TWI389345B - Light emitting device - Google Patents
Light emitting device Download PDFInfo
- Publication number
- TWI389345B TWI389345B TW97133377A TW97133377A TWI389345B TW I389345 B TWI389345 B TW I389345B TW 97133377 A TW97133377 A TW 97133377A TW 97133377 A TW97133377 A TW 97133377A TW I389345 B TWI389345 B TW I389345B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductor pattern
- light
- electrode
- emitting element
- electrically connected
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims description 130
- 239000000463 material Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 23
- 238000005538 encapsulation Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007223467A JP2010262946A (ja) | 2007-08-30 | 2007-08-30 | 発光装置 |
| JP2008115304A JP2010262948A (ja) | 2008-04-25 | 2008-04-25 | 発光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200915627A TW200915627A (en) | 2009-04-01 |
| TWI389345B true TWI389345B (zh) | 2013-03-11 |
Family
ID=40387399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97133377A TWI389345B (zh) | 2007-08-30 | 2008-08-29 | Light emitting device |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI389345B (ja) |
| WO (1) | WO2009028689A1 (ja) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168235A (ja) * | 1997-12-05 | 1999-06-22 | Toyoda Gosei Co Ltd | 発光ダイオード |
| JP4296644B2 (ja) * | 1999-01-29 | 2009-07-15 | 豊田合成株式会社 | 発光ダイオード |
| JP4065655B2 (ja) * | 2000-11-09 | 2008-03-26 | 昭和電工株式会社 | フリップチップ型半導体発光素子とその製造方法及び発光ダイオードランプ並びに表示装置、フリップチップ型半導体発光素子用電極 |
| JP2002335015A (ja) * | 2001-05-09 | 2002-11-22 | Rohm Co Ltd | 半導体発光素子 |
| JP2003046142A (ja) * | 2001-08-01 | 2003-02-14 | Sanyo Electric Co Ltd | 発光装置及びそれに用いる支持台 |
| JP2005191097A (ja) * | 2003-12-24 | 2005-07-14 | Kawaguchiko Seimitsu Co Ltd | 半導体パッケージ |
| JP4176703B2 (ja) * | 2004-11-25 | 2008-11-05 | 松下電器産業株式会社 | 半導体発光装置、照明装置、携帯通信機器、カメラ、及び製造方法 |
| JP2006156668A (ja) * | 2004-11-29 | 2006-06-15 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
| EP1715521B1 (en) * | 2005-04-21 | 2012-02-22 | C.R.F. Società Consortile per Azioni | Use of a transparent display having light-emitting diodes (LED) in a motor vehicle |
| JP4575248B2 (ja) * | 2005-07-20 | 2010-11-04 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
-
2008
- 2008-08-29 WO PCT/JP2008/065597 patent/WO2009028689A1/ja active Application Filing
- 2008-08-29 TW TW97133377A patent/TWI389345B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200915627A (en) | 2009-04-01 |
| WO2009028689A1 (ja) | 2009-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |