TWI365488B - Method of producing semiconductor device, solid-state imaging device, method of producing electric apparatus, and electric apparatus - Google Patents
Method of producing semiconductor device, solid-state imaging device, method of producing electric apparatus, and electric apparatusInfo
- Publication number
- TWI365488B TWI365488B TW097131432A TW97131432A TWI365488B TW I365488 B TWI365488 B TW I365488B TW 097131432 A TW097131432 A TW 097131432A TW 97131432 A TW97131432 A TW 97131432A TW I365488 B TWI365488 B TW I365488B
- Authority
- TW
- Taiwan
- Prior art keywords
- electric apparatus
- producing
- solid
- state imaging
- semiconductor device
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000003384 imaging method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007223114A JP5194645B2 (ja) | 2007-08-29 | 2007-08-29 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200929341A TW200929341A (en) | 2009-07-01 |
TWI365488B true TWI365488B (en) | 2012-06-01 |
Family
ID=40406073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097131432A TWI365488B (en) | 2007-08-29 | 2008-08-18 | Method of producing semiconductor device, solid-state imaging device, method of producing electric apparatus, and electric apparatus |
Country Status (5)
Country | Link |
---|---|
US (4) | US8207007B2 (zh) |
JP (1) | JP5194645B2 (zh) |
KR (1) | KR101457382B1 (zh) |
CN (1) | CN101378019B (zh) |
TW (1) | TWI365488B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5194645B2 (ja) * | 2007-08-29 | 2013-05-08 | ソニー株式会社 | 半導体装置の製造方法 |
US9427261B2 (en) * | 2012-06-13 | 2016-08-30 | Warsaw Orthopedic, Inc. | Spinal correction system and method |
CN108701587B (zh) * | 2016-01-28 | 2023-04-21 | 东京毅力科创株式会社 | 旋涂沉积金属氧化物的方法 |
CN112992950A (zh) * | 2021-02-05 | 2021-06-18 | 华虹半导体(无锡)有限公司 | 基于cis产品的高深宽比坚膜结构控制关键尺寸的方法 |
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-
2007
- 2007-08-29 JP JP2007223114A patent/JP5194645B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-06 KR KR1020080076851A patent/KR101457382B1/ko not_active IP Right Cessation
- 2008-08-18 US US12/222,855 patent/US8207007B2/en not_active Expired - Fee Related
- 2008-08-18 TW TW097131432A patent/TWI365488B/zh not_active IP Right Cessation
- 2008-08-29 CN CN2008102101849A patent/CN101378019B/zh active Active
-
2010
- 2010-09-29 US US12/923,584 patent/US9502599B2/en active Active
-
2011
- 2011-06-16 US US13/067,638 patent/US8658457B2/en not_active Expired - Fee Related
-
2013
- 2013-10-11 US US14/052,023 patent/US8940575B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20140038341A1 (en) | 2014-02-06 |
US8940575B2 (en) | 2015-01-27 |
CN101378019B (zh) | 2010-06-23 |
US20110250741A1 (en) | 2011-10-13 |
US9502599B2 (en) | 2016-11-22 |
US8658457B2 (en) | 2014-02-25 |
JP5194645B2 (ja) | 2013-05-08 |
CN101378019A (zh) | 2009-03-04 |
US8207007B2 (en) | 2012-06-26 |
US20090057798A1 (en) | 2009-03-05 |
US20110018083A1 (en) | 2011-01-27 |
JP2009059731A (ja) | 2009-03-19 |
TW200929341A (en) | 2009-07-01 |
KR20090023102A (ko) | 2009-03-04 |
KR101457382B1 (ko) | 2014-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |