WO2006095781A1 - 電子機器用筐体の製造方法 - Google Patents
電子機器用筐体の製造方法 Download PDFInfo
- Publication number
- WO2006095781A1 WO2006095781A1 PCT/JP2006/304491 JP2006304491W WO2006095781A1 WO 2006095781 A1 WO2006095781 A1 WO 2006095781A1 JP 2006304491 W JP2006304491 W JP 2006304491W WO 2006095781 A1 WO2006095781 A1 WO 2006095781A1
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- WIPO (PCT)
- Prior art keywords
- resin
- molded body
- primary
- transfer material
- molding
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1675—Making multilayered or multicoloured articles using exchangeable mould halves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
- B29C2045/14696—Coating articles provided with a decoration transparent decorated inserts
Definitions
- the present invention relates to a method for manufacturing a casing for an electronic device that can be easily obtained for a casing for an electronic device that is used in a mobile phone, a PDA, and the like and includes a transparent window portion and a main body portion.
- PMMA polymethyl methacrylate (polymethyl methacrylate)
- PMMA polymethyl methacrylate
- SMMA sulfur rubber
- the window member and the casing member are separately molded using different molding greases, and then bonded together with a double-sided tape or integrated into ultrasonic waves or lasers. Therefore, they were welded together.
- the method using a double-sided tape is widely used because the cost can be kept relatively low, but a certain area or more of the fitting portion is secured in order to secure the strength of adhesion with the double-sided tape. It is required to do.
- two parts, double-sided tape and a total of three members overlap each other in this fitting portion, which increases the thickness of the product.
- the method of welding increases the manufacturing cost and may limit the selection of materials for efficient welding.
- the fitting portion of the two members in order to prevent the window member from falling off, it is better to configure the fitting portion of the two members so that the window member is fitted to the outside force of the housing member.
- the fitting portion when an external force or pressure is applied to the window member, the fitting portion may be disengaged inward, and the window member may fall out inward.
- the fitting part when configured in this way, the fitting part is visible from the outside of the product through a transparent window member, so some kind of coating treatment is required. Since there are various difficulties in decorating the surface of a three-dimensional object, the shape design is constrained.
- the present invention eliminates the above-described drawbacks, and an electronic device that can easily obtain a molded product including a transparent window portion excellent in scratch resistance and a strength holding portion excellent in impact strength.
- An object is to provide a method for manufacturing a housing.
- the present invention is configured as follows.
- the transfer material in which the decorative layer is formed on the base sheet is disposed between the first exchange mold capable of forming the primary molding cavity and the common mold. To close the mold to form the primary molding cavity,
- the secondary molding resin is injected into the secondary molding cavity, and the secondary molded body fixed to the primary molded body is molded and the decorative layer of the transfer material and the secondary molded body are bonded,
- the decorative layer of the transfer material is transferred to the surface, and the primary molded body uses the secondary molded body as a transparent window portion, and the other
- An electronic device casing manufacturing method for manufacturing an electronic device casing as a main body is provided.
- a transparent resin is injected to form a primary resin.
- a method for manufacturing an electronic device casing according to the first aspect is provided, wherein an electronic device casing is manufactured by forming a secondary molded body and using the secondary molded body as a main body portion and the primary molded body as a transparent window portion. To do.
- a transparent molded resin is injected to form a secondary molded body, and the primary molded body is used as a main body, and the secondary molded body is used.
- a method for manufacturing an electronic device casing according to a first aspect is provided for manufacturing an electronic device casing having a transparent window as a transparent window portion.
- the primary molded body has a visible light transmittance power of 3 ⁇ 40% or more as defined in JIS-K7105 as JIS-K5600-5-4 as the primary molded resin.
- a method for manufacturing a casing for electronic equipment according to the first or second aspect wherein the specified pencil hardness is molded using a resin having F or higher.
- the primary molded body is molded using a resin having a rubber added to a methylmethacrylate resin as the primary molded resin, the electron of the fourth aspect A method for manufacturing a housing for equipment is provided.
- the secondary molded body uses, as the secondary molded resin, a resin having an Izod impact strength of lOKjZm 2 or more as defined in ASTM-D256.
- a method of manufacturing a molded electronic device casing according to the first or second aspect is provided.
- the secondary molded resin is a resin having a molding temperature higher than that of the primary molded resin, and the surface of the primary molded body is melted to form the primary molded body.
