TWI285216B - Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure - Google Patents
Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure Download PDFInfo
- Publication number
- TWI285216B TWI285216B TW90109925A TW90109925A TWI285216B TW I285216 B TWI285216 B TW I285216B TW 90109925 A TW90109925 A TW 90109925A TW 90109925 A TW90109925 A TW 90109925A TW I285216 B TWI285216 B TW I285216B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive layer
- circuit
- electrodes
- connection
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 84
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims description 10
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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Description
1285216 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明(1 ) [技術領域】 本發明係關於電路連接用黏著劑及使用該黏著劑之電 路連接方法以及電路連接結構體。 [先行技術】 以往,液晶顯示器與TCP或FPC之連接,TCP或FPC 與印刷電路板之連接係使用於黏著劑中分散有導電性粒子 之各向異性導電黏著劑。而且,最近將半導體矽晶片構裝 於基板時,亦已不用銲線法,而係將半導體矽晶片面朝下 地直接構裝於基板,進行所謂的覆晶(flipchip)構裝,此時 亦開始採用各向異性黏著劑(曰本專利特開昭59 120436 號、特開昭60-191228號、特開平號、特開平 7-90237號公報)。 然而,以往之各向異性導電黏著劑對於各種基板之黏 著力不足,無法獲致充分之連接可靠性。尤其,為了降低 連接時對基板的傷害或位置的偏移以及提高生產效率,對 於連接溫度之低溫化及連接時間之縮短化等需求無法獲致 充分之可靠性。 本發明係提供達成連接溫度之低溫化、連接時間之縮 短化的電路連接用黏著劑,及使用該黏著劑之電路連接方 法以及使用該方法之電路連接結構體。 [發明概要] 本發明之第一形態係(1)介於具有相向之電路電極的 基板間,對具有相向之電路電極之基板加壓,而於加壓# 向的電極間作電連接之電路連接用黏著劑,其特徵為上^ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 312588 --------------------tr---------線 (請先閱讀背面之注意事項再填寫本頁) A7
1285216 五、發明說明(2 ) 黏著劑含有酸當量為5至500(KOH毫克/克)之化合物。 (2) 提供上述(1)中所記載之電路連接用黏著劑,其令酸 當量為5至500(KOH毫克/克)之化合物係含有至少一個羧 基的化合物。 (3) 提供上述(1)或(2)中所記載之電路連接用黏著劑, 其中進而含有自由基聚合性物質。 (4) 提供上述(1)至(3)中任一項所記載之電路連接用黏 著劑,其中進而含有導電粒子。 (5) 使電路連接用黏著劑介於具有相向之電路電極的 基板間’對具有相向之電路電極的基板加壓,於加壓方向 之電極間作電連接的連接結構,其中上述電路連接用黏著 劑係上述(1)至(4)中任一項所記載之黏著劑。 本發明之第二形態係(6)介於具有相向之電路電極的 基板間,對具有相向之電路電極之基板加壓,而於加壓方 向之電極間作電連接之電路連接用黏著劑,其特徵為上述 黏著劑具有第一黏著劑層及第二黏著劑層,而第一黏著劑 層之加壓連接後的玻璃轉移溫度(Tg)高於第二黏著劑層之 加壓連接後的Tg。 (7) 提供如上述(6)所記載之電路連接用黏著劑,其中第 一黏著劑層之連接後的Tg為50至200°C,而第二黏著劑 層之連接後的Tg為40至1〇〇。(:,且第一黏著劑層之Tg 較第二黏著劑層之連接後的Tg高5°C以上。 (8) 提供上述(6)或(7)所記載之電路連接用黏著劑,其 中第一黏著劑層以及第二黏著劑層之至少一層含有導電粒 --------訂---------線 (請先閱讀背面之注咅?事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 x 297公釐) 2 312588 1285216 A7 --------B7 _____ 五、發明說明(3 ) 子。 (9) 提供上述(6)至(8)中任一項所記載之電路連接用黏 (請先閱讀背面之注意事項再填寫本頁) 著劑,其中第一黏著劑層、第二黏著劑層之至少一層含有 自由基聚合性物質。 (10) 提供上述(6)至(9)中任一項所記載之電路連接用 黏著劑,其中第一黏著劑層與第二黏著劑層的厚度比為, 第一黏著劑層之厚度/第二黏著劑層之厚度=0.3至3.0。 (11) 提供上述(6)至(1〇)中所記載之電路連接用黏著 劑,其中第一黏著劑層以及第二黏著劑層之至少一層含有 酸當量為5至500(KOH毫克/克)之化合物。 經濟部智慧財產局員工消費合作社印製 (12) 提供使上述(6)至(π)中任一項所記載之電路連接 用黏著劑介於具有相向之電路電極的基板間,對具有相向 之電路電極的基板加壓,於加壓方向之電極間作電連接的 方法’其中上述電路連接用黏著劑具有第一黏著劑層及第 二黏著劑層,第一黏著劑層之加壓連接後的Tg高於第二 黏著劑層之加壓連接後的Tg,而且Tg較高之第一黏著劑 層係配置於具有相向電路電極之基板中彈性率較高之基板 側而連接之電路連接方法。 (13) 提供使上述(6)至(11)中任一項所記載之電路連 接用黏著劑介於具有相向之電路電極的基板間,對具有相 向之電路電極的基板加壓,於加壓方向之電極間作電連接 的連接結構,其中上述黏著劑具有第一黏著劑層及第二黏 著劑層’第一黏著劑層之加愿連接後的Tg高於第二黏著 劑層之加壓連接後的Tg,而且Tg較高之第一黏著劑層係 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 3 312588 1285216 . , Α7 -------_Β7_ 五、發明說明(4 )
配置於具有相向電路電極之基板中彈性率較高的基板侧而 連接之連接結構Q
