TWI290163B - Wiring-connecting material and process for producing circuit board with the same - Google Patents

Wiring-connecting material and process for producing circuit board with the same Download PDF

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Publication number
TWI290163B
TWI290163B TW089117120A TW89117120A TWI290163B TW I290163 B TWI290163 B TW I290163B TW 089117120 A TW089117120 A TW 089117120A TW 89117120 A TW89117120 A TW 89117120A TW I290163 B TWI290163 B TW I290163B
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Taiwan
Prior art keywords
wiring
resin
connection
weight
wiring board
Prior art date
Application number
TW089117120A
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Chinese (zh)
Inventor
Tohru Fujinawa
Itsuo Watanabe
Masami Yusa
Motohiro Arifuku
Satoyuki Nomura
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Hitachi Chemical Co Ltd
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Publication of TWI290163B publication Critical patent/TWI290163B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
    • C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
    • C08G18/4269—Lactones
    • C08G18/4277—Caprolactone and/or substituted caprolactone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6607—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8141—Unsaturated isocyanates or isothiocyanates masked
    • C08G18/815—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen
    • C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
    • C08G18/8175—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen with esters of acrylic or alkylacrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

Description

1290163 A7 ____B7_ 五、發明説明（1 ) 本發明係有關使用黏合劑組成物及導電性粒子之連接 配線材料以及製造配線板之方法者。 先行技術中，環氧樹脂系黏著劑可取得高黏著強度， 且具有良好耐水性、耐熱性等理由，因此，被廣用於電器 、電子、建築、汽車、航空機等各種用途。其中又以一液 型環氧樹脂系黏著劑由於無需混合主劑與硬化劑，使用較 爲簡便，以薄膜狀、糊狀、粉體狀被廣泛使用之。一液型 環氧樹脂系黏著劑中可使環氧樹脂與硬化劑及變性劑呈多 樣化組合，如：特開昭6 2 — 1 4 1 0 8 3號公報所載， 藉由適當選取該組合後，可取得所期待之功能。 惟，此特開昭6 2 - 1 4 1 0 8 3號公報所示之薄膜 狀黏著劑雖可藉由短時間硬化性（速硬化性）與貯存安定 性（保存性）同時並存取得目的之良好安定性而常溫下， 使用不活性觸媒型硬化劑，因此，硬化時無法充份進行反 應，造成作業性雖然良好，於2 0秒之連接時間下1 4 0 〜1 8 0 °C之加熱、1 〇秒中務必爲1 8 0〜2 1 0 °C之 加熱者。 惟，近來，精密電子機器領域中，電路高密度化極爲 進步，端子寬之連接、連接端子間隔呈極狹窄者。因此， 藉由先行技術之環氧樹脂系配線連接材料以連接條件進行 連接時，將出現配線之脫落、剝離、位置偏差等現象。且 ’爲提昇生產效率，被要求可於1 〇秒內連接之連接時間 縮短化。爲了滿足此要求，期待於低溫下同時短時間內進 行硬化之低溫連硬化性連接配線材料者。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) ^衣- 訂 經濟部智慧財產局員工消費合作社印製 -4- 1290163 A7 B7 五、發明説明（2 ) 本發明係以提供一種比先行環氧樹脂系連接材料更具 低溫速硬化，且，具有可使用時間之電氣、電子用連接配 線材料及使用其配線板之製造方法爲目的者。 本發明係提供一種含有2〜7 5重量份之聚胺酯樹脂 與3 0〜6 0重量份原子團聚合性物質以及藉由加熱產生 游離原子團之0 · 1〜3 0重量份硬化劑之連接配線材料 者。此本發明連接配線材料係介於相向連接端子間，使相 向連接端子加壓後加壓方向之連接端子間做爲電氣性連接 之連接材料者爲特別理想者。 本發明連接配線材料更以含有薄膜形成材料及/或導 電性粒子者宜。