TWI820140B - 黏著帶 - Google Patents

黏著帶 Download PDF

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Publication number
TWI820140B
TWI820140B TW108118534A TW108118534A TWI820140B TW I820140 B TWI820140 B TW I820140B TW 108118534 A TW108118534 A TW 108118534A TW 108118534 A TW108118534 A TW 108118534A TW I820140 B TWI820140 B TW I820140B
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive tape
weight
adhesive layer
graft copolymer
Prior art date
Application number
TW108118534A
Other languages
English (en)
Chinese (zh)
Other versions
TW202016249A (zh
Inventor
緒方雄大
戶田智基
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202016249A publication Critical patent/TW202016249A/zh
Application granted granted Critical
Publication of TWI820140B publication Critical patent/TWI820140B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10Block or graft copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Organic Insulating Materials (AREA)
TW108118534A 2018-06-06 2019-05-29 黏著帶 TWI820140B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2018-108742 2018-06-06
JP2018108742 2018-06-06

Publications (2)

Publication Number Publication Date
TW202016249A TW202016249A (zh) 2020-05-01
TWI820140B true TWI820140B (zh) 2023-11-01

Family

ID=68770760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108118534A TWI820140B (zh) 2018-06-06 2019-05-29 黏著帶

Country Status (5)

Country Link
JP (2) JP7334117B2 (ja)
KR (1) KR102590639B1 (ja)
CN (1) CN112218926A (ja)
TW (1) TWI820140B (ja)
WO (1) WO2019235287A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020110489A1 (ja) * 2018-11-30 2020-06-04 日東電工株式会社 粘着シート
CN113260689B (zh) * 2019-03-08 2024-06-07 积水化学工业株式会社 粘合剂组合物及粘合带
JP6856799B1 (ja) * 2019-12-06 2021-04-14 積水化学工業株式会社 シリコーン系グラフト共重合体、粘着剤組成物及び粘着テープ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201411739A (zh) * 2012-08-10 2014-03-16 Sekisui Chemical Co Ltd 晶圓之處理方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582875B2 (ja) * 1988-11-01 1997-02-19 日東電工株式会社 再剥離型粘着剤
JP2601956B2 (ja) 1991-07-31 1997-04-23 リンテック株式会社 再剥離型粘着性ポリマー
JPH11158453A (ja) * 1997-11-27 1999-06-15 Sekisui Chem Co Ltd アクリル系粘着剤組成物及び粘着加工製品
JP4687576B2 (ja) 2006-02-28 2011-05-25 日立化成工業株式会社 回路接続用フィルム状接着剤
JP2010132755A (ja) * 2008-12-03 2010-06-17 Nippon Shokubai Co Ltd 電離放射線硬化性再剥離粘着剤組成物
JP5950869B2 (ja) 2013-06-20 2016-07-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP6323000B2 (ja) * 2013-12-26 2018-05-16 日立化成株式会社 仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート
JP6564325B2 (ja) * 2014-02-07 2019-08-21 積水化学工業株式会社 ウエハの処理方法
KR101687062B1 (ko) * 2014-03-05 2016-12-15 제일모직주식회사 점착필름 및 이를 포함하는 광학표시장치
JP2015214636A (ja) * 2014-05-09 2015-12-03 ニッタ株式会社 粘着剤組成物
SG11201704005XA (en) * 2015-01-14 2017-07-28 Lintec Corp Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method
JP6200611B1 (ja) * 2016-03-17 2017-09-20 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、半導体ウェハ加工用粘着テープの製造方法および半導体ウェハの加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201411739A (zh) * 2012-08-10 2014-03-16 Sekisui Chemical Co Ltd 晶圓之處理方法

Also Published As

Publication number Publication date
JP7334117B2 (ja) 2023-08-28
WO2019235287A1 (ja) 2019-12-12
CN112218926A (zh) 2021-01-12
TW202016249A (zh) 2020-05-01
JPWO2019235287A1 (ja) 2021-05-06
JP2023155293A (ja) 2023-10-20
KR102590639B1 (ko) 2023-10-17
KR20210016506A (ko) 2021-02-16

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