SG11201608996TA - Interrupted structured abrasive article and methods of polishing a workpiece - Google Patents

Interrupted structured abrasive article and methods of polishing a workpiece

Info

Publication number
SG11201608996TA
SG11201608996TA SG11201608996TA SG11201608996TA SG11201608996TA SG 11201608996T A SG11201608996T A SG 11201608996TA SG 11201608996T A SG11201608996T A SG 11201608996TA SG 11201608996T A SG11201608996T A SG 11201608996TA SG 11201608996T A SG11201608996T A SG 11201608996TA
Authority
SG
Singapore
Prior art keywords
polishing
workpiece
methods
abrasive article
structured abrasive
Prior art date
Application number
SG11201608996TA
Inventor
John J Gagliardi
Vincent D Romero
Eric C Coad
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201608996TA publication Critical patent/SG11201608996TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02—Wheels in one piece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201608996TA 2014-05-02 2015-04-22 Interrupted structured abrasive article and methods of polishing a workpiece SG11201608996TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461987728P 2014-05-02 2014-05-02
PCT/US2015/027105 WO2015167899A1 (en) 2014-05-02 2015-04-22 Interrupted structured abrasive article and methods of polishing a workpiece

Publications (1)

Publication Number Publication Date
SG11201608996TA true SG11201608996TA (en) 2016-11-29

Family

ID=54359170

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608996TA SG11201608996TA (en) 2014-05-02 2015-04-22 Interrupted structured abrasive article and methods of polishing a workpiece

Country Status (8)

Country Link
US (1) US10058970B2 (en)
EP (1) EP3137259A4 (en)
JP (1) JP6838811B2 (en)
KR (1) KR20160147917A (en)
CN (1) CN106376234B (en)
SG (1) SG11201608996TA (en)
TW (1) TW201546893A (en)
WO (1) WO2015167899A1 (en)

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WO2018017695A1 (en) 2016-07-20 2018-01-25 3M Innovative Properties Company Shaped vitrified abrasive agglomerate, abrasive articles, and method of abrading
US11478899B2 (en) 2016-10-25 2022-10-25 3M Innovative Properties Company Shaped vitrified abrasive agglomerate with shaped abrasive particles, abrasive articles, and related methods
CN106670991B (en) * 2016-11-28 2018-10-16 华侨大学 A kind of pattern preferred method of concretion abrasive phyllotaxy abrasive disk
CN108655946B (en) * 2017-03-31 2021-06-18 台湾积体电路制造股份有限公司 Polishing head and method for polishing backside of semiconductor wafer
EP3421180B1 (en) * 2017-06-30 2023-07-12 Guido Valentini Polishing pad of a hand-held power tool and power tool with such a polishing pad
CN112055737B (en) 2018-03-01 2022-04-12 3M创新有限公司 Shaped siliceous abrasive agglomerates with shaped abrasive particles, abrasive articles, and related methods
JP2021053753A (en) * 2019-09-30 2021-04-08 富士紡ホールディングス株式会社 Polishing pad and method for manufacturing polished product
JP2021053748A (en) * 2019-09-30 2021-04-08 富士紡ホールディングス株式会社 Polishing pad and method for manufacturing polished product
JP2021053754A (en) * 2019-09-30 2021-04-08 富士紡ホールディングス株式会社 Polishing pad and method for manufacturing polished product
JP2021053747A (en) * 2019-09-30 2021-04-08 富士紡ホールディングス株式会社 Polishing pad and method for manufacturing polished product
CN112677062B (en) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof
CN114761177A (en) * 2019-12-06 2022-07-15 3M创新有限公司 Grid abrasive and preparation method thereof
CN112548845B (en) * 2021-02-19 2021-09-14 清华大学 Substrate processing method
CN113043178A (en) * 2021-03-17 2021-06-29 江苏韦尔博新材料科技有限公司 Brazing diamond grinding and polishing sheet and preparation process thereof

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US4652275A (en) 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Erodable agglomerates and abrasive products containing the same
US4773920B1 (en) 1985-12-16 1995-05-02 Minnesota Mining & Mfg Coated abrasive suitable for use as a lapping material.
US4751138A (en) 1986-08-11 1988-06-14 Minnesota Mining And Manufacturing Company Coated abrasive having radiation curable binder
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Also Published As

Publication number Publication date
US10058970B2 (en) 2018-08-28
US20170057043A1 (en) 2017-03-02
TW201546893A (en) 2015-12-16
WO2015167899A1 (en) 2015-11-05
CN106376234A (en) 2017-02-01
EP3137259A1 (en) 2017-03-08
JP6838811B2 (en) 2021-03-03
KR20160147917A (en) 2016-12-23
EP3137259A4 (en) 2018-01-03
JP2017519649A (en) 2017-07-20
CN106376234B (en) 2019-11-05

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