WO2009054387A1 - 被覆導電性粉体およびそれを用いた導電性接着剤 - Google Patents
被覆導電性粉体およびそれを用いた導電性接着剤 Download PDFInfo
- Publication number
- WO2009054387A1 WO2009054387A1 PCT/JP2008/069068 JP2008069068W WO2009054387A1 WO 2009054387 A1 WO2009054387 A1 WO 2009054387A1 JP 2008069068 W JP2008069068 W JP 2008069068W WO 2009054387 A1 WO2009054387 A1 WO 2009054387A1
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- WO
- WIPO (PCT)
- Prior art keywords
- coated
- conductive
- powder
- conductive powder
- coated conductive
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
- Y10T428/2996—Glass particles or spheres
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Chemically Coating (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009538219A JP5363989B2 (ja) | 2007-10-22 | 2008-10-21 | 被覆導電性粉体およびそれを用いた導電性接着剤。 |
CN2008801128024A CN101836266B (zh) | 2007-10-22 | 2008-10-21 | 包覆导电性粉体以及使用该包覆导电性粉体的导电性粘合剂 |
KR1020107008701A KR101404274B1 (ko) | 2007-10-22 | 2008-10-21 | 피복 도전성 분체 및 그것을 이용한 도전성 접착제 |
US12/738,029 US8124232B2 (en) | 2007-10-22 | 2008-10-21 | Coated conductive powder and conductive adhesive using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007273551 | 2007-10-22 | ||
JP2007-273551 | 2007-10-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054387A1 true WO2009054387A1 (ja) | 2009-04-30 |
Family
ID=40579491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/069068 WO2009054387A1 (ja) | 2007-10-22 | 2008-10-21 | 被覆導電性粉体およびそれを用いた導電性接着剤 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8124232B2 (ja) |
JP (1) | JP5363989B2 (ja) |
KR (1) | KR101404274B1 (ja) |
CN (1) | CN101836266B (ja) |
TW (1) | TWI452577B (ja) |
WO (1) | WO2009054387A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102222535A (zh) * | 2010-01-29 | 2011-10-19 | 日本化学工业株式会社 | 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法 |
JP2015133301A (ja) * | 2014-01-15 | 2015-07-23 | 日本化学工業株式会社 | 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体 |
JP2015189777A (ja) * | 2014-03-27 | 2015-11-02 | スリーボンドファインケミカル株式会社 | エポキシ樹脂組成物 |
JP2015195200A (ja) * | 2014-03-26 | 2015-11-05 | 積水化学工業株式会社 | 光硬化性導電材料、接続構造体及び接続構造体の製造方法 |
JP2017228533A (ja) * | 2017-07-20 | 2017-12-28 | 日本化学工業株式会社 | 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体 |
JP2018060799A (ja) * | 2017-11-07 | 2018-04-12 | 日本化学工業株式会社 | 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体 |
CN109694685A (zh) * | 2018-12-31 | 2019-04-30 | 苏州思德新材料科技有限公司 | 一种阻燃型单组份泡沫填缝剂及其制备方法 |
JPWO2018047690A1 (ja) * | 2016-09-09 | 2019-06-24 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1303175C (zh) * | 2002-09-04 | 2007-03-07 | 纳美仕有限公司 | 导电性粘接剂及使用它的电路 |
KR101402892B1 (ko) | 2007-09-11 | 2014-06-11 | 삼성디스플레이 주식회사 | 도전성 입자를 갖는 이방성 도전 접착제, 상기 도전성입자의 제조 방법, 및 상기 이방성 도전 접착제를 이용하여표시 장치를 제조하는 방법 |
JP5617210B2 (ja) | 2009-09-14 | 2014-11-05 | デクセリアルズ株式会社 | 光反射性異方性導電接着剤及び発光装置 |
US9469790B2 (en) | 2009-09-29 | 2016-10-18 | The Boeing Company | Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation |
JP5871938B2 (ja) | 2010-10-15 | 2016-03-01 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨物品 |
