TWI663021B - ***式墊窗 - Google Patents
***式墊窗 Download PDFInfo
- Publication number
- TWI663021B TWI663021B TW106137496A TW106137496A TWI663021B TW I663021 B TWI663021 B TW I663021B TW 106137496 A TW106137496 A TW 106137496A TW 106137496 A TW106137496 A TW 106137496A TW I663021 B TWI663021 B TW I663021B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- window
- polishing
- adhesive layer
- groove
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims abstract description 187
- 239000010410 layer Substances 0.000 claims abstract description 53
- 239000012790 adhesive layer Substances 0.000 claims abstract description 41
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 37
- 230000003287 optical effect Effects 0.000 claims description 18
- 239000013307 optical fiber Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 9
- 238000001228 spectrum Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 235000012773 waffles Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/778,760 | 2010-05-12 | ||
US12/778,760 US20110281510A1 (en) | 2010-05-12 | 2010-05-12 | Pad Window Insert |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201817541A TW201817541A (zh) | 2018-05-16 |
TWI663021B true TWI663021B (zh) | 2019-06-21 |
Family
ID=44912183
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106137496A TWI663021B (zh) | 2010-05-12 | 2011-04-28 | ***式墊窗 |
TW106129437A TWI663020B (zh) | 2010-05-12 | 2011-04-28 | ***式墊窗 |
TW100114926A TWI611866B (zh) | 2010-05-12 | 2011-04-28 | ***式墊窗 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106129437A TWI663020B (zh) | 2010-05-12 | 2011-04-28 | ***式墊窗 |
TW100114926A TWI611866B (zh) | 2010-05-12 | 2011-04-28 | ***式墊窗 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110281510A1 (ko) |
JP (1) | JP2013526420A (ko) |
KR (2) | KR101956848B1 (ko) |
CN (1) | CN102893377B (ko) |
TW (3) | TWI663021B (ko) |
WO (1) | WO2011142975A2 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
US8961266B2 (en) * | 2013-03-15 | 2015-02-24 | Applied Materials, Inc. | Polishing pad with secondary window seal |
US9308620B2 (en) * | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
US10012494B2 (en) * | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
SG11201608996TA (en) | 2014-05-02 | 2016-11-29 | 3M Innovative Properties Co | Interrupted structured abrasive article and methods of polishing a workpiece |
WO2017146735A1 (en) * | 2016-02-26 | 2017-08-31 | Applied Materials, Inc. | Window in thin polishing pad |
US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
JP6883475B2 (ja) * | 2017-06-06 | 2021-06-09 | 株式会社荏原製作所 | 研磨テーブル及びこれを備える研磨装置 |
JP7015667B2 (ja) * | 2017-10-02 | 2022-02-03 | 株式会社ディスコ | 研磨装置 |
JP2020001162A (ja) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法 |
US11571782B2 (en) * | 2018-11-28 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Single bodied platen housing a detection module for CMP systems |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030205325A1 (en) * | 2001-12-12 | 2003-11-06 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
TWI227254B (en) * | 2001-10-26 | 2005-02-01 | Jsr Corp | Window member for chemical mechanical polishing and polishing pad |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6451398B1 (en) * | 1998-11-24 | 2002-09-17 | Michael S. Sylvester | Double-sided self-adhesive reinforced foam tape |
US6235365B1 (en) * | 1998-12-18 | 2001-05-22 | W. R. Grace & Co.-Conn. | Waterproofing membrane having release sheet cutting system |
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US20040082271A1 (en) | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