[發明之最佳實施形態] (請先閱讀背面之注音?事項再填寫本頁) 本發明之電路連接用黏著劑以及使用該黏著劑之電路 連接方法及電路連接結構體中,在耐濕試驗、冷熱循環試 驗等各種可靠性試驗後,亦無基板脫落、剝離的發生,故 不起黏著力之下降或連接電阻之上升,呈現優良之連接可 靠性。 經濟部智慧財產局員工消費合作社印製 於本發明之第一形態中,可使用以氫氧化鉀滴定法測 定之酸當量在5至500(KOH毫克/克)之範圍的化合物,尤 以使用含有羧基之化合物為佳。酸當量若在5以下則不見 黏著力之提升’而若大到超過5〇〇則因黏著劑之吸水率變 大,故耐濕可靠性降低。含有羧基之化合物只要係分子内 含有羧基之化合物即無特殊限制。而且重量平均分子量亦 無特殊限制,但以小於15000,000之化合物為佳。分子量 右大於1,0 0 0,0 0 〇則黏著劑之流動性下降。含有鲮基之化 合物的具體例者,可以列舉草酸、丙二酸等羧酸、聚丁二 烯、聚乙烯醇縮丁酸、(甲基)丙烯酸系樹脂、聚酰亞胺、 聚酰胺、聚苯乙烯、聚乙烯醇縮甲醛樹脂、聚酯樹脂、二 甲苯樹脂、苯氧基樹脂、聚氨酯樹脂、尿素樹脂等聚合物 中導入有羧基之化合物。於聚合物中導入羧基時,可將含 有羧基之化合物用作共聚成分,亦可於聚合物合成以後將 叛基導入。本發明中所用的聚合物中導入有叛基之化合物 其配合量係以1至80重量%為佳,5至70重量%尤佳。不 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4 312588 1285216 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(5 ) 足1重量%時黏著性差,超過80重量%則流動性下降。 本發明所使用之含有羧基之化合物以外者可使用苯乙 稀-丁二稀-苯乙稀共聚物、苯乙烯-異戊二浠_苯乙稀共聚物 等熱可塑性樹脂、及環氧樹脂、(甲基)丙烯酸系樹脂、馬 來酰亞胺樹脂、檸康酰亞胺樹脂、降冰片浠酰亞胺樹脂、 酚類樹脂等熱硬化性樹脂,而從耐熱性或可靠性之觀點係 以使用熱硬化性樹脂為佳,尤其是使用(甲基)丙烯酸系樹 脂、馬來酰亞胺樹脂、檸康酰亞胺樹脂、降冰片烯酰亞胺 樹脂的自由基聚合系,從低溫硬化性之觀點係為較佳者。 本發明之第二形態中的電路連接用黏著劑,係由第一 黏著劑層以及第二黏著劑層所構成,其中第一黏著劑層之 連接後的Tg必須高於第二黏著劑層之連接後的Tg。第一 黏著劑層之Tg係以50至200°C為佳,以60至1 50°c為更 佳。並且,第二黏著劑層之Tg在40至1〇〇 °C,第一黏著 劑層之Tg以較第二黏著劑層之連接後的Tg高5°c以上為 佳,更以高10°C以上為特佳。 而且’第一黏著劑層與第二黏著劑層之厚度比係為第 一黏著劑層之厚度/第二黏著劑層之厚度=〇3至3 〇,而以 在0.8至3.0為佳。該範圍以外之厚度經耐濕試驗,冷熱 循環試驗等各種可靠性試驗後,有發生從基板脫落、剝離 而無法獲致優良的連接可靠性之傾向。 再者本發明在使用上述二層構造之黏著劑層作相向的 基板之電路電極的電連接時,係以將Tg較高之第一黏著 劑層配置於相向的基板之彈性率較高的基板側為佳。 --------------------訂---------^-1 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格⑵G χ 297公爱) 5 312588 1285216 經濟部智慧財產局員工消費合作社印製 A7 —----------- 五、發明說明(6 ) 上述熱可塑性樹脂或熱硬化性樹脂均可用作為本發明 所使用之第一黏著劑層或第二黏著劑層,而從耐熱性及可 靠性之觀點係以使用熱硬化性樹脂為佳,尤其是使用(甲基) 丙烯酸系樹脂、馬來酰亞胺樹脂、檸康酰亞胺樹脂、降冰 片烯酰亞胺樹脂的自由基聚合系,從低溫硬化性之觀點係 為較佳。 (甲基)丙烯酸系樹脂可由(甲基)丙烯酸酯類之自由基 聚合而得,有(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(f 基)丙烯酸異丙酯、(甲基)丙烯酸異丁酯、乙二醇二(甲基) 丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三羥甲基丙烷三 (甲基)丙烯酸酯、四亞甲基二醇四(甲基)丙烯酸酯、2_羥基 -1,3-一丙烯酰氧基丙烷、2,2_雙[4_(丙烯酰氧基甲氧基)苯 基】丙烷、2,2-雙[4-(丙烯酰氧基乙氧基)苯基]丙烷、二環戊 烯基(甲基)丙烯酸酯、三環癸烷基(甲基)丙稀酸酯、參(丙 烯酰氧基乙基)異氰酸酯、氨酯(甲基)丙烯酸酯等,可以單 獨或以二種以上混合使用。並且必要時氫醌、甲基醚氫醌 等自由基聚合抑制劑可於無損硬化性之範圍内加以使用。 進而,在使用具有磷酸酯構造之自由基聚合性物質 時,可提升對金屬等無機物之黏著力。具有磷酸酯構造之 自由基聚合性物質之使用量,相對於黏著劑組成物之總量 係在〇·1至10重量份,而以0 5至5重量份為較佳。具有 磷酸酯構造之自由基聚合性物質可得自磷酸酐與2_羥基乙 基(甲基)丙烯酸酯之反應產物。具體而言有單(2_甲基丙烯 酰氧基乙基)酸式磷酸鹽、二(2_甲基丙烯酰氧基乙基式 (請先閱讀背面之注意事項再填寫本頁) IT'--------- 本紙張尺度義中國國家標準(CNS) A4規格⑽X 297公餐) 6 312588 1285216 經濟部智慧財產局員工消費合作社印製 A7 __B7_____ 五、發明說明(7 ) 磷酸鹽等,可以單獨或混合使用。 馬來酰亞胺樹脂係分子中具有至少一個馬來酰亞胺基 之樹脂,例如苯基馬來酰亞胺、1-甲基_2,4-雙馬來酰亞胺 苯、N,N’-鄰亞苯基雙馬來酰亞胺、n,N,-對亞甲基雙馬來 酰亞胺、N,N’-4,4-亞聯苯基雙馬來酰亞胺、n,N,-4,4-(3,3-二甲基亞聯苯基)雙馬來酰亞胺、N,N,-4,4-(3,3-二甲基二苯 基甲烷)雙馬來酰亞胺、N,N,-4,4-(3,3-二乙基二苯基甲烷) 雙馬來酰亞胺、N,N、4,4-二苯基甲烷雙馬來酰亞胺、 1^,14’-4,4-二苯基丙烷雙馬來酰亞胺、^,]^,-4,4-二苯基醚雙 馬來酰亞胺、N,N’-4,4-二苯基楓雙馬來酰亞胺、2,2_雙(4-(4-馬來酰亞胺)苯基)丙烧、2,2-雙(3-二級丁基_3,4-(4-馬來 酰亞胺苯氧基)苯基)丙烷、1,1_雙(4-(4-馬來酰亞胺苯氧基) 苯基)癸烷、4,4’-亞環己基雙(1-(4-馬來酰亞胺苯氧基卜2-環己基苯、2,2-雙(4-(4-馬來酰亞胺苯氧基)苯基)六氟丙烷 等,可以單獨或者二種以上混合使用。 檸康酰亞胺樹脂係於分子中具有至少一個檸康酰亞胺 基之檸康酰亞胺化合物的聚合物,檸康酰亞胺化合物者有 例如苯基檸康酰亞胺、1-甲基雙檸康酰亞胺苯、N,N,_ 鄰亞苯基雙檸康醜亞胺、N,N,_對亞苯基雙檸康酰亞胺、 队1^’-4,4-亞聯苯基雙檸康酰亞胺、:^,]^,_4,4_(3,3_二甲基亞 聯苯基)雙檸康酰亞胺、N,N’-4,4-(3,3-二甲基二苯基甲炫) 雙棒康醜亞胺、Ν,Ν’-4,4·(3,3-二乙基二苯基甲烷)雙檸康酰 亞胺、Ν,Ν’-4,4-二苯基甲烷雙檸康酰亞胺、Ν,Ν,-4,4•二苯 基丙烷雙檸康酰亞胺、Ν,Ν’-4,4-二苯基醚雙檸康酰亞胺、 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公餐^ ----- 7 312588 -----------------^—1T-----------^ (請先閱讀背面之注意事項再填寫本頁) 1285216 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(8) N,N’-4,4-二苯基楓雙擰康酰亞胺、2,2-雙(4-(4-擰康酰亞胺 苯氧基)苯基)丙烷、2,2-雙(3-二級丁基-3,4_(仁檸康酰亞胺 苯氧基)苯基)丙烷、1,1-雙(4,4(檸康酰亞胺苯氧基)苯基) 癸烷、4,4’-亞環己基-雙(1-(4-檸康酰亞胺苯氧基)苯氧 基)-2-環己基苯、2,2-雙(4-(4-檸康酰亞胺苯氧基)苯基)六 氟丙烷等,可以單獨或二種以上混合使用。 降冰片烯酰亞胺樹脂係分子中具有至少一個降冰片稀 酰亞胺基之降冰片烯酰亞胺化合物之聚合物’降冰片烯酰 亞胺化合物者有例如苯基降冰片烯酰亞胺、1-甲基-2,4-雙 降冰片烯酰亞胺苯、Ν,Ν,-鄰亞苯基雙降冰片烯酰亞胺、 Ν,Ν’-對亞苯基雙降冰片烯酰亞胺、Ν,Ν’-4,4-亞聯苯基雙降 冰片烯酰亞胺、Ν,Ν’-4,4-(3,3-二甲基亞聯苯基)雙降冰片烯 酰亞胺、Ν,Ν’-4,4-(3,3-二甲基二苯基甲烷)雙降冰片烯酰亞 胺、队1^’-4,4-(3,3-二乙基二苯基甲烷)雙降冰片烯酰亞胺、 Ν,Ν’-4,4-二苯基甲烷雙降冰片烯酰亞胺、Ν,Ν’-4,4-二苯基 丙烷雙降冰片烯酰亞胺、Ν,Ν’-4,4-二苯基醚雙降冰片烯醜 亞胺、Ν,Ν’-4,4-二苯基楓雙降冰片烯酰亞胺、2,2-雙(4-(4-降冰片烯酰亞胺苯氧基)苯基)丙烷、2,2-雙(3-二級丁基― 3,4-(4-降冰片烯酰亞胺苯氧基)苯基)丙烷、1,1-雙(4-(4-降 冰片烯酰亞胺苯氧基)苯基)癸烷、4,4’-亞環己基-雙(1-(4-降冰片烷酰亞胺苯氧基)苯氧基)-2_環己基苯、2,2-雙(4-(4-降冰片烯酰亞胺苯氧基)苯基)六氟丙烷等,可以單獨或二 種以上混合使用。 