- a method for manufacturing a casing for an electronic device according to a first aspect is provided that is fixed to a secondary molded body.
- the decorative layer includes a transparent region having an area that can be disposed so as to be accommodated in the primary molding cavity, and an impermeable layer provided around the transparent region.
- the transparent region of the decorative layer is composed of an ink containing a transparent rosin, and the transparent region is adhered to the primary molded body.
- a method for manufacturing an electronic device casing is provided.
- the primary molding resin in a state where the transfer material is arranged in the primary molding cavity, the primary molding resin is injected, and the primary molded body made of the primary molding resin is adhered to the transfer material.
- the secondary molding cavity is formed so as to remain inside, so that problems such as misalignment of the primary molded body can be prevented.
- the primary molded body may be a transparent primary molded resin so as to correspond to the transparent window portion.
- the primary molded body may be a resin corresponding to the main body portion.
- the secondary molding resin uses a transparent resin corresponding to the transparent window portion.
- the visible light transmittance defined in JIS-K7105 is 80% or more as the primary molded resin, and the pencil hardness defined in JIS-K5600-5-4 is F or more.
- the visible light transmittance defined in JIS-K7105 is 80% or more as the primary molded resin
- the pencil hardness defined in JIS-K5600-5-4 is F or more.
- the secondary molded resin is formed by injecting a resin having an Izod impact strength of lOKjZm 2 or more as defined in ASTM-D256 to form a main body.
- a resin having an Izod impact strength of lOKjZm 2 or more as defined in ASTM-D256 is formed by injecting a resin having an Izod impact strength of lOKjZm 2 or more as defined in ASTM-D256 to form a main body.
- an electronic device casing having sufficient strength as the main body can be manufactured.
- the seventh aspect of the present invention by using the secondary molded resin having a molding temperature higher than that of the primary molded resin, the adhesion between the primary molded body and the secondary molded body can be strengthened. .
- the transparent region of the decorative layer is configured to be smaller than the primary molding cavity, and the periphery of the transparent region is configured by an opaque region. It is possible to conceal the vicinity of the fixed portion between the secondary molded body and the secondary molded body.
- the transparent region is provided with ink containing transparent resin, the area where the primary molded body adheres to the decorative layer can be increased, and the transfer material can be used when forming the secondary molding cavity. It is possible to strengthen the close contact with the primary molded body and prevent the primary molded body from being displaced or dropped.
- FIG. 1 is a partial cross-sectional perspective view showing an embodiment of an electronic device casing obtained by the method for manufacturing an electronic device casing of the present invention
- FIG. 2A is a diagram showing one process according to an embodiment of the method for manufacturing an electronic device casing of the present invention, and is a diagram showing a state in which a primary molding core mold and a cavity mold are closed;
- FIG. 2B is a partially enlarged view of Fig. 2A.
- FIG. 2C is a diagram showing one process according to an embodiment of the method for manufacturing an electronic device casing of the present invention, and showing a state where the primary molding core mold and the cavity mold are opened;
- FIG. 3A is a diagram showing one process according to an embodiment of the method for manufacturing an electronic device casing of the present invention, and is a diagram showing a state where the secondary molding core mold and the cavity mold are closed;
- FIG. 3B is a diagram showing one step according to the embodiment of the method for manufacturing the electronic device casing of the present invention, and is a diagram showing a state where the secondary molding resin is injected into the secondary molding cavity;
- FIG. 4 is a diagram showing a process involved in another embodiment of the method for manufacturing an electronic device casing of the present invention, showing a state in which the core mold for primary molding and the cavity mold are closed.
- FIG. 5 is a diagram showing a step involved in another embodiment of the method for manufacturing an electronic device casing of the present invention, and showing a state where the core mold for secondary molding and the cavity mold are closed. Yes,
- FIG. 6 is a cross-sectional view showing an embodiment of a transfer material used in the method for manufacturing an electronic device casing of the present invention.
- a method for manufacturing an electronic device casing according to the present embodiment is, for example, a method for manufacturing an electronic device casing as shown in FIG.
- the electronic device casing 50 includes a transparent window portion 53 made of transparent resin and a main body portion 54 constituting the casing main body.
- a molding simultaneous transfer method is used. Use to transfer the pattern to the surface.
