TWI695465B - 扇出型半導體封裝 - Google Patents

扇出型半導體封裝 Download PDF

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Publication number
TWI695465B
TWI695465B TW107127573A TW107127573A TWI695465B TW I695465 B TWI695465 B TW I695465B TW 107127573 A TW107127573 A TW 107127573A TW 107127573 A TW107127573 A TW 107127573A TW I695465 B TWI695465 B TW I695465B
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TW
Taiwan
Prior art keywords
layer
fan
heat dissipation
semiconductor package
wiring layer
Prior art date
Application number
TW107127573A
Other languages
English (en)
Chinese (zh)
Other versions
TW201919167A (zh
Inventor
吳華燮
李斗煥
Original Assignee
南韓商三星電子股份有限公司
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Application filed by 南韓商三星電子股份有限公司 filed Critical 南韓商三星電子股份有限公司
Publication of TW201919167A publication Critical patent/TW201919167A/zh
Application granted granted Critical
Publication of TWI695465B publication Critical patent/TWI695465B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW107127573A 2017-11-08 2018-08-08 扇出型半導體封裝 TWI695465B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
??10-2017-0148216 2017-11-08
KR10-2017-0148216 2017-11-08
KR20170148216 2017-11-08
KR10-2018-0051254 2018-05-03
KR1020180051254A KR102185706B1 (ko) 2017-11-08 2018-05-03 팬-아웃 반도체 패키지
??10-2018-0051254 2018-05-03

Publications (2)

Publication Number Publication Date
TW201919167A TW201919167A (zh) 2019-05-16
TWI695465B true TWI695465B (zh) 2020-06-01

Family

ID=66671934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127573A TWI695465B (zh) 2017-11-08 2018-08-08 扇出型半導體封裝

Country Status (3)

Country Link
JP (1) JP2019087731A (ko)
KR (1) KR102185706B1 (ko)
TW (1) TWI695465B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102164794B1 (ko) * 2018-08-27 2020-10-13 삼성전자주식회사 팬-아웃 반도체 패키지
KR102584991B1 (ko) * 2019-06-14 2023-10-05 삼성전기주식회사 반도체 패키지
KR102574409B1 (ko) * 2019-07-01 2023-09-04 삼성전기주식회사 반도체 패키지
KR20210078891A (ko) * 2019-12-19 2021-06-29 삼성전자주식회사 반도체 소자 및 이를 구비한 반도체 패키지
KR20210078952A (ko) * 2019-12-19 2021-06-29 삼성전기주식회사 전자부품 내장기판
KR20210082969A (ko) 2019-12-26 2021-07-06 삼성전자주식회사 반도체 패키지
CN113395817B (zh) * 2020-03-13 2023-03-24 重庆达方电子有限公司 薄膜电路板

