TWI292349B - - Google Patents
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- TWI292349B TWI292349B TW094101151A TW94101151A TWI292349B TW I292349 B TWI292349 B TW I292349B TW 094101151 A TW094101151 A TW 094101151A TW 94101151 A TW94101151 A TW 94101151A TW I292349 B TWI292349 B TW I292349B
- Authority
- TW
- Taiwan
- Prior art keywords
- decane
- group
- acid
- polymer
- butyl
- Prior art date
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- -1 decane compound Chemical class 0.000 claims description 353
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 92
- 229920000642 polymer Polymers 0.000 claims description 70
- 239000013589 supplement Substances 0.000 claims description 53
- 150000001875 compounds Chemical class 0.000 claims description 45
- 238000006243 chemical reaction Methods 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 30
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 24
- 125000005843 halogen group Chemical group 0.000 claims description 23
- 125000003545 alkoxy group Chemical group 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 125000000962 organic group Chemical group 0.000 claims description 16
- 229910052731 fluorine Inorganic materials 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 239000003960 organic solvent Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 125000001153 fluoro group Chemical group F* 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims description 7
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 6
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 5
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 230000003301 hydrolyzing effect Effects 0.000 claims description 3
- KKBBWXXPTRIVMP-UHFFFAOYSA-N CCCCCCCCCC.[C] Chemical class CCCCCCCCCC.[C] KKBBWXXPTRIVMP-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- AXTYOFUMVKNMLR-UHFFFAOYSA-N dioxobismuth Chemical compound O=[Bi]=O AXTYOFUMVKNMLR-UHFFFAOYSA-N 0.000 claims 1
- 229940119177 germanium dioxide Drugs 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000007789 gas Substances 0.000 description 93
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 52
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 42
- 239000000243 solution Substances 0.000 description 37
- 239000002253 acid Substances 0.000 description 35
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 32
- 229910052719 titanium Inorganic materials 0.000 description 32
- 239000010936 titanium Substances 0.000 description 32
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 31
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 24
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 23
- 239000002904 solvent Substances 0.000 description 23
- 239000012295 chemical reaction liquid Substances 0.000 description 22
- 239000007983 Tris buffer Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 20
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 16
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- 235000014113 dietary fatty acids Nutrition 0.000 description 15
- 229930195729 fatty acid Natural products 0.000 description 15
- 239000000194 fatty acid Substances 0.000 description 15
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 15
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 14
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 14
- 239000002585 base Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 13
- 238000003756 stirring Methods 0.000 description 13
- 239000004094 surface-active agent Substances 0.000 description 13
- 229910052726 zirconium Inorganic materials 0.000 description 13
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 12
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 12
- GDDJLKLSPDBRJL-UHFFFAOYSA-N ethyl 2-oxo-3-sulfanylpropanoate Chemical compound CCOC(=O)C(=O)CS GDDJLKLSPDBRJL-UHFFFAOYSA-N 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 10
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 10
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 8
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 8
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 8
- 239000013522 chelant Substances 0.000 description 8
- 239000003638 chemical reducing agent Substances 0.000 description 8
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 8
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 8
- 238000010304 firing Methods 0.000 description 8
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 8
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 8
- 229920006254 polymer film Polymers 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 7
- QUBWTXNVPULBEW-UHFFFAOYSA-N acetic acid;butanimidamide Chemical compound CC(O)=O.CCCC(N)=N QUBWTXNVPULBEW-UHFFFAOYSA-N 0.000 description 7
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 7
- 239000011737 fluorine Substances 0.000 description 7
- 230000007062 hydrolysis Effects 0.000 description 7
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 239000004305 biphenyl Substances 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 229940125782 compound 2 Drugs 0.000 description 6
- 229920003257 polycarbosilane Polymers 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 5
- 229940022663 acetate Drugs 0.000 description 5
- 150000005215 alkyl ethers Chemical class 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 229940125904 compound 1 Drugs 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 5
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 5
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 4
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 4
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 4
- OJOLFAIGOXZBCI-UHFFFAOYSA-N 3-mercaptopyruvic acid Chemical compound OC(=O)C(=O)CS OJOLFAIGOXZBCI-UHFFFAOYSA-N 0.000 description 4
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- CCLNTBSYPXPIJP-UHFFFAOYSA-N C(C)OC1(OC(C(OC1)(OCC)OCC)(OCC)OCC)OCC Chemical compound C(C)OC1(OC(C(OC1)(OCC)OCC)(OCC)OCC)OCC CCLNTBSYPXPIJP-UHFFFAOYSA-N 0.000 description 4
