WO2001098832A1 - Composition de resine photosensible, element photosensible la contenant, procede de production d'un motif de resist et procede de production d'une carte a circuit imprime - Google Patents
Composition de resine photosensible, element photosensible la contenant, procede de production d'un motif de resist et procede de production d'une carte a circuit imprime Download PDFInfo
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- WO2001098832A1 WO2001098832A1 PCT/JP2001/005357 JP0105357W WO0198832A1 WO 2001098832 A1 WO2001098832 A1 WO 2001098832A1 JP 0105357 W JP0105357 W JP 0105357W WO 0198832 A1 WO0198832 A1 WO 0198832A1
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- photosensitive resin
- resin composition
- component
- glycol chain
- weight
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
Definitions
- Photosensitive resin composition Photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board
- the present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for producing a resist pattern, and a method for producing a printed wiring board.
- tenting is a method in which a copper through-hole for interlayer connection is protected with a resist and an electric circuit is formed through etching and resist peeling
- plating method is a method in which a through hole is formed by electric plating. This is a method in which copper is deposited in a single layer, protected by soldering, and an electrical circuit is formed by resist peeling and etching.
- the tenting method does not require various steps such as degreasing, substrate cleaning, acid cleaning, and activation as compared with the plating method, and the resist does not come into contact with a strongly acidic or strongly basic aqueous solution for a long time. This is industrially useful because unnecessary troubles in the manufacture of the product are avoided and the process is simplified.
- the characteristics required of the photosensitive resin composition are as follows:
- the exfoliated pieces are fine because of their properties.
- the resist shape should be vertical with no voids in the resist wall at the interface between the resist and the copper surface. If the resist shape is trapezoidal, it will hinder high resolution in terms of resolution, and if it is inverted trapezoidal, the contact area with the copper surface will be relatively small, and the adhesion of the resist during etching will be reduced. Will be.
- the size, the resist shape, and the strength of the tent film of the release piece are determined by the composition or molecular weight of the binder polymer used in the photosensitive resin composition. Tends to decrease as the molecular weight of the binder polymer decreases and the composition becomes hydrophilic. On the other hand, the resist shape tends to worsen as the molecular weight of the binder polymer decreases and the composition becomes hydrophilic, and cavities are seen on the side walls of the resist. In addition, the strength of the tent film tends to decrease as the molecular weight of the binder polymer decreases and the composition becomes more hydrophilic, and the tent film is likely to be broken by a spray pressure of a developing solution or water washing.
- An object of the present invention is to provide a photosensitive resin composition and a photosensitive element useful for automation.
- the present invention uses a photosensitive resin composition or a photosensitive element in which all of the properties of the resist shape, tent reliability and releasability are well-balanced and excellent, to further increase the density of printed wiring and to improve printed wiring.
- An object of the present invention is to provide a method for manufacturing a resist pattern and a method for manufacturing a printed wiring board, which enable more efficient automation of board manufacturing.
- a binder composed of two or more binder polymers and one having a dispersity of Z or 2.5 to 6.0 are used, and as the photopolymerizable compound, an ethylene glycol chain having 3 to 6 carbon atoms in the molecule is used as the photopolymerizable compound.
- the present inventors have found that the above problems can be solved by using a compound having at least one alkylene glycol chain selected from the group consisting of alkylene glycol chains, and have completed the present invention.
- the photosensitive resin composition of the present invention contains (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond in a molecule, and (C) a photopolymerization initiator.
- the binder polymer as the component (A) is composed of two or more binder polymers
- the photopolymerizable compound as the component (B) is ethylene in the molecule. It has at least one alkylene glycol chain selected from the group consisting of a glycol chain and an alkylene glycol chain having 3 to 6 carbon atoms.
- the photosensitive resin composition of the present invention contains (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond in a molecule, and (C) a photopolymerization initiator.
- the binder resin as the component (A) has a dispersity of 2.5 to 6.0
- the photopolymerizable compound as the component (B) is a photosensitive resin composition. It has at least one alkylene glycol chain selected from the group consisting of an ethylene glycol chain and an alkylene glycol chain having 3 to 6 carbon atoms in the molecule.
- the photosensitive element of the present invention is obtained by applying the above-described photosensitive resin composition of the present invention on a support and drying the composition.
- the photosensitive element according to the present invention is laminated on a circuit-forming substrate so that the photosensitive resin composition layer is in close contact with the circuit, and the active light is irradiated imagewise. Then, the exposed portion is light-cured, and the unexposed portion is removed by development.
- the method of manufacturing a printed wiring board of the present invention is a method of performing etching or plating on a circuit-forming substrate on which a resist pattern has been formed by the above-described method for manufacturing a resist pattern of the present invention.
- the photopolymerizable compound as the component (B) has at least 15 alkylene glycol units having 2 to 6 carbon atoms, and / or has a molecular weight of 900 or more. Is preferred. It is preferable that the photopolymerizable compound as the component (B) has at least one ethylene glycol chain and at least one propylene glycol chain in the molecule.