薄膜形成材料之配合量以〇〜4 0重量份 者宜，以聚醯亞胺樹脂爲理想者。 又，做爲聚胺酯樹脂者以使用藉由流動測定法所測定 之流動點爲4 0 °C〜1 4 0 °C之樹脂者宜，做爲硬化劑者 ’以使用2 5 °C、2 4小時之重量保持率（亦即，室溫（ 2 5 °C )，常壓下開放放置2 4小時前後之質量差，放置 前質量之比例，爲2 0重量％以上之硬化劑者宜。做爲原 子團聚合性物質者以胺酯丙烯酸酯者宜。 又，本發明係提供一種含有利用本發明連接配線材料 後連接配線端子間之步驟的製造配線板之方法者。亦即， 含有分別具有連接端子之配線材料間可導通該連接端子間 之連接的連接步驟進行製造配線板之方法者，該連接步驟 係其具有連接端子面相互呈相對之二個以上配置之配線材 料間挾著本發明連接配線材料介著配線材料進行加壓同時 (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慈財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -5 - 1290163 A7 __ B7 五、發明説明（3 ) 加熱之步驟進行製造配線板之方法者。該本發明之製造方 法之其至少1個連接端子表面以選自至少1種金、銀及銷 族金屬者爲特別理想者。 〔圖面之簡單說明〕 圖1代表實施例1之配線板製造方法的說明圖者。 圖2代表實施例3所使用撓性配線板連接部份之截面 圖者。 圖3代表實施例4所使用液晶配電盤連接部份配線基 板之截面圖者。 主要元件對照表 (請先閲讀背面之注意事項再填寫本頁) ·裝· 訂 經濟部智慧財產局員工消費合作社印製 1 0 印刷基板 1 1 層合基板 1 2 電路 1 3 樹脂組成物 1 4 導電性粒子 1 5 連接配線材料 1 6 連接端子 1 7 黏著劑 1 8 聚醯亞胺薄膜 1 9 捲裝攜帶膠帶 2 0 加壓 2 1 配線板 本紙張尺度適用中國國家標準（CNS ) Μ規格（21〇χ 297公羡） ·ά -6- 1290163 A7 B7 五、發明説明（4 ) 2 2 聚 醯 亞 胺 薄膜 2 3 連 接 端 子 2 4 撓 性 配 線 板 2 5 玻 璃 基 板 2 6 配 線 2 7 液 晶 配 電 盤 〔發明之最佳實施形態〕 A .硬化劑 本發明所使用之硬化劑係藉由過氧化化合物、氮雜系 化合物等加熱分解後產生之游離原子團者。硬化劑可適當 選由目的之連接溫度、連接時間、適用期等，惟.，爲實現 高反應性及長適用期，其半衰期1 0小時之溫度爲4 0 t 以上，且，半衰期1分鐘之溫度爲1 8 0°C以下之有機過 氧化物者宜，半衰期1 0小時之溫度爲6 0°C以上，且半 衰期1分鐘之溫度爲1 7 0°C以下之有機過氧化物爲更理 想。 經濟部智慧財產局員工消費合作社印製 當連接時間爲1 0秒以下時，爲取得充份之反應率， 其硬化劑之配合量以0 · 1〜3 0重量份者宜，以1〜 2 0重量份者更佳。當硬化劑配合量小於〇 . 1重量份時 ，則無法取得充份之反應率，不易取得良好之黏著強度， 小的連接抵抗者。反之，配合量大於3 0重量份則連接配 線材料之流動性降低，連接抵抗上昇，連接配線材料之適 本紙^尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 「7 - 1290163 A7 _B7_ 五、發明説明（5 ) 用期變短。 做爲本發明硬化劑之理想有機過氧化物者如：二醯基 過氧化物、過氧化二碳酸酯、過氧化酯、過氧化縮酮、二 烷基過氧化物、氫過氧化物、甲矽烷基過氧化物等示例。 做爲二醯基過氧化物類之例者如：異丁基過氧化物、 2，4 —二氯苯甲醯過氧化物、3，5 ，5 —三甲基己醯 過氧化物、辛醯過氧化物、月桂醯過氧化物、硬脂醯過氧 化物、琥珀醯過氧化物、苯甲醯過氧化甲苯、苯甲醯過氧 化物等例。 做爲過氧化碳酸酯類之例如：二-正-丙基過氧化二 碳酸酯、二異丙基過氧化二碳酸酯、雙（4 —第3 -丁基 環己基）過氧化二碳酸酯、二一2-乙氧基乙基過氧化二 碳酸酯、二（2 —乙基己基過氧化）二碳酸酯、二甲氧基 丁基過氧化二碳酸酯、二（3 -甲基一 3 -甲氧基丁基過 氧化）二碳酸酯等例。 做爲過氧化酯類之例者如：枯烯基過氧化新癸酸酯、 1 ，1、 3 ，3 -四甲基丁基過氧化新癸酸酯、1 一環己 基- 1 -甲基乙基過氧化新癸酸酯、第3 -己基過氧化新 癸酸酯、第3 — 丁基過氧化三甲基乙酸酯、1 ，1 ，3 ’ 3 —四甲基丁基過氧化—2 -乙基己酸酯、2 ，5 —二甲 基一 2 ，5 —二（2 —乙基己醯過氧化）己烷、1 一環己 基—1 一甲基乙基過氧化一 2 -乙基己酸酯、第3 -己基 過氧化一 2 —乙基己酸酯、第3 — 丁基過氧化- 2 -乙基 己酸酯、第3 -丁基過氧化異丁酸酯、1 ，1 一雙（第3 (請先閲讀背面之注意事項再填寫本頁) :裝. 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 8 - 1290163 A7 _B7_ 五、發明説明（6 ) -丁基過氧化）環己烷、第3-己基過氧化異丙基單碳酸 酯、第3 - 丁基過氧化一 3，5，5-三甲基己酸酯、第 3 — 丁基過氧化月桂酸酉旨、2 ，5 — —^甲基一 2 5 5 — ~-(間-甲苯醯基過氧化）己烷、第3-丁基過氧化異丙基 單碳酸酯、第3 - 丁基過氧化- 2 -乙基己基單碳酸酯、 第3-己基過氧化苯甲酸酯、第3-丁基過氧化乙酸酯等 例。 做爲過氧化縮酮類者如：1，1 一雙（第3 -己基過 氧化）3 ，3，5 —三甲基環己烷、1 ，1 一雙（第3-己基過氧化）環己烷、1 ，1 一雙（第3 -丁基過氧化） 一 3，3，5 -三甲基環己烷、1，1—(第3- 丁基過 氧化）一環十二烷、2，2 -雙（第3 -丁基過氧化）癸 烷等例。 二烷基過氧化物類之例如·· α，α /-雙（第3 -丁 基過氧化）二異丙基苯、二枯烯基過氧化物、2，5 -二 甲基—2，5 -二（第3 -丁基過氧化）己烷、第3 —丁 基枯烯基過氧化物等例。 氮過氧化物類之例如：二異丙基苯氫過氧化物、枯烯 氫過氧化物等例。 