WO2011010453A1 - 電子部品包装用カバーテープおよび電子部品包装体 - Google Patents
電子部品包装用カバーテープおよび電子部品包装体 Download PDFInfo
- Publication number
- WO2011010453A1 WO2011010453A1 PCT/JP2010/004661 JP2010004661W WO2011010453A1 WO 2011010453 A1 WO2011010453 A1 WO 2011010453A1 JP 2010004661 W JP2010004661 W JP 2010004661W WO 2011010453 A1 WO2011010453 A1 WO 2011010453A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cover tape
- electronic component
- adhesive layer
- component packaging
- surfactant
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 122
- 239000012790 adhesive layer Substances 0.000 claims abstract description 156
- 239000010410 layer Substances 0.000 claims abstract description 120
- 239000004094 surface-active agent Substances 0.000 claims abstract description 100
- -1 alkylene carbonate Chemical compound 0.000 claims abstract description 79
- 239000002216 antistatic agent Substances 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 61
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical group CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 38
- 239000004840 adhesive resin Substances 0.000 claims description 37
- 229920006223 adhesive resin Polymers 0.000 claims description 37
- 239000003093 cationic surfactant Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 239000002563 ionic surfactant Substances 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 18
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- 239000002904 solvent Substances 0.000 description 2
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- ZZXUZKXVROWEIF-UHFFFAOYSA-N 1,2-butylene carbonate Chemical compound CCC1COC(=O)O1 ZZXUZKXVROWEIF-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
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- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical compound N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- 229920002492 poly(sulfone) Polymers 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/31—Heat sealable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
- B32B2439/40—Closed containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2553/00—Packaging equipment or accessories not otherwise provided for
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Definitions
- the present invention relates to an electronic component packaging cover tape and an electronic component packaging body.
- Electronic components such as ICs (Integrated Circuits) such as transistors, diodes, capacitors, and piezoelectric element resistors are carrier tapes and cover tapes heat-sealed to the carrier tapes.
- ICs Integrated Circuits
- cover tapes heat-sealed to the carrier tapes.
- Patent Document 1 discloses a top tape (cover) that includes a surface layer, an intermediate layer having an antistatic function, a heat seal material layer, and an adhesive layer. Corresponding to a tape).
- the adhesive layer contains a conductive material to prevent electrification, and bonds the surface layer and the intermediate layer.
- a metal such as tin oxide, gold, silver, copper, iron, nickel, or zinc, or carbon such as ketjen black or acetylene black is used.
- the conductivity of the top tape is improved and the top tape becomes difficult to be charged, but on the other hand, the transparency of the top tape is lowered. Therefore, when a metal or carbon is added to the adhesive layer, it becomes difficult for the user to visually recognize the electronic component packaged in the package through the top tape.
- An object of the present invention is to provide an electronic component packaging cover tape and an electronic component packaging that are less charged and excellent in transparency.
- the cover tape for packaging electronic parts is composed of a plurality of layers including at least a base material layer and a heat seal layer. At least any two of the plurality of layers are laminated via an adhesive layer.
- the adhesive layer contains an antistatic agent in an amount of 10 wt% to 70 wt% with respect to the adhesive layer.
- the antistatic agent is mainly composed of alkylene carbonate and a surfactant.
- the addition of an antistatic agent of 10% by weight or more and 70% by weight or less to the adhesive layer may make it difficult to charge the cover tape for packaging electronic parts. It became clear. For this reason, the cover tape for electronic component packaging can suppress the pick-up defect of an electronic component, and can suppress the destruction of the electronic component by electrostatic discharge.
- the antistatic agent is mainly composed of alkylene carbonate and a surfactant, and contains almost no conductive material such as metal or carbon that causes a decrease in the transparency of the cover tape for packaging electronic parts. Or not included at all. Therefore, the cover tape for packaging electronic parts has excellent transparency.
- the electronic component packaging cover tape is not easily charged and has excellent transparency.
- the adhesive layer contains an antistatic agent in an amount of 45% by weight to 70% by weight with respect to the adhesive layer.
- the addition of an antistatic agent of 45% by weight or more and 70% by weight or less to the adhesive layer may make it difficult to charge the cover tape for packaging electronic parts. It became clear. For this reason, the cover tape for electronic component packaging can suppress the pickup defect of an electronic component more, and can suppress the destruction of the electronic component by electrostatic discharge more.
- the plurality of layers include a cushion layer. This cushion layer is provided between the base material layer and the heat seal layer.
- the cushion layer is cushioned so that heat and pressure are evenly applied to the electronic component packaging cover tape and the electronic component packaging carrier tape. Play an important role. Thereby, the cover tape for electronic component packaging can be reliably heat-sealed to the carrier tape for electronic component packaging.
- the surfactant is an ionic surfactant.
- the surfactant is an ionic surfactant and has excellent ionic conductivity. For this reason, the electronic component packaging cover tape is less likely to be charged.
- the ionic surfactant is a cationic surfactant.
- the ionic surfactant is a cationic surfactant, it easily dissolves in alkylene carbonate.
- the alkylene carbonate solution of the cationic surfactant becomes transparent.
- the electronic component packaging cover tape has excellent transparency.
- the electronic component packaging cover tape is less likely to be charged.
- the manufacturing cost of the cover tape for electronic component packaging can be reduced by using an inexpensive cationic surfactant.
- the cationic surfactant is an alkyl quaternary ammonium ethosulphate.
- the cationic surfactant is alkyl quaternary ammonium etosulphate. For this reason, the electronic component packaging cover tape is less likely to be charged.
- the alkylene carbonate is propylene carbonate.
- the cover tape for packaging electronic parts is less easily charged by using alkylene carbonate as propylene carbonate. For this reason, the cover tape for electronic component packaging can suppress the pickup defect of an electronic component more, and can suppress the destruction of the electronic component by electrostatic discharge more.
- the weight ratio of alkylene carbonate to surfactant is from 10/90 to 40/60.
- the weight ratio of alkylene carbonate to surfactant is 10/90 or more and 40/60 or less. For this reason, surfactant exists in the state melt
- the weight ratio between the alkylene carbonate and the surfactant is less than 10/90, the adhesive strength of the adhesive layer is insufficient.
- the weight ratio of the alkylene carbonate to the surfactant exceeds 40/60, the surfactant as a medium for preventing static charge is insufficient, and the antistatic effect of the cover tape for packaging electronic parts is reduced. Therefore, when the weight ratio of alkylene carbonate to surfactant (alkylene carbonate / surfactant) is within the above range, the adhesive layer has adhesiveness and is difficult to be charged.
- the surface resistance value (measurement method: JIS K 6911) of the adhesive layer at a humidity of 20% RH is 10 8 ⁇ / ⁇ or more and 10 12 ⁇ / ⁇ or less.
- the surface resistance value of the adhesive layer is 10 8 ⁇ / ⁇ or more and 10 12 ⁇ / ⁇ or less. For this reason, the cover tape for electronic component packaging has high electrical conductivity at low humidity as compared with the conventional cover tape for electronic component packaging. Therefore, the electronic component packaging cover tape is less likely to be charged at low humidity.
- This electronic component packaging cover tape can attenuate the charged voltage in a short time. Thereby, the electronic component packaging cover tape is less likely to be charged.
- the surface to be heat-sealed and the electronic component are moved at a speed of 300 rpm in a state where both surfaces are not subjected to antistatic treatment.
- the friction is applied for 1 minute, the absolute value of the charged voltage on the surface of the electronic component packaging cover tape on the side to be heat sealed is 50V or less.
- This electronic component packaging cover tape has a lower charged voltage when it is rubbed against an electronic component than a conventional electronic component packaging cover tape. Therefore, the electronic component packaging cover tape is less likely to be charged.
- This electronic component wrapping cover tape is more difficult to be charged because it has antistatic treatment on both sides or one side.
- the adhesive layer contains an adhesive resin.
- the antistatic agent is dissolved in the adhesive resin.
- the adhesive strength of the adhesive layer is reduced.
- an antistatic agent having no adhesive performance is present in a state dissolved in an adhesive resin. Therefore, the adhesive layer has an excellent adhesive force.
- the base material layer is made of a film stretched in a uniaxial direction or a biaxial direction.
- the base material layer is made of a film stretched in a uniaxial direction or a biaxial direction. For this reason, this base material layer can raise the mechanical strength of the cover tape for electronic component packaging compared with the base material layer which consists of an unstretched film.
- the thickness of the base material layer is 12 ⁇ m or more and 30 ⁇ m or less.
- the thickness of the base material layer is 12 ⁇ m or more and 30 ⁇ m or less.