- NSCFHMBIYKTBLG-UHFFFAOYSA-N C(CCC)C(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC Chemical compound C(CCC)C(C(OCCCC)(OCCCC)OCCCC)CCCCCCCC NSCFHMBIYKTBLG-UHFFFAOYSA-N 0.000 description 4
- GKIHECQGDLQZPQ-UHFFFAOYSA-N CC(=O)CC(=O)C(=O)S Chemical compound CC(=O)CC(=O)C(=O)S GKIHECQGDLQZPQ-UHFFFAOYSA-N 0.000 description 4
- KMPSFPWSBZMKDS-UHFFFAOYSA-N COC1(OC(C(OC1)(OC)OC)(OC)OC)OC Chemical compound COC1(OC(C(OC1)(OC)OC)(OC)OC)OC KMPSFPWSBZMKDS-UHFFFAOYSA-N 0.000 description 4
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 4
- RZKSECIXORKHQS-UHFFFAOYSA-N Heptan-3-ol Chemical compound CCCCC(O)CC RZKSECIXORKHQS-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 4
- UNRQTHVKJQUDDF-UHFFFAOYSA-N acetylpyruvic acid Chemical compound CC(=O)CC(=O)C(O)=O UNRQTHVKJQUDDF-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229940126214 compound 3 Drugs 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 239000001530 fumaric acid Substances 0.000 description 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229930003658 monoterpene Natural products 0.000 description 4
- 150000002773 monoterpene derivatives Chemical class 0.000 description 4
- 235000002577 monoterpenes Nutrition 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 4
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 4
- 229960004063 propylene glycol Drugs 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910021653 sulphate ion Inorganic materials 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 3
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 description 3
- KHPNGCXABLTQFJ-UHFFFAOYSA-N 1,1,1-trichlorodecane Chemical compound CCCCCCCCCC(Cl)(Cl)Cl KHPNGCXABLTQFJ-UHFFFAOYSA-N 0.000 description 3
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical compound C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 3
- CGTNCTXIQDWSOL-UHFFFAOYSA-N 1-butoxydecane Chemical compound CCCCCCCCCCOCCCC CGTNCTXIQDWSOL-UHFFFAOYSA-N 0.000 description 3
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 3
- LOLANUHFGPZTLQ-UHFFFAOYSA-N 1-ethoxydecane Chemical compound CCCCCCCCCCOCC LOLANUHFGPZTLQ-UHFFFAOYSA-N 0.000 description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
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- SSTZGACKDAVIGZ-UHFFFAOYSA-N sulfanium;bromide Chemical compound [SH3+].[Br-] SSTZGACKDAVIGZ-UHFFFAOYSA-N 0.000 description 1
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- 150000003456 sulfonamides Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- ANUMBTODEQDFNN-UHFFFAOYSA-N trichloromethylcyclohexane Chemical compound ClC(Cl)(Cl)C1CCCCC1 ANUMBTODEQDFNN-UHFFFAOYSA-N 0.000 description 1
- ABVVEAHYODGCLZ-UHFFFAOYSA-N tridecan-1-amine Chemical compound CCCCCCCCCCCCCN ABVVEAHYODGCLZ-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
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Description
1292349 九、發明說明: 【發明所屬之技術領域】 本發明係關於聚合物之製造方法、聚合物、絕 用組成物、絕緣膜之製造方法、及絕緣膜。 【先前技術】 習知,半導體元件等的層間絕緣膜係大多採用 (Chemical Vapor Deposition)法等真空製程所形 化矽(S i 0 2)膜。然而,近年在以形成更均勻之層 之目的下,便有使用通稱「SOG(SpinonGlass)月 烷氧基矽烷的水解生成物為主成分之塗佈式絕緣 外,隨半導體元件等的高積體化,已有開發通稱 S0G」,以聚有機矽氧烷為主成分的低介電常數之 膜0 特別係隨半導體元件等更加高積體化、多層化 更優越的導體間電絕緣性,所以,便形成要求更 數,且耐龜裂性、機械強度及密接性均優越的層 材料。 低介電常數材料有提案如:由在氨存在下使烷 進行縮合所獲得的微粒、與烷氧基矽烷之鹼性部 的混合物所構成的組成物(參照日本專利特開平 號公報、特開平5 - 3 1 5 3 1 9號公報);或藉由使聚 烷之鹼性水解物,在氨存在下進行縮合所獲得的ί 照日本專利特開平1 1 _ 3 4 0 2 1 9號公報、特開平1 號公報)。但是,依該等方法所獲得的材料,因為 312ΧΡ/發明說明書(補件)/94-05/94101151 緣膜形成 依CVD 成的二氧 間絕緣膜 I」,以四 膜。此 「有機 層間絕緣 ,便要求 低介電常 間絕緣膜 &基砂烧 分水解物 )-263045 烧氧基石夕 ί佈液(參 -340220 反應生成 5 1292349 物的性質不穩定,且塗膜的介電常數、耐龜裂性、機械強 度、密接性等的偏差亦大,因而並不適於工業生產。此外, 雖有提案利用將聚碳矽烷溶液與聚矽氧烷溶液混合而調製 塗佈液,並形成低介電率絕緣膜的方法(參照日本專利特開 2 0 0 1 _ 1 2 7 1 5 2號公報),但是,此方法有以碳矽烷與矽氧烷 的區域分別呈不均勻狀態分散於塗膜中的問題。
再者,亦有提案採用從有機金屬矽烷化合物製造含碳橋 接矽烷寡聚物之後,再施行水解縮合而所獲得有機矽酸酯 聚合體的方法(參照W 0 2 0 0 2 - 0 9 8 9 5 5 ),但是,依此方法所 獲得材料係屬於反應生成物的安定性差劣,無法長期保管 的材料,此外亦潛在對基板的密接性差劣的問題點。 【發明内容】 (發明所欲解決之問題) 本發明係提供一種可形成能適用為如半導體元件等的 層間絕緣膜,且介電常數小,機械強度與密接性均優越, 並具有均勻膜質之膜的聚合物之製造方法及聚合物。 本發明之另一目的在於提供一種使用上述本發明聚合 物的絕緣膜形成用組成物、絕緣膜之製造方法及絕緣膜。 (解決問題之手段) 本發明的聚合物之製造方法,係包含有: 在1種以上的(A )聚碳矽烷存在下,使(B )含水解性基矽 烷單體進行水解縮合; 上述(A )聚碳矽烷中至少1種係下述聚碳矽烷(I )。 使(I )下述一般式(1 )所示化合物,在鹼金屬與鹼土族金 6 312XP/發明說明書(補件)/94-05/94101151 1292349 屬中至少其中一者存在下進行反應而獲得的重量平均分子 量5 0 0以上之聚碳矽烷(I ): R^Ys-.S i CR2nXs-n ……(1 ) (式中,R1、R2係指相同或互異且分別為1價有機基或 氫原子;X係指鹵原子;Y係指鹵原子或烷氧基;k係指0〜3 整數,m與η係指相同或互異的0〜2整數。)
其中,上述本發明的聚合物之製造方法中,上述(Α)聚 碳矽烷之另一種係將上述聚碳矽烷(I ),更進一步在有機溶 劑中,與醇或有機酸進行反應而獲得的聚碳矽烷(I I )。 其中,上述本發明的聚合物之製造方法,上述(A )聚碳 矽烷之再另一種係將上述聚碳矽烷(I )與上述聚碳矽烷(I I ) 中至少其中一者,更進一步在有機溶劑中,與還原劑進行 反應而獲得的聚碳矽烷(I I I )。 其中,本發明的聚合物之製造方法,上述(B )含水解性 基矽烷單體係從下述一般式(2 )所示化合物與下述一般式 (3 )所示化合物的組群中,至少選擇1種的矽烷化合物。 R3aSiX4-a ……(2) (式中,R3係指氫原子、氟原子或1價有機基;X係指鹵 原子或烷氧基;a係指0〜3整數。) R4bY3-bSi-(R6)d-SiZ3-cR5c ……(3) (式中,R4、R5係指相同或互異且分別為1價有機基;b 與c係指相同或互異的0〜2整數;R6係指氧原子、伸苯基 或-(C Η 2) e -所示基(其中,e係指1〜6整數);Y與Z係指相 同或互異的鹵原子或烷氧基;d係指0或1。) 7 312XP/發明說明書(補件)/94-05/94101151 1292349 本發明的聚合物係依照上述本發明的聚合物之製造方 法而獲得。 本發明的絕緣膜形成用組成物係含有上述本發明的聚 合物及有機溶劑。 本發明的絕緣膜之製造方法,係包含有:將上述本發明 的絕緣膜形成用組成物塗佈於基板上,並加熱至3 0〜4 5 0 〇C 。
本發明的二氧化矽系絕緣膜係依照本發明的絕緣膜之 製造方法而獲得。 依照本發明的聚合物之製造方法,藉由在(A )聚碳矽烷 存在下,使(B )含水解性基矽烷單體進行反應,便可獲得源 自(B )含水解性基矽烷單體的聚矽氧烷、與(A )聚碳矽烷進 行反應的聚合物。例如藉由在具水解性基的(A )聚碳碎烧存 在下,對(B )含水解性基矽烷單體進行水解縮合,便獲得其 中一部份共縮合的聚合物。藉由使用含有此種特定聚合物 的絕緣膜形成用組成物,便可獲得介電常數小,且機械強 度、密接性均優越,膜中無相分離的絕緣膜。 【實施方式】 以下,針對本發明進行更詳細的説明。 1 .聚合物 本發明的聚合物係藉由在1種以上的(A )聚碳矽烷存在 下,使(B )含水解性基矽烷單體進行水解縮合而獲得。 1 · 1 · ( A )聚碳矽烷 本發明的聚合物中,(A )聚碳矽烷中至少其中1種係下 8 312XP/發明說明書(補件)/94-05/94101151 1292349 述聚碳矽烷(I )。 使(I )下述一般式(1 )所示化合物,在驗金屬與驗土族金 屬中至少其中一者存在下進行反應而獲得的重量平均分子 量5 0 0以上之聚碳矽烷(I ): R^Ya-.SiCR'nXs-n ……(1 )
(式中,R 1、R2係指相同或互異且分別為1價有機基或 氫原子;X係指鹵原子;Y係指鹵原子或烷氧基;k係指0〜3 整數,m與η係指相同或互異的0〜2整數。) 本發明中,所謂「水解性基」係指在本發明的聚合物製 造時能水解的基。水解性基的具體例並無特別限制,可舉 例如:鍵結於矽原子的氫原子、i原子、羥基、烷氧基、醯 氧基、磺醯基、曱磺醯基、及三氟甲磺醯基。 再者,本發明的聚合物係作為(A )聚碳矽烷可使用使聚 碳梦烧(I ),更進一步在有機溶劑中,與醇或有機酸進行反 應而獲得的聚碳矽烷(I I )所得者。 再者,本發明的聚合物係作為(A )聚碳矽烷可使用使聚 碳矽烷(I)與聚碳矽烷(II)中至少其中一者,更進一步在有 機溶劑中,與還原劑進行反應而獲得的聚碳矽烷(I I I )所得 者。 1 · 1 · 1 · 一般式(1 )所示化合物(以下稱「化合物1」) 在一般式(1 )中,R1、R2係指相同或互異的氫原子、或1 價有機基。R1、R2的具體例可舉例如:烷基、烯基、炔基等 碳數1〜1 0直鏈狀或分支鏈狀脂肪族基;環烷基、環烯基、 雙環烷基等碳數3〜2 0脂環式基;碳數6〜2 0芳香基;及碳數 9 312XP/發明說明書(補件)/94-05/94101151 1292349 6〜20芳烷基。 烷基可舉例如:甲基、乙基、正丙基、異丙基、正丁基、 異丁基、第三丁基、正戊基、異戊基、新戊基、噻基(thexyl) 等。 烯基可舉例如:乙烯基、丙烯基、3 -丁烯基、3 -戊烯基、 3-己烯基。 炔基可舉例如:丙炔基、3 -曱基丙炔基、3 -乙基丙炔基