- the binder polymer as the component (A) contains any one selected from the group consisting of styrene and a styrene derivative as an essential copolymerization component.
- the photopolymerizable compound as the component (B) may be polyalkylene glycol di (meth) acrylate or 2,2-bis (4-((meth) acryloxypoly). Alkoxy) phenyl) propane is preferred.
- the photopolymerization initiator as the component (C) is the photopolymerization initiator as the component (C)
- 2,4,5-triarylimidazomonodimer be contained as an essential component.
- (meth) acrylic acid means acrylic acid and methacrylic acid corresponding thereto
- (Meth) acrylate means acrylate and its corresponding methyl acrylate
- (meth) acryloyl means acryloyl and its corresponding methacryloyl group. I do.
- the features of the first photosensitive resin composition of the present invention include (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenic unsaturated bond in a molecule, and (C) a photopolymerization compound.
- the second photosensitive resin composition of the present invention has the following features: (A) a binder polymer; and (B) at least one ethylenic unsaturated bond in the molecule.
- a photosensitive resin composition comprising a photopolymerizable compound and (C) a photopolymerization initiator, wherein the binder polymer as the component (A) has a dispersity of 2.5 to 6.0.
- the photopolymerizable compound as the component (B) has at least one alkylene glycol chain selected from the group consisting of an ethylene glycol chain and an alkylene dalicol chain having 3 to 6 carbon atoms in the molecule. Is to have.
- the two or more binder polymers pertaining to the binder polymer as the component (A) of the first photosensitive resin composition are not particularly limited as long as they are combinations of two or more binder polymers. It is preferably a combination of two types of binders and polymers, more preferably a combination of two or three types of binders and polymers, and particularly preferably a combination of two types of binders and polymers.
- Examples of the two or more (two or more) binder polymers include two or more binder polymers having different copolymerization components, two or more binder polymers having different weight average molecular weights, and two or more pine having different dispersities.
- One example is Darpolymer.
- the resulting photosensitive resin composition has a resist shape and tent reliability unless the dispersity is 2.5 to 6.0 as described later. However, at least one of the peeling properties is inferior.
- the binder polymer is composed of two or more binders and polymers, a light-sensitive resin composition in which all properties of the resist shape, tent reliability and releasability are well-balanced and excellent can be obtained. Further, it becomes possible to efficiently and reliably obtain a binder polymer having a degree of dispersion of 2.5 to 6.0, which will be described later.
- binder-polymers having different weight average molecular weights include: For example, a binder polymer having a weight average molecular weight of about 100,000 to 75,000 and a binder polymer having a weight average molecular weight of about 80,000 to 200,000 may be used. Combinations are preferred.
- the weight-average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.
- the two types of binder polymers having different copolymer components include, for example, a blend of the following copolymers A, a blend of the following copolymers B, and a copolymer of the following copolymers A and B: Blend is preferred
- Copolymer A Copolymer of (meth) acrylic acid and one or more alkyl (meth) acrylates
- Copolymer B Copolymer of (meth) acrylic acid and one or more (meth) acrylic acid alkyl esters and styrene
- binder polymers having different dispersities for example, a combination of a binder polymer having a dispersity of 1.5 to 2.5 and a binder polymer having a dispersity of 3.5 to 4.5 is used. Preferred are mentioned.
- the degree of dispersion of the binder polymer as the component (A) in the second photosensitive resin composition is not particularly limited as long as it is 2.5 to 6.0, and is preferably 2.7 to 6.0. , 3.0 to 6.0, more preferably 3.0 to 5.5, particularly preferably 3.0 to 5.0, and 3.0 to 4.0. It is very preferably 5, and very preferably 3.0 to 4.0. If the degree of dispersion of the binder polymer according to the present invention is less than the above lower limit, it is difficult to achieve a balance between the tent reliability and the releasability (especially, the releasability is deteriorated). Worsens.
- the degree of dispersion refers to the weight average molecular weight / number average molecular weight.
- the weight average molecular weight and the number average molecular weight are measured by gel permeation chromatography, and converted by a calibration curve prepared using standard polystyrene.
- the binder polymer having a dispersity of 2.5 to 6.0 is, for example, at least two kinds of binder polymers having different weight average molecular weights (preferably, weight average molecular weights of 10 and 1000 to 75 and 0,000). And a binder polymer having a weight-average molecular weight of about 800,000 to 200,000-). Also, by using a polymer having a multi-mode molecular weight distribution described in JP-A-11-327137, the degree of dispersion of one kind of binder-polymer is adjusted to 2.5 to 6.0. You can also.
- binder polymer examples include an acrylic resin, a styrene resin, an epoxy resin, an amide resin, an amide epoxy resin, an alkyd resin, and a phenol resin. From the viewpoint of alkali developability, acrylic resins are preferred. These can be used alone or in combination of two or more.
- the binder polymer can be produced, for example, by radically polymerizing a polymerizable monomer.
