Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
  • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R33/00—Arrangements or instruments for measuring magnetic variables
  • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
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  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49541—Geometry of the lead-frame
  • H01L23/49548—Cross section geometry
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  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49575—Assemblies of semiconductor devices on lead frames
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  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
  • H01L2224/0554—External layer
  • H01L2224/0555—Shape
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  • H01L2224/05554—Shape in top view being square
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  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
  • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
  • H01L2224/321—Disposition
  • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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  • H01L2224/4805—Shape
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  • H01L2224/481—Disposition
  • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
  • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
• • H—ELECTRICITY
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  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
  • H01L2224/491—Disposition
  • H01L2224/4912—Layout
  • H01L2224/49171—Fan-out arrangements
• • H—ELECTRICITY
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  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
• • H—ELECTRICITY
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  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/42—Wire connectors; Manufacturing methods related thereto
  • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/42—Wire connectors; Manufacturing methods related thereto
  • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
• • H—ELECTRICITY
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  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• • H—ELECTRICITY
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  • H01L2924/01—Chemical elements
  • H01L2924/01004—Beryllium [Be]
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  • H01L2924/01—Chemical elements
  • H01L2924/01067—Holmium [Ho]
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  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation

Definitions

• the present invention relates to a physical quantity sensor for measuring the direction and direction of a physical quantity such as magnetism and gravity, and a lead frame used for the physical quantity sensor.
• GPS Global Positioning System
• a magnetic sensor in which two magnetic sensor chips are mounted on a non-tilted installation surface.
• This magnetic sensor is a magnetic sensor chip (physical quantity sensor chip) that is mounted on a substrate and is sensitive to the magnetic component of an external magnetic field in two directions (X and Y directions) perpendicular to each other along the surface of the substrate.
• the other magnetic sensor chip sensitive to the magnetic component of the external magnetic field in the direction perpendicular to the surface of the substrate (Z direction).
• This magnetic sensor uses the magnetic component detected by the pair of magnetic sensor chips to measure the geomagnetic component as a vector in three-dimensional space.
• Patent Documents 1, 2, and 3 describe that the physical quantity sensor chip is mounted on the inclined installation surface as described above in order to reduce the thickness as much as possible.
• Patent Document 1 discloses an acceleration sensor as a physical quantity sensor.
• This acceleration sensor has a one-side beam structure, and an acceleration sensor chip is tilted in advance with respect to the substrate. Therefore, the sensitivity in the predetermined axial direction corresponding to the tilt direction can be kept high, and the sensitivity in the other axial direction including the direction along the surface of the substrate can be reduced.
• the conventional physical quantity sensor requires a sufficient area and height for packaging in order to place the physical quantity sensor chip on the inclined installation surface. Therefore, there is a limit to using the conventional packaging in a compact portable terminal device.
• Patent Document 1 Japanese Patent Laid-Open No. 9-292408
• Patent Document 2 Japanese Patent Laid-Open No. 2002-156204
• Patent Document 3 Japanese Patent Application Laid-Open No. 2004-128473
• the present invention has been made in view of the circumstances described above, and provides a physical quantity sensor capable of storing a physical quantity sensor chip in a small and thin package and tilting it, and a lead frame used therefor. For the purpose.
• a lead frame having a metallic thin plate force includes a physical quantity sensor chip and at least two stage portions having an area smaller than a placement surface of the physical quantity sensor chip.
• a deformable part that is formed on the connecting lead and inclines the stage part by being deformed, and the physical quantity sensor chip has a mounting surface that is part of the stage part and the plurality of leads. And are superposed in the thickness direction of the frame portion.
• the connecting lead is the lead arranged on one side of the frame part, and the stage part is centered on a reference axis with respect to the frame part in the middle part of the connecting lead.
• An easily deformable part for inclining may be formed.
• the physical quantity sensor chip is placed on the surface of each stage unit.
• a part of the mounting surface of the physical quantity sensor chip is disposed so as to overlap with a part of the plurality of leads in order to protrude from the stage part.
• the easily deformable portion is deformed and the stage portion and the physical quantity sensor chip can be inclined with respect to the frame portion around the reference axis.
• the tip end portion of the connecting lead located on the stage portion side of the easily deformable portion is inclined together with the stage portion. That is, even if the tip of the connection lead and the physical quantity sensor chip are arranged at positions where they overlap each other in the thickness direction of the lead frame, the physical quantity sensor chip and the connection lead can be prevented from interfering (contacting) with each other.
• connection lead protrudes from the pair of stage portion forces at a position symmetrical with respect to the central axis passing through the center of the stage portion and is connected to the frame portion.
• the deformable twisted portion may be a deformable twisted portion, and the twisted portion and the stage portion may be arranged at a position shifted in the thickness direction of the lead frame with respect to the lead.
• the pair of connecting leads connected to each stage portion is twisted around the reference axis at the twisted portion by pressing the stage portion while the frame portion is fixed.
• the stage part can be inclined with respect to the frame part.
• the lead frame can be made smaller than the physical quantity sensor chip, and the physical quantity sensor can be made smaller.
• a sheet-like insulating film having an electric insulating material force may be provided on the surface of the stage portion.
• the physical quantity sensor chip is placed on the surface of each stage portion via an insulating film. Next, the physical quantity sensor chip and the lead are electrically connected by wire bonding. After that, by pressing the stage portion with the frame portion fixed, the easily deformable portion is deformed, and the stage portion and the physical quantity sensor chip can be inclined with respect to the frame portion around the reference axis. Monkey.
• the physical quantity sensor chip and the stage part are electrically insulated by the insulating film, the physical quantity sensor chip and the connecting lead connected to the stage part are electrically insulated. Therefore, a connecting lead can also be used for electrical connection of the physical quantity sensor chip by wire bonding described above. That is, it is possible to increase the number of leads that can be electrically connected to the physical quantity sensor chip without changing the size of the lead frame.
• each of the stage portions is disposed at a position closer to one corner portion than the other corner portions of the inner region of the lead frame, and the magnetic sensor chip 1 It may be arranged so as to overlap only a plurality of leads provided on one side.
• the physical quantity sensor chip is placed on the surface of the stage portion adjacent to one corner of the lead frame.
• the mounting surface that protrudes from the surface of the stage portion of the physical quantity sensor chip is arranged so as to overlap a part of the plurality of leads provided on the same side in the thickness direction of the lead frame.
• the physical quantity sensor chip and the lead are electrically connected by wire bonding.
• Wire bonding is difficult for the lead that overlaps the physical quantity sensor chip in the thickness direction.
• the number of leads overlapping the physical quantity sensor chip is reduced as compared with the case where the stage portion is arranged at the center of one side of the inner region of the lead frame. Therefore, it is possible to secure a sufficient number of leads that can be electrically connected to the physical quantity sensor chip without changing the arrangement of the leads with respect to the rectangular frame portion.
• the connecting lead is deformed so that the stage part and the physical quantity sensor chip are connected to the lead frame. Tilt against the lemma.
• the lead frame is formed in a substantially square shape, and the two stage portions are disposed so as to be close to two corner portions located on the same side of the inner region. It's okay to be.
• the stage portion by placing the stage portion on the same side of the inner region, the inner region located on the side facing the one side becomes a surplus region. It is possible to newly provide a stage section for mounting another physical quantity sensor chip or signal processing LSI in the area.
• the two stage portions may be disposed on diagonal lines of the inner region.
• stage part, physical quantity sensor chip, and lead are integrally molded by grease using the lead frame having this structure
• the stage part and physical quantity are inserted into the grease forming space in the mold while the frame part is sandwiched between the molds.
• one corner force located on the other diagonal intersecting with one diagonal in the arrangement direction of the two stage portions is directed toward the other corner.
• the melted resin is allowed to flow into the resin-forming space. Since the stage part and the physical quantity sensor chip are not located on the inflow path of the resin, it is possible to prevent the flow of the molten resin from being blocked by the physical quantity sensor chip.
• the physical quantity sensor includes a stage part on which the physical quantity sensor chip is mounted, a plurality of leads including a connection lead arranged around the stage part and connected to the stage part, and the connection lead And an easily deformable portion that tilts the stage portion by being deformed and an end portion that is placed on the tilted stage portion and overlaps a part of the plurality of leads in the thickness direction of the leads.
• the physical quantity sensor chip arranged, and the mold part for fixing the stage part, the plurality of leads, and the physical quantity sensor chip integrally.
• the physical quantity sensor chip can be tilted without bringing the lead and the physical quantity sensor chip into contact with each other. Can be miniaturized.
• the physical quantity sensor that stores the physical quantity sensor chip in a tilted manner in the package can be made smaller and thinner.
• FIG. 1 is a plan view showing a lead frame according to a first embodiment of the present invention.
• FIG. 2 is a side sectional view showing a state where a magnetic sensor chip is mounted on the lead frame shown in FIG.