甲矽烷基過氧化物類之例如：第3 - 丁基三甲基甲矽 烷基過氧化物、雙（第3 - 丁基）二甲基甲矽烷基過氧化 物、第3 -丁基三乙烯基甲矽烷基過氧化物、雙（第3 -丁基）二乙烯基甲矽烷基過氧化物、三（第3 丁基）乙烯 基甲矽烷基過氧化物、第3 - 丁基三丙烯基甲矽烷基過氧 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） -9 - (請先閱讀背面之注意事項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 1290163 A7 B7 五、發明説明（7 ) 化物、雙（第3 -丁基）二丙烯基甲矽烷基過氧化物、三 (第3 - 丁基）丙烯基甲矽烷基過氧化物等例。 (請先閲讀背面之注意事項再填寫本頁) 本發明中做爲硬化劑者可使用此等化合物中1種類或 2種以上倂用者均可。又，此等硬化劑（游離原子團產生 劑）亦可倂用分解促進劑、抑制劑等。 另外，爲抑制配線材料連接端子之腐蝕，於硬化劑中 所含有之氯離子、有機酸以5000ppm以下者宜，更 且，加熱分解後所產生之有機酸者爲極少者宜。又，由提 昇所製作連接配線材料之安定性其室溫下（2 5 °C )、常 壓下開放放置2 4小時後重量保持率爲2 0重量％以上者 宜。 又，以聚胺酯系、聚酯系之高分子物質等被覆此等硬 化劑之微膠囊化者可使時間延長而較爲理想者。 B.聚胺酯樹脂 經濟部智慧財產局員工消費合作社印製 做爲聚胺酯樹脂者其藉由於分子內具有2個氫氧基之 二醇與2個異氰酸酯基之二異氰酸酯相互反應後取得之樹 脂由於硬化時之應力緩和佳，具有極性而可提昇黏著性， 極適於本發明者。 做爲二醇者於線狀化合物之末端具有氫氧基者即可使 用之，具體而言，如：聚乙烯己二酸酯、聚二乙烯己二酸 酯、聚丙烯己二酸酯、聚丁烯己二酸酯、聚六亞甲基己二 酸酯、聚新戊基己二酸酯、聚己內酯聚醇、聚六亞甲基碳 酸酯、矽酮聚醇、丙烯基聚醇、聚乙二醇、聚丙二醇、聚 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -1〇 - 1290163 B7 五、發明説明（8 ) 四甲二醇等例。此等可單獨以任意化合物使用’亦可倂用 2種以上化合物者。 (請先閲讀背面之注意事項再填寫本頁) 做爲二異氰酸酯之例如：異佛爾酮二異氰酸酯、甲代 苯烯二異氰酸酯、4，4 / —二苯基甲烷二異氰酸酯、萘 一 1 ，5 —二異氰酸酯、對一二苯二異氰酸酯、4，4一 -亞甲基雙環己基二異氰酸酯、六亞甲基二異氰酸酯、環 己烷二異氰酸酯等例。此等可以單獨任意化合物使用，亦 可倂用2種以上者。 本發明所使用聚胺酯樹脂之重量平均分子量以 1 0 0 0 0〜1 0 0 0 0 0 0者宜。重量平均分子量小於 1 0 0 0 0者時，則連接配線材料之凝聚力降低，不易取 得足夠之黏著強度，反之，大於1 0 0 0 0 0 0則混合性 、流動性變差。 又，合成聚胺酯樹脂時，除配合此等二醇及二異氰酸 酯外，更配合多價醇、胺類、酸酐等後進行適當反應者亦 可，如：含有與酸酐反應後取得之亞胺基之聚胺酯可提昇 黏著性、耐熱性爲理想者。 本發明所使用之聚胺酯樹脂亦可爲變性者。特別以原 經濟部智慧財產局員工消費合作社印製 子團聚合性之官能基所變性者可提昇耐熱性故極爲理想者 〇 本發明所使用之聚胺酯樹脂其流動測試法之流動點以 40 °C〜140 °C之範圍者宜、50 °C〜100 r者更佳 。又’所謂流動法之流動點係指使用直徑1 m m之模，加 以3 Μ P a之壓力後，以昇溫速度2它/分鐘進行昇溫時 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公董） - 11 - 1290163 A7 B7 五、發明説明（9 ) 其圓筒開始轉動之溫度者，以流動試驗器進行測定之。當 流動測試法之流動點小於4 0 °C時，其薄膜成型性，黏著 性將變差，反之，大於1 4 0 °C則流動性惡化，對於電氣 性連接有不良影響。 請 先 閱 經濟部智慧財產局員工消費合作社印製 C ·薄膜形成材料 做爲本發明所使用之薄膜形成材料者如： 脂、聚乙烯甲縮醛樹脂、聚苯乙烯樹脂、聚乙 脂、聚酯樹脂、丙烯酸樹脂、聚醯胺樹脂、二 苯氧基樹脂等例。此等可單獨使用，亦可以2 使用之。 另外，薄膜形成材料係指使液狀物呈固形 成組成物做成具備自體支撑性之薄膜形狀時， 用簡單，不致輕易出現龜裂、割傷、黏腻等現 態下具有可做爲薄膜使用之機械特性者。 做爲薄膜形成材料者，由其耐熱性面觀之 醯亞胺樹脂適於本發明者。聚醯亞胺樹脂可使 四羧酸二酐與二胺之附加反應所合成之聚醯胺 合呈亞胺化者。聚醯亞胺樹脂之重量平均分子 形成性之面觀之，以1 0000〜1 5 00 00 合成聚醯亞胺樹脂時所使用之酸二酐及二 溶劑之溶解性、原子團聚合性材料相互之互溶 適當選取。又，可分別單獨使用，亦可2種以 之。又，由提昇黏著性、柔軟性面觀之，以其 聚醯亞胺樹 烯丁縮醛樹 甲苯樹脂、 種以上合倂 化後，以構 其薄膜之使 象 般狀 ，特別以聚 用如：藉由 酸經加熱縮 量由其薄膜 者宜。 胺可由對於 性等面進行 上合倂使用 酸二酐及二 之 注 意 事 項 再 旁 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） _ 12 _ 1290163 A7 B7 五、發明説明（1(D) 胺中至少1種化合物爲具有矽氧烷骨架者宜。 另外，本發明中所使用之薄膜形成材料亦可藉由原子 團聚合性之官能基所變性者。 D .原子團聚合性物質 本發明所使用之原子團聚合性物質係藉由原子團後具 有聚合之官能基物質者，如：丙烯酸酯、甲基丙烯酸酯、 馬來酸酐縮亞胺化合物等例。此等可以單獨任意化合物使 用之，亦可合倂2種以上化合物使用者。 又，原子團聚合性物質亦可以單體及低聚物之任意狀 態使用之，亦可合倂單體與低聚物使用之。 做爲本發明理想丙烯酸酯之具體例者如：甲基丙烯酸 酯、乙基丙烯酸酯、異丙基丙烯酸酯、異丁基丙燦酸酯、 乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三羥甲基丙烷 三丙烯酸酯、四羥甲基甲烷四丙烯酸酯、2 -羥基-1 ， 3 —二丙烯氧基丙烷、2，2 —雙〔4—(丙烯氧基甲氧 基）苯基〕丙烷、2，2 —雙〔4 一（丙烯氧基聚乙氧基 )苯基〕丙烷、二環戊烯基丙烯酸酯、三環癸烯基丙烯酸 酯、三（丙烯氧基乙基）三聚異氰酸酯、三聚異氰酸環氧 乙烷變性二丙烯酸酯及胺酯丙烯酸酯等例。