- the cover tape for electronic component packaging becomes suitable rigidity. Therefore, when a torsional stress is applied to the electronic component packaging carrier tape after heat sealing, the electronic component packaging cover tape can follow the deformation of the electronic component packaging carrier tape. It can be easily peeled off from the tape, and the electronic component can be prevented from falling off the electronic component package.
- the cover tape for packaging electronic parts has a suitable mechanical strength. For this reason, the cover tape for electronic component packaging can suppress a fracture
- An electronic component packaging body includes an electronic component packaging cover tape according to any one of the above (1) to (16) and an electronic component packaging carrier tape to which the electronic component packaging cover tape is heat-sealed. And comprising.
- This electronic component package is provided with the above electronic component packaging cover tape. For this reason, the electronic component packaging body can suppress the pickup failure of the electronic component, and can suppress the destruction of the electronic component due to electrostatic discharge. Furthermore, this electronic component package has excellent transparency.
- the electronic component packaging carrier tape is peeled at a peeling speed of 300 mm / min when the antistatic treatment is not performed on both sides of the electronic component packaging cover tape. (Test condition: JIS C0806-compliant), the absolute value of the charged voltage generated on the heat-sealed surface of the electronic component packaging cover tape is 150 V or less.
- the electronic component package has a lower voltage generated when the electronic component packaging cover tape is peeled from the electronic component packaging carrier tape than the conventional electronic component package. Thereby, the cover tape for electronic component packaging can prevent charging more.
- An electronic component packaging cover tape includes a plurality of layers and an adhesive layer.
- the plurality of layers include at least a base material layer and a heat seal layer.
- the adhesive layer adheres at least any two of the plurality of layers.
- the adhesive layer contains an antistatic agent in an amount of 10% by weight to 70% by weight with respect to the adhesive layer.
- the antistatic agent is mainly composed of alkylene carbonate and a surfactant.
- the cover tape for packaging electronic parts becomes difficult to be charged by adding an antistatic agent of 10 wt% or more and 70 wt% or less to the adhesive layer. It became clear. For this reason, the cover tape for electronic component packaging can suppress the pick-up defect of an electronic component, and can suppress the destruction of the electronic component by electrostatic discharge.
- the antistatic agent is mainly composed of alkylene carbonate and a surfactant, and contains almost no conductive material such as metal or carbon that causes a decrease in the transparency of the cover tape for packaging electronic parts. Or not included at all. Therefore, the cover tape for packaging electronic parts has excellent transparency.
- the electronic component packaging cover tape and the electronic component packaging according to the present invention are not easily charged and are excellent in transparency.
- FIG. 3 is a cross-sectional view of the electronic component package shown in FIG. 2 taken along line AA. It is the perspective view which showed the state from which the cover tape for electronic component packaging was peeled from the electronic component package.
- Cover tape cover tape for packaging electronic parts
- Base material layer Adhesive layer
- Antistatic agent 130
- Cushion layer 140
- Heat seal layer 200
- Electronic component packaging body 300
- Carrier tape electrostatic component carrier tape
- an electronic component packaging cover tape 100 (hereinafter referred to as “cover tape”) according to this embodiment mainly includes a base material layer 110, an adhesive layer 120, a cushion layer 130, and a heat.
- the seal layer 140 is formed by being laminated in this order.
- the cover tape 100 is heat-sealed by an electronic component packaging carrier tape 300 (hereinafter, referred to as “carrier tape”), and constitutes a part of the electronic component packaging 200.
- carrier tape an electronic component packaging carrier tape 300
- the substrate layer 110 is appropriately selected according to the application. Films processed from various materials can be used.
- the material of the base material layer 110 includes polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, polyvinyl chloride, polyacrylate, polymethacrylate, polyimide, poly Etherimide, polyarylate, polysulfone, polyethersulfone, polyphenylene ether, polycarbonate, ABS resin and the like are used.
- polyethylene terephthalate, nylon 6 or nylon 66 as the material of the base material layer 110.
- the base material layer 110 is preferably a film stretched in a uniaxial direction or a biaxial direction.
- the thickness of the base material layer 110 is preferably 12 ⁇ m to 30 ⁇ m, more preferably 16 ⁇ m to 28 ⁇ m, and particularly preferably 20 ⁇ m to 25 ⁇ m.
- the base material layer 110 having a thickness of less than 30 ⁇ m does not make the cover tape 100 too rigid. Accordingly, when a twisting stress is applied to the carrier tape 300 after heat sealing, the cover tape 100 follows the deformation of the carrier tape 300. As a result, the cover tape 100 is not easily peeled off from the carrier tape 300.
- the base material layer 110 having a thickness of more than 12 ⁇ m is suitable for the mechanical strength of the cover tape 100.
- the cover tape 100 is peeled off from the carrier tape 300 at a high speed. The tape 100 is difficult to break.
- the adhesive layer 120 includes an adhesive resin and an antistatic agent.
- the main components of the antistatic agent are alkylene carbonate and a surfactant.
- the antistatic agent is preferably contained in an amount of 10% by weight to 70% by weight, more preferably 20% by weight or more and 70% by weight or less, and more preferably 30% by weight or more and 70% by weight with respect to the adhesive layer 120. More preferably, it is more preferably contained in an amount of 40% by weight or more and 70% by weight or less, and further preferably 45% by weight or more and 70% by weight or less.
- the method for forming the adhesive layer 120 is not particularly limited, but from the viewpoint of ease of processing and cost reduction, a formation method by coating is preferable.
- Adhesive resin As adhesive resin, the well-known resin used as an adhesive for films for bonding adherends, such as a film, can be used. In addition, the adhesive resin is often handled using a solvent, and needs to be non-aqueous when used by being added to a solvent.
- the adhesive layer 120 is inserted between the base material layer 110 and the cushion layer 130 which are stretched films. Therefore, the adhesive layer 120 is inserted as an anchor coat adhesive resin. When the adhesive layer 120 is inserted between the stretched film and the stretched film, the adhesive layer 120 is inserted as an adhesive resin for dry lamination.
- the adhesive resin material include ester-based and ether-based materials, but considering the transparency of the adhesive layer 120, an ester-based urethane-isocyanate.
- a curable adhesive is preferred.
- the main component of the adhesive resin may be an ester type or an ether type, and an ester type is preferable.
- the curing agent for the adhesive resin include aromatics and aliphatics, and aliphatics are particularly preferable because they do not cause yellowing after curing.
- the main component of the adhesive resin includes a combination of a polyester composition such as polyester polyol or polyether polyol and an isocyanate compound.
- the adhesive resin is a mixture of a polyester composition and an isocyanate compound
- the surfactant and alkylene carbonate may be added after mixing the polyester composition and the isocyanate compound, but considering the stability of the reaction conditions, It is preferable to add to any of the resins in advance.
- alkylene carbonate Since alkylene carbonate has a high boiling point and a high dielectric constant, it remains in a liquid state in which the surfactant is dissolved without volatilization after the dry laminating step of curing by heating. Since the remaining alkylene carbonate in the liquid state acts as an ionic electrolyte, the cover tape 100 can suppress charging without requiring moisture in the air. For this reason, the cover tape 100 can suppress charging in a low humidity environment.
- Specific examples of the alkylene carbonate include ethylene carbonate, propylene carbonate, butylene carbonate, and propylene carbonate is particularly preferable.
- the weight ratio of alkylene carbonate to surfactant is preferably 10/90 or more and 40/60 or less.
- the weight ratio of the alkylene carbonate and the surfactant is less than 10/90, the adhesive force of the adhesive layer 120 is insufficient.
- the weight ratio of the alkylene carbonate to the surfactant exceeds 40/60, the surfactant, which is a medium for preventing static charge, is insufficient, and the antistatic effect of the cover tape 100 is reduced. If the weight ratio of the alkylene carbonate to the surfactant is within the above range, the adhesive layer 120 has adhesiveness and is difficult to be charged.
- surfactant itself can impart antistatic performance to the added material by exhibiting ionic conductivity using moisture or the like. Therefore, the surfactant improves the antistatic property of the adhesive layer 120. In addition, the surfactant improves the antistatic properties of the base material layer 110 and the cushion layer 130 that are adherends of the adhesive layer 120.
- the surfactant a known surfactant can be used, but it is preferable that it is soluble in alkylene carbonate and transparent.
- the surfactant material is preferably a nonaqueous ionic electrolyte of a cationic antistatic agent from the viewpoints of transparency, antistatic properties and cost.
- alkyl quaternary ammonium ethosulphate is preferred. Is preferred.
