
- the heating temperature of the coating layer at the time of simultaneous irradiation is 910 ° C.
- the sealing material layer having a film thickness of 12 ⁇ m was formed by firing the coating layer of the sealing material paste using such two laser beams. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. Furthermore, it was confirmed that no gap occurred at the irradiation end position.
- Example 1 After laminating the second glass substrate having the sealing material layer and the first glass substrate having the element region in the same manner as in Example 1, the laser is applied to the sealing material layer through the second glass substrate. By irradiating with light, the first glass substrate and the second glass substrate were sealed.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 6 In the same manner as in Example 1, a coating layer of the sealing material paste was formed on an alkali-free glass substrate (first glass substrate). Such a glass substrate was placed on a sample holder of the same laser irradiation apparatus as in Example 1 with an alumina substrate having a thickness of 0.5 mm interposed therebetween. Next, the first layer of laser light having a wavelength of 808 nm and an output density of 199 W / cm 2 is irradiated to the coating layer of the sealing material paste at a fixed point, and at the same time, the second laser beam having a wavelength of 940 nm and an output density of 448 W / cm 2 is placed at the same position.
- Irradiation was performed, and further, a second laser beam was irradiated along the coating layer at a scanning speed of 3 mm / second. Irradiation of the second laser beam was terminated when it overlapped with the irradiation position of the first laser beam.
- the first laser beam has a coating layer heating temperature of 680 ° C. during fixed point irradiation.
- the heating temperature of the coating layer becomes 680 ° C.
- the heating temperature of the coating layer at the time of simultaneous irradiation is 930 ° C.
- the sealing material layer having a film thickness of 12 ⁇ m was formed by firing the coating layer of the sealing material paste using such two laser beams. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. Furthermore, it was confirmed that no gap occurred at the irradiation end position.
- Example 1 After laminating the second glass substrate having the sealing material layer and the first glass substrate having the element region in the same manner as in Example 1, the laser is applied to the sealing material layer through the second glass substrate. By irradiating with light, the first glass substrate and the second glass substrate were sealed.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 7 In the same manner as in Example 1, a coating layer of the sealing material paste was formed on an alkali-free glass substrate (first glass substrate). Such a glass substrate was placed on a sample holder of the same laser irradiation apparatus as in Example 1 with an alumina substrate having a thickness of 0.5 mm interposed therebetween. Next, the coating layer of the sealing material paste is irradiated with a first laser beam having a wavelength of 808 nm and an output density of 224 W / cm 2 at the same time, and at the same time, a second laser beam having a wavelength of 940 nm and an output density of 497 W / cm 2 is placed at the same position. Irradiation was further performed along the coating layer with a second laser beam at a scanning speed of 5 mm / sec. Irradiation of the second laser beam was terminated when it overlapped with the irradiation position of the first laser beam.
- the first laser beam has a coating layer heating temperature of 700 ° C. during fixed point irradiation.
- the second laser beam has a coating layer heating temperature of 663 ° C. when scanned at 5 mm / sec.
- the heating temperature of the coating layer at the time of simultaneous irradiation is 930 ° C.
- the sealing material layer having a film thickness of 12 ⁇ m was formed by firing the coating layer of the sealing material paste using such two laser beams. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. Furthermore, it was confirmed that no gap occurred at the irradiation end position.
- Example 1 After laminating the second glass substrate having the sealing material layer and the first glass substrate having the element region in the same manner as in Example 1, the laser is applied to the sealing material layer through the second glass substrate. By irradiating with light, the first glass substrate and the second glass substrate were sealed.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 8 In the same manner as in Example 1, a coating layer of the sealing material paste was formed on an alkali-free glass substrate (first glass substrate). Such a glass substrate was placed on a sample holder of the same laser irradiation apparatus as in Example 1 with an alumina substrate having a thickness of 0.5 mm interposed therebetween. Next, a laser beam having a wavelength of 940 nm and an output density of 597 W / cm 2 is irradiated for 3 seconds at a scanning speed of 1 mm / sec to the coating layer of the sealing material paste, and then the laser beam output density is reduced to 348 W / cm 2 to be the same. Irradiation was performed along the coating layer at a scanning speed.
- the laser beam was again raised to an output density of 597 W / cm 2 and irradiated in this state to the irradiation end position.
- the heating temperature of the coating layer when the output density of the laser beam is 597 W / cm 2 is 1000 ° C.