- polymerizable monomer examples include styrene, vinyltoluene, polymethylstyrene, p-methylstyrene, p-ethylstyrene, p-methoxystyrene, p-ethoxystyrene, p-chlorostyrene, and p-butylstyrene.
- Polymerizable styrene derivatives such as acrylamide, acrylonitrile, vinyl-esters of vinyl alcohol such as n-butyl ether, (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrafluorofurfuryl ester Dimethylaminoethyl (meth) acrylate, getylaminoethyl (meth) acrylate, Evening) glycidyl acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, (meta) ) Acrylic acid, monobromo (meth) acrylic acid, monochloro (meth) acrylic acid, monofuryl (meth) acrylic acid, styryl (meth) acrylic acid, maleic acid, maleic anhydride, maleic acid Monoesters of maleic acid such as monomethyl phosphate, monoethyl maleate, and monois
- alkyl (meth) acrylate examples include the following general formula:
- H 1 represents a hydrogen atom or a methyl group
- R 2 represents an alkyl group having 1 to 12 carbon atoms
- the alkyl group is a hydroxyl group, an epoxy group, or a halogen group.
- Examples of the alkyl group having 1 to 12 carbon atoms represented by R 2 in the general formula include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, and a nonyl group.
- alkyl (meth) acrylate examples include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, and (meth) acrylic acid.
- the binder polymer as the component (A) preferably has a carboxyl group in at least one kind of binder polymer from the viewpoint of alkali developability, and makes all binder polymers contain a carboxyl group. Is more preferable.
- the binder polymer having a carboxyl group can be produced, for example, by radically polymerizing a polymerizable monomer having a carboxyl group and another polymerizable monomer (the polymerizable monomer having a carboxyl group described above). Methacrylic acid is preferred as the monomer.
- the binder polymer as the component (A) preferably contains a styrene or styrene derivative as a polymerizable monomer in at least one kind of binder polymer from the viewpoint of flexibility.
- a styrene or styrene derivative as a polymerizable monomer in at least one kind of binder polymer from the viewpoint of flexibility.
- 0.1 to 40% by weight of styrene or styrene derivative based on the total amount of the copolymer component of the binder polymer is used. %, More preferably 1 to 28% by weight, and particularly preferably 1.5 to 27% by weight. If the content is less than 0.1% by weight, the adhesion tends to be poor, while if it exceeds 40% by weight, the peeled pieces tend to be large and the peeling time tends to be long.
- the carboxy group content (the ratio of the polymerizable monomer having a carboxyl group to the total polymerizable monomers used) in the entire binder polymer as the component (A) is determined by the balance between alkali developability and alkali resistance. From a viewpoint, it is preferably from 12 to 50% by weight, more preferably from 12 to 40% by weight, particularly preferably from 15 to 30% by weight, and from 15 to 30% by weight. Very preferably, it is 25% by weight. If the carboxyl group content is less than 12% by weight, the developability tends to be poor, while if it exceeds 50% by weight, the alkali resistance tends to be poor.
- the weight average molecular weight of the entire binder polymer as the component (A) is preferably from 20,000 to 300,000 from the viewpoint of balance between mechanical strength and alkali developability. It is more preferably 0, 000 to 200, 000, and particularly preferably 60, 000-120, 000. When the weight average molecular weight is less than 200,000, the mechanical strength tends to be inferior, and when it exceeds 300,000, the alkali developability tends to be inferior.
- the photosensitive resin composition of the present invention contains, as the component (B), a photopolymerizable compound having at least one ethylenically unsaturated bond in the molecule, and the photopolymerizable compound is contained in the molecule.
- An alkylene glycol chain selected from the group consisting of an ethylene glycol chain and an alkylene glycol chain having 3 to 6 carbon atoms, and 3 ⁇ 4: at least one each.
- alkylene glycol chain having 3 to 6 carbon atoms examples include, for example, a propylene glycol chain (n-propylene glycol chain or isoprene glycol chain), an n-butylene glycol chain, and an isoprene glycol chain. , N-pentylene glycol chain, hexylene glycol chain, and structural isomers thereof.
- a propylene glycol chain is preferred from the viewpoint of hydrophobic balance, availability, and the like.
- the photopolymerizable compound according to the present invention has at least one ethylenically unsaturated bond in the molecule, but is preferably 2 or more, more preferably 2, from the viewpoints of tenting properties and releasability.
- the photopolymerizable compound having at least one ethylene glycol chain and one propylene glycol chain in the molecule includes at least one ethylene glycol chain and one propylene glycol chain in the molecule. There is no particular limitation as long as it is carried out.
- a polyalkylene glycol di (meth) acrylate having at least one ethylene glycol chain and at least one propylene glycol chain in the molecule, an ethylene glycol chain and propylene in the molecule 2,2-bis (4-((meth) acryloxypolyalkoxy) phenyl) having at least one each glycol chain Propane, at least one each of an ethylene glycol chain and a propylene glycol chain in the molecule
- Method acrylate compounds having a urethane bond
- trimethylolpropane triacrylate (meth) acrylate compounds having at least one each of an ethylene glycol chain and a propylene glycol chain in the molecule.
