WO2009139357A1 - Procédé de protection de surface de métal à traiter et procédé de fixation temporaire - Google Patents

Procédé de protection de surface de métal à traiter et procédé de fixation temporaire Download PDF

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Publication number
WO2009139357A1
WO2009139357A1 PCT/JP2009/058783 JP2009058783W WO2009139357A1 WO 2009139357 A1 WO2009139357 A1 WO 2009139357A1 JP 2009058783 W JP2009058783 W JP 2009058783W WO 2009139357 A1 WO2009139357 A1 WO 2009139357A1
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WIPO (PCT)
Prior art keywords
meth
acrylate
workpiece
protective film
mass
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PCT/JP2009/058783
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English (en)
Japanese (ja)
Inventor
剛介 中島
貴之 南雲
和宏 大島
Original Assignee
電気化学工業株式会社
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Application filed by 電気化学工業株式会社 filed Critical 電気化学工業株式会社
Priority to CN200980117146.1A priority Critical patent/CN102026807B/zh
Priority to JP2010511972A priority patent/JP5507451B2/ja
Publication of WO2009139357A1 publication Critical patent/WO2009139357A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0017—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor characterised by the choice of the material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0065—Heat treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the present invention relates to a surface protection method and a temporary fixing method of the workpiece when processing various materials. More specifically, the present invention provides a protective film made of a curable composition (hereinafter sometimes referred to as a cured body) on the surface of a workpiece when processing an optical member, a semiconductor wafer, or the like.
  • a method for protecting the surface of a workpiece which is intended to protect a portion not to be processed from foreign matter adhesion or scratches during processing, is presented.
  • the present invention is to collect the workpiece by bonding the workpiece to the base material, processing the workpiece, immersing the bonded portion in warm water, and removing the protective film.
  • a characteristic method of temporarily fixing the workpiece is also presented.
  • a surface protective film that temporarily protects components is widely used.
  • a pressure-sensitive adhesive sheet is mainly used.
  • the back surface grinding method protects the circuit surface of the wafer and the non-processed surface of the optical component with the surface protection sheet, and temporarily fixes the substrate to the substrate via the surface protection sheet, and grinds the back surface opposite to the circuit surface. It is a method to do.
  • the pressure-sensitive adhesive surface protection sheet currently in use has a limit in the ability to follow the irregularities of the circuit of the semiconductor wafer. For this reason, contamination due to the ingress of the grinding liquid between the wafer and the surface protective layer often becomes a problem.
  • a typical semiconductor surface protection sheet cannot follow protrusions of 100 ⁇ m or more typified by bumps, causing a problem of contamination and chip jumping. there were.
  • Conventional surface protective sheets are generally sheets having a pressure-sensitive adhesive layer as a surface protective layer on a polymer film material, and the pressure-sensitive adhesive is designed to have a low elastic modulus so as to follow the irregularities of the circuit surface. .
  • the elastic modulus is too low, a large stress is applied to the wafer when the sheet is peeled off from the wafer, leading to damage of the wafer.
  • an energy ray easily peelable protective sheet that cures the pressure-sensitive adhesive by irradiating energy rays such as ultraviolet rays before peeling the sheet, and reduces the adhesive force between the wafer and the protective sheet.
  • the pressure-sensitive adhesive layer is in an uncured state during grinding, and there is a problem that the wafer is damaged during grinding because it is too soft.
  • Patent Document 1 discloses a wafer grinding method in which the energy ray easy-peelable protective sheet as described above is attached to a wafer on which a circuit is formed, and the adhesive layer is cured with energy rays, and then the back surface of the wafer is ground. ing.
  • the pressure-sensitive adhesive is not a fluid, the followability to the unevenness of the wafer circuit surface is not sufficient.
  • Patent Document 2 discloses a hot-melt type semiconductor surface protective sheet.
  • a hot-melt type sheet that melts and exhibits fluidity when heated to 60 to 100 ° C. can follow the unevenness of the circuit surface and exhibit excellent grindability.
  • this sheet has the property of melting whenever the temperature exceeds the melting point.
