WO2008149862A1 - ポリアミド－ポリフェニレンエーテル樹脂組成物及びフィルム - Google Patents

ポリアミド－ポリフェニレンエーテル樹脂組成物及びフィルム Download PDF

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Publication number
WO2008149862A1
WO2008149862A1 PCT/JP2008/060227 JP2008060227W WO2008149862A1 WO 2008149862 A1 WO2008149862 A1 WO 2008149862A1 JP 2008060227 W JP2008060227 W JP 2008060227W WO 2008149862 A1 WO2008149862 A1 WO 2008149862A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyamide
polyphenylene ether
resin composition
ether resin
film
Prior art date
Application number
PCT/JP2008/060227
Other languages
English (en)
French (fr)
Inventor
Takaaki Miyoshi
Hiroaki Furukawa
Original Assignee
Asahi Kasei Chemicals Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corporation filed Critical Asahi Kasei Chemicals Corporation
Priority to CN2008800177451A priority Critical patent/CN101679744B/zh
Priority to US12/601,582 priority patent/US8357450B2/en
Priority to JP2009517871A priority patent/JP5404393B2/ja
Priority to EP08765040.4A priority patent/EP2154203B1/en
Publication of WO2008149862A1 publication Critical patent/WO2008149862A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides

Abstract

　本発明は、シクロヘキサンジカルボン酸単位を２０～１００モル％含有するジカルボン酸単位と炭素数６～１２の脂肪族ジアミン単位を含有するジアミン単位とからなる脂環構造を有するポリアミドと、ポリフェニレンエーテルと、ポリアミドとポリフェニレンエーテルとの相溶化剤と、を含むポリアミド－ポリフェニレンエーテル樹脂組成物を提供する。
PCT/JP2008/060227 2007-06-04 2008-06-03 ポリアミド－ポリフェニレンエーテル樹脂組成物及びフィルム WO2008149862A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800177451A CN101679744B (zh) 2007-06-04 2008-06-03 聚酰胺-聚苯醚树脂组合物和膜
US12/601,582 US8357450B2 (en) 2007-06-04 2008-06-03 Polyamide-polyphenylene ether resin composition and film
JP2009517871A JP5404393B2 (ja) 2007-06-04 2008-06-03 ポリアミド−ポリフェニレンエーテル樹脂組成物及びフィルム
EP08765040.4A EP2154203B1 (en) 2007-06-04 2008-06-03 Polyamide-polyphenylene ether resin composition and film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-148531 2007-06-04
JP2007148531 2007-06-04

Publications (1)

Publication Number Publication Date
WO2008149862A1 true WO2008149862A1 (ja) 2008-12-11

Family

ID=40093678

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060227 WO2008149862A1 (ja) 2007-06-04 2008-06-03 ポリアミド－ポリフェニレンエーテル樹脂組成物及びフィルム

Country Status (5)

Country Link
US (1) US8357450B2 (ja)
EP (1) EP2154203B1 (ja)
JP (1) JP5404393B2 (ja)
CN (1) CN101679744B (ja)
WO (1) WO2008149862A1 (ja)

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JP2010265380A (ja) * 2009-05-14 2010-11-25 Asahi Kasei Chemicals Corp 熱可塑性樹脂組成物及びその成形体
JP2010270308A (ja) * 2009-04-20 2010-12-02 Mitsubishi Chemicals Corp 導電性熱可塑性樹脂組成物、導電性熱可塑性樹脂組成物の製造方法、及びこれより得られる射出成形品並びに押出成形品
JP2011021128A (ja) * 2009-07-16 2011-02-03 Asahi Kasei Chemicals Corp Ｌｅｄリフレクタ用ポリアミド組成物
JP2011026568A (ja) * 2009-06-23 2011-02-10 Asahi Kasei Chemicals Corp ポリアミド組成物
JP2011042722A (ja) * 2009-08-20 2011-03-03 Asahi Kasei Chemicals Corp ポリアミドシート
JP2011042782A (ja) * 2009-07-24 2011-03-03 Asahi Kasei Chemicals Corp ポリアミド組成物及びポリアミド組成物を成形した成形体
WO2011027562A1 (ja) * 2009-09-07 2011-03-10 株式会社クラレ Ｌｅｄ用反射板およびそれを備える発光装置
JP2011046934A (ja) * 2009-07-27 2011-03-10 Asahi Kasei Chemicals Corp ポリアミド組成物
JP2011046939A (ja) * 2009-07-29 2011-03-10 Asahi Kasei Chemicals Corp ポリアミド組成物
WO2011030788A1 (ja) * 2009-09-08 2011-03-17 旭化成ケミカルズ株式会社 ポリアミド共重合体及び成形品
JP2011057975A (ja) * 2009-08-11 2011-03-24 Asahi Kasei Chemicals Corp ポリアミド組成物
JP2011057903A (ja) * 2009-09-11 2011-03-24 Asahi Kasei Chemicals Corp ポリアミド−ポリフェニレンエーテル樹脂組成物及び成形品
JP2011063795A (ja) * 2009-08-21 2011-03-31 Asahi Kasei Chemicals Corp ポリアミド溶着成形品
JP2011068876A (ja) * 2009-08-28 2011-04-07 Asahi Kasei Chemicals Corp ポリアミド組成物及び成形品
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JP2011080056A (ja) * 2009-09-11 2011-04-21 Asahi Kasei Chemicals Corp ポリアミド及びポリアミド組成物
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WO2012093722A1 (ja) 2011-01-07 2012-07-12 旭化成ケミカルズ株式会社 共重合ポリアミド
JP2012167284A (ja) * 2011-01-28 2012-09-06 Kuraray Co Ltd 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置
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CN101679744B (zh) 2013-09-25
JPWO2008149862A1 (ja) 2010-08-26
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EP2154203B1 (en) 2015-08-26
EP2154203A4 (en) 2012-12-19

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