Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
  • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

• the present invention relates to a novel conductive paste composition and a printed wiring board.
• the present invention relates to a conductive paste composition particularly suitable for forming electrode bumps used for interlayer connection of multilayer printed wiring boards and a printed wiring board using the same.
• conductive paste compositions have been used in many applications such as for IC circuits, conductive adhesives, and electromagnetic wave shields in the electronics field.
• a first substrate provided with a conical conductive bump made of a conductive paste at a predetermined position on at least one surface and a second substrate provided with a wiring pattern on at least one surface are provided.
• a laminate in which the surface on which the conductive bumps are provided and the surface on which the wiring pattern is provided are opposed to each other, and an insulator layer is disposed between the first substrate and the second substrate.
• a method of manufacturing a printed wiring board in which a conductive wiring portion is formed by penetrating the bump in the thickness direction of the insulating layer by laminating and pressing the laminated body! Speak Japanese Patent Publication No. 6-350258
• a through-type conductive wiring portion can be formed that has good pre-predder penetrability, does not generate cracks during penetration and pressing, and has a high adhesive force between the bump after penetration and the wiring pattern.
• a conductive paste containing melamine resin, phenol resin, epoxy resin, conductive powder and solvent is provided as a conductive paste having high yield and good connection reliability.
• An electrically conductive best composition for interlayer connection of printed wiring boards has been proposed in which the softening point of the epoxy resin is 80 ° C. or higher and 130 ° C. or lower (JP 2002-270033 A). ).
• thermosetting conductive resin composition capable of washing an apparatus, a jig and a container with water after screen printing
• a water-soluble thermosetting resin is provided.
• a conductive resin composition characterized by containing fat, conductive particles and dihydric alcohol.
• JP-A-2001-11388 discloses a multilayer capacitor electrode paste composition containing a water-soluble resin and glycol capable of washing a plate used for printing with water.
• Patent Document 1 Japanese Patent Laid-Open No. 6-350258
• Patent Document 2 JP 2002-270033 A
• Patent Document 3 Japanese Patent Laid-Open No. 2003-77337
• Patent Document 4 Japanese Patent No. 3588400
• Patent Document 5 Japanese Patent Laid-Open No. 9-286924
• Patent Document 6 Japanese Unexamined Patent Publication No. 2001-11388
• Patent Document 7 Japanese Patent Laid-Open No. 2003-331648
• Patent Document 8 Japanese Patent Application Laid-Open No. 2004-265826
• the present invention intends to provide a solution to the above problem by using a solvent mainly containing a specific compound.
• the conductive paste composition according to the present invention is a phenolic resin, a melamine resin, a conductive powder, a solvent and a divalent alcohol having an ether bond.
• Such a conductive paste composition according to the present invention includes, as a preferred embodiment, one having a divalent alcohol power having an ether bond and having an ethylenedioxy moiety in its molecular structure.
• Such a conductive paste composition according to the present invention preferably includes, as an aspect, one having a hydroxyl group at both ends of the divalent alcohol having an ether bond.
• the divalent alcohol having an ether bond is diethylene glycol, triethylene glycol, tetraethylene dalycol, pentaethylene glycol or hexaethylene.
• Glycol power group power includes at least one selected.
• Such a conductive paste composition according to the present invention preferably has, as an embodiment, when the total of the solvent and the divalent alcohol having an ether bond is 100% by mass, the divalent having the ether bond. which alcohol contains from 0.1 to 50 weight 0/0, encompass.
• the solvent is selected from the group consisting of butinorecanorebitonoreacetate, ethinore acetate, butinore acetate, ethinorecerosonolev, butylacetosolve, Including those containing at least one selected from the group consisting of til carbitol, butyl carbitol, isopropanol, butanol, terpineol, thixanol, butylceosolv acetate, and isophorone.
• Such a conductive paste composition according to the present invention preferably includes, as an aspect, a pigment, preferably further containing an extender pigment.
• a printed wiring board according to the present invention is characterized by using the conductive paste composition.
• a coating film having a sufficient thickness can be formed by a single coating operation.
• the number of overprints of the conductive paste composition can be reduced, and productivity can be improved. Further, since the conductive paste composition according to the present invention is of a non-firing type, it is not necessary to perform a calcining operation.