- the heating temperature of the coating layer when the output density of the laser beam is 348 W / cm 2 is 700 ° C.
- a sealing material layer having a film thickness of 12 ⁇ m was formed by firing the coating layer of the sealing material paste using such output-modulated laser light. When the state of the sealing material layer was observed with an SEM, it was confirmed that it was vitrified well. Furthermore, it was confirmed that no gap occurred at the irradiation end position.
- Example 1 After laminating the second glass substrate having the sealing material layer and the first glass substrate having the element region in the same manner as in Example 1, the laser is applied to the sealing material layer through the second glass substrate. By irradiating with light, the first glass substrate and the second glass substrate were sealed.
- the obtained glass panel was excellent in appearance, airtightness, bonding strength and the like as in Example 1.
- Example 9 In the same manner as in Example 1, a coating layer of the sealing material paste was formed on an alkali-free glass substrate (first glass substrate). A silicon substrate having a thickness of 0.5 mm is placed on the sample holder of the same laser irradiation apparatus as in Example 1 instead of the alumina substrate having a thickness of 0.5 mm, and a coating layer of a sealing material paste is formed on the silicon substrate. The glass substrate was installed so that it might touch. Next, a laser beam having a wavelength of 940 nm and an output density of 896 W / cm 2 was applied to the coating layer of the sealing material paste along the coating layer at a scanning speed of 1 mm / second from the glass substrate side. The heating temperature of the coating layer by laser light is 860 ° C.
- Example 10 An example in which the coating layer of the sealing material paste is baked using the laser baking apparatus 31 shown in FIGS.
- the laser light source 33 for example, a semiconductor laser (manufactured by LIMO) having a wavelength of 808 nm and a maximum oscillation output of 80 W is used.
- the X stage 36 SGSP33-100 (X) (maximum movement amount 100 mm, positioning accuracy 20 ⁇ m) manufactured by Sigma Koki Co., Ltd. is used.
- SGSP33-200 (X) maximum movement amount 200 mm, positioning accuracy 20 ⁇ m
- the laser irradiation heads 34A and 34B for example, as shown in FIG. 23, an optical fiber (core diameter 400 ⁇ m, NA 0.22) 41 that transmits the laser light emitted from the laser light source 33, and the laser light is condensed and desired.
- the dichroic mirror 45 and the reflection mirror 46 are configured to reflect only visible light from the irradiated portion (laser light is transmitted) and guide it to the CCD image pickup device 44.
- a two-color radiation thermometer (IR-FA, manufactured by Chino Corporation) 47 for measuring the temperature of the irradiated portions of the laser beams 9A and 9B is installed.
- FIG. 24 is a flowchart showing a method for forming a sealing material layer by the laser baking device 31 (a method for baking a frame-shaped coating layer of a sealing material paste).
- FIG. 25 shows an example of laser light output control at that time. Based on these figures, a method for firing the frame-shaped coating layer will be described.
- an alkali-free glass substrate on which a frame-shaped coating layer of the sealing material paste is formed is prepared in the same procedure as in Example 1.
- the glass substrate is disposed on the sample stage 32 of the laser baking apparatus 31 via an alumina substrate having a thickness of 0.5 mm.
- the glass substrate is disposed so that the frame-shaped coating layer is on top.
- the first and second laser irradiation beds 34A and 34B are moved to the initial position (101), and the first and second laser beams 9A and 9B are spot diameters of 1.6 mm at the same position of the frame-shaped coating layer, respectively. Irradiation is performed at a power density of 400 W / cm 2 (102).
- the irradiation start position (same location) of the laser beams 9A and 9B is the midpoint of one side of the frame-shaped coating layer.
- the temperature of the frame-shaped coating layer at that time is 860 ° C.
- the X stage 36 is operated to irradiate the first and second laser beams so that the first and second laser beams 9A and 9B move away on the frame-shaped coating layer 8 at a scanning speed of 5 mm / second, respectively.
- the beds 34A and 34B are moved (103). After the first and second laser beams 9A and 9B have moved 0.8 mm (1/2 of the spot diameter) from the irradiation start position, the outputs of the first and second laser beams 9A and 9B are respectively 750 W / cm 2. And then irradiate (104).
- the temperature of the coating layer in that case is 800 degreeC, respectively.
