TWI722179B - 陶瓷電路基板及其製造方法 - Google Patents
陶瓷電路基板及其製造方法 Download PDFInfo
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- TWI722179B TWI722179B TW106114162A TW106114162A TWI722179B TW I722179 B TWI722179 B TW I722179B TW 106114162 A TW106114162 A TW 106114162A TW 106114162 A TW106114162 A TW 106114162A TW I722179 B TWI722179 B TW I722179B
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Abstract
本發明之課題係得到一種電力模組用陶瓷電路基板,其係不使生產性降低、不使因絕緣樹脂位置偏離而導致部分放電特性惡化及絕緣特性降低之情況發生,塗佈有:防止焊料流動、晶片偏離的絕緣樹脂,以及防止部分放電、絕緣性降低的絕緣樹脂。藉由對於陶瓷電路基板,將防止焊料流動、晶片偏離的絕緣樹脂以及防止部分放電、絕緣性降低的絕緣樹脂,分別塗佈在金屬電路之主面上以及金屬電路之外周部或金屬電路間,以得到電力模組用陶瓷電路基板。
Description
本發明關於尤其適用於電力半導體模組等的陶瓷電路基板、及其製造方法。
考量熱傳導率、成本、安全性等觀點,已有人利用氧化鋁、氧化鈹、氮化矽、氮化鋁等的陶瓷基板作為利用於電力模組等的電路用基板。該等陶瓷基板藉由接合銅、鋁等金屬電路、散熱板,從而作為電路基板使用。穩定得到對於以樹脂基板、樹脂層作為絕緣材的金屬基板的高絕緣性係為該等陶瓷基板之特點。
以往,於半導體搭載用陶瓷基板之主面以接合焊材接合具導電性的金屬電路並進一步於金屬電路之既定位置搭載半導體元件而得之陶瓷電路基板已用於電梯、車輛、油電混合車等的電力模組用途。近年,電路基板朝向小型化、電力模組朝向高輸出化發展中,對於陶瓷基板材料除了要求散熱特性,亦要求高的電絕緣性,熱傳導性與絕緣特性優異的氮化鋁基板、氮化矽基板等受到關注。
上述陶瓷電路基板係利用焊料接合作為半導體晶片之Si晶片、SiC晶片而使用,但為了防止焊接時焊料本身之流動、晶片之位置偏離,會在金屬電路之主面塗佈作為阻焊劑之絕緣樹脂(專利文獻1)。
又,尤其在電氣化鐵路等的車輛用途係在高電壓下使用陶瓷電路基板,為了防止來自電路端部、接合部之部分放電、防止因遷移所致之絕緣性劣化,會塗佈絕緣樹脂(專利文獻2)。
但是,防止焊料流動的阻焊劑,一般多以網版印刷法塗佈在金屬電路之主面,並作為陶瓷電路基板之阻劑印刷步驟之一部分實施。又防止部分放電、遷移的絕緣樹脂之塗佈,一般係在將半導體元件安裝於電路基板上的步驟中利用點膠機(dispenser)進行塗佈。為了塗佈該等絕緣樹脂,需要個別不同的步驟,而出現了生產性降低及因絕緣樹脂位置偏離所致之部分放電特性降低及絕緣特性劣化之問題。 [專利文獻]
[專利文獻1] 日本特開平10-70212號公報 [專利文獻2] 日本特開2002-76190號公報
本發明之目的係:鑑於上述課題,提供一種陶瓷電路基板,其不使生產性降低、不使因絕緣樹脂位置偏離而導致部分放電特性惡化、絕緣特性降低之情況發生,塗佈有:防止焊料流動、晶片偏離的絕緣樹脂,以及防止部分放電、絕緣性降低的絕緣樹脂。並提供其製造方法。
