WO2005036566A1 - 積層コイル部品およびその製造方法 - Google Patents
積層コイル部品およびその製造方法 Download PDFInfo
- Publication number
- WO2005036566A1 WO2005036566A1 PCT/JP2004/012987 JP2004012987W WO2005036566A1 WO 2005036566 A1 WO2005036566 A1 WO 2005036566A1 JP 2004012987 W JP2004012987 W JP 2004012987W WO 2005036566 A1 WO2005036566 A1 WO 2005036566A1
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- WO
- WIPO (PCT)
- Prior art keywords
- ceramic
- ceramic laminate
- coil component
- external electrode
- chip inductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 144
- 239000004020 conductor Substances 0.000 claims abstract description 68
- 238000010030 laminating Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 abstract description 6
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 16
- 239000010931 gold Substances 0.000 description 15
- 230000032798 delamination Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 238000002788 crimping Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- YBCVMFKXIKNREZ-UHFFFAOYSA-N acoh acetic acid Chemical compound CC(O)=O.CC(O)=O YBCVMFKXIKNREZ-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
Definitions
- Multilayer coil component and method of manufacturing the same
- the present invention relates to a laminated coil component and a method for manufacturing the same, and more particularly, to an arrangement of coil conductors inside a ceramic laminate.
- the chip inductor 31 is provided with a coil conductor 33 having an axial center direction in one direction orthogonal to the laminating direction (thickness direction) X inside a ceramic laminate 32 having a substantially rectangular parallelepiped shape. It was done. That is, the coil conductor 33 having the axial direction coincident with the longitudinal direction Y of the ceramic laminate 32 is provided inside the ceramic laminate 32. Further, strip electrodes 34 are formed at upper and lower positions in the ceramic laminate 32. The strip electrode 34 and the coil conductor 33 have a structure in which respective ends of the ceramic laminate 32 are connected to each other through via holes 35 formed through the ceramic laminate 32 in the thickness direction X. Have been.
- the through holes 35 are formed with through holes at predetermined positions of each of the ceramic green sheets for forming the ceramic laminate 32, and the insides of these through holes are filled with a conductor (conductive paste) such as an Ag paste. It was formed as follows. Examples of the ceramic green sheet include a ferrite sheet. Further, each of the strip electrodes 34 formed at the upper end position of the ceramic laminate 32 is drawn out to the end face in the longitudinal direction Y of the ceramic laminate 32, and covers the end face of the ceramic laminate 32. The external electrodes 37 are formed separately.
- the sheet laminate formed by laminating the ceramic green sheets is integrally pressed along the laminating direction X and subsequently fired, whereby a ceramic laminate 32 is obtained. Further, when the external electrode 37 is dipped in the conductive paste and baked on the end face of the ceramic laminate 32, V, a chip inductor 31 as a so-called end face dipped product is completed. -252117
- the L (inductance) acquisition efficiency of the coil in the laminated coil component will be studied.
- the L acquisition efficiency of the coil conductor 33 in the above-described conventional chip inductor 31 is improved when the inner area and the outer area of the coil conductor 33 are equal.
- the area ratio is designed to be close to 1: 1.
- the ceramic green sheet which is disposed at the upper position and the lower position in the thickness direction X of the coil conductor 33 disposed inside the ceramic laminated body 32 and serves as an exterior portion has a certain degree or more to prevent Ag diffusion. It is required that the thickness of the outer package be large. In addition, even in the case where lamination displacement or cutting (cut) displacement occurs, it is necessary to prevent the band-shaped electrode 34 and the via hole 35 from being exposed to the outside, and the necessary minimum in the width direction Z of the ceramic laminate 32 is required. The minimum side gap must be secured.
- the ceramic laminate 32 included in the chip inductor 31 is manufactured by laminating and pressing a large number of ceramic dalene sheets, and then firing the cut one. However, at the time of crimping, a through hole 35, which is generally a via hole 35, is filled. The broken conductor is less likely to collapse than the ceramic green sheet. Therefore, these conductors act like pillars that resist the pressing force at the time of crimping, and the via holes 35 support the pressing force.