等。 環烷基可舉例如:環丙基、環丁基、環戊基、環己基、 去曱稻烷基等。 芳香基可舉例如:苯基、曱苯基、二甲苯基、α -萘基、 /3 -萘基、α _噻吩基、/3 _噻吩基等。 芳烷基可舉例如:苄基、苯乙基、苯丙基、苯丁基等。 X、Υ所示鹵原子,有如:氟原子、氯原子、溴原子、填 原子。此外,Υ所示烧氧基(-OR)的R有如與上述R1、R2 的烷基與芳香基所舉相同的例子。 化合物1可舉例如:氣甲基三氯矽烷、溴曱基三氣矽烷、 碘甲基三氣矽烷、氣曱基曱基二氣矽烷、氯甲基乙基二氣 矽烷、氣甲基正丙基二氣矽烷、氣甲基異丙基二氣矽烷、 氣甲基正丁基二氣矽烷、氯甲基第三丁基二氣矽烷、氣曱 基環己基二氯矽烷、氣甲基苯乙基二氣矽烷、氣甲基乙烯 基二氣矽烷、氣曱基苯基二氯矽烷、溴曱基甲基二氣矽烷、 溴甲基乙基二氣矽烷、溴甲基正丙基二氣矽烷、溴甲基異 丙基二氯矽烷、溴甲基正丁基二氣矽烷、溴曱基第三丁基 10 312ΧΡ/發明說明書(補件)/94-05/94101151 1292349
二氣矽烷、溴曱基環己基二氯矽烷、溴甲基苯乙基二氯矽 烷、溴曱基乙烯基二氣矽烷、溴曱苯基二氯矽烷、碘曱基 曱基二氣矽烷、碘甲基乙基二氣矽烷、碘曱基正丙基二氣 矽烷、碘曱基異丙基二氯矽烷、碘甲基正丁基二氯矽烷、 碘曱基第三丁基二氣矽烷、碘甲基環己基二氣矽烷、碘曱 基苯乙基二氯矽烷、碘曱基乙烯基二氣矽烷、碘曱基苯基 二氣矽烷、氯甲基二甲基氣矽烷、氣甲基二乙基氯矽烷、 氯曱基二正丙基氣矽烷、氣曱基二異丙基氣矽烷、氣甲基 二正丁基氯矽烷、氯曱基二第三丁基氯矽烷、氯甲基二環 己基氯矽烷、氣甲基二苯乙基氣矽烷、氣曱基二乙烯基氣 矽烷、氯曱基二苯基氯矽烷、溴曱基二曱基氣矽烷、溴甲 基二乙基氯矽烷、溴甲基二正丙基氯矽烷、溴甲基二異丙 基氣矽烷、溴甲基二正丁基氣矽烷、溴甲基二第三丁基氣 矽烷、溴曱基二環己基氯矽烷、溴曱基二苯乙基氯矽烷、 溴曱基二乙烯基氣矽烷、溴甲基二苯基氯矽烷、碘曱基二 曱基氯矽烷、碘甲基二乙基氯矽烷、碘甲基二正丙基氣矽 烷、碘曱基二異丙基氣矽烷、碘甲基二正丁基氣矽烷、碘 曱基二第三丁基氣矽烷、碘甲基二環己基氯矽烷、碘甲基 二苯乙基氯矽烷、碘甲基二乙烯基氯矽烷、碘甲基二苯基 氯矽烷等; (1-氣乙基)三氯矽烷、(1_氣丙基)三氯矽烷、(2 -氯_2-丙基)三氯矽烷、(1-氣丁基)三氣矽烷、(2-氣-2-丁基)三 氯石夕烧、(3_氣戊基)三氯石夕烧、(1_氯-2-丙稀基)三氣 矽烷、(α -氯苄基)三氯矽烷、二氣曱基三氯矽烷、三氣曱 11 312ΧΡ/發明說明書(補件)/94-05/94101151 1292349
基三氯矽烷、(1-氣乙基)曱基二氣矽烷、(1-氣丙基)曱基 二氯矽烷、(2 -氣-2-丙基)甲基二氯矽烷、(1-氣丁基)曱基 二氣矽烷、(2 -氣-2 - 丁基)甲基二氣矽烷、(3 -氯-3 -戊基) 甲基二氯矽烷、(1-氯-2 -丙烯基)曱基二氯矽烷、(α _氯苄 基)曱基二氯矽烷、二氣甲基曱基二氣矽烷、三氯曱基曱基 二氯矽烷、(1-氣乙基)二曱基氯矽烷、(1-氣丙基)二曱基 氣石夕烧、(2 -氣-2-丙基)二甲基氯石夕烧、(1-氯丁基)二曱基 氣矽烷、(2 -氯-2-丁基)二甲基氣矽烷、(3_氯-3-戊基)二 甲基氣矽烷、(1-氯-2-丙烯基)二曱基氯矽烷、(α -氣苄基) 二甲基氯矽烷、二氯甲基二甲基氣矽烷、三氣曱基二曱基 氣矽烷等; 氯甲基三曱氧基矽烷、溴曱基三甲氧基矽烷、碘甲基三 曱氧基矽烷、氣曱基曱基二曱氧基矽烷、氯甲基乙基二甲 氧基矽烷、氯甲基正丙基二甲氧基矽烷、氯曱基異丙基二 曱氧基矽烷、氯曱基正丁基二曱氧基矽烷、氯曱基第三丁 基二曱氧基矽烷、氯曱基環己基二曱氧基矽烷、氣甲基苯 乙基二甲氧基矽烷、氯甲基乙烯基二甲氧基矽烷、氣甲基 苯基二甲氧基矽烷、溴甲基甲基二甲氧基矽烷、溴曱基乙 基二曱氧基矽烷、溴曱基正丙基二甲氧基矽烷、溴甲基異 丙基二甲氧基矽烷、溴甲基正丁基二曱氧基矽烷、溴甲基 第三丁基二甲氧基矽烷、溴甲基環己基二曱氧基矽烷、溴 曱基苯乙基二曱氧基矽烷、溴曱基乙烯基二甲氧基矽烷、 溴甲基苯基二甲氧基矽烷、碘甲基甲基二甲氧基矽烷、碘 曱基乙基二甲氧基矽烷、碘甲基正丙基二甲氧基矽烷、碘 12 312ΧΡ/發明說明書(補件)/94-05/94101151 1292349
曱基異丙基二曱氧基矽烷、碘曱基正丁基二曱氧基矽烷、 碘曱基第三丁基二曱氧基矽烷、碘曱基環己基二曱氧基矽 烷、碘曱基苯乙基二甲氧基矽烷、碘曱基乙烯基二甲氧基 矽烷、碘曱基苯基二甲氧基矽烷、氯曱基二曱基甲氧基矽 烷、氣曱基二乙基曱氧基矽烷、氯曱基二正丙基曱氧基矽 烷、氣曱基二異丙基甲氧基矽烷、氣甲基二正丁基甲氧基 矽烷、氯甲基二第三丁基曱氧基矽烷、氣曱基二環己基甲 氧基矽烷、氯甲基二苯乙基甲氧基矽烷、氣曱基二乙烯基 甲氧基矽烷、氯曱基二苯基甲氧基矽烷、溴曱基二甲基甲 氧基矽烷、溴甲基二乙基甲氧基矽烷、溴甲基二正丙基曱 氧基矽烷、溴甲基二異丙基甲氧基矽烷、溴甲基二正丁基 曱氧基矽烷、溴曱基二第三丁基曱氧基矽烷、溴曱基二環 己基甲氧基矽烷、溴甲基二苯乙基甲氧基矽烷、溴甲基二 乙烯基曱氧基*矽烷、溴甲基二苯基曱氧基矽烷、碘曱基二 甲基甲氧基矽烷、碘甲基二乙基甲氧基矽烷、碘甲基二正 丙基曱氧基矽烷、碘甲基二異丙基甲氧基矽烷、碘甲基二 正丁基甲氧基矽烷、碘甲基二第三丁基曱氧基矽烷、碘甲 基二環己基甲氧基矽烷、碘甲基二苯乙基甲氧基矽烷、碘 曱基二乙烯基甲氧基矽烷、碘曱基二苯基甲氧基矽烷等; 氯甲基三乙氧基矽烷、溴曱基三乙氧基矽烷、碘甲基三 乙氧基矽烷、氯甲基甲基二乙氧基矽烷、氯甲基乙基二乙 氧基矽烷、氣甲基正丙基二乙氧基矽烷、氯甲基異丙基二 乙氧基矽烷、氣甲基正丁基二乙氧基矽烷、氯甲基第三丁 基二乙氧基矽烷、氯甲基環己基二乙氧基矽烷、氣甲基苯 13 312XP/發明說明書(補件)/94-05/94101151 1292349
乙基二乙氧基矽烷、氯甲基乙烯基二乙氧基矽烷、氣曱基 苯基二乙氧基矽烷、溴甲基甲基二乙氧基矽烷、溴曱基乙 基二乙氧基矽烷、溴甲基正丙基二乙氧基矽烷、溴曱基異 丙基二乙氧基矽烷、溴曱基正丁基二乙氧基矽烷、溴曱基 第三丁基二乙氧基矽烷、溴甲基環己基二乙氧基矽烷、溴 曱基苯乙基二乙氧基矽烷、溴曱基乙烯基二乙氧基矽烷、 溴甲基苯基二乙氧基矽烷、碘甲基甲基二乙氧基矽烷、碘 曱基乙基二乙氧基矽烷、碘甲基正丙基二乙氧基矽烷、碘 曱基異丙基二乙氧基矽烷、碘甲基正丁基二乙氧基矽烷、 碘曱基第三丁基二乙氧基矽烷、碘曱基環己基二乙氧基矽 烷、碘曱基苯乙基二乙氧基矽烷、碘曱基乙烯基二乙氧基 矽烷、碘甲基苯基二乙氧基矽烷、氯甲基二曱基乙氧基矽 烷、氣曱基二乙基乙氧基矽烷、氣甲基二正丙基乙氧基矽 烷、氣曱基二異丙基乙氧基矽烷、氯甲基二正丁基乙氧基 矽烷、氯甲基二第三丁基乙氧基矽烷、氯甲基二環己基乙 氧基矽烷、氣曱基二苯乙基乙氧基矽烷、氣甲基二乙烯基 乙氧基矽烷、氣甲基二苯基乙氧基矽烷、溴甲基二甲基乙 氧基矽烷、溴甲基二乙基乙氧基矽烷、溴甲基二正丙基乙 氧基矽烷、溴曱基二異丙基乙氧基矽烷、溴曱基二正丁基 乙氧基矽烷、溴甲基二第三丁基乙氧基矽烷、溴曱基二環 己基乙氧基梦院、漠甲基二苯乙基乙氧基碎烧、漠甲基二 乙烯基乙氧基矽烷、溴曱基二苯基乙氧基矽烷、碘甲基二 曱基乙氧基矽烷、碘甲基二乙基乙氧基矽烷、碘曱基二正 丙基乙氧基矽烷、碘甲基二異丙基乙氧基矽烷、碘曱基二 14 312XP/發明說明書(補件)/94-05/94101151 4 1292349
正丁基乙氧基矽烷、碘甲基二第三丁基乙氧基矽烷、碘甲 基二環己基乙氧基矽烷、碘甲基二苯乙基乙氧基矽烷、碘 曱基二乙烯基乙氧基矽烷、碘曱基二苯基乙氧基矽烷等; 氣曱基三正丙氧基矽烷、溴甲基三正丙氧基矽烷、碘甲 基三正丙氧基矽烷、氣甲基甲基二正丙氧基矽烷、氯甲基 乙基二正丙氧基矽烷、氣甲基正丙基二正丙氧基矽烷、氯 曱基異丙基二正丙氧基矽烷、氯甲基正丁基二正丙氧基矽 烷、氣甲基第三丁基二正丙氧基矽烷、氯曱基環己基二正 丙氧基矽烷、氯曱基苯乙基二正丙氧基矽烷、氯甲基乙烯 基二正丙氧基矽烷、氯甲基苯基二正丙氧基矽烷、溴甲基 曱基二正丙氧基矽烷、溴曱基乙基二正丙氧基矽烷、溴曱 基正丙基二正丙氧基矽烷、溴曱基異丙基二正丙氧基矽 烷、溴甲基正丁基二正丙氧基矽烷、溴甲基第三丁基二正 丙氧基石夕烷、溴甲基環己基二正丙氧基矽烷、溴曱基苯乙 基二正丙氧基矽烷、溴曱基乙烯基二正丙氧基矽烷、溴曱 基苯基二正丙氧基矽烷、碘甲基甲基二正丙氧基矽烷、碘 甲基乙基二正丙氧基矽烷、碘甲基正丙基二正丙氧基矽 烷、碘甲基異丙基二正丙氧基矽烷、碘曱基正丁基二正丙 氧基矽烷、碘曱基第三丁基二正丙氧基矽烷、碘甲基環己 基二正丙氧基矽烷、碘曱基苯乙基二正丙氧基矽烷、碘甲 基乙烯基二正丙氧基矽烷、碘甲基苯基二正丙氧基矽烷、 氣曱基二甲基正丙氧基矽烷、氣曱基二乙基正丙氧基矽 烷、氣甲基二正丙基正丙氧基矽烷、氣甲基二異丙基正丙 氧基矽烷、氣甲基二正丁基正丙氧基矽烷、氯甲基二第三 15 312XP/發明說明書(補件)/94-05/94101151
1292349 丁基正丙氧基矽烷、氣甲基二環己基正丙氧基矽烷、 基二苯乙基正丙氧基矽烷、氯甲基二乙烯基正丙氧基 烷、氣曱基二苯基正丙氧基矽烷、溴甲基二甲基正丙 矽烷、溴甲基二乙基正丙氧基矽烷、溴甲基二正丙基 氧基矽烷、溴曱基二異丙基正丙氧基矽烷、溴曱基二 基正丙氧基矽烷、溴甲基二第三丁基正丙氧基矽烷、 基二環己基正丙氧基矽烷、溴甲基二苯乙基正丙氧基 烷、溴甲基二乙烯基正丙氧基矽烷、溴甲基二苯基正 基矽烷、碘曱基二甲基正丙氧基矽烷、碘甲基二乙基 氧基矽烷、碘曱基二正丙基正丙氧基矽烷、碘甲基二 基正丙氧基矽烷、碘甲基二正丁基正丙氧基矽烷、碘 二第三丁基正丙氧基矽烷、碘曱基二環己基正丙氧基 烷、碘甲基二苯乙基正丙氧基矽烷、碘甲基二乙烯基 氧基矽烷、碘甲基二苯基正丙氧基矽烷等; 氣甲基三異丙氧基矽烷、溴曱基三異丙氧基矽烷、 基三異丙氧基矽烷、氯甲基曱基二異丙氧基矽烷、氣 乙基二異丙氧基矽烷、氯曱基正丙基二異丙氧基矽烷 曱基異丙基二異丙氧基矽烷、氣甲基正丁基二異丙氧 烷、氯曱基第三丁基二異丙氧基矽烷、氯甲基環己基 丙氧基矽烷、氯曱基苯乙基二異丙氧基矽烷、氯曱基 基二異丙氧基矽烷、氯甲基苯基二異丙氧基矽烷、溴 甲基二異丙氧基矽烷、溴曱基乙基二異丙氧基矽烷、 基正丙基二異丙氧基矽烷、溴甲基異丙基二異丙氧基 烷、溴甲基正丁基二異丙氧基矽烷、溴甲基第三丁基 312XP/發明說明書(補件)/94-05/94101151 氯曱 矽 氧基 正丙 正丁 溴甲 矽 丙氧 正丙 異丙 甲基 矽 正丙 碘甲 甲基 、氣 基石夕 二異 乙烯 曱基 溴曱 矽 二異 16 1292349
丙氧基矽烷、溴曱基環己基二異丙氧基矽烷、溴甲基苯乙 基二異丙氧基矽烷、溴甲基乙烯基二異丙氧基矽烷、溴甲 基苯基二異丙氧基矽烷、碘曱基甲基二異丙氧基矽烷、碘 曱基乙基二異丙氧基矽烷、碘曱基正丙基二異丙氧基矽 烷、碘甲基異丙基二異丙氧基矽烷、碘甲基正丁基二異丙 氧基矽烷、碘甲基第三丁基二異丙氧基矽烷、碘甲基環己 基二異丙氧基矽烷、碘甲基苯乙基二異丙氧基矽烷、碘甲 基乙烯基二異丙氧基矽烷、碘曱基苯基二異丙氧基矽烷、 氯曱基二甲基異丙氧基矽烷、氯甲基二乙基異丙氧基矽 烷、氯甲基二正丙基異丙氧基矽烷、氯甲基二異丙基異丙 氧基矽烷、氣曱基二正丁基異丙氧基矽烷、氣曱基二第三 丁基異丙氧基矽烷、氯曱基二環己基異丙氧基矽烷、氣曱 基二苯乙基異丙氧基碎烧、氣甲基二乙稀基異丙氧基碎 烷、氣曱基二苯基異丙氧基矽烷、溴甲基二甲基異丙氧基 矽烷、溴甲基二乙基異丙氧基矽烷、溴甲基二正丙基異丙 氧基矽烷、溴曱基二異丙基異丙氧基矽烷、溴甲基二正丁 基異丙氧基矽烷、溴曱基二第三丁基異丙氧基矽烷、溴甲 基二環己基異丙氧基矽烷、溴甲基二苯乙基異丙氧基矽 烷、溴曱基二乙烯基異丙氧基矽烷、溴甲基二苯基異丙氧 基矽烷、碘甲基二甲基異丙氧基矽烷、碘甲基二乙基異丙 氧基矽烷、碘甲基二正丙基異丙氧基矽烷、碘曱基二異丙 基異丙氧基矽烷、碘曱基二正丁基異丙氧基矽烷、碘甲基 二第三丁基異丙氧基矽烷、碘甲基二環己基異丙氧基矽 烷、碘甲基二苯乙基異丙氧基矽烷、碘曱基二乙烯基異丙 17 312XP/發明說明書(補件)/94-05/94101151 1292349 氧基矽烷、碘曱基二苯基異丙氧基矽烷等矽化物。
該等化合物1中較佳的化合物有如:氣曱基三氣矽烷、 溴甲基三氣矽烷、氣甲基甲基二氯矽烷、氯甲基乙基二氯 矽烷、氣曱基乙烯基二氯矽烷、氯曱基苯基二氯矽烷、溴 曱基曱基二氣矽烷、溴甲基乙烯基二氯矽烷、氣曱基二曱 基氯矽烷、氯曱基二乙烯基氯矽烷、溴甲基二甲基氯矽烷、 (1-氣乙基)三氣矽烷、(1-氯丙基)三氯矽烷、氯曱基三甲 氧基矽烷、溴甲基三曱氧基矽烷、氯曱基曱基二曱氧基矽 烷、氣曱基乙烯基二甲氧基矽烷、氯甲基苯基二曱氧基矽 烷、溴曱基曱基二甲氧基矽烷、溴曱基乙烯基二甲氧基矽 烷、溴甲基苯基二甲氧基矽烷、氣甲基二曱基甲氧基矽烷、 氣曱基二乙烯基曱氧基矽烷、氯甲基二苯基曱氧基矽烷、 溴甲基二甲基甲氧基矽烷、溴甲基二異丙基甲氧基矽烷、 氣曱基三乙氧基矽烷、溴甲基三乙氧基矽烷、氯曱基甲基 二乙氧基矽烷、氯曱基乙基二乙氧基矽烷、氯甲基乙烯基 二乙氧基矽烷、氯甲基苯基二乙氧基矽烷、溴甲基甲基二 乙氧基矽烷、溴曱基乙烯基二乙氧基矽烷、溴曱基苯基二 乙氧基矽烷、氯甲基二甲基乙氧基矽烷、氣甲基二乙基乙 氧基石夕烧、漠甲基二乙稀基乙氧基碎烧、氯甲基三異丙氧 基矽烷、溴曱基三異丙氧基矽烷等。 該等化合物1可單獨使用1種,亦可混合使用2種以上。 1 . 2.聚碳矽烷之製造 聚碳矽烷(I )係如在「1 .聚合物」項中所説明,使化合 物1在驗金屬與驗土族金屬中至少其中一者存在下,進行 18 312XP/發明說明書(補件)/94-05/94101151 1292349 反應而獲得。 本發明所使用的驗金屬有如:經、鉀、鈉,而驗土族金 屬則有如鎂,惟在本發明中最好使用鎂。 鹼金屬與鹼土族金屬係為從化合物1中,還原性的使鹵 原子或烷氧基脱離並形成_化金屬而使用,使用量最好與 化合物1的碳-鹵鍵結與碳-烧氧基鍵結之總量為相當量。
