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L A7 B7 五、發明說明（1 ) (技術領域） 本發明係關於一種適用於能進行多點同時檢查地並聯 地配設複數導電性接點之導電性接點單元的導電性接點單 元用配線基板。 (背景技術） 以往，欲進行液晶面板之點燈檢查或陣列基板檢查， 在結合用以實裝作爲該面板點燈驅動用L S I之I C晶片 的ΤΑ B及P C B (實裝印刷電路基板之前過程來檢查液 晶面板時，有使用具有與依液晶面板之晶格的配線圖案之 連接電極數相同數之導電性接點的導電性接點單元之情形 。在此等導電性接點單元，使用相同ΤΑ B或同等ΤΑ B 之配線基板，來進行上述檢查。 然而，在上述之液晶面板，近年來被要求依顯示之高 精細化之窄間距化。對應於此種高精細化，即使在上述導 電性接點單元之接點的窄間距化成爲必需，因.而在其配線 基板之配線圖案也需要高精度化。對於此種高精度化之要 求，在以往之T A B方式上在其細密化上有界限之問題。 (發明之揭示） 解決此等課題，爲了實現導通路徑之高精度化成爲可 能的配線基板，在本發明之導電性接點單元用配線基板， 屬於能進行多點同時檢査地用以電氣式地連接配設複數導 電性接點的導電性接點單元之該複數導電性接點與外部電 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） ,-------I ---I I * I — I I I I I --I I--I-- (請先w讀背面之注意i項再填寫本頁> -4- 45298 9 A7 B7 五、發明說明（2) 路之間的導電性接點單元之配設基板，其特徵爲：在玻璃 基板，形成對應於上述複數導電性接點之複數導電路徑’ 同時在上述導通路徑之其中一方端部形成用以接觸上述導 電性接點之接點用墊。 依照此構成，由於在玻璃基板形成導通路徑，因此在 配設複數導通路徑時可成爲窄間距化。對於形成在T A B 等之薄膜時不容易受到依溫度差之熱脹影響，可提高高精 度化。 又，由於檢查時之發生信號用I C晶片，以C 0 G實 裝技術實裝在上述導通路徑之間，而在檢査用實裝I C晶 片時，由於可將I C晶片直接實裝在配線基板，因此可以 節省空間，同時玻璃上之墊比TAB帶之墊不容易破損， 故可得到導通之安定化。 (實施發明所用之最佳形態） 第1圖係表示本發明所適用之多點同時檢查用導電性 接點單元的整體斜視圖。圖之導電性接點單元係適用於液 晶面板2之檢查，使用於設於液晶面板2與未圖示之外部 電路之間而用以電氣式地連接兩者間；該單元本體3係多 層地積層板所形成。在單元本體部3互相並排地配設有貫 穿各板之厚度方向所形成的複數保持孔，同時在各保持孔 內’同軸地收容分別出沒在單元本體3之上下方向的一對 導電性針狀體4 a ，4 b及彈性蓄勢彈壓該針狀體的抗壓 螺旋彈簧（未圖示）。 {請先閱讀背面之注意事項再瑱寫本頁> 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -5- 45298 A7 B7 五、發明說明（3) 在圖之導電性接點單元，係在該圖之上面重疊有配線 基板5。配線基板5係在玻璃基板形成配線圖案所成。在 該配線基板5 ，連接有作爲連接於未圖示之外部電路的外 部電路連接用配線構件之外部連接用F P C (撓性印刷電 路配線板）6。 如表示於從正面觀看配線基板5之第1圖之下面的圖 式之第2圖所示，形成有互相並排地所配設的複數條導通 路徑7，8，同時在此等導通路徑7，8之間實裝有I C 晶片9。如此實裝I C晶片9 ，對於與實裝於被成品化之 液晶面板之I C晶片相同者而較理想，爲了藉由依該I c 晶片之相同信號進行液晶面板2之I C晶片實裝前之完成 檢查。 在朝I C晶片9之圖中上方延伸的導通路徑7之延伸 方向端部，能與突出於第1圖上方之各導電性針狀體4 a 接觸地，各接點用墊7 a形成在各該對應之位置。在朝 I C晶片9之圖下方延伸的導通路徑8之延伸方向端部。 形成連接有上述外部連接用F P C 6的配線圖案之端部。 在該端部也可以形成容易地連接配線圖案所用的連接用墊 。又，上述I C晶片9係以C 0 G實裝技術被實裝較理想 〇 如此，由於在玻璃基板所成之配線基板5形成配線圖 案（導通路徑7，8)，因此可將導通路徑7之並排方向 的間距儘量變窄小。由此，對於在以往之TAB方式之薄 膜上形成配線圖案者，可將間距形成更窄小，也可充分地 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A _ lllllllllllll I I I I I 1 I illlllf (請先閱讀背面之注意事項再填寫本頁)L A7 B7 V. Description of the Invention (1) (Technical Field) The present invention relates to a conductive contact unit suitable for a conductive contact unit in which a plurality of conductive contacts are arranged in parallel and can be simultaneously inspected at multiple points. Wiring board. (Background Art) In the past, when lighting inspection or array substrate inspection of a liquid crystal panel was to be carried out, a combination of TAB and a PCB (a printed circuit board before mounting) for mounting an IC chip that is an LSI for driving the panel lighting was performed. When inspecting a liquid crystal panel, there are cases where a conductive contact unit having the same number of conductive contacts as the number of connection electrodes of the wiring pattern according to the lattice pattern of the liquid crystal panel is used. In these conductive contact units, the same TA is used. B or the equivalent TAB wiring board to perform the above inspections. However, the above-mentioned liquid crystal panels have been required to have narrower pitches in accordance with the higher definition of the display in recent years. Corresponding to this higher definition, even the above-mentioned conductivity It is necessary to narrow the pitch of the contacts of the contact unit, and the wiring pattern of the wiring board also needs to be highly precise. For such a requirement of high precision, the conventional TAB method has made it more compact. (Disclosure of the Invention) To solve these problems, in order to achieve high precision of the conduction path of the wiring substrate, the conductive connection of the present invention The wiring board for a unit belongs to a conductive contact unit provided with a plurality of conductive contacts and can be electrically connected to the conductive contact unit provided with a plurality of conductive contacts at the same time. CNS) A4 