- the present invention has been made in view of these problems, and secures high L acquisition efficiency by equalizing the inner area and the outer area of the coil conductor while realizing miniaturization and thinning. It is an object of the present invention to provide a multilayer coil component capable of effectively preventing a decrease in insulation resistance between via holes and a method of manufacturing the same.
- the laminated coil component according to the present invention according to claim 1 is a ceramic laminated body having a substantially rectangular parallelepiped shape in which a coil conductor composed of a plurality of strip electrodes and via holes connecting predetermined ends of the strip electrodes.
- the axial direction of the coil conductor is a direction perpendicular to both the laminating direction (thickness direction) and the length direction of the ceramic laminate.
- the feature is that it matches the width direction. That is, the axial direction of the coil conductor at this time is perpendicular to the laminating direction (thickness direction) of the ceramic laminate, and also perpendicular to the length direction of the ceramic laminate.
- a laminated coil component according to the present invention according to claim 2 is the laminated coil component according to claim 1, wherein an external electrode connected to an end of the coil conductor is arranged in a direction in which the ceramic laminate is laminated. At the end of the main surface in the length direction.
- the laminated coil component according to the present invention according to claim 3 is the laminated coil component according to claim 2, wherein the external electrode is formed so as to cover a region where the via hole is formed. It is characterized by being.
- a method for manufacturing a laminated coil component according to the present invention according to claim 4 is the method for manufacturing a laminated coil component according to claim 3, wherein the ceramic in which the strip-shaped electrode or z and the via hole are formed.
- the method includes a step of laminating a green sheet and a ceramic green sheet on which a conductor pattern serving as a base of the external electrode is printed, followed by pressing and firing.
- the thickness of the laminated coil component is made smaller than its length and width.
- the inside area of the coil conductor becomes extremely smaller than the outside area.
- the laminated coil component of the present invention miniaturization and thickness reduction are realized by utilizing the general characteristics of the laminated coil component. Further, the laminated coil component according to the present invention can secure a high L acquisition efficiency even when the exterior thickness and the side gap are reduced to the necessary minimum, and can improve the superimposition characteristics accordingly. Since the number of via holes is smaller than before, the processing cost can be reduced.
- the ceramic laminate has an axial direction of the coil conductor orthogonal to both the laminating direction (thickness direction) and the length direction of the ceramic laminate. In the width direction. Therefore, it is possible to prevent the inside area of the coil conductor from becoming extremely smaller than the outside area, and to make these areas equal to increase the L acquisition efficiency of the coil conductor. As a result, the superimposition characteristics can be improved, and the number of via holes can be reduced as compared with the conventional case, so that the processing cost can be reduced.
- the external electrode connected to the end of the coil conductor is formed at an end position in the length direction of the main surface in the laminating direction of the ceramic laminate. That is, in this laminated coil component, the external electrode is formed on the main surface in the thickness direction, not on the end surface in the length direction of the ceramic laminate.
- the external electrodes of the conventional laminated coil component are formed by dip-processing the end face of the ceramic laminate.
- the formation of external electrodes on the main surface of the ceramic laminate has not been practiced.
- an external electrode is formed on the main surface of the ceramic laminate. Therefore, when the laminated coil component is mounted on a substrate or the like, that is, when the external electrode of the laminated coil component is connected to a wiring pattern on the substrate or the like, the connection operation is facilitated, and the following effect is obtained.
- the external electrodes of the laminated coil component are connected to the wiring pattern of the substrate or the like by wire bonding, or the external electrodes of the laminated coil component are opposed to each other via the wiring pattern of the substrate or the bump.
- Work such as joining with the use can be performed very easily.
- the external electrode is formed at a position inside the edge of the main surface of the ceramic laminate in order to prevent the external electrode from being chipped or peeled off in the barrel process. .
- an advantage can be secured if the stray capacitance is reduced as compared with the conventional end face dip product.
- the region where the via hole is formed is covered with the external electrode, not only the via hole but also the periphery thereof is pressed when the ceramic laminate is pressed.
- the pressing force at the time of crimping acts on the ceramic part of the part via the external electrode. Therefore, the ceramic portions located at the periphery of these via holes are also pressed by the same pressing force as the ceramic portions located at positions where the via hole force is separated.