- the adhesive layer 120 mainly composed of the above-described alkylene carbonate and surfactant preferably has a surface resistance value (measuring method: JIS K 6911) of 10 12 ⁇ / ⁇ or less.
- a surface resistance value (measuring method: JIS K 6911) of 10 12 ⁇ / ⁇ or less.
- the environment of the production process for peeling the cover tape 100 may be in a dry state in winter.
- the surface resistance value of the adhesive layer 120 may be kept at 10 8 ⁇ / ⁇ or more and 10 12 ⁇ / ⁇ or less under low humidity in a dry state, the cover tape 100 can reduce trouble due to static electricity.
- electrostatic induction means that an opposite charge is generated on the object surface when a charged object approaches the object.
- electric lines of force are generated between the charged object and the object. This electric field line is a factor in the generation of static electricity.
- opposite electric lines of force are generated in the good dielectric. The electric lines of force in the good dielectric can cancel the electric lines of force between the charged object and the object, and suppress the generation of static electricity.
- the effect of preventing electrostatic induction is proportional to the dielectric property of the good dielectric, and if the dielectric property of the good dielectric is low (high surface resistance), the effect of preventing electrostatic induction is weakened.
- the cancellation time charge decay time
- the surface of the heat seal layer 140 is charged by applying 5 kv, the charged voltage becomes 1% after charging. It is necessary that the decay time until 10 seconds or less. Therefore, by setting the surface resistance value of the adhesive layer 120 to 10 12 ⁇ / ⁇ or less, the decay time can be set to 10 seconds or less.
- the cushion layer 130 is composed of at least one layer, and plays a cushion-like role when the cover tape 100 is sealed to the carrier tape 300.
- the cushion layer 130 also serves to achieve various peeling mechanisms when the cover tape 100 is peeled from the carrier tape 300.
- the cushion layer 130 includes a layer that considers compatibility with the adhesive layer 120.
- the cushion layer 130 includes a layer that causes cohesive failure in a layer adjacent to the adhesive layer 120.
- the cushion layer 130 may be a single layer, but in order to provide the cover tape 100 with a slipperiness, it is also effective to make it a multilayer.
- an olefin-based material is used as a material for the cushion layer 130 as a material that is easy to transfer to the adhesive layer 120 and is low in cost.
- the material of the cushion layer 130 is preferably a polyethylene-based material from the viewpoint of cushioning properties, and particularly preferably low-density polyethylene from the viewpoint of low-temperature sealing properties.
- the cohesive fracture peeling mechanism since cushioning properties are required as the material of the cushion layer 130, polyethylene or an olefin-based material is used. Moreover, in order to make it easy to destroy the cover tape 100, as a material of the cushion layer 130, it is preferable to mix an auxiliary component that is hardly compatible with polyethylene or an olefin-based material.
- a styrene-based material such as polystyrene or polyacrylstyrene is used as an auxiliary component that is difficult to be compatible.
- the thickness of the cushion layer 130 is preferably 5 ⁇ m or more and 50 ⁇ m or less.
- a dry laminating method, a co-extrusion method, and an extrusion laminating method can be cited as methods that are inexpensive and easy to implement.
- the heat seal layer 140 is disposed on the outermost layer of the cover tape 100.
- the heat seal layer 140 is formed by adding an antistatic agent to an acrylic resin or a polyester resin.
- the addition amount of the antistatic agent is adjusted so that the surface resistance value of the heat seal layer 140 is 10 4 ⁇ / ⁇ or more and 10 10 ⁇ / ⁇ or less at 23 ° C. and a humidity of 15% RH.
- the antistatic agent is a metal filler such as tin oxide, zinc oxide, titanium oxide, or carbon, and a surfactant such as polyoxyethylene alkylamine, quaternary ammonium, or alkyl sulfonate.
- Carbon includes fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube.
- oxide particles containing silicon, magnesium, or calcium as a main component for example, silica, talc, etc., or any one of polyethylene particles, polyacrylate particles, polystyrene particles, or these Alloys may be added to the above formulation.
- a gravure coating method is desirable.
- the surface resistance value of the heat seal layer 140 is less than 10 4 ⁇ / ⁇ , when the carrier tape 300 is sealed with the cover tape 100 and the external charge is generated, the resistance is too low and the charged object is close. In such a case, there is a danger that a discharge phenomenon may occur. On the other hand, if the surface resistance value exceeds 10 10 ⁇ / ⁇ , the electrostatic diffusion performance is not sufficient, and the cover tape is charged without exhibiting the desired static elimination performance, causing trouble.
- the electronic component package 200 includes a cover tape 100 and a carrier tape 300. As shown in FIGS. 2 and 3, the electronic component package 200 stores the electronic component 400 inside and stores and transports the electronic component 400 while being wound around the reel 500.
- the electronic component 400 is, for example, a transistor such as an IC (Integrated Circuit), a diode, a capacitor, or a piezoelectric element register.
- the electronic component 400 is housed and protected in the electronic component package 200 so as not to be damaged during storage and transportation.
- the electronic component 400 When the electronic component 400 is packed and transported by the electronic component package 200, the electronic component 400 is charged by friction between the electronic component 400 and the cover tape 100. However, since the adhesive layer 120 having the effect of preventing electrostatic induction is inserted into the cover tape 100, the electrostatic induction phenomenon from the charged electronic component 400 to the cover tape 100 can be suppressed.
- Example 1 A cationic surfactant (trade name: Elegan 264-WAX, manufactured by NOF Corporation) was dissolved in propylene carbonate to prepare an antistatic agent. The surfactant was added to the adhesive so as to be 42% by weight based on the adhesive layer 120, and the propylene carbonate was added to the adhesive so as to be 28% by weight based on the adhesive layer 120.
- a biaxially stretched polyester film (trade name: FE2021, manufactured by Futamura Chemical Co., Ltd.) having a film thickness of 25 ⁇ m was used.
- an adhesive was applied to provide an adhesive layer 120 having a thickness of 1 ⁇ m.
- low-density polyethylene (trade name: Sumikasen L705, manufactured by Sumitomo Chemical Co., Ltd.) on the adhesive layer 120 by extrusion lamination (drying furnace temperature 80 ° C .: line speed 150 m / min) to a film thickness of 25 ⁇ m.
- the cushion layer 130 was provided.
- an acrylic resin (trade name: Coponil 7980, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) is formed to a film thickness of 1 ⁇ m by the gravure coating method, the heat seal layer 140 is provided, and the coat thickness is 2.
- the cover tape 100 adjusted to 5 g / m 2 was obtained (see FIG. 1).
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 70 wt% with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant is 40/60.
- the cover tape 100 was peeled from the electronic component package 200, and the laminate strength of the cover tape 100 was measured. A lamination strength of 0.20 N or higher was accepted, and a lamination strength of less than 0.20 N was rejected.
- the surface resistance value was measured by measuring the surface resistance of the adhesive layer 120 of the cover tape 100 under the measurement conditions of 23 ° C. and 20% RH using a surface resistance measuring device manufactured by SIMCO. A surface resistance value of 10 8 ⁇ / ⁇ or more and 10 12 ⁇ / ⁇ or less was accepted, and the others were rejected.
- the cover tape 100 is peeled off from the carrier tape 300 at a peeling speed of 300 mm / min in a state where the antistatic treatment is not performed on both surfaces (see FIG. 4, test conditions: JIS C0806-compliant).
- the charged voltage generated in the heat seal layer 140 of the cover tape 100 was implemented using a surface potentiometer manufactured by TREK Co., Ltd., with the distance between the sample and the probe set to 1 mm.
- the charged voltage was measured under both the measurement conditions of 23 ° C. and 20% RH and the measurement conditions of 23 ° C. and 50% RH. The case where the absolute value of the charged voltage was 50 V or less was accepted and the case where the absolute value of the charged voltage exceeded 50 V was rejected.
- FIG. 5 shows the adhesive layer 120 in a state where the antistatic agent is dissolved
- FIG. 6 shows the adhesive layer 120 in a state where the antistatic agent 121 is saturated and not partially dissolved.
- the laminar strength was 0.22 N
- the surface resistance value was 1.0 ⁇ 10 9 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 0.02 seconds
- the charging voltage decay time (23 ° C., 50% RH) is 0.02 seconds
- peeling band voltage during friction 23 ° C., 20% RH
- peeling band voltage during friction 23 ° C., 50% RH
- Example 2 A cover tape 100 was obtained in the same manner as in Example 1 except that the coat thickness was adjusted to 5.0 g / m 2 . In addition, the cover tape 100 was measured and confirmed for each item in the same manner as in Example 1.