specification (210 x 297 mm), ----- I --- II * I-IIIII --I I--I-- (please read the note i on the back side before filling in this Page> -4- 45298 9 A7 B7 V. Description of the invention (2) The substrate for the provision of conductive contact units between circuits is characterized in that a plurality of conductive contacts are formed on the glass substrate corresponding to the above-mentioned plurality of conductive contacts. At the same time, a conductive pad is formed at one end of the conductive path to contact the conductive contact. According to this configuration, since a conductive path is formed on the glass substrate, it can be used when a plurality of conductive paths are provided. Narrow pitch. For forming thin films such as TAB, it is not easy to be affected by thermal expansion due to temperature difference, which can improve precision. In addition, the IC chip for signal generation during inspection is implemented by C 0 G mounting technology. Between the above mentioned conduction paths, while checking When the IC chip is mounted, since the IC chip can be directly mounted on the wiring substrate, space can be saved, and at the same time, the pad on the glass is less likely to break than the pad with TAB tape, so the conduction can be stabilized. The best form) FIG. 1 is an overall perspective view showing a conductive contact unit for multi-point simultaneous inspection applicable to the present invention. The conductive contact unit in the figure is suitable for inspection of a liquid crystal panel 2 and is used for The liquid crystal panel 2 and an external circuit (not shown) are used to electrically connect the two. The unit body 3 is formed of a multi-layer laminated board. The unit body 3 is arranged side by side through each board. A plurality of holding holes formed in the thickness direction, and a pair of conductive needle-shaped bodies 4 a, 4 b that appear and go up and down in the unit body 3 are coaxially accommodated in each holding hole, and the needle-shaped body is elastically elastically pressed against the needle-shaped bodies. Compression coil spring (not shown). {Please read the precautions on the back before transcripting this page> This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -5- 45298 A7 B7 V. Description of the invention (3) The conductive contact unit has a wiring substrate 5 superposed on the upper surface of the figure. The wiring substrate 5 is formed by forming a wiring pattern on a glass substrate. An external connection F PC (flexible printed circuit wiring board) 6 is connected to the wiring board 5 as an external circuit connection wiring member connected to an external circuit (not shown). As shown in the second diagram of the lower diagram of the first diagram of the wiring substrate 5 when viewed from the front, a plurality of conduction paths 7, 8 arranged side by side are formed, and these conduction paths 7 are formed at the same time. IC chips 9 are mounted between 8. Installing the IC chip 9 in this way is ideal for the same IC chip as the IC chip mounted on the finished LCD panel. In order to perform the inspection before the IC chip of the LCD panel 2 is mounted by the same signal according to the IC chip . At the end in the extending direction of the conductive path 7 extending upward in the figure of the IC chip 9, the conductive needle-like bodies 4a protruding above the first figure can be in contact with each other. Each contact pad 7a is formed in each The corresponding position. The extension direction end portion of the conduction path 8 extending below the figure of the IC chip 9. An end portion of the wiring pattern to which the above-mentioned external connection F P C 6 is connected is formed. A connection pad for easily connecting a wiring pattern can also be formed at this end portion. The above-mentioned IC chip 9 is ideally mounted with C 0 G mounting technology. As such, since a wiring pattern (conduction paths 7, 8) is formed on the wiring substrate 5 formed of a glass substrate, the conduction path 7 can be The pitch in the side-by-side direction should be as narrow as possible. Therefore, for those who form a wiring pattern on a conventional TAB film, the pitch can be made narrower, and the paper size can be fully adapted to the Chinese National Standard (CNS) A4 (210 X 297 mm) A _ lllllllllllll IIIII 1 I illlllf (Please read the notes on the back before filling this page)
