WO2009139357A1 - 被加工材の表面保護方法および仮固定方法 - Google Patents
被加工材の表面保護方法および仮固定方法 Download PDFInfo
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- WO2009139357A1 WO2009139357A1 PCT/JP2009/058783 JP2009058783W WO2009139357A1 WO 2009139357 A1 WO2009139357 A1 WO 2009139357A1 JP 2009058783 W JP2009058783 W JP 2009058783W WO 2009139357 A1 WO2009139357 A1 WO 2009139357A1
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- acrylate
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- protective film
- mass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0017—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor characterised by the choice of the material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
- C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0065—Heat treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Definitions
- the present invention relates to a surface protection method and a temporary fixing method of the workpiece when processing various materials. More specifically, the present invention provides a protective film made of a curable composition (hereinafter sometimes referred to as a cured body) on the surface of a workpiece when processing an optical member, a semiconductor wafer, or the like.
- a method for protecting the surface of a workpiece which is intended to protect a portion not to be processed from foreign matter adhesion or scratches during processing, is presented.
- the present invention is to collect the workpiece by bonding the workpiece to the base material, processing the workpiece, immersing the bonded portion in warm water, and removing the protective film.
- a characteristic method of temporarily fixing the workpiece is also presented.
- a surface protective film that temporarily protects components is widely used.
- a pressure-sensitive adhesive sheet is mainly used.
- the back surface grinding method protects the circuit surface of the wafer and the non-processed surface of the optical component with the surface protection sheet, and temporarily fixes the substrate to the substrate via the surface protection sheet, and grinds the back surface opposite to the circuit surface. It is a method to do.
- the pressure-sensitive adhesive surface protection sheet currently in use has a limit in the ability to follow the irregularities of the circuit of the semiconductor wafer. For this reason, contamination due to the ingress of the grinding liquid between the wafer and the surface protective layer often becomes a problem.
- a typical semiconductor surface protection sheet cannot follow protrusions of 100 ⁇ m or more typified by bumps, causing a problem of contamination and chip jumping. there were.
- Conventional surface protective sheets are generally sheets having a pressure-sensitive adhesive layer as a surface protective layer on a polymer film material, and the pressure-sensitive adhesive is designed to have a low elastic modulus so as to follow the irregularities of the circuit surface. .
- the elastic modulus is too low, a large stress is applied to the wafer when the sheet is peeled off from the wafer, leading to damage of the wafer.
- an energy ray easily peelable protective sheet that cures the pressure-sensitive adhesive by irradiating energy rays such as ultraviolet rays before peeling the sheet, and reduces the adhesive force between the wafer and the protective sheet.
- the pressure-sensitive adhesive layer is in an uncured state during grinding, and there is a problem that the wafer is damaged during grinding because it is too soft.
- Patent Document 1 discloses a wafer grinding method in which the energy ray easy-peelable protective sheet as described above is attached to a wafer on which a circuit is formed, and the adhesive layer is cured with energy rays, and then the back surface of the wafer is ground. ing.
- the pressure-sensitive adhesive is not a fluid, the followability to the unevenness of the wafer circuit surface is not sufficient.
- Patent Document 2 discloses a hot-melt type semiconductor surface protective sheet.
- a hot-melt type sheet that melts and exhibits fluidity when heated to 60 to 100 ° C. can follow the unevenness of the circuit surface and exhibit excellent grindability.
- this sheet has the property of melting whenever the temperature exceeds the melting point.
- the present inventor has specified a specific material as a composition that has sufficient followability to the unevenness of the circuit surface of a wafer or optical component and has sufficient rigidity as a support during grinding.
- the resin composition which consists of resin containing a (meth) acryl monomer is proposed (refer patent document 3 and 4).
- the resin composition is effective for surface protection during back grinding.
- a resin composition whose surface is completely cured during surface protection. This is because the surface may not be completely cured if it is subjected to polymerization inhibition by oxygen during surface protection during surface grinding / cutting.
- Patent Document 5 does not describe provision of a heating process in which a protective film is provided on the surface of a workpiece using the resin composition and heat treatment is performed at 80 to 150 ° C. Further, when a heating step is provided, there is no description that the protective film does not fall off during processing even if dicing is performed.
- the present inventor conducted a heat treatment of the protective film after providing a protective film made of the curable composition on the surface of the processed material, and then processed the workpiece.