- the operation of the X stage 36 is stopped (105), and the Y stage 37 is operated instead, and the sample stage 32 is moved. It is moved at a speed of 5 mm / sec (106).
- the irradiation conditions of the laser beams 9A and 9B at this time are also 750 W / cm 2 , and the temperature of the coating layer is 800 ° C., respectively.
- the operation of the Y stage 37 is stopped (107), and then the X stage 36 is operated to
- the first and second laser irradiation beds 34A and 34B are moved so that the laser beams 9A and 9B approach each other at a speed of 5 mm / second (108).
- the irradiation conditions of the laser beams 9A and 9B at this time are also 750 W / cm 2 , and the temperature of the coating layer is 800 ° C., respectively.
- the first and second laser beams 9A and 9B approach each other, and the laser beam 9A is positioned at a position 0.6 mm before reaching the irradiation end position (the midpoint of one side of the frame-shaped coating layer facing the irradiation start position).
- the output of 9B is reduced to 400 W / cm 2 (109), and the operation of the X stage 36 is stopped in the state where the first and second laser beams 9A and 9B overlap at the irradiation end position (110).
- the temperature of the coating layer at this time is 860 ° C.
- the irradiation of the laser beams 9A and 9B is stopped (111), and the X stage 36 and the Y stage 37 are returned to the origin (112).
- the series of operations described above are programmed in advance, and when the glass substrate on which the coating layer of the sealing material paste is formed is placed on the sample stage and the operation button is pressed, all the steps described above are automatically performed.
- the state of the coating layer of the sealing material paste baked by the above-described apparatus and procedure is the same as that of the sample baked in the electric furnace, and the laser sealability is also the same.
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Abstract
Description
レーザ光9の出力密度D1と出力密度D2との比率、D1/D2は、1.1~3.0が好ましく、1.2~2.0がより好ましい。