45298 S A7 B7 五、發明說明（4) t 奢 t ri L· 對應於例如使用於被高精細化之液晶面板之檢査的情形。 又由於玻璃上之墊者比TAB帶之墊不容易破損，故可得 到導通之安定化。 在上述圖示例中，表示在導通路徑7，8之間實裝 I C晶片9之一例子，惟依照本發明，由於藉C ◦ G實裝 技術可實裝I C晶片等，因此可增大實裝圖案之變化。又 ，欲實裝I C晶片時，由於進行直接實裝，因此可提高省 空間化。 在本發明中，並不一定實裝I c晶片等，如第3圖及 第4圖所示地配線基板5僅形成配線圖案者也可以。在表 示於第3圖者*在配線基板5之面，以互相並排配設之狀 態地形成有複數條導通路徑1 1 ，藉將各間距形成較大， 可儘量擴大各接點用墊1 1 a之寬度。由此，由於可增大 導電性針狀體4 a之接觸位置精度之容許値，因此可得到 安定之導通。 在表示於第4圖者，對應於液晶面板2側之各墊之間 距（各導電性針狀體4 a之間距）較窄》且外部連接用 F P C 6側之各配線間距較廣之情形，在途中變化各導通 路徑1 2之間距來形成配線圖案者。如此在進行導通路徑 1 2之間距變更時，由於在玻璃基板形成配線圖案，因此 可高精度地加工，而可適當地對應。又，與上述各圖示例 同樣地形成有接點用墊1 2 a。 依照本發明，由於配線基板係玻璃基板所形成，配線 圖案幾乎不會受到依使用氣氛之溫度變化等所產生的配線 (請先Η讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 4 52 98 S ΚΙ ____B7五、發明說明（5 ) 基板之伸縮變化的影響，因此，可維持配線圖案之高精度 形成狀態=對於在銅使用焊錫或鍍錫之T A B係在細密化 上有界限，若設置專用墊則有與鄰接墊成爲短路之虞，而 依照可高精細化之本發明構造，則可設置比配線圖案更寬 廣之專用墊，可增加接點之接觸可能範圍，並可提高接觸 可靠性。因此，可將配線圖案之配線寬儘量變細，同時可 形成高精度之配線圖案，並可增大生產線佈置之設計寬度 ，可適用於各種檢查對象。 (產業上之利用可能性） 如此依照本發明，由於在玻璃基板以窄間距可形成複 數導通路徑，因此對於形成在TAB等之薄膜之情形不容 易受到因溫度差所產生之熱脹之影響，可維持導通路徑之 高精細化，可較理想地對應於檢査對象之高精細化，同時 由於可自由地設計導通路徑之形狀，因此可形成各種配線 圖案，並可對應於各種檢查對象。又由於藉C O G實裝技 術可將I C晶片直接實裝於配線基板，因此可成爲省空間 化。又，由於在TAB之場合在薄膜〔聚醯亞胺）進行銅 及焊錫或鍍錫，因此，柔軟或基材之剛性或平面度變差， 與接點之接觸不安定，而在本發明，由於在玻璃基板以鋁 形成圖案，因此平面度也優異，接觸成爲安定化，同時減 少接點之凹陷，而配線圖案也不容易損傷，故可提高耐久 性。 --— If· ! I 訂·-----I I (锖先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中圉國家標準（CNS)A4規格（210 X 297公釐） -8 - A7 B7 五'發明說明（6) (圖式之簡單說明） 第1圖係表示本發明所適用之多點同時檢查用導電性 接點單元的整體斜視圖。 第2圖係表示本發明所適用之配線基板之配線圖案的 正面圖。 第3圖係表示第二實施形態之對應於第2圖的圖式。 第4圖係表示第三實施形態之對應於第2圖的圖式。 (記號之說明） 1 :導電性接點單元 2:液晶面板 3 :單元本體 4 a ’ 4 b :導電性針狀體 5 .配線基板 6:外部連接用FPC 7，8 :導通路徑 7 a :接點用墊 9 : I C晶片 1 1 :導通路徑 1 1 a ·接點用楚 1 2 :導通路徑 1 2 a :接點用墊 丨！丨1·1丨裝！|訂· — (請先閲讀背面之注意事項再填寫本頁) L· 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） -9-45298 S A7 B7 V. Description of the invention (4) t luxury t ri L · Corresponds to the case of, for example, inspection used for high-definition liquid crystal panels. In addition, since the pad on the glass is less likely to break than the pad on the TAB tape, the stability of the conduction can be obtained. In the above-mentioned example, an example is shown in which the IC chip 9 is mounted between the conduction paths 7 and 8. However, according to the present invention, since the IC chip and the like can be mounted by using the C ◦ G mounting technology, the actual size can be increased. Changes in the pattern. In addition, when IC chips are to be mounted, direct mounting can be performed, thereby saving space. In the present invention, it is not necessary to mount an IC chip or the like. As shown in Figs. 3 and 4, the wiring substrate 5 may be formed with only a wiring pattern. As shown in FIG. 3, a plurality of conducting paths 1 1 are formed on the surface of the wiring substrate 5 in a state of being arranged side by side. By forming each pitch to be larger, each contact pad 1 1 can be enlarged as much as possible. the width of a. Accordingly, the allowable tolerance of the accuracy of the contact position of the conductive needle-like body 4a can be increased, and stable conduction can be obtained. In the case shown in FIG. 4, corresponding to the case where the distance between the pads on the liquid crystal panel 2 side (the distance between the conductive needle-like bodies 4a) is narrow, and the distance between the wirings on the FPC 6 side for external connection is wide, Those who change the pitch of each of the conductive paths 12 on the way to form a wiring