JP4764825B2 - 研磨終点検知システム及び摩擦センサを使用する方法 - Google Patents
研磨終点検知システム及び摩擦センサを使用する方法 Download PDFInfo
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- JP4764825B2 JP4764825B2 JP2006538429A JP2006538429A JP4764825B2 JP 4764825 B2 JP4764825 B2 JP 4764825B2 JP 2006538429 A JP2006538429 A JP 2006538429A JP 2006538429 A JP2006538429 A JP 2006538429A JP 4764825 B2 JP4764825 B2 JP 4764825B2
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- substrate
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- polishing pad
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/02—Measuring coefficient of friction between materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
Claims (15)
- 研磨を受ける基板の摩擦係数をモニタする装置であって、
可動プラテンと、
研磨面を有し、かつ開口部をその中に有する、前記可動プラテンに接続された研磨パッドと、
前記研磨パッドの前記研磨面に対向して基板の露出面を保持するキャリアヘッドと、
前記開口部内に配置された可動部材であって、前記可動部材は前記基板の前記露出面に接触する上面を有し、前記可動部材が前記基板からの摩擦力に反応して前記研磨面に対して横方向に変位可能であり、前記上面が、前記研磨面と同一平面にあり、且つ、前記基板の前記露出面の表面積よりも小さい表面積を有する、可動部材と、
前記可動部材の横方向の変位に基づいて、前記基板の個別の領域の摩擦係数を示す信号を生成するセンサと、
を備える装置。 - 前記可動部材に結合され、前記可動部材を前記研磨面に対して横方向に中立位置に向けて付勢する復元要素をさらに備える、請求項1に記載の装置。
- 前記復元要素が板ばねを含む、請求項2に記載の装置。
- 前記可動部材の横方向の変位に基づいて信号を生成する前記センサが、前記板ばねに取り付けられたひずみゲージである、請求項3に記載の装置。
- 前記可動部材の横方向の変位に基づいて信号を生成する前記センサが光センサである、請求項1に記載の装置。
- 前記可動部材の横方向の変位に基づいて信号を生成する前記センサが圧電センサである、請求項1に記載の装置。
- 前記可動部材がギャップにより前記プラテンから隔離されており、
前記装置が、前記ギャップを通るスラリーの透過を防ぐ、前記可動部材に結合された柔軟なシーリング膜をさらに備える、請求項1に記載の装置。 - 前記可動部材に結合された復元要素をさらに備え、前記柔軟なシーリング膜が、前記復元要素と前記可動部材との間に挿入されている、請求項7に記載の装置。
- 前記可動部材が円形軌道を通り抜けるように前記プラテンが回転可能であり、
前記可動部材が、前記研磨面に対して前記円形軌道に接する方向に移動可能であり、前記円形軌道と直角な方向に移動可能でない、請求項1に記載の装置。 - 前記センサは、前記復元要素のひずみに基づいて信号を生成するように構成された、請求項2に記載の装置。
- 前記可動部材と前記研磨パッドとの間に及ぶシールをさらに備え、前記シールが、柔軟な、流体不透過性材料を含む、請求項1に記載の装置。
- 前記シールが、前記基板接触部材を通って延びている、請求項11に記載のシステム。
- 前記可動部材と前記研磨パッドの研磨層とが、前記基板接触部材を前記研磨パッドから機械的に分断する湾曲部によって接続されている、請求項1に記載のシステム。
- 前記可動部材に結合された接続部材であって、前記基板からの摩擦力に反応して、チャネルに沿って横方向に変位可能な接続部材をさらに備える、請求項1に記載の装置。
- 研磨工程中の基板の摩擦係数をモニタする方法であって、
基板をキャリアヘッドで保持して、前記基板の露出面を、研磨パッドの研磨面と接触させると共に、研磨パッドの開口部内に配置され且つ前記基板からの摩擦力に応じて研磨面に対して横方向に移動可能である部材の上面、ここで、当該上面は、前記研磨面と同一平面にあり、且つ、前記基板の前記露出面の表面積よりも小さい表面積を有する、と接触させて配置するステップと、
前記研磨パッドを移動するためにプラテンを移動するステップと、
可動部材の横方向変位に基づいて、前記可動部材に接する前記基板の個別の領域の摩擦係数を示す信号を生成するステップと、
を備える方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US51634903P | 2003-10-31 | 2003-10-31 | |
US60/516,349 | 2003-10-31 | ||
US59047104P | 2004-07-22 | 2004-07-22 | |
US60/590,471 | 2004-07-22 | ||