使用上述自由基聚合性化合物時,可使用聚合啟始 度適用中國國家標準(CNS)A4規格(210 X 297公釐) 312588 --------------------tr----------^ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1285216 • · A7 '----------------- 五、發明說明(9 ) "" ---- 劑。聚合啟始劑只要是以熱或光能產生自由基之化 無特殊限制,有過氣仆R 即 ,磓軋化物、偶氮化合物等,可考慮目標之 接/皿度、連接時間、儲存安定性等而適當選擇。從高 應|±及儲存t定性之觀點係以半衰期1〇小時之溫度在4〇 ^以上,且半衰期1分鐘之溫度在180°C以下的有機過氧 ,物為佳,而以半衰期10 *時之溫度在50°c以上,且半 衰期1分鐘之溫度在17(rc以下之有機過氧化物為特佳。 連接時間為10秒時為得充分之反應率,硬化劑之配合量, 相對於黏著劑組成物之總量,係以〗至20重量%為佳以 2至15重量%為特佳。本發明使用之有機過氧化物的具體 化合物可選自二酰基過氧化物、過氧二碳酸酯、過氧酯類、 過氧縮酮、二烷基過氧化物、氫過氧化物、矽烷基過氧化 物等,而過氧酯類、二烷基過氧化物、氫過氧化物、矽烷 基過氧化物,特佳者為啟始劑中之氣離子或有機酸在 5,000ppm以下,加熱分解後所產生之有機酸少而可抑制對 電路構件之連接終端的腐蝕者。 二酰基過氧化物類可列舉異丁基過氧化物、2,4-二氣 苯甲酰基過氧化物、3,5,5-三甲基己酰基過氧化物、辛酰基 過氧化物、月桂酰基過氧化物、硬脂酰基過氧化物、琥珀 酰基過氧化物、苯f酰基過氧化甲苯、苯甲酰基過氧化物 過氧二碳酸酯類可列舉二正丙基過氧二碳酸酯、二異 丙基過氧二碳酸酯、雙(4-三級丁基環己基)過氧二碳酸 酯、二-2·乙氧基甲氧基過氧二碳酸酯、二(2-乙基己基過氧 --------------------訂---------線 ί請先閱讀背面之注咅?事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 9 312588 經濟部智慧財產局員工消費合作社印製 1285216 Α7 五、發明說明(1G) 基)二碳酸酯、二甲氧基丁基過氧二礙酸酯、二(3-甲基-3-甲乳基丁基過氧基)二碳酸酿等。 過氧酯類可列舉異丙苯基過氧化新癸酸酯、1,1,3,3-四甲基丁基過氧化新癸酸醋、b環己基甲基乙基過氧化 新癸酸癱、三級己基過氡化新癸酸酯、三級丁基過氧化三 甲基醋酸酯、1,1,3,3-四甲基丁基過氧化_2_乙基己酸酯、 2一甲基2,5· 一(2-乙基己酸基過氧基)己燒、1_環己基-1-甲基乙基過氧化_2_乙基己酸酯、三級己基過氧化·2_乙基己 酸酯、三級丁基過氧化_2_乙基己酸酯、三級丁基過氧化異 丁酸SI ' 1,1·雙(三級丁基過氧基)環己炫、三級己基過氧化 異丙基單碳酸酯、三級丁基過氧化_3 5 5_三甲基己酸酯、 三級丁基過氧化月桂酸酯、25•二甲基·25二(間甲基苯甲 酰基過氧基)己院、三級丁基過氧化異丙基單碳酸醋、三級 丁基過氧化·2·乙基己基單碳酸醋、三級己基過氧化苯甲酸 酉曰、二級丁基過氧化醋酸g旨等。 過氧縮酮類可列舉M-雙(三級己基過氧基)_3,35_三 甲基環己烷、1,1-雙(三級己基過氧基)環己烷、Μ雙(三級 丁基過氧基)·3’3,5-三甲基環己烧、(三級丁基過氧基) 環十二烷、2,2-雙(三級丁基過氧基)癸烷等。 二烷基過氧化物類可列舉α,α’_雙(三級丁基過氧基) 二異丙基苯、二異丙苯基過氧化物、25·二甲基·2 $二(二 級丁基過氧基)己燒、三級丁基異丙苯基過氧化物等。一 氫過氧化物類可列舉二異丙基苯氫過氧化物、異丙苯 氳過氧化物等。 Λ (請先閱讀背面之注意事項再填寫本頁) f 矿---------炎秦 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 10 312588 1285216 經濟部智慧財產局員工消費合作社印製 A7 Β7 五、發明說明(11 ) 矽烷基過氧化物類可列舉三級丁基三甲基矽烷基過氧 化物、雙(三級丁基)二甲基矽烷基過氧化物、三級丁基三 乙烯基矽烷基過氧化物、雙(三級丁基)二乙烯基矽烷基過 氧化物、參(三級丁基)二乙烯基過氧化物、三級丁基三烯 丙基矽烷基過氧化物、雙(三級丁基)二烯丙基矽烷基過氧 化物、參(三級丁基)烯丙基矽烧基過氧化物等。 該等有機過氧化物者,為了抑制電路構件之連接終端 之腐姓或電路電極之腐钱’在硬化劑中或有機過氧化物中 所含有之氣離子或有機酸之量以在5,000ppm以下為佳, 並且以加熱分解後所產生之有機酸少者為更佳。而且,為 提升所製作之電路連接材料的安定性,以在室溫(25。〇常 壓下開放放置24小時後重量保持率在20重量%以上者為 佳。該等可適當混合使用。 該等游離自由基產生劑可以單獨或混合使用,亦可與 分解促進劑、抑制劑等混合使用。 並且,將該等硬化劑以聚氨酯系、聚酯系高分子物質 等被覆而微膠囊化者,因可用時間得以延長故而較佳。 自由基聚合系以外之熱硬化性樹脂有環氧樹脂,環氧 樹脂有雙酚A型環氧樹脂、雙酚F型環氧樹脂雙心型 環氧樹脂、酚系清漆型環氧樹脂、甲酚清漆型環氧樹脂、 雙紛a清漆型環氧樹mF清漆型環氧樹腊、磨環式 環氧樹脂、縮水甘油_型環氧樹鹿、縮水甘油胺型環 脂、己内酰脲型環氣樹磨、異氰尿竣_型環氧樹鹿 族鏈狀環氧樹磨等’該等環氧樹塘亦可予以由 本紙張尺度適用中國國家標準(CNS)A4規格⑵〇 x 297公髮) 312588 (請先閱讀背面之注意事項再填寫本頁) --------訂---------線* 11 1285216 A7 B7 五、發明說明(12) 加氳。該等環氧樹脂亦可以二種以上併用。 (請先閱讀背面之注意事項再填寫本頁) 並且,上述環氧樹脂之硬化劑有胺類、酚類、酸酐類、 咪嗤類、雙氰胺類等通常用作環氧樹脂硬化劑者。再者, 作為硬化促進劑者可適當使用通常所用之三級胺類、有機 磷系化合物。 而且’使環氧樹脂反應之方法除上述硬化劑之使用以 外,亦可使用毓鹽、碘鎗鹽等做陽離子聚合。 經濟部智慧財產局員工消費合作社印製 本發明之電路連接用黏著劑,為了賦予成膜性、黏著 性、硬化時之應力鬆弛性,而使用聚乙烯醇縮丁醛樹脂、 聚乙稀醇縮甲酸樹脂、聚醋樹脂、聚醜胺樹脂、聚醜亞胺 樹脂、二甲苯樹脂、苯氧基樹脂、聚氨酯樹鹿、尿素樹脂 等聚合物成分。該等聚合物成分以重量平均分子量在 10,000至10,000,000者為佳。並且,該等樹脂亦可利用自 由基聚合性官能基做改質,如此耐熱性可提升。再者,該 等樹脂若含羧基時,可用作本發明之含有羧基的化合物。 聚合物成分之配合量,相對於黏著劑組成物之總量,係在 2至80重量%,以5至70重量%為佳,以1〇至60重量% 為特佳。若不足2重量%,則應力鬆弛或黏著力不充分, 若超過80重量%,剛流動性變差。 本發明之電路連接用黏著劑亦可添加適當之填充劑、 軟化劑、促進劑、老化防化劑、著色劑、阻燃劑、耗合劑。 本發明所用之電路連接用黏著劑中,即使不含導電粒 子,連接時藉由相向電極之直接接觸亦得以連接,但含有 導電粒子時可得更加安定之連接。作為導電粒子者可以 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 12 312588 1285216 A7 B7 五、發明說明(13) 用八11、八容、;^1、0:11、銲料等金屬粒子或碳、破璃、陶竟、 或塑膠等非導電粒子於表面被覆有AU、Ag、麵等貴金屬 類的粒子。使用金屬粒子時為抑制其表面之氧化係以經 貝金屬類被覆者為佳。上料電粒子中,以㈣ 而以Au、Ag等被覆之粒子或熱熔融金屬粒子連接時藉 由加熱加壓而變形,接觸面積增加而可靠性提升。貴金屬 類被覆層的厚度若在1()()埃以上’較佳在3⑽埃以上則 可得良好之連接。而且’亦可進而使用將上述導電粒子以 絕緣性樹鹿被覆者。導電粒子相對於黏著劑成分刚體積 %,占0.1至30體積〇/〇,更佳者為〇」至1〇體積%,可依 用途於以上範圍内適當配合。 而且,於第一形態中,本發明之電路連接用黏著劑亦 可為’硬化物時之Tg(玻璃轉移溫度)相差5<t以上的二種 以上之層所構成之多層構造。 