- the inventors have obtained knowledge that the surface of the workpiece can be protected without dropping the protective film during processing, and have completed the present invention.
- the present invention provides a method for protecting a surface of a workpiece by providing a protective film made of a curable composition on the surface of the workpiece, and after the protective film is laminated on the surface of the workpiece, the protective film is heat-treated.
- a protective film made of a curable composition is provided on the surface of the workpiece, and after the heat treatment, the workpiece is processed, and then immersed in warm water of 90 ° C. or less.
- a method for temporarily fixing a workpiece comprising removing a protective film made of a curable composition from the workpiece.
- the present invention includes a laminating step of laminating a protective film formed of a curable composition containing the following (A), (B) and (C) on the surface of a workpiece, and 80 after the laminating step.
- a method for protecting a surface of a workpiece by laminating a protective film on the surface of the workpiece, comprising: a heating step of heat-treating to 150 ° C; and a processing step of processing the workpiece after the heating step. is there.
- the said protective film contains resin which has (D) cyclopentadiene frame
- the (D) resin containing a cyclopentadiene skeleton is a method for protecting the surface of the workpiece, wherein the molecule contains an ester group or a hydroxyl group.
- the (A) polyfunctional (meth) acrylate and the (B) monofunctional (meth) acrylate are both hydrophobic methods for protecting the surface of the workpiece.
- the curable composition comprises 5 to 50 parts by mass of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate in 100 parts by mass of the total amount of (A) and (B). And (C) 0.1-20 parts by weight of a photopolymerization initiator and (D) cyclopentadiene with respect to 100 parts by weight of the total amount of (A) and (B).
- a method for protecting a surface of a workpiece comprising 0.1 to 50 parts by mass of a resin having a skeleton.
- a laminating step of laminating a protective film made of a cured product formed from a curable composition containing the following (A), (B) and (C) on the surface of the workpiece, and 80 to 150 after the laminating step A heating step in which heat treatment is performed at a temperature of C; a processing step in which the workpiece is processed after the heating step; and a removal in which the workpiece is immersed in warm water of 90 ° C. or less after the processing step to remove the protective film from the workpiece A temporary fixing method for a workpiece, wherein a protective film is laminated on the surface of the workpiece.
- B) Monofunctional (meth) acrylate C) Photopolymerization initiator
- the method for protecting the surface of a workpiece according to the present invention is effective in that the protective film does not fall off even if processing such as dicing is performed, and scratches or foreign matter on the processed surface, circuit, sensor site, etc. of the workpiece Adhesion can be prevented.
- a protective film formed from a curable composition is provided on the surface of a workpiece, and then the protective film is heated to 80 to 150 ° C., and then the workpiece is processed.
- This is a method for protecting the surface of a workpiece, characterized in that the protective film is prevented from falling off.
- the temperature of the heat treatment is preferably 80 to 150 ° C., more preferably 90 to 120 ° C. from the viewpoint of maintaining the peelability of the protective film. If it is 80 degreeC or more, the effect by heat processing will be acquired, and if it is 150 degrees C or less, peelability is favorable.
- the curable composition used as a protective film in the present invention includes (A) polyfunctional (meth) acrylate, (B) monofunctional (meth) acrylate, (C) photopolymerization initiator, and (D) cyclohexane. It is preferable to contain a resin containing a pentadiene skeleton in order to obtain the effects of the present invention.
- the polyfunctional (meth) acrylate oligomer / polymer / monomer having two or more (meth) acryloyl groups can be used as the (A) polyfunctional (meth) acrylate used in the curable composition.
- the polyfunctional (meth) acrylate oligomer / polymer 1,2-polybutadiene-terminated urethane (meth) acrylate (for example, “TE-2000”, “TEA-1000” manufactured by Nippon Soda Co., Ltd.), the hydrogenated product ( For example, Nippon Soda Co., Ltd., “TEAI-1000”), 1,4-polybutadiene terminated urethane (meth) acrylate (for example, “BAC-45” manufactured by Osaka Organic Chemical Co., Ltd.), polyisoprene terminated (meth) acrylate, polyurethane Acrylate (for example, “UV-7000B” manufactured by Nippon Gosei Co., Ltd.), polyester
- 1,2-polybutadiene-terminated urethane (meth) acrylate one or two or more selected from the group consisting of 1,2-polybutadiene-terminated urethane (meth) acrylate, polyurethane acrylate oligomer, and polyester-based urethane acrylate oligomer is preferable in that the effect of peelability is great.