- the lamination strength was 0.24 N
- the surface resistance value was 8.0 ⁇ 10 8 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH
- peeling band voltage during friction 23 ° C., 20% RH
- peeling band voltage during friction 23 ° C., 50% RH
- Example 3 The surfactant is 27 wt% with respect to the adhesive layer 120, the propylene carbonate is 18 wt% with respect to the adhesive layer 120, and the adhesive resin is 55 wt% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 45 wt% with respect to the adhesive layer 120.
- the cover tape 100 was measured and confirmed for each item in the same manner as in Example 1.
- the laminar strength was 0.21 N
- the surface resistance value was 8.2 ⁇ 10 9 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 0.12 seconds
- the charging voltage decay time (23 ° C., 50% RH) is 0.10 seconds
- the peeling band voltage during friction (23 ° C., 20% RH) is 8 V
- the peeling band voltage during friction (23 ° C., 50% RH) is 9 V, not dissolved.
- There was no antistatic agent see Table 1 below).
- Example 4 The surfactant is 40% by weight with respect to the adhesive layer 120, the propylene carbonate is 5% by weight with respect to the adhesive layer 120, and the adhesive resin is 55% by weight with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 45 wt% with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant (alkylene carbonate / surfactant) is 11/89.
- the cover tape 100 was measured and confirmed for each item in the same manner as in Example 1.
- the lamination strength was 0.23 N
- the surface resistance value was 5.3 ⁇ 10 9 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH
- the peeling band voltage during friction 23 ° C., 20% RH
- the peeling band voltage during friction 23 ° C., 50% RH
- Example 5 The surfactant is 63% by weight with respect to the adhesive layer 120, the propylene carbonate is 7% by weight with respect to the adhesive layer 120, and the adhesive resin is 30% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%. Further, the weight ratio of alkylene carbonate to surfactant (alkylene carbonate / surfactant) is 10/90. In addition, the cover tape 100 was measured and confirmed for each item in the same manner as in Example 1.
- the lamination strength was 0.25 N
- the surface resistance value was 5.5 ⁇ 10 8 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 0.09 seconds
- the charging voltage decay time (23 ° C., 50% RH) is 0.10 seconds
- peeling band voltage during friction 23 ° C., 20% RH
- peeling band voltage during friction 23 ° C., 50% RH
- Example 6 The surfactant is 6% by weight with respect to the adhesive layer 120, the propylene carbonate is 4% by weight with respect to the adhesive layer 120, and the adhesive resin is 90% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 10% by weight with respect to the adhesive layer 120.
- the cover tape 100 was measured and confirmed for each item in the same manner as in Example 1.
- the lamination strength was 0.25 N
- the surface resistance value was 8.1 ⁇ 10 10 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 0.82 seconds
- the charging voltage decay time (23 ° C., 50% RH) is 0.55 seconds
- the peeling band voltage during friction (23 ° C., 20% RH) is 19 V
- the peeling band voltage during friction (23 ° C., 50% RH) is 18 V, not dissolved.
- There was no antistatic agent see Table 1 below).
- Example 7 The surfactant is 18% by weight with respect to the adhesive layer 120, the propylene carbonate is 2% by weight with respect to the adhesive layer 120, and the adhesive resin is 80% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 20 wt% with respect to the adhesive layer 120. Further, the weight ratio of alkylene carbonate to surfactant (alkylene carbonate / surfactant) is 10/90.
- the measurement and confirmation which concern on each item were performed like Example 1 except not having measured the laminate strength.
- the surface resistance value was 1.3 ⁇ 10 9 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 3.60 seconds
- the charging voltage decay time (23 ° C., 50% RH) was 0.00. 33 seconds
- the peeling band voltage during friction (23 ° C., 20% RH) was 15 V
- the peeling band voltage during friction (23 ° C., 50% RH) was 13 V
- there was no undissolved antistatic agent See Table 1 below.
- Example 8 The surfactant is 8 wt% with respect to the adhesive layer 120, the propylene carbonate is 2 wt% with respect to the adhesive layer 120, and the adhesive resin is 90 wt% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 10% by weight with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant is 20/80.
- the measurement and confirmation which concern on each item were performed like Example 1 except not having measured the laminate strength.
- the surface resistance value was 2.2 ⁇ 10 9 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 4.50 seconds
- the charging voltage decay time (23 ° C., 50% RH) was 0.00.
- the peeling band voltage during friction (23 ° C., 20% RH) was 29 V
- the peeling band voltage during friction (23 ° C., 50% RH) was 25 V
- there was no undissolved antistatic agent See Table 1 below).
- Example 9 The surfactant is 21% by weight with respect to the adhesive layer 120, the propylene carbonate is 9% by weight with respect to the adhesive layer 120, and the adhesive resin is 70% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 30% by weight with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant is 30/70.
- the measurement and confirmation which concern on each item were performed like Example 1 except not having measured the laminate strength.
- the surface resistance value was 1.1 ⁇ 10 9 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 3.50 seconds
- the charging voltage decay time (23 ° C., 50% RH) was 0.00. 18 seconds
- the peeling band voltage during friction (23 ° C., 20% RH) was 2 V
- the peeling band voltage during friction (23 ° C., 50% RH) was 20 V
- there was no undissolved antistatic agent See Table 1 below.
- Example 10 The surfactant is 12% by weight with respect to the adhesive layer 120, the propylene carbonate is 8% by weight with respect to the adhesive layer 120, and the adhesive resin is 80% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 20 wt% with respect to the adhesive layer 120.
- the measurement and confirmation which concern on each item were performed like Example 1 except not having measured the laminate strength.
- the surface resistance value was 4.0 ⁇ 10 10 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) was 6.00 seconds
- the charging voltage decay time (23 ° C., 50% RH) was 0.00.
- the peeling band voltage (23 ° C., 20% RH) during friction for 12 seconds was 35 V
- the peeling band voltage during friction (23 ° C., 50% RH) was 20 V
- there was no undissolved antistatic agent See Table 1 below).
- Example 1 The same as in Example 1 except that the surfactant and propylene carbonate were not added, the adhesive resin was 100% by weight with respect to the adhesive layer 120, and the coat thickness was adjusted to 1.5 g / m 2. A cover tape was obtained.
- the adhesive layer 120 does not include an antistatic agent composed of a surfactant and propylene carbonate.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the laminar strength is 0.25 N
- the surface resistance value is larger than 1.0 ⁇ 10 12 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH.
- the peeling voltage (23 ° C., 20% RH) at the time of friction is 100 V
- the peeling voltage (23 ° C., 50% RH) at the time of friction is 100 V.
- There was no antistatic agent see Table 2 below).
- Example 2 The surfactant is 33% by weight with respect to the adhesive layer 120, propylene carbonate is not added, the adhesive resin is 67% by weight with respect to the adhesive layer 120, and the coat thickness is 1.
- a cover tape was obtained in the same manner as in Example 1 except that the amount was adjusted to 6 g / m 2 .
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 33.3% by weight with respect to the adhesive layer 120.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the laminar strength is 0.20 N
- the surface resistance value is larger than 1.0 ⁇ 10 12 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH.
- the peeling voltage (23 ° C., 20% RH) at the time of friction is 80 V
- the peeling voltage (23 ° C., 50% RH) at the time of friction is 83 V.
- There was no antistatic agent see Table 2 below).
- Example 3 The surfactant was not added, propylene carbonate was 33.3% by weight with respect to the adhesive layer 120, the adhesive resin was 67% by weight with respect to the adhesive layer 120, and the coating thickness was A cover tape was obtained in the same manner as in Example 1 except that the amount was adjusted to 3.4 g / m 2 .
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 33.3% by weight with respect to the adhesive layer 120.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the lamination strength is 0.15 N
- the surface resistance value is larger than 1.0 ⁇ 10 12 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH.
- the peeling voltage (23 ° C., 20% RH) at the time of friction 85 V
- the peeling voltage (23 ° C., 50% RH) at the time of friction is 87 V.
- Example 4 The surfactant is 80% by weight with respect to the adhesive layer 120, the propylene carbonate is 20% by weight with respect to the adhesive layer 120, no adhesive resin is added, and the coat thickness is 1.
- a cover tape was obtained in the same manner as in Example 1 except that the amount was adjusted to 6 g / m 2 .
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 100 wt% with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant (alkylene carbonate / surfactant) is 20/80.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the peeling voltage (23 ° C., 50% RH) cannot be measured because the cover tape cannot be applied to the carrier tape, the surface resistance value is larger than 1.1 ⁇ 10 8 ⁇ / ⁇ , and the undissolved antistatic agent is (See Table 2 below).