pattern. When the pitch of the conduction paths 12 is changed as described above, since the wiring pattern is formed on the glass substrate, it can be processed with high accuracy, and it can respond appropriately. The contact pads 1 2 a are formed in the same manner as in the above-mentioned examples. According to the present invention, since the wiring substrate is formed of a glass substrate, the wiring pattern is hardly subjected to wiring caused by temperature changes in the use atmosphere (please read the precautions on the back before filling this page) This paper size is applicable to the country of China Standard (CNS) A4 specification (210 X 297 mm) 4 52 98 S KI ____B7 V. Description of the invention (5) The influence of the expansion and contraction of the substrate, so that the high-precision formation state of the wiring pattern can be maintained = for the use of solder on copper Or the tinned TAB system has a limit in miniaturization. If a dedicated pad is provided, it may short-circuit with the adjacent pad. According to the structure of the present invention that can be highly refined, a dedicated pad wider than the wiring pattern can be provided. Can increase the contact range of contacts, and improve contact reliability. Therefore, the wiring width of the wiring pattern can be made as thin as possible, at the same time, a high-precision wiring pattern can be formed, and the design width of the production line layout can be increased, which can be applied to various inspection objects. (Industrial Applicability) According to the present invention, since a plurality of conductive paths can be formed at a narrow pitch on a glass substrate, it is not easy to be affected by thermal expansion due to a temperature difference in the case of a thin film formed on a TAB or the like. It can maintain the high definition of the conduction path and can ideally correspond to the high definition of the inspection object. At the same time, since the shape of the conduction path can be freely designed, various wiring patterns can be formed and can correspond to various inspection objects. In addition, since the IC chip can be directly mounted on the wiring substrate by the COG mounting technology, it can save space. In addition, in the case of TAB, copper and solder or tin plating are performed on the film (polyimide), so the flexibility or the rigidity or flatness of the substrate is deteriorated, and the contact with the contact is unstable. In the present invention, Since the pattern is formed on the glass substrate with aluminum, the flatness is also excellent, the contact becomes stable, and the depression of the contacts is reduced, and the wiring pattern is not easy to be damaged, so the durability can be improved. --- If ·! I Order · ----- II (锖 Please read the notes on the back before filling in this page) This paper size is applicable to China 圉 National Standard (CNS) A4 (210 X 297 mm) -8 -A7 B7 Five 'Invention Description (6) (Simplified Description of Drawings) Figure 1 is an overall perspective view showing a multi-point simultaneous inspection conductive contact unit to which the present invention is applied. Fig. 2 is a front view showing a wiring pattern of a wiring substrate to which the present invention is applied. Fig. 3 is a drawing corresponding to Fig. 2 showing the second embodiment. Fig. 4 is a drawing corresponding to Fig. 2 showing a third embodiment. (Description of symbols) 1: conductive contact unit 2: liquid crystal panel 3: unit body 4 a '4 b: conductive needle-like body 5. wiring board 6: FPC for external connection 7, 8: conduction path 7 a: Contact pad 9: IC chip 1 1: Conduction path 1 1 a · Contact pad 1 2: Conduction path 1 2 a: Contact pad 丨!丨 1 · 1 丨 install! | Order · (Please read the notes on the back before filling in this page) L · This paper size is applicable to China National Standard (CNS) A4 (210 x 297 mm) -9-