• FIG. 3A is an enlarged side view showing a protruding piece of the lead frame shown in FIG.
• FIG. 3B is an enlarged cross-sectional view showing a protruding piece of the lead frame shown in FIG.
• FIG. 3C is an enlarged cross-sectional view showing a method of forming the protruding piece of the lead frame shown in FIG.
• FIG. 4 is a side sectional view showing a method of tilting the stage portion in the lead frame shown in FIG.
• FIG. 5 is a side sectional view showing a method of tilting the stage portion in the lead frame shown in FIG. 1.
• FIG. 6 is a plan view showing a magnetic sensor manufactured using the lead frame shown in FIG. 1.
• FIG. 6 is a plan view showing a magnetic sensor manufactured using the lead frame shown in FIG. 1.
• FIG. 7 is a side sectional view of the magnetic sensor shown in FIG.
• FIG. 8 is a side sectional view showing a modification of the connecting lead in the first embodiment of the present invention.
• FIG. 9 is a side sectional view showing another modified example of the connecting lead in the first embodiment of the present invention.
• FIG. 10 is a plan view showing another example of a magnetic sensor manufactured using the lead frame shown in FIG. 1.
• FIG. 11 is a plan view showing a lead frame according to a second embodiment of the present invention.
• FIG. 12 is a side sectional view showing a state in which a magnetic sensor chip is mounted on the lead frame shown in FIG. 11.
• FIG. 13 is a side sectional view showing a magnetic sensor manufactured using the lead frame shown in FIG. 11.
• FIG. 14 is a side sectional view showing a magnetic sensor using a lead frame according to a modification of the second embodiment of the present invention.
• FIG. 15 is a side sectional view showing a modification of the protruding piece in the first and second embodiments of the present invention.
• FIG. 16 is a side sectional view showing a bending process of the protruding piece shown in FIG.
• FIG. 17 is a side sectional view showing another modification of the protruding piece in the first and second embodiments of the present invention.
• FIG. 18 is a side sectional view showing still another modification of the protruding piece in the first and second embodiments of the present invention.
• FIG. 19 is a plan view showing a first modification of the protruding piece in the first embodiment of the present invention.
• FIG. 20 is a side cross-sectional view showing a state where a magnetic sensor chip is mounted on the lead frame shown in FIG.
• FIG. 21 is a plan view showing a second modification of the protruding piece in the first embodiment of the present invention.
• FIG. 22 is a side sectional view showing a state in which a magnetic sensor chip is mounted on the lead frame shown in FIG.
• FIG. 23 is a plan view showing a third modification of the protruding piece in the first embodiment of the present invention.
• FIG. 24 is a side sectional view showing a state where a magnetic sensor chip is mounted on the lead frame shown in FIG.
• FIG. 25 is a plan view showing a fourth modification of the protruding piece in the first embodiment of the present invention.
• FIG. 26 is a side sectional view showing a state in which a magnetic sensor chip is mounted on the lead frame shown in FIG. 25.
• FIG. 27 is a plan view showing a fifth modification of the protruding piece in the first embodiment of the present invention.
• FIG. 28 is a side sectional view showing a state where a magnetic sensor chip is mounted on the lead frame shown in FIG. 27.
• FIG. 29 is a schematic side view showing dimensions of each part of the lead frame according to the example of the present invention.
• FIG. 30 is a side sectional view showing a magnetic sensor according to an example of the present invention.
• FIG. 31 is a plan view showing a lead frame according to a third embodiment of the present invention.
• FIG. 32 is a side sectional view showing a state in which a magnetic sensor chip is mounted on the lead frame shown in FIG. 31.
• FIG. 33 is a side sectional view showing a method of tilting the stage portion in the lead frame shown in FIG. 31.
• FIG. 34 is a side sectional view showing a method of inclining the stage portion in the lead frame shown in FIG. 31.
• FIG. 35 is a plan view showing a magnetic sensor manufactured using the lead frame shown in FIG. 31.
• FIG. 36 is a sectional side view showing the magnetic sensor shown in FIG. 35.
• FIG. 37 is a plan view showing a state where a magnetic sensor chip is mounted on a lead frame according to a modification of the third embodiment of the present invention.
• FIG. 38 is a cross-sectional view taken along line GG in FIG.
• FIG. 39 is a plan view showing a lead frame according to another modification of the third embodiment of the present invention.
• FIG. 40 is a plan view showing a lead frame and a magnetic sensor according to a fourth example of the present invention.
• FIG. 41 is a cross-sectional view taken along line GG in FIG.
• FIG. 42 is a cross-sectional view taken along line HH in FIG.
• FIG. 43 is a side sectional view showing a method of tilting the stage portion in the lead frame shown in FIG. 40.
• Fig.44 shows the lead frame shown in Fig.40 with the stage part tilted. It is a sectional side view showing a method.
• FIG. 45 is a plan view showing a magnetic sensor manufactured using the lead frame shown in FIG. 40.
• FIG. 45 is a plan view showing a magnetic sensor manufactured using the lead frame shown in FIG. 40.
• FIG. 46 is a cross-sectional view taken along line I I in FIG.
• FIG. 47 is a cross-sectional view taken along line JJ of FIG.
• FIG. 48 is a plan view showing a lead frame and a magnetic sensor according to a fifth embodiment of the present invention.
• Magnetic sensor physical quantity sensor
• the magnetic sensor (physical quantity sensor) according to this embodiment measures the direction and magnitude of an external magnetic field by using two magnetic sensor chips inclined with respect to each other.
• This magnetic sensor is manufactured using a lead frame formed by pressing and etching a thin metal plate such as a copper plate.
• the lead frame 1 includes two stage portions 7, 9 for arranging magnetic sensor chips (physical quantity sensor chips) 3, 5 formed in a rectangular plate shape in plan view, And a frame portion 11 for supporting the tee portions 7 and 9.
• the stage portions 7 and 9 and the frame portion 11 are integrally formed.
• the frame portion 11 includes a rectangular frame portion 13 formed in a rectangular frame shape so as to surround the stage portions 7 and 9, and an inward direction from the rectangular frame portion 13. It is also a force with multiple protruding leads 15, 17.
• the lead 15 is electrically connected to a bonding pad (not shown) of the magnetic sensor chips 3 and 5.
• the lead 17 (hereinafter also referred to as a connecting lead 17) serves as a connecting lead that connects the rectangular frame portion 13 and the stage portions 7 and 9 to each other. Note that the lead 15 for electrical connection includes a lead protruding from the corner of the rectangular frame portion 13.
• the two stage portions 7, 9 are arranged side by side along one side of the rectangular frame portion 13, and the magnetic sensor chips 3, 5 are placed on the surfaces 7a, 9a, respectively.
• One end portions 7b, 9b of each stage portion 7, 9 are connected to a plurality of connecting leads 17 protruding in a direction in which these two stage portions 7, 9 are arranged.
• Photoetching force is applied to the surfaces 7a and 9a of the stage portions 7 and 9 and the surface 17b from the leading end portion 17a to the midway portion of the connecting lead 17 positioned on the stage portions 7 and 9 side. Accordingly, the thickness of the distal end portion 17a of the connecting lead 17 and the stage portions 7 and 9 is thinner than the base end portion 17c of the connecting lead 17 and the projecting pieces 19 and 21 described later.
• the surface 17b of the tip portion 17a of the connecting lead 17 is flush with the surfaces 7a, 9a of the stage portions 7, 9, and the magnetic sensor chips 3, 5 are placed thereon.
• a pair of projecting pieces 19 and 21 projecting toward the back surfaces 7d and 9d of the stage portions 7 and 9 are formed on the other end portions 7c and 9c of the stage portions 7 and 9 facing each other.
• These protruding pieces 19 and 21 are alternately arranged along the width direction of the stage portions 7 and 9.
• the above-mentioned photo etching cover is also applied to the base ends of the protruding pieces 19, 21 that bend the protruding pieces 19, 21 with respect to the stage parts 7, 9, and have the same thickness as the stage parts 7, 9. It has become.
• the base end portions of the protruding pieces 19 and 21 are formed thinner than the other portions and can be deformed. Therefore, the inclination angle of the protruding pieces 19 and 21 with respect to the stage portions 7 and 9 can be set with high accuracy.
• V-shaped grooves 25 are formed on the surfaces 19a and 21a of the projecting pieces 19 and 21 located on the same side as the surfaces 7a and 9a of the stage portions 7 and 9, respectively. Is formed.
• the ribs 23 and the grooves 25 enhance the rigidity of the projecting pieces 19 and 21 to prevent the projecting pieces 19 and 21 from being pinched when an external force is applied to the tips of the projecting pieces 19 and 21.
• these projecting pieces 19, 21 are punched toward the front surfaces 19a, 21a from the back surface 19b, 21b force in a punching cage for forming the lead frame 1 from a thin metal plate. Formed. Therefore, the front end portions 19c and 21c on the back surfaces 19b and 21b of the projecting pieces 19 and 21 are smoothly rounded.