- Example 5 The surfactant is 0.5 wt% with respect to the adhesive layer 120, the propylene carbonate is 0.5 wt% with respect to the adhesive layer 120, and the adhesive resin is added to the adhesive layer 120.
- a cover tape was obtained in the same manner as in Example 1 except that the content was 99% by weight and the coating thickness was adjusted to 2.5 g / m 2 .
- the adhesive layer 120 contains an antistatic agent made of a surfactant and propylene carbonate at 1% by weight with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant is 50/50.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the laminar strength is 0.25 N
- the surface resistance value is larger than 1.0 ⁇ 10 12 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH.
- Example 6 Example except that the surfactant was 20% by weight with respect to the adhesive layer 120, no propylene carbonate was added, and the adhesive resin was 80% by weight with respect to the adhesive layer 120.
- a cover tape was obtained in the same manner as in Example 1.
- the adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate at 20 wt% with respect to the adhesive layer 120.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the laminar strength is 0.25 N
- the surface resistance value is larger than 1.0 ⁇ 10 13 ⁇ / ⁇
- the charging voltage decay time 23 ° C., 20% RH
- the charging voltage decay time 23 ° C., 50% RH.
- the surfactant is 4% by weight with respect to the adhesive layer 120
- the propylene carbonate is 1% by weight with respect to the adhesive layer 120
- the adhesive resin is 95% with respect to the adhesive layer 120.
- the cover tape 100 was obtained in the same manner as in Example 1 except that the percentage was changed to%.
- the adhesive layer 120 contains an antistatic agent made of a surfactant and propylene carbonate at 5% by weight with respect to the adhesive layer 120.
- the weight ratio of alkylene carbonate to surfactant is 20/80.
- the obtained cover tape was measured and confirmed for each item in the same manner as in Example 1.
- the laminar strength is 0.25 N
- the surface resistance value is larger than 1.0 ⁇ 10 11 ⁇ / ⁇
- the charging voltage decay time (23 ° C., 20% RH) and the charging voltage decay time (23 ° C., 50% RH).
- the peeling voltage (23 ° C., 20% RH) at the time of friction is 60 V
- the peeling voltage (23 ° C., 50% RH) at the time of friction is 20 V.
- There was no antistatic agent see Table 2 below).
- Examples 1 to 10 all the evaluation items passed.
- Examples 1 to 5 containing 45% by weight or more and 70% by weight or less of the antistatic agent with respect to the adhesive layer 120 are Examples 6 containing the antistatic agent with less than 45% by weight of the adhesive layer 120.
- Better results were obtained compared to ⁇ 10. Further, when the transparency of Examples 1 to 10 and Comparative Examples 1 to 7 was compared visually, Examples 1 to 10 had higher transparency than Comparative Examples 1 to 7.
- Comparative Example 1 in which no antistatic agent was added to the adhesive layer 120, Comparative Examples 2 and 6 in which no alkylene carbonate was added, Comparative Example 3 in which no surfactant was added, and Antistatic Agent were bonded.
- Comparative Examples 5 and 7 containing less than 10% by weight with respect to the agent layer 120, the electrostatic damping effect was insufficient.
- the comparative example 4 which does not contain adhesive resin was insufficient in the static electricity attenuation effect and the lamination strength.
- the antistatic agent is mainly composed of alkylene carbonate and a surfactant, and contains little or no conductive substance such as metal or carbon that causes a decrease in the transparency of the cover tape 100. Not. Therefore, the cover tape 100 has excellent transparency.
- the cover tape 100 is hardly charged and is excellent in transparency.
- the cover tape 100 is obtained by adding 45 wt% or more and 70 wt% or less of the antistatic agent to the adhesive layer 120 with respect to the adhesive layer 120. It became clear that it became difficult to be charged. For this reason, the cover tape 100 can further suppress the pickup failure of the electronic component 400 and can further suppress the destruction of the electronic component 400 due to electrostatic discharge.
- the cushion layer plays a cushioning role so that heat and pressure are uniformly applied to the cover tape 100 and the carrier tape 300. Thereby, the cover tape 100 can be reliably heat-sealed to the carrier tape 300.
- the adhesive layer 120 can be easily provided between the base material layer 110 and the cushion layer, so that it is not necessary to newly provide the adhesive layer 120 between other layers. For this reason, the manufacturing cost of the cover tape 100 can be reduced.
- the surfactant is an ionic surfactant and has excellent ionic conductivity. For this reason, the cover tape 100 becomes more difficult to be charged.
- the ionic surfactant is a cationic surfactant, it easily dissolves in alkylene carbonate.
- the alkylene carbonate solution of the cationic surfactant becomes transparent.
- the cover tape 100 has excellent transparency. Furthermore, the cover tape 100 is less likely to be charged. Moreover, the manufacturing cost of the cover tape 100 can be reduced by using an inexpensive cationic surfactant.
- the cationic surfactant is an alkyl quaternary ammonium etosulphate. For this reason, the cover tape 100 becomes more difficult to be charged.
- the cover tape 100 is less easily charged by using alkylene carbonate as propylene carbonate. For this reason, the cover tape 100 can further suppress the pickup failure of the electronic component, and can further suppress the destruction of the electronic component 400 due to electrostatic discharge.
- the weight ratio of alkylene carbonate to surfactant is 10/90 or more and 40/60 or less. For this reason, surfactant exists in the state melt
- the weight ratio of the alkylene carbonate and the surfactant is less than 10/90, the adhesive force of the adhesive layer 120 is insufficient.
- the weight ratio of the alkylene carbonate to the surfactant exceeds 40/60, the surfactant, which is a medium for preventing static charge, is insufficient, and the antistatic effect of the cover tape 100 is reduced. Therefore, when the weight ratio of alkylene carbonate to surfactant (alkylene carbonate / surfactant) is within the above range, the adhesive layer 120 has adhesiveness and is difficult to be charged.
- the surface resistance value of the adhesive layer 120 is 10 8 ⁇ / ⁇ to 10 12 ⁇ / ⁇ .
- the cover tape 100 can attenuate the charged voltage in a short time. Thereby, the cover tape 100 becomes more difficult to be charged.
- the charged voltage generated when it is rubbed with the electronic component 400 is low. Therefore, the cover tape 100 is less likely to be charged.
- the adhesive layer 120 has an excellent adhesive force.
- the base material layer 110 is made of a film stretched in a uniaxial direction or a biaxial direction. For this reason, this base material layer 110 can raise the mechanical strength of the cover tape 100 compared with the base material layer 110 which consists of an unstretched film.
- the thickness of the base material layer 110 is 12 micrometers or more and 30 micrometers or less.
- the cover tape 100 has suitable rigidity. Therefore, when a twisting stress is applied to the carrier tape 300 after heat sealing, the cover tape 100 can follow the deformation of the carrier tape 300 and can be prevented from being peeled off from the carrier tape 300. Furthermore, the cover tape 100 has a suitable mechanical strength. For this reason, the cover tape 100 can suppress breaking when it is peeled from the carrier tape 300 at a high speed.
- the cover tape 100 is provided.
- the electronic component package 200 can suppress the pickup failure of the electronic component, and can suppress the destruction of the electronic component 400 due to electrostatic discharge.
- the cover tape 100 is easily peeled off from the carrier tape 300 as compared with the conventional electronic component package 200, and the electronic component 400 is dropped from the electronic component package 200. This can be prevented. Thereby, the cover tape 100 according to the present embodiment can further prevent charging.
- Antistatic treatment may be performed on both sides or one side of the cover tape 100. By this antistatic treatment, the cover tape 100 becomes more difficult to be charged.
- the base material layer 110 may be composed of a laminate of two or more layers.
- the base material layer 110 may be an unstretched film.
- the adhesive layer 120 is not provided between the base material layer 110 and the cushion layer 130 but may be provided between other layers.
- the cover tape according to the present invention protects electronic components from contamination together with the carrier tape when storing, transporting, and mounting the electronic components.