PCT/US2004/036412 WO2005043132A1 (en) | 2003-10-31 | 2004-10-28 | Polishing endpoint detection system and method using friction sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007510164A JP2007510164A (ja) | 2007-04-19 |
JP4764825B2 true JP4764825B2 (ja) | 2011-09-07 |
Family
ID=34556138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006538429A Expired - Fee Related JP4764825B2 (ja) | 2003-10-31 | 2004-10-28 | 研磨終点検知システム及び摩擦センサを使用する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7513818B2 (ja) |
JP (1) | JP4764825B2 (ja) |
KR (1) | KR101152747B1 (ja) |
TW (1) | TWI354599B (ja) |
WO (1) | WO2005043132A1 (ja) |
Cited By (1)
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TWI807048B (zh) * | 2018-06-22 | 2023-07-01 | 日商荏原製作所股份有限公司 | 渦電流檢測器的軌道的確認方法、基板的研磨進度的計算方法、基板研磨裝置的動作的停止方法、基板的研磨進度的均勻化方法、用於執行這些方法的程式、以及記錄有該程式的非暫態性的記錄介質 |
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2004
- 2004-10-28 KR KR1020067010761A patent/KR101152747B1/ko active IP Right Grant
- 2004-10-28 JP JP2006538429A patent/JP4764825B2/ja not_active Expired - Fee Related
- 2004-10-28 WO PCT/US2004/036412 patent/WO2005043132A1/en active Application Filing
- 2004-10-28 US US10/977,479 patent/US7513818B2/en not_active Expired - Fee Related
- 2004-10-29 TW TW093133104A patent/TWI354599B/zh active
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JPH07237937A (ja) * | 1994-02-25 | 1995-09-12 | Asahi Glass Co Ltd | 破損検出手段付き研磨装置 |
JPH10256209A (ja) * | 1997-03-17 | 1998-09-25 | Toshiba Corp | 研磨装置 |
JP2002529686A (ja) * | 1998-11-02 | 2002-09-10 | アプライド マテリアルズ インコーポレイテッド | 基板上メタル層の化学機械研磨における半径方向範囲の光モニタ |
JP2001001260A (ja) * | 1998-11-09 | 2001-01-09 | Tokyo Seimitsu Co Ltd | ウェーハ研磨装置 |
JP2003508904A (ja) * | 1999-08-31 | 2003-03-04 | マイクロン・テクノロジー・インコーポレーテッド | 化学的−機械的平坦化に使用される調整およびモニターのための装置および方法 |
JP2001129756A (ja) * | 1999-11-02 | 2001-05-15 | Mitsubishi Materials Corp | ウェーハ研磨装置及び研磨状態検出方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI807048B (zh) * | 2018-06-22 | 2023-07-01 | 日商荏原製作所股份有限公司 | 渦電流檢測器的軌道的確認方法、基板的研磨進度的計算方法、基板研磨裝置的動作的停止方法、基板的研磨進度的均勻化方法、用於執行這些方法的程式、以及記錄有該程式的非暫態性的記錄介質 |
Also Published As
Publication number | Publication date |
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US7513818B2 (en) | 2009-04-07 |
TWI354599B (en) | 2011-12-21 |
KR101152747B1 (ko) | 2012-06-18 |
KR20060108701A (ko) | 2006-10-18 |
WO2005043132A1 (en) | 2005-05-12 |
US20050136800A1 (en) | 2005-06-23 |
TW200518878A (en) | 2005-06-16 |
JP2007510164A (ja) | 2007-04-19 |
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