- FIG. 1 is a perspective view showing an external structure of a chip inductor which is an example of the laminated coil component according to the first embodiment
- FIG. 2 is a perspective view showing an exploded structure thereof
- FIG. 3 is an L characteristic when a current is applied.
- FIG. 4 is an explanatory diagram showing the rate of change of L when a current is applied
- FIG. 5 is an explanatory diagram showing the relationship between the area ratio of the coil conductor and the superimposition characteristics.
- 6 to 8 are side views showing the mounting structure of the chip inductor.
- FIG. 6 shows the first mounting structure
- FIG. 7 shows the second mounting structure
- FIG. 8 shows the third mounting structure. I have.
- the chip inductor 1 includes a plurality of strip electrodes 2 and predetermined ends of each strip electrode 2 which are mechanically and electrically connected.
- the coil conductor 4 is composed of a plurality of via holes 3 that are connected to each other.
- the coil conductor 4 is provided inside a ceramic laminate 5 having a substantially rectangular parallelepiped shape. That is, in the chip inductor 1, the ends of the strip electrodes 2 formed at predetermined positions on the upper side and the lower side in the laminating direction (thickness direction) X of the ceramic laminated body 5 are connected to each other.
- a coil conductor 4 having a circling shape is formed by being connected to each other by a via hole 3 penetrating in the thickness direction X.
- the axial direction of the coil conductor 4 is perpendicular to the laminating direction (thickness direction) X of the ceramic laminate 5 and also perpendicular to the length direction Y of the ceramic laminate 5. It matches the width direction Z of the layer body 5. That is, the axial direction of the coil conductor 4 is perpendicular to the laminating direction X of the ceramic laminate 5 and is also perpendicular to the length direction of the ceramic laminate 5.
- One end of each of the strip-shaped electrodes 2 disposed on the upper side of the ceramic laminate 5 and disposed on the outermost side along the width direction Z is formed by moving the ceramic laminate 5 in the thickness direction X.
- the ceramic laminate 5 is drawn out to the upper main surface in the thickness direction X of the ceramic laminate 5 through the via hole 3 formed therethrough.
- External electrodes 6 are formed at the end positions in the length direction Y of the upper main surface in the thickness direction X of the ceramic laminate 5 so as to be exposed.
- the via hole 3 is drawn out to the upper main surface of the ceramic laminate 5 and is connected separately to the external electrode 6 to conduct electricity.
- Each of the external electrodes 6 of the chip inductor 1 covers a region where the via hole 3 is formed when viewed from the lamination direction X of the ceramic laminate 5.
- the strip-shaped electrode 2 and the external electrode 6 are formed on the surface of the ceramic green sheet 7 constituting the ceramic laminate 5 using a conductor (conductive paste) such as an Ag paste or the like.
- a conductor conductive paste
- the strip electrode 2 is formed in three layers in FIG. 2, it may be formed in only one layer.
- Each of the via holes 3 is formed by forming a through hole by irradiating a laser beam or the like to each predetermined position of each of the ceramic green sheets 7 and filling the inside of the through hole with a conductor such as an Ag paste. It is.
- each of the external electrodes 6 are formed in the barrel process. It is possible to prevent the external electrodes 6 from being scraped or peeled off.
- each of the external electrodes 6 may be formed so as to reach the edge of the main surface of the ceramic laminate 5.
- the axial direction of the coil conductor 4 coincides with the width direction Z of the ceramic laminate 5 orthogonal to both the lamination direction (thickness direction) X and the length direction Y of the ceramic laminate 5.
- the fired dimensions of this chip inductor 1 are 0.35 mm in thickness, 3.2 mm in width, and 0.04 mm in outer thickness. Is 0.1 mm.
- the inner surface area and the outer area of the coil conductor 4 are equal. That is, since the area ratio of these is 1: 1.4, the inventors of the present invention have confirmed that the L acquisition efficiency of the coil conductor 4 is 1 :: LH.