- the cover tape according to the present invention is a cover used when packing a static sensitive device, which tends to increase in recent years, on a carrier tape because it has a configuration that pays special attention to static electricity generated at the time of peeling or after friction. Suitable as a tape.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本発明の一局面に係る電子部品包装用カバーテープは、少なくとも基材層およびヒートシール層を含む複数の層で構成される。この複数の層のうちの少なくともいずれか2層が、接着剤層を介して積層される。接着剤層は、帯電防止剤を、接着剤層に対して10重量%以上70重量%以下で含む。帯電防止剤は、炭酸アルキレンおよび界面活性剤を主成分とする。
上述(1)の電子部品包装用カバーテープにおいて、接着剤層は、帯電防止剤を、接着剤層に対して45重量%以上70重量%以下で含む。
上述(1)または(2)の電子部品包装用カバーテープにおいて、複数の層には、クッション層が含まれる。このクッション層は、基材層とヒートシール層との間に設けられる。
上述(3)の電子部品包装用カバーテープにおいて、基材層とクッション層とが接着剤層を介して積層されている。
上述(1)~(4)のいずれかの電子部品包装用カバーテープにおいて、界面活性剤は、イオン系界面活性剤である。
上述(5)の電子部品包装用カバーテープにおいて、イオン系界面活性剤は、カチオン系界面活性剤である。
上述(6)の電子部品包装用カバーテープにおいて、カチオン系界面活性剤は、アルキル4級アンモニウムエトサルフェートである。
上述(1)~(7)のいずれかの電子部品包装用カバーテープにおいて、炭酸アルキレンは、炭酸プロピレンである。
上述(1)~(8)のいずれかの電子部品包装用カバーテープにおいて、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、10/90以上40/60以下である。
上述(1)~(9)のいずれかの電子部品包装用カバーテープにおいて、湿度20%RHにおける接着剤層の表面抵抗値(測定方法:JIS K 6911)は、108Ω/□以上1012Ω/□以下である。
上述(1)~(10)のいずれかの電子部品包装用カバーテープにおいて、両面に帯電防止処理が施されていない状態で、ヒートシールされる側の面に5kvを印加して帯電させたとき、帯電させてから帯電圧が1%になるまでの減衰時間が10秒以下である。
上述(1)~(11)のいずれかの電子部品包装用カバーテープにおいて、両面に帯電防止処理が施されていない状態で、ヒートシールされる側の面と、電子部品とを300rpmの速さで1分間摩擦させたとき、電子部品包装用カバーテープのヒートシールされる側の面に係る帯電圧の絶対値が50V以下である。
上述(1)~(12)のいずれかの電子部品包装用カバーテープは、両面または片面に帯電防止処理を施されている。
上述(1)~(13)のいずれかの電子部品包装用カバーテープにおいて、接着剤層は、接着剤樹脂を含有している。帯電防止剤は、接着剤樹脂に溶解している。
上述(1)~(14)のいずれかの電子部品包装用カバーテープにおいて、基材層は、一軸方向または二軸方向に延伸したフィルムからなる。
上述(1)~(15)のいずれかの電子部品包装用カバーテープにおいて、基材層の厚さは、12μm以上30μm以下である。
さらに、電子部品包装用カバーテープは、好適な機械的強度を有する。このため、電子部品包装用カバーテープは、電子部品包装用キャリアテープから高速剥離されるときに破断することを抑制することができる。
本発明の一局面に係る電子部品包装体は、上述(1)~(16)のいずれかの電子部品包装用カバーテープと、電子部品包装用カバーテープがヒートシールされる電子部品包装用キャリアテープと、を備える。
上述(17)の電子部品包装体では、電子部品包装用カバーテープの両面に帯電防止処理が施されていない状態で、電子部品包装用カバーテープを剥離速度300mm/minで電子部品包装用キャリアテープから剥離したとき(試験条件:JIS C0806-3準拠)、電子部品包装用カバーテープのヒートシールされる側の面に発生する帯電圧の絶対値が150V以下である。
本発明の一局面に係る電子部品包装用カバーテープは、複数の層と、接着剤層とを備える。複数の層は、少なくとも基材層およびヒートシール層を含む。接着剤層は、複数の層のうちの少なくともいずれか2層を接着させる。また、接着剤層は、帯電防止剤を、接着剤層に対して10重量%以上70重量%以下で含む。帯電防止剤は、炭酸アルキレンおよび界面活性剤を主成分とする。
110 基材層
120 接着剤層
121 帯電防止剤
130 クッション層
140 ヒートシール層
200 電子部品包装体
300 キャリアテープ(電子部品キャリアテープ)
基材層110としては、テープ加工時およびキャリアテープ300へのヒートシール時などに加わる外力に耐えうる機械的強度、ならびにヒートシール時に耐えうる耐熱性があるフィルムであれば、用途に応じて適宜種々の材料を加工したフィルムを用いることができる。具体的に、基材層110の材料としては、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ナイロン6、ナイロン66、ポリプロピレン、ポリメチルペンテン、ポリ塩化ビニル、ポリアクリレート、ポリメタアクリレート、ポリイミド、ポリエーテルイミド、ポリアリレート、ポリスルホン、ポリエーテルスルホン、ポリフェニレンエーテル、ポリカーボネート、ABS樹脂などが用いられる。基材層110の機械的強度を向上させるには、基材層110の材料として、ポリエチレンテレフタレート、ナイロン6、ナイロン66を用いることが好ましい。
接着剤層120は、接着剤樹脂と、帯電防止剤とを有する。帯電防止剤の主成分は、炭酸アルキレンおよび界面活性剤である。帯電防止剤は、接着剤層120に対して10重量%以上70重量%以下で含むことが好ましく、特に20重量%以上70重量%以下で含むことがより好ましく、さらに30重量%以上70重量%以下で含むことがより好ましく、さらに40重量%以上70重量%以下で含むことがより好ましく、さらに45重量%以上70重量%以下で含むことがより好ましい。接着剤層120を形成する方法は、特に限定されないが、加工容易性および低コスト化という観点から、コーティングによる形成方法が好ましい。
接着剤樹脂としては、フィルム等の被着体を貼り合わせるためのフィルム用接着剤として用いられる公知の樹脂を用いることができる。また、接着剤樹脂は、溶剤を用いて扱われることが多く、溶剤に添加されて用いられる場合には、非水系である必要がある。
炭酸アルキレンは、高沸点、かつ、高誘電率であるため、加熱により硬化させるドライラミネート工程後も揮発せずに、界面活性剤が溶解している液状で残存する。液状で残存する炭酸アルキレンがイオン電解液として働くので、カバーテープ100は、空気中の水分などを必要とせずに帯電を抑制することができる。このため、カバーテープ100は、低湿度環境において帯電を抑制することができる。炭酸アルキレンとしては、具体的に、炭酸エチレン、炭酸プロピレン、炭酸ブチレン等が挙げられ、特に、炭酸プロピレンが好ましい。
界面活性剤は、それ自体が水分などを利用して、イオン電導性を発現することで、添加した素材へ帯電防止性能を付与することができる。そのため、界面活性剤は、接着剤層120の帯電防止性を向上させる。また、界面活性剤は、接着剤層120の被着体である基材層110およびクッション層130の帯電防止性を向上させる。
クッション層130は、少なくとも1層からなり、カバーテープ100がキャリアテープ300にシールされるときに、クッション的な役割を果たす。また、クッション層130は、カバーテープ100がキャリアテープ300から剥離されるときの種々の剥離機構を達成する役割も果たす。例えば、転写剥離機構の場合、クッション層130は、接着剤層120との相性を考慮した層を含む。凝集破壊剥離機構の場合、クッション層130は、接着剤層120と隣り合う層に凝集破壊する層を含む。界面剥離機構の場合、クッション層130は、単層でもかまわないが、カバーテープ100に滑り性を付与するために、多層とすることも有効である。
ヒートシール層140は、カバーテープ100の最外層に配置される。ヒートシール層140は、アクリル系樹脂またはポリエステル系樹脂に、帯電防止剤が添加されて形成される。帯電防止剤の添加量は、23℃、湿度15%RHにおけるヒートシール層140の表面抵抗値が104Ω/□以上1010Ω/□以下となるように調整される。本発明の主旨を損ねない範囲において、帯電防止剤は、酸化錫、酸化亜鉛、酸化チタン、カーボン等の金属フィラー、およびポリオキシエチレンアルキルアミン、第四級アンモニウム、アルキルスルホネート等の界面活性剤の中から選ばれるいずれか一種またはそれらの混合物などが用いられる。カーボンには、カーボンブラック、ホワイトカーボン、カーボン繊維、カーボンチューブ等の炭素からなる種々の形状のフィラーが含まれる。ブロッキング防止のために、ケイ素、マグネシウムまたはカルシウムのいずれかを主成分とする酸化物粒子、例えば、シリカ、タルク等、又はポリエチレン粒子、ポリアクリレート粒子、ポリスチレン粒子の内、いずれか1種もしくはこれらのアロイを上記配合に添加しても良い。ヒートシール層140の形成方法として、グラビアコーティング法が望ましい。
図2、3に示されるように、電子部品包装体200は、カバーテープ100と、キャリアテープ300とから構成される。この電子部品包装体200は、図2、3に示されるように、内部に電子部品400を収納し、リール500に巻き取られた状態で電子部品400を保管および搬送する。電子部品400は、例えば、IC(Integrated Circuit)を始めとしたトランジスター、ダイオード、コンデンサー、圧電素子レジスター等である。この電子部品400は、保管中および搬送中に破損しないように、電子部品包装体200に収納されて保護される。
カチオン系界面活性剤(商品名:エレガン264-WAX、日油株式会社製)を炭酸プロピレンに溶解させ、帯電防止剤を作製した。界面活性剤は接着剤層120に対して42重量%となるように接着剤に添加され、炭酸プロピレンは接着剤層120に対して28重量%となるように接着剤に添加された。帯電防止剤と、ポリウレタン組成物(商品名:タケラックA-520、三井化学株式会社製)およびイソシアネート組成物(商品名:タケネートA-10、三井化学株式会社製)とをプロペラ式攪拌機を用いて混合し、接着剤を作製した。接着剤樹脂であるポリウレタン組成物とイソシアネート組成物とは、接着剤層120に対して30重量%となるように接着剤に添加された。
電子部品包装体200からカバーテープ100を剥離させて、カバーテープ100のラミ強度を測定した。ラミ強度が0.20N以上を合格とし、ラミ強度が0.20N未満を不合格とした。
表面抵抗値の測定は、SIMCO社製の表面抵抗測定器を用いて、23℃、20%RHの測定条件で、カバーテープ100の接着剤層120の表面抵抗測定を実施した。表面抵抗値が108Ω/□以上1012Ω/□以下を合格とし、それ以外を不合格とした。