• each of the magnetic sensor chips 3 and 5 is bonded to the surfaces 7a and 9a of the stage portions 7 and 9, respectively.
• each of the magnetic sensor chips 3 and 5 is arranged so that one side thereof is orthogonal to the longitudinal direction of the connecting lead 17.
• Each of the magnetic sensor chips 3 and 5 is disposed in a region extending from the leading end portion 17a to the middle portion of the connecting lead 17 formed thin by the above-described photoetching process.
• bonding pads (not shown) arranged at equal intervals on the surfaces of the magnetic sensor chips 3 and 5 and the connecting leads 17 are electrically connected by wires (not shown).
• wires not shown
• the rectangular frame portion 13 of the lead frame 1 is disposed on the surface E2 of the mold E having the recess E1.
• the leads 15 and 17, the stage portions 7 and 9, the magnetic sensor chips 3 and 5, and the protruding pieces 19 and 21 inside the rectangular frame portion 13 are arranged above the recess E1.
• the magnetic sensor chips 3 and 5, the stage portions 7 and 9, and the protruding pieces 19 and 21 are sequentially positioned from the concave portion E1 side to the upper side.
• a mold F having a flat surface F1 is provided above the protruding pieces 19 and 21, and the rectangular frame portion 13 of the lead frame 1 is sandwiched together with the mold E described above. Between the lead frame 1 and the mold F, a sheet S is inserted to prevent the grease burrs from adhering to the leads 15 and to easily separate the mold F and the grease.
• the rectangular frame portion 13 is sandwiched between these two molds E and F. Then, the front end portions 19c and 21c of the projecting pieces 19 and 21 are pressed by the flat surface F1 of the mold F. Sudden Since the rigidity of the protruding pieces 19 and 21 is reinforced by the ribs 23 and the V-shaped grooves 25, it is possible to prevent the protruding pieces 19 and 21 from being pinched by this pressing. At this time, the force at which the leading ends of the protruding pieces 19, 21 and the sheet S come into contact with each other. The leading ends 19c, 21c of the protruding pieces 19, 21 are rounded. 19 and 21 can prevent the sheet S from being torn.
• the stage portions 7 and 9 are inclined with respect to the frame portion 1 around the reference axis L1 that connects the intermediate portions 17d of the connecting leads 17 that support the same magnetic sensor chips 3 and 5. Since the middle portion 17d of the connecting lead 17 is thinly formed by photoetching and is an easily deformable portion, the stage portions 7 and 9 can be easily inclined. Thereby, the magnetic sensor chips 3 and 5 mounted on the stage portions 7 and 9 are inclined at a predetermined angle with respect to the rectangular frame portion 13 and the flat surface F1.
• the resin used here is preferably a material with high fluidity so that the inclination angle of the magnetic sensor chips 3 and 5 and the stage parts 7 and 9 does not change due to the flow of the resin.
• the magnetic sensor chips 3 and 5 provided in the magnetic sensor 30 manufactured as described above are inclined with respect to the lower surface 27 a of the resin mold portion 27. Further, the one end portions 3b and 5b of the magnetic sensor chips 3 and 5 facing each other face the upper surface 27c side of the resin mold portion 27.
• the surface 3a of the magnetic sensor chip 3 is inclined at an acute angle with respect to the surface 5a of the magnetic sensor chip 5. That is, the angle ⁇ of the stage part 7 with respect to the stage part 9 is an acute angle.
• the magnetic sensor chip 3 is sensitive to the two-direction magnetic components of the external magnetic field.
• These two sensitive directions are the A direction and the B direction perpendicular to each other along the surface 3a of the magnetic sensor chip 3.
• the magnetic sensor chip 5 is sensitive to the two-direction magnetic component of the external magnetic field. These two sensitive directions are the C direction and the D direction perpendicular to each other along the surface 5a of the magnetic sensor chip 5.
• the A and C directions are parallel to the reference axis L1 and are opposite to each other.
• the B and D directions are directions orthogonal to the reference axis L1, and are opposite to each other.
• the A-B plane including the A and B directions along the surface 3a intersects the CD plane including the C and D directions along the surface 5a at an acute angle ⁇ .
• This angle 0 is greater than 0 ° and less than 90 °, and theoretically, if the angle is greater than 0 °, the three-dimensional geomagnetic orientation can be measured.
• the angle ⁇ is preferably 20 ° or more, more preferably 30 ° or more.
• the back surface 15ai of the plurality of leads 15 for electrically connecting the magnetic sensor chips 3 and 5 to the outside is exposed by the force of the lower surface 27a of the moonlight moored rod 27!
• One end of the lead 15 is electrically connected to the magnetic sensor chips 3 and 5 by a metal wire 29, and the connecting portion is embedded in the resin mold portion 27.
• the middle part 17d and the leading end part 17a of the connecting lead 17 used for inclining the stage parts 7 and 9 are embedded in the resin mold part 27 because they are inclined together with the stage parts 7 and 9. Only the back surface 17e of the base end portion 17c of the connecting lead 17 is exposed from the lower surface 27a of the resin mold portion 27.
• the magnetic sensor 30 is mounted on a substrate in the mobile terminal device, for example.
• This portable terminal device measures the direction of geomagnetism by the magnetic sensor 30 and displays the direction on the display panel.
• an easily deformable portion for inclining the stage portions 7 and 9 is formed in the middle portion 17d of the connecting lead 17.
• the leading end portion 17a of the connecting lead 17 located on the stage portions 7 and 9 side of the easily deformable portion is inclined together with the stage portions 7 and 9. Therefore, when the magnetic sensor chips 3 and 5 are arranged and tilted at the tip portion 17a, the magnetic sensor chips 3 and 5 and the connecting lead 17 do not interfere (contact) each other. That is, the tip 17a and the magnetic sensor chips 3 and 5 can be arranged at positions that overlap in the thickness direction of the metal thin plate. Therefore, that much The magnetic sensor 30 can be reduced in size. In this manner, the magnetic sensor chips 3 and 5 can be stored in an inclined manner in a small and thin package defined inside the resin mold portion 27, and the magnetic sensor 30 can be easily downsized. .
• the magnetic sensor chips 3 and 5 can be placed on the surfaces 7a and 9a of the stage portions 7 and 9 and the surface 17b of the tip 17a of the connecting lead 17, respectively.
• the stage portions 7 and 9 can be stably placed on the surfaces 7a and 9a.
• the stage portions 7 and 9 are formed thinner than the protruding pieces 19 and 21 by photoetching, and the rigidity of the protruding pieces 19 and 21 is reinforced by the ribs 23 and the V-shaped grooves 25. Accordingly, it is possible to prevent the protruding pieces 19 and 21 from being squeezed based on the pressing force for inclining the stage portions 7 and 9 and the magnetic sensor chips 3 and 5. Therefore, it is possible to prevent the shift of the tilt angle of the stage portions 7 and 9 based on this stagnation.
• the surface 7a and 9a of the stage portions 7 and 9 to which the magnetic sensor chips 3 and 5 are bonded are formed to be recessed by the above-described photoetching cage, so that the arrangement of the magnetic sensor chips 3 and 5 is lowered.
• the magnetic sensor 30 can be thinned.
• the tip of the protruding pieces 19, 21 that contact the sheet S is formed in a rounded shape, the protruding pieces 19, 21 can prevent the sheet S from being torn and The outflow can be prevented. Therefore, the magnetic sensor 30 having an accurate external shape can be manufactured.
• the magnetic sensor chips 3 and 5 may be bonded to a force that is merely placed on the surface 17b of the distal end portion 17a of the connecting lead 17.
• the stage portions 7 and 9 and the leading end portion 17a of the connecting lead 17 are arranged at positions shifted in the thickness direction of the metal thin plate with respect to the base end portion 17c of the connecting lead 17. You can do it.
• the position of the reference axis line L1 is also arranged at a position shifted in the thickness direction of the metal thin plate, similarly to the stage portions 7 and 9.
• stage portions 7 and 9 are not limited to the force in which the photoetching force is applied to the surfaces 7a and 9a to reduce the thickness.
• photoetching force may be applied to the back surfaces 7d and 9d of the stage portions 7 and 9.
• the bonding pads are not limited to the force shown in the example in which the bonding pads are arranged on the surfaces of the magnetic sensor chips 3 and 5 at equal intervals.
• the bonding pad 28 may be disposed in the vicinity of the reference axis L1 on the magnetic sensor chips 3 and 5. In the vicinity of the reference axis L 1, there is little change in the height of each bonding pad 28 due to the inclination of the magnetic sensor chips 3 and 5. That is, in this configuration, the relative position between the lead 15 and the bonding pad 28 generated when the stage portions 7 and 9 are tilted after the lead 15 and the bonding pad 28 are electrically connected by the wire 29. Change can be reduced. Therefore, the tension change generated in the wire 29 when the stage parts 7 and 9 are tilted is suppressed to prevent the wire 29 force S lead 15 and the bonding pad 28 from coming off and the wire 29 from being disconnected. it can.