再者,本發明的聚合物之製造方法中,(A )聚碳矽烷之 另1種係使聚碳矽烷(I)更進一步在有機溶劑中,與醇或有 機酸進行反應而獲得的聚碳矽烷(I I )。 再者,本發明的聚合物之製造方法中,(A )聚碳矽烷之 再另1種係使聚碳矽烷(I )與聚碳矽烷(I I )中至少其中一 者,更進一步在有機溶劑中,與還原劑進行反應而獲得的 聚碳矽烷(I I I )。 聚碳矽烷(I )〜(I I I )之製造方法配合需要,可藉由從外 部對反應液照射超音波俾促進反應。在此所使用的超音波 振動數最好為1 0〜7 Ο Κ Η z程度。 聚碳矽烷(I )〜(I I I )之製造中,所使用有機溶劑最好使 用醚系溶劑。在通常K i p p i n g反應中所使用的碳氫系溶 劑,較容易降低為目的之可溶性矽寡聚物的產率。 醚系溶劑可舉例如:二***、二正丙醚、二異丙醚、二 丁醚、乙基丙醚、茴香醚、苯***、二苯醚、二乙二醇二 甲醚、二乙二醇二***、二乙二醇二丁醚、二乙二醇曱基 ***、二丙二醇二曱醚、二丙二醇二***、二丙二醇二丁 醚、二丙二醇甲基***、乙二醇二甲醚、乙二醇二乙鍵、 19 312XP/發明說明書(補件)/94-05/94101151 1292349 乙二醇二丁醚、乙二醇甲基***、丙二醇二甲醚、丙二醇 二***、丙二醇二丁醚、丙二醇曱基***、四氫呋喃、二-四氫吡喃等。該等之中,就從所生成聚合物的溶解性觀點 而言,最好為如:二***、四氫呋喃、乙二醇二曱醚、乙二 醇二***等。
該等醚系溶劑最好預先去除水分。水分的去除法最好為 在鈉-二苯曱酮羰游基存在下的脱氣蒸餾法等。該等溶劑的 使用量並無特別限制,但在相對於化合物1總量之下,最 好1〜3 0重量份,尤以2〜2 0重量份為佳。 製造聚碳矽烷(I )時的反應溫度最好3 0〜1 5 0 °C ,尤以 3 0〜1 0 0 °C為佳。若反應溫度未滿3 0 °C,反應速度較慢無法 提昇生產性;反之,若反應溫度高於1 5 0 °C時,反應將趨 於複雜,所獲得聚合物的溶解性較容易降低。另外,反應 通常最好在氬、氮等非活性氣體中實施。 聚碳矽烷(I I )之製造方法中,使分子末端或側鏈具有未 反應之水解性鹵原子的聚碳^夕烧(I ),與醇或有機酸進行反 應,便可施行將鹵原子取代為更穩定之烷氧基或酯基的取 代處理。 醇可舉例如:曱醇、乙醇、正丙醇、異丙醇、正丁醇、 異丁醇、第二丁醇、第三丁醇、正戊醇、異戊醇、2 -甲基 丁醇、第二戊醇、第三戊醇、3 -甲氧基丁醇、正己醇、2 -甲基戊醇、第二己醇、2 -乙基丁醇、第二庚醇、3-庚醇、 正辛醇、2 -乙基己醇、第二辛醇、正壬醇、2, 6 -二甲基- 4-庚醇、正癸醇、第二月桂醇、三曱基壬醇、sec -十四烷醇、 20 312XP/發明說明書(補件)/94-05/94101151
等 1292349 sec -十七烷醇、苯酚、環己醇、甲基環己醇、3, 3, 5 -基環己醇、苄醇、二丙酮醇等單元醇; 乙二醇、1,2 -丙二醇、1,3-丁二醇、2,4 -戊二醇、 基-2,4-戊二醇、2,5_己二醇、2,4_庚二醇、2_乙基- 己二醇、二乙二醇、二丙二醇、三乙二醇、三丙二醇 元醇; 乙二醇單曱醚、乙二醇單***、乙二醇單丙醚、乙 單丁醚、乙二醇單己醚、乙二醇單苯醚、乙二醇單-2 -丁醚、二乙二醇單曱醚、二乙二醇單乙喊、二乙二醇 醚、二乙二醇單丁醚、二乙二醇單己醚、丙二醇單曱 丙二醇單***、丙二醇單丙醚、丙二醇單丁醚、二丙 單曱醚、二丙二醇單***、二丙二醇單丙醚等多元醇 醚系; 等 有機酸可舉例如:醋酸、丙酸、丁酸、戊酸、己酸 酸、辛酸、壬酸、癸酸、草酸、順丁烯二酸、曱基丙二 己二酸、癸二酸、沒食子酸、丁酸、苯六曱酸、花生油 莽草酸、2 -乙基己酸、油酸、硬脂酸、亞麻油酸、次 酸、水楊酸、安息香酸、對胺基安息香酸、對曱苯磺 苯磺酸、單氯醋酸、二氯醋酸、三氯醋酸、三氟醋酸 酸、丙二酸、磺酸、酞酸、反丁烯二酸、檸檬酸、酒石 琥珀酸、反丁烯二酸、衣康酸、曱基延胡索酸、檸康 蘋果酸、戊二酸等。 醇或酸可單獨使用1種,亦可混合使用2種以上。 312XP/發明說明書(補件)/94-05/94101151 三甲 2-曱 1,3- 等多 二醇 乙基 單丙 鍵、 二醇 部分 、庚 酸、 酸、 亞麻 酸、 、蟻 酸、 酸、 21 1292349
醇或酸的使用量係至少各自的羥基相對於殘留聚合物 之鹵原子的當量,最好1 . 0〜4. 0倍當量。此外,此時所使 用的溶劑僅要屬於未與所使用醇或酸產生反應的溶劑便 可,其餘並無特別限制,通常最好為芳香族系溶劑,例如: 苯、甲苯、二曱苯、均三甲苯等。該等可單獨使用,或混 合使用2種以上。另外,為能捕捉此反應時所生成的鹵化 氫,最好施行添加能生成與鹵化氫形成配對的鹽,且未具 活性氫的有機胺。該有機胺的具體例,可舉例如:吡啶、吡 咯、甲基吼啶、二疊氮雙環辛烷、二疊氮雙環壬烷、二疊 氮雙環月桂烯、三曱胺、三乙胺、三丙胺、三丁胺等。該 等鹼觸媒可單獨使用1種,亦可同時使用2種以上。 聚碳矽烷(I I I )之製造方法中,可施行對分子末端具未 反應水解性鹵原子的聚合物(I )、或上述經烷氧基化或酯化 的聚碳矽烷(I I )中至少其中一者,利用還原劑進行還原, 而將矽原子上的取代基取代為安定的氫原子之取代處理。
該還原劑可舉例如:L i A 1 Η 4、N a Η、L i B u 3 Β Η、( C 5 Η η ) 2 Β Η、 Β2Η6、NaBH4、Ζη(ΒΗ4)2、NaBH3CN、Β112ΑΙΗ' Li (0Bu)3A1H 等,最好為 LiAH、NaH、Β2Η6、NaBH4。 還原劑的使用量係還原劑中之氫原子至少相對於所殘 留聚合物之鹵原子的當量,最好1 . 0〜4. 0倍當量。此外, 此時所使用的溶劑僅要屬於未與所使用之還原劑產生反應 的溶劑便可,其餘並無特別限制,通常最好為喊系溶劑, 可使用如同上述所例示的醚系溶劑。該等可單獨使用,亦 可混合使用2種以上。 22 312XP/發明說明書(補件)/94-05/94101151 1292349 此時的反應溫度最好-7 8 °C〜+ 6 0 °C。若反應溫度未滿- 7 8 °C,反應較慢無法提昇生產性,反之,若高於+ 6 0 °C時,反 應生成物的溶解性將降低,聚合物的生成產率容易降低。 另外,反應通常最好在氬、氮等非活性氣體中實施。
本發明中所使用的聚碳矽烷(I )之重量平均分子量係在 5 0 0以上,最好7 0 0以上,尤以5 0 0〜3 0 0 0 0為佳。若此重 量平均分子量未滿5 0 0,將有在水解縮合反應時隨急遽高 分子化而凝膠化,而形成高結晶性的低分子化合物,導致 形成異物的原因。 1 . 3.聚合物之製造 本發明的聚合物之製造方法中,在上述1 .的(A )聚碳矽 烷存在下,使(B)含水解性基矽烷單體之由下述一般式(2) 所示化合物與下述一般式(3 )所示化合物的組群中,至少選 擇1種的碎烧化合物,在有機溶劑中,於觸媒存在下進行 水解縮合而獲得。 R 3 a S i X 4 - a ...... ( 2 ) (式中,R3係指氫原子、氟原子或1價有機基;X係指鹵 原子或烷氧基;a係指0〜3整數。) R\Y3-bSi-(R6)d-SiZ3-cR5c ……(3) (式中,R4、R5係指相同或互異且分別為1價有機基;b 與c係指相同或互異的0〜2整數;R6係指氧原子、伸苯基 或-(C Η 2) e -所示基(其中,e係指1〜6整數);Y與Z係指相 同或互異的鹵原子或烷氧基;d係指0或1。) 1 · 3 · 1 · —般式(2 )所示化合物(以下亦稱「化合物2」) 23 312XP/發明說明書(補件)/94-05/94101151 1292349 上述一般式(2 )中,R3係指氫原子、氟原子或1價有機 基。1價有機基可舉例如:烷基、芳香基、烯丙基、縮水甘 油基、乙烯基等。此外,一般式(2 )中,R3最好為1價有 機基,尤以烷基或苯基為佳。 其中,烧基可舉例如:曱基、乙基、丙基、丁基等,最 好碳數1〜5。該等烷基可為鏈狀亦可為分支,而且氫原子 亦可被氟原子、胺基等所取代。
芳香基可舉例如:苯基、萘基、甲基苯基、乙基苯基、 氯苯基、溴苯基、氟苯基等。 再者,相關X的烷氧基之碳氫部位,可直接適用R3之1 價有機基所舉例子。 一般式(2 )所示化合物(以下稱「化合物2」)的具體例, 可舉例如:四甲氧基矽烷、四乙氧基矽烧、四正丙氧基矽 烷、四異丙氧基矽烷、四正丁氧基矽烷、四第二丁氧基矽 烷、四第三丁氧基矽烷、四苯氧基矽烷、三曱氧基矽烷、 三乙氧基矽烷、三正丙氧基矽烷、三異丙氧基矽烷、三正 丁氧基矽烷、三第二丁氧基矽烷、三第三丁氧基矽烷、三 苯氧基矽烷、氟三甲氧基矽烷、氟三乙氧基矽烷、氟三正 丙氧基矽烷、氟三異丙氧基矽烷、氟三正丁氧基矽烷、氟 三第二丁氧基矽烷、氟三第三丁氧基矽烷、氟三苯氧基矽 烷等; 曱基三曱氧基矽烷、甲基三乙氧基矽烷、曱基三正丙氧 基矽烷、曱基三異丙氧基矽烷、曱基三正丁氧基矽烷、曱 基三第二丁氧基矽烷、甲基三第三丁氧基矽烷、曱基三苯 24 312XP/發明說明書(補件)/94-05/94101151 1292349
氧基石夕烧、乙基三甲氧基碎烧、乙基三乙氧基石夕烧、乙基 三正丙氧基石夕烧、乙基三異丙氧基石夕烧、乙基三正丁氧基 矽烷、乙基三第二丁氧基矽烷、乙基三第三丁氧基矽烷、 乙基三苯氧基矽烷、乙烯基三曱氧基矽烷、乙烯基三乙氧 基碎烧、乙婦基三正丙氧基石夕烧、乙稀基三異丙氧基秒烧、 乙烯基三正丁氧基矽烷、乙烯基三第二丁氧基矽烷、乙烯 基三第三丁氧基矽烷、乙烯基三苯氧基矽烷、正丙基三曱 氧基矽烷、正丙基三乙氧基矽烷、正丙基三正丙氧基矽烷、 正丙基三異丙氧基矽烷、正丙基三正丁氧基矽烷、正丙基 三第二丁氧基矽烷、正丙基三第三丁氧基矽烷、正丙基三 苯氧基石夕烧、異丙基三曱氧基石夕烧、異丙基三乙氧基石夕烧、 異丙基三正丙氧基矽烷、異丙基三異丙氧基矽烷、異丙基 三正丁氧基矽烷、異丙基三第二丁氧基矽烷、異丙基三第 三丁氧基矽烷、異丙基三苯氧基矽烷、正丁基三甲氧基矽 烷、正丁基三乙氧基矽烷、正丁基三正丙氧基矽烷、正丁 基三異丙氧基矽烷、正丁基三正丁氧基矽烷、正丁基三第 二丁氧基矽烷、正丁基三第三丁氧基矽烷、正丁基三苯氧 基矽烷、第二丁基三曱氧基矽烷、第二丁基三乙氧基矽烷、 第二丁基三正丙氧基矽烷、第二丁基三異丙氧基矽烷、第 二丁基三正丁氧基矽烷、第二丁基三第二丁氧基矽烷、第 二丁基三第三丁氧基矽烷、第二丁基三苯氧基矽烷、第三 丁基三甲氧基矽烷、第三丁基三乙氧基矽烷、第三丁基三 正丙氧基矽烷、第三丁基三異丙氧基矽烷、第三丁基三正 丁氧基矽烷、第三丁基三第二丁氧基矽烷、第三丁基三第 25 312ΧΡ/發明說明書(補件)/94-05/94101151 1292349 三丁氧基矽烷、第三丁基三苯氧基矽烷、苯基三曱氧基矽 烷、苯基三乙氧基矽烷、苯基三正丙氧基矽烷、苯基三異 丙氧基矽烷、苯基三正丁氧基矽烷、苯基三第二丁氧基矽 烷、苯基三第三丁氧基矽烷、苯基三苯氧基矽烷、乙烯基 三甲氧基矽烷、乙烯基三乙氧基矽烷、7-胺基丙基三曱氧 基石夕烧、7 _胺基丙基三乙氧基石夕烧、環氧丙氧基丙基 三甲氧基矽烷、7-環氧丙氧基丙基三乙氧基矽烷、7 _三 氟丙基三甲氧基矽烷、7-三氟丙基三乙氧基矽烷等;
二曱基二曱氧基矽烷、二甲基二乙氧基矽烷、二曱基二 正丙氧基矽烷、二曱基二異丙氧基石夕烷、二曱基二正丁氧 基矽烷、二甲基二第二丁氧基矽烷、二曱基二第三丁氧基 矽烷、二甲基二苯氧基矽烷、二乙基二甲氧基矽烷、二乙 基二乙氧基矽烷、二乙基二正丙氧基矽烷、二乙基二異丙 氧基矽烷、二乙基二正丁氧基矽烷、二乙基二第二丁氧基 矽烷、二乙基二第三丁氧基矽烷、二乙基二苯氧基矽烷、 二正丙基二甲氧基矽烷、二正丙基二乙氧基矽烷、二正丙 基二正丙氧基矽烷、二正丙基二異丙氧基矽烷、二正丙基 二正丁氧基矽烷、二正丙基二第二丁氧基矽烷、二正丙基 二第三丁氧基矽烷、二正丙基二苯氧基矽烷、二異丙基二 甲氧基矽烷、二異丙基二乙氧基矽烷、二異丙基二正丙氧 基矽烷、二異丙基二異丙氧基矽烷、二異丙基二正丁氧基 矽烷、二異丙基二第二丁氧基矽烷、二異丙基二第三丁氧 基矽烷、二異丙基二苯氧基矽烷、二正丁基二甲氧基矽烷、 二正丁基二乙氧基矽烷、二正丁基二正丙氧基矽烷、二正 26 312XP/發明說明書(補件)/94-05/94101151 1292349
丁基二異丙氧基矽烷、二正丁基二正丁氧基矽烷、二正丁 基二第二丁氧基矽烷、二正丁基二第三丁氧基矽烷、二正 丁基二苯氧基矽烷、二第二丁基二甲氧基矽烷、二第二丁 基二乙氧基矽烷、二第二丁基二正丙氧基矽烷、二第二丁 基二異丙氧基矽烷、二第二丁基二正丁氧基矽烷、二第二 丁基二第二丁氧基矽烷、二第二丁基二第三丁氧基矽烷、 二第二丁基二苯氧基矽烷、二第三丁基二曱氧基矽烷、二 第三丁基二乙氧基矽烷、二第三丁基二正丙氧基矽烷、二 第三丁基二異丙氧基矽烷、二第三丁基二正丁氧基矽烷、 二第三丁基二第二丁氧基矽烷、二第三丁基二第三丁氧基 矽烷、二第三丁基二苯氧基矽烷、二苯基二曱氧基矽烷、 二苯基二乙氧基矽烷、二苯基二正丙氧基矽烧、二苯基二 異丙氧基矽烷、二苯基二正丁氧基矽烷、二苯基二第二丁 氧基矽烷、二苯基二第三丁氧基矽烷、二苯基二苯氧基矽 烷、二乙烯基三甲氧基矽烷等; 四氣矽烷、四溴矽烷、四碘矽烷、三氯矽烷、三溴矽烷、 三碘矽烷、曱基三氯矽烷、乙基三氯矽烷、正丙基三氯矽 烷、異丙基三氣矽烷、正丁基三氯矽烷、第三丁基三氣矽 烷、環己基三氯矽烷、苯乙基三氯矽烷、2 -去曱稻烷基三 氯碎炫•、乙稀基三氣碎烧、苯基三氣碎烧、曱基三漠碎烧、 乙基三溴矽烷、正丙基三溴矽烷、異丙基三溴矽烷、正丁 基三溴矽烷、第三丁基三溴矽烷、環己基三溴矽烷、苯乙 基三 >臭咬烧、2 -去曱稻烧基三 臭石夕烧、乙稀基三漠石夕烧、 苯基三溴矽烷、甲基三碘矽烷、乙基三碘矽烷、正丙基三 27 312XP/發明說明書(補件)/94-05/94101151