解決上述課題的本發明由下列構成。 (1) 一種電力模組用陶瓷電路基板,係金屬電路與陶瓷基板接合而成的陶瓷電路基板,其特徵為:在金屬電路之主面上,以及在金屬電路之外周部及/或金屬電路間塗佈有絕緣樹脂。 (2) 如(1)之電力模組用陶瓷電路基板,其中,該陶瓷基板為氮化鋁、氮化矽或氧化鋁基板,該金屬電路由選自銅及鋁中之1種以上之金屬構成,且該絕緣樹脂使用含有選自環氧樹脂、聚醯亞胺樹脂、丙烯酸樹脂及聚矽氧樹脂中之1種以上的樹脂。 (3) 一種電力模組用陶瓷電路基板之製造方法,係製造如(1)或(2)之電力模組用陶瓷電路基板之方法,其特徵為:將絕緣樹脂同時地塗佈在金屬電路之主面上以及金屬電路之外周部及/或金屬電路間。 (4) 如(3)之電力模組用陶瓷電路基板之製造方法,其中,該絕緣樹脂之塗佈方法係噴墨印刷法或移印法(tampo printing)。
以下,說明電力模組用陶瓷電路基板之各種實施形態,其次說明陶瓷電路基板之製造方法,但已針對一實施形態記載的特定說明對其他實施形態也適用時,則於其他實施形態省略該說明。
[電力模組用陶瓷電路基板] 本發明之第一實施形態之電力模組用陶瓷電路基板,係用於電力模組之陶瓷電路基板,係金屬電路與陶瓷基板接合而成,其特徵為:在金屬電路之主面上,以及在金屬電路之外周部及/或金屬電路間塗佈有絕緣樹脂。 塗佈絕緣樹脂的金屬電路之外周部及/或金屬電路間,包含將金屬電路與陶瓷基板予以接合的焊材部分或經焊材接合的陶瓷基板主面、金屬電路主面之外周端部。
(金屬電路) 就金屬電路之材料而言,考量導電性及熱傳導率之觀點,可使用銅、鋁、銀、金等,但考量價格面及之後的電路形成等的觀點,會使用銅或鋁。本實施形態之金屬電路,可使用由銅或鋁、或銅及鋁之2層包覆材構成的金屬。 本實施形態之金屬電路之板厚不特別限定,0.10~1.5mm為較佳。藉由使板厚為0.10mm以上,作為電力模組用之電路基板使用時,可確保充分的導電性,金屬電路部分之發熱等問題受到抑制;藉由使板厚為1.5mm以下,金屬電路本身之熱阻(thermal resistance)增大,電路基板之散熱特性降低之情形受到抑制。
(陶瓷基板) 本實施形態中,陶瓷基板不特別限定,可使用氮化矽、氮化鋁等氮化物系陶瓷、氧化鋁、氧化鋯等氧化物系陶瓷、碳化矽等碳化物系陶瓷、硼化鑭等硼化物系陶瓷等。用於電力模組時,氮化鋁、氮化矽等非氧化物系陶瓷或氧化鋁等氧化物型陶瓷為較佳。 陶瓷基板之厚度不特別限定,若為0.2mm以上可得到耐久性,若為1.5mm以下可抑制熱阻增大,因此0.2~1.5mm為較佳。
(絕緣樹脂) 本實施形態之絕緣樹脂只要為具有絕緣性的樹脂即可,不特別限定,也可為以選自環氧樹脂、聚醯亞胺樹脂、丙烯酸樹脂、聚矽氧樹脂中的至少1種以上作為主成分的樹脂。 本實施形態中,以防止焊料流動、晶片偏離為目的之絕緣樹脂(第一絕緣樹脂)、與以防止部分放電、絕緣性降低為目的之絕緣樹脂(第二絕緣樹脂),分別塗佈在金屬電路之主面上以及金屬電路之外周部及/或金屬電路間。 又,第一絕緣樹脂與第二絕緣樹脂,可為以同一樹脂作為主成分者,也可為以不同的樹脂作為主成分者。 塗佈於陶瓷電路基板的絕緣樹脂之厚度並無特別限制,宜印刷成5~500μm之厚度。
[接合方法] 於陶瓷基板上接合金屬電路及金屬板之方法,有利用焊材的活性金屬法等或直接於陶瓷基板上配置金屬電路板、金屬板並在鈍性環境下加熱的直接接合法。例如,已知將銅板與陶瓷基板接合時,若將無氧銅板之表面經氧化處理而得者或精煉銅(tough-pitch copper)板配置在氧化鋁等氧化物系陶瓷基板上,並在鈍性氣體中加熱,則銅板與陶瓷基板會直接接合。本實施形態,不論哪種情況皆得到同樣的效果。 又,形成金屬電路板之既定電路圖案的方法,有在將金屬板接合後於該金屬板之表面形成電路形狀之抗蝕劑並利用蝕刻實施圖案化的方法、預先利用壓製或蝕刻形成電路形狀之金屬板後再接合於陶瓷基板的方法等。於形成圖案後,視需要也可對於金屬板實施鍍Ni或鍍Ni合金、鍍金、鍍銀、防銹處理。
