WO2008123087A1 - 異方性導電ペースト - Google Patents

異方性導電ペースト Download PDF

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Publication number
WO2008123087A1
WO2008123087A1 PCT/JP2008/055042 JP2008055042W WO2008123087A1 WO 2008123087 A1 WO2008123087 A1 WO 2008123087A1 JP 2008055042 W JP2008055042 W JP 2008055042W WO 2008123087 A1 WO2008123087 A1 WO 2008123087A1
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WO
WIPO (PCT)
Prior art keywords
conductive paste
anisotropic conductive
inorganic filler
solder particles
insulating inorganic
Prior art date
Application number
PCT/JP2008/055042
Other languages
English (en)
French (fr)
Inventor
Tadahiko Sakai
Hideki Eifuku
Yukinari Abe
Satomi Kawamoto
Kaori Matsumura
Original Assignee
Namics Coropration
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Coropration, Panasonic Corporation filed Critical Namics Coropration
Priority to JP2009509040A priority Critical patent/JP5491856B2/ja
Publication of WO2008123087A1 publication Critical patent/WO2008123087A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
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  • Adhesives Or Adhesive Processes (AREA)
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Abstract

　高温高湿下でも信頼性の高い電気接続を可能とする異方性導電ペースト、及び該異方性導電ペーストを用いた接続を含む半導体装置を提供する。エポキシ樹脂、イミダゾール化合物、ハンダ粒子及び絶縁性無機フィラーを含み、ハンダ粒子の平均粒子寸法よりも、絶縁性無機フィラーの平均粒子寸法が小さい、異方性導電ペーストである。
PCT/JP2008/055042 2007-03-19 2008-03-19 異方性導電ペースト WO2008123087A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509040A JP5491856B2 (ja) 2007-03-19 2008-03-19 異方性導電ペースト

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-071346 2007-03-19
JP2007071346 2007-03-19

Publications (1)

Publication Number Publication Date
WO2008123087A1 true WO2008123087A1 (ja) 2008-10-16

Family

ID=39830588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055042 WO2008123087A1 (ja) 2007-03-19 2008-03-19 異方性導電ペースト

Country Status (4)

Country Link
JP (1) JP5491856B2 (ja)
KR (1) KR20090129478A (ja)
TW (1) TWI476266B (ja)
WO (1) WO2008123087A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219507A (ja) * 2009-02-20 2010-09-30 Panasonic Corp はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法
JP2012072211A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 熱硬化性樹脂組成物及び半導体部品実装基板
CN103666297A (zh) * 2012-09-21 2014-03-26 第一毛织株式会社 各向异性导电膜和包括它的半导体装置
JP2014209624A (ja) * 2014-04-18 2014-11-06 パナソニック株式会社 回路基板と半導体部品との接合部構造
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
WO2015133343A1 (ja) * 2014-03-07 2015-09-11 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2015178482A1 (ja) * 2014-05-23 2015-11-26 デクセリアルズ株式会社 接着剤及び接続構造体
JP2015221875A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
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WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
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JP2020152789A (ja) * 2019-03-19 2020-09-24 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方性導電フィルム、並びに電子装置

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CN106062119A (zh) * 2014-03-19 2016-10-26 迪睿合株式会社 各向异性导电粘接剂
KR20160135700A (ko) * 2014-03-19 2016-11-28 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제
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US10435601B2 (en) 2014-05-23 2019-10-08 Dexerials Corporation Adhesive agent and connection structure
JP2015221875A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
WO2015178482A1 (ja) * 2014-05-23 2015-11-26 デクセリアルズ株式会社 接着剤及び接続構造体
JP2015221876A (ja) * 2014-05-23 2015-12-10 デクセリアルズ株式会社 接着剤及び接続構造体
JP2016054296A (ja) * 2014-09-01 2016-04-14 積水化学工業株式会社 接続構造体の製造方法
JPWO2017033934A1 (ja) * 2015-08-24 2017-10-12 積水化学工業株式会社 導電材料及び接続構造体
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
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JP2020152789A (ja) * 2019-03-19 2020-09-24 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方性導電フィルム、並びに電子装置
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