- the thickness after firing is 0.35 mm
- the width is 1.6 mm
- the outer thickness is 0.04 mm
- the side gap is 0.1 mm.
- the area ratio between the inner area and the outer area of the coil conductor 33 is 1: 1.8. Therefore, it was also confirmed that the L acquisition efficiency of the coil conductor 33 was only 1., and the L acquisition efficiency of the chip inductor 1 according to the present embodiment was higher than that of the conventional chip inductor 31. I have.
- the inventors of the present invention measured the L characteristic when the current was applied and the L change rate when the current was applied, the measurement results as shown in FIGS. 3 and 4 were obtained. That is, the solid lines in these figures show the case of the chip inductor 1 according to the present embodiment, and the broken lines show the case of the chip inductor 31 according to the conventional example. From these figures, it can be seen that the structure according to the present embodiment is better than the structure according to the conventional example in both the L characteristic and the L change rate.
- the occurrence rate of delamination was 10%.
- the rate of delamination is 0%, and when the external electrode 6 is formed, the delamination is generated. It has been confirmed that the occurrence rate of rust is greatly improved.
- the printing thickness of the external electrode 6 is preferably 15 m or more.
- the inventors of the present invention have a structure in which a Ni base plating and an Au plating are applied to the external electrode 6 on the main surface of the ceramic laminate 5 provided in the chip inductor 1, and a chip inductor 31 according to a conventional example.
- the bonding strength of a structure in which the external electrode 37 baked by dipping on the end face of the ceramic laminate 32 was provided with a Ni base plating and an Au plating was evaluated. That is, a ball-sharing test and a wire-pull test, which are Au wire bonding evaluations, were performed on both of these structures.
- the bonding strength of the chip inductor 1 that is, the structure in which the external electrode 6 formed on the main surface of the ceramic laminate 5 is provided with the Ni base plating and the Au plating is higher. It was confirmed that it was good. Further, when the external electrode 6 is formed at an end position in the length direction Y of the upper main surface in the thickness direction X of the ceramic laminate 5 constituting the chip inductor 1, Various mounting structures can be adopted. First, as shown in the first mounting structure shown in FIG. 6, the external electrode 6 of the chip inductor 1 and the wiring pattern 8 such as a substrate on which the chip inductor 1 is mounted are bonded by wire bonding using Au wires 9 or the like. It is easier to do this.
- bonding may be performed using solder balls or Au balls 10. That is, in this case, first, solder balls or Au balls 10 are mounted on the external electrodes 6 of the chip inductor 1, and the solder balls or Au balls 10 are applied to the external electrodes 6 by a force for reflow processing or ultrasonic processing. Or join Au ball 10. Thereafter, the chip inductor 1 is turned upside down, and the solder balls or Au balls 10 are joined to the wiring pattern 8 such as a substrate by a reflow process or the like.
- an ultrasonic wave is generated by directly contacting the external electrode 6 of the chip inductor 1 with Au plating and the wiring pattern 8 such as a substrate. It may be joined by processing. Furthermore, the external electrodes 6 of the not-shown force chip inductor 1 and the wiring pattern 8 such as a substrate on which the chip inductor 1 is mounted may be joined with a conductive adhesive or an anisotropic conductive tape. It becomes possible. With such a mounting structure, since high heat is not applied to the chip inductor 1 as in the case of soldering, there is obtained an advantage that the characteristic variation of the chip inductor 1 itself can be suppressed.
- an aqueous binder such as acetate acetate or water-soluble acryl
- an organic binder such as polybutyral
- the ceramic green sheet 7 is formed by a doctor blade method or a method using a reverse roll coater. Then, the required number of the ceramic green sheets 7 are irradiated with laser light, and through holes serving as the via holes 3 are formed at predetermined positions of each of the ceramic Darline sheets 7.
- each of the through holes formed in the ceramic green sheet 7 by screen printing of the Ag paste is filled with the Ag paste to form the via holes 3.
- Ag By screen printing of the paste, a strip electrode 2 which is a part of the coil conductor 4 is formed at a predetermined position on the surface of each ceramic green sheet 7. Further, a conductor pattern serving as a base of the external electrode 6 is formed at a predetermined position on the surface of the other ceramic green sheet 7.