出力制御部35は、例えばレーザ光源33に入力される電力を制御することによりレーザ光の出力を制御する。また、出力制御部35はレーザ光源33から出射されたレーザ光の出力を制御する出力変調器を有していてもよい。レーザ光の出力は、第1及び第2のレーザ照射ヘッド34A、34Bに応じて個々に制御するようにしてもよい。
Bi2O383.2質量%、B2O35.6質量%、ZnO10.7質量%、Al2O30.5質量%の組成を有し、平均粒径が1μmのビスマス系ガラスフリット(軟化温度:450℃)と、低膨張充填材として平均粒径が2μmのコージェライト粉末と、Fe2O3-Cr2O3-MnO-Co2O3組成を有し、平均粒径が1μmのレーザ吸収材とを用意した。
封着材料ペーストの塗布層に照射するレーザ光の出力密度を298W/cm2、走査速度を1mm/秒に変更する以外は、実施例1と同様にして封着材料ペーストの塗布層の焼成工程を実施した。この際の塗布層の温度は637℃であった。このような条件でレーザ光を照射して封着材料ペーストの塗布層を焼成することによって、膜厚が12μmの封着材料層を形成した。封着材料層の状態をSEMで観察したところ、良好にガラス化していることが確認された。また、封着材料層には有機バインダに起因する気泡や表面変形の発生も認められなかった。さらに、封着材料層の残留カーボン量を測定したところ、同一の封着材料ペーストの塗布層を電気炉で焼成(250℃×40分)した際の残留カーボン量と同等であることが確認された。
封着材料ペーストの塗布層に照射するレーザ光の出力密度を448W/cm2、走査速度を3mm/秒に変更する以外は、実施例1と同様にして封着材料ペーストの塗布層の焼成工程を実施した。この際の塗布層の温度は666℃であった。このような条件でレーザ光を照射して封着材料ペーストの塗布層を焼成することによって、膜厚が12μmの封着材料層を形成した。封着材料層の状態をSEMで観察したところ、良好にガラス化していることが確認された。また、封着材料層には有機バインダに起因する気泡や表面変形の発生も認められなかった。さらに、封着材料層の残留カーボン量を測定したところ、同一の封着材料ペーストの塗布層を電気炉で焼成(250℃×40分)した際の残留カーボン量と同等であることが確認された。
封着材料ペーストの塗布層に照射するレーザ光の出力密度を497W/cm2、走査速度を5mm/秒に変更する以外は、実施例1と同様にして封着材料ペーストの塗布層の焼成工程を実施した。この際の塗布層の温度は663℃であった。このような条件でレーザ光を照射して封着材料ペーストの塗布層を焼成することによって、膜厚が12μmの封着材料層を形成した。封着材料層の状態をSEMで観察したところ、良好にガラス化していることが確認された。また、封着材料層には有機バインダに起因する気泡や表面変形の発生も認められなかった。さらに、封着材料層の残留カーボン量を測定したところ、同一の封着材料ペーストの塗布層を電気炉で焼成(250℃×40分)した際の残留カーボン量と同等であることが確認された。
封着材料ペーストの塗布層に照射するレーザ光の出力密度を696W/cm2、走査速度を10mm/秒に変更する以外は、実施例1と同様にして封着材料ペーストの塗布層の焼成工程を実施した。このような条件でレーザ光を照射して封着材料ペーストの塗布層を焼成することによって、膜厚が12μmの封着材料層を形成した。
実施例1と同様にして、無アルカリガラス基板(第1のガラス基板)上に封着材料ペーストの塗布層を形成した。このようなガラス基板を実施例1と同一のレーザ照射装置のサンプルホルダ上に厚さ0.5mmのアルミナ基板を介して配置した。次いで、封着材料ペーストの塗布層に波長808nm、出力密度194W/cm2の第1のレーザ光を定点照射し、同時に波長940nm、出力密度298W/cm2の第2のレーザ光を同一位置に照射し、さらに第2のレーザ光を1mm/秒の走査速度で塗布層に沿って照射した。第2のレーザ光は第1のレーザ光の照射位置と重なったところで照射を終了した。
実施例1と同様にして、無アルカリガラス基板(第1のガラス基板)上に封着材料ペーストの塗布層を形成した。このようなガラス基板を実施例1と同一のレーザ照射装置のサンプルホルダ上に厚さ0.5mmのアルミナ基板を介して配置した。次いで、封着材料ペーストの塗布層に波長808nm、出力密度199W/cm2の第1のレーザ光を定点照射し、同時に波長940nm、出力密度448W/cm2の第2のレーザ光を同一位置に照射し、さらに第2のレーザ光を3mm/秒の走査速度で塗布層に沿って照射した。第2のレーザ光は第1のレーザ光の照射位置と重なったところで照射を終了した。