再者,於第二形態中,係以在第一黏著劑層及第二黏 著劑層之至少一層中含有酸當量在5至500(KOH毫克/克) 之化合物為佳。 使用本發明之電路連接用黏著劑黏著之基板,只要是 已形成有電連接所需電極者即無特殊限制,有液晶顯示器 所使用之形成有ITO等電極之玻璃或塑膠基板,印刷電路 板、陶瓷電路板、軟性電路板、半導體硬晶片等,必要時 可组合使用。 使用上述基板而做連接時,作為本發明第二形態中的 電路連接用黏著劑者,以將Tg較高之第一黏著劑層配置 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 312588 (請先閱讀背面之注意事項再填寫本頁) --------訂---------線* 經濟部智慧財產局員工消費合作社印製 13 1285216 A7 B7 五、發明說明(14) 於彈性率較高之基板側為佳。藉此可更進一步減少脫落之 發生。 (請先閱讀背面之注意事項再填寫本頁) 連接時之條件並無特殊限制,連接溫度為90至250 °C,連接時間為1秒至1 〇分鐘,可依照使用之用途、黏著 劑、基板等作適當選擇’必要時亦可進行後硬化處理。並 且,連接時係藉加熱加壓而進行,而必要除了熱以外之其 它能源,例如光、超音波、電磁波等亦可使用。 [實施例] 以下藉由實施例更加具體地說明本發明,惟本發明之 範圍並非僅限於該實施例。 依以下配方分別配合,使用簡易塗布機(測試器產業公 司製)塗布於厚度50微米之單面經表面處理之pet(聚對苯 二甲酸乙二醇酯)薄膜,利用70°C,5分鐘之熱風乾燥製作 薄膜。 (氨酯丙烯酸酯之合成) 經濟部智慧財產局員工消費合作社印製 將重量平均分子量800之聚己内酯二醇400重量份, 2 -經基丙基丙稀酸酯131重量份,作為催化劑之二丁基錫 二月桂酯0·5重量份,及作為聚合抑制劑之氳醌單甲基醚 1·〇重量份一面攪拌一面於50 °C加熱混合。其次滴入異佛 爾酮二異氰酸酯222重量份後,一面攪拌一面升溫至8〇t 進行氨酯化反應。確認NCO之反應率已達99%以上後,降 低反應溫度而得氨酯丙烯酸酯。 使用上述氨酯丙稀酸酯作為自由基聚合性物質。並 且,使用羧酸改質之縮丁醛樹脂(6000 EP ;電氣化學工業 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 14 312588 1285216 A7 B7 五、發明說明(15) 股份有限公司製商品名,酸當量2 50(KOH毫克/克))以及苯 氧基樹脂(PKHC ;聯合碳化公司製商品名,重量平均分子 量45,000)作為薄膜形成材料。 使用二級己基過氧化-2 -乙基己酸醋之5〇重量 %DOP(酞酸二辛酯)溶液作為可藉由加熱產生游離自由基 之硬化劑。 使用以聚苯乙烯為核心,於其粒子表面設有厚度〇 2 微米之鎳層,於該鎳層之外側設有厚度〇 04微米之金層而 製作的平均粒徑4微米的導電粒子作為導電粒子。 實施例1 以固體成分重量比為:經羧酸改質之縮丁醛樹脂(以固 體成分計)20公克,苯氧基樹脂(以固體成分計)3〇公克, 氨酯丙烯酸酯49公克,磷酸酯型丙烯酸酯(共榮社油脂股 份有限公司製,商品名P2M)1公克,三級己基過氧化_2-乙基己酸酯5公克(以DOP溶液計為1 〇公克)予以配合, 再配合分散導電粒子3體積%,塗布、乾燥得黏著劑層之 厚度為8微米之電路連接材料。 (電路連接結構體之製作) 將上述電路連接材料做成1.5毫米寬之長條,於形成 有ΙΤΟ作為電極之玻璃基板上,以80°C,5秒,1百萬帕 之條件做臨時連接。將PET基材剝離,於此將TCP之電極 對準安置,以150°C,20秒,4百萬帕做正式連接。 實施例2 以固趙成分重量比為:經叛酸改質之縮丁搭樹脂(以固 (請先閱讀背面之注音?事項再填寫本頁) --------訂---------線泰 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公餐) 15 312588 1285216 A7 B7 五、發明說明(16) 體成分計)30公克,苯氧基樹脂(以固體成分計)30公克, 氨酯丙烯酸酯39公克,磷酸酯型丙烯酸酯(共榮社油脂股 份有限公司製,商品名P2M) 1公克,三級己基過氧化-2-乙基己酸酯5公克(以DOP溶液計為1 〇公克)予以配合, 再配合分散導電粒子3體積%,塗布、乾燥得黏著劑層之 厚度為8微米之電路連接材料。 (電路連接結構體之製作) 將上述電路連接材料做成1·5毫米寬之長條,於形成 有ΙΤΟ作為電極之玻璃基板上,以8〇乞,5秒,1百萬帕 之條件做臨時連接。將PET基材剝離,於此將TCP之電極 對準安置,以15(TC,20秒,4百萬帕做正式連接。 實施例3 以固體成分重量比為:經羧酸改質之縮丁醛樹脂(以固 體成分計)1〇公克,苯氧基樹脂(以固體成分計)35公克, 氨酯丙烯酸酯54公克,璘酸酯型丙烯酸酯(共榮社油脂股 份有限公司製,商品名P2M)1公克,三級己基過氧化2-乙基己酸醋5公克(以D0P溶液計貝,】為1〇公克)予以配人, 經濟部智慧財產局員工消費合作社印製 再配合分散導電粒子3體積% ’塗布、乾燥得黏著劑層之 厚度為8微米之電路連接材料。 (電路連接結構體之製作) 將上述電路連接材料做成15毫 宅木寬之長條,於形成 有ITO作為電極之玻璃基板上,以 ,5秒,1石莖喊 之條件做臨時連接。將PET基材剝離 ^ ^ ^ ^ 何利離,於此將TCP之雷極 對準女置,以15〇t,20秒,4百萬帕 電極 ______ 禺帕之條件做正式連接。 k紙張尺度適用中國國家標準(CNS)A4規格⑽x297公复「 16 (請先閱讀背面之注意事項再填寫本頁) 312588 1285216 A7 B7 &«部智慧財產局員工消費合作社印製 五、發明說明(17) 比較例1 以固體成分重量比為··苯氧基樹脂(以固體成分計)45 公克,氨酯丙烯酸酯54公克,磷酸酯型丙稀酸酿(共榮社 油脂股份有限公司製,商品名P2M) 1公克,三級己基過 氧化-2-乙基己酸醋5公克(以DOP溶液計則為1〇公克)予 以配合’再配合分敎導電粒子3體積%,得黏著劑層之厚 度為8微米之電路連接材料。 (電路連接結構體之製作) 將上述電路連接材料做成1.5毫米寬之長條,於形成 有ITO作為電極之玻璃基板上,以8〇〇c,$秒,1百萬帕 之條件做臨時連接。將PET基材剝離,於此將pCT之電極 對準安置,以150X:,20秒,4百萬帕做正式連接。 (特性評估方法) (υ連接電阻:使用先準測試(股)製之多元測試值TR 6848,以!毫安培之固定電流測定鄰接電路間之電阻。 (2)黏著強度:依據JISz_〇237進行,使用東洋精機 製作所(股)製之ST〇ROGRAPHE-S,以9〇度剝離做測定。 剝離Ο)#連包接部份之觀察··以金屬顯微鏡觀察連接部份有無 。可靠性評估··關於上述連接電阻,黏著力,以8〇 C、95%RH之條件進行高溫高濕試驗,於240小時後取屮 做項目(1)至(3)之試驗。 ®, 其測定結果示於表1。
