WO2006137304A1 - 粘接着剤及び粘接着シート - Google Patents
粘接着剤及び粘接着シート Download PDFInfo
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- WO2006137304A1 WO2006137304A1 PCT/JP2006/311917 JP2006311917W WO2006137304A1 WO 2006137304 A1 WO2006137304 A1 WO 2006137304A1 JP 2006311917 W JP2006311917 W JP 2006311917W WO 2006137304 A1 WO2006137304 A1 WO 2006137304A1
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- adhesive
- acrylic resin
- weight
- resin
- adhesive sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/064—Copolymers with monomers not covered by C08L33/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Definitions
- the present invention relates to a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet having high punchability, heat resistance and adhesiveness.
- FPC flexible printed wiring boards
- Adhesives, heat resistance, and punching are used for adhesives and pressure-sensitive adhesives used when joining the FPC and the base material that composes the FPC, or when joining the coverlay film or reinforcing plate and the FPC. Higher performance in terms of punchability, electrical insulation, and flexibility has been demanded.
- Adhesives are generally liquid, and are applied to a substrate with a brush or roller to form an adhesive sheet, which is bonded to an adherend.
- the adhesive is solidified by vaporization of the solvent or a high molecular weight reaction, and is firmly bonded to the adherend.
- the pressure-sensitive adhesive may be liquid, it is generally supplied in a form applied to a substrate.
- the form is basically a semi-solid viscoelastic body with a feeling of adsorption, and has adhesiveness that can be pressed against the adherend with a weak pressure. If the property is not obtained, it has a drawback.
- an adhesive composed of an acrylic resin, an epoxy resin, a curing catalyst, or the like containing only a carboxyl group as a functional group, or a carboxyl group and a hydroxyl group (see Patent Document 1). .
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-313526 (Claim 1) Disclosure of the invention
- an object of the present invention is to provide not only a polyimide film having high punchability and heat resistance, but also an adhesive and an adhesive sheet having high adhesion to a polyester film.
- the present invention has been made based on the above findings.
- the adhesive of the present invention contains a carboxyl group as a functional group and has an acid value of 2 mgK.
- It comprises an acrylic resin (B), an epoxy resin (C) and a curing agent or a curing catalyst (D) that are KOH / g or less.
- the adhesive of the present invention has a hydroxyl value of the acrylic resin (B) of 5 to 100 mgKH.
- the adhesive of the present invention includes the acrylic resin (A) and / or the acrylic resin (
- the glass transition temperature of B) is 120-20 ° C.
- the content ratio of the acrylic resin (A) and the acrylic resin (B) is 100% by weight of the acrylic resin (A).
- the adhesive of the present invention includes the acrylic resin (A) and / or the acrylic resin (
- B) has a weight average molecular weight of 300,000 to 1,200,000.
- the adhesive sheet of the present invention is characterized in that an adhesive layer made of the adhesive is formed on a substrate.
- the adhesive sheet of the present invention is characterized in that the substrate is a force burley film for a flexible printed wiring board, a reinforcing plate for a flexible printed wiring board, or a peelable substrate. is there.
- an acrylic resin containing a carboxyl group as a functional group and having an acid value of a specific value or more and an acrylic resin containing a hydroxyl group as a functional group and having an acid value of a specific value or less are used in combination.
- an adhesive having not only a polyimide film with high punchability and heat resistance but also high adhesion to a polyester film.
- this adhesive since this adhesive is formed on a substrate, it is not only a polyimide film having high punching workability and heat resistance but also a high adhesiveness to a polyester film.
- An adhesive sheet can be provided.
- the adhesive of the present invention contains, as an essential component, (1) a carboxyl group as a functional group Acrylic resin (A) having an acid value of 2 mgK0H / g or more, (2) acrylic resin (B) having a hydroxyl group as a functional group and an acid value of 0 ⁇ lmgK0H / g or less, (3) Contains epoxy resin (C), (4) curing agent or curing catalyst (D).