JP5872440B2 (ja) * | 2012-02-13 | 2016-03-01 | Dowaエレクトロニクス株式会社 | 球状銀粉およびその製造方法 |
KR20140003056A (ko) * | 2012-06-29 | 2014-01-09 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
US20140299268A1 (en) * | 2013-04-09 | 2014-10-09 | The Boeing Company | Thermally Curable Bonding Film Adhesive with Uniform Thickness |
TWI471573B (zh) * | 2013-07-04 | 2015-02-01 | Au Optronics Corp | 顯示裝置及其電路板模組 |
JP6443732B2 (ja) * | 2014-10-24 | 2018-12-26 | 日立金属株式会社 | 導電性粒子、導電性粉体、導電性高分子組成物および異方性導電シート |
CN105225721B (zh) * | 2015-08-26 | 2017-04-19 | 贵州理工学院 | 一种高导电复合金属氧化粉体材料及其制备方法 |
DE102016212508A1 (de) | 2016-07-08 | 2018-01-11 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
WO2018030184A1 (ja) * | 2016-08-10 | 2018-02-15 | 株式会社スリーボンド | エポキシ樹脂組成物およびこれを含む導電性接着剤 |
KR102650760B1 (ko) * | 2018-07-10 | 2024-03-22 | 니폰 가가쿠 고교 가부시키가이샤 | 피복 입자 |
DE102019107633A1 (de) * | 2019-03-25 | 2020-10-29 | Sphera Technology Gmbh | Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems |
CN111763931A (zh) * | 2020-07-15 | 2020-10-13 | 上海大学 | 一种镀镍玻璃微球的制备方法及制品 |
CN113462197B (zh) * | 2021-06-30 | 2022-08-09 | 常熟世名化工科技有限公司 | 一种二氧化钛水性分散体的制备方法及其产品和应用 |
CN113948235B (zh) * | 2021-12-20 | 2022-03-29 | 西安宏星电子浆料科技股份有限公司 | 一种高分散性、低收缩率的镍内电极浆料及其制备方法 |
CA3219241A1 (en) * | 2022-11-15 | 2024-05-15 | Evonik Operations Gmbh | Curable composition for production of coatings for thermal, electrical and/or acoustic insulation |
Citations (9)
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JPH04259766A (ja) * | 1991-02-14 | 1992-09-16 | Hitachi Chem Co Ltd | 回路の接続部材 |
JPH08253745A (ja) * | 1995-03-17 | 1996-10-01 | Fujitsu Ltd | 接着剤 |
WO2002035555A1 (fr) * | 2000-10-23 | 2002-05-02 | Sekisui Chemical Co., Ltd. | Particule enrobee |
WO2003025955A1 (fr) * | 2001-09-14 | 2003-03-27 | Sekisui Chemical Co., Ltd. | Particule conductrice revetue, procede de fabrication d'une particule conductrice revetue, materiau conducteur anisotrope et structure de connexion electrique |
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JP2015195200A (ja) * | 2014-03-26 | 2015-11-05 | 積水化学工業株式会社 | 光硬化性導電材料、接続構造体及び接続構造体の製造方法 |
JP2015189777A (ja) * | 2014-03-27 | 2015-11-02 | スリーボンドファインケミカル株式会社 | エポキシ樹脂組成物 |
JPWO2018047690A1 (ja) * | 2016-09-09 | 2019-06-24 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JP7284555B2 (ja) | 2016-09-09 | 2023-05-31 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JP2017228533A (ja) * | 2017-07-20 | 2017-12-28 | 日本化学工業株式会社 | 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体 |
JP2018060799A (ja) * | 2017-11-07 | 2018-04-12 | 日本化学工業株式会社 | 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体 |
CN109694685A (zh) * | 2018-12-31 | 2019-04-30 | 苏州思德新材料科技有限公司 | 一种阻燃型单组份泡沫填缝剂及其制备方法 |
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US20100221545A1 (en) | 2010-09-02 |
TW200929262A (en) | 2009-07-01 |
JPWO2009054387A1 (ja) | 2011-03-03 |
US8124232B2 (en) | 2012-02-28 |
TWI452577B (zh) | 2014-09-11 |
CN101836266A (zh) | 2010-09-15 |
JP5363989B2 (ja) | 2013-12-11 |
KR20100075521A (ko) | 2010-07-02 |
KR101404274B1 (ko) | 2014-06-05 |
CN101836266B (zh) | 2012-02-15 |
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