• the conductive paste composition according to the present invention is characterized in that it comprises a phenolic resin, a melamine resin, a conductive powder, a solvent and a divalent alcohol having an ether bond.
• “consisting of” means a conductive property in which other components other than the above essential components (that is, phenol resin, melamine resin, conductive powder, solvent and divalent alcohol having an ether bond) coexist.
• the paste composition is not excluded. That is, the conductivity according to the present invention
• the conductive paste composition includes both a conductive paste composition that only has the above essential components and a conductive paste composition that includes the above essential components and other components other than these essential components.
• “conductive” means that the volume resistance value is at least 1 ⁇ 10 3 _3 cm. ⁇ or less.
• the conductive paste composition according to the present invention preferably has a viscosity of 200 to 500? & '5, particularly 300 to 400 Pa's. This viscosity is measured with a spiral viscometer manufactured by Malcolm at 1 Orpm / min at 25 ° C.
• the conductive paste composition according to the present invention preferably has a thixo index of 0.75 to L0, particularly 0.8 to 0.95.
• the thixo index is calculated from the viscosity of the conductive paste measured with a Malcolm spiral viscometer at 10 rpm Zmin, 5 rpm / min, and 25 ° C, using the thixo index calculation formula log (viscosity value at 5 rpm, viscosity at ZlO rpm. Value) Calculated with Zlog [10 (rpm) / 5 (rpm)].
• the thixo index is an index that shows the property that the apparent viscosity increases when left standing and the apparent viscosity decreases when mixed vigorously, making it easier to coat.
• phenol resin used in the present invention novolak type and resol type! Any of those having phenolic hydroxyl groups such as phenol, cresol, xylenol, polyparabuphenol, p-alkylphenol, chlorophenol, bisphenol A, phenolsulfonic acid, resorcin, etc.
• Preferred examples of the coconut resin include cocoa and the like obtained by adding and condensing aldehydes such as formalin and furfural. Of these, polyparabufenol is particularly preferred.
• melamine rosin used in the present invention include methylol melamine and alkylated melamine.
• Examples of the conductive powder used in the present invention include various conductive fine powders such as silver powder, gold powder, copper powder, nickel powder, platinum powder, palladium powder, solder powder, and metal powders such as metal alloy powders. Etc. can be used. These conductive powders can be used in combination of two or more. wear. Moreover, electroconductive powder other than a metal, for example, carbon powder, can also be used. The conductive powder may be surface-treated.
• the form and size of the conductive powder are arbitrary as long as they are not contrary to the object of the present invention.
• dendritic, flaky, spherical, and flaky forms particularly preferably a mixture of flaky and spherical forms can be used.
• the average particle size is preferably 0.5 to 10 / ⁇ ⁇ , particularly 1.0 to 5. O ⁇ m.
• the conductive paste composition according to the present invention contains a divalent alcohol having an ether bond.
• divalent alcohols having an ether bond divalent alcohols having an ethylenedioxy moiety in the molecular structure are preferred, and divalent alcohols having hydroxy groups at both ends are particularly preferred! /.
• Examples of such preferred! / Compounds include diethylene glycol, triethylene glycol, tetraethylene glycol, pentaethylene glycol and hexaethylene glycol. Among these, triethylene glycol is particularly preferable.
• one kind selected from these divalent alcohol powers having an ether bond can be used alone, or two or more kinds can be used in combination.
• the solvent used in the present invention for example, various kinds of organic solvents capable of forming a paste composition together with the above-mentioned phenol resin, melamine resin and conductive powder can be used.
• organic solvent include, for example, butyl carbitol acetate, ethyl acetate, butyl acetate, ethyl acetate solve, butyl cetyl sorb, ethyl carbitol, butyl carbitol, isopropanol, butanol, terpineol, thixanol, butyl glycerol.
• examples include sorb acetate, isophorone alone or a mixed solution thereof.
• the content of divalent alcohol having an ether bond is 100 mass%, the content of divalent alcohol having an ether bond, from 0.1 to 50 weight 0/0, preferably 0 5 to 40% by mass, more preferably 1 to 30% by mass.
• the conductive paste composition according to the present invention can contain various components as required.
• the Specific examples of the components that can be included as needed include the following pigments, thixotropy-imparting agents, antifoaming agents, dispersants, antifungal agents, reducing agents, and the above-mentioned phenols.