- (Meth) acryloxypolyalkoxy) phenyl) propane is preferred.
- the photopolymerizable compound having at least one each of an ethylene glycol chain and an alkylene glycol chain selected from the group consisting of alkylene glycol chains having 3 to 6 carbon atoms in the molecule, as an alkylene glycol chain in the molecule, There is no particular limitation as long as it has both an ethylene glycol chain and an alkylene glycol chain selected from the group consisting of alkylene glycol chains having 3 to 6 carbon atoms.
- Ethylene glycol chains and propylene glycol chains n— Propylene glycol chains or isopropylene glycol chains).
- ethylene glycol chains And n-butylene glycol chain in addition to propylene glycol chain. Isobutylene glycol chain, n-pentylene glycol chain, hexylene glycol chain, and alkylene glycol chains having about 4 to 6 carbon atoms such as structural isomers thereof. May be provided.
- the photopolymerizable compound preferably polyalkylene glycol di-
- the total number of repeating units of the alkylene glycol chain in (meth) acrylate) is preferably an integer of 5 to 30, more preferably 8 to 23, and more preferably 10 to 15 Particularly preferred is an integer. If the total number is less than 5, the tent reliability tends to deteriorate, while if it exceeds 30, the adhesion, resolution, and resist shape tend to deteriorate.
- the alkylene glycol having 2 to 6 carbon atoms has a unit number of 15 or more as the component (B).
- the carbon number is preferably from 2 to 6, more preferably from 2 to 5, and particularly preferably 2 or 3, from the viewpoints of tenting properties and developer contamination.
- the number of units that is, the total number of repeating units of the alkylene glycol chain having 2 to 6 carbon atoms is preferably an integer of 15 to 30 and more preferably an integer of 15 to 25. It is particularly preferably an integer of 15 to 20. If the unit number is less than 15, the tenting properties (tent reliability) are poor, and the peeling time tends to be long.
- the adhesiveness, resolution, and resist shape tend to deteriorate.
- the molecular weight of the photopolymerizable compound is more preferably 900 to 250. 0, particularly preferably 100 to 150. If the molecular weight is less than 900, tenting properties and sensitivity are poor, and the peeling time tends to be long.
- the ethylene glycol chain and alkylene glycos having 3 to 6 carbon atoms
- alkylene glycol chains preferably propylene glycol chains
- each of the plurality of ethylene glycol chains and alkylene glycol chains be present continuously in a block-like manner. It does not have sex and may exist randomly.
- the secondary carbon of the propylene group may be bonded to an oxygen atom, or the primary carbon may be bonded to an oxygen atom.
- polyalkylene glycol di (meth) acrylate having at least one ethylene glycol chain and at least one propylene glycol chain in the molecule, for example, the following general formula (I):
- E 0 represents an ethylene glycolate one Le chain
- P 0 represents a propylene glycol Ichiru chain
- m 4 and n 4 are each a compound represented by independently an integer from 1 to 3 0
- R (In the formula, two Rs each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, E 0 represents an ethylene glycol chain, PO represents a propylene glycol chain, m 5 , m 6 , ⁇ 5 and ⁇ 6 are each independently an integer from 1 to 30)
- Examples of the alkyl group having 1 to 3 carbon atoms in the general formula (1), the general formula (11), the general formula (III) and the general formula (IV) include a methyl group, an ethyl group, a ⁇ -propyl group, Isopropyl group and the like.
- the total number of repeating ethylene glycol chains in the general formulas (1), (11), (III) and (IV) (m 1 + m 2 , m 3 , m 4 and m 5 + m 6 ) is each independently an integer of 1 to 3 °, preferably an integer of 1 to 10, more preferably an integer of 4 to 9, and particularly preferably an integer of 5 to 8. preferable. If the number of repetitions exceeds 30, the tent reliability and the resist shape tend to deteriorate.
- the general formula (1), the general formula (11), the general formula (III) and the number of repetitions total of the general formula (IV) to definitive pro propylene glycol chain are each independently an integer of 1 to 30, preferably an integer of 5 to 20, more preferably an integer of 8 to 16, and an integer of 10 to 14 Is particularly preferred.
- the number of repetitions exceeds 30, the resolution deteriorates, and scum (developer contamination) tends to occur.
- Examples of 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane represented by the general formula (IV) include, for example, 2,2-bis (4-1 ((meta) ) Acryloxyj ethoxypropapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetraethoxytetrapropoxy) phenyl) propane, 2, 2-1 bis (4-1 ((meta) Acryloxyhexaethoxyhexapropoxy) phenyl) propane and the like. These are used alone or in combination of two or more.
- the photopolymerizable compound other than the photopolymerizable compound having at least one each of an ethylene glycol chain and a propylene glycol chain in the molecule is, for example, obtained by reacting a polyhydric alcohol with a monounsaturated carboxylic acid.