  • the present inventor has specified a specific material as a composition that has sufficient followability to the unevenness of the circuit surface of a wafer or optical component and has sufficient rigidity as a support during grinding.
  • the resin composition which consists of resin containing a (meth) acryl monomer is proposed (refer patent document 3 and 4).
  • the resin composition is effective for surface protection during back grinding.
  • a resin composition whose surface is completely cured during surface protection. This is because the surface may not be completely cured if it is subjected to polymerization inhibition by oxygen during surface protection during surface grinding / cutting.
  • Patent Document 5 does not describe provision of a heating process in which a protective film is provided on the surface of a workpiece using the resin composition and heat treatment is performed at 80 to 150 ° C. Further, when a heating step is provided, there is no description that the protective film does not fall off during processing even if dicing is performed.
  • the present inventor conducted a heat treatment of the protective film after providing a protective film made of the curable composition on the surface of the processed material, and then processed the workpiece.
  • the inventors have obtained knowledge that the surface of the workpiece can be protected without dropping the protective film during processing, and have completed the present invention.
  • the present invention provides a method for protecting a surface of a workpiece by providing a protective film made of a curable composition on the surface of the workpiece, and after the protective film is laminated on the surface of the workpiece, the protective film is heat-treated.
  • a protective film made of a curable composition is provided on the surface of the workpiece, and after the heat treatment, the workpiece is processed, and then immersed in warm water of 90 ° C. or less.
  • a method for temporarily fixing a workpiece comprising removing a protective film made of a curable composition from the workpiece.
  • the present invention includes a laminating step of laminating a protective film formed of a curable composition containing the following (A), (B) and (C) on the surface of a workpiece, and 80 after the laminating step.
  • a method for protecting a surface of a workpiece by laminating a protective film on the surface of the workpiece, comprising: a heating step of heat-treating to 150 ° C; and a processing step of processing the workpiece after the heating step. is there.
  • the said protective film contains resin which has (D) cyclopentadiene frame
  • the (D) resin containing a cyclopentadiene skeleton is a method for protecting the surface of the workpiece, wherein the molecule contains an ester group or a hydroxyl group.
  • the (A) polyfunctional (meth) acrylate and the (B) monofunctional (meth) acrylate are both hydrophobic methods for protecting the surface of the workpiece.
  • the curable composition comprises 5 to 50 parts by mass of (A) polyfunctional (meth) acrylate and (B) monofunctional (meth) acrylate in 100 parts by mass of the total amount of (A) and (B). And (C) 0.1-20 parts by weight of a photopolymerization initiator and (D) cyclopentadiene with respect to 100 parts by weight of the total amount of (A) and (B).
  • a method for protecting a surface of a workpiece comprising 0.1 to 50 parts by mass of a resin having a skeleton.
  • a laminating step of laminating a protective film made of a cured product formed from a curable composition containing the following (A), (B) and (C) on the surface of the workpiece, and 80 to 150 after the laminating step A heating step in which heat treatment is performed at a temperature of C; a processing step in which the workpiece is processed after the heating step; and a removal in which the workpiece is immersed in warm water of 90 ° C. or less after the processing step to remove the protective film from the workpiece A temporary fixing method for a workpiece, wherein a protective film is laminated on the surface of the workpiece.
  • B) Monofunctional (meth) acrylate C) Photopolymerization initiator
  • the method for protecting the surface of a workpiece according to the present invention is effective in that the protective film does not fall off even if processing such as dicing is performed, and scratches or foreign matter on the processed surface, circuit, sensor site, etc. of the workpiece Adhesion can be prevented.
  • a protective film formed from a curable composition is provided on the surface of a workpiece, and then the protective film is heated to 80 to 150 ° C., and then the workpiece is processed.
  • This is a method for protecting the surface of a workpiece, characterized in that the protective film is prevented from falling off.
  • the temperature of the heat treatment is preferably 80 to 150 ° C., more preferably 90 to 120 ° C. from the viewpoint of maintaining the peelability of the protective film. If it is 80 degreeC or more, the effect by heat processing will be acquired, and if it is 150 degrees C or less, peelability is favorable.