実施例1と同様にして、無アルカリガラス基板(第1のガラス基板)上に封着材料ペーストの塗布層を形成した。このようなガラス基板を実施例1と同一のレーザ照射装置のサンプルホルダ上に厚さ0.5mmのアルミナ基板を介して配置した。次いで、封着材料ペーストの塗布層に波長808nm、出力密度224W/cm2の第1のレーザ光を定点照射し、同時に波長940nm、出力密度497W/cm2の第2のレーザ光を同一位置に照射し、さらに第2のレーザ光を5mm/秒の走査速度で塗布層に沿って照射した。第2のレーザ光は第1のレーザ光の照射位置と重なったところで照射を終了した。
実施例1と同様にして、無アルカリガラス基板(第1のガラス基板)上に封着材料ペーストの塗布層を形成した。このようなガラス基板を実施例1と同一のレーザ照射装置のサンプルホルダ上に厚さ0.5mmのアルミナ基板を介して配置した。次いで、封着材料ペーストの塗布層に波長940nm、出力密度597W/cm2のレーザ光を1mm/秒の走査速度で3秒間照射した後、レーザ光の出力密度348W/cm2まで低下させて同一走査速度で塗布層に沿って照射した。そして、照射終了位置(照射開始位置と同一位置)に至る3秒前にレーザ光の出力密度597W/cm2まで再上昇させ、この状態で照射終了位置まで照射した。
実施例1と同様にして、無アルカリガラス基板(第1のガラス基板)上に封着材料ペーストの塗布層を形成した。実施例1と同一のレーザ照射装置のサンプルホルダ上に厚さ0.5mmのアルミナ基板に代えて厚さ0.5mmのシリコン基板を配置し、その上に封着材料ペーストの塗布層がシリコン基板と接するようにガラス基板を設置した。次いで、封着材料ペーストの塗布層にガラス基板側から波長940nm、出力密度896W/cm2のレーザ光を1mm/秒の走査速度で塗布層に沿って照射した。レーザ光による塗布層の加熱温度は860℃である。
図12及び図13に示したレーザ焼成装置31を用いて、封着材料ペーストの塗布層を焼成する例について述べる。レーザ光源33としては、例えば波長808nm、最大発振出力80Wの半導体レーザ(LIMO社製)が用いられる。Xステージ36としては、シグマ光機社製のSGSP33-100(X)(最大移動量100mm、位置決め精度20μm)が用いられる。Yステージ37としては、SGSP33-200(X)(最大移動量200mm、位置決め精度20μm)が用いられる。
なお、2009年7月23日に出願された日本特許出願2009-171812号及び2009年11月19日に出願された日本特許出願2009-263540号の明細書、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。
Claims (32)
- 封止領域を有するガラス基板を用意する工程と、
封着ガラスとレーザ吸収材とを含む封着材料を有機バインダと混合して調製した封着材料ペーストを、前記ガラス基板の前記封止領域上に枠状に塗布する工程と、
前記枠状の封着材料ペーストの塗布層に沿ってレーザ光を照射して加熱し、前記塗布層内の前記有機バインダを除去しつつ、前記封着材料を焼成して封着材料層を形成する工程とを具備し、
前記封着ガラスの軟化温度T(℃)に対して前記封着材料の加熱温度が(T+213℃)以上で(T+480℃)以下の範囲となるように、前記レーザ光を前記枠状の封着材料ペーストの塗布層に照射することを特徴とする封着材料層付きガラス部材の製造方法。 - 前記レーザ光を前記枠状の封着材料ペーストの塗布層に沿って走査しながら照射することを特徴とする請求項1記載の封着材料層付きガラス部材の製造方法。
- 前記レーザ光を0.1mm/秒以上で5mm/秒以下の範囲の走査速度で走査することを特徴とする請求項2記載の封着材料層付きガラス部材の製造方法。
- 前記枠状の封着材料ペーストの塗布層に出力密度が200~900W/cm2の範囲の前記レーザ光を照射することを特徴とする請求項1乃至3のいずれか1項記載の封着材料層付きガラス部材の製造方法。
- 前記レーザ光の照射開始時期及び照射終了時期における出力密度が、前記照射開始時期及び前記照射終了時期を除く前記レーザ光の前記枠状の封着材料ペーストの塗布層に沿った走査照射時期における出力密度より高くなるように、前記レーザ光の出力密度を制御することを特徴とする請求項2又は3記載の封着材料層付きガラス部材の製造方法。
- 前記照射開始時期及び前記照射終了時期における前記封着材料の加熱温度が(T+350℃)以上で(T+550℃)以下の範囲となると共に、前記走査照射時期における前記封着材料の加熱温度が(T+213℃)以上で(T+480℃)以下の範囲となるように、前記レーザ光を前記枠状の封着材料ペーストの塗布層に沿って照射することを特徴とする請求項5記載の封着材料層付きガラス部材の製造方法。