- 1,2-polybutadiene terminated urethane (meth) acrylate is more preferred.
- bifunctional (meth) acrylate monomers include 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9 -Nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol (meth) acrylate, neopentyl glycol modified trimethylolpropane Di (meth) acrylate, stearic acid-modified pentaerythritol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis (meth) a Lilo propoxy
- Examples of the tetra- or higher functional (meth) acrylate monomer include dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerystol penta (meth) acrylate, and dipenta Examples include erythritol hexa (meth) acrylate.
- dicyclopentanyl di (meth) acrylate and / or 1,6-hexanediol di (meth) acrylate is preferable and dicyclopentanyl di (meth) acrylate is preferable in that the effect of peelability is large. More preferred.
- polyfunctional (meth) acrylates polyfunctional (meth) acrylate oligomers / polymers having two or more (meth) acryloyl groups and bifunctional (meth) acrylates in terms of a large effect of peelability It is preferable to use a monomer together.
- the mixing ratio (mass ratio) of the polyfunctional (meth) acrylate oligomer / polymer having two or more (meth) acryloyl groups and the bifunctional (meth) acrylate monomer is 30 to 30 100: 70 to 0 is preferable, and 50 to 65:50 to 35 is more preferable.
- the hydrophobic (A) polyfunctional (meth) acrylate used in the present invention is more preferable.
- hydrophobicity it is possible to prevent a phenomenon that tends to occur when it is water-soluble, that is, a phenomenon in which the cured product of the curable composition swells during processing to cause displacement and poor processing accuracy.
- the hydrophobic polyfunctional (meth) acrylate refers to (meth) acrylate having no hydroxyl group.
- the above-mentioned polyfunctional (meth) acrylates can be mentioned.
- one or more selected from the group consisting of 1,2-polybutadiene-terminated urethane (meth) acrylate, 1,6-hexadiol di (meth) acrylate and dicyclopentanyl di (meth) acrylate Is preferred. Even if it is hydrophilic, it can be used as long as the cured product of the curable composition is not greatly swollen or partially dissolved by water.
- the amount of (A) polyfunctional (meth) acrylate used is preferably 5 to 50 parts by mass, preferably 20 to 40 parts by mass in 100 parts by mass of the total amount of (A) and the later-described (B) monofunctional (meth) acrylate component. Part is more preferred. If it is 5 parts by mass or more, it is possible to prevent the peelability from decreasing or the cured product of the curable composition from becoming a film, and if it is 50 parts by mass or more, the shrinkage of curing increases and the initial adhesiveness. There is no fear that it will fall.
- Examples of the (B) monofunctional (meth) acrylate monomer used in the curable composition include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl ( (Meth) acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (Meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth)
- -(1,2-cyclohexanedicarboximido) ethyl (meth) acrylate and / or phenol ethylene oxide 2 molar modified (meth) acrylate is more preferred.
- the mixing ratio (mass ratio) of phenol ethylene oxide 2 mol-modified (meth) acrylate and 2- (1,2-cyclohexanedicarboximido) ethyl (meth) acrylate is 20 to 20 70:80 to 30 is preferable, and 30 to 45:70 to 55 is more preferable.
- the monofunctional (meth) acrylate is preferably hydrophobic as in the case of the component (A).
- hydrophobic means (meth) acrylate having no hydroxyl group.
- hydrophobicity it is possible to prevent a phenomenon that tends to occur when water-soluble, that is, a phenomenon in which the cured product of the curable composition swells during processing to cause displacement and poor processing accuracy. Even if it is hydrophilic, it may be used as long as the cured product of the curable composition does not swell or partially dissolve with water.
- the amount of the (B) monofunctional (meth) acrylate used is preferably 50 to 95 parts by mass, more preferably 60 to 80 parts by mass in 100 parts by mass of the total amount of the component (A) and the component (B). If it is 50 parts by mass or more, the initial adhesiveness is not likely to be lowered, and if it is 95 parts by mass or less, the peelability is not lowered, and a cured product of the curable composition is obtained in a film form.