• FIGS. 1 and the magnetic sensor according to the second embodiment are different from those of the first embodiment in the connection between the frame portion and the stage portion.
• the connecting portion between the frame portion and the stage portion will be described, and the same components as those of the lead frame 1 and the magnetic sensor 30 will be described.
• the same reference numerals are given to one part, and the description thereof is omitted.
• the stage portions 7 and 9 and the rectangular frame portion 13 are connected by connecting leads (connecting portions) 16 protruding from the corners of the rectangular frame portion 13. They are interconnected.
• the connecting leads 16 are formed so as to protrude in pairs from the stage portions 7 and 9 at positions that are symmetrical with respect to the central axis L2 passing through the stage portions 7 and 9.
• one end portion 16a of the connecting lead 16 is connected to the side end portions positioned at both ends on the one end portions 7b and 9b side of the stage portions 7 and 9 positioned on the connecting lead 17 side.
• the one end portion 16a is provided with a concave notch on the side surface thereof, and is formed to be thinner than other portions of the connecting lead 16. Therefore, when the stage portions 7 and 9 are inclined, the one end portion 16a is a twisted portion that can be easily twisted around the reference axis L3 connecting the pair of end portions 16a.
• the stage portions 7 and 9 and the one end portion 16 a of the connecting lead 16 are arranged at positions shifted in the thickness direction of the metal thin plate with respect to the entire connecting lead 17.
• the distal end portion 17a of the connecting lead 17 and the one end portions 7b, 9b of the stage portions 7, 9 are arranged so as to overlap in the thickness direction.
• the magnetic sensor chips 3 and 5 are arranged so that the force stage portions 7 and 9 protrude from the surfaces 7a and 9a of the stage portions 7 and 9 to the connecting lead 17 side and the protruding pieces 19 and 21 side. In the state before tilting, the connecting lead 17 is not contacted.
• Concave grooves 18 are formed by photoetching at the base ends of the protruding pieces 19 and 21 located on the back surfaces 7d and 9d of the stage portions 7 and 9.
• the thickness dimensions of the base end portions of the projecting pieces 19 and 21 are formed thinner than other portions by the groove 18 and can be easily deformed. For this reason, it becomes possible to set the inclination angle of the protruding pieces 19 and 21 with respect to the stage portions 7 and 9 with high accuracy.
• the protruding pieces 19, 21 are pressed by the same mold as in the first embodiment, and the stage portions 7, 9 and the magnetic sensor chips 3, 5 are connected. Tilt to frame 11.
• the connecting lead 16 around the reference axis L3 One end portion 16a of the screw is twisted.
• the physical quantity sensor chips 3 and 5 facing the surface 17 b of the connecting lead 17 enter the recess 20.
• the magnetic sensor chips 3 and 5 disposed so as to protrude from the stage portions 7 and 9 in a state before the stage portions 7 and 9 are inclined. And a surface 17b of the connecting lead 17 is formed with a gap. Therefore, even if the magnetic sensor chips 3 and 5 and the connecting lead 17 overlap in the thickness direction, the magnetic sensor chips 3 and 5 are connected when the stage portions 7 and 9 and the magnetic sensor chips 3 and 5 are inclined. Interference (contact) with the lead 17 can be prevented, and the magnetic sensor 31 can be downsized. Further, a part of the inclined magnetic sensor chips 3 and 5 can enter the recess 20 formed in the surface 17b of the connecting lead 17.
• the force that forms the recess 20 in the portion of the connecting lead 17 from the distal end portion 17a to the midway portion 17d is not limited to this.
• a recess may be formed on the entire surface 17b of the connecting lead 17, that is, the thickness dimension of the connecting lead 17 may be made thinner than other parts.
• the stage portions 7 and 9 are not limited to the force connected to the connecting lead 16 and the connecting lead 17. As shown in FIG. 14, the stage portions 7 and 9 only need to be connected to a connecting lead 16 having at least a twisted portion. That is, the stage portions 7 and 9 do not have to be connected to the connecting leads 17 that overlap the magnetic sensor chips 3 and 5 in the thickness direction. However, even in this case, in order to prevent interference with the magnetic sensor chips 3 and 5, the connecting lead 17 is preferably formed with a recess 22 that is recessed from the surface 17b.
• the twisted portion of the connecting lead 16 is connected to the one end 7b, 9b side of the stage portions 7, 9, it is not limited to this.
• the twisted portion of the connecting lead 16 may be provided at a position shifted to the protruding pieces 19 and 21 side from the one end portions 7b and 9b. That is, the reference axis L3 for rotating the stage portions 7 and 9 is set to the one end 7b and 9b side of the stage portions 7 and 9 so that the force on the protruding pieces 19 and 21 side You can shift it.
• the concave groove 18 is formed in the base end part of the protrusion pieces 19 and 21, it is not restricted to this. It is sufficient that the protruding pieces 19 and 21 can be easily bent at least with respect to the stage portions 7 and 9. That is, a cut may be formed in the base end portions of the protruding pieces 19 and 21 instead of the groove 18.
• the tip portions 19c and 21c of the projecting pieces 19 and 21 that contact the sheet S were formed by punch punching.
• the tip portions 19c and 21c of the projecting pieces 19 and 21 only need to have a rounded shape. That is, as shown in FIG. 15, the distal end portions may be bent so that the back surfaces of the distal end portions of the projecting pieces 19 and 21 have a convex rounded shape. As shown in FIG. 16, this bending process is preferably performed at the same time when the projecting pieces 19 and 21 are bent with respect to the stage portions 7 and 9 using a mold.
• the photo-etching force is applied to the front surfaces 19a and 21a and the rear surfaces 19b and 21b of the leading ends 19c and 21c of the protruding pieces 19 and 21.
• the thicknesses of the tip portions 19c, 21c may be formed thinner than other portions. In the case of this configuration, the tip portions 19c and 21c can be easily bent.
• the projecting pieces 19 and 21 are formed on the other end portions 7c and 9c of the stage portions 7 and 9 facing each other, the present invention is not limited to this.
• the protruding pieces 19 and 21 only need to protrude at least on the back surfaces 7 d and 9 d side of the stage portions 7 and 9.
• the projecting pieces 41 to 44 are formed on the other end portions 7c and 9c of the stage portions 7 and 9 facing each other and the side end portions 7e and 9f of the stage portions 7 and 9, respectively. It doesn't matter.
• the protruding pieces 41, 42 (43, 44) formed on the same stage portion 7 (9) protrude at an angle of 90 °.
• the stage portions 7 and 9 are formed at the side end portions 7e, 7f, 9e, and 9f, and the two end portions 7 and 9 are formed from the side end portions 7e, 7f, 9e, and 9f.
• a pair of protruding pieces 45 to 48 extending in the direction in which they are arranged may be provided.
• the protruding pieces 45, 47 (46, 48) formed on the same side end portions 7 e, 9 e (7 f, 9 f) side are preferably arranged side by side in the width direction of the stage portions 7, 9.
• the stage portions 7 and 9 are cut into a substantially C shape to form rectangular cutouts.
• the protruding pieces 49 to 56 may be formed by bending the portion.
• the protruding pieces 49 and 50 may protrude toward the other end portions 7c and 9c of the stage portions 7 and 9.
• the protruding pieces 51, 5 may protrude toward the other end portions 7c and 9c of the stage portions 7 and 9.
• 53, 54 may be protruded from each other at an angle of 90 °.
• one protruding piece 53, 55 is protruded to the other end 7c, 9c side of the stage parts 7, 9, and the other protruding piece 54, 56 is set to the side end part 7e, 9f side of the stage part 7, 9. It is protruding.
• stage parts 7, 9 are inclined using the protruding pieces 19, 21, 41 to 56, based on the inclination angle of each target stage part 7, 9,
• the dimensions of the stage parts 7, 9 and the protruding pieces 19, 21, 41 to 56 can be determined by the following formula (1).
• t is the thickness dimension of the stage portions 7 and 9
• hO is the stage from the back surface 17e of the connecting lead 17 before the stage portions 7 and 9 are inclined.
• the distances to the rear surfaces 7 d and 9 d of the parts 7 and 9, that is, the amount of displacement in the thickness direction of the stage parts 7 and 9 with respect to the connecting lead 17 are shown.
• L4 indicates the length of the stage portion extending vertically from the reference axes LI, L3 along the surfaces 7a, 9a of the stage portions 7, 9, and reaching the base ends of the protruding pieces 19, 21, 41-56.
• L5 indicates the length of the protruding piece up to the tip portion of the protruding pieces 19, 21, 41 to 56 as well.