- urethane monomer such as (meth) acrylate compound having urethane bond, chloro-1-hydroxypropyl -'- (meth) acryloyloxetyl-O- Phthalate, ⁇ -Hydroxyshetyl-?-(Meth) acryloyloxyshetyl- ⁇ -(Meth) Acryloyloxy-shetyl- ⁇ - (Phthalate, (Meth-A) Alkyl acrylates, etc., but bisphenol-based (meth) acrylate compounds or That (meth) it is preferable to Akuri rate compound as essential components.
- urethane monomer such as (meth) acrylate compound having urethane bond, chloro-1-hydroxypropyl -'- (meth) acryloyloxetyl-O- Phthalate, ⁇ -Hydroxyshetyl-?-(Meth) acryloyloxyshetyl-
- 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane for example, 2,2-bis (4-((meth) acryloxydiethoxy) phenyl) Propane, 2,2-bis (4-((meta) acryloxytoriethoxy) phenyl) propane, 2,2-bis (4-1 ((meth) acryloxytetraethoxy) phenyl) propane, 2,, 2-Bis (4-((meth) acryloxyphene ethoxy) phenyl) P Mouth bread, 2,2-bis (4-((Meth) acryloxyhexaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyheptanoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyctaethoxy) phenyl) propane, 2,2-bis (4-1 ((me Acryloxynonaethoxy) Phenyl
- BPE-500 product name, manufactured by Shin-Nakamura Chemical Co., Ltd.
- BPE-130 Shin-Nakamura Chemical Co., Ltd., product name
- Examples of the photopolymerization initiator as the component (C) include ⁇ ⁇ ⁇ , ⁇ ′-tetraalkyl-14 such as benzophenone, ⁇ , ⁇ ′-tetramethyl-14,4 ′ diaminonovenzophenone (michella ketone), and the like.
- Aromatic ketones such as linolepropanone 11; quinones such as alkylanthraquinone; benzoin ether compounds such as benzozoalkyl ethers; benzoin compounds such as benzoin and alkylbenzoin; benzyl compounds such as benzoin compounds and benzyldimethyl ketal.
- substituents of the aryl groups of the two 2,4,5-triarylimidazoles may be the same to give the target compound, or they may give different asymmetric compounds.
- 2,4,5-triarylimidazole dimer is more preferable. These are used alone or in combination of two or more.
- the blending amount of the binder polymer as the component (A) is determined from the viewpoint of the balance between the coating properties and the photocurability, based on 100 parts by weight of the total amount of the components (A) and (B).
- the amount is preferably from 80 to 80 parts by weight, more preferably from 50 to 70 parts by weight, and particularly preferably from 55 to 65 parts by weight. If the amount is less than 40 parts by weight, the resulting photosensitive resin composition tends to have poor coating properties, while if it exceeds 80 parts by weight, the photocurability tends to be insufficient.
- the compounding amount of the photopolymerizable compound as the component (B) is as follows.
- the amount is preferably from 20 to 60 parts by weight, more preferably from 3 ° to 50 parts by weight, more preferably from 35 to 45 parts by weight, based on 100 parts by weight of the component (B). Is particularly preferred. If the amount is less than 20 parts by weight, the photocurability tends to be insufficient, while if it exceeds 60 parts by weight, the coating properties tend to deteriorate.
- an ethylene glycol chain and a C3-6 The amount of the photopolymerizable compound having at least one alkylene glycol chain selected from the group consisting of alkylene glycol chains is 10 to 100 parts by weight based on 100 parts by weight of the total amount of the component (B). Parts by weight, more preferably 25 to 75 parts by weight, particularly preferably 40 to 60 parts by weight. If the amount is less than 10 parts by weight, the reliability of the tent tends to be insufficient.
- the amount of the photopolymerization initiator as the component (C) is 0.01 based on 100 parts by weight of the total amount of the components (A) and (B). To 20 parts by weight, preferably 0.01 to: 10 parts by weight, more preferably 0.01 to 5 parts by weight, and 0.05 to 4 parts by weight. Is very preferable, and 0.1 to 3 parts by weight is very preferable. If the amount is less than 0.01 part by weight, the sensitivity tends to be insufficient, while if it exceeds 20 parts by weight, the resolution tends to deteriorate.
- the photosensitive resin composition may include, as necessary, a photopolymerizable compound having at least one cationically polymerizable cyclic ether group in the molecule, a cationic polymerization initiator, a dye such as malachite green, or a dye.
- Photochromic agents such as lipromophenyl sulfone and leuco crystal violet, thermal coloring inhibitors, plasticizers such as p-toluenesulfonamide, pigments, fillers, defoamers, flame retardants, stabilizers, and adhesion Additives, leveling agents, release accelerators, antioxidants, fragrances, imaging agents, thermal cross-linking agents, etc. 0.01 to 20 parts by weight based on 100 parts by weight of component (A) and component (B) It can be contained in the order of parts by weight. These are used alone or in combination of two or more.
- the photosensitive resin composition may be, if necessary, methanol, ethanol, acetone, methyl ethyl ketone, methyl sorb, methyl cellulose, toluene, N, N-dimethylformamide, propylene glycol monoamine. It can be dissolved in a solvent such as methyl ether or a mixed solvent thereof and applied as a solution having a solid content of about 30 to 60% by weight.
- the photosensitive resin composition is not particularly limited, but is coated as a liquid resist on a metal surface such as copper, a copper-based alloy, iron, and an iron-based alloy, dried, and then, if necessary, coated with a protective film. It is preferable to use it after coating or in the form of a photosensitive element.
- the thickness of the photosensitive resin composition layer varies depending on the application, but is preferably about 1 to 100 ⁇ m in thickness after drying.
- the protective film may be a polymer film such as polyethylene or polypropylene.
- the photosensitive element can be obtained, for example, by applying and drying a photosensitive resin composition on a polymer film such as polyethylene terephthalate, polypropylene, polyethylene, or polyester as a support.
- a photosensitive resin composition on a polymer film such as polyethylene terephthalate, polypropylene, polyethylene, or polyester as a support.
- the above-mentioned coating can be carried out by a known method such as, for example, overnight-course-over-night, comma-night-over, gravure-over-night, air-knife-over, daiko-over, barco-over. Drying can be performed at 70 to 150 ° C. for about 5 to 30 minutes.
- the amount of the residual organic solvent in the photosensitive resin composition layer is preferably 2% by weight or less from the viewpoint of preventing the diffusion of the organic solvent in a later step.
- the thickness of these polymer films is preferably from 1 to 100 ⁇ m.
- One of these polymer films is used as a support for the photosensitive resin composition layer, and the other is laminated on both sides of the photosensitive resin composition layer as a protective film for the photosensitive resin composition.
- the protective film a film having a smaller adhesive strength between the photosensitive resin composition layer and the protective film than the adhesive force between the photosensitive resin composition layer and the support is preferable, and a low fisheye film is preferable.
- the photosensitive element has an intermediate layer and a protective layer such as a cushion layer, an adhesive layer, a light absorbing layer, and a gas barrier layer, in addition to the photosensitive resin composition layer, the support, and the protective film.
- a protective layer such as a cushion layer, an adhesive layer, a light absorbing layer, and a gas barrier layer, in addition to the photosensitive resin composition layer, the support, and the protective film.
- the photosensitive element is stored, for example, as it is or after being further laminated with a protective film on the other surface of the photosensitive resin composition layer and wound on a cylindrical core.
- the support is wound up so as to be the outermost side.
- the core include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, and ABS resin (acrylonitrile-butadiene-styrene copolymer).
- the protective film In producing a resist pattern using the photosensitive element, if the protective film is present, the protective film is removed, and then the photosensitive resin composition layer is heated to 70 to 130 °. the circuit-forming board while heating to approximately C 0 1 ⁇ ;. LMP a degree (1 ⁇ ; L 0 kg if / cm 2 or so) and a method of laminating by bonding with a pressure may be mentioned of, under reduced pressure Stacking is also possible.
- the surface to be laminated is usually a metal surface, but is not particularly limited.
- the photosensitive resin composition layer thus completed is irradiated with actinic rays imagewise through a negative or positive mask pattern.
- a known light source for example, a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, or the like that effectively emits ultraviolet light or visible light is used.
- a jet development using a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent is performed.
- the resist pattern can be manufactured by removing unexposed portions by dry development or the like and developing the image.
- Examples of the alkaline aqueous solution include a dilute solution of 0.1 to 5% by weight of sodium carbonate, a dilute solution of 0.1 to 5% by weight of potassium carbonate, and a dilute solution of 0.1 to 5% by weight of sodium hydroxide. Solution and the like.
- the pH of the aqueous solution is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin composition layer.
- a surfactant, an antifoaming agent, an organic solvent and the like may be mixed in the alkaline aqueous solution.
- Examples of the developing method include a dip method, a spray method, brushing, and slapping.
- a registry pattern by performing. 2 to 1 0 JZ cm 2 about exposure Is also good.
- a cupric chloride solution, a ferric chloride solution, an alkali etching solution, or the like can be used.
- the surface of the circuit forming substrate is treated by a known method such as etching and plating using the developed resist pattern as a mask.
- the plating method include copper plating, solder plating, nickel plating, and gold plating.
- the resist pattern can be peeled off, for example, with an aqueous solution that is stronger than the aqueous solution used for development.
- an aqueous solution that is stronger than the aqueous solution used for development for example, an aqueous solution that is stronger than the aqueous solution used for development.
- the strong alkaline aqueous solution for example, an aqueous solution of 1 to 10% by weight of sodium hydroxide, an aqueous solution of 1 to 10% by weight of potassium hydroxide and the like are used. Peeling Examples of the release method include an immersion method and a spray method.
- the printed wiring board on which the resist pattern is formed may be a multilayer printed wiring or may have a small diameter through hole.