JP2001009699A (ja) * | 1999-07-05 | 2001-01-16 | Nichiden Mach Ltd | 平面研磨装置 |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
KR100905266B1 (ko) * | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US6857941B2 (en) * | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
WO2002102547A1 (en) * | 2001-06-15 | 2002-12-27 | Rodel Holdings, Inc. | Polishing apparatus that provides a window |
JP2003163191A (ja) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | 機械化学的研磨装置用の研磨パッド |
JP2003188124A (ja) * | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | 研磨布 |
WO2003066282A2 (en) * | 2002-02-04 | 2003-08-14 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
US20040146682A1 (en) * | 2003-01-29 | 2004-07-29 | David Emmert | Decal form with sub-surface window |
TW200530378A (en) * | 2003-03-11 | 2005-09-16 | Toyo Tire & Rubber Co | Polishing pad and semiconductor device manufacturing method |
KR100771738B1 (ko) * | 2003-04-03 | 2007-10-30 | 히다치 가세고교 가부시끼가이샤 | 연마패드, 그 제조방법 및 그것을 이용한 연마방법 |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
JP4764825B2 (ja) * | 2003-10-31 | 2011-09-07 | アプライド マテリアルズ インコーポレイテッド | 研磨終点検知システム及び摩擦センサを使用する方法 |
WO2005104199A1 (ja) * | 2004-04-23 | 2005-11-03 | Jsr Corporation | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
WO2006062158A1 (ja) * | 2004-12-10 | 2006-06-15 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド及び研磨パッドの製造方法 |
WO2007024807A2 (en) * | 2005-08-22 | 2007-03-01 | Applied Materials, Inc. | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
US20070193126A1 (en) * | 2006-01-10 | 2007-08-23 | Mishko Teodorovich | Apparatus and method for door and window side flashing |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
US7815997B2 (en) * | 2006-12-29 | 2010-10-19 | 3M Innovative Properties Company | Window film assembly and method of installing |
WO2008154185A2 (en) | 2007-06-08 | 2008-12-18 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
KR20090055857A (ko) * | 2007-11-29 | 2009-06-03 | 주식회사 동부하이텍 | 화학 기계적 연마용 패드 |
US7839496B2 (en) * | 2008-04-24 | 2010-11-23 | Araca Incorporated | Confocal microscopy pad sample holder and method of hand using the same |
-
2010
- 2010-05-12 US US12/778,760 patent/US20110281510A1/en not_active Abandoned
-
2011
- 2011-04-27 JP JP2013510125A patent/JP2013526420A/ja not_active Withdrawn
- 2011-04-27 CN CN201180023970.8A patent/CN102893377B/zh active Active
- 2011-04-27 WO PCT/US2011/034215 patent/WO2011142975A2/en active Application Filing
- 2011-04-27 KR KR1020177020536A patent/KR101956848B1/ko active IP Right Grant
- 2011-04-27 KR KR1020127032411A patent/KR101762936B1/ko active IP Right Grant
- 2011-04-28 TW TW106137496A patent/TWI663021B/zh active
- 2011-04-28 TW TW106129437A patent/TWI663020B/zh active
- 2011-04-28 TW TW100114926A patent/TWI611866B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI227254B (en) * | 2001-10-26 | 2005-02-01 | Jsr Corp | Window member for chemical mechanical polishing and polishing pad |
US20030205325A1 (en) * | 2001-12-12 | 2003-11-06 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
Also Published As
Publication number | Publication date |
---|---|
KR101956848B1 (ko) | 2019-03-11 |
KR20170088444A (ko) | 2017-08-01 |
US20110281510A1 (en) | 2011-11-17 |
TW201742705A (zh) | 2017-12-16 |
WO2011142975A3 (en) | 2012-03-01 |
TWI611866B (zh) | 2018-01-21 |
CN102893377A (zh) | 2013-01-23 |
TW201217104A (en) | 2012-05-01 |
JP2013526420A (ja) | 2013-06-24 |
CN102893377B (zh) | 2016-08-10 |
WO2011142975A2 (en) | 2011-11-17 |
KR101762936B1 (ko) | 2017-07-28 |
KR20130103674A (ko) | 2013-09-24 |
TWI663020B (zh) | 2019-06-21 |
TW201817541A (zh) | 2018-05-16 |
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