[電力模組用陶瓷電路基板之製造方法] 本發明之一實施形態之電力模組用陶瓷電路基板之製造方法,其特徵為:於金屬電路與陶瓷基板接合而成的陶瓷電路基板,將絕緣樹脂同時地塗佈在金屬電路之主面上以及金屬電路之外周部或金屬電路間。在此所稱同時地塗佈,意指將朝向金屬電路之主面上之塗佈以及朝向金屬電路之外周部或金屬電路間之塗佈在一連串之步驟中連續地或同時地進行。
又,上述絕緣樹脂之塗佈方法可為使用噴墨印刷法或移印法的印刷。尤其噴墨印刷法,係除了印墨以外非接觸於電路基板的直接圖案化法,藉由輸入印刷數據,於高度不同的印刷面也能以良好位置精度、有效率地進行印刷。又在印刷寬度窄的金屬電路之外周部、金屬電路間、或在陶瓷基板與金屬電路主面之間的高低差部分也能理想地進行印刷。若使用移印法,在印刷寬度窄的金屬電路之外周部、金屬電路間、或在陶瓷基板與金屬電路主面之間的高低差部分也能理想地進行印刷。
[印刷精度] 本實施形態之陶瓷電路基板之製造方法中,將絕緣樹脂以偏離量為0.4mm以下,較佳為0.25mm以下,更佳為0.2mm以下之印刷精度塗佈於陶瓷電路基板。
[部分放電特性] 本實施形態之陶瓷電路基板之部分放電電荷量為1.0pC以下,較佳為0.7pC以下,更佳為0.5pC以下。 [實施例]
以下,舉實施例及比較例更具體地說明本發明,本發明不受實施例等之內容限定。
[實施例1] 於55mm×48mm×1.0mmt之氮化鋁基板之一主面,利用0.3mmt之銅板以圖1所示之圖案成為30mm×44mm與20.5mm×44mm之圖案且圖案間距離為0.50mm之方式配置金屬電路。於另一主面則接合52mm×45mm×0.3mmt銅板(散熱板)而製作成陶瓷電路基板。對於該陶瓷電路基板,利用噴墨印刷法(裝置名 日本文化精工製噴墨印刷機(印刷頭:Ricoh製GEN5))將以環氧樹脂作為主成分的樹脂(太陽油墨製造(股)製IJSR-4000)以圖2所示之圖案在距電路外周部為內側3.00mm之位置以寬度3.00mm塗佈於金屬電路主面上,同時以寬度1.00mm塗佈於電路部之外周部,且同時以寬度0.50mm塗佈於金屬電路間,而得到圖2所示之陶瓷電路基板。
[實施例2] 使用將0.2mmt之銅板與0.2mmt之鋁板予以擴散接合而得之2層包覆材(鋁板側接合於氮化鋁基板)替代銅板,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例3] 使用以聚醯亞胺樹脂作為主成分的樹脂(JNC(股)製LIXON COAT)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例4] 使用以丙烯酸樹脂作為主成分的樹脂(互應化學工業(股)製PER400)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例5] 使用0.4mmt之鋁板替代0.3mmt之銅板,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例6] 使用以聚醯亞胺樹脂作為主成分的樹脂(JNC(股)製LIXON COAT)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例5同樣方式得到圖2所示之陶瓷電路基板。