  • the curable composition used as a protective film in the present invention includes (A) polyfunctional (meth) acrylate, (B) monofunctional (meth) acrylate, (C) photopolymerization initiator, and (D) cyclohexane. It is preferable to contain a resin containing a pentadiene skeleton in order to obtain the effects of the present invention.
  • the polyfunctional (meth) acrylate oligomer / polymer / monomer having two or more (meth) acryloyl groups can be used as the (A) polyfunctional (meth) acrylate used in the curable composition.
  • the polyfunctional (meth) acrylate oligomer / polymer 1,2-polybutadiene-terminated urethane (meth) acrylate (for example, “TE-2000”, “TEA-1000” manufactured by Nippon Soda Co., Ltd.), the hydrogenated product ( For example, Nippon Soda Co., Ltd., “TEAI-1000”), 1,4-polybutadiene terminated urethane (meth) acrylate (for example, “BAC-45” manufactured by Osaka Organic Chemical Co., Ltd.), polyisoprene terminated (meth) acrylate, polyurethane Acrylate (for example, “UV-7000B” manufactured by Nippon Gosei Co., Ltd.), polyester
  • 1,2-polybutadiene-terminated urethane (meth) acrylate one or two or more selected from the group consisting of 1,2-polybutadiene-terminated urethane (meth) acrylate, polyurethane acrylate oligomer, and polyester-based urethane acrylate oligomer is preferable in that the effect of peelability is great.
  • 1,2-polybutadiene terminated urethane (meth) acrylate is more preferred.
  • bifunctional (meth) acrylate monomers include 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9 -Nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol (meth) acrylate, neopentyl glycol modified trimethylolpropane Di (meth) acrylate, stearic acid-modified pentaerythritol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis (meth) a Lilo propoxy
  • Examples of the tetra- or higher functional (meth) acrylate monomer include dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerystol penta (meth) acrylate, and dipenta Examples include erythritol hexa (meth) acrylate.
  • dicyclopentanyl di (meth) acrylate and / or 1,6-hexanediol di (meth) acrylate is preferable and dicyclopentanyl di (meth) acrylate is preferable in that the effect of peelability is large. More preferred.
  • polyfunctional (meth) acrylates polyfunctional (meth) acrylate oligomers / polymers having two or more (meth) acryloyl groups and bifunctional (meth) acrylates in terms of a large effect of peelability It is preferable to use a monomer together.
  • the mixing ratio (mass ratio) of the polyfunctional (meth) acrylate oligomer / polymer having two or more (meth) acryloyl groups and the bifunctional (meth) acrylate monomer is 30 to 30 100: 70 to 0 is preferable, and 50 to 65:50 to 35 is more preferable.
  • the hydrophobic (A) polyfunctional (meth) acrylate used in the present invention is more preferable.
  • hydrophobicity it is possible to prevent a phenomenon that tends to occur when it is water-soluble, that is, a phenomenon in which the cured product of the curable composition swells during processing to cause displacement and poor processing accuracy.
  • the hydrophobic polyfunctional (meth) acrylate refers to (meth) acrylate having no hydroxyl group.
  • the above-mentioned polyfunctional (meth) acrylates can be mentioned.
  • one or more selected from the group consisting of 1,2-polybutadiene-terminated urethane (meth) acrylate, 1,6-hexadiol di (meth) acrylate and dicyclopentanyl di (meth) acrylate Is preferred. Even if it is hydrophilic, it can be used as long as the cured product of the curable composition is not greatly swollen or partially dissolved by water.
  • the amount of (A) polyfunctional (meth) acrylate used is preferably 5 to 50 parts by mass, preferably 20 to 40 parts by mass in 100 parts by mass of the total amount of (A) and the later-described (B) monofunctional (meth) acrylate component. Part is more preferred. If it is 5 parts by mass or more, it is possible to prevent the peelability from decreasing or the cured product of the curable composition from becoming a film, and if it is 50 parts by mass or more, the shrinkage of curing increases and the initial adhesiveness. There is no fear that it will fall.