又，對應此等 丙烯酸酯之甲基丙烯酸酯亦適於本發明者。 又，二環戊烯基、三環癸烯基及三嗪環中至少具有1 種原子團聚合性物質可提昇所取得連接配線材料之耐熱性 因此極爲理想者。 (請先閲讀背面之注意事項再填寫本頁) —•I裝· 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13 - 1290163 A7 B7 11, 經濟部智慧財產局員工消費合作社印製 五、發明説明（ 做爲本發明所使用之原子團聚合性物質者爲具有良好 黏著性者以胺酯丙烯酸酯爲特別理想者。胺酯丙烯酸酯係 於分子內至少具有1個尿烷基者，例如：聚四甲二醇等之 聚醇與聚異氰酸酯及含氫氧基之丙烯基化合物相互之反應 生成物者。 又，由提昇金屬等無機物表面之黏著強度觀之，除此 等原子團聚合性物質，更倂用具有磷酸酯結構之原子團聚 合性物質者爲宜。 做爲具有適於本發明磷酸酯結構之原子團聚合性物質 之例如：無水磷酸與2 -羥乙基丙烯酸酯或對應其之甲基 丙烯酸酯之2 -羥乙基甲基丙烯酸酯之反應物之例者。具 體而言，可使用單（2 -甲基丙烯氧乙基）酸性磷酸酯、 二（2 -甲基丙烯氧乙基）酸性磷.酸酯等。此等可以1種 化合物使用之，亦可倂用2種以上者使用。 做爲馬來酸酐縮亞胺化合物者以分子中至少含2個以 上馬來酸酐縮亞胺基者適於本發明。此馬來酸酐縮亞胺化 合物之例如：1 -曱基- 2，4 -雙馬來酸酐縮亞胺苯、 N，N > —間—二苯雙馬來酸酐縮亞胺、N，N > -對一 二苯雙馬來酸酐縮亞胺、N，N > -間一甲苯烯雙馬來酸 酐縮亞胺、N，N / - 4，4 —雙二苯雙馬來酸酐縮亞胺 、N，N>4，4 一（3，3，一二甲基二苯烯）雙馬來 酸酐縮亞胺、N，N > - 4，4 (3-3 二甲基二 苯基甲烷）雙馬來酸酐縮亞胺、N，N / - 4，4 一（ 31290163 A7 ____B7_ V. DESCRIPTION OF THE INVENTION (1) The present invention relates to a connection wiring material using a binder composition and conductive particles, and a method of manufacturing a wiring board. In the prior art, an epoxy resin adhesive has high adhesion strength and good water resistance and heat resistance. Therefore, it is widely used in various applications such as electric appliances, electronics, construction, automobiles, and aircraft. Among them, the one-component epoxy resin-based adhesive is widely used in the form of a film, a paste, or a powder because it is not required to be mixed with a main agent and a hardener. One-component epoxy resin adhesive can be used in various combinations of epoxy resin and hardener and denaturing agent, as described in Japanese Patent Publication No. 6 2 - 1 4 1 0 8 3 by appropriate selection. After combination, you can get the desired function. However, the film-like adhesive shown in the Japanese Patent Publication No. 6 2 - 1 4 1 0 8 3 can be used for the purpose of coexisting with the short-term curability (speed-curing property) and storage stability (preservability). Good stability and use of inactive catalyst type hardener at normal temperature. Therefore, it is not possible to fully react during hardening, resulting in good workability, and 140 to 180 °C at a connection time of 20 seconds. Heating, 1 〇 second must be 1 8 0~2 1 0 °C heating. However, recently, in the field of precision electronic equipment, the density of circuits has been extremely advanced, and the connection of terminals and the interval between terminals have been extremely narrow. Therefore, when the epoxy resin-based wiring connecting material of the prior art is connected under the connection conditions, the wiring may be peeled off, peeled off, or