- the (A) component and the (B) component of the above composition are further added to (meth) acryloyloxyethyl acid phosphate, dibutyl 2- (meth) acryloyloxyethyl acid phosphate, dioctyl 2- (meth) acryloyloxyethyl phosphate
- phosphate ester having vinyl group or (meth) acryloyl group such as
- the (C) photopolymerization initiator used in the curable composition is used for sensitizing with actinic rays of visible light or ultraviolet rays to promote photocuring of the curable composition, and is known in the art. Various photopolymerization initiators can be used.
- the amount of the photopolymerization initiator used is preferably 0.1 to 20 parts by mass, and more preferably 3 to 10 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). If it is 0.1 part by mass or more, the effect of promoting curing can be reliably obtained, and if it is 20 parts by mass or less, a sufficient curing rate can be achieved. As a more preferable form, it can harden
- the resin having a cyclopentadiene skeleton used in the present invention may be any resin having a cyclopentadiene skeleton, but the softening point is preferably 50 to 200 ° C., and the number average molecular weight (Mn) Is preferably from 300 to 600 in terms of solubility in the component (A) and the component (B).
- the softening point was measured according to JIS K 2207 ring and ball system.
- the number average molecular weight was measured according to GPC (gel permeation chromatography) polystyrene conversion value.
- Examples of (D) include petroleum resins produced using cyclopentadiene extracted from the C5 fraction as a main raw material.
- the amount of the resin having a cyclopentadiene skeleton is preferably 0.5 to 50 parts by mass and more preferably 5 to 30 parts by mass with respect to 100 parts by mass of the total amount of component (A) and component (B). preferable. If the amount is 0.5 parts by mass or more, no adhesive remains without forming a film, and if it is 50 parts by mass or less, the adhesiveness does not decrease.
- polymerization inhibitors include methyl hydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol), catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2,5-ditertiary butyl Hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiarybutyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary butylcatechol, 2-butyl-4-hydroxyanisole, and Examples include 2,6-ditertiary butyl-p-cresol.
- one or more of the group consisting of 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), hydroquinone monomethyl ether and p-benzoquinone are preferred, More preferred is methylene-bis (4-methyl-6-tertiary butylphenol).
- the amount of these polymerization inhibitors used is preferably 0.001 to 3 parts by mass, and more preferably 0.01 to 2 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). If it is 0.001 part by mass or more, the storage stability is sufficient, and if it is 3 parts by mass or less, reliable adhesiveness is obtained and there is no possibility of becoming uncured.
- the curable composition used in the present invention includes various elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic fillers, solvents, extenders, Additives such as reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants, silane coupling agents and surfactants may be used.
- elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic fillers, solvents, extenders, Additives such as reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants, silane coupling agents and surfactants may be used.
- the present invention provides a protective film made of the above curable composition on the surface of the workpiece, heat-treats the protective film, and then processes the workpiece to prevent the protective film from falling off during processing.
- a protective film is provided by applying a curable composition having a thickness of 20 to 200 ⁇ m, preferably 50 to 150 ⁇ m, on the surface of the workpiece, and the wavelength is 365 nm. integrated quantity of light 1000 ⁇ 4000mJ / cm 2, preferably preferred curing under the conditions of 1500 ⁇ 3000mJ / cm 2.
- a step of heat-treating the protective film at 80 to 150 ° C., preferably 80 to 120 ° C., for 5 to 30 minutes is preferable.
- the processing step for processing the workpiece after the heating step includes a rotational speed of 5000 to 40000 rpm, preferably 10,000 to 35000 rpm, a feed rate of 0.2 to 50 mm / sec, preferably 0.5 to 30 mm / sec, a chip size of 0.
- a step of dicing under conditions of 5 to 15 mm square is preferable.
- a protective film made of a curable composition is provided on the surface of the work material, and after heat treatment, the work material is processed, and then hot water of 70 to 90 ° C. or less, preferably 75.
- a method for temporarily fixing a workpiece comprising a step of removing the protective film made of the curable composition from the workpiece by immersing in warm water at ⁇ 85 ° C.
- Experimental Examples I-1 to I-15 are examples of the present invention
- Experimental Examples II-1 to II-5 are comparative examples.