[實施例7] 使用以丙烯酸樹脂作為主成分的樹脂(互應化學工業(股)製PER400)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例5同樣方式得到圖2所示之陶瓷電路基板。
[實施例8] 使用以聚矽氧樹脂作為主成分的樹脂(東麗道康寧(股)製WL-5351)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例5同樣方式得到圖2所示之陶瓷電路基板。
[實施例9] 使用厚度0.635mm之氮化矽基板替代氮化鋁基板,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例10] 使用聚醯亞胺樹脂(JNC(股)製LIXON COAT)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例9同樣方式得到圖2所示之陶瓷電路基板。
[實施例11] 使用以丙烯酸樹脂作為主成分的樹脂(互應化學工業(股)製PER400)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例9同樣方式得到圖2所示之陶瓷電路基板。
[實施例12] 使用0.4mmt之鋁板替代0.3mmt之銅板,除此以外,以與實施例9同樣方式得到圖2所示之陶瓷電路基板。
[實施例13] 使用以聚醯亞胺樹脂作為主成分的樹脂(JNC(股)製LIXON COAT)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例12同樣方式得到圖2所示之陶瓷電路基板。
[實施例14] 使用0.635mmt之氧化鋁基板替代氮化鋁基板,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例15] 不用噴墨印刷法而改用移印法將以環氧樹脂作為主成分的樹脂(太陽油墨製造(股)製UVR-150G)同時地塗佈在電路面上以及電路部之外周部及金屬電路間,除此以外,以與實施例1同樣方式得到圖2所示之陶瓷電路基板。
[實施例16] 使用以聚矽氧樹脂作為主成分的樹脂(東麗道康寧(股)製WL-5351)替代以環氧樹脂作為主成分的樹脂,除此以外,以與實施例15同樣方式得到圖2所示之陶瓷電路基板。
[比較例1] 以不對於與實施例1同樣方式製作而得之陶瓷電路基板塗佈絕緣樹脂之狀態使用。
[比較例2] 以不對於與實施例5同樣方式製作而得之陶瓷電路基板塗佈絕緣樹脂的狀態使用。
[比較例3] 以不對於與實施例9同樣方式製作而得之陶瓷電路基板塗佈絕緣樹脂的狀態使用。
[比較例4] 以不對於與實施例14同樣方式製作而得之陶瓷電路基板塗佈絕緣樹脂的狀態使用。
[比較例5] 對於實施例1中記載的配置有金屬電路與散熱板的陶瓷電路基板,與習知步驟同樣,實施在金屬電路之主面塗佈絕緣樹脂的步驟後,先拆下並再度設定後,另分成在電路部之外周部及金屬電路間塗佈絕緣樹脂之步驟,將以環氧樹脂作為主成分的樹脂(太陽油墨製造製IJSR-4000)以噴墨印刷法個別塗佈,而得到圖2所示之陶瓷電路基板。
[比較例6] 使用以聚醯亞胺樹脂作為主成分的樹脂(JNC(股)製LIXON COAT)替代以環氧樹脂作為主成分的樹脂,除此以外,以與比較例5同樣方式得到圖2所示之陶瓷電路基板。
[比較例7] 使用以丙烯酸樹脂作為主成分的樹脂(互應化學工業(股)製PER400)替代以環氧樹脂作為主成分的樹脂,除此以外,以與比較例5同樣方式得到圖2所示之陶瓷電路基板。