- the picture has a transparent portion 11 lb in the transparent window portion 53 and an opaque portion 11 la in the main body portion 54 and a joint portion between the transparent window portion 53 and the main body portion 54.
- the outer surface of the housing 50 is transparent.
- a pattern may be transferred to the inside of the housing.
- the pattern 51 transferred to the housing by the transfer material is preferably configured so that the boundary portion between the transparent window portion 53 and the main body portion 54 where the transparent portion 11 la is smaller than the transparent window portion 53 is covered. ,.
- a so-called two-color molding die 1 is used.
- the two-color molding die 1 is capable of forming an injection-molded product composed of two different types of resin. Specifically, for example, a primary mold core mold 2 as an example of a first exchange mold, a secondary mold core mold 3 as an example of a second exchange mold, and a cavity mold 4 as an example of a common mold 3 Consists of various core types.
- Each core type shown in this example has the following configuration.
- a primary molding cavity 11 is formed on the primary molding core mold 2, and a primary molding resin injection path 13 for injecting the primary molding resin into the primary molding cavity 11 is provided.
- a primary molded body corresponding to the transparent window portion 53 of the housing is molded by the primary molding cavity 11.
- the secondary molding core mold 3 is provided with a secondary molding cavity 12, and a secondary molding resin injection path 14 for injecting the secondary molding resin 12 into the secondary molding cavity 12 is provided. It is.
- a secondary molded body corresponding to the main body 54 of the housing is molded by the secondary molding cavity 12. Further, as will be described later, by injecting the secondary molded resin into the secondary molding cavity 12, a secondary molded body composed of the primary molded body corresponding to the transparent window portion 54 and the secondary molded resin. And the entire housing is molded.
- the cavity mold 4 is a mold on which a film-like transfer material 100 for simultaneous molding and transfer is disposed.
- a molding resin injection path for discharging molten resin to the cavity mold 4 is not provided in order to place the transfer material 100 on the cavity mold 4.
- the molded resin injection path is not provided. It is good also as a structure which provides.
- the transfer material 100 is arranged in the cavity mold 4 by a transfer material feeding device (not shown) and a transfer material scraping device (not shown) supplied to the cavity mold 4 provided in the injection molding machine.
- the primary molding core mold 2 and the secondary molding core mold 3 are provided on a movable plate (not shown) such as a rotary plate capable of rotating operation or a slide plate capable of sliding, which is provided in the injection molding machine. Install.
- the primary molded resin injection path 13 is connected to the primary molded resin injection nozzle of the injection unit by combining the movable platen and the injection unit at the primary molding position.
- the secondary molding resin injection path 14 is connected to the secondary molding resin injection nozzle of the injection unit by combining the movable platen and the injection unit at the position where the secondary molding is performed.
- the primary molding core mold 2 and the secondary molding core mold 3 may be attached to a slide disc.
- the turntable and slide are fixed to the tip of the shaft of the drive unit installed in the injection unit of the injection molding machine.
- the drive unit rotates or slides the rotating disk via the shaft. Further, the drive unit may drive the rotary disk and the slide disk back and forth so that the primary molding core mold 2 and the secondary molding core mold 3 are close to and separated from the cavity mold 4.
- the cavity mold 4 is attached to a fixed plate (not shown) of an injection molding machine.
- the stationary platen is fixed to the tip of the shaft of the drive unit mounted in the drive unit.
- the drive unit may drive the fixed plate back and forth so that the cavity type approaches and separates from the core type.
- the multiple mold molds correspond to the core mold 2 for the primary molding and the core mold 3 for the secondary molding, respectively, so that the primary molding and the secondary molding can be performed simultaneously in different places. It may be arranged.
- the injection unit is a vertical molding machine (one in which the mold cavity mold and the core mold are installed in a substantially horizontal direction and are closed in the horizontal direction), and the vertical molding machine (of the mold).
- the cavity type and the core type may be installed facing each other in a substantially vertical direction and closed in the vertical direction).
- the core mold 2 for primary molding and the core mold 3 for secondary molding may be lined up or down, or lined side by side.
- the injection unit is provided with two cylinders for discharging two types of molded resin, each of which is provided with a nozzle hole for injecting the resin into the mold.
- the two cylinders 1 may be provided on the same side with the mold sandwiched in accordance with the configuration of the mold, or may be provided on different sides. Further, it may be arranged in any orientation depending on the position of the molding resin injection path provided in the mold.