- A a carboxyl group as a functional group
- acrylic resin (B) having a hydroxyl group as a functional group and an acid value of 0 ⁇ lmgK0H / g or less Contains epoxy resin (C), (4) curing agent or curing catalyst (D).
- the acrylic resin (A) contains at least one carboxynole group in at least one molecule, and is a bulene monomer having a carboxynole group, the main component of which is a (meth) acrylic acid ester. Depending on the above, it is a copolymer containing acrylonitrile, styrene and the like.
- the talyl resin (B) described later is used alone, the functions such as punching and heat resistance are reduced due to insufficient curing reaction between the acrylic resin (B) and the epoxy resin (C). However, this problem can be solved by using this talyl resin (A) together.
- Examples of (meth) acrylic acid esters include ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, and octyl (meth) acrylate.
- Monomers such as 2-methylhexyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, (meth) acrylic acid 2-hydroxyethyl, (meth) acrylic acid 2- Monomers having a hydroxyl group such as hydroxylpropyl and aryl alcohol, and monomers having an epoxy group of an epichlorohydrin modified product such as glycidyl acrylate and dimethylaminoethyl acrylate. From these, one or more types can be selected and used.
- Biel monomer having a carboxyl group examples include, but are not limited to, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, maleic anhydride, and the like.
- Optional components such as acrylonitrile and styrene can be added to improve performance such as heat resistance.
- the amount of applied force is not particularly limited, but is preferably about 10% by weight or less based on the (meth) acrylic acid ester.
- the acid value of the acrylic resin (A) is 2 mgKmgH / g or more. A practical curing reaction rate and curing temperature can be obtained when it is 2 mgKmgHZg or more.
- the acid value can be adjusted to the above-mentioned range by adjusting the type of monomer constituting the acrylic resin (A) and the ratio of the vinyl monomer having a carboxyl group.
- the ratio of the carboxyl monomer-containing bull monomer to (meth) acrylic acid ester varies depending on the monomer and is generally specified. Although it cannot be determined, it is usually 0.1% by weight or more.
- the acrylic resin (A) may contain other functional groups such as a hydroxyl group, an epoxy group, and a methylol group as long as the acid value is 2 mgK ⁇ H / g or more.
- the acrylic resin (A) is preferably a high molecular weight acrylic resin having a weight average molecular weight of 300,000 to 1,200,000 by gel permeation chromatography (GPC). Is more desirable. By setting the weight average molecular weight to 300,000 or more, heat resistance can be improved. Further, by setting the weight average molecular weight to 1,200,000 or less, it is possible to prevent the solution viscosity from becoming high, and it is possible to prevent problems such as poor workability and handling at the time of preparing the adhesive sheet.
- GPC gel permeation chromatography
- the acrylic resin (A) preferably has a glass transition temperature of 20 to 20 ° C-20 to 10: more preferably 10 ° C.
- a glass transition temperature 20 to 20 ° C-20 to 10: more preferably 10 ° C.
- the polymerization method of the acrylic resin (A) and the acrylic resin (B) described later includes bulk polymerization, solution polymerization, emulsion polymerization, suspension polymerization, etc., but does not require a salting-out step, and migration. Suspension polymerization that is less susceptible to the influence of an emulsifier that causes a decrease in the viscosity is preferred.
- the acrylic resin (B) is used from the viewpoint of improving the adhesiveness with the polyester film.
- the above acrylic resin (A) alone does not properly align functional groups such as hydroxyl groups with respect to the adhesion interface of the adherend, resulting in poor adhesion to the polyester film.
- functional groups such as hydroxyl groups
- the acrylic resin (B) is an acrylic resin having at least one hydroxyl group in at least one molecule, and is a bully monomer having a hydroxyl group and having a (meth) acrylic acid ester as a main component. Accordingly, it is a copolymer containing acrylonitrile, styrene and the like.
- Examples of the (meth) acrylic acid ester include those similar to the above-mentioned acrylic resin (A). It is. From these, one or more types can be selected and used.
- Examples of the vinyl monomer having a hydroxyl group include, but are not limited to, a force S including 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, and aryl alcohol.