[比較例8] 使用以聚矽氧樹脂作為主成分的樹脂(東麗道康寧(股)製WL-5351)替代以環氧樹脂作為主成分的樹脂,除此以外,以與比較例5同樣方式得到圖2所示之陶瓷電路基板。
以下列方法對於在實施例1~16及比較例1~8製作而得之陶瓷電路基板的部分放電特性及絕緣特性進行評價。將該等結果示於表1。
<印刷精度> 對於得到的陶瓷電路基板30片,將偏離圖2所示之於B部的絕緣樹脂(阻焊劑)(3)及絕緣樹脂(防止絕緣劣化、放電)(4)間之既定距離3.00mm之偏離量以光學顯微鏡(倍率30倍)進行測定,並定義為印刷精度(偏離量)。
<部分放電特性之評價> 將得到的陶瓷電路基板於絕緣油中以升壓速度0.3kV/s升壓到10kV,然後以0.5kV/s之速度降壓到8kV,並在8kV維持10秒鐘,將此時之部分放電電荷量以Mess-&Prufsysteme GmbH公司製部分放電測定機(TTP15)測定。
<絕緣特性之評價> 對於陶瓷電路基板30片於85℃、93%Rh邊以電壓1.0kV施加電壓500小時邊測定絕緣電阻,將絕緣電阻値為1×106
Ω以下的基板之片數評為絕緣劣化基板。
由以上,本實施例之陶瓷基板,由於在金屬電路主面塗佈有絕緣樹脂,故可防止焊料流動、晶片偏離,並且在金屬電路之外周部或金屬電路間塗佈有絕緣樹脂,而防止了電壓施加時的部分放電起始電壓降低、因焊材成分之遷移所致之絕緣電阻降低。又,藉由將絕緣樹脂同時地印刷,不會使生產性降低,印刷精度變得良好,並改善了部分放電特性及絕緣性。 [產業利用性]
依本發明,藉由對於將金屬電路與陶瓷基板接合而得之電路基板,塗佈防止焊料流動、晶片偏離的絕緣樹脂以及在金屬電路之外周部或金屬電路間塗佈防止部分放電、絕緣性降低的絕緣樹脂,可得到防止了電壓施加時的部分放電起始電壓降低、因焊材成分之遷移所致之絕緣電阻降低的陶瓷電路基板。
1‧‧‧陶瓷基板2‧‧‧金屬電路3‧‧‧絕緣樹脂(阻焊劑)4‧‧‧絕緣樹脂(防止絕緣劣化、放電)
圖1係顯示實施例中使用的陶瓷電路基板之金屬電路圖案形狀的說明圖。 圖2係顯示已對於圖1所示的金屬電路塗佈絕緣樹脂3(阻焊劑目的)與絕緣樹脂4(防止部分放電及絕緣性降低之目的)之狀態的說明圖。 圖3係沿圖2之A-A方向的剖面圖。
1‧‧‧陶瓷基板
2‧‧‧金屬電路
3‧‧‧絕緣樹脂(阻焊劑)
4‧‧‧絕緣樹脂(防止絕緣劣化、放電)
Claims (4)
- 一種電力模組用陶瓷電路基板,包含:金屬電路、陶瓷基板、含有第一絕緣樹脂之堰部、及含有第二絕緣樹脂之絕緣部,其特徵為:該金屬電路和該陶瓷基板接合,該堰部係在該金屬電路的主面上沿著該金屬電路的邊緣形成為帶狀,該絕緣部係形成於該金屬電路之外周部及/或該金屬電路間,該堰部與該絕緣部係以彼此不接觸的方式獨立設置。
- 如申請專利範圍第1項之電力模組用陶瓷電路基板,其中,該陶瓷基板為氮化鋁、氮化矽或氧化鋁基板,該金屬電路由選自銅及鋁中之1種以上之金屬構成,且該第一絕緣樹脂或第二絕緣樹脂使用含有選自環氧樹脂、聚醯亞胺樹脂、丙烯酸樹脂及聚矽氧樹脂中之1種以上的樹脂。
- 一種電力模組用陶瓷電路基板之製造方法,係製造如申請專利範圍第1或2項之電力模組用陶瓷電路基板之方法,其特徵為:將絕緣樹脂同時地塗佈在金屬電路之主面上以及金屬電路之外周部及/或金屬電路間。
- 如申請專利範圍第3項之電力模組用陶瓷電路基板之製造方法,其中,該絕緣樹脂之塗佈方法係噴墨印刷法或移印法(tampo printing)。
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