JP2013526420A - パッドウインドウ挿入物 - Google Patents

パッドウインドウ挿入物 Download PDF

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Publication number
JP2013526420A
JP2013526420A JP2013510125A JP2013510125A JP2013526420A JP 2013526420 A JP2013526420 A JP 2013526420A JP 2013510125 A JP2013510125 A JP 2013510125A JP 2013510125 A JP2013510125 A JP 2013510125A JP 2013526420 A JP2013526420 A JP 2013526420A
Authority
JP
Japan
Prior art keywords
polishing
window
polishing pad
platen
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2013510125A
Other languages
English (en)
Japanese (ja)
Inventor
ボグスロー， エー． スウェデク，
ドミニク， ジェイ． ベンヴェニュ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2013526420A publication Critical patent/JP2013526420A/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2013510125A 2010-05-12 2011-04-27 パッドウインドウ挿入物 Withdrawn JP2013526420A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/778,760 2010-05-12
US12/778,760 US20110281510A1 (en) 2010-05-12 2010-05-12 Pad Window Insert
PCT/US2011/034215 WO2011142975A2 (en) 2010-05-12 2011-04-27 Pad window insert

Publications (1)

Publication Number Publication Date
JP2013526420A true JP2013526420A (ja) 2013-06-24

Family

ID=44912183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013510125A Withdrawn JP2013526420A (ja) 2010-05-12 2011-04-27 パッドウインドウ挿入物

Country Status (6)

Country Link
US (1) US20110281510A1 (ko)
JP (1) JP2013526420A (ko)
KR (2) KR101956848B1 (ko)
CN (1) CN102893377B (ko)
TW (3) TWI663021B (ko)
WO (1) WO2011142975A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016512926A (ja) * 2013-03-15 2016-05-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 補助窓シール付き研磨パッド

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
SG11201608996TA (en) 2014-05-02 2016-11-29 3M Innovative Properties Co Interrupted structured abrasive article and methods of polishing a workpiece
WO2017146735A1 (en) * 2016-02-26 2017-08-31 Applied Materials, Inc. Window in thin polishing pad
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
JP6883475B2 (ja) * 2017-06-06 2021-06-09 株式会社荏原製作所 研磨テーブル及びこれを備える研磨装置
JP7015667B2 (ja) * 2017-10-02 2022-02-03 株式会社ディスコ 研磨装置
JP2020001162A (ja) * 2018-06-28 2020-01-09 株式会社荏原製作所 研磨パッド積層体、研磨パッド位置決め治具、および研磨パッドを研磨テーブルに貼り付ける方法
US11571782B2 (en) * 2018-11-28 2023-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Single bodied platen housing a detection module for CMP systems

Citations (2)

* Cited by examiner, † Cited by third party
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US20030205325A1 (en) * 2001-12-12 2003-11-06 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US20080305729A1 (en) * 2007-06-08 2008-12-11 Applied Materials, Inc. Thin polishing pad with window and molding process

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US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6451398B1 (en) * 1998-11-24 2002-09-17 Michael S. Sylvester Double-sided self-adhesive reinforced foam tape
US6235365B1 (en) * 1998-12-18 2001-05-22 W. R. Grace & Co.-Conn. Waterproofing membrane having release sheet cutting system
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US20040082271A1 (en) 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
JP2001009699A (ja) * 1999-07-05 2001-01-16 Nichiden Mach Ltd 平面研磨装置
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
KR100905266B1 (ko) * 2000-12-01 2009-06-29 도요 고무 고교 가부시키가이샤 연마 패드
US6641470B1 (en) * 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
US6857941B2 (en) * 2001-06-01 2005-02-22 Applied Materials, Inc. Multi-phase polishing pad
WO2002102547A1 (en) * 2001-06-15 2002-12-27 Rodel Holdings, Inc. Polishing apparatus that provides a window
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2003163191A (ja) * 2001-11-28 2003-06-06 Tokyo Seimitsu Co Ltd 機械化学的研磨装置用の研磨パッド
JP2003188124A (ja) * 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
WO2003066282A2 (en) * 2002-02-04 2003-08-14 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
US20040146682A1 (en) * 2003-01-29 2004-07-29 David Emmert Decal form with sub-surface window
TW200530378A (en) * 2003-03-11 2005-09-16 Toyo Tire & Rubber Co Polishing pad and semiconductor device manufacturing method
KR100771738B1 (ko) * 2003-04-03 2007-10-30 히다치 가세고교 가부시끼가이샤 연마패드, 그 제조방법 및 그것을 이용한 연마방법
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
JP4764825B2 (ja) * 2003-10-31 2011-09-07 アプライド マテリアルズ インコーポレイテッド 研磨終点検知システム及び摩擦センサを使用する方法
WO2005104199A1 (ja) * 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
WO2006062158A1 (ja) * 2004-12-10 2006-06-15 Toyo Tire & Rubber Co., Ltd. 研磨パッド及び研磨パッドの製造方法
WO2007024807A2 (en) * 2005-08-22 2007-03-01 Applied Materials, Inc. Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US20070193126A1 (en) * 2006-01-10 2007-08-23 Mishko Teodorovich Apparatus and method for door and window side flashing
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
US7815997B2 (en) * 2006-12-29 2010-10-19 3M Innovative Properties Company Window film assembly and method of installing
KR20090055857A (ko) * 2007-11-29 2009-06-03 주식회사 동부하이텍 화학 기계적 연마용 패드
US7839496B2 (en) * 2008-04-24 2010-11-23 Araca Incorporated Confocal microscopy pad sample holder and method of hand using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030205325A1 (en) * 2001-12-12 2003-11-06 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US20080305729A1 (en) * 2007-06-08 2008-12-11 Applied Materials, Inc. Thin polishing pad with window and molding process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016512926A (ja) * 2013-03-15 2016-05-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 補助窓シール付き研磨パッド
US10744618B2 (en) 2013-03-15 2020-08-18 Applied Materials, Inc. Polishing pad with secondary window seal
US11618124B2 (en) 2013-03-15 2023-04-04 Applied Materials, Inc. Polishing pad with secondary window seal

Also Published As

Publication number Publication date
KR101956848B1 (ko) 2019-03-11
KR20170088444A (ko) 2017-08-01
US20110281510A1 (en) 2011-11-17
TW201742705A (zh) 2017-12-16
WO2011142975A3 (en) 2012-03-01
TWI611866B (zh) 2018-01-21
CN102893377A (zh) 2013-01-23
TW201217104A (en) 2012-05-01
CN102893377B (zh) 2016-08-10
WO2011142975A2 (en) 2011-11-17
TWI663021B (zh) 2019-06-21
KR101762936B1 (ko) 2017-07-28
KR20130103674A (ko) 2013-09-24
TWI663020B (zh) 2019-06-21
TW201817541A (zh) 2018-05-16

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