本紙張尺度翻巾關緖 (210 X 297 公釐) 17 312588 (請先閱讀背面之注意事項再填寫本頁) -------訂---------線赢 項目 +連接電 阻(Ω)— 黏著力(N/m) 連接都份之外觀 初期 耐濕試 驗240 小時後 初期 耐濕試 驗240 小時後 初期 耐濕試 驗240 小時後 實施例1 2 2.2 1150 1000 良好 良好 實施例2 2.2 2.3 [Ύΐ90~ 1180 良好 良好 實施例3 2.1 卜2.4 1030 1030 良好 良好 比較例1 2.6 5.3 760 350 良好 發生脫落 1285216 A7 五、發明說明(18) [表1] 本發明之實施例1至3,在連接電阻、黏著力、連接 部份之外觀均顯示良好的特性,耐濕試驗後亦顯示良好的 可靠性。相對於此,使用酸當量不及5(Κ0ΪΙ毫克/克)之化 合物的比較例’其黏著力之初期值低,而且,在耐濕試驗 後連接電阻變高,黏著力變低,發生剝落而連接可靠性差。 實施例4 (第一黏著劑層) 使用二輕甲基三環癸烧二丙烯酸酯以及上述氨酯丙稀 酸酯作為自由基聚合性物質。 使用苯氧基樹脂(PKHC ;聯合碳化公司製商品名,重 量平均分子量45,000)作為薄膜形成材料。 使用三級己基過氧化-2-乙基己酸酯之50重量 %DOP(駄酸二辛酯)溶液作為藉由加熱產生游離自由基之 硬化劑。 於聚苯乙烯為核心之粒子表面設置厚度〇·2微米之鎳 層,於該鎳層之外侧設置厚度0.04微米之金層,製作平均 粒徑4微米之導電粒子。 以固體成份之重量比為:苯氧基樹脂(以固體成分 (請先閱讀背面之注意事項再填寫本頁) --------訂---------線表 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 18 312588 1285216 A7 五、發明說明(19 ) rtt先閱讀背面之注音?事項再填寫本頁) 計)50公克,二羥甲基三環癸烷丙烯酸酯30公克,氨_内 烯酸酯19公克,磷酸酯型丙烯酸酯(共榮社油脂股份有限 公司製商品名;P2M)1公克,三級己基過氧化_2·乙基己酸 酯5公克(以DOP溶液計則為1〇公克)予以配合,再配合 分散3體積%之導電粒子,塗布、乾燥得黏著劑層厚度為容 微米之電路連接材料(硬化物之Tg為not)。 (第二黏著劑層) 使用氨酯丙烯酸酯作為自由基聚合性物質。 使用苯氧基樹脂(PKHC ;聯合碳化公司製商品名,重 量平均分子量45,000)作為薄膜形成材料。 使用三級己基過氧化-2_乙基己酸酯之50重量 %DOP(酞酸二辛酯)溶液作為藉由加熱產生游離自由基之 硬化劑。 於聚苯乙烯為核心的粒子表面設置厚度〇·2微米之絲 層,於該鎳層之外側設置厚度為〇·〇4微米之金層,製作平 均粒徑4微米之導電粒子。 經濟部智慧財產局員工消費合作社印製 以固體成分之重量比為:苯氧基樹脂(以固體成分 計)50公克,二羥甲基三環癸烷丙烯酸酯1〇公克,上述所 合成之氨酯丙烯酸酯39公克,磷酸酯型丙烯酸酯(共榮社 油脂股份有限公司製商品名;Ρ2Μ) 1公克,三級己基過氧 基-2-乙基己酸酯5公克(以DOP溶液計則為1〇公克)予以 配合,再配合分散3體積%之導電粒子,塗布、乾燥得勘 著劑層厚度為18微米之電路連接材料(硬化物之Tg為60 〇C)。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 19 312588 1285216 A7 B7 五、發明說明(20) 將第一黏著劑層及第二黏著劑層用輥筒積層機貼合成 二層構造之電路連接用黏著劑。 (請先閱讀背面之注意事項再填寫本頁) (第一黏著劑層) 除黏著劑層之厚度為12微米之外,以與實施例4之第 一黏著劑層同樣方法獲得電路連接材料(硬化物之Tg為 110〇C ) 〇 (第—黏著劑層) 除黏著劑層之厚度為1 5微米之外,以與實施例4之第 二黏著劑層同樣方法獲得電路連接材料(硬化物之Tg為60 。。)。 將第一黏著劑層及第二黏著劑層用輥筒積層機貼合成 二層構造之電路連接用黏著劑。 實施例6 (第一黏著劑層) 除黏著劑層之厚度為18微米之外,以與實施例4之第 經濟部智慧財產局員工消費合作社印製 一黏著劑層同樣方法獲得電路連接用材料(硬化物之Tg為 110〇C )。 (第二黏著劑層) 除黏著劑層之厚度為14微米以外,以與實施例4之第 二黏著劑層同樣方法獲得電路連接用材料(硬化物之Tg為 60°C ) ° 將第一黏著劑層及第二黏著劑層用輥筒積層機貼合成 二層構造之電路連接用黏著劑。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 20 312588 1285216 A7 B7 五、發明說明(21) (第一黏著劑層) 使用苯氧基樹脂(PKHC ;聯合碳化公司製商品名,重 量平均分子量45,000)作為薄膜形成材料。 使用三級己基過氧基-2-乙基己酸酯之5〇重量 %D〇P(酞酸二辛酯)溶液作為可藉由加熱產生游離自由基 之硬化劑。 以聚苯乙稀為核心之粒子,於基表面設置厚度〇 2微 米之鎳層,於該鎳層之外側設置厚度〇 〇4微米之金層,製 作平均粒徑4微米之導電粒子。 以固體成分之重量比為:苯氧基樹脂(以固體成分 計)40公克,二羥甲基三環癸烷二丙烯酸酯2()公克,氨酯 丙烯酸酯39公克,磷酸酯型丙烯酸酯(共榮社油脂股份有 限公司製商品名;P2M) 1公克,三級己基過氧化-乙基 己酸酯5公克(以DOP溶液計則為10公克)予以配合,再 配合分散3體積%之導電粒子,經塗布、乾燥得黏著劑層 厚度為8微米之電路連接用材料(硬化物之Tg為68。〇。 (第二黏著劑層) 利用本氧基樹脂(PKHC ;聯合碳化公司製商品名,重 量平均分子量45,000)以及經羧酸改質之缩丁醛樹脂(6〇〇〇 EP,電氣化學工業股份有限公司製商品名,酸當量 250(KOH毫克/克))作為薄膜形成材料。 利用二級己基過氧化-2-乙基己酸酿之50重量 %DOP(駄酸二辛酯)溶液作為可藉由加熱產生游離自由基 (請先閱讀背面之注音?事項再填寫本頁) 訂---------線秦 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 21 312588 1285216 A7 B7 五、發明說明(22) 之硬化劑。 以聚苯乙烯為核心之粒子,於其表面設置厚度0·2微 米之鎳層’於該鎳層之外側設置厚度為0.04微米之金層, 製作平均粒徑4微米之導電粒子。 以固體成分之重量比為:苯氧基樹脂(以固體成分 計)3〇公克,經羧酸改質之縮丁醛樹脂(以固體成分計)2〇 公克’二羥甲基三環癸烷二丙烯酸酯10公克,上述所合成 之氨醋丙烯酸酯39公克,磷酸酯型丙烯酸酯(共榮社油脂 股份有限公司製,商品名Ρ2Μ)1公克,三級己基過氧化· 2-乙基己酸酯5公克(以DOP溶液計為1〇公克)予以配合, 再配合分散3體積%之導電粒子,經塗布、乾燥得黏著劑 層厚度為18微米之電路連接材料(硬化物之Tg為52。〇。 將第一黏著劑層及第二黏著劑層用輥筒積層機貼合成 層構造之電路連接用黏著劑。 比較例2 僅使用實施例4之第一黏著劑層,獲得黏著劑層厚度 為25微米的電路連接材料(硬化物之Tg為11〇。〇。 比較例3 僅使用實施例4之第二黏著劑層,獲得黏著劑層厚度 為25微米的電路連接材料(硬化物之Tg為60 °C)。 (連接結構之製作) 將上述二層構造的電路連接用黏著劑做成15毫米寬 之長條,於形成有ITO作為電極之玻璃基板上(彈性率較高 之基板侧),將Tg較高之第一黏著劑層配置於玻璃側,於 (請先閱讀背面之注音?事項再填寫本頁) **♦ --------訂---------. 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公釐) 22 312588 1285216
五、發明說明(23) 〇C $秒,1百萬帕之條件下做臨時連接。其後,將pet 基材剝離,使IT0之電極與TCP之電極的位置對準,於 14〇°C ’ 20秒,4百萬帕做正式連接。 另外,將實施例4之二層構造黏著劑,以Tg較低之 第二黏著劑層配置於玻璃側,以相同條件連接,作為本發 明之參考例。而且,比較例2及3之電路連接用黏著劑亦 與上述同樣進行而製得。 (特性評估方法) 與實施例1至3及比較例1同樣地進行。 特性評估結果示於表2。 [表2] 連接電 阻(Ω) 黏著力(N/m) $接部份之外觀 項目 初期 耐濕試 驗240 小時後 初期 耐濕試 驗240 小時後 初期 耐濕試 驗240 小時後 脣施例4 2.1 2.3 1200 1100 良好 良好 ¥施例5 2.2 2.5 1050 1000 良好 良好 實施例6 2.4 2.8 1250 1180 良好 實施例7 2.5 2.9 1000 970 良好 良好 比較例2 2.2 2.2 1100 950 良好 發生脫落 比較 2.2 10 1250 450 良好 發生脫落 參考例 2Λ 4.6 1100 650 良好 發生脫落 實施例4至7之任一例均具有連接電阻、黏著力,以 及外觀之良好結果,顯示良好的連接可靠性。 相對於此,單層構造之比較例2及3中,Tg為ii(TC 之比較例2 ’在耐濕試驗後雖亦無連接電阻之變化而保持 良妤,但黏著力有所下降而發生脫落。並且,Tg為較低之 60°C的比較例3,在耐濕試驗240小時後發現有連接電阻 (請先閱讀背面之注意事項再填寫本頁) ^ J I n ·ϋ ϋ 言 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 23 312588 1285216 . , A7 --------B7____ 五、發明說明(24) 之上升,黏著力亦降低。而且連接部份也發生脫落。 另一方面,因為若將Tg較低之第二黏著劑層配置於 玻璃基板側則有發生脫落之情形,在本發明中係以將 較高之第一黏著劑層配置於玻璃基板侧為佳。 [產業上之利用可能性] 根據本發明之第一形態可提高初期及耐濕試驗後之黏 著力並且了和1供能達成連接溫度低溫化,連接時間縮短 化的電路連接用黏著劑,以及使用該黏著劑之電路連接結 構體。 並且’本發明第二形態中的電路連接用黏著劑及使用 該黏著劑之電路連接方法、電路連接結構體,可提供對應 連接溫度之低溫化及連接時間之縮短化,能在l4(rc以2〇 秒作連接,且在連接後之耐濕試驗中亦無剝離脫落之發 生’顯示優良連接可靠性之電路連接結構體。 (請先閱讀背面之注意事項再填寫本頁) tr--------- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) 24 312588
Claims (1)
1285216 竹
第90109925號專利申請案 申請專利範圍修正本 1 一種雷Hm (92年6月17日) •:電路連接用黏著劑’係介於具有相向之電路電極的 ,對具有相向之電路電極的基板加壓,而於加壓 方向的電極間作電連接之電路連接用黏著劑其特徵為 上述黏著劑中含有酸當量45至5〇〇(k〇h毫克/克)之化 合物。 2·如申請專利範圍第1項之電路連接用黏著劑,其中酸當 量為5至500(K〇H毫克/克)之化合物係含有至少一個= 基之化合物。 3·如申請專利範圍第1項之電路連接用黏著劑,其中進而 含有自由基聚合性物質。 4·如申請專利範圍第1項至第3項中任一項之電路連接用 黏著劑,其中進而含有導電粒子。 經濟部中央標準局員工福利委員會印製 5· —種電路連接結構體,係使電路連接用黏著劑介於具有 相向之電路電極的基板間,對具有相向之電路電極的基 板加壓,而於加壓方向的電極間作電連接之連接結構, 其中上述電路連接用黏著劑係如申請專利範圍第1項 至第3項中任一項之黏著劑。 6· —種電路連接用黏著劑,係介於具有相向之電路電極的 基板間,對具有相向之電路電極的基板加壓,而於加壓 方向的電極間作電連接之電路連接用黏著劑,其特徵為 上述黏著劑於厚度方向具有第一黏著劑層及第二黏著 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1 312588 1285216
劑層之二層者,而第一黏著劑層之加壓 <楼後的破璃棘 移溫度(Tg)高於第二黏著劑層之加壓連接後的丁轻 7·如申請專利範圍第6項之電路連接用黏著劑,其g中第一 黏著劑層之連接後的Tg為50至200,曾一 卑一黏著劑層 之連接後的Tg為4(^10(rc,且第一黏著劑層之τ 較第二黏著劑層之連接後的Tg高5°C以上。 g 8·如申請專利範圍第6項之電路連接用黏著劑,其中第一 黏著劑層、第二黏著劑層中至少一層含有導電粒子。 9·如申請專利範圍第6項至第8射任—項之電路連接用 黏著劑,其中第一黏著劑層、第二黏著劑層中至少一層 含有自由基聚合性物質。 10·如申請專利範圍第6項至第8項中任一項之電路連接用 黏著劑,其中第一黏著劑層與第二黏著劑層的厚度比 為,第一黏著劑層之厚度/第二黏著劑層之厚度=〇3至 3.0 〇 經濟部中央標準局員工福利委員會印製 11.如申請專利範圍第6項至第8項中任一項之電路連接用 黏著劑,其中第一黏著劑層及第二黏著劑層中至少一層 含有酸當量為5至500(KOH毫克/克)之化合物。 12·—種電路連接方法,係使如申請專利範圍第6項至第? 項中任一項之電路連接用黏著劑介於具有相向之電路 電極的基板間,對具有相向之電路電極的基板加壓,於 加壓方向之電極間作電連接的方法,其特徵為上述電路 連接用黏著劑具有第一黏著劑層及第二黏著劑層,而第 一黏著劑層之加壓連接後的Tg高於第二黏著劑層之加 本紙張尺度適用中國國家標準(CNS) A4規格(21〇χ297公釐) 2 312588 1285216 H3 壓連接後的Tg,且Tg較高之第一黏著劑層係配置於具 有相向之電路電極的基板中彈性率較高的基板侧而連 接。 13·—種連接結構,係使如申請專利範圍第6項至第8項中 任一項之電路連接用黏著劑介於具有相向之電路電極 的基板間,對具有相向之電路電極的基板加壓,於加壓 方向之電極間作電連接之連接結構,其特徵為上述黏著 劑具有第一黏著劑層及第二黏著劑層,而第一黏著劑層 之加壓連接後的Tg高於第二黏著劑層之加壓連接後的 Tg,且Tg較高之第一黏著劑層係配置於具有相向之電 路電極的基板中彈性率較高之基板側而連接。 經濟部中央標準局員工福利委員會印製 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 3 312588
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JP (2) | JP3915512B2 (zh) |
KR (1) | KR100463558B1 (zh) |
CN (1) | CN1214455C (zh) |
AU (1) | AU2001252557A1 (zh) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI748105B (zh) * | 2017-06-07 | 2021-12-01 | 日商昭和電工材料股份有限公司 | 半導體用膜狀接著劑、半導體裝置的製造方法及半導體裝置 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007169632A (ja) * | 2000-04-25 | 2007-07-05 | Hitachi Chem Co Ltd | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
KR100463558B1 (ko) * | 2000-04-25 | 2004-12-29 | 히다치 가세고교 가부시끼가이샤 | 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP2005320455A (ja) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
US7224075B2 (en) * | 2004-08-13 | 2007-05-29 | Intel Corporation | Methods and systems for attaching die in stacked-die packages |
JP4555943B2 (ja) * | 2004-10-29 | 2010-10-06 | 日立化成工業株式会社 | 異方導電フィルム、異方導電フィルムの製造方法、これを用いた接続体および半導体装置 |
JP4760070B2 (ja) * | 2005-03-16 | 2011-08-31 | 日立化成工業株式会社 | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
KR101081671B1 (ko) * | 2005-03-16 | 2011-11-09 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조체 및 반도체 장치 |
JP2007091959A (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
US20100178501A1 (en) * | 2006-01-23 | 2010-07-15 | Takashi Masuko | Adhesive composition, film-like adhesive, adhesive sheet, and semiconductor device made with the same |
CN104087194B (zh) * | 2006-04-26 | 2016-04-27 | 日立化成株式会社 | 粘接带及使用其的太阳能电池模块 |
CN101794638B (zh) * | 2006-07-21 | 2012-06-06 | 日立化成工业株式会社 | 电路连接材料、电路部件的连接结构及电路部件的连接方法 |
ATE540426T1 (de) | 2006-07-21 | 2012-01-15 | Hitachi Chemical Co Ltd | Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements |
EP2048209A4 (en) * | 2006-08-04 | 2012-01-18 | Hitachi Chemical Co Ltd | ADHESIVE COMPOSITION AND CONNECTION STRUCTURE FOR CIRCUIT ELEMENT |
JP2008111091A (ja) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
JP5181220B2 (ja) * | 2007-04-19 | 2013-04-10 | 日立化成株式会社 | 回路接続用接着フィルム、接続構造体及びその製造方法 |
JP5192194B2 (ja) * | 2007-07-26 | 2013-05-08 | デクセリアルズ株式会社 | 接着フィルム |
CN102977798B (zh) * | 2007-09-05 | 2015-04-29 | 日立化成株式会社 | 粘接剂以及使用该粘接剂的连接结构体 |
EP2206756A1 (en) * | 2007-10-29 | 2010-07-14 | Hitachi Chemical Company, Ltd. | Circuit connecting material, connection structure and method for producing the same |
TWI456707B (zh) * | 2008-01-28 | 2014-10-11 | Renesas Electronics Corp | 半導體裝置及其製造方法 |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
JP2010100840A (ja) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
JP5668636B2 (ja) * | 2010-08-24 | 2015-02-12 | 日立化成株式会社 | 回路接続構造体の製造方法 |
CN102737752B (zh) * | 2011-03-30 | 2016-06-29 | 株式会社田村制作所 | 各向异性导电糊以及使用该导电糊的电子部件的连接方法 |
JP2012057161A (ja) * | 2011-09-21 | 2012-03-22 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP2013093245A (ja) * | 2011-10-26 | 2013-05-16 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
JP2013206765A (ja) * | 2012-03-29 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | ダイボンド用導電性ペースト及び該導電性ペーストによるダイボンド方法 |
JP6302666B2 (ja) * | 2013-12-25 | 2018-03-28 | ヘンケルジャパン株式会社 | ラミネート用接着剤 |
TWI667276B (zh) * | 2014-05-29 | 2019-08-01 | 美商羅傑斯公司 | 具改良耐燃劑系統之電路物質及由其形成之物件 |
US10233365B2 (en) | 2015-11-25 | 2019-03-19 | Rogers Corporation | Bond ply materials and circuit assemblies formed therefrom |
WO2018151131A1 (ja) * | 2017-02-17 | 2018-08-23 | 日立化成株式会社 | 接着剤フィルム |
WO2019123180A1 (en) | 2017-12-21 | 2019-06-27 | 3M Innovative Properties Company | Adhesive articles including a cushion layer and a continuous shell layer |
CN112424308A (zh) * | 2018-09-10 | 2021-02-26 | 昭和电工株式会社 | 粘接片 |
CN116801484B (zh) * | 2023-08-11 | 2024-03-08 | 荣耀终端有限公司 | 一种单板及其制备方法、电子设备 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5929302A (ja) * | 1982-08-10 | 1984-02-16 | サンユレジン株式会社 | 導電性樹脂組成物 |
DE3402280C1 (de) * | 1984-01-24 | 1985-07-25 | Dynamit Nobel Ag, 5210 Troisdorf | Waermehaertbare Klebstoff- und Dichtungsmassen |
JPS6147760A (ja) * | 1984-08-16 | 1986-03-08 | Shin Etsu Polymer Co Ltd | 異方導電接着剤 |
US4695508A (en) * | 1985-09-06 | 1987-09-22 | The Yokohama Rubber Co., Ltd. | Adhesive composition |
US4855001A (en) * | 1987-02-10 | 1989-08-08 | Lord Corporation | Structural adhesive formulations and bonding method employing same |
JPH0715082B2 (ja) * | 1987-06-26 | 1995-02-22 | 東洋インキ製造株式会社 | ポリオレフィンとの接着性に優れた焼付塗料 |
IL96196A (en) | 1989-11-01 | 1995-03-30 | Raychem Ltd | Electrically conductive polymeric preparation |
JP2702796B2 (ja) * | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | 銀合金導電性ペースト |
US5258139A (en) * | 1990-04-20 | 1993-11-02 | Hitachi Chemical Company, Ltd. | Epoxy resin and adhesive composition containing the same |
US5086703A (en) * | 1991-02-05 | 1992-02-11 | Klein John M | Universal projectile ammunition |