  • Examples of the (B) monofunctional (meth) acrylate monomer used in the curable composition include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl ( (Meth) acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (Meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth)
  • -(1,2-cyclohexanedicarboximido) ethyl (meth) acrylate and / or phenol ethylene oxide 2 molar modified (meth) acrylate is more preferred.
  • the mixing ratio (mass ratio) of phenol ethylene oxide 2 mol-modified (meth) acrylate and 2- (1,2-cyclohexanedicarboximido) ethyl (meth) acrylate is 20 to 20 70:80 to 30 is preferable, and 30 to 45:70 to 55 is more preferable.
  • the monofunctional (meth) acrylate is preferably hydrophobic as in the case of the component (A).
  • hydrophobic means (meth) acrylate having no hydroxyl group.
  • hydrophobicity it is possible to prevent a phenomenon that tends to occur when water-soluble, that is, a phenomenon in which the cured product of the curable composition swells during processing to cause displacement and poor processing accuracy. Even if it is hydrophilic, it may be used as long as the cured product of the curable composition does not swell or partially dissolve with water.
  • the amount of the (B) monofunctional (meth) acrylate used is preferably 50 to 95 parts by mass, more preferably 60 to 80 parts by mass in 100 parts by mass of the total amount of the component (A) and the component (B). If it is 50 parts by mass or more, the initial adhesiveness is not likely to be lowered, and if it is 95 parts by mass or less, the peelability is not lowered, and a cured product of the curable composition is obtained in a film form.
  • the (A) component and the (B) component of the above composition are further added to (meth) acryloyloxyethyl acid phosphate, dibutyl 2- (meth) acryloyloxyethyl acid phosphate, dioctyl 2- (meth) acryloyloxyethyl phosphate
  • phosphate ester having vinyl group or (meth) acryloyl group such as
  • the (C) photopolymerization initiator used in the curable composition is used for sensitizing with actinic rays of visible light or ultraviolet rays to promote photocuring of the curable composition, and is known in the art. Various photopolymerization initiators can be used.
  • the amount of the photopolymerization initiator used is preferably 0.1 to 20 parts by mass, and more preferably 3 to 10 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). If it is 0.1 part by mass or more, the effect of promoting curing can be reliably obtained, and if it is 20 parts by mass or less, a sufficient curing rate can be achieved. As a more preferable form, it can harden
  • the resin having a cyclopentadiene skeleton used in the present invention may be any resin having a cyclopentadiene skeleton, but the softening point is preferably 50 to 200 ° C., and the number average molecular weight (Mn) Is preferably from 300 to 600 in terms of solubility in the component (A) and the component (B).
  • the softening point was measured according to JIS K 2207 ring and ball system.
  • the number average molecular weight was measured according to GPC (gel permeation chromatography) polystyrene conversion value.
  • Examples of (D) include petroleum resins produced using cyclopentadiene extracted from the C5 fraction as a main raw material.
  • the amount of the resin having a cyclopentadiene skeleton is preferably 0.5 to 50 parts by mass and more preferably 5 to 30 parts by mass with respect to 100 parts by mass of the total amount of component (A) and component (B). preferable. If the amount is 0.5 parts by mass or more, no adhesive remains without forming a film, and if it is 50 parts by mass or less, the adhesiveness does not decrease.
  • polymerization inhibitors include methyl hydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol), catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2,5-ditertiary butyl Hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiarybutyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary butylcatechol, 2-butyl-4-hydroxyanisole, and Examples include 2,6-ditertiary butyl-p-cresol.
  • one or more of the group consisting of 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), hydroquinone monomethyl ether and p-benzoquinone are preferred, More preferred is methylene-bis (4-methyl-6-tertiary butylphenol).
  • the amount of these polymerization inhibitors used is preferably 0.001 to 3 parts by mass, and more preferably 0.01 to 2 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). If it is 0.001 part by mass or more, the storage stability is sufficient, and if it is 3 parts by mass or less, reliable adhesiveness is obtained and there is no possibility of becoming uncured.
