TWI595067B - Surface protection sheet - Google Patents

Surface protection sheet Download PDF

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Publication number
TWI595067B
TWI595067B TW102135945A TW102135945A TWI595067B TW I595067 B TWI595067 B TW I595067B TW 102135945 A TW102135945 A TW 102135945A TW 102135945 A TW102135945 A TW 102135945A TW I595067 B TWI595067 B TW I595067B
Authority
TW
Taiwan
Prior art keywords
workpiece
adhesive layer
substrate
adhesive
resin
Prior art date
Application number
TW102135945A
Other languages
English (en)
Chinese (zh)
Other versions
TW201422758A (zh
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201422758A publication Critical patent/TW201422758A/zh
Application granted granted Critical
Publication of TWI595067B publication Critical patent/TWI595067B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
TW102135945A 2012-10-05 2013-10-04 Surface protection sheet TWI595067B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012223655A JP6059499B2 (ja) 2012-10-05 2012-10-05 表面保護シート

Publications (2)

Publication Number Publication Date
TW201422758A TW201422758A (zh) 2014-06-16
TWI595067B true TWI595067B (zh) 2017-08-11

Family

ID=50652631

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102135945A TWI595067B (zh) 2012-10-05 2013-10-04 Surface protection sheet
TW106115691A TWI634189B (zh) 2012-10-05 2013-10-04 Surface protection sheet

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106115691A TWI634189B (zh) 2012-10-05 2013-10-04 Surface protection sheet

Country Status (3)

Country Link
JP (1) JP6059499B2 (ja)
KR (2) KR101880644B1 (ja)
TW (2) TWI595067B (ja)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5823591B1 (ja) * 2014-10-01 2015-11-25 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
JP6139808B2 (ja) * 2015-03-31 2017-05-31 リンテック株式会社 表面保護フィルム
JP2016192488A (ja) * 2015-03-31 2016-11-10 リンテック株式会社 半導体加工用粘着シート
JP2017005072A (ja) * 2015-06-09 2017-01-05 日東電工株式会社 半導体ウエハ保護用粘着シート
JP6584245B2 (ja) * 2015-09-08 2019-10-02 三井化学東セロ株式会社 電子部品製造用フィルム及び電子部品の製造方法
WO2017046855A1 (ja) * 2015-09-14 2017-03-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
WO2017150145A1 (ja) * 2016-03-04 2017-09-08 リンテック株式会社 保護膜形成用複合シート
JP6833804B2 (ja) * 2016-03-04 2021-02-24 リンテック株式会社 保護膜形成用複合シート
JP6851689B2 (ja) * 2016-05-18 2021-03-31 日東電工株式会社 バックグラインドテープ
JP6775880B2 (ja) * 2016-09-21 2020-10-28 株式会社ディスコ ウェーハの加工方法
JP6746211B2 (ja) * 2016-09-21 2020-08-26 株式会社ディスコ ウェーハの加工方法
KR102412725B1 (ko) * 2016-10-05 2022-06-23 린텍 가부시키가이샤 제1 보호막 형성용 시트
JP6324573B1 (ja) * 2017-03-31 2018-05-16 古河電気工業株式会社 粘着剤組成物、それを用いた半導体ウエハ表面保護テープの製造方法及び半導体ウエハ表面保護テープ
JP7157301B2 (ja) * 2017-11-06 2022-10-20 株式会社東京精密 ウェーハの加工方法
WO2019172438A1 (ja) * 2018-03-09 2019-09-12 リンテック株式会社 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法
JP2018119156A (ja) * 2018-03-20 2018-08-02 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JPWO2020195087A1 (ja) * 2019-03-22 2020-10-01
KR20210143153A (ko) 2019-03-22 2021-11-26 린텍 가부시키가이샤 워크 가공용 점착 시트 및 그 제조 방법
KR20220163431A (ko) 2020-04-23 2022-12-09 미쓰이 가가쿠 토세로 가부시키가이샤 백그라인드용 점착성 필름 및 전자 장치의 제조 방법
KR20230007493A (ko) 2020-06-10 2023-01-12 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법
WO2021251420A1 (ja) 2020-06-10 2021-12-16 三井化学東セロ株式会社 電子装置の製造方法
CN116157486A (zh) 2020-07-22 2023-05-23 三井化学东赛璐株式会社 背面研磨用粘着性膜及电子装置的制造方法
JPWO2022019160A1 (ja) 2020-07-22 2022-01-27
WO2022019166A1 (ja) 2020-07-22 2022-01-27 三井化学東セロ株式会社 電子装置の製造方法
CN117397005A (zh) 2021-05-28 2024-01-12 三井化学东赛璐株式会社 电子装置的制造方法
KR20240005912A (ko) 2021-05-28 2024-01-12 미쓰이 가가쿠 토세로 가부시키가이샤 백그라인드용 점착성 필름 및 전자 장치의 제조 방법
WO2022250132A1 (ja) 2021-05-28 2022-12-01 三井化学東セロ株式会社 電子装置の製造方法
KR20240006621A (ko) 2021-05-28 2024-01-15 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법
JPWO2022250128A1 (ja) 2021-05-28 2022-12-01
JPWO2022250137A1 (ja) 2021-05-28 2022-12-01
JPWO2022250130A1 (ja) 2021-05-28 2022-12-01
KR20240005910A (ko) 2021-05-28 2024-01-12 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법
JPWO2022250133A1 (ja) 2021-05-28 2022-12-01
JP7173392B1 (ja) 2022-05-12 2022-11-16 大日本印刷株式会社 半導体加工用粘着テープ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW588103B (en) * 2000-02-18 2004-05-21 Nec Corp Pressure sensitive adhesive sheet for wafer sticking
US20050269717A1 (en) * 2004-06-02 2005-12-08 Lintec Corporation Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
TW201117280A (en) * 2009-08-07 2011-05-16 Nitto Denko Corp Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor wafer