- Methacrylic acid Z Methyl methacrylate
- Acid ethyl 20/50/30 (weight ratio), weight average 150
- Methacrylic acid Z Methyl methacrylate
- Weight 80,000, 40% by weight
- Methacrylic acid Z Methyl methacrylate / acrylic
- Acid ethyl 20/50/30 (weight ratio), weight average 150 150
- Methacrylic acid Methyl methacrylate Z acrylic
- the solution of the photosensitive resin composition obtained above was evenly spread on a 19 m-thick polyethylene terephthalate film (product name: G2-19, manufactured by Teijin Limited). And dried with a hot air convection dryer of 100 for 10 minutes to obtain a photosensitive element.
- the dried film thickness of the photosensitive resin composition layer was 40 m.
- the copper surface of a copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-697), which is a glass epoxy material with copper foil (thickness: 35 ⁇ m) Polished using a polishing machine with a brush equivalent to 600 (manufactured by Sankei Co., Ltd.), washed with water, dried in an air stream, and the obtained copper-clad laminate was heated to 80 ° C. W
- the layers of the photosensitive resin composition were laminated at 11 ° C. and 0.4 MPa.
- the copper-clad laminate was cooled, and when the temperature of the copper-clad laminate reached 23 ° C, a phototool (a 21-step step plate of stophor) was placed on the polyethylene terephthalate surface.
- a line width / space width of 30 mZ 400 ⁇ m to 200 ⁇ / 400 ⁇ m, a photoresist with a wiring pattern) is closely attached, and an exposure machine manufactured by Oak Manufacturing Co., Ltd. (model HMW-201) Using a GX, 5 kW ultra-high pressure mercury lamp), exposure was performed at an energy amount such that the number of remaining steps after development of the 21-step step tablet of the stuff was 8.0.
- the tent reliability was evaluated according to the following procedure. 3.0 mm 0s 3.5 mm0, 4.0 m ⁇ 4.5 mm0, 5.Omm0, 5.5 mm 6.0 mm ⁇ holes in 6 mm thick copper-clad laminate 24 bright each
- the photosensitive element is laminated on both sides of the substrate (110 ° C, 0.4 MPa) and exposed with the above energy amount (exposure amount at which the number of remaining steps after development becomes 8.0). Then, development for 60 seconds (30 ° C., sprayed with a 1.0% by weight aqueous sodium carbonate solution) was performed twice. After development, 3. 0 mm0, 3. 5 mm0 , 4. 0 mm ⁇ N 4. 5 mm0, 5.
- the peelability was evaluated according to the following procedure.
- the copper surface of a copper-clad laminate (MCL-E—6979, manufactured by Hitachi Chemical Co., Ltd.), a glass epoxy material with a thickness of 35 laminated on both sides, is equivalent to # 600
- polishing machine manufactured by Sankei Co., Ltd.
- the obtained copper-clad laminate was heated to 80 ° C.
- a layer of the photosensitive resin composition is
- the copper-clad laminate was cooled, and when the temperature of the copper-clad laminate reached 23 ° C, an exposure machine (model HMW-20) manufactured by Oak Manufacturing Co., Ltd. was used without using a font. Using a 1 GX, 5 kW ultra-high pressure mercury lamp), exposure was performed with an energy amount that would allow the remaining step number after development of the 21-step step tablet of the transfer to be 8.0 (overall exposure).
- the photosensitive resin compositions used in Comparative Examples 1 and 2 had poor tent reliability. Further, the photosensitive resin composition used in Comparative Example 3 had poor releasability. Furthermore, the photosensitive resin compositions used in Comparative Examples 4 and 6 were both poor in resist shape and tent reliability. Furthermore, the photosensitive resin composition used in Comparative Example 5 had poor tent reliability and peelability.
- the photosensitive resin compositions used in Examples 1 to 7 had excellent resist shapes, tent reliability, and peelability.
- the photosensitive resin composition and the photosensitive element of the present invention it is possible to achieve a well-balanced and high-level characteristic in all of the resist shape, tent reliability, and peelability. . Therefore, the photosensitive resin composition and photosensitive element of the present invention are useful for increasing the density of printed wiring and automating the production of printed wiring boards.
- the photosensitive resin according to the present invention is excellent in all of the characteristics of the resist shape, tent reliability and peelability with good balance.
- the use of the composition or photosensitive element allows for higher density printed wiring and more efficient automation of printed wiring board production.
