WO2009037833A1 - Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique - Google Patents
Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique Download PDFInfo
- Publication number
- WO2009037833A1 WO2009037833A1 PCT/JP2008/002564 JP2008002564W WO2009037833A1 WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1 JP 2008002564 W JP2008002564 W JP 2008002564W WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- printed wiring
- solid printed
- electronic component
- component module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009533045A JPWO2009037833A1 (ja) | 2007-09-21 | 2008-09-18 | 立体プリント配線板およびその製造方法ならびに電子部品モジュール |
CN200880107929A CN101803476A (zh) | 2007-09-21 | 2008-09-18 | 立体印刷布线板及其制造方法以及电子部件模块 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-244838 | 2007-09-21 | ||
JP2007244839 | 2007-09-21 | ||
JP2007-244839 | 2007-09-21 | ||
JP2007244838 | 2007-09-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009037833A1 true WO2009037833A1 (fr) | 2009-03-26 |
Family
ID=40467660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002564 WO2009037833A1 (fr) | 2007-09-21 | 2008-09-18 | Carte de câblage imprimée solide, procédé pour fabriquer une carte de câblage imprimée solide, et module de composant électronique |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2009037833A1 (fr) |
CN (1) | CN101803476A (fr) |
TW (1) | TW200922417A (fr) |
WO (1) | WO2009037833A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011148915A1 (fr) * | 2010-05-26 | 2011-12-01 | 株式会社村田製作所 | Substrat module et son procédé de fabrication |
EP2473012A1 (fr) * | 2010-12-30 | 2012-07-04 | Research In Motion Limited | Combinaison de cartes de circuits imprimés |
JP2016039213A (ja) * | 2014-08-06 | 2016-03-22 | ローム株式会社 | 基板内蔵パッケージ、半導体装置およびモジュール |
WO2018110383A1 (fr) * | 2016-12-15 | 2018-06-21 | 株式会社村田製作所 | Module électronique et procédé de production de module électronique |
JP2021082771A (ja) * | 2019-11-22 | 2021-05-27 | 株式会社ジェイテクト | 電気機器 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105977364A (zh) * | 2016-07-20 | 2016-09-28 | 广州硅能照明有限公司 | 多层led光引擎结构及其加工方法 |
CN108513432B (zh) * | 2017-02-24 | 2021-06-29 | 泰连公司 | 电子元件组件和其组装方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63254788A (ja) * | 1987-04-10 | 1988-10-21 | 松下電器産業株式会社 | プリント配線板 |
JPH06334298A (ja) * | 1993-05-27 | 1994-12-02 | Fujitsu Ltd | 表面実装部品の搭載構造 |
JP2005504443A (ja) * | 2001-08-31 | 2005-02-10 | エプコス アクチエンゲゼルシャフト | 構成要素装置 |
JP2005236256A (ja) * | 2003-09-12 | 2005-09-02 | Matsushita Electric Ind Co Ltd | コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332246A (ja) * | 2005-05-25 | 2006-12-07 | Matsushita Electric Ind Co Ltd | 回路基板、回路基板の接続構造および電子機器 |
JP4879890B2 (ja) * | 2005-05-25 | 2012-02-22 | パナソニック株式会社 | 回路基板の接続方法 |
-
2008
- 2008-09-18 WO PCT/JP2008/002564 patent/WO2009037833A1/fr active Application Filing
- 2008-09-18 JP JP2009533045A patent/JPWO2009037833A1/ja active Pending
- 2008-09-18 CN CN200880107929A patent/CN101803476A/zh active Pending
- 2008-09-19 TW TW97136055A patent/TW200922417A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63254788A (ja) * | 1987-04-10 | 1988-10-21 | 松下電器産業株式会社 | プリント配線板 |
JPH06334298A (ja) * | 1993-05-27 | 1994-12-02 | Fujitsu Ltd | 表面実装部品の搭載構造 |
JP2005504443A (ja) * | 2001-08-31 | 2005-02-10 | エプコス アクチエンゲゼルシャフト | 構成要素装置 |
JP2005236256A (ja) * | 2003-09-12 | 2005-09-02 | Matsushita Electric Ind Co Ltd | コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011148915A1 (fr) * | 2010-05-26 | 2011-12-01 | 株式会社村田製作所 | Substrat module et son procédé de fabrication |
CN102907188A (zh) * | 2010-05-26 | 2013-01-30 | 株式会社村田制作所 | 模块基板及其制造方法 |
JP5454681B2 (ja) * | 2010-05-26 | 2014-03-26 | 株式会社村田製作所 | モジュール基板およびその製造方法 |
US9674970B2 (en) | 2010-05-26 | 2017-06-06 | Murata Manufacturing Co., Ltd. | Module board and manufacturing method thereof |
EP2473012A1 (fr) * | 2010-12-30 | 2012-07-04 | Research In Motion Limited | Combinaison de cartes de circuits imprimés |
JP2016039213A (ja) * | 2014-08-06 | 2016-03-22 | ローム株式会社 | 基板内蔵パッケージ、半導体装置およびモジュール |
WO2018110383A1 (fr) * | 2016-12-15 | 2018-06-21 | 株式会社村田製作所 | Module électronique et procédé de production de module électronique |
JPWO2018110383A1 (ja) * | 2016-12-15 | 2019-10-24 | 株式会社村田製作所 | 電子モジュールおよび電子モジュールの製造方法 |
US10660227B2 (en) | 2016-12-15 | 2020-05-19 | Murata Manufacturing Co., Ltd. | Electronic module and method of manufacturing electronic module |
JP2021082771A (ja) * | 2019-11-22 | 2021-05-27 | 株式会社ジェイテクト | 電気機器 |
JP7427928B2 (ja) | 2019-11-22 | 2024-02-06 | 株式会社ジェイテクト | 電気機器 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009037833A1 (ja) | 2011-01-06 |
TW200922417A (en) | 2009-05-16 |
CN101803476A (zh) | 2010-08-11 |
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