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2625398B2 (ja) * 1995-03-17 1997-07-02 日本電気株式会社 マルチチップ冷却装置
US6265765B1 (en) * 1994-07-07 2001-07-24 Tessera, Inc. Fan-out semiconductor chip assembly
US20090032933A1 (en) * 2007-07-31 2009-02-05 Tracht Neil T Redistributed chip packaging with thermal contact to device backside
US20090160071A1 (en) * 2007-12-20 2009-06-25 Geng-Shin Shen Die rearrangement package structure using layout process to form a compliant configuration
TWI352410B (en) * 2007-10-31 2011-11-11 Chipmos Technologies Inc Cdim package structure with pre-setting fan out st
TWI358808B (en) * 2008-03-20 2012-02-21 Chipmos Technologies Inc Chip package structure and the method thereof
TWI358804B (en) * 2007-11-30 2012-02-21 Chipmos Technologies Inc Multichip package structure and the forming method
US20140175633A1 (en) * 2012-08-14 2014-06-26 Bridge Semiconductor Corporation Thermally enhanced semiconductor assembly with embedded chip and interposer and method of manufacturing the same
CN103985695A (zh) * 2014-05-19 2014-08-13 中国科学院微电子研究所 一种扇出型封装结构及其制作工艺
CN105161466A (zh) * 2015-07-08 2015-12-16 华进半导体封装先导技术研发中心有限公司 高功率器件扇出型封装结构及生产工艺
JP2016025143A (ja) * 2014-07-17 2016-02-08 イビデン株式会社 回路基板及びその製造方法
US20170062357A1 (en) * 2015-03-19 2017-03-02 Intel Corporation Radio die package with backside conductive plate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016173A (ja) * 2000-06-30 2002-01-18 Mitsubishi Electric Corp 半導体装置
JP2006269594A (ja) * 2005-03-23 2006-10-05 Cmk Corp 半導体装置及びその製造方法
JP4929784B2 (ja) * 2006-03-27 2012-05-09 富士通株式会社 多層配線基板、半導体装置およびソルダレジスト
JP5165207B2 (ja) * 2006-03-29 2013-03-21 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
JP2008210912A (ja) * 2007-02-26 2008-09-11 Cmk Corp 半導体装置及びその製造方法
JP5184132B2 (ja) * 2008-02-15 2013-04-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5224845B2 (ja) * 2008-02-18 2013-07-03 新光電気工業株式会社 半導体装置の製造方法及び半導体装置
WO2010150297A1 (ja) * 2009-06-22 2010-12-29 三菱電機株式会社 半導体パッケージおよび当該半導体パッケージの実装構造
JP2011165741A (ja) * 2010-02-05 2011-08-25 Renesas Electronics Corp 半導体装置およびその製造方法
JP2011187473A (ja) * 2010-03-04 2011-09-22 Nec Corp 半導体素子内蔵配線基板
KR20140059514A (ko) * 2012-11-08 2014-05-16 한국전기연구원 투명 방열 코팅제 제조방법
KR20170121666A (ko) * 2016-04-25 2017-11-02 삼성전기주식회사 팬-아웃 반도체 패키지

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265765B1 (en) * 1994-07-07 2001-07-24 Tessera, Inc. Fan-out semiconductor chip assembly
JP2625398B2 (ja) * 1995-03-17 1997-07-02 日本電気株式会社 マルチチップ冷却装置
US20090032933A1 (en) * 2007-07-31 2009-02-05 Tracht Neil T Redistributed chip packaging with thermal contact to device backside
TWI352410B (en) * 2007-10-31 2011-11-11 Chipmos Technologies Inc Cdim package structure with pre-setting fan out st
TWI358804B (en) * 2007-11-30 2012-02-21 Chipmos Technologies Inc Multichip package structure and the forming method
US20090160071A1 (en) * 2007-12-20 2009-06-25 Geng-Shin Shen Die rearrangement package structure using layout process to form a compliant configuration
TWI358808B (en) * 2008-03-20 2012-02-21 Chipmos Technologies Inc Chip package structure and the method thereof
US20140175633A1 (en) * 2012-08-14 2014-06-26 Bridge Semiconductor Corporation Thermally enhanced semiconductor assembly with embedded chip and interposer and method of manufacturing the same
CN103985695A (zh) * 2014-05-19 2014-08-13 中国科学院微电子研究所 一种扇出型封装结构及其制作工艺
JP2016025143A (ja) * 2014-07-17 2016-02-08 イビデン株式会社 回路基板及びその製造方法
US20170062357A1 (en) * 2015-03-19 2017-03-02 Intel Corporation Radio die package with backside conductive plate
CN105161466A (zh) * 2015-07-08 2015-12-16 华进半导体封装先导技术研发中心有限公司 高功率器件扇出型封装结构及生产工艺

Also Published As

Publication number Publication date
JP2019087731A (ja) 2019-06-06
TW201919167A (zh) 2019-05-16
KR102185706B1 (ko) 2020-12-02
KR20190052598A (ko) 2019-05-16

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