TWI592066B - Carrier copper foil, method for producing the carrier copper foil, copper-clad laminate obtained by using the carrier copper foil, and printed circuit board - Google Patents

Carrier copper foil, method for producing the carrier copper foil, copper-clad laminate obtained by using the carrier copper foil, and printed circuit board Download PDF

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Publication number
TWI592066B
TWI592066B TW104111075A TW104111075A TWI592066B TW I592066 B TWI592066 B TW I592066B TW 104111075 A TW104111075 A TW 104111075A TW 104111075 A TW104111075 A TW 104111075A TW I592066 B TWI592066 B TW I592066B
Authority
TW
Taiwan
Prior art keywords
copper foil
carrier
release layer
layer
peeling
Prior art date
Application number
TW104111075A
Other languages
English (en)
Chinese (zh)
Other versions
TW201603659A (zh
Inventor
Ayumu Tateoka
Yasuo Sato
Hiroyuki Watanabe
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW201603659A publication Critical patent/TW201603659A/zh
Application granted granted Critical
Publication of TWI592066B publication Critical patent/TWI592066B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW104111075A 2014-04-02 2015-04-02 Carrier copper foil, method for producing the carrier copper foil, copper-clad laminate obtained by using the carrier copper foil, and printed circuit board TWI592066B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014076392 2014-04-02

Publications (2)

Publication Number Publication Date
TW201603659A TW201603659A (zh) 2016-01-16
TWI592066B true TWI592066B (zh) 2017-07-11

Family

ID=54240688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111075A TWI592066B (zh) 2014-04-02 2015-04-02 Carrier copper foil, method for producing the carrier copper foil, copper-clad laminate obtained by using the carrier copper foil, and printed circuit board

Country Status (6)

Country Link
JP (1) JP6054523B2 (ja)
KR (1) KR101832806B1 (ja)
CN (1) CN106133200B (ja)
MY (1) MY190559A (ja)
TW (1) TWI592066B (ja)
WO (1) WO2015152380A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108029202B (zh) * 2015-10-28 2020-01-21 三井金属矿业株式会社 印刷电路板的制造方法
KR102137068B1 (ko) * 2019-11-27 2020-07-23 와이엠티 주식회사 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체
CN112361731A (zh) * 2020-11-05 2021-02-12 陕西汉和新材料科技有限公司 一种防止铜箔氧化的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05228130A (ja) 1992-02-19 1993-09-07 Otax Kk 血液監視用携帯装置
JP3676152B2 (ja) * 1999-11-11 2005-07-27 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
JP3690962B2 (ja) 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
JP3973197B2 (ja) 2001-12-20 2007-09-12 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
CN1984527B (zh) 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
TWI402009B (zh) * 2007-12-10 2013-07-11 Furukawa Electric Co Ltd Surface treatment of copper foil and circuit substrate
KR101722430B1 (ko) * 2009-07-24 2017-04-03 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 수지 복합 전해 동박, 동장 적층판 및 프린트 배선판
JP5503789B2 (ja) * 2013-08-30 2014-05-28 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板

Also Published As

Publication number Publication date
CN106133200A (zh) 2016-11-16
KR101832806B1 (ko) 2018-02-28
TW201603659A (zh) 2016-01-16
MY190559A (en) 2022-04-27
JPWO2015152380A1 (ja) 2017-04-13
JP6054523B2 (ja) 2016-12-27
KR20160114696A (ko) 2016-10-05
WO2015152380A1 (ja) 2015-10-08
CN106133200B (zh) 2018-04-27

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