JPH0821254B2 (ja) | 1991-02-22 | 1996-03-04 | 旭化成工業株式会社 | 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤 |
US5318651A (en) * | 1991-11-27 | 1994-06-07 | Nec Corporation | Method of bonding circuit boards |
JP3006944B2 (ja) | 1991-12-06 | 2000-02-07 | 積水フアインケミカル株式会社 | 異方導電性熱接着剤 |
US5336443A (en) * | 1993-02-22 | 1994-08-09 | Shin-Etsu Polymer Co., Ltd. | Anisotropically electroconductive adhesive composition |
JP2830681B2 (ja) * | 1993-03-08 | 1998-12-02 | ソニーケミカル株式会社 | Icチップ実装方法 |
JP3907217B2 (ja) | 1993-07-29 | 2007-04-18 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
JPH07176557A (ja) * | 1993-12-21 | 1995-07-14 | Toshiba Corp | 半導体装置 |
JPH0881669A (ja) * | 1994-07-15 | 1996-03-26 | Hitachi Chem Co Ltd | 導電性樹脂ペースト組成物および半導体装置 |
US5827609A (en) * | 1995-06-07 | 1998-10-27 | Avery Dennison Corporation | Multilayer Pressure-sensitive adhesive construction |
US5686703A (en) * | 1994-12-16 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Anisotropic, electrically conductive adhesive film |
US5763096A (en) * | 1995-03-08 | 1998-06-09 | Toray Industries, Inc. | Film having a good adhesive property and process for producing the same |
JPH09235355A (ja) * | 1996-02-28 | 1997-09-09 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びこれを用いた多層プリント配線板の製造方法 |
JP3852488B2 (ja) | 1996-04-26 | 2006-11-29 | 日立化成工業株式会社 | 補修可能な電極接続用接着剤組成物および該組成物からなる電極接続用接続部材 |
US6034331A (en) * | 1996-07-23 | 2000-03-07 | Hitachi Chemical Company, Ltd. | Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet |
JPH10178251A (ja) | 1996-10-15 | 1998-06-30 | Toray Ind Inc | 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置 |
JPH10178063A (ja) | 1996-10-15 | 1998-06-30 | Toray Ind Inc | 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置 |
JPH10168412A (ja) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
JP3587859B2 (ja) * | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JPH10273626A (ja) | 1997-03-31 | 1998-10-13 | Hitachi Chem Co Ltd | 回路接続材料及び回路板の製造法 |
US6022907A (en) * | 1997-06-03 | 2000-02-08 | Kyoeisha Chemical Co., Ltd. | Urethane prepolymer, process for producing the same and pressure-sensitive adhesive comprising the same |
JP3632882B2 (ja) * | 1997-06-27 | 2005-03-23 | ソニー株式会社 | 半導体装置及びその製造方法 |
JPH11274372A (ja) * | 1998-03-19 | 1999-10-08 | Toshiba Corp | 半導体装置及びその半導体パッケージ |
AU8648598A (en) * | 1998-08-13 | 2000-03-06 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board, and method of producing thesame |
JP3195315B2 (ja) * | 1999-06-03 | 2001-08-06 | 株式会社日立製作所 | 半導体装置用接着層付き配線テープ及びその製造方法 |
KR100463558B1 (ko) * | 2000-04-25 | 2004-12-29 | 히다치 가세고교 가부시끼가이샤 | 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI748105B (zh) * | 2017-06-07 | 2021-12-01 | 日商昭和電工材料股份有限公司 | 半導體用膜狀接著劑、半導體裝置的製造方法及半導體裝置 |
TWI804062B (zh) * | 2017-06-07 | 2023-06-01 | 日商力森諾科股份有限公司 | 半導體用膜狀接著劑、半導體裝置的製造方法及半導體裝置 |
TWI827512B (zh) * | 2017-06-07 | 2023-12-21 | 日商力森諾科股份有限公司 | 半導體用膜狀接著劑、半導體裝置的製造方法及半導體裝置 |
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MY143567A (en) | 2011-05-31 |
CN1425192A (zh) | 2003-06-18 |
US8029911B2 (en) | 2011-10-04 |
US20030141014A1 (en) | 2003-07-31 |
CN1214455C (zh) | 2005-08-10 |
KR100463558B1 (ko) | 2004-12-29 |
KR20020084198A (ko) | 2002-11-04 |
US7208105B2 (en) | 2007-04-24 |
JP3915512B2 (ja) | 2007-05-16 |
AU2001252557A1 (en) | 2001-11-07 |
US20100294551A1 (en) | 2010-11-25 |
JP2009182363A (ja) | 2009-08-13 |
WO2001082363A1 (en) | 2001-11-01 |
US20070166549A1 (en) | 2007-07-19 |
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