• the base ends of the projecting pieces 19, 21, 41 to 56 in the formula (1) are the rear surfaces 7d and 9d of the stage portions 7 and 9, and the rear surfaces 19b, 21b, 41b to the projecting pieces 19, 21, 41 to 56, respectively. It shows the position where 56b and force ⁇ intersect.
• ⁇ 1 represents the inclination angle of the back surface 7 d, 9 d of the stage rod 9 with respect to the back surface 17 e of the connecting lead 17.
• 0 2 indicates the bending angles of the back surfaces 19b, 21b, 41b to 56b of the protruding pieces 19, 21, 41 to 56 with respect to the back surfaces 7d and 9d of the stage portions 7 and 9.
• the stage length L4 is 1.9 lmm.
• the stage length L4 is 1.37 mm.
• a plurality of protruding pieces 41 to 44, 53 to 56 force S are provided on each stage portion 7 and 9, and each protruding piece 41 to 44, 53 to 56 is provided.
• the stage rod length L4 is different, it is necessary to calculate the protruding piece length L5 for each protruding piece 41 to 44, 53 to 56.
• the stage portions 7 and 9 are formed in a substantially rectangular shape in plan view, but the present invention is not limited to this.
• the stage portions 7 and 9 may have any shape as long as at least the magnetic sensor chips 3 and 5 can be bonded to the surfaces 7a and 9a. That is, the stage portions 7 and 9 may be formed in, for example, a circular shape or an oval shape in a plan view, or may have a mesh shape even in a shape provided with a hole penetrating in the thickness direction. It does not matter in shape.
• stage parts 7 and 9 are inclined using the protrusion pieces 41-44 and 53-56, it is not restricted to this. At least when the production of the magnetic sensor is finished, the two magnetic sensor chips 3 and 5 are inclined with respect to each other! /.
• the magnetic sensor chips 3 and 5 protrude beyond the reference axes LI and L3 to the side of the connecting lead 17 as in the configuration described above, the magnetic field is generated when the stage portions 7 and 9 are tilted.
• the sensor chips 3 and 5 move in a direction approaching the connecting lead 17.
• the arrangement of the magnetic sensor chips 3 and 5 on the surfaces 7a and 9a of the stage portions 7 and 9a is adjusted so that the magnetic sensor chips 3 and 5 do not come into contact with the connecting leads 17 during this inclination, and the stage portion It is preferable to adjust the length of the magnetic sensor chips 3 and 5 protruding from the end portions 7b and 9b of the seventh and ninth portions.
• the stage portions 7, 9 are tilted.
• the one end portions 7b and 9b move in a direction approaching the lower surface 27a side of the resin mold portion 27. Therefore, one end portion from the reference axes LI and L3 along the surfaces 7a and 9a of the stage portions 7 and 9 is arranged so that the one end portions 7b and 9b of the stage portions 7 and 9 do not contact the lower surface 27a during this inclination. It is preferable to adjust the length of the stage parts 7, 9 up to 7b, 9b.
• the lengths of the magnetic sensor chips 3 and 5 protruding from the one end portions 7b and 9b of the stage portions 7 and 9 are adjusted so that the magnetic sensor chips 3 and 5 and the connecting leads 17 are thick. It can also be applied when the direction does not overlap. That is, for example, when the magnetic sensor chips 3 and 5 protrude beyond the reference axes LI and L3 to the lead 15 side, the magnetic sensor chips 3 and 5 are molded into the resin mold when the stage portions 7 and 9 are inclined. It moves in the direction approaching the lower surface 27a side of the part 27.
• one end portion along the surfaces 7a and 9a of the stage portions 7 and 9 is provided so that the end portions 3c and 5c of the magnetic sensor chips 3 and 5 do not contact the lower surface 27a of the resin mold portion 27 during this inclination. It is preferable to adjust the length of the magnetic sensor chips 3 and 5 protruding from 7b and 9b.
• the force for inclining the two magnetic sensor chips 3 and 5 around the reference axes LI and L3 parallel to each other is not limited thereto.
• the two magnetic sensor chips 3 and 5 may be inclined with respect to reference axes orthogonal to each other.
• two sensitive directions of the two magnetic sensor chips 3 and 5 form a plane parallel to the lower surface 27a of the resin mold portion 27. Therefore, the magnetism along the lower surface 27a can be accurately measured.
• the lead frame 101 includes two stage portions 107 and 109 for disposing magnetic sensor chips (physical quantity sensor chips) 103 and 105 formed in a rectangular plate shape in plan view, A frame rod for supporting the stage rod 109 and connecting portions 119 and 121 for coupling the stage rods 109 and the frame portion 111 are provided.
• the stage portions 107 and 109, the frame portion 111, and the connecting portions 119 and 121 are integrally formed.
• the frame part 111 includes a rectangular frame part 113 formed in a rectangular frame shape so as to surround the stage parts 107 and 109, and a plurality of leads 115 and 117 protruding inward from the rectangular frame part 113. It has.
• the connecting portions 119 and 121 connect the stage portions 107 and 109 to the leads 117 (three in this embodiment).
• the leads 115 and 117 are electrically connected to bonding pads (not shown) of the magnetic sensor chips 103 and 105, and are disposed apart from each other.
• the two stage portions 107 and 109 are arranged side by side along one side of the rectangular frame portion 113.
• a lead 117 connected to the stage portions 107 and 109 extends in the direction in which the two stage portions 107 and 109 are arranged. Leads 117 connected to the stage portions 107 and 109 extend in directions facing each other.
• Each stage portion 107, 109 and connecting portion 119, 121 is composed of a plurality of extension leads 123, 125 that also extend the tip of each lead 117, and each extension lead 123, 125 is separated from each other. is doing.
• Projecting leads 127 and 129 projecting toward the mutual stage portions 107 and 109 are formed at the ends of the extension leads 123 and 125 facing each other.
• These protruding leads 127 and 129 are formed integrally with the leads 117 connected to the respective stage portions 107 and 109. Further, the protruding leads 127 and 129 do not overlap the magnetic sensor chips 103 and 105 in a state where the magnetic sensor chips 103 and 105 are mounted on the stage portions 107 and 109, respectively.
• one sheet-like insulating films 131 and 133 are arranged at positions corresponding to the stage portions 107 and 109, that is, In other words, the insulating films 131 and 133 are arranged over the plurality of extension leads 123 and 125.
• the insulating films 131 and 133 are formed from an electrically insulating material.
• An adhesive layer (not shown) is formed on the front and back surfaces of the insulating films 131 and 133 in advance. This adhesive layer is formed to adhere the stage portions 107 and 109 and the magnetic sensor chips 103 and 105 to both surfaces of the insulating fins 131 and 133.
• the adhesive layer has a function of either temporary adhesion that can be reattached after adhesion or permanent adhesion that cannot be reattached after adhesion.
• the insulating films 131 and 133 are attached to the stage portions 107 and 109, respectively. In this state, the magnetic sensor chips 103 and 105 can be bonded to the surfaces 123a and 125a of the stage portions 107 and 109 via the insulating films 131 and 133.
• Protruding pieces 135 and 137 projecting toward the back surfaces 123d and 125d of the extension leads 123 and 125 are formed at the tips of the projecting leads 127 and 129 that face each other.
• the base ends of the projecting pieces 135 and 137 are subjected to photo-etching force, and the stage portions 107,
• the thickness is equivalent to 109. That is, the base end portions of the protruding pieces 135 and 137 are formed thinner than the other portions and can be deformed. Thereby, it is possible to set the inclination angle of the protruding pieces 135 and 137 with respect to the stage portions 107 and 109 with high accuracy.
• the magnetic sensor chips 103 and 105 are bonded to the surfaces 123a and 125a of the stage portions 107 and 109 via the insulating films 131 and 133, respectively.
• a wire 138 is bonded to electrically connect bonding pads (not shown) disposed on the surfaces of the magnetic sensor chips 103 and 105 and the leads 115 and 117.
• a wire 138 is bonded between the bonding pad of one magnetic sensor chip 103 and the surface 129a of the projecting lead 129 located on the stage 9 side where the other magnetic sensor chip 105 is disposed.
• the same lead 117 is electrically connected to the two magnetic sensor chips 103 and 105.
• the lead 117 is composed of two magnetic sensor chips 103 such as a ground electrode, for example. , 105 for electrodes shared.
• the material of the wire 138 is easy to bend and is soft. Is preferable.
• the rectangular frame 113 of the lead frame 101 is arranged on the surface E102 of the mold E having the recess E101.
• the leads 115 and 117, the stage portions 107 and 109, the magnetic sensor chips 103 and 105, and the protruding pieces 135 and 137 inside the rectangular frame portion 113 are disposed above the recess E101.
• magnetic sensor chips 103 and 105, stage portions 107 and 109, and projecting pieces 135 and 137 are sequentially arranged from the concave portion E101 side to the upper side.
• a mold F having a flat surface F101 is disposed above the protruding pieces 135 and 137, and the rectangular frame 113 of the lead frame 101 is sandwiched together with the mold E described above.