- a predetermined number of ceramic green sheets 7 having only the via holes 3 are arranged at the center position in the stacking direction X. Then, a predetermined number of ceramic green sheets 7 on which the strip electrodes 2 and the via holes 3 are formed are arranged at these upper and lower positions. Further, a ceramic green sheet 7 on which a conductor pattern serving as a base of the external electrode 6 is formed is placed on these upper positions. On the other hand, on the lower side, all of the conductive patterns which are the bases of the strip electrodes 2 and the via holes 3 and the external electrodes 6 are formed, and the ceramic green sheets 7 are arranged in an overlapping manner.
- the sheet laminate 11 thus laminated is pressed in the laminating direction X, cut to a predetermined size, degreased and fired, and the ceramic laminate 5 is obtained. Subsequently, when the external electrode 6 is formed by applying a Ni base plating and an Au plating to the conductor pattern serving as the base of the external electrode 6, the chip inductor 1 is completed.
- the present invention is not limited to the nickel plating and the gold plating, but may be the nickel plating and the tin plating! Further, the applied pressure at the time of pressing the sheet laminate 11 is 98 to 120 MPa (1.0 to 1.2 t / cm 2).
- the force that assumes that the chip inductor 1 provided with one coil conductor 4 inside the ceramic laminate 5 is a multilayer coil component is a multilayer coil component to which the present invention is applied. It is not limited to the chip inductor 1 alone. That is, a chip inductor having a structure in which two or more coil conductors 4 are provided in parallel inside the ceramic laminate 5 may be used as a transformer or a common choke coil. In addition, it is compatible with other multilayer coil components such as multilayer impeder and multilayer LC filter. However, it goes without saying that the present invention can be applied.
- FIG. 9 is a perspective view showing an external structure of a chip inductor according to a second embodiment of the present invention
- FIG. 10 is a perspective view showing an exploded structure thereof.
- reference numeral 21 denotes a chip inductor. Is shown.
- the structure of the chip inductor 21 according to the present embodiment is basically the same as the chip inductor 1 according to the first embodiment, except for the structure related to the external electrodes.
- FIGS. 9 and 10 parts that are the same as those in FIGS. 1 and 2 are given the same reference numerals, and detailed descriptions thereof are omitted. Further, the manufacturing method and function of the chip inductor 21 according to the second embodiment are also basically different from those of the chip inductor 1 according to the first embodiment, and thus the details and description thereof are omitted here.
- the chip inductor 21 has the same configuration as the chip inductor 1. That is, as shown in FIG. 9 showing an external structure and FIG. 10 showing an exploded structure, a plurality of band-shaped electrodes 2 and a plurality of predetermined ends of each band-shaped electrode 2 are mechanically and electrically connected to each other.
- a coil conductor 4 composed of a plurality of via holes 3 is provided inside a ceramic laminate 22 having a substantially rectangular parallelepiped shape.
- the axial direction of the coil conductor 4 is also perpendicular to the laminating direction (thickness direction) X of the ceramic laminate 22 and is also perpendicular to the length direction Y of the ceramic laminate 22. It matches the width direction Z of 22.
- one end of the strip-shaped electrode 2 disposed on the upper side of the ceramic laminate 22 and disposed on the outermost side along the width direction Z is connected to the ceramic laminate 22 in the thickness direction X.
- the ceramic laminate 22 is drawn out to the upper main surface in the thickness direction X of the ceramic laminate 22 through the via hole 3 formed to penetrate the ceramic laminate 22.
- external electrodes 23 are provided at end positions in the length direction Y of the upper main surface in the thickness direction X of the ceramic laminate 22.
- each of the external electrodes 23 was exposed on the uppermost layer of the ceramic laminate 22 and formed integrally with a pair of upper electrodes 24 formed separately from each other and directly below the pair of upper electrodes 24.
- the upper electrode 24 and the lower electrode 25 are connected via the via hole 3.
- These external electrodes 23 are used for the lamination of the ceramic laminate 22.
- the via hole 3 is covered with the formed region.