- (Experimental Example I-1) As polyfunctional (meth) acrylate, “TE-2000” (1,2-polybutadiene-terminated urethane methacrylate, hereinafter abbreviated as “TE-2000”) manufactured by Nippon Soda Co., Ltd., dicyclopentanyl di 15 parts by mass of acrylate (manufactured by Nippon Kayaku Co., Ltd., “KAYARAD R-684”, hereinafter abbreviated as “R-684”), (B) 2- (1,2-cyclohexanedicarboxy as monofunctional (meth) acrylate 40 parts by mass of imido) ethyl acrylate (Toa Gosei Co., Ltd., “Aronix M-140
- Adhesive strength (tensile shear adhesive strength): The bond strength (tensile shear bond strength) was measured according to JIS K 6850. Specifically, heat-resistant Pyrex (registered trademark) glass (25 mm ⁇ 25 mm ⁇ 2.0 mm (length ⁇ width ⁇ thickness)) was used as the adherend.
- the adhesion site is a circle with a diameter of 8 mm and a thickness of 100 ⁇ m, and two heat-resistant Pyrex (registered trademark) glasses are bonded together with the prepared curable composition, and a fusion device manufactured by Fusion, using an electrodeless discharge lamp, Curing was performed under the condition of an integrated light amount of 2000 mJ / cm 2 with a wavelength of 365 nm to prepare a tensile shear bond strength test piece.
- the prepared test piece was measured for tensile shear bond strength at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50% using a universal testing machine.
- adhesion test Status of holding protective film after dicing (adhesion test): The adhesion test was performed in an environment of a temperature of 23 ° C. and a humidity of 50%. A curable composition is applied to a silicon wafer with a thickness of 100 ⁇ m, and the curable composition is cured under a condition of an integrated light amount of 2000 mJ / cm 2 with a wavelength of 365 nm by a curing device manufactured by Fusion Corporation using an electrodeless discharge lamp. Thus, a protective film was produced. Then, after heat-treating the protective film at 100 ° C.
- dicing is performed under the conditions of a rotation speed of 30000 rpm, a feed rate of 1.0 mm / sec, and a chip size of 1 mm square, and observation is made whether the protective film is retained after dicing. did. Of the 25 chips, the number of chips holding the protective film was measured.
- peeling test About the test body in which the protective film was hold
- QM Dicyclopentenyloxyethyl methacrylate (Rohm & Haas, “QM-657”)
- BZ benzyl methacrylate (manufactured by Kyoeisha Chemical Co., “Light Ester BZ”)
- UV-7000B Polyurethane acrylate oligomer (manufactured by Nippon Synthetic Chemical Co., Ltd., “UV-7000B”)
- UV-3000B Polyester urethane acrylate oligomer (manufactured by Nippon Synthetic Chemical Co., Ltd., “UV-3000B”)
- 1,6-HX-A 1,6-hexanediol diacrylate (manufactured by Kyoeisha Chemical Co., Ltd., “Light acrylate 1,6-HX-A”)
- M-5300 ⁇ -carboxy-polycaprolactone monoacrylate (manufactured by Toa Gosei Co., Ltd., “
- Example II-1 and II-2 A curable composition was prepared in the same manner as in Experimental Example I-1, except that the heat treatment was performed at the temperature shown in Table 2. The obtained curable composition was evaluated in the same manner as in Experimental Example I-1. The results are shown in Table 2. In addition, “ ⁇ ” of the heat treatment temperature in Experimental Example II-1 means that the heat treatment was not performed.
- the protective film is provided on the surface of the workpiece, the protective film is heat-treated, and then the workpiece is processed to prevent the protective film from falling off during processing. It is possible to protect the surface of the workpiece from contamination and contamination. Moreover, since the curable composition of the present invention has sufficient followability to irregularities on the surface such as a circuit surface, the surface is protected not only from smooth surfaces but also from irregularities to scratches and contamination. It is possible.
- the protective film of the present invention can be recovered from the workpiece in the form of a film by immersing it in warm water of 90 ° C. or less after the workpiece is processed, an effect of excellent workability can be obtained. Furthermore, it is not necessary to use an organic solvent that is indispensable for conventional adhesives, and the effect of reducing the environmental load can be obtained.
- a protective film is provided on the surface of a workpiece using the curable composition. In the present invention, for example, even if dicing is performed under a condition where the feed rate is 2 mm / sec or less, an effect that the protective film does not fall off during processing can be obtained.
