KR101555729B1 - 피가공재의 표면 보호 방법 및 가고정 방법 - Google Patents

피가공재의 표면 보호 방법 및 가고정 방법 Download PDF

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Publication number
KR101555729B1
KR101555729B1 KR1020107023157A KR20107023157A KR101555729B1 KR 101555729 B1 KR101555729 B1 KR 101555729B1 KR 1020107023157 A KR1020107023157 A KR 1020107023157A KR 20107023157 A KR20107023157 A KR 20107023157A KR 101555729 B1 KR101555729 B1 KR 101555729B1
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KR
South Korea
Prior art keywords
meth
acrylate
processed
parts
protective film
Prior art date
Application number
KR1020107023157A
Other languages
English (en)
Korean (ko)
Other versions
KR20110008180A (ko
Inventor
고스케 나카지마
다카유키 나구모
가즈히로 오시마
Original Assignee
덴끼 가가꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 덴끼 가가꾸 고교 가부시키가이샤 filed Critical 덴끼 가가꾸 고교 가부시키가이샤
Publication of KR20110008180A publication Critical patent/KR20110008180A/ko
Application granted granted Critical
Publication of KR101555729B1 publication Critical patent/KR101555729B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0017—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor characterised by the choice of the material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0065—Heat treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020107023157A 2008-05-12 2009-05-11 피가공재의 표면 보호 방법 및 가고정 방법 KR101555729B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-125321 2008-05-12
JP2008125321 2008-05-12

Publications (2)

Publication Number Publication Date
KR20110008180A KR20110008180A (ko) 2011-01-26
KR101555729B1 true KR101555729B1 (ko) 2015-09-25

Family

ID=41318725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107023157A KR101555729B1 (ko) 2008-05-12 2009-05-11 피가공재의 표면 보호 방법 및 가고정 방법

Country Status (4)

Country Link
JP (1) JP5507451B2 (ja)
KR (1) KR101555729B1 (ja)
CN (1) CN102026807B (ja)
WO (1) WO2009139357A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155112A (ja) * 2010-01-27 2011-08-11 Disco Abrasive Syst Ltd ウェーハの加工方法
JP2012033788A (ja) * 2010-08-02 2012-02-16 Denki Kagaku Kogyo Kk 板状被削物の加工及び剥離方法
KR102494902B1 (ko) * 2017-02-02 2023-02-01 쇼와덴코머티리얼즈가부시끼가이샤 전자 부품의 제조 방법, 가보호용 수지 조성물 및 가보호용 수지 필름
JP6938168B2 (ja) * 2017-02-28 2021-09-22 デクセリアルズ株式会社 積層体の製造方法、及び光硬化性樹脂組成物
KR102236041B1 (ko) * 2019-07-23 2021-04-05 주식회사 한솔케미칼 양자점 광학 필름 및 이에 포함되는 양자점 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119780A (ja) 2002-09-27 2004-04-15 Nitto Denko Corp 半導体ウエハの加工方法
JP2007186587A (ja) 2006-01-13 2007-07-26 Denki Kagaku Kogyo Kk 樹脂組成物及びそれを用いる被加工部材の仮固定方法と表面保護方法
JP2008069255A (ja) 2006-09-14 2008-03-27 Denki Kagaku Kogyo Kk 被加工物に被覆した保護膜の剥離方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4376610B2 (ja) * 2003-12-18 2009-12-02 株式会社きもと 表面保護膜およびこれを用いた表面保護フィルム
CN102161732B (zh) * 2006-01-13 2012-11-21 电气化学工业株式会社 固化性树脂组合物、表面保护方法、临时固定方法及剥离方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119780A (ja) 2002-09-27 2004-04-15 Nitto Denko Corp 半導体ウエハの加工方法
JP2007186587A (ja) 2006-01-13 2007-07-26 Denki Kagaku Kogyo Kk 樹脂組成物及びそれを用いる被加工部材の仮固定方法と表面保護方法
JP2008069255A (ja) 2006-09-14 2008-03-27 Denki Kagaku Kogyo Kk 被加工物に被覆した保護膜の剥離方法

Also Published As

Publication number Publication date
JP5507451B2 (ja) 2014-05-28
CN102026807B (zh) 2014-05-21
WO2009139357A1 (ja) 2009-11-19
JPWO2009139357A1 (ja) 2011-09-22
KR20110008180A (ko) 2011-01-26
CN102026807A (zh) 2011-04-20

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