- 前記レーザ光として少なくとも一対のレーザ光を、前記枠状の封着材料ペーストの塗布層の照射開始位置に重なるように照射し、前記少なくとも一対のレーザ光のうちの少なくとも一方を前記枠状の封着材料ペーストの塗布層に沿って走査しながら照射した後、前記枠状の封着材料ペーストの塗布層の照射終了位置で2つの前記レーザ光を重ならせることを特徴とする請求項2記載の封着材料層付きガラス部材の製造方法。
- 前記少なくとも一対のレーザ光のうちの少なくとも一方を0.1mm/秒以上で5mm/秒以下の範囲の走査速度で走査することを特徴とする請求項7記載の封着材料層付きガラス部材の製造方法。
- 前記一対のレーザ光のうちの一方のレーザ光を前記照射開始位置に照射し続けると共に、他方のレーザ光を前記照射開始位置から前記照射開始位置と同一位置である前記照射終了位置まで前記枠状の封着材料ペーストの塗布層に沿って走査しながら照射することを特徴とする請求項7又は8記載の封着材料層付きガラス部材の製造方法。
- 前記一対のレーザ光をそれぞれ前記照射開始位置から逆方向に向けて前記枠状の封着材料ペーストの塗布層に沿って前記照射終了位置まで走査しながら照射し、前記照射終了位置で重ならせることを特徴とする請求項7又は8記載の封着材料層付きガラス部材の製造方法。
- 前記レーザ光として複数対のレーザ光を用意すると共に、前記枠状の封着材料ペーストの塗布層を前記レーザ光の対数に対応させて複数の領域に分割し、
前記複数の領域が隣接する部分にそれぞれ前記複数の領域内の前記照射開始位置と前記照射終了位置とを設定し、
前記複数対のレーザ光のうちのそれぞれ一方のレーザ光を前記照射開始位置に照射し続けると共に、それぞれ他方のレーザ光を各領域内の前記照射開始位置から前記照射終了位置まで前記枠状の封着材料ペーストの塗布層に沿って走査しながら照射し、前記照射終了位置で前記照射開始位置を照射している他の対のレーザ光と重ならせることを特徴とする請求項7又は8記載の封着材料層付きガラス部材の製造方法。 - 前記レーザ光として複数対のレーザ光を用意すると共に、前記枠状の封着材料ペーストの塗布層を前記レーザ光の対数に対応させて複数の領域に分割し、
前記複数の領域の中間部分にそれぞれ前記照射開始位置を設定すると共に、前記複数の領域が隣接する部分にそれぞれ前記照射終了位置を設定し、
前記複数対のレーザ光をそれぞれ前記複数の領域の前記照射開始位置に照射し、各対のレーザ光を前記照射開始位置から逆方向に向けて前記枠状の封着材料ペーストの塗布層に沿って照射し、前記照射終了位置で他の対のレーザ光と重ならせることを特徴とする請求項7又は8記載の封着材料層付きガラス部材の製造方法。 - 前記封着ガラスに対して剥離性を有するあて板を、前記枠状の封着材料ペーストの塗布層上に配置した後、前記枠状の封着材料ペーストの塗布層に沿って前記レーザ光を照射することを特徴とする請求項1乃至12のいずれか1項記載の封着材料層付きガラス部材の製造方法。
- 前記封着材料層は20μm以下の厚さを有することを特徴とする請求項1乃至13のいずれか1項記載の封着材料層付きガラス部材の製造方法。
- 前記封着材料は、錫-リン酸系ガラス又はビスマス系ガラスからなる前記封着ガラスを含むことを特徴とする請求項1乃至14のいずれか1項記載の封着材料層付きガラス部材の製造方法。
- 前記封着材料は、Fe、Cr、Mn、Co、Ni、及びCuから選ばれる少なくとも1種の金属又は前記金属を含む化合物からなる前記レーザ吸収材を0.1~10体積%の範囲で含むことを特徴とする請求項1乃至15のいずれか1項記載の封着材料層付きガラス部材の製造方法。
- 前記封着材料は、シリカ、アルミナ、ジルコニア、珪酸ジルコニウム、チタン酸アルミニウム、ムライト、コージェライト、ユークリプタイト、スポジュメン、リン酸ジルコニウム系化合物、石英固溶体、ソーダライムガラス、及び硼珪酸ガラスから選ばれる少なくとも1種からなる低膨張充填材を5~50体積%の範囲で含むことを特徴とする請求項1乃至16のいずれか1項記載の封着材料層付きガラス部材の製造方法。
- 封着ガラスとレーザ吸収材とを含む封着材料を有機バインダと混合して調製した封着材料ペーストの枠状塗布層を有するガラス基板が載置される試料台と、
レーザ光を出射するレーザ光源と、
前記レーザ光源から出射されたレーザ光を前記ガラス基板の前記枠状塗布層に照射する光学系を有するレーザ照射ヘッドと、
前記試料台と前記レーザ照射ヘッドとの位置を相対的に移動させる移動機構と、
前記レーザ光を前記枠状塗布層に沿って走査しながら照射するように、前記移動機構を制御する走査制御部と、