• molten resin is injected into the molds E and F in a state where the tip portions 135a and 137a of the projecting pieces 135 and 137 are pressed by the flat surface F101 of the mold F, and the magnetic sensor chip 103, Embed 105 inside the resin. Therefore, as shown in FIGS. 35 and 36, the magnetic sensor chips 103 and 105 are fixed inside the resin mold portion 141 in a state of being inclined with respect to each other.
• the resin used here is preferably a material having high fluidity so that the inclination angles of the magnetic sensor chips 103 and 105 and the stage parts 107 and 109 are not changed by the flow of the resin.
• the rectangular frame 113 is cut off, and the leads 115 and 117 are individually cut and electrically separated, and the manufacture of the magnetic sensor 140 is completed.
• the magnetic sensor 140 manufactured as described above has the same arrangement relationship of the magnetic sensor chips 103 and 105 as described in the first embodiment, as shown in FIG.
• the magnetic sensor 140 has the same function as that of the first embodiment.
• the insulating sensor 131, 133 force ⁇ is provided between the magnetic sensor chips 103, 105 and the stage ⁇ 109. Therefore, the magnetic sensor chips 103, 105 And the leads 117 connected to the stage portions 107 and 109 are electrically insulated. For this reason, the electrical connection of the magnetic sensor chips 103 and 105 by wire bonding described above can be performed using the leads 117 constituting the stage portions 107 and 109 where only the leads 115 are connected. That is, the number of leads that can be electrically connected to the magnetic sensor chips 103 and 105 without increasing the size of the lead frame 101 by increasing the number of leads 115 can be increased.
• the lead 17 used for coupling with the stage portions 7 and 9 can be used for electrical connection with the magnetic sensor chips 103 and 105 of this embodiment. Therefore, it is possible to perform more inputs / outputs with respect to the magnetic sensor chips 3 and 5, and as a result, it is possible to provide a highly functional magnetic sensor 40.
• the wire 138 is bonded between the bonding pad of one magnetic sensor chip 103 and the surface 129a of the protruding lead 129 located on the stage portion 109 side on which the other magnetic sensor chip 105 is mounted.
• the lead 117 can be electrically connected to the two magnetic sensor chips 103 and 105. As a result, it is used for electrical connection with the magnetic sensor chips 103 and 105.
• the number of leads 117 can be reduced, and the magnetic sensor 140 can be further miniaturized.
• the stage portions 107 and 109 and the magnetic sensor chips 103 and 105 are inclined with respect to the frame portion 111 around the reference axis L101, one end portion 103b of one magnetic sensor chip 103 and the other magnetic sensor chip 105 side
• the distance from the protruding lead 129 does not change much. Therefore, the wire 138 connected to the protruding lead 129 can be formed short, and the manufacturing cost of the magnetic sensor 140 can be reduced.
• stage portions 107, 109 and the connecting portions 119, 121 are formed by the extended leads 123, 125 having the same shape as the lead 117, the shape of the lead frame 101 can be simplified. . Therefore, the manufacturing cost of the lead frame 101 and the magnetic sensor 140 can be reduced.
• the magnetic sensor chips 103 and 105 are bonded to the surfaces 123a and 125a of the stage ⁇ 109 using the insulating films 131 and 133 with adhesive layers. Compared to the case, the thickness accuracy of the adhesive layer can be easily improved. Therefore, the inclination of the magnetic sensor chips 103 and 105 with respect to the surfaces 122a and 125a of the stage portions 107 and 109 can be suppressed due to variations in the thickness of the adhesive.
• the force shown in the example in which the lead 117 connected to the stage portion 109 is electrically connected to the magnetic sensor chip 103 mounted on the other stage portion 107 by the wire 38 is not limited to.
• the magnetic sensor chips 103 and 105 mounted on the stage portions 107 and 109 are electrically connected to the protruding leads 126 and 128, which also have the same stage portion force, by wires 139. Also good. Magnetic sensor chips 103, 10 are provided at the ends of these protruding leads 126, 128 ⁇ and the extended leads 123, 125. It is formed in the heel region that does not overlap with 5.
• the stage portions 107 and 109 are inclined with respect to the lead 117.
• the positional relationship between the extended leads 123 and 125 and the protruding leads 126 and 128 does not change. Therefore, it is possible to reliably prevent the wire 139 connected between the magnetic sensor chips 103 and 105 and the protruding leads 126 and 128 from being deformed. Therefore, the length of the wire 139 can be shortened in advance, and the manufacturing cost of the magnetic sensor can be reduced.
• the physical quantity sensor chips 103 and 105 can be electrically connected to the plurality of protruding leads 126 and 128 constituting the stage portions 107 and 109, the number of leads that can be electrically connected to the magnetic sensor chips 103 and 105 is further increased. be able to. In other words, since the plurality of leads 117 coupled to the stage portions 107 and 109 can be used for electrical connection with the magnetic sensor chips 103 and 105, respectively, the magnetic sensor can be further reduced in size.
• extension leads 123 and 125 may be provided with extension leads that do not function as the stage portions 107 and 109, all of which function as the stage portions 107 and 109.
• the lead frame 146 includes a first lead 143 (with the lead 117 shown in FIG. 31) coupled to the extension leads 123 and 125 forming the stage portions 107 and 109. Equivalent). Furthermore, the lead frame 146 includes second leads 144 arranged along the reference axis L101 together with the leads 143. The lead 144 is formed with an adjacent lead 145 extending from the tip thereof.
• the adjacent lead 145 is disposed substantially parallel to the extended leads 123 and 125 with a space therebetween, and is substantially equal to the length obtained by adding the protruding lead 126 to the extended lead 123.
• a protruding piece 147 similar to the protruding pieces 135 and 137 formed at the ends of the protruding leads 126 and 128 is formed at the tip of the adjacent lead 145.
• the adjacent lead 145 can be inclined with respect to each second lead 144 by being bent about the reference axis L101. That is, the adjacent lead 145 can be inclined in the same direction and inclination angle as the extension leads 123 and 125.
• the magnetic sensor chips 103, 105 and the adjacent leads 145 are electrically connected by wire bonding. Thereafter, the mold presses the protruding piece 147 so that the extension leads 123 and 125 and the adjacent lead 145 are inclined in the same direction. At this time, the relative distance between the adjacent lead 45 and the extension leads 23 and 25 is kept constant. That is, the wire 148 that electrically connects the magnetic sensor chips 103 and 105 and the adjacent lead 145 is not deformed, and the length of the wire 148 can be shortened. Therefore, the manufacturing cost of the magnetic sensor can be reduced.
• the adjacent lead 145 and the stage portions 107 and 109 can be inclined at the same inclination angle, a chip larger than the magnetic sensor chips 103 and 105 can be mounted on the stage portions 107 and 109. That is, a larger chip can also be supported by adjacent leads 145. Therefore, it is not necessary to change the design of the lead frame 146 according to the size of the magnetic sensor chip, and the lead frame 146 can be used for general purposes. In this case, it is preferable to provide insulating films 131 and 133 between the magnetic sensor chip and the adjacent lead 145.
• the lead frame 46 is easy to manufacture.
• the force is designed so that the two stage portions 107 and 109 are inclined with respect to the reference axis L101 parallel to each other.
• the two stage portions 107 and 109 may be designed to be inclined about the reference axis lines L101 and L102 orthogonal to each other.
• the leads 117 forming the stage portions 107 and 109 are orthogonal to each other.
• two sensitive directions (A direction and C direction) of the two magnetic sensor chips 103 and 105 are arranged in a plane parallel to the lower surface 141a of the 1S resin mold part 141. The magnetism along 141a can be accurately measured.
• two magnetic sensor chips 103 and 105 are arranged along one diagonal line L103 of the rectangular frame 113.
• the molten resin can be smoothly flowed. That is, when forming the resin mold part 141 by flowing molten resin into the resin forming space formed by the molds E and F, the rectangular frame part 113 located on the diagonal line L104 intersecting the diagonal line L103. By injecting molten resin from one corner 113a toward the other corner 113b, the stage sections 107 and 109 and the magnetic sensor chips 103 and 105 do not hinder the flow of the molten resin. ,.
• the molten resin can smoothly reach from one corner 113a to the other corner 113b, and the filling failure of the resin can be surely prevented. Further, it is possible to prevent the tilt angles of the stage portions 107 and 109 and the magnetic sensor chips 103 and 105 from receiving a flow pressure due to the flow of the molten resin. As a result, the inclination angle of the magnetic sensor chips 103 and 105 can be set with high accuracy.
• a lead similar to the adjacent lead 145 described in FIG. 37 may be provided at the tip of the lead 115 arranged together with the lead 117 forming the stage portions 107 and 109.
• the present invention is not limited to this when the thickness dimension of the adhesive layer is not taken into account.