- Optional components such as acrylonitrile and styrene can be added to improve performance such as heat resistance.
- the amount of applied force is not particularly limited, but is preferably about 10% by weight or less based on the (meth) acrylic acid ester.
- the acid value of the acrylic resin (B) is 0.1 mgKOHZg or less. By setting it to 0.lmgK0H / g or less, the adhesiveness with the polyester film when used in combination with the acrylic resin (A) can be improved.
- the acrylic resin (B) may contain a methylol group, an epoxy group, or the like as a functional group as long as the acid value is 0.1 mgKOHZg or less.
- the hydroxyl value of the hydroxyl group contained as a functional group is preferably 5 to:! OOmgKOH / g, more preferably 5 to 50 mgKOH / g.
- the hydroxyl value can be adjusted to the above-mentioned range by adjusting the type of monomer constituting the acrylic resin (B) and the proportion of the vinyl monomer having a hydroxyl group.
- the ratio of the hydroxyl group-containing bulle monomer to the (meth) acrylic acid ester varies depending on the monomer and cannot be specified unconditionally, but it is usually about: 25 to 25% by weight.
- the acrylic resin (B) is preferably a high molecular weight acrylic resin having a weight average molecular weight of 300,000 to 1,200,000 by GPC, similar to the above-mentioned acrylic resin (A). Is more desirable. Heat resistance can be achieved by setting the weight average molecular weight to 300,000 or more. Further, by setting the weight average molecular weight to 1.2 million or less, it is possible to prevent the solution viscosity from becoming high, and it is possible to prevent problems such as poor workability and handling at the time of preparing the adhesive sheet. By setting both the acrylic resin (A) and the acrylic resin (B) to a weight average molecular weight within a suitable range, the remarkable effect of the present invention can be exhibited.
- the acrylic resin (B) preferably has a glass transition temperature of 120 to 20 ° C-more preferably 15 to 15 ° C. By setting the temperature to 20 ° C or higher, it is possible to prevent the adhesive from flowing out during heat lamination or hot pressing. Also, by setting the temperature to 20 ° C or less, sufficient tackiness can be provided for temporary bonding.
- the glass transition temperature can be adjusted to the above-mentioned range by adjusting the type of monomer constituting the acrylic resin (B). By setting both the acrylic resin (A) and the acrylic resin (B) to a glass transition temperature in a suitable range, the remarkable effect of the present invention can be exhibited.
- the total content of the acrylic resin (A) and the acrylic resin (B) in the adhesive of the present invention is 50 to 98% by weight in the total solid content of the adhesive. 60 to 95% by weight is more desirable. By setting it to 50% by weight or more, the flexibility of the adhesive can be maintained. Moreover, by setting it to 98% by weight or less, it is possible to prevent the curing reaction with the epoxy resin from being lowered.
- the content ratio of the acrylic resin (A) and the acrylic resin (B) may be 1 to 100 parts by weight of the acrylic resin (B) with respect to 100 parts by weight of the acrylic resin (A). More preferred is 5 to 80 parts by weight.
- the acrylic resin (B) 1 part by weight or more the adhesiveness to the polyester film can be made sufficient. Further, by making the acrylic resin (B) 100 parts by weight or less, the punching workability when the adhesive sheet is obtained can be made sufficient.
- the epoxy resin (C) is not limited to a polyfunctional epoxy resin as long as it contains two or more epoxy groups in one molecule. Also includes resin.
- the epoxy resin (C) is not particularly limited, but for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type, cresol novolak type, bisphenol novolak type, etc. Novolak-type epoxy resin, aliphatic epoxy resin, and the like. These epoxy resins can be used alone or in combination of two or more as required.
- the epoxy equivalent of the epoxy resin (C) is 150 to 1000 gZeq.
- the epoxy equivalent By setting the epoxy equivalent to 150 g / eq or more, the adhesion to a polyester film or the like can be made effective.
- the epoxy equivalent shall be 1000 g / eq or less.
- the curing reaction can be prevented from being lowered, and the thermosetting property can be prevented from being lowered.