- the cylinder for discharging two types of molded resin is branched from one cylinder into two molded resin injection nozzles. As good as.
- the transfer material feeding device and the transfer material scraping device continuously supply a long transfer material 100 to the cavity mold 4.
- the transfer material feeding device is composed of a transfer material 100 wound up in a roll shape and a support rod that supports the transfer material 100 on a fixed platen, a transfer material 100-a roll, a sensor for accurate alignment with the cavity, etc. It has.
- the transfer material winding device includes a transfer material 100 that has been fed by a transfer material feeding device and wound up in a roll shape, and a support rod that supports the transfer material 100 on a fixed platen.
- the core types 2a and 3a and the cavity type 4a having other configurations shown in FIGS. 4 and 5 can also be used.
- the transfer material 100 is disposed on the inner side surface of the housing.
- the transfer sheet 100 has a configuration in which a decorative layer 102 is formed on a base sheet 101.
- the transfer material 100 for example, a material in which a decorative layer 102 formed by laminating a release layer 110, a design layer 111, an adhesive layer 112, and the like on a base sheet 101 is used. Yes (see Figure 6).
- the material of the base sheet 101 includes polypropylene resin, polyethylene resin, polyamide resin, polyester resin, acrylic resin, and polysalt resin resin. It is possible to use grease sheets, metal foils such as aluminum foil and copper foil, cellulose sheets such as dalasin paper, coated paper, cellophane, etc., or a composite of the above-mentioned respective sheets. What is used as 101 can be used. In addition, when the surface of the base sheet 101 has fine irregularities, the irregularities are copied to the decorative layer 102, and a surface shape such as a fancy hairline can be expressed.
- the decorative layer 102 may be provided directly on the base sheet 101.
- a release layer (not shown) may be formed on the entire surface before the decorative layer 102 is provided on the base sheet 101. .
- the release layer 110 is entirely formed on the surface of the base sheet 101 (or release layer).
- the peeling layer 110 is a layer that peels from the base sheet 101 or the release layer and becomes the outermost surface of the transfer object when the base sheet 101 is peeled after simultaneous molding and transfer.
- material of release layer 110 Acrylic resin, polyester resin, polysalt vinyl resin, cellulose resin, rubber resin, polyurethane resin, polyacetic acid resin resin, vinyl chloride — Copolymers such as vinyl acetate copolymer resin and ethylene vinyl acetate copolymer resin may be used.
- the scratch resistance of the transparent window portion 53 is obtained. Can be further improved.
- the release layer 110 may be colored or uncolored. Examples of the method for forming the release layer 110 include a gravure coating method, a roll coating method, a coating method such as a comma coating method, a printing method such as a gravure printing method, and a screen printing method.
- the design layer 111 is usually formed on the release layer 110 as a printing layer.
- the material of the printing layer is polyvinyl resin, polyamide resin, polyester resin, acrylic resin, polyurethane resin, polybulassal resin, polyester urethane resin, cellulose ester resin It is recommended to use colored inks containing a resin, such as a resin, an alkyd resin, and a suitable color pigment or dye as a colorant!
- a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method may be used.
- the offset printing method and the Daravia printing method are suitable for multicolor printing and gradation expression.
- a coating method such as a gravure coating method, a roll coating method, or a comma coating method may be employed.
- a transparent area 11 lb transferred to the transparent window 53 and an opaque area 11 la transferred to the main body 54 are formed as a pattern to be formed on the design layer 111.
- the boundary between the transparent window 53 and the main body 54 is formed so that the opaque region 11 la is wider than the transparent window 53 in order to prevent misalignment due to misalignment between the shape of the molded product and the design layer 111. And try to cover the border.
- the transparent region 111b is a layer configured to transmit light, and uses an ink containing a transparent resin. Specifically, inks that have power only with transparent resin, inks that have power with dye and resin binder, color pigments and fluorescent pigments with small particle size that do not have a significant effect on visibility Ink composed of a binder may be used.
- the opaque region 11 la is a layer printed so as to block light, and has a concealable car. It is preferable to use an ink made of an opaque material such as Bon Black or acid titanium and a resin binder.
- the opaque region 11la of the design layer 111 may be a metal thin film layer force or a combination force of a printed layer and a metal thin film layer.