• Other fat components for example, epoxy resins and acrylic resins
• that are miscible with fat and / or melamine resin can be used.
• the conductive paste composition according to the present invention can contain various organic or inorganic pigments as needed, and the coating film of the conductive paste composition can be reinforced with such a pigment.
• extender pigments such as microsilica, calcium carbonate, barium sulfate, magnesium carbonate, alumina and the like can be used alone or as a mixture thereof.
• the blending ratio of each component in the conductive paste composition according to the present invention is as follows (in the following, the total of the rosin components means the total amount of phenol and melamine rosins. In addition, when there is a resin other than phenol resin or melamine resin, it means the total amount of each of these resin components).
• the total amount of the solvent and the dihydric alcohol having an ether bond is 10
• the amount of the conductive powder is preferably 300 to L 100 parts by mass with respect to 100 parts by mass of the resin component.
• the amount of the pigment is preferably 1 to 30 parts by mass, more preferably 5 to 25 parts by mass with respect to 100 parts by mass of the resin component.
• the ratio of phenolic rosin and melamine rosin in the rosin component is expressed by mass ratio
• the range is 0/70 to 70/30, more preferably 60/40 to 40/60.
• the conductive paste composition according to the present invention has good conductivity and can be printed on a substrate by a known printing method such as a screen printing method or a metal mask printing method. It is a good one. Therefore, the conductive paste composition according to the present invention can be used in a wide range of fields as in the past.
• the conductive paste composition according to the present invention has a thick coating film thickness per printing operation, it can efficiently form a sufficiently thick conductive layer. Is
• the conductive paste composition according to the present invention can form bumps having a sufficiently high height with fewer coatings than before, for example, even with only one coating.
• the productivity can be improved.
• a printed wiring board according to the present invention is characterized by using the conductive paste composition described above.
• Such a printed wiring board according to the present invention preferably includes, as an embodiment, a printed wiring board in which electrical connection between layers is made by bumps formed from the conductive paste composition.
• Divalent alcohol was mixed at a mass ratio shown in Table 1, and sufficiently mixed with three rolls to produce a conductive paste composition according to the present invention.
• the viscosity and thixo index of this conductive paste composition are as shown in Table 1.
• a metal mask plate made of aluminum with a hole of / z m Use a metal mask plate made of aluminum with a hole of / z m, use a urethane resin squeegee with a hardness of 80 °, and control the environment to a temperature of 20 ° C and humidity of 50%.
• a conductive paste composition (comparative example) was produced in the same manner as in Example 1 except that the solvent was used in the proportions shown in Tables 2 and 3 and the divalent alcohol having an ether bond was removed. Then, screen printing was performed in the same manner as in the Examples, and the height and shape of the formed bumps were evaluated. The results are as described in Table 2.
• Viscosity (P a ⁇ s / 25 ° C) 250 1 77 1 7 1 223 1 72 1 53 Thixo index 0. 50 0. 82 0. 69 0. 92 0. 60 0. 54 Pump height (m) 58 6 1 54 63 54 57 Pam shape Good Good Good Good Good Good Good Good
• Comparative Example 8 Comparative Example 9 Comparative Example 1 0 Comparative Example 1 1 Comparative Example 1 2 Comparative Example 1 3 Phenolic Resin 50 50 50 50 50 50 50 Men Resin 5 0 50 50 50 50 50 50 50 Silver Powder 700 7 00 700 700 700 700 Extender Pigment 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 butyl carbite sulfate 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45

Landscapes

• Chemical & Material Sciences (AREA)
• Dispersion Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Manufacturing & Machinery (AREA)
• Conductive Materials (AREA)
• Manufacturing Of Printed Wiring (AREA)
• Parts Printed On Printed Circuit Boards (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37073405

Family Applications (1)

Country Status (5)

Families Citing this family (1)

Citations (4)

Family Cites Families (1)

• 2005
  • 2005-03-31 JP JP2005103932A patent/JP4841158B2/ja not_active Expired - Fee Related
• 2006
  • 2006-03-30 KR KR1020077025031A patent/KR100995607B1/ko not_active IP Right Cessation
  • 2006-03-30 WO PCT/JP2006/306709 patent/WO2006106849A1/ja active Application Filing
  • 2006-03-30 CN CN2006800109671A patent/CN101156218B/zh not_active Expired - Fee Related
  • 2006-03-31 TW TW095111582A patent/TW200701259A/zh not_active IP Right Cessation

Patent Citations (4)

Also Published As

Similar Documents

Legal Events