- the surface protection method of the present invention has a protective film made of a curable composition that has photocurability because of its composition, and is cured by visible light or ultraviolet light. Therefore, it saves labor and energy compared to conventional hot melt adhesives. A remarkable effect can be obtained in terms of speed and work shortening.
- a heat treatment process is performed to reduce internal strain of the protective film, and the protective film is prevented from falling off in the subsequent machining process of the workpiece. Can do.
- the protective film can exhibit high adhesive strength without affecting the cutting fluid used at the time of processing, and the work material can be removed from the entrance of the cutting fluid, scratches due to cutting waste, etc. The surface can be protected. Since the effects as described above are obtained, the present invention is useful in industries such as engineering parts, processing of electronic parts such as sensors, and electrical parts, particularly precision processing such as cutting, grinding, and polishing.
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Abstract
Description
本発明は、下記(A)、(B)及び(C)を含有する硬化性組成物から形成される硬化体からなる保護膜を被加工材の表面に積層する積層工程と、積層工程後に80~150℃に加熱処理する加熱工程と、加熱工程後に被加工材を加工する加工工程とを有することを特徴とする、被加工材の表面に保護膜を積層する被加工材の表面保護方法である。
(A)多官能(メタ)アクリレート
(B)単官能(メタ)アクリレート
(C)光重合開始剤
さらに、前記保護膜が、(D)シクロペンタジエン骨格を有する樹脂を含有する請求項1に記載の被加工材の表面保護方法である。
また、前記(D)シクロペンタジエン骨格を含有する樹脂が、分子内にエステル基又は水酸基を含有する該被加工材の表面保護方法である。
また、前記(A)多官能(メタ)アクリレートと、前記(B)単官能(メタ)アクリレートとが、いずれも疎水性である該被加工材の表面保護方法である。
(A)多官能(メタ)アクリレート
(B)単官能(メタ)アクリレート
(C)光重合開始剤
加熱処理の温度は、保護膜の剥離性を保持するという観点から80~150℃が好ましく、90~120℃がより好ましい。80℃以上ならば加熱処理による効果が得られ、150℃以下ならば剥離性が良好である。
3官能(メタ)アクリレートモノマーとしては、トリメチロールプロパントリ(メタ)アクリレート、トリス[(メタ)アクリロイキシエチル]イソシアヌレート等が挙げられる。
これらの中では、剥離性の効果が大きい点で、ジシクロペンタニルジ(メタ)アクリレート及び/又は1,6-ヘキサンジオールジ(メタ)アクリレートが好ましく、ジシクロペンタニルジ(メタ)アクリレートがより好ましい。
(A)多官能(メタ)アクリレートの中では、剥離性の効果が大きい点で、2個以上の(メタ)アクリロイル基を有する多官能(メタ)アクリレートオリゴマー/ポリマーと、2官能(メタ)アクリレートモノマーとを併用することが好ましい。2個以上の(メタ)アクリロイル基を有する多官能(メタ)アクリレートオリゴマー/ポリマーと、2官能(メタ)アクリレートモノマーとの混合割合(質量比)は、剥離性の効果が大きい点で、30~100:70~0が好ましく、50~65:50~35がより好ましい。