• the edge film may be bonded to the stage portions 107 and 109 and the magnetic sensor chips 103 and 105.
• the protruding pieces 135, 137, 147 are not limited to being formed at the end portions of the stage portions 107, 109 and the adjacent lead 145 facing each other, but at least the back surfaces of the stage portions 107, 109 1 23d, 125d It only has to protrude to the side.
• stage portions 107 and 109 and the adjacent leads 145 are not limited to this force that is inclined using the protruding pieces 135, 137, and 147. At least when the manufacture of the magnetic sensor 140 is completed, the two magnetic sensor chips 103 and 105 and the adjacent leads 145 may be inclined by other means.
• the magnetic sensor (physical quantity sensor) according to this embodiment measures the direction and magnitude of an external magnetic field by two magnetic sensor chips inclined with respect to each other, as in the above-described embodiment. Copper material, etc. It is manufactured using a lead frame formed by subjecting the metal plate to press-curing and etching force.
• the lead frame 201 includes two stage portions 207 and 209 on which magnetic sensor chips (physical quantity sensor chips) 203 and 205 formed in a rectangular plate shape in plan view are placed, and a stage And a frame portion 211 that supports the portions 207 and 209.
• the stage portions 207 and 209 and the frame portion 211 are integrally formed.
• the frame portion 211 is orthogonal to the rectangular frame portion 213 formed in a substantially square frame shape so as to surround the stage portions 207 and 209 and the sides 213a to 213d of the inner region S201 of the rectangular frame portion 213.
• a plurality of leads 215 and 216 protruding inward, and connecting leads (connecting portions) 217 protruding inward from the respective corners 213e to 213h of the inner region S201.
• a plurality are provided on each side 213a to 213d of leads 215, 216 ⁇ , and inner region S201.
• the leads 215 and 216 are provided for electrical connection with bonding pads (not shown) of the magnetic sensor chips 203 and 205.
• These leads 215 and 216 are arranged only in the middle of each side 213a to 213d of the inner region S201 in order to avoid contact with the connecting lead 217, which will be described later, and at the end of each side 213a to 213d Cannot be established.
• the vicinity of the corners 213e to 213h of the inner region S201 becomes non-installation regions S202 to S205 that do not obscure the leads 215 and 216.
• the connecting lead 217 is a suspension lead that connects the stage portions 207 and 209 and the rectangular frame portion 213.
• One end portion 217a of the connecting lead 217 is connected to side end portions located at both ends of the one end portions 207a and 209a of the stage portions 207 and 209, respectively.
• the side end portions of the stage portions 207 and 209 are end portions of the stage portions 207 and 209 that are orthogonal to the direction in which the two stage portions 207 and 209 are arranged.
• the one end 217a of the connecting lead 217 is provided with a concave notch on the side surface, and is formed narrower than the other parts. This notch is a twisted portion that can be easily deformed when the stage portions 207 and 209 are inclined by bending about the axis L201 along the two parallel sides 213a and 213c of the inner region S201. .
• the two stage portions 207 and 209 are arranged side by side along one side 213d of the inner region S201.
• the stage portions 207 and 209 are positioned so as to be shifted from the leads 215 and 216 in the thickness direction of the thin metal plate (lead frame).
• Stage part 207, 209 surface 207 b and 209b are formed in a substantially rectangular shape in plan view so that the magnetic sensor chips 203 and 205 are placed thereon, respectively.
• These two stage portions 207 and 209 are arranged closer to the non-installation areas S202 and S205 than the non-installation areas S203 and S204, respectively, and the surfaces 207b and 209b are the mounting surfaces of the magnetic sensor chips 203 and 205, respectively.
• a recess 220 is formed on the surface 215b of the lead 215 that is in contact with the one end 207a, 209a of the stage 209 by the photoetching cage on the surface 215b of the lead 215. That is, the thickness force of the leading end portion 215a of the lead 215 is formed thinner than the base end portion 215c of the lead 215 located on the rectangular frame portion 213 side.
• a pair of projecting pieces 219 and 221 projecting toward the back surfaces 207d and 209d of the stage portions 207 and 209 are formed on the other end portions 207c and 209c of the stage portions 207 and 209, respectively.
• These protruding pieces 219 and 221 are provided to incline the stage portions 207 and 209.
• the protruding piece 219 of the stage portion 207 and the protruding piece 221 of the stage portion 209 face each other. In order to stably tilt the stage portions 207 and 209, it is preferable to increase the mutual distance between the pair of protruding pieces 219 and 221 formed on the stage portions 207 and 209.
• each stage part 207, 209 it is desirable to widen the tip part of the pair of projecting pieces 2 19, 221.
• the area of the tip portion that receives the pressing force when the stage portions 207 and 209 are inclined is widened, so that deformation of the protruding pieces 219 and 221 is prevented by stress relaxation, and the inclination of the stage portions 207 and 209 is stabilized.
• the pair of projecting pieces 219 and 221 may be wider than in the illustrated rod shape.
• the tip portions of the projecting pieces 219 and 221 may be bent into a rectangular shape.
• the inner region S201 located on the side 203b facing the side 203d is defined as the surplus region. Become. In this surplus region, a substantially rectangular auxiliary stage portion 223 connected to the connecting lead 217 is formed.
• the auxiliary stage portion 223 is shifted in the thickness direction of the metal thin plate (lead frame 201), similarly to the stage portions 207 and 209.
• the auxiliary stage portion 223 is formed with a twisted portion 217b and a pair of projecting portions 225 for inclining about an axis L202 orthogonal to the above-described axis L201.
• Surface 223 of this auxiliary stage part 223 On a, a semiconductor chip 227 such as a magnetic sensor chip, an acceleration sensor chip, a temperature sensor chip, a signal processing LSI or the like is mounted.
• the semiconductor chip 227 is electrically connected to the leads 216 arranged around the semiconductor chip 227.
• the surfaces 207b of the stage portions 207 and 209 and the auxiliary stage portion 2 23, The magnetic sensor chips 203 and 205 and the semiconductor chip 227 are bonded to 209b and 223a.
• the magnetic sensor chips 203 and 205 are arranged close to the non-installation regions S202 and S205 so that the sides of the magnetic sensor chips 203 and 205 are parallel to the sides 213a to 213d of the inner region S201.
• the magnetic sensor chips 203 and 205 are provided on the surfaces 207b and 209b of the stage portions 207 and 209.
• the protruding portions are formed by a plurality of leads 215 and 216 provided on the sides 213a and 213c of the inner region S201. Among them, they are arranged so as to overlap a plurality of leads 215 (four in the illustrated example) located on the non-installation areas S202 and S205 side. As shown in FIG. 41, the stage portions 207 and 209 are displaced in the thickness direction of the thin metal plate (lead frame 201) with respect to the leads 215, so that the magnetic sensor chips 203 and 205 are in contact with the leads 215. Do not touch.
• Each of the magnetic sensor chips 203 and 205 is disposed in a region from the leading end 215a to the middle of the lead 215 formed thin by the above-described photoetching cage.
• the magnetic sensor chips 203 and 205 are arranged so as not to overlap with the leads 216 arranged along the arrangement direction (side 213d) of the stage portions 207 and 209.
• a bonding pad (not shown) disposed on the surfaces of the magnetic sensor chips 203 and 205 and the semiconductor chip 227, a lead 216 that does not overlap the magnetic sensor chips 203 and 205, and a force S wire (not shown) )). Since the positional relationship between the bonding portions of the magnetic sensor chips 203 and 205 and the semiconductor chip 227 and the bonding portion of the leads 216 changes at the stage of tilting the stage portions 207 and 209 and the auxiliary stage portion 223, which will be described later, this wire The material is preferably easy to bend and soft.
• a resin mold part for fixing the magnetic sensor chips 203 and 205, the semiconductor chip 227, the stage parts 207 and 209, the auxiliary stage part 223, and the leads 215 and 216 together. Cage) is formed.
• the rectangular frame portion 213 of the lead frame 201 is positioned on the surface E202 of the mold E having the recess E201.
• the leads 215 and 216, the stage portions 207 and 209, the magnetic sensor chips 203 and 205, and the projecting pieces 219 and 221 inside the rectangular frame portion 213 are arranged above the recess E201. That is, in this state, the magnetic sensor chips 203 and 205, the stage portions 207 and 209, and the protruding pieces 219 and 221 are arranged in this order from the concave portion E201 side to the upper side.
• a mold F having a flat surface F201 is disposed above the projecting pieces 219 and 221, and the rectangular frame part 213 of the lead frame 201 is sandwiched together with the mold E described above.
• the protruding pieces 219 and 221 are pressed by the flat surface F201 of the mold F.
• the one end 217a force S of the connecting lead 217 is turned around the axis L201, and the stage 209 is inclined.
• the magnetic sensor chips 203, 205 facing the surface 215 b of the lead 215 are drawn into the one end 203 a, 205 a force four-sided 220.