- the content of the epoxy resin (C) is preferably 5 to 50% by weight, more preferably 10 to 30% by weight, based on the total solid content of the adhesive. By setting the content to 5% by weight or more, it is possible to prevent a decrease in crosslink density and to prevent a decrease in heat resistance. Further, when the content is 50% by weight or less, it is possible to prevent the adhesiveness from being lowered, and it is possible to prevent problems such as flow of the adhesive during pressing.
- the curing agent or curing catalyst (D) is not particularly limited as long as it is a known curing agent or curing catalyst for epoxy resins.
- examples include aliphatic amine curing agents, aromatic amine curing agents, acid anhydride curing agents, dicyandiamide, boron triboride amine complex salts, imidazole compounds, paratoluenesulfonic acid, and latent acid generators.
- the content of these curing agents or curing catalysts is preferably 0.:! To 20 parts by weight with respect to 100 parts by weight of the epoxy resin (C). .
- the content is 0.1 part by weight or more, a sufficient curing reaction of the epoxy resin (C) can be obtained, and deterioration of heat resistance and electrical characteristics can be prevented.
- the content is 20 parts by weight or less, it is possible to prevent problems such as deterioration in adhesiveness and poor storage stability.
- the adhesive if necessary, other resins, crosslinking agents, tackifiers, acid proliferating agents, diluents, fillers, coloring agents, matting agents, slipping agents, antistatic agents are used. Agents, flame retardants, antibacterial agents, antifungal agents, UV absorbers, light stabilizers, antioxidants, plasticizers, leveling agents, pigment dispersants, flow regulators, antifoaming agents, etc. .
- a filler by adding a filler, heat resistance can be improved and heat dissipation can be exhibited.
- a commonly used organic or inorganic filler can be used. These organic or inorganic fillers may be used as a mixture.
- Various resin particles can be used as the organic filler, such as styrene, butyl ketone, acrylonitrile, methyl methacrylate, ethyl methacrylate, glycidyl methacrylate, glycidyl acrylate, and methyl acrylate. Examples thereof include particles of two or more kinds of polymers, polycondensation resins such as melamine and urea.
- Examples of the inorganic filler include metal hydroxides such as aluminum hydroxide and magnesium hydroxide, metal oxides such as aluminum oxide and calcium oxide, silica, My strength , Talc, clay and the like. These can be used alone or in combination of two or more as required.
- the content of these fillers is preferably 1 to 50% by weight in the total solid content of the adhesive. By setting the content to 1% by weight or more, it is possible to prevent the film from remaining viscous and the punching processability from being lowered. In addition, when the content is 50% by weight or less, it is possible to prevent problems such as brittleness appearing in the film and deterioration of adhesiveness.
- the adhesive of the present invention is usually used by dissolving the above-described components in an organic solvent such as methyl ethyl ketone, toluene, methanol, N-methylolpyrrolidone, N, N-dimethylformamide or the like. Is done.
- the particle size is preferably adjusted to 10 am or less using a ball mill or the like. By setting it to 10 zm or less, it is possible to prevent unevenness on the film surface when it is used as an adhesive sheet, and to prevent deterioration of adhesiveness, heat resistance and appearance.
- the adhesive of the present invention contains an acrylic resin having a carboxyl group as a functional group and an acid value of not less than a specific value, a hydroxyl group as a functional group, and an acid value of not more than a specified value. It is used in combination with a certain acrylic resin, and as a result, it has excellent properties such as not only a polyimide film with high punching workability and heat resistance but also high adhesion to a polyester film. Therefore, the adhesive of the present invention can be suitably used for FPC production applications that require performance such as heat resistance and adhesion, coverlay film or joining applications between reinforcing plates and FPC, etc. .
- the adhesive of the present invention is used as an adhesive layer of an adhesive sheet described below, and is applied to the surface of a member to be bonded in the same manner as known adhesives and adhesives. It can also be used.
- the adhesive of the present invention is preferably heated, dried and thermally cured after bonding. Thereby, adhesive strength can be improved.