積層工程後に加熱処理する加熱工程としては、保護膜を80~150℃、好ましくは80~120℃で、5~30分間加熱処理する工程が好ましい。
加熱工程後に被加工材を加工する加工工程としては、回転数5000~40000rpm、好ましくは10000~35000rpm、送り速度0.2~50mm/sec、好ましくは0.5~30mm/sec、チップサイズ0.5~15mm角の条件下でダイシングを行う工程が好ましい。
なお、実験例I-1~I-15は本発明の実施例であり、実験例II-1~II-5は比較例である。
(実験例I-1)
(A)多官能(メタ)アクリレートとして、日本曹達社製、「TE-2000」(1,2-ポリブタジエン末端ウレタンメタクリレート、以下「TE-2000」と略す。)20質量部、ジシクロペンタニルジアクリレート(日本化薬社製、「KAYARAD R-684」、以下「R-684」と略す。)15質量部、(B)単官能(メタ)アクリレートとして、2-(1,2-シクロヘキサンジカルボキシイミド)エチルアクリレート(東亜合成社製、「アロニックスM-140」、以下「M-140」と略す。)40質量部、およびフェノールエチレンオキサイド2モル変性アクリレート(東亜合成社製、「アロニックスM-101A」、以下「M-101A」と略す。)25質量部からなる組成物の100質量部に、(C)光重合開始剤として、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(チバ・スペシャルティ・ケミカルズ社製、「IRGACURE907」、以下「I-907」と略す。)6質量部と、(D)シクロペンタジエン骨格を含有する樹脂として、シクロペンタジエン骨格樹脂(日本ゼオン社製、「Quintone1700」、水酸基を含有し、軟化点が100℃であり、数平均分子量は380である。以下「Quintone1700」と略す。)10質量部と、重合禁止剤として2,2-メチレン-ビス(4-メチル-6-ターシャリーブチルフェノール)(以下、「MDP」と略す。)0.1質量部と、を配合して硬化性組成物を作製した。得られた硬化性組成物を使用して、以下に示す評価方法にて引張せん断接着強さの測定、密着性試験及び剥離試験を行った。結果を表1に示した。
接着強さ(引張せん断接着強さ):
接着強さ(引張せん断接着強さ)は、JIS K 6850に従い測定した。具体的には、被着材として耐熱パイレックス(登録商標)ガラス(25mm×25mm×2.0mm(縦×横×厚さ))を用いた。接着部位は直径8mmの円形で、厚さ100μmとして、作製した硬化性組成物にて2枚の耐熱パイレックス(登録商標)ガラスを貼り合わせ、無電極放電ランプを使用したフュージョン社製硬化装置により、365nmの波長の積算光量2000mJ/cm2の条件にて硬化させ、引張せん断接着強さ試験片を作製した。作製した試験片は、万能試験機を使用して、温度23℃、湿度50%の環境下、引張速度10mm/minで引張せん断接着強さを測定した。
ダイシング後の保護膜の保持状況(密着性試験):
温度23℃、湿度50%の環境下で密着性の試験を行なった。シリコンウエハ上に硬化性組成物を厚さ100μmとして塗布し、無電極放電ランプを使用したフュージョン社製硬化装置により、365nmの波長の積算光量2000mJ/cm2の条件にて硬化性組成物を硬化させ、保護膜を作製した。その後、保護膜を100℃で10分間加熱処理した後、回転数30000rpm、送り速度1.0mm/sec、チップサイズ1mm角の条件にてダイシングを行い、ダイシング後も保護膜が保持されているか観察した。25枚のチップのうち保護膜が保持されているチップの枚数を計測した。
上記のダイシング後も保護膜が保持されていた試験体について、温水(80℃)に浸漬してから、シリコンウエハから保護膜が剥離するまでの時間を測定した。
剥離状態の観察(剥離試験):
上記80℃温水による剥離時間(剥離試験)の試験後に、剥離した保護膜を観察した。
加熱処理を表1に示す温度で行ったこと以外は実験例I-1と同様にして硬化性組成物を作製した。得られた硬化性組成物に関して、実験例I-1と同様に評価を行った。それらの結果を表1に示す。
表1に示す種類の原材料を表1に示す組成で使用したこと以外は実験例I-1と同様にして硬化性組成物を作製した。得られた硬化性組成物に関して、実験例I-1と同様に評価を行った。それらの結果を表1に示す。
(使用材料)
QM:ジシクロペンテニルオキシエチルメタクリレート(ローム&ハース社製、「QM-657」)
BZ:ベンジルメタクリレート(共栄社化学社製、「ライトエステルBZ」)
UV-7000B:ポリウレタンアクリレートオリゴマー(日本合成化学社製、「UV-7000B」)
UV-3000B:ポリエステル系ウレタンアクリレートオリゴマー(日本合成化学社製、「UV-3000B」)
1,6-HX-A:1,6-ヘキサンジオールジアクリレート(共栄社化学社製、「ライトアクリレート 1,6-HX-A」)
M-5300:ω-カルボキシ-ポリカプロラクトンモノアクリレート(東亜合成社製、「アロニックスM-5300」)