displaced. And in order to increase production efficiency, the connection time required to connect in 1 second is shortened. In order to meet this requirement, it is expected to be a low-temperature hardening connection wiring material which is hardened at a low temperature and simultaneously in a short time. This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) (please read the note on the back and fill out this page) ^ Clothing - Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -4- 1290163 A7 B7 V. INSTRUCTION DESCRIPTION OF THE INVENTION (2) The present invention provides a method for manufacturing a wiring material for electrical and electronic use having a usable time and a wiring board using a wiring board which is harder than a prior art epoxy resin-based connecting material. Target person. The present invention provides a connecting wiring material comprising 2 to 7 5 parts by weight of a polyurethane resin and 30 to 60 parts by weight of a radical polymerizable substance and 0 to 1 to 30 parts by weight of a hardener by heating to generate a free radical. . It is particularly preferable that the connecting wiring material of the present invention is a connecting material which is electrically connected between the connecting terminals which are pressed between the opposite connecting terminals and which are pressed in the pressing direction. The connecting wiring material of the present invention preferably contains a film forming material and/or a conductive particle. The blending amount of the film-forming material is preferably from 10,000 to 40 parts by weight, and the polyimine resin is preferred. Further, as the polyurethane resin, those having a pour point of 40 ° C to 140 ° C as measured by a flow measurement method should be used as a hardener to use 25 ° C, 2 4 The weight retention rate of the hour (that is, the room temperature (25 ° C), the quality difference before and after the open position for 24 hours under normal pressure, the ratio of the mass before placement, is more than 20% by weight of the hardener. Further, the present invention provides a method of manufacturing a wiring board including a step of connecting a wiring member with a wiring material according to the present invention, that is, a method of manufacturing a wiring board. A method of manufacturing a wiring board by connecting a wiring between the wiring materials of the terminals to connect the connection terminals, wherein the connection step is performed by connecting the wiring materials having two or more opposing terminal surfaces to each other. The wiring material is pressurized under the wiring material (please read