1292349 碘矽烷、異丙基三碘矽烷、正丁基三碘矽烷、第三丁 碘矽烷、環己基三碘矽烷、苯乙基三碘矽烷、2 -去曱 基三碘矽烷、乙烯基三碘矽烷、苯基三碘矽烷、二甲 氣矽烷、二乙基二氣矽烷、二正丙基二氣矽烷、二異 二氣矽烷、二正丁基二氣矽烷、二第三丁基二氣矽烷 環己基二氯矽烷、二苯乙基二氣矽烷、二-2 -去曱稻烷 氣矽烷、二乙烯基二氣矽烷、二苯基二氯矽烷、二曱 溴矽烷、二乙基二溴矽烷、二正丙基二溴矽烷、二異 二溴矽烷、二正丁基二溴矽烷、二第三丁基二溴矽烷 環己基二溴矽烷、二苯乙基二溴矽烷、二-2 -去曱稻烷 溴矽烷、二乙烯基二溴矽烷、二苯基二溴矽烷、二甲 碘矽烷、二乙基二碘矽烷、二正丙基二碘矽烷、二異 二碘矽烷、二正丁基二碘矽烷、二第三丁基二碘矽烷 環己基二碘矽烷、二苯乙基二碘矽烷、二-2-去曱稻烷 碘矽烷、二乙烯基二碘矽烷、二苯基二碘矽烷、三甲 石夕烧、三乙基氣石夕烧、三正丙基氣石夕烧、三異丙基氯石J 三正丁基氯矽烷、三第三丁基氯矽烷、三環己基氣矽 三苯乙基氣石夕烧、三-2-去甲宿烧基氯石夕烧、三乙婦基 烧、三苯基氣石夕烧、三曱基溴石夕烧、三乙基溴石夕院、 丙基溴矽烷、三異丙基溴矽烷、三正丁基溴矽烷、三 丁基溴矽烷、三環己基溴矽烷、三苯乙基溴矽烷、三 去曱稻烷基溴矽烷、三乙烯基溴矽烷、三苯基溴矽烷 甲基碘矽烷、三乙基碘矽烷、三正丙基碘矽烷、三異 換石夕烧、三正丁基埃石夕烧、三第三丁基蛾石夕烧、三環 312XP/發明說明書(補件)/94-05/94101151 基三 稻烷 基二 丙基 、二 基二 基二 丙基 、二 基二 基二 丙基 、二 基二 基氯 烷、 烷、 氣矽 三正 第三 - 2-、 三 丙基 己基 28 1292349 碘矽烷、三苯乙基碘矽烷、三-2_去甲稍烷基碘矽烷、三乙 烯基碘矽烷、三苯基碘矽烷等矽化合物。該等化合物可單 獨使用1種,亦可混合使用2種以上。
化合物2最好如:甲基三甲氧基矽烷、甲基三乙氧基矽 烷、甲基三正丙氧基矽烷、甲基三異丙氧基矽烷、乙基三 曱氧基矽烷、乙基三乙氧基矽烷、乙烯基三曱氧基矽烷、 乙烯基三乙氧基矽烷、苯基三曱氧基矽烷、苯基三乙氧基 矽烷、二甲基二甲氧基矽烷、二曱基二乙氧基矽烷、二乙 基二曱氧基矽烷、二乙基二乙氧基矽烷、二苯基二甲氧基 矽烷、二苯基二乙氧基矽烷等。該等可單獨使用1種,亦 可同時使用2種以上。 1 · 3 · 2 · —般式(3 )所示化合物(以下亦稱「化合物3」) 上述一般式(3 )中,R4、R5所示1價有機基,可舉例如: 上述一般式(2 )中所舉相同的有機基。 化合物3中,一般式(3 )的R6為氧原子之化合物,可舉 例如:六氣二矽氧烷、六溴二矽氧烷、六碘二矽氧烷、六甲 氧基二矽氧烷、六乙氧基二矽氧烷、六苯氧基二矽氧烷、 1,1,1,3,3-五甲氧基-3-曱基二矽氧烷、1,1,1,3,3-五乙氧 基-3-甲基二矽氧烷、1,1,1,3, 3 -五苯氧基-3-甲基二矽氧 烷、1,1,1,3,3 -五曱氧基-3-乙基二矽氧烷、1,1,1,3,3-五乙氧基-3-乙基二矽氧烷、1,1,1,3, 3 -五苯氧基-3-乙基 二矽氧烷、1,1,1,3, 3-五甲氧基-3-苯基二矽氧烷、 1,1,1,3,3 -五乙氧基-3-苯基二矽氧烷、1,1,1,3,3 -五苯氧 基-3-苯基二矽氧烷、1,1,3, 3 -四曱氧基-1,3 -二曱基二矽 29 312XP/發明說明書(補件)/94-05/94101151 1292349
氧烷、1,1,3,3 -四乙氧基-1,3_二曱基二矽氧烷、1,1,3,3-四苯氧基-1,3 -二甲基二矽氧烷、1,1,3,3 -四曱氧基-1,3-二乙基二石夕氧烧、1,1,3,3 -四乙氧基-1,3 -二乙基二石夕氧 烷、1,1,3,3 -四苯氧基-1,3_二乙基二矽氧烷、1,1,3,3-四曱氧基-1,3 -二苯基二矽氧烷、1,1,3,3_四乙氧基-1,3-二苯基二矽氧烷、1,1,3, 3 -四苯氧基-1,3 -二苯基二矽氧 烧、1,1,3 -三曱氧基-1,3 ,3 -三甲基二石夕氧烧、1,1,3 -三乙 氧基-1,3,3-三甲基二石夕氧烧、1,1,3_三苯氧基_1,3,3-三 曱基二矽氧烷、1,1,3 -三曱氧基-1,3, 3 -三乙基二矽氧烷、 1,1,3 -三乙氧基-1,3,3 -三乙基二石夕氧烧、1,1,3-三苯氧基 -1,3,3-三乙基二石夕氧烧、1,1,3-三甲氧基-1,3,3-三苯基 二石夕氧烧、1,1,3-三乙氧基-1,3,3_三苯基二石夕氧烧、 1,1,3 -三苯氧基-1,3, 3-三苯基二矽氧烷、1,3 -二曱氧基 -1,1,3, 3 -四曱基二矽氧烷、1,3 -二乙氧基-1,1,3, 3 -四甲 基二矽氧烷、1,3 -二苯氧基-1,1,3, 3 -四甲基二矽氧烷、 1,3-二甲氧基-1,1,3, 3 -四乙基二矽氧烷、1,3 -二乙氧基 -1,1,3, 3 -四乙基二矽氧烷、1,3 -二苯氧基-1,1,3, 3 -四乙 基二矽氧烷、1,3 -二甲氧基-1,1,3, 3 -四苯基二矽氧烷、 1,3 -二乙氧基-1,1,3, 3 -四苯基二矽氧烷、1,3-二苯氧基 -1,1,3, 3 -四苯基二矽氧烷等。 該等之中,較佳的例子有如:六曱氧基二矽氧烷、六乙 氧基二矽氧烷、1,1,3, 3 -四曱氧基-1,3 -二曱基二矽氧烷、 1,1,3, 3 -四乙氧基-1,3 -二曱基二矽氧烷、1,1,3,3-四甲氧 基-1,3 -二苯基二矽氧烷、1,3_二曱氧基-1,1, 3 ,3 -四甲基 30 312XP/發明說明書(補件)/94-05/94101151 1292349 二矽氧烷、1,3 -二乙氧基-1,1,3, 3 -四甲基二矽氧烷、1,3-二曱氧基-1,1,3, 3 -四苯基二矽氧烷、1,3 -二乙氧基 -1,1,3, 3-四苯基二矽氧烷等。
再者,化合物3中,一般式(3)的d為0之化合物,可 舉例如:六氣二矽烷、六溴二矽烷、六磁二矽烷、六甲氧基 二矽烷、六乙氧基二矽烷、六苯氧基二矽烷、1,1,1,2,2-五曱氧基-2-曱基二矽烷、1,1,1,2, 2-五乙氧、基-2 -曱基二 矽烷、1,1,1,2,2 -五苯氧基-2-甲基二矽烷、1,1,1,2,2-五曱氧基-2-乙基二石夕烧、1,1,1,2,2 -五乙氧基_2 -乙基二 矽烷、1,1,1,2,2-五苯氧基-2-乙基二矽烷、1,1,1,2,2-五甲氧基-2-苯基二矽烷、1,1,1,2,2 -五乙氧基-2-苯基二 矽烷、1,1,1,2,2-五苯氧基-2-苯基二矽烷、1,1,2,2-四曱 氧基_1,2-二曱基二碎烧、1,1,2,2 -四乙氧基-1,2-二曱基 二矽烷、1,1,2,2 -四苯氧基-1,2 -二甲基二矽烷、1,1,2,2-四甲氧基-1,2 -二乙基二矽烷、1,1,2, 2 -四乙氧基-1,2-二 乙基二矽烷、1,1,2,2 -四苯氧基-1,2 -二乙基二矽烧、 1, 1,2, 2 -四甲氧基-1,2-二苯基二矽烷、1,1,2, 2 -四乙氧基 -1, 2 -二苯基二矽烷、1,1,2, 2 -四苯氧基-1,2-二苯基二矽 烷、1,1,2 -三曱氧基-1,2, 2 -三甲基二矽烷、1,1,2 -三乙氧 基-1,2, 2 -三曱基二矽烷、1,1,2 -三苯氧基-1,2,2-三甲基 二碎烧、1,1,2 -三曱氧基-1,2,2 -三乙基二球烧、1,1,2-三乙氧基_1,2,2_三乙基二碎烧、1,1,2 -三苯氧基-1,2,2-三乙基二石夕院、1,1,2-三甲氧基-1,2,2 -三苯基二石夕烧、 1,1,2 -三乙氧基-1,2,2_三苯基二石夕烧、1,1,2 -三苯氧基 31 312XP/發明說明書(補件)/94-05/94101151 1292349 -1,2, 2 -三苯基二矽烷、1,2-二甲氧基-1,1,2, 2 -四甲基二 矽烷、1,2 -二乙氧基-1,1,2, 2 -四曱基二矽烷、1,2 -二苯氧 基-1,1,2, 2 -四甲基二矽烷、1,2-二曱氧基-1,1,2, 2-四乙 基二矽烷、1,2 -二乙氧基-1,1,2, 2 -四乙基二矽烷、1,2-二苯氧基-1,1,2,2 -四乙基二矽烷、1,2 -二甲氧基 -1,1,2, 2-四苯基二矽烷、1,2 -二乙氧基_1,1,2, 2 -四苯基 二矽烷、1,2 -二苯氧基_1,1,2, 2 -四苯基二矽烷等。
該等之中,較佳的例子有如:六曱氧基二矽烷、六乙氧 基二矽烷、1,1,2, 2 -四曱氧基-1,2-二曱基二矽烷、 1,1,2, 2-四乙氧基-1,2 -二曱基二矽烷、1,1,2, 2 -四曱氧基 -1,2 -二苯基二矽烷、1,2 -二曱氧基-1,1,2, 2 -四甲基二矽 烷、1,2 -二乙氧基-1,1,2, 2 -四甲基二矽烷、1,2 -二甲氧基 -1,1,2,2 -四苯基二碎烧、1,2 -二乙氧基-1,1,2,2-四苯基 二矽烷等。 再者,化合物3中,一般式(3)的R6為-(CH 2.) e-所示基 的化合物,可舉例如··雙(三氯矽烷基)曱烷、雙(三溴矽烷 基)甲烷、雙(三碘矽烷基)甲烷、雙(三氯矽烷基)乙烷、雙 (三溴矽烷基)乙烷、雙(三碘矽烷基)乙烷、雙(三甲氧基矽 烷基)曱烷、雙(三乙氧基矽烷基)甲烷、雙(三正丙氧基矽 烷基)甲烷、雙(三異丙氧基矽烷基)甲烷、雙(三正丁氧基 矽烷基)甲烷、雙(三第二丁氧基矽烷基)甲烷、雙(三第三 丁氧基矽烷基)曱烷、1,2-雙(三甲氧基矽烷基)乙烷、1,2-雙(三乙氧基矽烷基)乙烷、1,2 -雙(三正丙氧基矽烷基)乙 烷、1,2 -雙(三異丙氧基矽烷基)乙烷、1,2 -雙(三正丁氧基 32 312XP/發明說明書(補件)/94-05/94101151 1292349 矽烷基)乙烷、1,2 -雙(三第二丁氧基矽烷基)乙烷、
1,1,2, 2 -雙(三第三丁氧基矽烷基)乙烷、1-(二曱氧基曱基 矽烷基)-1-(三甲氧基矽烷基)甲烷、1 -(二乙氧基曱基矽烷 基)-1-(三乙氧基矽烷基)曱烷、1_(二正丙氧基甲基矽烷 基)-1-(三正丙氧基矽烷基)曱烷、1-(二異丙氧基甲基矽烷 基)-1 -(三異丙氧基矽烷;i)曱烷、1 -(二正丁氧基甲基矽烷 基)-1-(三正丁氧基矽烷基)曱烷、1-(二第二丁氧基曱基矽 烷基)-1 -(三第二丁氧基矽烷基)曱烷、1 -(二第三丁氧基甲 基矽烷基)-1-(三第三丁氧基矽烷基)甲烷、1-(二曱氧基曱 基矽烷基)- 2 -(三曱氧基矽烷基)乙烷、1-(二乙氧基曱基矽 烷基)_2-(三乙氧基矽烷基)乙烷、1-(二正丙氧基曱基矽烷 基)-2-(三正丙氧基矽烷基)乙烷、1-(二異丙氧基曱基矽烷 基)-2-(三異丙氧基矽烷基)乙烷、1-(二正丁氧基曱基矽烷 基)-2-(三正丁氧基矽烷基)乙烷、1-(二第二丁氧基曱基矽 烷基)-2-(三第二丁氧基矽烷基)乙烷、1-(二第三丁氧基甲 基矽烷基)-2-(三第三丁氧基矽烷基)乙烷、雙(二曱氧基曱 基矽烷基)曱烷、雙(二乙氧基甲基矽烷基)曱烷、雙(二正 丙氧基甲基矽烷基)甲烷、雙(二異丙氧基甲基矽烷基)甲 烷、雙(二正丁氧基曱基矽烷基)甲烷、雙(二第二丁氧基甲 基矽烷基)甲烷、雙(二第三丁氧基甲基矽烷基)甲烷、1,2-雙(二甲氧基甲基矽烷基)乙烷、1,2 -雙(二乙氧基曱基矽烷 基)乙烷、1,2 -雙(二正丙氧基甲基矽烷基)乙烷、1,2-雙(二 異丙氧基曱基矽烷基)乙烷、1,2 -雙(二正丁氧基甲基矽烷 基)乙烷、1,2 -雙(二第二丁氧基甲基矽烷基)乙烷、1,2 - 33 312XP/發明說明書(補件)/94-05/94101151 1292349 雙(二第三丁氧基曱基矽烷基)乙烷、1,2_雙(三曱氧基矽烷 基)苯、1,2 -雙(三乙氧基矽烷基)苯、1,2 -雙(三正丙氧基 矽烷基)苯、1,2-雙(三異丙氧基矽烷基)苯、1,2-雙(三正 丁氧基矽烷基)苯、1,2 -雙(三第二丁氧基矽烷基)苯、1,2-雙(三第三丁氧基矽烷基)苯、1,3 -雙(三曱氧基矽烷基)
苯、1,3-雙(三乙氧基矽烷基)苯、1,3-雙(三正丙氧基矽烷 基)苯、1,3 -雙(三異丙氧基矽烷基)苯、1,3 -雙(三正丁氧 基矽烷基)苯、1,3 -雙(三第二丁氧基矽烷基)苯、1,3-雙(三 第三丁氧基矽烷基)苯、1,4-雙(三曱氧基矽烷基)苯、1,4-雙(三乙氧基矽烷基)苯、1,4 -雙(三正丙氧基矽烷基)苯、 1,4 -雙(三異丙氧基矽烷基)苯、1,4 -雙(三正丁氧基矽烷基) 苯、1,4 -雙(三第二丁氧基矽烷基)苯、1,4 -雙(三第三丁氧 基矽烷基)苯等。 該等之中,較佳的例子有如:雙(三甲氧基矽烷基)曱 烷、雙(三乙氧基矽烷基)甲烷、1,2 -雙(三甲氧基矽烷基) 乙烷、1,2-雙(三乙氧基矽烷基)乙烷、1-(二曱氧基甲基矽 烷基)-1-(三曱氧基矽烷基)曱烷、1_(二乙氧基甲基矽烷 基)-1-(三乙氧基矽烷基)甲烷、1-(二甲氧基曱基矽烷 基)-2-(三曱氧基矽烷基)乙烷、1-(二乙氧基曱基矽烷 基)-2 -(三乙氧基矽烷基)乙烷、雙(二甲氧基甲基矽烷基) 甲烷、雙(二乙氧基曱基矽烷基)甲烷、1,2 -雙(二甲氧基曱 基矽烷基)乙烷、1,2 -雙(二乙氧基甲基矽烷基)乙烷、1,2-雙(三甲氧基矽烷基)苯、1,2-雙(三乙氧基矽烷基)苯、l,3-雙 (三甲 氧基矽 烷基) 苯、 1,3-雙 (三乙 氧基矽 烷基) 苯、 1,4- 34 312XP/發明說明書(補件)/94-05/94101151 1292349 雙(三甲氧基矽烷基)苯、1,4_雙(三乙氧基矽烷基)苯等。 化合物2、3可單獨使用1種,亦可混合使用2種以上。 另外,當在上述聚碳矽烷(I)〜(III)中至少1種存在下, 使從化合物2、3的組群中至少選擇1種的矽烷化合物進行 水解縮合之際,最好化合物2、3平均1莫耳使用0. 5莫耳 以上且1 5 0莫耳以下的水,尤以添加0 . 5莫耳以上且1 3 0 莫耳以下的水為佳。