両面に帯電防止処理が施されていない状態で、ヒートシール層140に5kvを印加して帯電させたとき、帯電させてからカバーテープ100の帯電圧が1%になるまでの減衰時間の測定を、ETS株式会社製の静電気減衰測定器を用いて実施した。なお、23℃、20%RHの測定条件と、23℃、50%RHの測定条件との両方で、それぞれ減衰時間の測定を実施した。減衰時間が10秒以下を合格とし、減衰時間が10秒を超える場合を不合格とした。
カバーテープ100の両面に帯電防止処理が施されていない状態で、剥離速度300mm/minでキャリアテープ300から剥離させる(図4参照、試験条件:JIS C0806-3準拠)。次に、カバーテープ100のヒートシール層140に発生する帯電圧を、TREK株式会社製の表面電位計を用いて、サンプルとプローブとの間の距離を1mmに設定して実施した。なお、23℃、20%RHの測定条件と、23℃、50%RHの測定条件との両方で、それぞれ帯電圧の測定を実施した。帯電圧の絶対値が50V以下を合格とし、帯電圧の絶対値が50Vを超える場合を不合格とした。
偏光顕微鏡で接着剤層120の観察を行い、帯電防止剤が接着剤樹脂に溶解しているか否かを確認した。図5は帯電防止剤が溶解している状態の接着剤層120を示し、図6は帯電防止剤121が飽和して一部溶解していない状態の接着剤層120を示す。
コート厚を5.0g/m2に調整した以外は、実施例1と同様にしてカバーテープ100を得た。また、カバーテープ100について、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して27重量%となるようにし、炭酸プロピレンは接着剤層120に対して18重量%となるようにし、接着剤樹脂が接着剤層120に対して55重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して45重量%で含む。また、カバーテープ100について、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して40重量%となるようにし、炭酸プロピレンが接着剤層120に対して5重量%となるようにし、接着剤樹脂が接着剤層120に対して55重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して45重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、11/89となる。また、カバーテープ100について、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して63重量%となるようにし、炭酸プロピレンが接着剤層120に対して7重量%となるようにし、接着剤樹脂が接着剤層120に対して30重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、10/90となる。また、カバーテープ100について、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して6重量%となるようにし、炭酸プロピレンが接着剤層120に対して4重量%となるようにし、接着剤樹脂が接着剤層120に対して90重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して10重量%で含む。また、カバーテープ100について、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して18重量%となるようにし、炭酸プロピレンが接着剤層120に対して2重量%となるようにし、接着剤樹脂が接着剤層120に対して80重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して20重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、10/90となる。また、カバーテープ100について、ラミ強度の測定を行わなかった以外は、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して8重量%となるようにし、炭酸プロピレンが接着剤層120に対して2重量%となるようにし、接着剤樹脂が接着剤層120に対して90重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して10重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、20/80となる。また、カバーテープ100について、ラミ強度の測定を行わなかった以外は、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して21重量%となるようにし、炭酸プロピレンが接着剤層120に対して9重量%となるようにし、接着剤樹脂が接着剤層120に対して70重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して30重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、30/70となる。また、カバーテープ100について、ラミ強度の測定を行わなかった以外は、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して12重量%となるようにし、炭酸プロピレンが接着剤層120に対して8重量%となるようにし、接着剤樹脂が接着剤層120に対して80重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して20重量%で含む。また、カバーテープ100について、ラミ強度の測定を行わなかった以外は、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤および炭酸プロピレンを添加せず、接着剤樹脂が接着剤層120に対して100重量%となるようにし、コート厚を1.5g/m2に調整した以外は、実施例1と同様にしてカバーテープを得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を含まない。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して33重量%となるようにし、炭酸プロピレンを添加せず、接着剤樹脂が接着剤層120に対して67重量%となるようにし、コート厚を1.6g/m2に調整した以外は、実施例1と同様にしてカバーテープを得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して33.3重量%で含む。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤を添加せず、炭酸プロピレンが接着剤層120に対して33.3重量%となるようにし、接着剤樹脂が接着剤層120に対して67重量%となるようにし、コート厚を3.4g/m2に調整した以外は、実施例1と同様にしてカバーテープを得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して33.3重量%で含む。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して80重量%となるようにし、炭酸プロピレンが接着剤層120に対して20重量%となるようにし、接着剤樹脂を添加せず、コート厚を1.6g/m2に調整した以外は、実施例1と同様にしてカバーテープを得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して100重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、20/80となる。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して0.5重量%となるようにし、炭酸プロピレンが接着剤層120に対して0.5重量%となるようにし、接着剤樹脂が接着剤層120に対して99重量%となるようにし、コート厚を2.5g/m2に調整した以外は、実施例1と同様にしてカバーテープを得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して1重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、50/50となる。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して20重量%となるようにし、炭酸プロピレンを添加せず、接着剤樹脂が接着剤層120に対して80重量%となるようにした以外は、実施例1と同様にしてカバーテープを得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して20重量%で含む。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
界面活性剤が接着剤層120に対して4重量%となるようにし、炭酸プロピレンが接着剤層120に対して1重量%となるようにし、接着剤樹脂が接着剤層120に対して95重量%となるようにした以外は、実施例1と同様にしてカバーテープ100を得た。なお、接着剤層120は、界面活性剤と炭酸プロピレンからなる帯電防止剤を、接着剤層120に対して5重量%で含む。また、炭酸アルキレンと界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、20/80となる。また、この得られたカバーテープについて、実施例1と同様にして各項目に係る測定および確認を行った。
以上のように、本実施形態に係るカバーテープ100においては、本願発明者の鋭意検討の結果、接着剤層120に対して10重量%以上70重量%以下の帯電防止剤を接着剤層120に添加することにより、カバーテープ100が帯電しにくくなることが明らかとなった。このため、カバーテープ100は、電子部品400のピックアップ不良を抑制し、かつ、静電気放電による電子部品400の破壊を抑制することができる。
さらに、カバーテープ100は、好適な機械的強度を有する。このため、カバーテープ100は、キャリアテープ300から高速剥離されるときに破断することを抑制することができる。
(A)
カバーテープ100の両面または片面に帯電防止処理が施されていてもよい。この帯電防止処理によって、カバーテープ100は、より帯電しにくくなる。
基材層110は、2層以上の積層体から構成されていてもよい。また、基材層110は、未延伸のフィルムが用いられていてもよい。
接着剤層120は、基材層110とクッション層130との間に設けられるのではなく、他の層と層との間に設けられていてもよい。
ヒートシール層140では、電子部品400の種類に応じて、カバーテープ100と電子部品400の摩擦帯電特性を抑制するために、異なる帯電特性を有する樹脂が添加されていてもよい。
Claims (19)
- 少なくとも基材層およびヒートシール層を含む複数の層で構成され、
前記複数の層のうちの少なくともいずれか2層が、接着剤層を介して積層される電子部品包装用カバーテープであって、
前記接着剤層は、炭酸アルキレンおよび界面活性剤を主成分とする帯電防止剤を、該接着剤層に対して10重量%以上70重量%以下で含むことを特徴とする電子部品包装用カバーテープ。 - 前記接着剤層は、前記帯電防止剤を、該接着剤層に対して45重量%以上70重量%以下で含む請求項1に記載の電子部品包装用カバーテープ。