the precautions on the back side and fill out this page). The Ministry of Economic Affairs, Zhici Property Bureau, Staff Consumer Cooperatives, Printed Paper Size Applicable to China Standard (CNS) A4 size (210X 297 mm) -5 - 1290163 A7 __ B7 V. INSTRUCTIONS (3) Heating step The method of manufacturing the wiring board is at least one connection terminal of the manufacturing method of the present invention. The surface is preferably one selected from the group consisting of at least one type of gold, silver, and pin metal. [Brief Description of the Drawing] Fig. 1 is an explanatory view showing a method of manufacturing a wiring board of the first embodiment. Fig. 3 is a cross-sectional view showing a portion of the wiring board connected to the liquid crystal panel used in Embodiment 4. The main component comparison table (please read the back sheet and read this page) ·Installation · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1 0 Printed substrate 1 1 Laminate substrate 1 2 Circuit 1 3 Resin composition 1 4 Conductive particles 1 5 Connection wiring material 1 6 Connection terminal 1 7 Adhesive 1 8 Polyimide film 1 9 Reel carrying tape 2 0 Pressurized 2 1 Wiring board The paper size is applicable to China National Standard (CNS) Μ Specifications (21〇χ 297 羡) · ά -6- 1290163 A7 B7 V. hair Description (4) 2 2 Polyimine film 2 3 Connection terminal 2 4 Flexible wiring board 2 5 Glass substrate 2 6 Wiring 2 7 Liquid crystal panel (best embodiment of the invention) A. Hardener Hardening used in the present invention The agent is a free atomic group produced by heating and decomposing a peroxidic compound, an aza compound, etc. The curing agent can be appropriately selected from the connection temperature, the connection time, the pot life, etc., in order to achieve high reactivity and long Applicable period, the half-life of 10 hours is more than 40 t, and the half-life of 1 minute is preferably less than 180 °C. The half-life of 10 hours is above 60 °C. An organic peroxide having a half-life of 1 minute and a temperature of 170 ° C or less is more preferable. When the connection time is less than 10 seconds, the Ministry of Economic Affairs, Intellectual Property Office, and the Consumer Cooperatives, in order to obtain a sufficient reaction rate, the amount of the hardener is preferably 0.1 to 30 parts by weight, and 1 to 2 0 parts by weight is more preferred. When the amount of the hardener is less than 0.1 part by weight, a sufficient reaction rate cannot be obtained, and it is difficult to obtain good adhesion strength and a small connection resistance. On the other hand, if the compounding amount is more than 