在製造本發明的聚合物之際,當於(A )聚碳矽烷(聚碳矽 烧(I)〜(III)中至少1種)存在下,使從上述化合物2、3 的組群中至少選擇1種的矽烷化合物進行水解縮合之際, 可使用特定觸媒。觸媒可使用由鹼觸媒、金屬螯合觸媒、 酸觸媒的組群中至少選擇1種。 鹼觸媒可舉例如:氫氧化鈉、氫氧化鉀、氫氧化鋰、吡 咬、σ比洛、略ϋ井、°比洛σ定、°辰σ定、曱基°比咬、單乙醇胺、 二乙醇胺、二曱基單乙醇胺、單曱基二乙醇胺、三乙醇胺、 二疊氮雙環辛烷、二疊氮雙環壬烷、二疊氮雙環月桂烯、 氫氧化四曱銨、氫氧化四乙銨、氫氧化四丙銨、氫氧化四 丁銨、氨、甲胺、乙胺、丙胺、丁胺、戊胺、己胺、戊胺、 辛胺、壬胺、癸胺、Ν,Ν-二甲胺、Ν,Ν -二乙胺、Ν,Ν -二丙 胺、Ν,Ν -二丁胺、三甲胺、三乙胺、三丙胺、三丁胺、環 己胺、三曱基亞胺(trimethyl imidine)、1 -胺基-3-甲基 丁烷、二曱基胺乙酸、3 -胺基-3-甲胺等,最好為胺或胺鹽, 尤以有機胺或有機胺鹽為佳,更以烷基胺、氫氧化四烷基 銨為佳。該等鹼觸媒可單獨使用1種,或同時使用2種以 35 312XP/發明說明書(補件)/94-05/94101151 1292349
金屬螯合觸媒可舉例如:三乙氧基•單(乙醯基丙酮酸) 鈦、三正丙氧基•單(乙醯基丙嗣酸)鈇、三異丙氧基•單 (乙醯基丙酮酸)鈦、三正丁氧基•單(乙醯基丙酮酸)鈦、 三第二丁氧基•單(乙醯基丙酮酸)鈦、三第三丁氧基•單 (乙醯基丙酮酸)鈦、二乙氧基•雙(乙醯基丙酮酸)鈦、二 正丙氧基•雙(乙醯基丙酮酸)鈦、二異丙氧基•雙(乙醯基 丙酮酸)鈦、二正丁氧基•雙(乙醯基丙酮酸)鈦、二第二丁 氧基•雙(乙醯基丙酮酸)鈦、二第三丁氧基•雙(乙醯基丙 酮酸)鈦、單乙氧基•三(乙醯基丙酮酸)鈦、單正丙氧基· 三(乙醯基丙酮酸)鈦、單異丙氧基•三(乙醯基丙酮酸) 鈦、單正丁氧基•三(乙醯基丙酮酸)鈦、單第二丁氧基· 三(乙醯基丙酮酸)鈦、單第三丁氧基•三(乙醯基丙酮酸) 鈦、四(乙醯基丙酮酸)鈦、三乙氧基•單(乙基乙醯醋酸) 鈦、三正丙氧基•單(乙基乙醯醋酸)鈦、三異丙氧基•單 (乙基乙醯醋酸)鈦、三正丁氧基•單(乙基乙醯醋酸)鈦、 三第二丁氧基•單(乙基乙醯醋酸)鈦、三第三丁氧基•單 (乙基乙醯醋酸)鈦、二乙氧基•雙(乙基乙醯醋酸)鈦、二 正丙氧基•雙(乙基乙醯醋酸)鈦、二異丙氧基•雙(乙基乙 醯醋酸)鈦、二正丁氧基•雙(乙基乙醯醋酸)欽、二第二丁 氧基•雙(乙基乙醯醋酸)鈦、二第三丁氧基•雙(乙基乙醯 醋酸)鈦、單乙氧基•三(乙基乙醯醋酸)鈦、單正丙氧基· 三(乙基乙醯醋酸)鈦、單異丙氧基•三(乙基乙醯醋酸) 鈦、單正丁氧基•三(乙基乙醯醋酸)鈦、單第二丁氧基· 36 31ZXP/發明說明書(補件)/94-05/94101151 1292349 三(乙基乙醯醋酸)鈦、單第三丁氧基•三(乙基乙醯醋酸) 鈦、四(乙基乙醯醋酸)鈦、單(乙醯基丙酮酸)三(乙基乙醯 醋酸)鈦、雙(乙醯基丙酮酸)雙(乙基乙醯醋酸)鈦、三(乙 醯基丙酮酸)單(乙基乙醯醋酸)鈦等鈦螯合物;
三乙氧基•單(乙醯基丙酮酸)鍅、三正丙氧基•單(乙 醯基丙酮酸)鍅、三異丙氧基•單(乙醯基丙酮酸)鍅、三正 丁氧基•單(乙醯基丙酮酸)锆、三第二丁氧基•單(乙醯基 丙酮酸)锆、三第三丁氧基•單(乙醯基丙酮酸)锆、二乙氧 基•雙(乙醯基丙酮酸)锆、二正丙氧基•雙(乙醯基丙酮酸) 锆、二異丙氧基•雙(乙醯基丙酮酸)锆、二正丁氧基•雙 (乙醯基丙酮酸)鍅、二第二丁氧基•雙(乙醯基丙酮酸) 鍅、二第三丁氧基•雙(乙醯基丙酮酸)锆、單乙氧基•三 (乙醯基丙酮酸)鍅、單正丙氧基•三(乙醯基丙酮酸)鍅、 單異丙氧基•三(乙醯基丙酮酸)鍅、單正丁氧基•三(乙醯 基丙酮酸)鍅、單第二丁氧基•三(乙醯基丙酮酸)锆、單第 三丁氧基•三(乙醯基丙酮酸)锆、四(乙醯基丙酮酸)锆、 三乙氧基•單(乙基乙醯醋酸)锆、三正丙氧基•單(乙基乙 醯醋酸)锆、三異丙氧基•單(乙基乙醯醋酸)錘、三正丁氧 基•單(乙基乙醯醋酸)鍅、三第二丁氧基•單(乙基乙醯醋 酸)鍅、三第三丁氧基•單(乙基乙醯醋酸)鍅、二乙氧基· 雙(乙基乙醯醋酸)鍅、二正丙氧基•雙(乙基乙醯醋酸) 锆、二異丙氧基•雙(乙基乙醯醋酸)锆、二正丁氧基•雙 (乙基乙醯醋酸)誥、二第二丁氧基•雙(乙基乙醯醋酸) 锆、二第三丁氧基•雙(乙基乙醯醋酸)锆、單乙氧基•三 37 312XP/發明說明書(補件)/94-05/94101151 1292349 (乙基乙醯醋酸)鍅、單正丙氧基•三(乙基乙醯醋酸)锆、 單異丙氧基•三(乙基乙醯醋酸)锆、單正丁氧基•三(乙基 乙醯醋酸)鍅、單第二丁氧基•三(乙基乙醯醋酸)锆、單第 三丁氧基•三(乙基乙醯醋酸)锆、四(乙基乙醯醋酸)锆、 單(乙醯基丙酮酸)三(乙基乙醯醋酸)鍅、雙(乙醯基丙酮酸) 雙(乙基乙醯醋酸)鍅、三(乙醯基丙酮酸)單(乙基乙醢醋酸) 锆等锆螯合物;
三(乙醯基丙酮酸)鋁、三(乙基乙醯醋酸)鋁等鋁螯合 物; 等等,最好為鈦或鋁的螯合物,尤以鈦的螯合物為佳。該 等金屬螯合觸媒可單獨使用1種,亦可同時使用2種以上。 酸觸媒可舉例如:鹽酸、硝酸、硫酸、氟酸、磷酸、硼 酸等無機酸; 醋酸、丙酸、丁酸、戊酸、己酸、庚酸、辛酸、壬酸、 癸酸、草酸、順丁烯二酸、甲基丙二酸、己二酸、癸二酸、 沒食子酸、丁酸、苯六曱酸、花生油酸、莽草酸、2 -乙基 己酸、油酸、硬脂酸、亞麻油酸、次亞麻酸、水楊酸、安 息香酸、對胺基安息香酸、對甲苯磺酸、苯磺酸、單氯醋 酸、二氯醋酸、三氣醋酸、三氟醋酸、蟻酸、丙二酸、磺 酸、酞酸、反丁烯二酸、檸檬酸、酒石酸、琥珀酸、反丁 烯二酸、衣康酸、曱基延胡索酸、檸康酸、蘋果酸、戊二 酸之水解物、順丁烯二酸酐之水解物、酞酸酐之水解物等 有機酸,最好為有機羧酸。該等酸觸媒可單獨使用1種, 亦可同時使用2種以上。 38 312XP/發明說明書(補件)/94-05/94101151 1292349 上述觸媒的使用量係相對於化合物2、3中由X,Υ,Z所 示基的總量 1 莫耳,通常為 0 . 0 0 0 0 1〜1 0 莫耳,最好 0.00005〜5莫耳。若觸媒使用量在上述範圍内,反應中發 生聚合物析出或凝勝化的顧慮較少。此外,本發明中,化 合物2、3進行水解時的溫度,通常為0〜1 0 0 °C,最好為1 5〜8 0 °C 。
本發明中,所謂「完全水解縮合物」係指(A )聚碳矽烷、 及化合物2、3中的水解性基1 0 0 %水解,並轉成S i Ο Η基, 更且完全縮合形成矽氧烷構造者。 再者,因為縮合物較所獲得組成物的貯藏安定性更優 越,因此最好為(A )聚碳矽烷與化合物2的水解縮合物。本 發明中化合物2、3相對於(A)聚碳矽烷的使用量,係化合 物 2、3 總量成分相對於(A)聚碳矽烷 1 0 0 重量份為 5 0 0〜4 0 0 0重量份,最好1 0 0 0〜3 0 0 0重量份。 本發明中,聚合物的聚苯乙烯換算重量平均分子量,通 常為 1,500〜500, 000 ,最好 2,000〜200, 000 ,尤以 2,0 0 0〜1 0 0,0 0 0為佳。若聚合物的聚苯乙烯換算重量平均 分子量未滿1,5 0 0,將有無法獲得為目的之介電常數的情 況;反之,若超過 5 0 0,0 0 0,將有塗膜面内均勻性惡化的 情 況 2 .聚合物膜形成用組成物(絕緣膜形成用組成物) 本發明之聚合物膜形成用組成物(絕緣膜形成用組成物) 中,除本發明的聚合物之外,尚可添加有機聚合物、界面 活性劑等成分。 39 312XP/發明說明書(補件)/94-05/94101151 1292349 有機聚合物可舉例如:具糖鏈構造的化合物、乙烯基醯 胺系聚合物、(曱基)丙烯酸系聚合物、芳香族乙烯基化合 物、樹枝狀高分子、聚醯亞胺、聚醯胺酸、聚亞芳香基、 聚醯胺、聚喹哼啉、聚嘮二唑、氟系聚合物、具聚氧化伸 烷構造的化合物等。
具聚氧化伸烷構造的化合物,可舉例如:聚氧代曱烷 (poly methylene xoide)構造、聚環氧乙烧構造、聚環氧 丙烷構造、聚四氧代曱烷構造、聚環氧丁烷構造等。 具體而言可舉例如:聚氧亞曱基烷基醚、聚氧乙烯烷基 醚、聚氧乙烯烷基苯基醚、聚氧乙烯固醇醚、聚氧乙烯羊 毛脂衍生物、烧基苯S分甲酿縮合物之氧化乙烤衍生物、聚 氧乙烯聚氧丙烯嵌段共聚物、聚氧乙烯聚氧丙烯烷基醚等 醚型化合物;聚氧乙烯甘油脂肪酸酯、聚氧乙烯山梨糖醇 酐脂肪酸酯、聚氧乙烯山梨糖醇脂肪酸酯、聚氧乙烯脂肪 酸烷醇醯胺硫酸鹽等之醚酯型化合物、聚乙二醇脂肪酸 酯、乙二醇脂肪酸酯、脂肪酸單甘油酯、聚甘油脂肪酸酯、 山梨糖醇酐脂肪酸酯、丙二醇脂肪酸酯、蔗糖脂肪酸酯等 醚酯型化合物等。 聚氧乙烯聚氧丙烯嵌段共聚物有如具有下示嵌段構造 的化合物。 -(XJ ) )k- -(X ’)j - ( Y ’)k - ( X ’)1 - (式中,X’ 係指-CH2CH2〇- 所示基;Y’ 係指-CH2CH(CH3)0-所示基;j係指1〜9 0 ; k係指1 0〜9 9 ; 1係指0〜9 0的數值。) 40 312XP/發明說明書(補件)/94-05/94101151 1292349 該等之中,較佳的例子有如:聚氧乙烯烷基醚、聚氧乙 烯聚氧丙烯嵌段共聚物、聚氧乙烯聚氧丙烯烷基醚、聚氧 乙烯甘油脂肪酸酯、聚氧乙烯山梨糖醇酐脂肪酸酯、聚氧 乙烯山梨糖醇脂肪酸酯等醚型化合物。該等可單獨使用1 種,亦可同時使用2種以上。
界面活性劑有如:非離子系界面活性劑、陰離子系界面 活性劑、陽離子系界面活性劑、兩性界面活性劑等,尚可 舉例如:氟系界面活性劑、石夕酮系界面活性劑、聚環氧烧系 界面活性劑、聚(曱基)丙烯酸酯系界面活性劑等,最好為 如:氟系界面活性劑、石夕酮系界面活性劑。 氟系界面活性劑可舉例如:1,1,2,2 -四氟辛基 (1,1,2, 2-四氟丙基)醚、1,1,2, 2-四氟辛基己醚、八乙二 醇二(1,1,2, 2 -四氟丁基)醚、六乙二醇(1,1,2, 2, 3 ,3-六氟 戊基)醚、八丙二醇二(1,1,2, 2 -四氟丁基)醚、六丙二醇二 (1,1,2,2,3 ,3-六氟戊基)醚、全氟十二烧基石黃酸鈉、 1,1,2,2,8,8,9,9,10,10 -十氟化十二烷、1,1,2,2,3,3-六 氟癸烷、N-[3-(全氟辛烷磺醯醯胺)丙基]-N,Ν’-二曱基- N-羧基亞甲基銨甜菜输、全氟烷基磺醯醯胺丙基三甲基銨 鹽、全氟烷基-Ν -乙基磺醯基胺乙酸鹽、磷酸雙(Ν -全氟辛 基磺醯基-Ν -乙基胺基乙基)、單全氟烷基乙基磷酸酯等, 由末端、主鏈及側鏈的至少任一部位,具有氟化烷基或氟 伸烧基的化合物所構成之氟系界面活性劑。 再者,市售品則有如依美佳伐克 F 1 4 2 D、同 F 1 7 2、同 F 1 7 3、同F 1 8 3 [以上均為大日本油墨化學工業(股)製]、艾 41 312ΧΡ/發明說明書(補件)/94-05/94101151 1292349 伏得布E F 3 Ο 1、同3 Ο 3、同3 5 2 [新秋田化成(股)製]、伏蘿 拉得FC - 4 3 0、同FC-431[住友3Μ(股)製]、亞撒佳德AG710、 薩 4昌隆 S-382、同 SC-101、同 SC-102、同 SC-103、同 SC—104、同 SC - 105、同 SC - 106[旭石肖子(股)製]、ΒΜ-1000、 ΒΜ-1100[裕商(股)製]、ΝΒΧ-15[尼歐斯(股)]等名稱在市售 的氟系界面活性劑。該等之中,特別以美佳伐克 F1 7 2、 ΒΜ-1000 > ΒΜ-1100> ΝΒΧ-15 為佳 °
石夕酮系界面活性劑可採用如:S Η 7 P A、S Η 2 1 P A、S Η 3 0 P A、 ST94PA[均為東雷•道康尼克·矽利康(股)製]等。該等之 中最好為上述SH28PA、 SH30PA。 界面活性劑的使用量係相對於聚合物(完全水解縮合 物),通常為0 . 0 0 0 1〜1 0重量份。該等可單獨使用1種,亦 可同時使用2種以上。 本發明的絕緣膜形成用組成物,可將本發明的聚合物 (水解縮合物)及配合需要的添加劑,溶解或分散於有機溶 劑中。 此時可使用的有機溶劑有如從醇系溶劑、酮系溶劑、醯 胺系溶劑、酯系溶劑及非質子系溶劑所構成組群中,至少 選擇1種。 其中,醇系溶劑可舉例如:甲醇、乙醇、正丙醇、異丙 醇、正丁醇、異丁醇、第二丁醇、第三丁醇、正戊醇、異 戊醇、2 -甲基丁醇、第二戊醇、第三戊醇、3 -曱氧基丁醇、 正己醇、2 -曱基戊醇、第二己醇、2 -乙基丁醇、第二庚醇、 3-庚醇、正辛醇、2 -乙基己醇、第二辛醇、正壬醇、2, 6- 42 312XP/發明說明書(補件)/94-05/94101151 1292349 二甲基-4-庚醇、正癸醇、第二月桂醇、三曱基壬醇、sec-十四烧醇、sec -十七烧醇、苯紛、環己醇、曱基環己醇、 3,3,5 -三甲基環己醇、苄醇、二丙酮醇等單元醇系溶劑; 乙二醇、1,2-丙二醇、1,3 -丁二醇、2, 4 -戊二醇、2 -曱 基-2 ,4 -戊二醇、2, 5 -己二醇、2, 4 -庚二醇、2 -乙基-1,3-己二醇、二乙二醇、二丙二醇、三乙二醇、三丙二醇等多 元醇系溶劑;
乙二醇單曱醚、乙二醇單***、乙二醇單丙醚、乙二醇 單丁醚、乙二醇單己醚、乙二醇單苯醚、乙二醇單-2-乙基 丁醚、二乙二醇單曱醚、二乙二醇單***、二乙二醇單丙 醚、二乙二醇單丁醚、二乙二醇單己醚、丙二醇單甲醚、 丙二醇單***、丙二醇單丙醚、丙二醇單丁醚、二丙二醇 單甲醚、二丙二醇單***、二丙二醇單丙醚等多元醇部分 醚系溶劑; 等等。該等醇系溶劑可單獨使用1種,亦可同時使用2種 以上。 酮系溶劑可舉例如:丙酮、曱基乙酮、曱基正丙酮、甲 基正丁酮、二乙酮、曱基異丁酮、曱基正戊酮、乙基正丁 酮、甲基正己酮、二異丁酮、三曱基壬酮、環己酮、2-己 酮、甲基環己酮、2,4 -戊二酮、丙酮基丙酮、苯乙酮、小 茴香酮等,此外尚有如:乙醯基丙酮、2,4 -己二酮、2,4 -庚二酮、3, 5-庚二酮、2,4 -辛二酮、3, 5 -辛二酮、2, 4-壬 二酮、3, 5 -壬二酮、5 -曱基-2 ,4 -己二酮、2, 2, 6,6 -四曱基 -3,5-庚二8同、1,1,1,5,5,5-六氟_2,4-庚二酮等/?_二8同類 43 312XP/發明說明書(補件)/94-05/94101151