- the heating method is not particularly limited, but it is preferably heated by hot air or hot press in the temperature range of 80 to 200 ° C.
- the adhesive sheet of the present invention has a base material and an adhesive layer formed thereon, and uses the adhesive of the present invention as an adhesive layer.
- the base material plays a role as a base material when the adhesive layer is formed.
- This base material Can be used on the premise that they are peeled off at the time of use, but the base material itself can also be used as a reinforcing plate, a cover lay film or the like without peeling.
- Such a substrate is not particularly limited because it is selected depending on the application.
- a polyester film, a polyimide vinylome, an acrylic film, a polychlorinated bure film, a polystyrene film, a polycarbonate examples thereof include plastic films such as films, polypropylene films, triacetyl cellulose films, and various fluororesin films.
- a coating layer of a sealant such as clay, polyethylene, or polypropylene is applied to both surfaces of paper such as high-quality paper, craft paper, Ronole paper, and glassine paper.
- each of the coating layers is coated with a silicone-based, fluorine-based, or alkyd-type release agent, and polyethylene, polypropylene, ethylene mono-olefin copolymer, and propylene mono-olefin copolymer.
- a silicone-based, fluorine-based, or alkyd-type release agent and polyethylene, polypropylene, ethylene mono-olefin copolymer, and propylene mono-olefin copolymer.
- the pressure-sensitive adhesive sheet of the present invention is obtained by applying a coating solution obtained by dissolving the above-mentioned pressure-sensitive adhesive in a suitable solvent by a known method such as a bar coater, a blade coater, a spin coater, a roll. It can be obtained by coating and drying on a substrate using a coater, gravure coater, flow coater, spray, screen printing or the like. In order to improve handleability, it is preferable to attach a separator on the adhesive layer.
- the thickness of the adhesive sheet after drying is appropriately changed as necessary, but is preferably in the range of 5 to 200 / im.
- Adhesive strength can be achieved by setting the thickness of the adhesive sheet to 5 / im or more. In addition, by setting it to 200 / m or less, it is possible to prevent drying from becoming insufficient, and it is possible to prevent problems such as an increase in residual solvent and blistering during FPC manufacturing press.
- the drying conditions are not particularly limited, but the residual solvent ratio after drying is preferably 1% or less. By setting it to 1% or less, it is possible to prevent the problem that the residual solvent foams and swells during FPC pressing.
- the adhesive sheet of the present invention for example, after the adhesive layer is bonded to a reinforcing plate made of a polyester film or the like, the base material is peeled off and the adhesive is removed. Dew layer Then, the adhesive layer is bonded to the FPC, and the FPC and the reinforcing plate are bonded to each other via the adhesive layer. When these are bonded together, a hot press or a hot roll laminator is used. The temperature at that time can be adjusted appropriately within the temperature range from room temperature to 160 ° C.
- the adhesive obtained by bonding the FPC and the reinforcing plate with the adhesive layer is maintained for 30 to 400 minutes in an environment such as a circulating hot air oven at 80 to 200 ° C.
- the layer is heat cured to improve the bond strength. Since the adhesive strength of the adhesive layer can be improved in this way, high-temperature heat is applied to the adhesive layer as in the case of bonding using an acrylic resin-based pressure-sensitive adhesive. No swelling or peeling occurs.
- the adhesive sheet of the present invention can be used for making FPCs, for covering the coverlay film with shellfish, etc., and used under the same conditions as above. I can do it.
- the base material used to form the adhesive layer is a polyester film or polyimide film
- the base material itself should be used as an FPC component base material, cover lay film or reinforcing plate. It is possible to eliminate the step of peeling the substrate out of the above usage methods.
- the FPC as used herein means that a copper foil is bonded to a base material such as a polyester film, or a copper chemical or electroplating, or printing such as conductive paint, resistance paint, dielectric paint, magnetic paint, etc.
- a base material such as a polyester film, or a copper chemical or electroplating, or printing such as conductive paint, resistance paint, dielectric paint, magnetic paint, etc.