- the metal thin film layer is for expressing the metallic luster as the pattern layer 111, and is formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method or the like.
- Use metal such as aluminum, nickel, gold, platinum, chromium, iron, copper, tin, indium, silver, titanium, lead, zinc, alloys or compounds of these depending on the metallic luster color to be expressed.
- an anchor layer may be provided in order to improve the adhesion between the other decorative layer 102 and the metal thin film layer.
- the material of the anchor layer includes two-component cured urethane resin, thermosetting urethane resin, melamine resin, cellulose ester resin, chlorine-containing rubber resin, chlorine-containing resin resin, acrylic resin It is recommended to use a resin, epoxy resin, vinyl copolymer resin.
- the method for forming the anchor layer include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, a printing method such as a gravure printing method, and a screen printing method.
- the adhesive layer 112 adheres each of the above layers to the surface of the transfer object, and is formed over the entire surface.
- a heat-sensitive or pressure-sensitive resin suitable for the resin material to be transferred may be appropriately used.
- the method for forming the adhesive layer 112 include a coating method such as a gravure coating method, a mouth coating method, and a comma coating method, a printing method such as a gravure printing method, and a screen printing method.
- the configuration of the decorative layer 102 is not limited to the above-described embodiment.
- the adhesive layer 112 can be omitted.
- the transfer material 100 is first placed in the primary molding cavity 11. Specifically, the transfer material 100 is fed between the core mold 2 and the cavity mold 4 constituting the primary molding cavity 11. At that time, the sheet-like transfer material 100 may be fed one by one, or necessary portions of the long transfer material 100 may be intermittently fed one by one. Using long transfer material 100 In this case, a feeding device having a positioning mechanism is used so that the design layer 111 of the transfer material 100 and the molding die are registered.
- the transfer material 100 when the transfer material 100 is intermittently fed, if the position of the transfer material 100 is detected by a sensor (not shown) and then the transfer material 100 is fixed to the core type and the cavity type, The transfer material 100 can always be fixed at the same position, and the displacement of the pattern layer 111 can be suppressed.
- the transfer material 100 is brought into close contact with the cavity surface of the cavity type 4.
- a film clamp (not shown) may be used.
- a suction hole 5 may be provided in the cavity type so that the transfer material 100 is sucked.
- the transfer material 100 may be heated and softened.
- an electrothermal heater (not shown) capable of heating to a temperature of about 80 to 260 ° C. is suitable.
- the cavity mold 4 and the primary molding core mold 2 are clamped to form the primary molding cavity 11. Thereafter, the molten primary molding resin melted from the gate provided in the primary molding core mold 2 is injected, filled in the primary molding cavity 11, and a primary molded body corresponding to the transparent window portion 53 is molded. At the same time, the transfer material 100 is adhered to the surface. At this time, the decorative layer 102 of the transfer material 100 is bonded to the primary molded body at the portion where the decorative layer 102 of the transfer material 100 and the transparent resin are in contact with each other.
- the visible light transmittance specified in JIS-K7105 (1981) is 0% or more
- the pencil hardness specified in JIS- 5600-5-4 (1999) is F or more. It is preferable to use those.
- JIS-K5600-5-4 is a test related to the drag strength of the coating film, but the same test method was tested for the case where a primary molded resin plate was used as a test piece, and the presence or absence of indentations was visually observed. You can evaluate with.
- the transparent resin having a visible light transmittance of 80% or more specified in JIS-K7105 is used to ensure the screen visibility of the transparent window portion 53. If the visible light transmittance is less than 80%, the display of the transparent window portion 53 becomes dark, and the display on the lower side of the transparent window portion 53 becomes illegible.
- JI The reason why the transparent resin having a pencil hardness specified in S-K5600-5-4 is F or higher is to prevent the transparent window 53 from being damaged.
- the transparent resin satisfying such characteristics for example, polymethylmetatalylate (PMMA) resin, PMMA resin with a rubber component added, or the like may be used. The addition amount is preferably about 10 to 50% by weight of rubber material such as sulfurized rubber with respect to the PMMA resin.
- the cavity mold 4 and the core mold 2 are opened (see Fig. 2C). Since the primary compact is adhered to the transfer film, it remains in the cavity mold 4. As shown in Fig. 2B, the primary molding cavity 11 has a side wall extending from the opening to the bottom so that the primary molded body of the transparent window 53 does not separate from the cavity mold 4 when the mold is opened. It is recommended that l is beveled to have a so-called undercut shape in which the bottom surface is wider than the opening.