- 前記複数の層には、前記基材層と前記ヒートシール層との間に設けられるクッション層が含まれる請求項1または2に記載の電子部品包装用カバーテープ。
- 前記基材層と前記クッション層とが前記接着剤層を介して積層されている請求項3に記載の電子部品包装用カバーテープ。
- 前記界面活性剤は、イオン系界面活性剤である請求項1~4のいずれか1項に記載の電子部品包装用カバーテープ。
- 前記イオン系界面活性剤は、カチオン系界面活性剤である請求項5に記載の電子部品包装用カバーテープ。
- 前記カチオン系界面活性剤は、アルキル4級アンモニウムエトサルフェートである請求項6に記載の電子部品包装用カバーテープ。
- 前記炭酸アルキレンは、炭酸プロピレンである請求項1~7のいずれか1項に記載の電子部品包装用カバーテープ。
- 前記炭酸アルキレンと前記界面活性剤との重量比(炭酸アルキレン/界面活性剤)は、10/90以上40/60以下である請求項1~8のいずれか1項に記載の電子部品包装用カバーテープ。
- 湿度20%RHにおける前記接着剤層の表面抵抗値(測定方法:JIS K 6911)は、108Ω/□以上1012Ω/□以下である請求項1~9のいずれか1項に記載の電子部品包装用カバーテープ。
- 両面に帯電防止処理が施されていない状態で、前記ヒートシールされる側の面に5kvを印加して帯電させたとき、帯電させてから帯電圧が1%になるまでの減衰時間が10秒以下である請求項1~10のいずれか1項に記載の電子部品包装用カバーテープ。
- 両面に帯電防止処理が施されていない状態で、前記ヒートシールされる側の面と、電子部品とを300rpmの速さで1分間摩擦させたとき、該電子部品包装用カバーテープのヒートシールされる側の面に係る帯電圧の絶対値が50V以下である請求項1~11のいずれか1項に記載の電子部品包装用カバーテープ。
- 両面または片面に帯電防止処理を施されている請求項1~12のいずれか1項に記載の電子部品包装用カバーテープ。
- 前記接着剤層は、接着剤樹脂を含有し、
前記帯電防止剤は、前記接着剤樹脂に溶解している請求項1~13のいずれか1項に記載の電子部品包装用カバーテープ。 - 前記基材層は、一軸方向または二軸方向に延伸したフィルムからなる請求項1~14のいずれか1項に記載の電子部品包装用カバーテープ。
- 前記基材層の厚さは、12μm以上30μm以下である請求項1~15のいずれか1項に記載の電子部品包装用カバーテープ。
- 請求項1~16のいずれか1項に記載の電子部品包装用カバーテープと、
前記電子部品包装用カバーテープがヒートシールされる電子部品包装用キャリアテープと、を備えることを特徴とする電子部品包装体。 - 前記電子部品包装用カバーテープの両面に帯電防止処理が施されていない状態で、該電子部品包装用カバーテープを剥離速度300mm/minで前記電子部品包装用キャリアテープから剥離したとき(試験条件:JIS C0806-3準拠)、該電子部品包装用カバーテープのヒートシールされる側の面に発生する帯電圧の絶対値が150V以下である請求項17に記載の電子部品包装体。
- 少なくとも基材層およびヒートシール層を含む複数の層と、
前記複数の層のうちの少なくともいずれか2層を接着させ、かつ、炭酸アルキレンおよび界面活性剤を主成分とする帯電防止剤を、該接着剤層に対して10重量%以上70重量%以下で含む接着剤層とを備えることを特徴とする電子部品包装用カバーテープ。
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JPH0269864A (ja) * | 1988-09-06 | 1990-03-08 | Mitsubishi Electric Corp | 情報入出力方式 |
MY107463A (en) * | 1991-02-28 | 1995-12-30 | Sumitomo Bakelite Co | Cover tape for packaging chip type electronic parts. |
TW339840U (en) * | 1993-12-22 | 1998-09-01 | Lintec Corp | Coating applicator |
US5447784A (en) * | 1994-06-01 | 1995-09-05 | Rexham Industries Corp. | Electrostatic dissipating cover tape |
US5491013A (en) * | 1994-08-31 | 1996-02-13 | Rexam Industries Corp. | Static-dissipating adhesive tape |
JPH08295001A (ja) * | 1995-04-27 | 1996-11-12 | Dainippon Printing Co Ltd | 蓋材とキャリアテープおよびこれらを用いたテーピング |
US5599621A (en) * | 1995-09-29 | 1997-02-04 | Brady Precision Tape Co. | Cover tape for surface mount device packaging |
US6030692A (en) * | 1996-09-13 | 2000-02-29 | Netpco Incorporated | Cover tape for formed tape packing system and process for making same |
US6027802A (en) * | 1997-10-23 | 2000-02-22 | Four Piliars Enterprise Co., Ltd. | Cover tape for packaging |
ATE336371T1 (de) * | 2001-06-26 | 2006-09-15 | Sumitomo Bakelite Co | Abdeckstreifen zum verpacken von elektronischen bauteilen |
TW200506025A (en) * | 2003-07-15 | 2005-02-16 | Kanji Hayashi | Antistatic adhesive for water-based or solvent-based dry laminate and complex plastic film |
JP2005306460A (ja) * | 2004-04-26 | 2005-11-04 | Denki Kagaku Kogyo Kk | カバーテープ及び電子部品包装用キャリアテープシステム |
JP2007331783A (ja) | 2006-06-14 | 2007-12-27 | Shin Etsu Polymer Co Ltd | カバーテープおよび電子部品用包装体 |
JP5137102B2 (ja) * | 2007-03-07 | 2013-02-06 | 寛治 林 | 帯電防止性接着剤の主剤用溶液及び帯電防止性ドライラミネート用接着剤及び帯電防止性複合フィルム |
JP2009035659A (ja) * | 2007-08-03 | 2009-02-19 | Finetech Kenkyusho:Kk | カチオン型帯電防止剤及びこの帯電防止剤を含む接着剤及びこの接着剤を用いてドライラミネートされたドライラミネートフィルム |
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2010
- 2010-07-21 JP JP2010546561A patent/JP4826858B2/ja not_active Expired - Fee Related
- 2010-07-21 CN CN2010800322077A patent/CN102470964B/zh not_active Expired - Fee Related
- 2010-07-21 WO PCT/JP2010/004661 patent/WO2011010453A1/ja active Application Filing
- 2010-07-21 KR KR1020117027267A patent/KR101139545B1/ko not_active IP Right Cessation
- 2010-07-21 SG SG2011095551A patent/SG177337A1/en unknown
- 2010-07-21 US US13/386,081 patent/US8584859B2/en not_active Expired - Fee Related
- 2010-07-22 TW TW099124201A patent/TWI359181B/zh not_active IP Right Cessation
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2012
- 2012-07-05 HK HK12106583.6A patent/HK1165771A1/xx not_active IP Right Cessation
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015029867A1 (ja) * | 2013-09-02 | 2015-03-05 | 電気化学工業株式会社 | カバーフィルムおよび電子部品包装体 |
CN105492337A (zh) * | 2013-09-02 | 2016-04-13 | 电化株式会社 | 覆盖膜及电子零件包装体 |
JPWO2015029867A1 (ja) * | 2013-09-02 | 2017-03-02 | デンカ株式会社 | カバーフィルムおよび電子部品包装体 |
JP2016009842A (ja) * | 2014-06-26 | 2016-01-18 | 住友ベークライト株式会社 | 電子部品包装体搬送装置および電子部品包装体の搬送方法 |
JP2017007739A (ja) * | 2015-06-17 | 2017-01-12 | 浙江潔美電子科技股▲ふん▼有限公司 | 電子部品の収納用キャリアテープのカバーテープ及びその調製方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102470964A (zh) | 2012-05-23 |
KR20120012815A (ko) | 2012-02-10 |
TW201107446A (en) | 2011-03-01 |
SG177337A1 (en) | 2012-02-28 |
KR101139545B1 (ko) | 2012-04-27 |
US8584859B2 (en) | 2013-11-19 |
US20120118789A1 (en) | 2012-05-17 |
JP4826858B2 (ja) | 2011-11-30 |
CN102470964B (zh) | 2013-08-28 |
TWI359181B (en) | 2012-03-01 |
JPWO2011010453A1 (ja) | 2012-12-27 |
HK1165771A1 (en) | 2012-10-12 |
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