- This is a flexible wiring board on which a circuit pattern is formed.
- the reinforcing plate referred to here is for assisting the strength of the FPC, and a polyester phenol or the like is used.
- the coverlay film here is for protecting the surface of the FPC, and a polyester film or the like is used in the same manner as described above.
- Example 1 Adhesive layer coating solution with acrylic resin (B) containing only other hydroxyl groups
- Acrylic resin (B) (W-248DR: Negami Kogyo Co., Ltd., solid content 100%) (acid value 0 mgKOH / g, hydroxyl value 8.5 mg KOH / g)
- a pressure-sensitive adhesive sheet of Example 2 was produced in the same manner as in Example 1 except that the glass transition temperature was changed to 7 ° C and the weight average molecular weight was 450,000.
- Example 2 In the same manner as in Example 1, except that the acrylic resin (B) of Example 1 was changed to 10 parts by weight, the epoxy resin (C) was changed to 4.3 parts by weight, and the methyl ethyl ketone was changed to 79 parts by weight. An adhesive sheet was prepared.
- Example 4 The adhesive sheet of Example 4 was the same as Example 1 except that the acrylic resin (B) of Example 1 was changed to 0.5 parts by weight and the epoxy resin (C) was changed to 2.2 parts by weight. Was made.
- the adhesive sheet of Example 5 was the same as Example 1 except that the acrylic resin ( ⁇ ) of Example 1 was changed to 0.1 parts by weight and the epoxy resin (C) was changed to 2.1 parts by weight. Was made.
- Example 6 In the same manner as in Example 1, except that the acrylic resin ( ⁇ ) in Example 1 was changed to 13 parts by weight, the epoxy resin (C) to 4.3 parts by weight, and methylethylketone to 82 parts by weight. 6 adhesive sheets were prepared.
- An adhesive sheet of Comparative Example 1 was produced in the same manner as in Example 1 except that the acrylic resin (soot) of Example 1 was not contained and the epoxy resin (C) was changed to 2 parts by weight.
- Example 2 Except for the acrylic resin ( ⁇ ) of Example 1, which was changed to 20 parts by weight of acrylic resin ( ⁇ ), 3.4 parts by weight of epoxy resin (C), and 133 parts by weight of methyl ethyl ketone. In the same manner as in Example 1, an adhesive sheet of Comparative Example 2 was produced.
- Comparative Example 3 was the same as Example 1 except that the acrylic resin ( ⁇ ) of Example 2 was not contained, the acrylic resin ( ⁇ ) was changed to 20 parts by weight, and the epoxy resin (C) was changed to 2 parts by weight.
- An adhesive sheet was prepared.
- Table 1 shows the contents (parts) of the materials constituting the adhesives of the examples and comparative examples.
- Table 2 shows the content (parts) of acrylic resin ( ⁇ ⁇ ⁇ ⁇ ) and acrylic resin ( ⁇ ).
- the separate film (primary release substrate) is peeled from the adhesive sheets obtained in Examples and Comparative Examples to expose the adhesive layer, and the polyester film (secondary release group) is exposed through the adhesive layer.
- Material and a rolled copper foil having a thickness of 35 ⁇ m were pasted at 40 ° C.
- the polyester film (secondary release substrate) is peeled to expose the adhesive layer, and a 25 ⁇ m-thick polyimide film (rolled copper foil and FPC substrate) is formed via the adhesive layer.
- Kapton 100 ⁇ , Toray DuPont were attached at 40 ° C. Subsequently, it was kept in a circulating hot air oven at 150 ° C. for 120 minutes, and the adhesive layer was heated and cured to prepare a test piece.
- test piece obtained as described above was subjected to Thomson caching (punching).
- test pieces were tested for solder heat resistance in accordance with IPC-TM-650. “O” indicates that the adhesive layer did not swell after being immersed in a solder bath at 288 ° C for 10 seconds.
- the samples that did not swell after being immersed for 2 seconds were designated as “ ⁇ ”, and those that swelled after being immersed in a 260 ° C. solder bath were designated as “X”.