- the transparent window 53 is difficult to be pulled out by being caught on the side wall of the cavity of the cavity type (or core type), and the transparent window part 53 is separated from the core type (or cavity type) and immediately becomes a cavity type (or It is effective because it is separated from the core type.
- the secondary molding core mold 3 is moved to a position facing the cavity mold 4 with the transfer material 100 and the primary molded body kept in close contact with each other. Specifically, it is preferable to rotate a rotating plate, which is a core type movable platen, or to slide a slide platen by the drive unit and the shaft of the injection unit.
- both molds are closed with the transfer material placed on the cavity mold 4 (see FIG. 3A), forming a secondary forming cavity 12.
- the primary molded body is inserted into the secondary molding cavity 12 and functions as one of the members that define the secondary molding cavity 12. Therefore, the secondary molding cavity 12 is formed in a state where the primary molded body corresponding to the transparent window portion 53 remains, so that the secondary molded resin that forms the main body 54 around the primary molded body is formed. It will be injected.
- the secondary molded resin it is preferable to use a resin having an Izod impact strength defined by ASTM-D256 of lOKjZm 2 or more.
- the injection of the secondary molding resin is carried out by the injection mechanism of the injection unit from the injection nozzle for secondary molding resin to the secondary molding resin injection path 14. Dispense (see Figure 3B).
- the secondary molded resin is filled around the primary molded body, and the primary molded body and the secondary molded resin are fixed and integrated. Further, the decorative layer 102 of the transfer material 100 adheres to the surface of the secondary molded resin, whereby a molded product having the decorative layer 102 laminated on the surface is obtained.
- a secondary molded resin having an Izod impact strength of 10 KJ Zm 2 or more as defined in ASTM-D256 It is preferable to use a secondary molded resin having an Izod impact strength of 10 KJ Zm 2 or more as defined in ASTM-D256.
- a resin having an Izod impact strength of lOKjZm 2 or more as defined in ASTM-D256 is used to ensure the strength required for the main body 54. If the Izod impact strength is less than lOKjZm 2 , there is a problem that it cannot withstand the impact when dropped.
- the resin satisfying such characteristics for example, PC resin, ABS resin, and mixed resin thereof may be used.
- the core mold 3 for secondary molding 3 and the cavity mold 4 are opened, and a molded product in which the primary molded body and the secondary molded body are integrated and the transfer material 100 is adhered to the surface is taken out.
- the base sheet 101 is peeled off.
- the primary molded body constituting the transparent window portion 53 and the secondary molding constituting the main body portion 54 are used. It is possible to obtain the electronic device casing 10 in which the opaque pattern is transferred to the connection portion with the body.
- the molding order of the two types of resin may be reversed.
- a resin having a high molding temperature is selected as the resin to be molded later, the surface of the primary molded body is partially melted when the secondary molding resin is injected around the primary molded body.
- the adhesion between the two members can be further strengthened.
- the molding temperature of PC resin or mixed resin of PC resin and ABS resin is higher than the molding temperature of PMMA resin.
- transparent resin made of PMMA resin is used.
- the window part 53 is formed as a primary molded body, and then the main body part 54 such as PC resin or a mixed resin of PC resin and ABS resin is formed as a secondary molded body.
- a biaxially stretched polyethylene terephthalate film with a thickness of 38 ⁇ m was used as the base sheet, and On top of this, an ink that has a mixture power of UV curable acrylic polyol, isocyanate and azo polymerization initiator as a release layer was applied to a thickness of 5 ⁇ m by the gravure coating method.
- Four layers of pigment dispersed ink are applied by gravure printing at a thickness of 0.8 to 1.5 / zm, respectively, and a salt-bull acetate bull copolymer copolymer resin is gravure coated as an adhesive layer.
- the transfer material was obtained by coating to a thickness of 2 ⁇ m by the method.
- the transfer material thus obtained was loaded into a transfer material feeding device installed in a two-color molding apparatus, and the primary molding core mold and the cavity mold were clamped to form a primary molding cavity.
- PMMA resin was injection molded into the primary molding cavity to form a primary molded body corresponding to the transparent window.
- the core mold was changed to a secondary molding core mold to form a secondary molding cavity.