前記レーザ照射ヘッドから前記枠状塗布層に照射されるレーザ光の照射開始時期及び照射終了時期における出力密度が、前記照射開始時期及び前記照射終了時期を除く前記レーザ光の前記枠状塗布層に沿った走査照射時期における出力密度より高くなるように、前記レーザ光の出力を制御する出力制御部と
を具備することを特徴とする封着材料層付きガラス部材の製造装置。 - 前記出力制御部は、前記封着ガラスの軟化温度T(℃)に対して前記照射開始時期及び前記照射終了時期における前記封着材料の加熱温度が(T+350℃)以上で(T+550℃)以下の範囲となると共に、前記走査照射時期における前記封着材料の加熱温度が(T+213℃)以上で(T+480℃)以下の範囲となるように、前記レーザ光の出力を制御することを特徴とする請求項18記載の封着材料層付きガラス部材の製造装置。
- 前記走査制御部は、前記レーザ光の走査速度が0.1mm/秒以上で5mm/秒以下の範囲となるように、前記移動機構を制御することを特徴とする請求項18又は19記載の封着材料層付きガラス部材の製造装置。
- 封着ガラスとレーザ吸収材とを含む封着材料を有機バインダと混合して調製した封着材料ペーストの枠状塗布層を有するガラス基板が載置される試料台と、
レーザ光を出射するレーザ光源と、
前記レーザ光源から出射されたレーザ光を前記ガラス基板の前記枠状塗布層に照射する光学系をそれぞれ有する少なくとも一対のレーザ照射ヘッドと、
前記少なくとも一対のレーザ照射ヘッドから前記枠状塗布層に照射される少なくとも一対のレーザ光の出力を制御する出力制御部と、
前記試料台と前記少なくとも一対のレーザ照射ヘッドとの個別位置を相対的に移動させる移動機構と、
前記少なくとも一対のレーザ光のうちの少なくとも一方を、前記少なくとも一対のレーザ光が重なる照射開始位置から照射終了位置まで、前記枠状塗布層に沿って走査しながら照射するように、前記移動機構を制御する走査制御部と
を具備することを特徴とする封着材料層付きガラス部材の製造装置。 - 前記少なくとも一対のレーザ照射ヘッドは、前記照射開始位置を照射するように固定された第1のレーザ照射ヘッドと、走査可能とされた第2のレーザ照射ヘッドとを備え、
前記移動機構は、前記第2のレーザ照射ヘッドをX方向に移動させるXステージと、前記試料台をY方向に移動させるYステージとを備え、
前記走査制御部は、前記第2のレーザ照射ヘッドから照射される第2のレーザ光を、前記第1のレーザ照射ヘッドから照射される第1のレーザ光と重なる前記照射開始位置から前記照射開始位置と同一位置である前記照射終了位置まで、前記枠状塗布層に沿って走査しながら照射するように、前記Xステージ及び前記Yステージを駆動させることを特徴とする請求項21記載の封着材料層付きガラス部材の製造装置。 - 前記少なくとも一対のレーザ照射ヘッドは、前記照射開始位置を照射するように固定された第1のレーザ照射ヘッドと、走査可能とされた第2のレーザ照射ヘッドとを備え、
前記移動機構は、前記第2のレーザ照射ヘッドをX方向に移動させるXステージと、前記XステージをY方向に移動させるYステージとを備え、
前記走査制御部は、前記第2のレーザ照射ヘッドから照射される第2のレーザ光を、前記第1のレーザ照射ヘッドから照射される第1のレーザ光と重なる前記照射開始位置から前記照射開始位置と同一位置である前記照射終了位置まで、前記枠状塗布層に沿って走査しながら照射するように、前記Xステージ及び前記Yステージを駆動させることを特徴とする請求項21記載の封着材料層付きガラス部材の製造装置。 - 前記少なくとも一対のレーザ照射ヘッドは、第1のレーザ照射ヘッドと第2のレーザ照射ヘッドとを備え、
前記移動機構は、前記第1及び第2のレーザ照射ヘッドをX方向に移動させるXステージと、前記試料台をY方向に移動させるYステージとを備え、
前記走査制御部は、前記第1のレーザ照射ヘッドから照射される第1のレーザ光と前記第2のレーザ照射ヘッドから照射される第2のレーザ光とを、前記第1のレーザ光と前記第2のレーザ光とが重なる前記照射開始位置から逆方向に向けて、前記第1のレーザ光と前記第2のレーザ光とが重なる前記照射終了位置まで前記枠状塗布層に沿って走査しながら照射するように、前記Xステージ及び前記Yステージを駆動させることを特徴とする請求項21記載の封着材料層付きガラス部材の製造装置。 - 前記少なくとも一対のレーザ照射ヘッドは、第1のレーザ照射ヘッドと第2のレーザ照射ヘッドとを備え、
前記移動機構は、前記第1及び第2のレーザ照射ヘッドをX方向に移動させるXステージと、前記XステージをY方向に移動させるYステージとを備え、