1292349 等。該等酮系溶劑可單獨使用1種,亦可同時使用2 醯胺系溶劑可舉例如:甲醯胺、N _曱基甲醯胺、N, 甲基曱醯胺、N -乙基甲醯胺、N,N -二乙基甲醯胺、乙酺 N -甲基乙醯胺、N,N_二曱基乙醯胺、N -乙基乙醢胺、 二乙基乙醯胺、N -甲基丙醯胺、N -甲基吡咯烷酮、N-基嗎啉、N -曱醯基哌啶、N -曱醯基吡咯啶、N -乙醯基嗎 N -乙醯基哌啶、N -乙醯基吡咯啶等。該等醯胺系溶劑 獨使用1種,亦可同時使用2種以上。 酯系溶劑可舉例如:二乙基碳酸酯、碳酸乙烯酯、 丙烯酯、碳酸二乙酯、醋酸曱酯、醋酸乙酯、7 -丁内 7 -戊内酯、醋酸正丙酯、醋酸異丙酯、醋酸正丁酯、 異丁酯、醋酸第二丁酯、醋酸正戊酯、醋酸第二戊酯 甲氧基丁基醋酸酯、醋酸曱基戊酯、2 -乙基丁基醋酸 2 -乙基己基醋酸酯、醋酸苄酯、醋酸環己酯、醋酸甲 己酯、醋酸正壬酯、乙醯醋酸甲酯、乙醯醋酸乙酯、 乙二醇單甲醚、醋酸乙二醇單***、醋酸二乙二醇單曱 醋酸二乙二醇單***、醋酸二乙二醇單正丁醚、醋酸 醇單甲醚、醋酸丙二醇單***、醋酸丙二醇單丙醚、 丙二醇單丁醚、醋酸二丙二醇單甲醚、醋酸二丙二醇 醚、乙二醇二醋酸酯、醋酸曱氧基三乙二醇酯、丙酸乙 丙酸正丁酯、丙酸異戊酯、草酸二乙酯、草酸二正丁 乳酸曱酯、乳酸乙酯、乳酸正丁酯、乳酸正戊酯、丙 二乙酯、酞酸二甲酯、酞酸二乙酯等。該等酯系溶劑 312XP/發明說明書(補件)/94-05/94101151 種以 N-二 胺、 N, N-曱醯 琳、 可單 碳酸 酯、 醋酸 ' 3- 酯、 基環 醋酸 醚、 丙二 醋酸 單乙 酯、 酯、 二酸 可單 44 1292349 獨使用1種,亦可同時使用2種以上。
非質子系溶劑可舉例如:乙腈、二曱基亞砜、N,N,N ’,N ’ -四乙基磺醯胺、六曱基磷酸三醯胺、N -曱基嗎啉酮、N -曱 基σ比洛、N -乙基ϋ比洛、N -甲基-△ 3 -二氫σ比洛、N -曱基派咬、 Ν -乙基哌啶、Ν,Ν-二曱基哌畊、Ν -甲基咪唑、Ν -甲基-4 -哌啶酮、Ν -甲基- 2 -哌啶酮、Ν -曱基- 2 -吡咯烷酮、1,3 -二 甲基-2-咪唑啉二酮、1,3-二曱基四氫- 2(1Η)-嘧啶酮等。 該等非質子系溶劑可單獨使用1種,亦可同時使用2種以 依此所獲得本發明絕緣膜形成用組成物的總固形份濃 度,最好為2〜30重量%,可配合所使用目的而適當調整。 絕緣膜形成用組成物之總固形份濃度若為2〜3 0重量%,塗 膜膜厚便將在適當範圍内,保存安定性亦將更優越。另外, 此總固形份濃度的調整,若需要的話,亦可施行濃縮及利 用上述有機溶劑施行稀釋。 3 ·聚合物膜(絕緣膜) 本發明之聚合物膜係藉由經塗佈上述絕緣膜形成用組 成物而形成塗膜之後,再對塗膜施行加熱而獲得。 當將本發明之絕緣膜形成用組成物塗佈於矽晶圓、S i 〇2 晶圓、S i N晶圓等基材之際,可採取旋塗法、浸潰法、輥 塗法、喷塗法等塗佈手段。 此時的膜厚係所形成乾燥膜厚,在1次塗佈時的厚度為 0.05〜2.5//m程度,在2次塗佈時的厚度為0.1〜5.0#m程 度的塗膜。然後,藉由在常溫進行乾燥,或在8 0〜6 0 0 °C程 45 312XP/發明說明書(補件)/94-05/94101151 1292349 度的溫度中,通常加熱5〜2 4 0分鐘程度而乾燥,藉此便可 形成玻璃質或巨高分子塗膜。 此時的加熱方法可使用加熱板、烤箱、高溫爐等,而加 熱環境則可在大氣壓下、氮環境、氬環境、真空下、經控 制氧濃度的減壓下等環境中實施。 再者,為控制上述塗膜的硬化速度,配合需要,可施行 階段式加熱,或選擇氮、空氣、氧、減壓等環境。
再者,本發明亦可將絕緣膜形成用組成物塗佈於基板 上,並在高能量線照射下加熱至3 0〜4 5 0 °C 。 依此所獲得本發明的二氧化矽系絕緣膜,係膜密度通常 為 0.35〜1.2g/cm3,最好 0.4〜l.lg/cm3,尤以 0.5〜1.0g/cm3 為佳。若膜密度未滿0 . 3 5 g / c m3,塗膜的機械強度將降低, 反之,若超過1 . 2 g / c m3,將無法獲得低介電常數。此外, 本發明的絕緣膜介電常數,通常為 3. 2〜1 . 2,最好為 3 · 0〜1 . 5,尤以2 · 7〜1 · 8為佳。 本發明聚合物膜的特徵在於膜構造中具有多數個矽-碳 鍵結。藉由此特徵便可使絕緣性、塗佈膜均勻性、介電率 特性、塗膜彈性率、塗膜密接性均優越。 本發明的聚合物膜,因為低介電常數、耐龜裂性、機械 強度及密接性均優越,因而頗適用於L S I、系統L S I、D R A Μ、 SDRAM、RDRAM、D-RDRAM 等半導體元件用層間系絕緣膜、 或蝕刻終止膜、半導體元件表面被覆膜等的保護膜、使用 多層光阻的半導體製作步驟之中間層、多層配線基板的層 間絕緣膜、液晶表示元件用保護膜或絕緣膜等等用途方面。 46 312XP/發明說明書(補件)/94-05/94101151 1292349 4.實施例 以下,針對本發明舉實施例進行更具體的説明。惟,本 發明並不僅限於以下實施例。另外,實施例與比較例中的 「份」及「%」,在無特別說明的情況下,分別指「重量份」 及「重量%」。 4. 1 .評估方法 各種評估係依下述方法進行。
4.1.1.聚合物之重量平均分子量(Mw) 依下述條件並利用凝膠滲透層析儀(G P C )法進行測定。 試料:將四氫呋喃使用為溶劑,並將聚合物(水解縮合 物)1 g溶解於1 0 0 c c的四氫呋喃中而調製得。 標準聚苯乙烯:使用美國布雷佳化學公司製的標準聚苯 乙嫦。 裝置:美國渥達斯公司製的高溫高速凝膠滲透層析儀 (型號 150-C ALC/GPC) 管柱:昭和電工(股)製SHODEX A-80M(長度5 0 cm) 測定溫度:4 0 °C 流速:1 c c /分 4. 1 . 2.介電常數 對所獲得聚合物膜利用蒸鍍法形成鋁電極圖案,而製成 介電常數測定用樣本。針對該樣本,依頻率 1 0 0 k Η z的頻 率,採用横河·修雷得帕佳德(股)製、Η Ρ 1 6 4 5 1 Β電極及 Η Ρ 4 2 8 4 Α介電分析儀,利用C V法測定室溫中的該塗膜介電 常數。 47 312XP/發明說明書(補件)/94-05/94101151 1292349 4 · 1 . 3 ·機械強度(彈性率•硬度) 採用奈米壓痕機XP (納能因工業公司製),利用連續剛性 測定法測定所獲得絕緣膜。 4 . 1 . 4.密接性
在所獲得絕緣膜上,利用濺鍍法形成S i 0 2膜4 0 0 n m,並 裁剪為適當大小,在此晶圓片上將相同大小的空白矽晶 圓,使用環氧樹脂進行黏著,並在烤箱中利用1 3 5 °C進行2 小時加熱。將其採用晶割機切成小片,分別利用4點彎曲 密接力測定法施行剝落試驗。結果,如下所示。 A :每平方公尺的密接能在3. 0焦耳以上 B :每平方公尺的密接能未滿3 . 0焦耳 4. 1 . 5.確認膜有無相分離 針對絕緣膜截面,採用聚焦離子束法加工成觀察用,並 採用T E Μ依1 8 0 0 0倍調查外觀。判斷結果如下示。 A :經截面形狀觀察,獲得均勻塗膜。 B :在塗膜上發現海島狀區域相分離。 4 · 2 · ( A )聚碳矽烷之合成例 4 . 2 . 1 .合成例1 將安裝有溫度計、冷卻冷凝器、點滴漏斗及攪拌裝置, 且内容量3 L的四口燒瓶内以氬氣置換後,裝填入乾燥四氫 呋喃1 L、與金屬鎂6 0 g,並利用氬氣施行發泡。將其在2 0 °C進行攪拌的情況下,由點滴漏斗徐緩添加氣甲基二曱基 氣矽烷1 4 3 g與氯曱基曱基二氣矽烷8 2 g之混合物。 經點滴結束之後,於4 5 °C中再持續攪拌3小時。將此反 48 312XP/發明說明書(補件)/94-05/94101151 1292349
應系的上澄液添加於,在乾燥四氫呋喃 3 0 0 ml中懸浮 L i A 1 Η 41 0 g的溶液中,並在室溫下進行反應5小時。 其次,將反應混合物注入於1 5 L冰水中,而使生成聚 物沈殿。將生成聚合物利用水進行充分的洗淨,並經真 乾燥而獲得褐色固體聚合物(1 ) 6 5 g。 依此所獲得聚合物的重量平均分子量為1 1,0 0 0。 4 . 2 . 2 .合成例2 將安裝有溫度計、冷卻冷凝器、點滴漏斗及攪拌裝置 且内容量3 L的四口燒瓶内以氬氣置換後,裝填入乾燥四 呋喃1 L、與金屬鎂6 0 g,並利用氬氣施行發泡。將其在 °C進行攪拌的情況下,由點滴漏斗徐緩添加氯曱基二曱 氯矽烷7 2 g與氣甲基曱基二氯矽烷1 6 3 g之混合物。 經點滴結束之後,於4 5 °C中再持續攪拌3小時。將此 應系的上澄液添加於,在乾燥四氫呋喃 3 0 0 m 1中懸浮 L i A 1 Η 41 0 g的溶液中,並在室溫下進行反應5小時。 其次,將反應混合物注入於1 5 L冰水中,而使生成聚 物沈殿。將生成聚合物利用水進行充分的洗淨,並經真 乾燥而獲得褐色固體聚合物(2 ) 6 8 g。 依此所獲得聚合物的重量平均分子量為4,0 0 0。 4 . 2 . 3 .合成例3 將安裝有溫度計、冷卻冷凝器、點滴漏斗及攪拌裝置 且内容量3 L的四口燒瓶内以氬氣置換後,裝填入乾燥四 呋喃1 L、與金屬鎂6 0 g,並利用氬氣施行發泡。將其在 °C進行攪拌的情況下,由點滴漏斗徐緩添加氯甲基三氯 著 合 空 氫 20 基 反 著 合 空 氫 20 矽 312XP/發明說明書(補件)/94-05/94101151 49 1292349
烷7 9 g。經點滴結束後,在4 51:中更持續攪拌3小時 此反應系統進行過濾而去除無機鹽,並將濾液施行減 縮、真空乾燥。 其次,將此反應生成物添加於已裝填甲苯 2 0 0 g與 胺 1 9 0 g 的四口燒瓶内,更從點滴漏斗徐缓添加 15 0ml。經點滴結束後,在室溫中更施行攪拌2小時。 玻璃過濾器去除所生成的鹽,藉由對濾液施行減壓濃 真空乾燥,而獲得白色固體聚合物(3 ) 5 2 g。 依此所獲得聚合物的重量平均分子量為7,1 0 0。 4 . 2 . 4 .合成例4 將安裝有溫度計、冷卻冷凝器、點滴漏斗及攪拌裝 且内容量4 L的四口燒瓶内以氬氣置換後,裝填入乾燥 呋喃1 . 5 L、與金屬鎂7 1 g,並利用氬氣施行發泡。將 2 0 °C進行攪拌的情況下,由點滴漏斗徐緩添加氯甲基 氧基矽烷5 0 0 g。 經點滴結束之後,於0 °C中再持續攪拌1 2小時。在 應液中添加己烷之後,利用矽藻土進行過濾,經真空 對濾液施行真空乾燥而完全去除有機溶劑,便獲得褐 體聚合物(4 ) 4 1 4 g。 依此所獲得聚合物(4 )的重量平均分子量為4 2 0。 4. 3.實施例,比較例 4 . 3 . 1 .實施例1 在石英製可分離燒瓶中,將合成例 1 所獲得聚 (1)5. 0g、甲基三曱氧基矽烷22g、四乙氧基矽烷28g 〇對 壓濃 三乙 曱醇 利用 縮、 置, 四氫 其在 三乙 此反 烤箱 色固 合物 、及 312XP/發明說明書(補件)/94-05/94101151 50
1292349 三乙胺Ο . Ο Ο 2 9 g溶解於曱醇2 4 9 g中之後,並利用攪拌機 行擭:拌,使溶液溫度穩定於 5 5 °C 。其次,將離子交換 5 〇 . 1 g與丙二醇單***2 0 2 g的混合溶液,歷時1小時添 於溶液中。然後,在5 5 °C中進行反應4小時之後,添加 酸的1 0 %丙二醇單丙醚溶液1 0 g,更進行反應3 0分鐘, 後將反應液冷卻至室溫。在5 0 °C中,從反應液中將甲醇 含水溶液2 9 9 g利用蒸發器去除,便獲得反應液A。依此 獲得縮合物的重量平均分子量為2 2,0 0 0。 4 . 3 · 2 ·實施例2 在石英製可分離燒瓶中,將合成例 2所獲得聚合 (2)5.0g與甲基三曱氧基矽烷 51g溶解於曱醇 252g中 後,並利用攪拌機進行攪拌,使溶液溫度穩定於5 5 °C。 次,將離子交換水50.2g、丙二醇單***200g、及氫氧 四曱鈹2 5 %水溶液Ο . Ο 1 1 2 g之混合溶液,歷時1小時添 於溶液中。然後,在5 5 °C中進行反應4小時之後,添加 酸的1 0 %丙二醇單丙醚溶液1 0 g,更進行反應3 0分鐘, 後將反應液冷卻至室溫。在5 0 °C中,從反應液中將甲醇 含水溶液2 9 8 g利用蒸發器去除,便獲得反應液B。依此 獲得縮合物的重量平均分子量為1 2,0 0 0。 4 . 3 . 3 .實施例3 在石英製可分離燒瓶中,將合成例 1 所獲得聚合 (l)5.0g及四乙氧基矽烷50g溶解於曱醇250g中之後, 用攪拌機進行攪拌,並使溶液溫度穩定於5 5 °C。其次, 離子交換水5 0 . 3 g、丙二醇單***2 Ο 1 g、及曱胺4 0 %水 312XP/發明說明書(補件)/94-05/94101151 進 水 加 醋 狄 與 所 物 之 其 化 加 醋 與 所 物 利 將 溶 51
1292349 液Ο . Ο Ο 8 0 g的混合溶液,歷時1小時添加於溶液中。穷 在5 5 °C中進行反應4小時之後,再添加醋酸的1 0 %丙 單丙醚溶液1 0 g,更進行反應3 0分鐘,再使反應液冷 室溫。 從反應液中,於5 0 °C中利用蒸發器去除曱醇與含水 2 9 8 g便獲得反應液C。依此所獲得縮合物的重量平均 量為 26, 000 。 4 . 3 . 4 ·實施例4 在石英製可分離燒瓶中,將合成例 2 所獲得聚 (2) 5. 0g >四乙氧基矽烷51g、及三乙胺0.0029g溶解 醇2 5 0 g中之後,再利用攪拌機進行攪拌,並使溶液溫 定於55 °C。其次,將離子交換水50. 0g與丙二醇單*** 的混合溶液,歷時1小時添加於溶液中。 然後,在5 5 °C中進行反應4小時之後,添加草酸# 丙二醇單丙醚溶液1 〇 g,更進行反應3 0分鐘,再將反 冷卻至室溫。從反應液中,於5 0 °C中利用蒸發器去除 與含水溶液2 9 7 g,便獲得反應液D。依此所獲得縮合 重量平均分子量為1 5,0 0 0。 4 . 3 . 5 .實施例5 在石英製可分離燒瓶中,將合成例 3 所獲得聚 (3) 4. 6 g '甲基三甲氧基石夕烧53g、及三乙胺0.0054g 於甲醇2 4 6 g中之後,再利用攪拌機進行攪拌,並將溶 度穩定於5 5 °C。其次,將離子交換水5 1 . 4 g與丙二醇 醚2 0 1 g的混合溶液,歷時1小時添加於溶液中。 312XP/發明說明書(補件)/94-05/94101151 後, 二醇 卻至 溶液 分子 合物 於甲 度穩 201g 1 0°/〇 應液 甲醇 物的 合物 溶解 液溫 單乙 52 1292349 然後,在5 5 °C中進行反應4小時之後,添加醋酸的1 Ο % 丙二醇單丙醚溶液1 0 g,更進行反應3 0分鐘,將反應液冷 卻至室溫。從反應液中,於5 0 °C中利用蒸發器去除曱醇與 含水溶液2 7 9 g,便獲得反應液E。依此所獲得縮合物的重 量平均分子量為1 9,0 0 0。 4 . 3 . 6 .實施例6