- the core mold for primary molding and the cavity mold were opened, the primary molded body adhered to the transfer material, and it was difficult to cause displacement or dropping.
- a secondary molded body corresponding to the main body was formed by injection molding a mixed resin of PC resin and ABS resin into the secondary molding cavity.
- the molded product thus obtained was taken out from the mold, and the base sheet of the transfer material was peeled off to produce a mobile phone casing.
- the mobile phone casing had a pattern transferred to the surface of the main body, and the transparent window was firmly fixed to the main body.
- the boundary between the main body and the transparent window was covered with a pattern, and the boundary was strong enough to see no external force.
- the cellular phone casing thus obtained was provided with a transparent window portion excellent in scratch resistance and a main body portion excellent in impact strength.
- the cavity for secondary molding may be included in one of the cavity mold 4 and the core mold 3 for secondary molding, or both.
- the molded resin injection path may be provided in different core molds for the primary molding and the secondary molding.
- the primary molded resin injection path 13 for feeding primary molded resin to the primary molding cavity 11 is formed in the cavity mold 4 and the secondary molded resin injection path 14 for feeding secondary molded resin is used for secondary molding.
- the core mold 3 may be provided. With this configuration, the primary resin molded product corresponding to the transparent window 53 is likely to be attached to the cavity mold 4 by the primary molded resin injection path 13. That is, the primary molding core mold 2 and the mold are exchanged for the secondary molding core mold 3. When the tee mold 4 is opened, the primary resin molding can be prevented from falling off.
- the present invention can be suitably used for manufacturing an electronic device casing having a transparent window portion firmly fixed to the main body, and as a method for manufacturing an electronic device casing such as a mobile phone or a PDA. Industrially useful.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06715411A EP1857251A4 (en) | 2005-03-10 | 2006-03-08 | METHOD FOR MANUFACTURING AN ENCLOSURE FOR ELECTRONIC EQUIPMENT |
JP2007507156A JP4642071B2 (ja) | 2005-03-10 | 2006-03-08 | 電子機器用筐体の製造方法 |
BRPI0608841-4A BRPI0608841A2 (pt) | 2005-03-10 | 2006-03-08 | método para produção de invólucro para aparelho eletrÈnico |
CA002600109A CA2600109A1 (en) | 2005-03-10 | 2006-03-08 | Process for producing housing for electronic equipment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-066461 | 2005-03-10 | ||
JP2005066461 | 2005-03-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006095781A1 true WO2006095781A1 (ja) | 2006-09-14 |
Family
ID=36953375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/304491 WO2006095781A1 (ja) | 2005-03-10 | 2006-03-08 | 電子機器用筐体の製造方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US20080122137A1 (ja) |
EP (1) | EP1857251A4 (ja) |
JP (1) | JP4642071B2 (ja) |
KR (1) | KR20070116595A (ja) |
CN (1) | CN101137486A (ja) |
BR (1) | BRPI0608841A2 (ja) |
CA (1) | CA2600109A1 (ja) |
MX (1) | MX2007010932A (ja) |
RU (1) | RU2007137562A (ja) |
TW (1) | TW200637712A (ja) |
WO (1) | WO2006095781A1 (ja) |
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JP2009078436A (ja) * | 2007-09-26 | 2009-04-16 | Toppan Printing Co Ltd | 二色成形品およびその製造方法 |