• the magnetic sensor chip 203 and 205 force together with the stage rod 209 is inclined at a predetermined angle with respect to the rectangular frame portion 213 and the flat surface F201.
• the auxiliary stage portion 223 is inclined at a predetermined angle with respect to the rectangular frame portion 213 and the flat surface F201 when the protruding piece 225 is pressed by the flat surface F201 of the mold F. To do.
• the molten resin is injected into the resin forming space formed by the recesses E201 and the flat surface F201 of the molds E and F.
• the A resin mold portion for filling the magnetic sensor chips 203 and 205 inside the resin is formed by the melted resin.
• the resin is solidified, as shown in FIGS. 45 to 47, the magnetic sensor chips 203 and 205 are fixed inside the resin mold part (package) 229 in an inclined state.
• the resin used here is preferably a material having high fluidity so that the inclination angles of the magnetic sensor chips 203 and 205 and the semiconductor chip 227 are not changed by the flow of the resin.
• the resin mold part 229 of the magnetic sensor 230 manufactured as described above is formed in a substantially rectangular shape in plan view similar to the rectangular frame part 213 described above.
• the reeds 215 and 216 extend from the inner side S201 of the inner region S201 defined by the resin monored 229 229 to the inner side of the tree-shaped monored portion 229.
• These leads 215 and 216 are provided in the non-installation areas S202 to S205 located at the corners of the inner area S201! / ,!
• each of these leads 216 is electrically connected to the magnetic sensor chips 203, 205 and the semiconductor chip 227 by a metal wire (not shown). Embedded in 229.
• the magnetic sensor chips 203 and 205 and the semiconductor chip 227 are inclined with respect to the lower surface 229a of the resin mold part 229.
• the other end portions 203b and 205b of the magnetic sensor chips 203 and 205 facing each other face the upper surface 229c side of the resin mold portion 229.
• the surface 203a of the magnetic sensor chip 203 is inclined at an acute angle with respect to the surface 205a of the magnetic sensor chip 205. That is, the angle ⁇ of the stage unit 207 with respect to the stage unit 209 is an acute angle.
• the sensitive directions of the magnetic sensor chips 203 and 205 are the same as those in the first embodiment of the present invention described with reference to FIG.
• the angle ⁇ formed by the 8-plane with respect to the 0-plane can theoretically measure the three-dimensional geomagnetic orientation as long as it is greater than 0 ° and less than 90 °. It is preferable that the angle is 20 ° or more, and it is more preferable that the angle is 30 ° or more, as in the first embodiment.
• the magnetic sensor 330 is mounted, for example, on a substrate in the portable terminal device, and can detect the direction of geomagnetism.
• a part of the magnetic sensor chips 203 and 205 are arranged so as to overlap the leads 215, so that the magnetic sensor 230 can be downsized. Monkey.
• each of the magnetic sensor chips 203 and 205 is a lead that protrudes from one corner portion of the inner region, that is, close to the non-installation regions S202 and S205, and the sides 213a and 213c of the inner region S201 Overlaid only on 15. Therefore, the number of leads overlapping the magnetic sensor chips 203 and 205 is reduced as compared with the case where the stage portions 207 and 209 and the magnetic sensor chips 203 and 205 are arranged at the center of one side 213a and 213c of the inner region S201. To do. Therefore, a sufficient number of leads 216 that can be electrically connected to the magnetic sensor chips 203 and 205 can be secured without changing the position of the leads 215 and 216 with respect to the rectangular frame portion 213. Therefore, it is possible to input / output many signals to / from the magnetic sensor chips 203 and 205, and it is possible to provide a highly functional magnetic sensor 230.
• the highly functional magnetic sensor 230 can be manufactured easily and inexpensively.
• the two stage portions 207 and 209 and the magnetic sensor chips 203 and 205 are arranged close to the same side 213d and 229g of the inner region S201, so that the extra region in the inner region S201 of the rectangular frame portion 213 is separately provided. Since the auxiliary stage part 223 and the semiconductor chip 227 can be newly arranged, it is possible to provide a highly functional magnetic sensor 230 while changing the size of the rectangular frame part 213 and the resin mold part 229. It becomes.
• the stage portion extends in the thickness direction of the metal thin plate with respect to the lead 215.
• the magnetic sensor chips 203, 205 can be greatly inclined with respect to the frame ⁇ by preventing the insects from contacting the magnetic sensor chips 203, 205 and the leads 215 without extending the length of the 207, 209. Therefore, the magnetic sensor 230 can be made thinner.
• the force that the auxiliary stage portion 223 is provided with the protruding piece 225 is not limited to this.
• the auxiliary stage part 223 is at least a resin mold part
• the auxiliary stage unit 223 need not be inclined when the semiconductor chip 227 to be placed is a temperature sensor chip or a signal processing LSI. In this case, the twisted portions of the protruding piece 225 and the connecting lead 217 are unnecessary.
• the lead frame and the magnetic sensor according to the fifth embodiment are different from the fourth embodiment in the frame portion.
• the positions of the stage unit and the magnetic sensor chip are different.
• the two stage portions 207 and 209 and the magnetic sensor chips 203 and 205 are arranged side by side on the diagonal line L203 of the inner region S201.
• the stage portions 207 and 209 are arranged close to the corner portions located on the diagonal line L203, that is, the non-installation areas S202 and S204.
• the magnetic sensor can be reduced in size, and a highly functional magnetic sensor can be easily and inexpensively manufactured. it can.
• stage portions 207, 209 and the physical quantity sensor chips 203, 205 are not positioned between the one corner portion 213h and the other corner portion 213f, the stage portion 207, It is possible to prevent the flow of the molten resin from being hindered by 209 and the physical quantity sensor chips 203 and 205. Therefore, it is difficult to form a portion where the resin cannot reach in the resin forming space. In particular, the grease having the gate M force flowing into the resin forming space can easily reach the other corner S203 located at the farthest gate M force.
• the stage portions 207 and 209 and the physical quantity sensor chips 203 and 205 are also possible to prevent the stage portions 207 and 209 and the physical quantity sensor chips 203 and 205 from being pushed by the flow of the resin flowing into the resin-forming space, and the inclination angles thereof to be changed unexpectedly. Therefore, the inclination angle of the physical quantity sensor chips 203 and 205 is set with high accuracy. Can be determined.
• the twisted portion of the connecting lead 217 is not limited to the force connected to the one end portions 207a and 209a of the stage portions 207 and 209.
• the twisted portion may be arranged at a position shifted toward the projecting pieces 219 and 221 with respect to the one end portions 207a and 209a. That is, the axis L201 for rotating the stage portions 207 and 209 may be shifted from the one end portions 207a and 209a side of the stage portions 207 and 209 to the protruding pieces 219 and 221 side.
• the force shown in the example in which the pair of projecting pieces 219 and 221 are formed on the stage portions 207 and 209 is not limited thereto. That is, only one protruding piece may be formed on each of the stage portions 207 and 209, and this protruding piece may be formed to have a width approximately equal to half of the width of the stage portions 207 and 209. Also in this configuration, since the area of the tip of the protruding piece that receives the pressing force when the stage portions 207 and 209 are inclined is widened, deformation of the protruding piece is prevented by stress relaxation. Therefore, the tilt angles of the stage portions 207 and 209 can be stabilized.
• the protruding pieces 219 and 221 protrude at least on the rear surface 207d and 209dftlJ of the stage ⁇ 209! /.
• stage portions 207 and 209 may be inclined with respect to each other before forming the resin mold portion 229 at least.
• the stage portions 207 and 209 may be formed, for example, in a circular shape or an oval shape in plan view, or may be provided with holes penetrating in the thickness direction or formed in a mesh shape.
• the magnetic sensor may contain the magnetic sensor chips 203 and 205, the stage portions 207 and 209, and the leads 215 and 216 inside the box as a knocker, and these forces may be fixed integrally. .
• the two magnetic sensor chips 203 and 205 may be inclined with respect to the axes orthogonal to each other along the lower surface 229a of the resin mold part 229.
• the magnetic sensor for detecting the magnetic direction in the three-dimensional space has been described as the physical quantity sensor, but the present invention is not limited to this.
• the physical quantity sensor may be any sensor that measures the orientation and orientation in at least the three-dimensional space. That is, the physical quantity sensor may be, for example, an acceleration sensor equipped with an acceleration sensor chip that detects the magnitude and direction of acceleration.
• the present invention can be applied to a physical quantity sensor that measures the azimuth and orientation of physical quantities such as magnetism and gravity, and the physical quantity sensors can be made small and thin.

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• 2005
  • 2005-09-29 TW TW94134065A patent/TWI280399B/zh not_active IP Right Cessation
  • 2005-09-30 WO PCT/JP2005/018168 patent/WO2006038564A1/ja active Application Filing
  • 2005-09-30 KR KR20067027011A patent/KR20070030226A/ko not_active Application Discontinuation

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