- the separate film (primary release substrate) is peeled from the adhesive sheets obtained in the examples and comparative examples to expose the adhesive layer, and the polyester film (secondary release group) is exposed through the adhesive layer.
- the polyester film (secondary release substrate) used as a base material for forming the adhesive layer is peeled off to expose the adhesive layer, and the polyester resin is removed via the adhesive layer.
- a 25 ⁇ m thick polyester film (S_28: Toray Industries, Inc.) was attached at 40 ° C.
- the adhesive layer was heated and cured by holding in a circulating hot air oven at 150 ° C. for 120 minutes.
- the 180 ° peel strength was measured according to JIS C6471: 1995.
- the separate film (primary release substrate) is peeled from the adhesive sheets obtained in the examples and comparative examples to expose the adhesive layer, and the polyester is interposed through the adhesive layer.
- a film (secondary release substrate) and a 25 ⁇ m-thick polyimide film (Kapton 100H, Toray DuPont) were attached at 40 ° C.
- the polyester film (secondary release substrate) used as a base material for forming the adhesive layer is peeled to expose the adhesive layer, and the polyimide film is interposed through the adhesive layer.
- a 25 ⁇ m thick polyimide film (Kapton 100 mm, Toray DuPont) were attached at 40 ° C.
- the adhesive layer was heat-cured by holding in a circulating hot air oven at 150 ° C. for 120 minutes.
- the adhesives and adhesive sheets of the examples contain an acrylic resin containing a carboxyl group as a functional group as an adhesive and an acid value of a specific value or more, a hydroxyl group as a functional group, and an acid value. Therefore, it was excellent in punching processability, heat resistance, and adhesion to polyester films and polyimide films.
- the adhesives of Examples:! To 4 are acrylic resin (A) and acrylic resin ( B)
- the content of the acrylic resin (B) is within the range of:! ⁇ 100 parts by weight with respect to 100 parts by weight of the acrylic resin (A), so punching workability and adhesion to polyester film Both were excellent.
- the adhesive and the adhesive sheet of Comparative Example 1 are made of an acrylic resin (A) containing a hydroxyl group or the like as a functional group alone like the conventional adhesives and adhesive sheets. As a result, the adhesion to the polyester film was poor.
- the adhesives and adhesive sheets of Comparative Examples 2 and 3 do not contain the acrylic resin (A) of the example, and therefore the curing reaction of the adhesive is insufficient. It was inferior in punching workability and inferior in heat resistance.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007522249A JP5209306B2 (ja) | 2005-06-23 | 2006-06-14 | 粘接着剤及び粘接着シート |
KR1020077029263A KR101201079B1 (ko) | 2005-06-23 | 2006-06-14 | 점접착제 및 점접착 시트 |
US11/922,589 US20090035567A1 (en) | 2005-06-23 | 2006-06-14 | Tacky-Adhesive and Tacky-Adhesive Sheet |
CN2006800214108A CN101198671B (zh) | 2005-06-23 | 2006-06-14 | 粘接着剂及粘接着片 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-183432 | 2005-06-23 | ||
JP2005183432 | 2005-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006137304A1 true WO2006137304A1 (ja) | 2006-12-28 |
Family
ID=37570334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/311917 WO2006137304A1 (ja) | 2005-06-23 | 2006-06-14 | 粘接着剤及び粘接着シート |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090035567A1 (ja) |