US7769354B2 (en) | 2006-11-22 | 2010-08-03 | Shenzhen Futaihong Precision Industry Co., Ltd. | Mobile device housing with a display unit, and method for making the mobile device housing |
JP2010234787A (ja) * | 2009-03-31 | 2010-10-21 | Nissha Printing Co Ltd | 皮革インサート成形品とその製造方法 |
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- 2006-03-08 KR KR1020077020174A patent/KR20070116595A/ko not_active Application Discontinuation
- 2006-03-08 JP JP2007507156A patent/JP4642071B2/ja not_active Expired - Fee Related
- 2006-03-08 MX MX2007010932A patent/MX2007010932A/es not_active Application Discontinuation
- 2006-03-08 BR BRPI0608841-4A patent/BRPI0608841A2/pt not_active IP Right Cessation
- 2006-03-08 US US11/886,039 patent/US20080122137A1/en not_active Abandoned
- 2006-03-08 EP EP06715411A patent/EP1857251A4/en not_active Withdrawn
- 2006-03-08 CN CNA2006800078118A patent/CN101137486A/zh active Pending
- 2006-03-08 CA CA002600109A patent/CA2600109A1/en not_active Abandoned
- 2006-03-08 RU RU2007137562/12A patent/RU2007137562A/ru not_active Application Discontinuation
- 2006-03-09 TW TW095107928A patent/TW200637712A/zh unknown
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Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US7769354B2 (en) | 2006-11-22 | 2010-08-03 | Shenzhen Futaihong Precision Industry Co., Ltd. | Mobile device housing with a display unit, and method for making the mobile device housing |
JP2008307880A (ja) * | 2007-05-11 | 2008-12-25 | Toppan Printing Co Ltd | 二色成形品およびその製造方法 |
JP2009066763A (ja) * | 2007-09-10 | 2009-04-02 | Sol-Plus Co Ltd | 被膜成形体 |
JP2009078436A (ja) * | 2007-09-26 | 2009-04-16 | Toppan Printing Co Ltd | 二色成形品およびその製造方法 |
JP2010234787A (ja) * | 2009-03-31 | 2010-10-21 | Nissha Printing Co Ltd | 皮革インサート成形品とその製造方法 |
JP2012121159A (ja) * | 2010-12-06 | 2012-06-28 | Sanwa Screen Meiban:Kk | 導光型装飾樹脂成型品およびその製造方法 |
KR101351436B1 (ko) * | 2013-09-05 | 2014-01-16 | 범진아이엔디(주) | 전자기기의 액정화면용 뷰 커버 제조 방법 및 이에 의해 제조된 뷰 커버 |
JP2018130846A (ja) * | 2017-02-13 | 2018-08-23 | Nissha株式会社 | 加飾成形品の製造方法 |
WO2018146875A1 (ja) * | 2017-02-13 | 2018-08-16 | Nissha株式会社 | 加飾成形品の製造方法 |
WO2019077965A1 (ja) * | 2017-10-16 | 2019-04-25 | Nissha株式会社 | 成形品及び当該成形品を含む表示装置並びに成形品の製造方法 |
JP2019072916A (ja) * | 2017-10-16 | 2019-05-16 | Nissha株式会社 | 成形品及び当該成形品を含む表示装置並びに成形品の製造方法 |
CN111212717A (zh) * | 2017-10-16 | 2020-05-29 | 日写株式会社 | 成型品及包含该成型品的显示装置以及成型品的制造方法 |
US10810911B2 (en) | 2017-10-16 | 2020-10-20 | Nissha Co., Ltd. | Molded article, display device including the molded article, and method for manufacturing molded article |
CN111212717B (zh) * | 2017-10-16 | 2022-03-11 | 日写株式会社 | 成型品及包含该成型品的显示装置以及成型品的制造方法 |
DE102017012070A1 (de) * | 2017-12-29 | 2019-07-04 | Rehau Ag + Co | Verfahren zur Herstellung eines wenigstens zwei Farbschichten aufweisenden Bauteils für ein Kraftfahrzeug |
DE102017012070B4 (de) | 2017-12-29 | 2020-04-30 | Rehau Ag + Co | Verfahren zur Herstellung eines wenigstens zwei Farbschichten aufweisenden Bauteils für ein Kraftfahrzeug |
JP2020116838A (ja) * | 2019-01-24 | 2020-08-06 | アイシン精機株式会社 | 型内塗装用金型及び型内塗装方法 |
JP7211105B2 (ja) | 2019-01-24 | 2023-01-24 | 株式会社アイシン | 型内塗装用金型及び型内塗装方法 |
Also Published As
Publication number | Publication date |
---|---|
BRPI0608841A2 (pt) | 2010-02-02 |
JPWO2006095781A1 (ja) | 2008-08-14 |
RU2007137562A (ru) | 2009-04-20 |
JP4642071B2 (ja) | 2011-03-02 |
CN101137486A (zh) | 2008-03-05 |
EP1857251A4 (en) | 2009-08-12 |
US20080122137A1 (en) | 2008-05-29 |
EP1857251A1 (en) | 2007-11-21 |
MX2007010932A (es) | 2007-10-15 |
KR20070116595A (ko) | 2007-12-10 |
CA2600109A1 (en) | 2006-09-14 |
TW200637712A (en) | 2006-11-01 |
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