WO2000079289A1 - Substrat de cablage pour module de contact conducteur - Google Patents

Substrat de cablage pour module de contact conducteur Download PDF

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Publication number
WO2000079289A1
WO2000079289A1 PCT/JP2000/003902 JP0003902W WO0079289A1 WO 2000079289 A1 WO2000079289 A1 WO 2000079289A1 JP 0003902 W JP0003902 W JP 0003902W WO 0079289 A1 WO0079289 A1 WO 0079289A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
conductive paths
contact
contact unit
wiring substrate
Prior art date
Application number
PCT/JP2000/003902
Other languages
English (en)
Japanese (ja)
Inventor
Junji Akaza
Akira Inoue
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to AU54271/00A priority Critical patent/AU5427100A/en
Publication of WO2000079289A1 publication Critical patent/WO2000079289A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H01R12/67—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal insulation penetrating terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Definitions

  • the present invention relates to a conductive contact unit wiring board suitable for use in a conductive contact unit in which a plurality of conductive contacts are arranged in parallel so that multipoint simultaneous inspection can be performed. is there. Background art
  • the liquid crystal panel is inspected in a process prior to joining a TAB and a PCB (mounting printed circuit board) for mounting an IC chip as a panel lighting driving LSI.
  • a conductive contact unit having the same number of conductive contacts as the number of connection electrodes according to the wiring pattern of the cell of the liquid crystal panel may be used.
  • the above inspection was performed using a wiring board using the same TAB or an equivalent TAB.
  • a plurality of conductive contacts are arranged so that a multi-point simultaneous inspection can be performed.
  • a plurality of conductive paths corresponding to the plurality of conductive contacts are formed on a glass substrate, and the conductive path is formed at one end of the conductive path.
  • a contact head for contacting the electrical contact was formed.
  • the pitch can be narrowed when a plurality of conductive paths are provided, and the heat generated due to the temperature difference is different from the case where the conductive paths are formed on a film such as TAB. It is hardly affected by expansion and can improve accuracy.
  • FIG. 1 is an overall perspective view showing a conductive contact unit for multipoint simultaneous inspection to which the present invention is applied
  • FIG. 2 is a front view showing a wiring pattern of a wiring board to which the present invention is applied
  • FIG. 3 is a diagram corresponding to FIG. 2 showing the second embodiment
  • FIG. 4 is a diagram corresponding to FIG. 2 showing the third embodiment.
  • FIG. 1 is an overall perspective view showing a conductive contact unit for multipoint simultaneous inspection to which the present invention is applied.
  • the conductive contact unit 1 shown in the figure is suitable for use in inspection of the liquid crystal panel 2, and is provided between the liquid crystal panel 2 and an external circuit (not shown) to electrically connect the two.
  • the unit body 3 is formed by stacking plates in multiple layers.
  • a plurality of holder holes formed through the unit body 3 in the thickness direction of each plate are arranged in parallel with each other, and each holder hole extends vertically in the unit body 3.
  • a pair of conductive needles 4a 44b, which are to be immersed, and a compression coil spring (not shown) for resiliently energizing them are coaxially received.
  • a wiring board 5 is superimposed on the upper surface in the figure.
  • the wiring substrate 5 is formed by forming a wiring pattern on a glass substrate.
  • the wiring board 5 is further connected to an external connection FPC (flexible printed wiring board) 6 as an external circuit connection wiring member connected to an external circuit (not shown).
  • FPC flexible printed wiring board
  • FIG. 2 which is a view of the lower surface of the wiring board 5 in FIG. 1 as viewed from the front, the wiring board 5 is formed with a plurality of conductive paths 8 arranged in parallel with each other.
  • an IC chip 9 is mounted between the conduction paths 7 and 8. The mounting of the IC chip 9 in this manner may be the same as the IC chip mounted on the liquid crystal panel 2 to be manufactured, and the completion inspection of the liquid crystal panel 2 before mounting the IC chip is performed on the IC chip. This is because the same signal is used.
  • a connection pad for facilitating connection with the wiring pattern may be formed.
  • the IC chip 9 may be mounted by COG (chip-on-glass) mounting technology.
  • the pitch of the conductive paths 7 in the parallel direction can be reduced as much as possible.
  • it can be used for inspection of high-definition liquid crystal panels. Can respond adequately.
  • the pad on the glass is less likely to be damaged than the pad on the TAB tape, so that conduction can be stabilized.
  • each contact pad 11a is expanded as much as possible. This increases the allowable value of the contact position accuracy of the conductive needle-shaped body 4a, so that stable conduction can be obtained.
  • the pitch of each pad on the liquid crystal panel 2 (the pitch of each conductive needle 4a) is relatively narrow, and the wiring pitch on the FPC 6 side for external connection is compared.
  • a wiring pattern is formed by changing the pitch of each conduction path 12 on the way. As described above, even when the pitch of the conduction path 12 is changed, since the wiring pattern is formed on the glass substrate, the processing can be performed with high accuracy and can be suitably performed.
  • the contact pads 12a are formed in the same manner as in each of the above-described examples.
  • the wiring substrate is made of a glass substrate, the wiring pattern is hardly affected by a change in expansion and contraction of the wiring substrate due to a change in the temperature of the use atmosphere or the like. Is maintained.
  • TAB which uses solder or tincture for copper, has a limit in miniaturization, and if a dedicated pad is provided, there is a risk of short-circuiting with an adjacent pad.
  • a dedicated pad wider than the wiring pattern can be provided, the contactable range of the contact can be increased, and the contact reliability can be improved. Therefore, the wiring width of the wiring pattern can be reduced as much as possible, and a high-precision wiring pattern can be formed. As a result, the design width of the line layout increases, and the wiring pattern can be applied to various inspection objects.
  • a plurality of conductive paths can be formed at a narrow pitch on a glass substrate, and therefore, there is an effect of thermal expansion due to a temperature difference with respect to the case where the conductive paths are formed on a film such as TAB. It is difficult to maintain high definition of the conduction path.
  • the shape of the conduction path can be freely designed, various wirings / turns can be formed, and it can be applied to various inspection objects.
  • the COG mounting technology allows the IC chip to be mounted directly on the wiring board, saving space.
  • the film (polyimide) is coated with copper, solder, and tin, so it is soft and has poor rigidity and flatness of the base material, making it difficult to stabilize the contact with the contact.
  • the flatness is good, the contact is stabilized, the contact bites are reduced, and the wiring pattern is less painful, so the durability is improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)