將實施例1中所獲得反應液A,利用0 . 2 // m孔徑的鐵弗 龍(註冊商標)製之過濾器施行過濾,便獲得本發明的絕緣 膜形成用組成物。 將所獲得組成物利用旋塗法塗佈於矽晶圓上,然後在加 熱板上於9 0 °C施行3分鐘加熱,其次,於氮環境下於2 0 0 °C中施行3分鐘而使基板乾燥,更在4 0 0 °C的氮環境下, 利用加熱板對基板施行6 0分鐘的燒成。經燒成後所獲得聚 合物膜(以下稱「二氧化矽系膜」),如4. 1 .的評估方法進 行評估。評估結果如表1所示。 4 · 3 · 7 ·實施例 7 - 1 0 除在實施例 6中,分別使用反應液B、C、D、E之外, 其餘均如同實施例 6般的形成二氧化矽系膜,並施行評 估。評估結果如表1所示。 4 . 3 . 8 .比較例1 除將合成例1中所獲得聚合物(1 ) 1 · 0 g溶解於丙二醇單 丙醚4. 0 g的反應液F,使用為塗佈溶液之外,其餘均如同 實施例6般的形成二氧化矽系膜,並施行評估。評估結果 如表1所示。 53 312XP/發明說明書(補件)/94-05/94101151 1292349 4 . 3 . 9 .比較例2
在石英製可分離燒瓶中,裝填入蒸餾乙醇4 3 0 g、離子交 換水2 1 1 g、及2 5 %氫氧化四曱銨水溶液1 5 . 2 g,並均勻攪 拌。在此溶液中添加曱基三甲氧基矽烷4 0 · 0 g與四乙氧基 矽烷6 1 . 1 g的混合物。在將溶液保持於6 0 °C的狀態下,進 行反應2小時。在此溶液中添加丙二醇單丙醚3 0 0 g之後, 然後採用5 0 °C的蒸發器,將溶液濃縮至2 0 % (換算為完全水 解縮合物)之後,添加順丁烯二酸的1 0 %丙二醇單丙醚溶液 2 0 g,便獲得反應液G。除使用此反應液G之外,其餘均如 同實施例6般的形成二氧化矽系膜,並施行評估。評估結 果如表1所示。 4 . 3 . 1 0 .比較例3 將由式-[Si(CH3)(H)-CH2]-所示重複單位構成,重量平 均分子量 2 0,0 0 0之聚碳石夕烧的丙二醇單丙醚2 5 %溶液(以 下稱「反應液 J」),與比較例 2的反應液 E,調製成依 J : E = 2 : 8重量比進行混合的混合液,便獲得反應液F。除使 用此反應液F之外,其餘均如同實施例6般的形成二氧化 矽系膜,並施行評估。評估結果合併表示於表1。 4 . 3 . 1 1 .比較例4 將合成例 4所獲得聚合物(4 ) 9 g、曱基三甲氧基矽烷 30 .Og、及四甲氧基矽烷3. 4g混合於四氫呋喃60ml中,將 此混合液形成0 °C之後,再徐緩添加0 . 0 1 N硝酸3 7 m 1,並 進行反應3 0分鐘。其次,昇溫至7 0 °C並在進行1 6小時迴 流情況下產生反應。接著,將反應液放置冷卻,經利用二 54 312XP/發明說明書(補件)/94-05/94101151 1292349 *** 2 5 0 m 1稀釋之後,再利用蒸餾水洗淨 3〜4次直到 ρ Η 變為中性。在此溶液中添加丙二醇單丙醚2 Ο 0 g,然後使用 5 Ot的蒸發器,施行濃縮直到溶液變為2 0 % (換算成完全水 解縮合物)為止,然後,添加順丁烯二酸的1 0 %丙二醇單丙 醚溶液2 0 g,便獲得反應液I。除使用此反應液I之外,其 餘均如同實施例6般的形成二氧化石夕系膜,並施行評估。 評估結果如表1所示。
【表1】
反應液 塗膜處理條件 膜厚 [//m] 介電常數 彈性率 [Gpa] 硬度 [Gpa] 密接性 TEM觀察 實施例6 A 加熱燒成 0.50 2.46 8. 9 0· 9 A A 實施例7 B 加熱燒成 0.50 2. 55 8. 7 1. 0 A A 實施例8 C 加熱燒成 0. 50 2. 59 8.8 0.8 A A 實施例9 D 加熱燒成 0.50 2.91 9.6 1.0 A A 實施例10 E 加熱燒成 0.50 2.62 9.3 0. 9 A A 比較例1 F 加熱燒成 0.50 2.92 7.4 0.6 A A 比較例2 G 加熱燒成 0.50 2.86 7.2 0.7 B A 比較例3 Η 加熱燒成 0.50 2. 90 8. 1 0.6 A B 比較例4 I 加熱燒成 0.50 3. 10 9. 1 0· 9 B A 55 312XP/發明說明!:(補件)/94-05/94101151
Claims (1)
- 1292349 十、申請專利範圍: 1 . 一種聚合物之製造方法,係包含有: 在1種以上的(A )聚碳矽烷存在下,使(B ) 烷單體進行水解縮合; 上述(A )聚碳矽烷中之至少1種係下述聚j (I)使下述一般式(1)所示化合物,在驗金 屬中至少其中一者之存在下進行反應而獲得 子量500以上之聚碳矽烷(I): R'.Ya-.S i CR2nX3-n ……(1 ) (式中,R1、R2係相同或互異,分別為1 $ 原子;X係指鹵原子;Y係指鹵原子或烷氧1 之整數,m與η係相同或互異,為0〜2之整; 2.如申請專利範圍第1項之聚合物之製造 上述(A )聚碳矽烷之另一種係將上述聚碳矽:)? 有機溶劑中與醇或有機酸進行反應而獲得的 (II)。 3. 如申請專利範圍第2項之聚合物之製造 上述(A )聚碳矽烷之再另一種係將上述聚碳石j 聚碳矽烷(II)中至少其中一者更進一步在有 原劑進行反應而獲得的聚碳矽烷(I I I )。 4. 如申請專利範圍第1項之聚合物之製造 上述(B )含水解性基矽烷單體係從下述一般^ 物與下述一般式(3 )所示化合物的組群中至5 矽烷化合物; 312XP/發明說明書(補件)/94-05/94101151 含水解性基秒 复矽烷(I ): 屬與鹼土族金 的重量平均分 ^有機基或氫 ^ ; k係指0〜3 tt ) ° 方法,其中, L ( I )進一步在 聚碳矽烷 方法,其中, 7烷(I )與上述 機溶劑中與還 方法,其中, u ( 2 )所示化合 >選擇1種的 56 1292349 R 3 a S i X 4 - a ...... (2) (式中,R3係指氫原子、氟原子或1價有機基;X係指齒 原子或烧氧基;a係指0〜3之整數); R4bY3-bSi -(R6)d - SiZ3-cR5c ……(3) (式中,R4、R5係相同或互異,分別為1價有機基;b與 c係相同或互異,為0〜2之整數;R6係指氧原子、伸苯基 或- (CH2)e-所示之基(其中,e係指1〜6之整數);Y與Z係 相同或互異,為鹵原子或烷氧基;d係指0或1 )。5.如申請專利範圍第2項之聚合物之製造方法,其中, 上述(B)含水解性基矽烷單體係從下述一般式(2 )所示化合 物與下述一般式(3 )所示化合物的組群中至少選擇1種的 矽烷化合物; R3aSiX4-a ……(2) (式中,R3係指氫原子、氟原子或1價有機基;X係指鹵 原子或烷氧基;a係指0〜3之整數); R4bY3-bSi~(R6)d-SiZ3-cR5c ……(3) (式中,R4、R5係相同或互異,分別為1價有機基;b與 c係相同或互異,為0〜2之整數;R6係祚氧原子、伸苯基 或- (CH2)e-所示之基(其中,e係指1〜6之整數);Y與Z係 相同或互異,為鹵原子或烷氧基;d係指0或1 )。 6 .如申請專利範圍第3項之聚合物之製造方法,其中, 上述(B)含水解性基矽烷單體係從下述一般式(2 )所示化合 物與下述一般式(3 )所示化合物的組群中至少選擇1種的 矽烷化合物; 57 312XP/發明說明書(補件)/94-05/94101151 1292349 R3aSiX4-a ……(2) (式中,R3係指氫原子、氟原子或1價有機基;X係指鹵 原子或烷氧基;a係指0〜3之整數); R4bY3-bSi-(R6)d-SiZ3-cR5c ……(3) (式中,R4、R5係相同或互異,分別為1價有機基;b與 c係相同或互異,為0〜2之整數;R6係指氧原子、伸苯基 或-(C Η 2) e -所示之基(其中,e係指1〜6之整數),;Y與Z係 相同或互異,為鹵原子或烷氧基;d係指0或1 )。7. —種聚合物,係依照申請專利範圍第1至6項中任一 項之聚合物之製造方法而獲得。 8 . —種絕緣膜形成用組成物,係含有申請專利範圍第7 項之聚合物及有機溶劑。 9. 一種絕緣膜之製造方法,係包含:將申請專利範圍第8 項之絕緣膜形成用組成物塗佈於基板上,並加熱至3 0〜4 5 0 °C 。 1 0 . —種二氧化矽系絕緣膜,係依照申請專利範圍第7 項之絕緣膜之製造方法而獲得。 1 1 . 一種二氧化矽系絕緣膜,係依照申請專利範圍第8 項之絕緣膜之製造方法而獲得。 1 2 . —種二氧化矽系絕緣膜,係依照申請專利範圍第9 項之絕緣膜之製造方法而獲得。 58 312XP/發明說明書(補件)/94-05/94101151
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TWI292349B true TWI292349B (zh) | 2008-01-11 |
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TW094101152A TWI265172B (en) | 2004-01-16 | 2005-01-14 | and method for forming the same Composition for forming insulating film, method for producing the same, silica-based insulating film |
TW094101151A TW200536621A (en) | 2004-01-16 | 2005-01-14 | Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film |
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TW094101152A TWI265172B (en) | 2004-01-16 | 2005-01-14 | and method for forming the same Composition for forming insulating film, method for producing the same, silica-based insulating film |
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US (2) | US20070015892A1 (zh) |
EP (2) | EP1705206A4 (zh) |
JP (2) | JP5013045B2 (zh) |
KR (2) | KR20060123549A (zh) |
TW (2) | TWI265172B (zh) |
WO (2) | WO2005068539A1 (zh) |
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TW200538491A (en) * | 2004-01-16 | 2005-12-01 | Jsr Corp | The composition of forming insulating film and the method of producing insulating film |
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- 2005-01-14 WO PCT/JP2005/000373 patent/WO2005068539A1/ja active Application Filing
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Also Published As
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US20070015892A1 (en) | 2007-01-18 |
TW200536621A (en) | 2005-11-16 |
EP1705206A1 (en) | 2006-09-27 |
WO2005068539A1 (ja) | 2005-07-28 |
JPWO2005068538A1 (ja) | 2007-12-27 |
KR20060123548A (ko) | 2006-12-01 |
JPWO2005068539A1 (ja) | 2007-12-27 |
US20070021580A1 (en) | 2007-01-25 |
EP1705207A4 (en) | 2009-06-24 |
KR101129875B1 (ko) | 2012-03-28 |
EP1705206A4 (en) | 2009-06-24 |
JP5013045B2 (ja) | 2012-08-29 |
EP1705207A1 (en) | 2006-09-27 |
KR20060123549A (ko) | 2006-12-01 |
JP5110243B2 (ja) | 2012-12-26 |
TWI265172B (en) | 2006-11-01 |
EP1705207B1 (en) | 2012-10-24 |
TW200538490A (en) | 2005-12-01 |
WO2005068538A1 (ja) | 2005-07-28 |
US7528207B2 (en) | 2009-05-05 |
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