  • the curable composition used in the present invention includes various elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic fillers, solvents, extenders, Additives such as reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants, silane coupling agents and surfactants may be used.
  • elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic fillers, solvents, extenders, Additives such as reinforcing materials, plasticizers, thickeners, dyes, pigments, flame retardants, silane coupling agents and surfactants may be used.
  • the present invention provides a protective film made of the above curable composition on the surface of the workpiece, heat-treats the protective film, and then processes the workpiece to prevent the protective film from falling off during processing.
  • a protective film is provided by applying a curable composition having a thickness of 20 to 200 ⁇ m, preferably 50 to 150 ⁇ m, on the surface of the workpiece, and the wavelength is 365 nm. integrated quantity of light 1000 ⁇ 4000mJ / cm 2, preferably preferred curing under the conditions of 1500 ⁇ 3000mJ / cm 2.
  • a step of heat-treating the protective film at 80 to 150 ° C., preferably 80 to 120 ° C., for 5 to 30 minutes is preferable.
  • the processing step for processing the workpiece after the heating step includes a rotational speed of 5000 to 40000 rpm, preferably 10,000 to 35000 rpm, a feed rate of 0.2 to 50 mm / sec, preferably 0.5 to 30 mm / sec, a chip size of 0.
  • a step of dicing under conditions of 5 to 15 mm square is preferable.
  • a protective film made of a curable composition is provided on the surface of the work material, and after heat treatment, the work material is processed, and then hot water of 70 to 90 ° C. or less, preferably 75.
  • a method for temporarily fixing a workpiece comprising a step of removing the protective film made of the curable composition from the workpiece by immersing in warm water at ⁇ 85 ° C.
  • Experimental Examples I-1 to I-15 are examples of the present invention
  • Experimental Examples II-1 to II-5 are comparative examples.
  • (Experimental Example I-1) As polyfunctional (meth) acrylate, “TE-2000” (1,2-polybutadiene-terminated urethane methacrylate, hereinafter abbreviated as “TE-2000”) manufactured by Nippon Soda Co., Ltd., dicyclopentanyl di 15 parts by mass of acrylate (manufactured by Nippon Kayaku Co., Ltd., “KAYARAD R-684”, hereinafter abbreviated as “R-684”), (B) 2- (1,2-cyclohexanedicarboxy as monofunctional (meth) acrylate 40 parts by mass of imido) ethyl acrylate (Toa Gosei Co., Ltd., “Aronix M-140
  • Adhesive strength (tensile shear adhesive strength): The bond strength (tensile shear bond strength) was measured according to JIS K 6850. Specifically, heat-resistant Pyrex (registered trademark) glass (25 mm ⁇ 25 mm ⁇ 2.0 mm (length ⁇ width ⁇ thickness)) was used as the adherend.
  • the adhesion site is a circle with a diameter of 8 mm and a thickness of 100 ⁇ m, and two heat-resistant Pyrex (registered trademark) glasses are bonded together with the prepared curable composition, and a fusion device manufactured by Fusion, using an electrodeless discharge lamp, Curing was performed under the condition of an integrated light amount of 2000 mJ / cm 2 with a wavelength of 365 nm to prepare a tensile shear bond strength test piece.
  • the prepared test piece was measured for tensile shear bond strength at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50% using a universal testing machine.
  • adhesion test Status of holding protective film after dicing (adhesion test): The adhesion test was performed in an environment of a temperature of 23 ° C. and a humidity of 50%. A curable composition is applied to a silicon wafer with a thickness of 100 ⁇ m, and the curable composition is cured under a condition of an integrated light amount of 2000 mJ / cm 2 with a wavelength of 365 nm by a curing device manufactured by Fusion Corporation using an electrodeless discharge lamp. Thus, a protective film was produced. Then, after heat-treating the protective film at 100 ° C.