JP (1) | JP5209306B2 (ja) |
KR (1) | KR101201079B1 (ja) |
CN (1) | CN101198671B (ja) |
TW (1) | TWI385227B (ja) |
WO (1) | WO2006137304A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009084336A (ja) * | 2007-09-28 | 2009-04-23 | Kimoto & Co Ltd | 粘接着剤および粘接着シート |
JP2009088077A (ja) * | 2007-09-28 | 2009-04-23 | Dainippon Printing Co Ltd | 電子回路部品、及びハードディスクドライブ用サスペンション |
JP2009203450A (ja) * | 2008-01-30 | 2009-09-10 | Tokyo Ohka Kogyo Co Ltd | 接着剤組成物、および接着フィルム |
JP2011204934A (ja) * | 2010-03-26 | 2011-10-13 | Dainippon Printing Co Ltd | フレキシブルプリント基板、及び補強フレキシブルプリント基板 |
US8901234B2 (en) | 2008-06-17 | 2014-12-02 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition |
JP2015111619A (ja) * | 2013-12-06 | 2015-06-18 | Dic株式会社 | 熱伝導シート、物品及び電子部材 |
JP2017017131A (ja) * | 2015-06-30 | 2017-01-19 | デクセリアルズ株式会社 | 補強フレキシブルプリント配線板の製造方法、熱硬化性樹脂組成物及び熱硬化性接着シート |
Families Citing this family (8)
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JP4851579B2 (ja) * | 2009-11-19 | 2012-01-11 | 古河電気工業株式会社 | シート状接着剤及びウエハ加工用テープ |
CN103503582B (zh) * | 2011-04-28 | 2017-07-18 | 株式会社钟化 | 补强板一体型挠性印刷基板 |
TW201305306A (zh) * | 2011-07-25 | 2013-02-01 | Nitto Denko Corp | 接著片及其用途 |
DE102012103586A1 (de) * | 2012-04-24 | 2013-10-24 | Leonhard Kurz Stiftung & Co. Kg | Verfahren und Vorrichtung zum Verbinden einer ersten Folienbahn und einer zweiten Folienbahn |
WO2016060191A1 (ja) * | 2014-10-17 | 2016-04-21 | 太陽インキ製造株式会社 | ドライフィルムおよびフレキシブルプリント配線板 |
KR101956547B1 (ko) | 2016-03-09 | 2019-03-11 | 미쯔비시 케미컬 주식회사 | 점착 필름 및 그의 제조방법 |
WO2019150433A1 (ja) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | 熱硬化性樹脂組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 |
CN115232578B (zh) * | 2022-08-17 | 2024-02-23 | 苏州赛伍应用技术股份有限公司 | 一种uv减粘胶黏剂及其制备方法 |
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2006
- 2006-06-14 WO PCT/JP2006/311917 patent/WO2006137304A1/ja active Application Filing
- 2006-06-14 US US11/922,589 patent/US20090035567A1/en not_active Abandoned
- 2006-06-14 JP JP2007522249A patent/JP5209306B2/ja not_active Expired - Fee Related
- 2006-06-14 CN CN2006800214108A patent/CN101198671B/zh not_active Expired - Fee Related
- 2006-06-14 KR KR1020077029263A patent/KR101201079B1/ko not_active IP Right Cessation
- 2006-06-22 TW TW095122475A patent/TWI385227B/zh not_active IP Right Cessation
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JP2009084336A (ja) * | 2007-09-28 | 2009-04-23 | Kimoto & Co Ltd | 粘接着剤および粘接着シート |
JP2009088077A (ja) * | 2007-09-28 | 2009-04-23 | Dainippon Printing Co Ltd | 電子回路部品、及びハードディスクドライブ用サスペンション |
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JP2011204934A (ja) * | 2010-03-26 | 2011-10-13 | Dainippon Printing Co Ltd | フレキシブルプリント基板、及び補強フレキシブルプリント基板 |
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JP2017017131A (ja) * | 2015-06-30 | 2017-01-19 | デクセリアルズ株式会社 | 補強フレキシブルプリント配線板の製造方法、熱硬化性樹脂組成物及び熱硬化性接着シート |
Also Published As
Publication number | Publication date |
---|---|
KR20080018893A (ko) | 2008-02-28 |
US20090035567A1 (en) | 2009-02-05 |
CN101198671B (zh) | 2010-11-24 |
JPWO2006137304A1 (ja) | 2009-01-15 |
TW200710187A (en) | 2007-03-16 |
TWI385227B (zh) | 2013-02-11 |
KR101201079B1 (ko) | 2012-11-14 |
CN101198671A (zh) | 2008-06-11 |
JP5209306B2 (ja) | 2013-06-12 |
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