- the ceramic green sheets 7 are formed, and through holes serving as the via holes 3 are formed at predetermined positions in the required number of ceramic green sheets 7.
- the Ag paste is filled by screen printing to form the via holes 3, and the Ag paste is screen-printed to a predetermined position on the surface of each ceramic green sheet 7 so as to form a strip that becomes a part of the coil conductor 4.
- the electrode 2 is formed.
- a conductor pattern serving as a base for the upper electrode 24 and the lower electrode 25 of the external electrode 23 is formed at predetermined positions on the surface of the other ceramic green sheet 7.
- a conductor pattern serving as a base for the upper electrode 24 and the lower electrode 25 of the external electrode 23 is formed at predetermined positions on the surface of the other ceramic green sheet 7.
- the sheet laminate 27 thus laminated is pressed along the laminating direction X, cut to a predetermined size, degreased and fired, and the ceramic laminate 22 is obtained. Therefore, when the external electrode 23 is formed by applying a Ni base plating and an Au plating to the conductor pattern serving as the base of the upper electrode 24 of the external electrode 23, the chip inductor 21 shown in FIG. Is completed. With the chip inductor 21 having such a structure, the area of the Au plating is smaller than that of the chip inductor 1 according to the first embodiment, so that the manufacturing cost can be reduced.
- a laminated coil component a transformer or a common choke having a structure in which two or more coil conductors are provided in parallel or the like inside a ceramic laminated body which is not limited to a chip inductor. Used as a coil. Further, it is needless to say that the present invention can be applied to other laminated coil components such as a laminated impedance and a laminated LC filter.
- FIG. 1 is a perspective view showing an external structure of a chip inductor as an example of a laminated coil component according to Embodiment 1 of the present invention.
- FIG. 2 is a perspective view showing the disassembled structure.
- FIG. 3 is an explanatory diagram showing an L characteristic when a current is applied.
- FIG. 4 is an explanatory diagram showing an L change rate when a current is applied.
- FIG. 5 is an explanatory diagram showing a relationship between an area ratio of a coil conductor and superposition characteristics.
- FIG. 6 is a side view showing a first mounting structure of the chip inductor.
- FIG. 7 is a side view showing a second mounting structure of the chip inductor.
- FIG. 8 is a side view showing a third mounting structure of the chip inductor.
- FIG. 9 is a perspective view showing an external structure of a chip inductor which is an example of a laminated coil component according to Embodiment 2 of the present invention.
- FIG. 10 is a perspective view showing the disassembled structure.
- FIG. 11 is a perspective view showing an external structure of a chip inductor as an example of a laminated coil component according to a conventional example.
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005514539A JP4492540B2 (ja) | 2003-10-10 | 2004-09-07 | 積層コイル部品およびその製造方法 |
US10/531,956 US7176772B2 (en) | 2003-10-10 | 2004-09-07 | Multilayer coil component and its manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-352770 | 2003-10-10 | ||
JP2003352770 | 2003-10-10 |
Publications (1)
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WO2005036566A1 true WO2005036566A1 (ja) | 2005-04-21 |