  • dicing is performed under the conditions of a rotation speed of 30000 rpm, a feed rate of 1.0 mm / sec, and a chip size of 1 mm square, and observation is made whether the protective film is retained after dicing. did. Of the 25 chips, the number of chips holding the protective film was measured.
  • peeling test About the test body in which the protective film was hold
  • QM Dicyclopentenyloxyethyl methacrylate (Rohm & Haas, “QM-657”)
  • BZ benzyl methacrylate (manufactured by Kyoeisha Chemical Co., “Light Ester BZ”)
  • UV-7000B Polyurethane acrylate oligomer (manufactured by Nippon Synthetic Chemical Co., Ltd., “UV-7000B”)
  • UV-3000B Polyester urethane acrylate oligomer (manufactured by Nippon Synthetic Chemical Co., Ltd., “UV-3000B”)
  • 1,6-HX-A 1,6-hexanediol diacrylate (manufactured by Kyoeisha Chemical Co., Ltd., “Light acrylate 1,6-HX-A”)
  • M-5300 ⁇ -carboxy-polycaprolactone monoacrylate (manufactured by Toa Gosei Co., Ltd., “
  • Example II-1 and II-2 A curable composition was prepared in the same manner as in Experimental Example I-1, except that the heat treatment was performed at the temperature shown in Table 2. The obtained curable composition was evaluated in the same manner as in Experimental Example I-1. The results are shown in Table 2. In addition, “ ⁇ ” of the heat treatment temperature in Experimental Example II-1 means that the heat treatment was not performed.
  • the protective film is provided on the surface of the workpiece, the protective film is heat-treated, and then the workpiece is processed to prevent the protective film from falling off during processing. It is possible to protect the surface of the workpiece from contamination and contamination. Moreover, since the curable composition of the present invention has sufficient followability to irregularities on the surface such as a circuit surface, the surface is protected not only from smooth surfaces but also from irregularities to scratches and contamination. It is possible.
  • the protective film of the present invention can be recovered from the workpiece in the form of a film by immersing it in warm water of 90 ° C. or less after the workpiece is processed, an effect of excellent workability can be obtained. Furthermore, it is not necessary to use an organic solvent that is indispensable for conventional adhesives, and the effect of reducing the environmental load can be obtained.
  • a protective film is provided on the surface of a workpiece using the curable composition. In the present invention, for example, even if dicing is performed under a condition where the feed rate is 2 mm / sec or less, an effect that the protective film does not fall off during processing can be obtained.
  • the surface protection method of the present invention has a protective film made of a curable composition that has photocurability because of its composition, and is cured by visible light or ultraviolet light. Therefore, it saves labor and energy compared to conventional hot melt adhesives. A remarkable effect can be obtained in terms of speed and work shortening.
  • a heat treatment process is performed to reduce internal strain of the protective film, and the protective film is prevented from falling off in the subsequent machining process of the workpiece. Can do.
  • the protective film can exhibit high adhesive strength without affecting the cutting fluid used at the time of processing, and the work material can be removed from the entrance of the cutting fluid, scratches due to cutting waste, etc. The surface can be protected. Since the effects as described above are obtained, the present invention is useful in industries such as engineering parts, processing of electronic parts such as sensors, and electrical parts, particularly precision processing such as cutting, grinding, and polishing.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

L'invention concerne un procédé de protection de surface pouvant empêcher le décollement d'un film protecteur même lorsqu'on exécute un traitement, tel qu'un découpage en dés. De manière plus spécifique, l'invention concerne un procédé pour protéger la surface d'une matière à traiter par stratification d'un film protecteur sur la surface de ladite matière.  Ledit procédé est caractérisé en ce qu'il comprend : une étape de stratification du film protecteur sur la surface de la matière, ledit film protecteur étant composé d'une matière durcie formée à partir d'une composition durcissable qui comprend : (A) un (meth)acrylate polyfonctionnel, (B) un (meth)acrylate monofonctionnel et (C) un initiateur de photopolymérisation; puis une étape de chauffage du produit stratifié à 80-150°C; et une étape de traitement de la matière.  Le film protecteur contient, de préférence, en plus (D) une résine dotée d'un squelette de cyclopentadiène.