Abstract

L'invention concerne un substrat de câblage pour module de contact conducteur sur lequel il est possible de former des chemins conducteurs de haute précision. On fabrique un substrat (5) de câblage, qui permet de mettre en contact une pluralité d'éléments (4a) en forme d'aiguille situés sur d'un module (1) de contact conducteur utilisé pour l'inspection d'un panneau (2) d'affichage à cristaux liquides, par agencement de chemins conducteurs sur un substrat de verre. Ensuite, on forme un plot de contact à l'une des extrémités de chaque chemin conducteur, alors qu'à l'autre extrémité, on raccorde un circuit (16) imprimé souple pour la connexion extérieure. Puisqu'il est possible de former une pluralité de chemins conducteurs avec un faible écart sur un substrat de verre, le substrat de câblage est peu sensible à la dilatation thermique due à un écart de température, contrairement, par exemple, à une connexion sur bande où les chemins conducteurs sont formés directement sur le film. La miniaturisation des chemins conducteurs est maintenue et elle peut être adaptée de façon appropriée à la miniaturisation d'un objet à inspecter. Puisque les chemins conducteurs peuvent être dessinés librement, divers motifs peuvent être formés, et le substrat de câblage peut être ainsi adapté à divers objets faisant l'objet d'une inspection.
PCT/JP2000/003902 1999-06-18 2000-06-15 Substrat de cablage pour module de contact conducteur WO2000079289A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU54271/00A AU5427100A (en) 1999-06-18 2000-06-15 Wiring substrate for conductive contact unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/172316 1999-06-18
JP17231699 1999-06-18

Publications (1)

Publication Number Publication Date
WO2000079289A1 true WO2000079289A1 (fr) 2000-12-28

Family

ID=15939666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/003902 WO2000079289A1 (fr) 1999-06-18 2000-06-15 Substrat de cablage pour module de contact conducteur

Country Status (3)

Country Link
AU (1) AU5427100A (fr)
TW (1) TW452989B (fr)
WO (1) WO2000079289A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110471201A (zh) * 2019-08-14 2019-11-19 武汉精毅通电子技术有限公司 压接治具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155072U (fr) * 1987-03-30 1988-10-12
JPH10239352A (ja) * 1997-02-27 1998-09-11 Mitsubishi Materials Corp プローブ装置
JPH11119245A (ja) * 1997-10-20 1999-04-30 Citizen Watch Co Ltd 液晶表示パネル

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155072U (fr) * 1987-03-30 1988-10-12
JPH10239352A (ja) * 1997-02-27 1998-09-11 Mitsubishi Materials Corp プローブ装置
JPH11119245A (ja) * 1997-10-20 1999-04-30 Citizen Watch Co Ltd 液晶表示パネル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110471201A (zh) * 2019-08-14 2019-11-19 武汉精毅通电子技术有限公司 压接治具

Also Published As

Publication number Publication date
AU5427100A (en) 2001-01-09
TW452989B (en) 2001-09-01

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