M-5710:2-ヒドロキシ-3-フェノキシプロピルアクリレート(東亜合成社製、「アロニックスM-5710」)
Quintone1500:シクロペンタジエン骨格樹脂(日本ゼオン社製、「Quintone1500」、エステル基を含有し、軟化点が125℃であり、数平均分子量が470である。)
BDK:ベンジルジメチルケタール(チバ・スペシャルティ・ジャパン社製、「IRGACURE651」)
加熱処理を表2に示す温度で行ったこと以外は実験例I-1と同様にして硬化性組成物を作製した。得られた硬化性組成物に関して、実験例I-1と同様に評価を行った。それらの結果を表2に示す。なお、実験例II-1の加熱処理温度の「-」は、加熱処理を行わなかったことを意味する。
表2に示す種類の原材料を表2に示す組成で行ったこと以外は実験例I-1と同様にして硬化性組成物を作製した。得られた硬化性組成物に関して、実験例I-1と同様に評価を行った。それらの結果を表2に示す。
IBX:イソボルニルメタクリレート(共栄社化学社製、「ライトエステルIB-X」)
その結果、実験例II-1は加熱処理せずにダイシングを行ったため、ダイシング時に保護膜が剥離してしまった。また、実験例II-2では、ダイシング時は保護膜が剥離せずに保持していたが、加熱処理の温度が高すぎたため、剥離性が低下してしまい、その後温水剥離することができなかった。
本発明は、前記硬化性組成物を用いて被加工材の表面に保護膜を設けるものである。本発明は、例えば送り速度が2mm/sec以下の条件でダイシングを行っても、加工時に保護膜が脱落しないという効果が得られる。
上記のような効果が得られることから、本発明は、工学部品、センサー等の電子、電気部品の加工、特に切断、研削、研磨等の精密加工等の産業で有用である。
Claims (6)
- 下記(A)、(B)及び(C)を含有する硬化性組成物から形成される硬化体からなる保護膜を被加工材の表面に積層する積層工程と、積層工程後に80~150℃に加熱処理する加熱工程と、加熱工程後に被加工材を加工する加工工程とを有することを特徴とする、被加工材の表面に保護膜を積層する被加工材の表面保護方法。
(A)多官能(メタ)アクリレート
(B)単官能(メタ)アクリレート
(C)光重合開始剤 - 前記保護膜が、(D)シクロペンタジエン骨格を有する樹脂を含有する請求項1に記載の被加工材の表面保護方法。
- 前記(D)シクロペンタジエン骨格を含有する樹脂が、分子内にエステル基又は水酸基を含有する請求項2に記載の被加工材の表面保護方法。
- 前記(A)多官能(メタ)アクリレートと、前記(B)単官能(メタ)アクリレートとが、いずれも疎水性である請求項1乃至3のいずれか一項に記載の被加工材の表面保護方法。
- 前記硬化性組成物が、(A)と(B)との合計量100質量部中、(A)多官能(メタ)アクリレートを5~50質量部と(B)単官能(メタ)アクリレートを50~95質量部とを含有し、(A)と(B)との合計量100質量部に対して、(C)光重合開始剤を0.1~20質量部と(D)シクロペンタジエン骨格を有する樹脂を0.1~50質量部とを含有する請求項2乃至4のいずれか一項に記載の被加工材の表面保護方法。
- 下記(A)、(B)及び(C)を含有する硬化性組成物から形成される硬化体からなる保護膜を被加工材の表面に積層する積層工程と、積層工程後に80~150℃に加熱処理する加熱工程と、加熱工程後に被加工材の加工を行う加工工程と、加工工程後に被加工材を90℃以下の温水に浸漬して前記保護膜を前記被加工材から取り外す取り外し工程とを有することを特徴とする、被加工材の表面に保護膜を積層する被加工材の仮固定方法。
(A)多官能(メタ)アクリレート
(B)単官能(メタ)アクリレート
(C)光重合開始剤
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JP2011155112A (ja) * | 2010-01-27 | 2011-08-11 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP2012033788A (ja) * | 2010-08-02 | 2012-02-16 | Denki Kagaku Kogyo Kk | 板状被削物の加工及び剥離方法 |
WO2018159110A1 (ja) * | 2017-02-28 | 2018-09-07 | デクセリアルズ株式会社 | 積層体の製造方法、及び光硬化性樹脂組成物 |
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JP2004119780A (ja) * | 2002-09-27 | 2004-04-15 | Nitto Denko Corp | 半導体ウエハの加工方法 |
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