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PCT/JP2004/012987 WO2005036566A1 (ja) | 2003-10-10 | 2004-09-07 | 積層コイル部品およびその製造方法 |
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US (1) | US7176772B2 (ja) |
JP (1) | JP4492540B2 (ja) |
KR (1) | KR100664999B1 (ja) |
CN (1) | CN100356489C (ja) |
WO (1) | WO2005036566A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009099766A (ja) * | 2007-10-17 | 2009-05-07 | Murata Mfg Co Ltd | コイル部品及びその実装構造 |
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Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000348939A (ja) * | 1999-06-02 | 2000-12-15 | Murata Mfg Co Ltd | 積層型インダクタ |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587609Y2 (ja) * | 1979-01-25 | 1983-02-10 | ティーディーケイ株式会社 | 積層トランス |
JPH01129808U (ja) * | 1988-02-25 | 1989-09-04 | ||
JP3150141B2 (ja) * | 1990-08-24 | 2001-03-26 | ティーディーケイ株式会社 | 高周波用チップインダクタ |
JPH06112655A (ja) * | 1992-09-29 | 1994-04-22 | Matsushita Electric Ind Co Ltd | コイル内蔵多層印刷配線板およびその製造方法 |
JPH0855726A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層型電子部品及びその製造方法 |
JPH08250333A (ja) * | 1995-03-14 | 1996-09-27 | Taiyo Yuden Co Ltd | インダクタアレイ |
JP3097569B2 (ja) * | 1996-09-17 | 2000-10-10 | 株式会社村田製作所 | 積層チップインダクタの製造方法 |
JPH11186040A (ja) * | 1997-12-22 | 1999-07-09 | Tdk Corp | 積層型ノイズフィルタ |
JP3500319B2 (ja) * | 1998-01-08 | 2004-02-23 | 太陽誘電株式会社 | 電子部品 |
JPH11273979A (ja) * | 1998-03-19 | 1999-10-08 | Tdk Corp | インダクタンス素子の製造方法およびインダクタンス素子 |
JP2001102218A (ja) * | 1999-10-01 | 2001-04-13 | Koa Corp | 積層チップインダクタ及びその製造方法 |
JP3788325B2 (ja) | 2000-12-19 | 2006-06-21 | 株式会社村田製作所 | 積層型コイル部品及びその製造方法 |
JP2003017325A (ja) * | 2001-06-27 | 2003-01-17 | Murata Mfg Co Ltd | 積層型金属磁性電子部品及びその製造方法 |
JP4206745B2 (ja) * | 2002-12-13 | 2009-01-14 | 株式会社村田製作所 | 積層チップインダクタ |
JP2004303776A (ja) * | 2003-03-28 | 2004-10-28 | Mitsubishi Materials Corp | 積層型コモンモードチョークコイル及びその製造方法 |
JP2005039187A (ja) * | 2003-06-26 | 2005-02-10 | Murata Mfg Co Ltd | 積層コイル部品 |
JP3594031B1 (ja) * | 2003-07-04 | 2004-11-24 | 株式会社村田製作所 | 積層セラミック電子部品、積層コイル部品および積層セラミック電子部品の製造方法 |
US7167070B2 (en) * | 2003-09-01 | 2007-01-23 | Murata Manufacturing Co., Ltd. | Laminated coil component and method of producing the same |
-
2004
- 2004-09-07 JP JP2005514539A patent/JP4492540B2/ja active Active
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000348939A (ja) * | 1999-06-02 | 2000-12-15 | Murata Mfg Co Ltd | 積層型インダクタ |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099766A (ja) * | 2007-10-17 | 2009-05-07 | Murata Mfg Co Ltd | コイル部品及びその実装構造 |
JP2011244363A (ja) * | 2010-05-21 | 2011-12-01 | Panasonic Corp | アンテナ装置 |
JP2013089640A (ja) * | 2011-10-13 | 2013-05-13 | Tdk Corp | 積層コイル部品 |
JP2013211302A (ja) * | 2012-03-30 | 2013-10-10 | Tdk Corp | 積層コイル部品 |
US8988180B2 (en) | 2012-03-30 | 2015-03-24 | Tdk Corporation | Multilayer coil component |
JP2014232814A (ja) * | 2013-05-29 | 2014-12-11 | 太陽誘電株式会社 | コイル部品の製造方法 |
JP2014232815A (ja) * | 2013-05-29 | 2014-12-11 | 太陽誘電株式会社 | コイル部品 |
JP2018056472A (ja) * | 2016-09-30 | 2018-04-05 | 太陽誘電株式会社 | コイル部品 |
WO2024095565A1 (ja) * | 2022-11-02 | 2024-05-10 | 株式会社村田製作所 | インダクタ部品 |
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US20060049905A1 (en) | 2006-03-09 |
JP4492540B2 (ja) | 2010-06-30 |
CN100356489C (zh) | 2007-12-19 |
JPWO2005036566A1 (ja) | 2006-12-28 |
CN1701398A (zh) | 2005-11-23 |
KR100664999B1 (ko) | 2007-01-09 |
KR20050084853A (ko) | 2005-08-29 |
US7176772B2 (en) | 2007-02-13 |
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