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001266324A AU2001266324A1 (en) | 2000-06-22 | 2001-06-22 | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board |
US10/311,692 US7067228B2 (en) | 2000-06-22 | 2001-06-22 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method |
JP2002504534A JP4779284B2 (ja) | 2000-06-22 | 2001-06-22 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000187819 | 2000-06-22 | ||
JP2000-187819 | 2000-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001098832A1 true WO2001098832A1 (fr) | 2001-12-27 |
Family
ID=18687725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/005357 WO2001098832A1 (fr) | 2000-06-22 | 2001-06-22 | Composition de resine photosensible, element photosensible la contenant, procede de production d'un motif de resist et procede de production d'une carte a circuit imprime |
Country Status (7)
Country | Link |
---|---|
US (1) | US7067228B2 (ja) |
JP (3) | JP4779284B2 (ja) |
KR (1) | KR100537085B1 (ja) |
CN (1) | CN1221860C (ja) |
AU (1) | AU2001266324A1 (ja) |
TW (1) | TWI240149B (ja) |
WO (1) | WO2001098832A1 (ja) |
Cited By (5)
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EP1546808A1 (en) * | 2002-09-03 | 2005-06-29 | Kolon Industries, Inc. | Photopolymerizable resin composition for sandblast resist |
WO2006025092A1 (ja) * | 2004-08-30 | 2006-03-09 | Hitachi Chemical Co., Ltd. | 感光性フィルム |
JP2006527179A (ja) * | 2003-06-06 | 2006-11-30 | ビーエーエスエフ アクチェンゲゼルシャフト | アルキレニレングリコールの(メタ)アクリル酸エステルおよびその使用 |
JP2011123505A (ja) * | 2000-06-22 | 2011-06-23 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
JP2014134815A (ja) * | 2006-12-27 | 2014-07-24 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002027407A1 (fr) * | 2000-09-27 | 2002-04-04 | Hitachi Chemical Co., Ltd. | Motif de reserve, procede de production et d'utilisation dudit motif |
US7005143B2 (en) * | 2002-04-12 | 2006-02-28 | 3M Innovative Properties Company | Gel materials, medical articles, and methods |
JP4315892B2 (ja) * | 2004-11-25 | 2009-08-19 | 東京応化工業株式会社 | 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム |
JP4764668B2 (ja) * | 2005-07-05 | 2011-09-07 | セイコーエプソン株式会社 | 電子基板の製造方法および電子基板 |
KR101190945B1 (ko) * | 2005-10-25 | 2012-10-12 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법 |
KR101012907B1 (ko) * | 2006-04-18 | 2011-02-08 | 히다치 가세고교 가부시끼가이샤 | 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법 |
JP4711886B2 (ja) * | 2006-05-26 | 2011-06-29 | 富士フイルム株式会社 | 感光性組成物、感光性フィルム及びプリント基板 |
KR100974790B1 (ko) * | 2009-11-03 | 2010-08-06 | 강법식 | 가래떡 중앙 속넣기 장치 |
JP5935271B2 (ja) * | 2010-09-22 | 2016-06-15 | Dic株式会社 | 熱転写用フィルム及びその製造方法 |
US20150293443A1 (en) * | 2012-11-20 | 2015-10-15 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
CN106233204A (zh) * | 2014-05-13 | 2016-12-14 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法 |
CN107077068B (zh) * | 2014-11-17 | 2021-03-12 | 昭和电工材料株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法 |
CN104834182B (zh) * | 2015-05-20 | 2019-05-03 | 杭州福斯特应用材料股份有限公司 | 一种具有高分辨率和优异掩孔性能的感光干膜 |
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- 2001-06-22 AU AU2001266324A patent/AU2001266324A1/en not_active Abandoned
- 2001-06-22 JP JP2002504534A patent/JP4779284B2/ja not_active Expired - Lifetime
- 2001-06-22 WO PCT/JP2001/005357 patent/WO2001098832A1/ja active IP Right Grant
- 2001-06-22 TW TW090115325A patent/TWI240149B/zh not_active IP Right Cessation
- 2001-06-22 US US10/311,692 patent/US7067228B2/en not_active Expired - Fee Related
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011123505A (ja) * | 2000-06-22 | 2011-06-23 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
JP2011128629A (ja) * | 2000-06-22 | 2011-06-30 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
EP1546808A1 (en) * | 2002-09-03 | 2005-06-29 | Kolon Industries, Inc. | Photopolymerizable resin composition for sandblast resist |
EP1546808A4 (en) * | 2002-09-03 | 2007-07-25 | Kolon Inc | POLYMERIZABLE RESIN COMPOSITION FOR SAND MASK |
JP2006527179A (ja) * | 2003-06-06 | 2006-11-30 | ビーエーエスエフ アクチェンゲゼルシャフト | アルキレニレングリコールの(メタ)アクリル酸エステルおよびその使用 |
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JP2014134815A (ja) * | 2006-12-27 | 2014-07-24 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2011128629A (ja) | 2011-06-30 |
US20040101777A1 (en) | 2004-05-27 |
JP4900514B2 (ja) | 2012-03-21 |
JP4779284B2 (ja) | 2011-09-28 |
KR20030076239A (ko) | 2003-09-26 |
JP2011123505A (ja) | 2011-06-23 |
TWI240149B (en) | 2005-09-21 |
KR100537085B1 (ko) | 2005-12-16 |
JP4983985B2 (ja) | 2012-07-25 |
CN1221860C (zh) | 2005-10-05 |
US7067228B2 (en) | 2006-06-27 |
AU2001266324A1 (en) | 2002-01-02 |
CN1437716A (zh) | 2003-08-20 |
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