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JPH0685055A (ja) 1992-09-04 1994-03-25 Toshiba Corp 半導体素子の製造方法
JP2971855B1 (ja) * 1998-06-22 1999-11-08 明治乳業株式会社 風味のよいアミノ酸含有食品の製造方法
JP3670267B2 (ja) 2002-03-12 2005-07-13 浜松ホトニクス株式会社 レーザ加工方法
JP2004111428A (ja) 2002-09-13 2004-04-08 Tokyo Seimitsu Co Ltd チップ製造方法
US20070172649A1 (en) * 2004-03-19 2007-07-26 Mitsui Chemicals, Inc. Adhesive material, pressure sensitive adhesive film and method of use thereof
JP4393934B2 (ja) * 2004-06-23 2010-01-06 リンテック株式会社 半導体加工用粘着シート
JP2006286808A (ja) * 2005-03-31 2006-10-19 Furukawa Electric Co Ltd:The ウエハ加工用テープおよびそれを用いたウエハ加工方法
JP4667308B2 (ja) * 2006-06-23 2011-04-13 三井化学株式会社 半導体ウェハダイシング用保護シート及びそれを用いた半導体ウェハのダイシング方法
KR101058659B1 (ko) * 2006-10-06 2011-08-22 스미토모 베이클리트 컴퍼니 리미티드 반도체용 필름, 반도체용 필름의 제조 방법 및 반도체 장치
JP5063421B2 (ja) * 2008-03-13 2012-10-31 ユニチカ株式会社 半導体製造工程用フィルム
JP4810565B2 (ja) * 2008-11-26 2011-11-09 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2011142253A (ja) * 2010-01-08 2011-07-21 Hitachi Chem Co Ltd 半導体用途接着フィルム及びその製造方法並びに半導体装置の製造方法及び半導体装置
JP2012089709A (ja) * 2010-10-20 2012-05-10 Disco Abrasive Syst Ltd ワークの分割方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW588103B (en) * 2000-02-18 2004-05-21 Nec Corp Pressure sensitive adhesive sheet for wafer sticking
US20050269717A1 (en) * 2004-06-02 2005-12-08 Lintec Corporation Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
TW201117280A (en) * 2009-08-07 2011-05-16 Nitto Denko Corp Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor wafer

Also Published As

Publication number Publication date
JP2014075560A (ja) 2014-04-24
KR20180084029A (ko) 2018-07-24
KR102042598B1 (ko) 2019-11-08
JP6059499B2 (ja) 2017-01-11
TW201730307A (zh) 2017-09-01
KR101880644B1 (ko) 2018-07-20
TWI634189B (zh) 2018-09-01
KR20140044758A (ko) 2014-04-15
TW201422758A (zh) 2014-06-16

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