PCT/JP2009/058783 2008-05-12 2009-05-11 Procédé de protection de surface de métal à traiter et procédé de fixation temporaire WO2009139357A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980117146.1A CN102026807B (zh) 2008-05-12 2009-05-11 被加工件的表面保护方法和临时固定方法
JP2010511972A JP5507451B2 (ja) 2008-05-12 2009-05-11 被加工材の仮固定方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-125321 2008-05-12
JP2008125321 2008-05-12

Publications (1)

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WO2009139357A1 true WO2009139357A1 (fr) 2009-11-19

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KR (1) KR101555729B1 (fr)
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WO (1) WO2009139357A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155112A (ja) * 2010-01-27 2011-08-11 Disco Abrasive Syst Ltd ウェーハの加工方法
JP2012033788A (ja) * 2010-08-02 2012-02-16 Denki Kagaku Kogyo Kk 板状被削物の加工及び剥離方法
WO2018159110A1 (fr) * 2017-02-28 2018-09-07 デクセリアルズ株式会社 Procédé de fabrication de corps stratifié et composition de résine photodurcissable

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Publication number Priority date Publication date Assignee Title
KR102494902B1 (ko) * 2017-02-02 2023-02-01 쇼와덴코머티리얼즈가부시끼가이샤 전자 부품의 제조 방법, 가보호용 수지 조성물 및 가보호용 수지 필름
KR102236041B1 (ko) * 2019-07-23 2021-04-05 주식회사 한솔케미칼 양자점 광학 필름 및 이에 포함되는 양자점 조성물

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JP2004119780A (ja) * 2002-09-27 2004-04-15 Nitto Denko Corp 半導体ウエハの加工方法
WO2007080936A1 (fr) * 2006-01-13 2007-07-19 Denki Kagaku Kogyo Kabushiki Kaisha Composition de resine durcissable, procede de protection de surface, procede de fixation temporaire et procede de separation
JP2007186587A (ja) * 2006-01-13 2007-07-26 Denki Kagaku Kogyo Kk 樹脂組成物及びそれを用いる被加工部材の仮固定方法と表面保護方法
JP2008069255A (ja) * 2006-09-14 2008-03-27 Denki Kagaku Kogyo Kk 被加工物に被覆した保護膜の剥離方法

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JP4376610B2 (ja) * 2003-12-18 2009-12-02 株式会社きもと 表面保護膜およびこれを用いた表面保護フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119780A (ja) * 2002-09-27 2004-04-15 Nitto Denko Corp 半導体ウエハの加工方法
WO2007080936A1 (fr) * 2006-01-13 2007-07-19 Denki Kagaku Kogyo Kabushiki Kaisha Composition de resine durcissable, procede de protection de surface, procede de fixation temporaire et procede de separation
JP2007186587A (ja) * 2006-01-13 2007-07-26 Denki Kagaku Kogyo Kk 樹脂組成物及びそれを用いる被加工部材の仮固定方法と表面保護方法
JP2008069255A (ja) * 2006-09-14 2008-03-27 Denki Kagaku Kogyo Kk 被加工物に被覆した保護膜の剥離方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155112A (ja) * 2010-01-27 2011-08-11 Disco Abrasive Syst Ltd ウェーハの加工方法
JP2012033788A (ja) * 2010-08-02 2012-02-16 Denki Kagaku Kogyo Kk 板状被削物の加工及び剥離方法
WO2018159110A1 (fr) * 2017-02-28 2018-09-07 デクセリアルズ株式会社 Procédé de fabrication de corps stratifié et composition de résine photodurcissable
JP2018140601A (ja) * 2017-02-28 2018-09-13 デクセリアルズ株式会社 積層体の製造方法、及び光硬化性樹脂組成物

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JP5507451B2 (ja) 2014-05-28
CN102026807B (zh) 2014-05-21
JPWO2009139357A1 (ja) 2011-09-22
KR20110008180A (ko) 2011-01-26
CN102026807A (zh) 2011-04-20

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