TWI718326B - 晶片間隔維持方法 - Google Patents

晶片間隔維持方法 Download PDF

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Publication number
TWI718326B
TWI718326B TW106126221A TW106126221A TWI718326B TW I718326 B TWI718326 B TW I718326B TW 106126221 A TW106126221 A TW 106126221A TW 106126221 A TW106126221 A TW 106126221A TW I718326 B TWI718326 B TW I718326B
Authority
TW
Taiwan
Prior art keywords
workpiece
sheet
expansion
wafers
gap
Prior art date
Application number
TW106126221A
Other languages
English (en)
Chinese (zh)
Other versions
TW201812882A (zh
Inventor
原田成規
趙金艷
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201812882A publication Critical patent/TW201812882A/zh
Application granted granted Critical
Publication of TWI718326B publication Critical patent/TWI718326B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106126221A 2016-09-09 2017-08-03 晶片間隔維持方法 TWI718326B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016176352A JP6741529B2 (ja) 2016-09-09 2016-09-09 チップ間隔維持方法
JP2016-176352 2016-09-09

Publications (2)

Publication Number Publication Date
TW201812882A TW201812882A (zh) 2018-04-01
TWI718326B true TWI718326B (zh) 2021-02-11

Family

ID=61569821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126221A TWI718326B (zh) 2016-09-09 2017-08-03 晶片間隔維持方法

Country Status (4)

Country Link
JP (1) JP6741529B2 (ko)
KR (1) KR102305385B1 (ko)
CN (1) CN107808847B (ko)
TW (1) TWI718326B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7154809B2 (ja) * 2018-04-20 2022-10-18 株式会社ディスコ ウエーハの加工方法
JP2020102569A (ja) * 2018-12-25 2020-07-02 東レエンジニアリング株式会社 保持テーブル
JP2022167030A (ja) 2021-04-22 2022-11-04 株式会社ディスコ チップ間隔形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005530A (ja) * 2005-06-23 2007-01-11 Lintec Corp チップ体の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6312800B1 (en) * 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
JP4471627B2 (ja) * 2003-11-06 2010-06-02 株式会社ディスコ ウエーハの分割方法
JP2006203133A (ja) * 2005-01-24 2006-08-03 Lintec Corp チップ体の製造方法、デバイスの製造方法およびチップ体固着用粘接着シート
JP5378780B2 (ja) 2008-12-19 2013-12-25 株式会社ディスコ テープ拡張方法およびテープ拡張装置
JP5313036B2 (ja) * 2009-05-11 2013-10-09 株式会社ディスコ 粘着テープの拡張方法
JP5536555B2 (ja) * 2010-06-22 2014-07-02 株式会社ディスコ 拡張テープ収縮装置
JP5013148B1 (ja) * 2011-02-16 2012-08-29 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP6249586B2 (ja) * 2011-08-31 2017-12-20 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP6298635B2 (ja) * 2014-01-10 2018-03-20 株式会社ディスコ 分割装置及び被加工物の分割方法
JP2015204362A (ja) * 2014-04-14 2015-11-16 株式会社ディスコ チップ間隔維持方法
JP6266429B2 (ja) * 2014-05-08 2018-01-24 株式会社ディスコ チップ間隔維持装置及びチップ間隔維持方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005530A (ja) * 2005-06-23 2007-01-11 Lintec Corp チップ体の製造方法

Also Published As

Publication number Publication date
JP6741529B2 (ja) 2020-08-19
TW201812882A (zh) 2018-04-01
KR102305385B1 (ko) 2021-09-24
CN107808847A (zh) 2018-03-16
JP2018041894A (ja) 2018-03-15
CN107808847B (zh) 2023-04-11
KR20180028932A (ko) 2018-03-19

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