前記走査制御部は、前記第1のレーザ照射ヘッドから照射される第1のレーザ光と前記第2のレーザ照射ヘッドから照射される第2のレーザ光とを、前記第1のレーザ光と前記第2のレーザ光とが重なる前記照射開始位置から逆方向に向けて、前記第1のレーザ光と前記第2のレーザ光とが重なる前記照射終了位置まで前記枠状塗布層に沿って走査しながら照射するように、前記Xステージ及び前記Yステージを駆動させることを特徴とする請求項21記載の封着材料層付きガラス部材の製造装置。 - 前記出力制御部は、前記少なくとも一対のレーザ光が重なる前記照射開始位置及び前記照射終了位置を含めて、前記封着ガラスの軟化温度T(℃)に対して前記封着材料の加熱温度が(T+213℃)以上で(T+480℃)以下の範囲となるように、前記レーザ光の出力を制御することを特徴とする請求項21乃至25のいずれか1項記載の封着材料層付きガラス部材の製造装置。
- 前記走査制御部は、前記少なくとも一対のレーザ光の走査速度がそれぞれ0.1mm/秒以上で5mm/秒以下の範囲となるように、前記移動機構を制御することを特徴とする請求項21乃至26のいずれか1項記載の封着材料層付きガラス部材の製造装置。
- 第1の封止領域が設けられた第1の表面を有する第1のガラス基板を用意する工程と、
前記第1の封止領域に対応する第2の封止領域が設けられた第2の表面を有する第2のガラス基板を用意する工程と、
封着ガラスとレーザ吸収材とを含む封着材料を有機バインダと混合して調製した封着材料ペーストを、前記第2のガラス基板の前記第2の封止領域上に枠状に塗布する工程と、
前記封着ガラスのガラス軟化温度T(℃)に対して前記封着材料の加熱温度が(T+213℃)以上で(T+480℃)以下の範囲となるように、前記枠状の封着材料ペーストの塗布層に沿って焼成用レーザ光を照射して加熱し、前記塗布層内の前記有機バインダを除去しつつ、前記封着材料を焼成して封着材料層を形成する工程と、
前記第1の表面と前記第2の表面とを対向させつつ、前記封着材料層を介して前記第1のガラス基板と前記第2のガラス基板とを積層する工程と、
前記第1のガラス基板又は前記第2のガラス基板を通して前記封着材料層に封着用レーザ光を照射し、前記封着材料層を溶融させて前記第1のガラス基板と前記第2のガラス基板との間に設けられた電子素子部を封止する封着層を形成する工程と
を具備することを特徴とする電子デバイスの製造方法。 - 前記焼成用レーザ光を0.1mm/秒以上で5mm/秒以下の範囲の走査速度で走査しながら照射することを特徴とする請求項28記載の電子デバイスの製造方法。
- 前記焼成用レーザ光の照射開始時期及び照射終了時期における出力密度が、前記照射開始時期及び前記照射終了時期を除く前記焼成用レーザ光の前記枠状の封着材料ペーストの塗布層に沿った走査照射時期における出力密度より高くなるように、前記焼成用レーザ光の出力密度を制御することを特徴とする請求項28記載の電子デバイスの製造方法。
- 前記焼成用レーザ光として少なくとも一対のレーザ光を、前記枠状の封着材料ペーストの塗布層の照射開始位置に重なるように照射し、前記少なくとも一対のレーザ光のうちの少なくとも一方を前記枠状の封着材料ペーストの塗布層に沿って走査しながら照射した後、前記枠状の封着材料ペーストの塗布層の照射終了位置で2つの前記レーザ光を重ならせることを特徴とする請求項28記載の電子デバイスの製造方法。
- 前記封着ガラスに対して剥離性を有するあて板を、前記枠状の封着材料ペーストの塗布層上に配置した後、前記枠状の封着材料ペーストの塗布層に沿って前記焼成用レーザ光を照射することを特徴とする請求項28乃至31のいずれか1項記載の電子デバイスの製造方法。
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- 2010-04-01 CN CN2010800022975A patent/CN102066280A/zh active Pending
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Also Published As
Publication number | Publication date |
---|---|
US20120111059A1 (en) | 2012-05-10 |
TW201103878A (en) | 2011-02-01 |
US8490434B2 (en) | 2013-07-23 |
JPWO2011010489A1 (ja) | 2012-12-27 |
CN102066280A (zh) | 2011-05-18 |
KR20120048528A (ko) | 2012-05-15 |
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