30 parts by weight, the fluidity of the connection wiring material is lowered, the connection resistance is increased, and the appropriate paper for connecting the wiring material is applicable to the Chinese National Standard (CNS) A4 specification (210×297 mm) "7 - 1290163 A7 _B7_ V. Description of the invention (5) The application period is shortened. It is an ideal organic peroxide for the hardener of the present invention such as: dimercapto peroxide, peroxydicarbonate, peroxyester, peroxyketal, and Examples of alkyl peroxides, hydroperoxides, formyl peroxides, etc. Examples of di-mercapto peroxides such as isobutyl peroxide and 2,4-dichlorobenzamide Peroxide, 3,5,5-trimethylhexyl peroxide, octyl peroxide, laurel peroxide, stearin peroxide, amber oxime peroxide, benzamidine peroxide toluene Examples of benzamidine peroxides, etc. As peroxycarbonates, for example, di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4 - 3rd - butyl) Cyclohexyl)peroxydicarbonate, di- 2-ethoxyethyl peroxidation Carbonate, di(2-ethylhexylperoxy)dicarbonate, dimethoxybutylperoxydicarbonate, bis(3-methyl-3-methoxybutoxy)dicarbonate, etc. Examples of peroxyesters such as: cumenyl peroxy neodecanoate, 1, 1, 3, 3-tetramethylbutyl peroxy neodecanoate, 1 monocyclohexyl-1 - A Ethyl ethyl peroxy neodecanoate, 3 - hexyl peroxy neodecanoate, 3 - butyl peroxy trimethyl acetate, 1, 1 , 3 ' 3 - tetramethyl butyl peroxidation —2-ethylhexanoate, 2,5-dimethyl- 2,5-di(2-ethylhexyl peroxy)hexane, 1-cyclohexyl-1 monomethylethylperoxide- 2 - Ethyl hexanoate, 3 - hexylperoxy-2-ethylhexanoate, 3 -butylperoxy-2-ethylhexanoate, 3 -butylperoxy isobutyrate, 1 , 1 pair (3rd (please read the note on the back and fill out this page): Installed. Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed on this paper scale applicable to China National Standard (CNS) A4 specification (210X297 mm) _ 8 - 1290163 A7 _B7_ V. Description of the invention (6) -butyl peroxy) cyclohexane, 3-hexylperoxyisopropyl monocarbonate, 3 -butylperoxy-3,5,5- Trimethylhexanoate, 3rd-butylperoxylaurate, 2,5--methyl- 2 5 5 —~-(m-toluene-based peroxy)hexane, 3-but Examples of isopropyl isopropyl monocarbonate, tert-butylperoxy-2-ethylhexyl monocarbonate, 3-hexylperoxybenzoate, and 3-butylperoxyacetate . As peroxy ketals such as: 1,1 double (3rd-hexylperoxy) 3,3,5-trimethylcyclohexane, 1,1 double (3-hexyl peroxy) ring Hexane, 1, 1 double (3 -butylperoxy) 3,3,5-trimethylcyclohexane, 1,1-(3-butylperoxy)-cyclododecane, 2 , 2-bis(3 -butylperoxy) decane, and the like. Dialkyl peroxides such as α,α /-bis(3 -butylperoxy)diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2, Examples of 5-di(t-butylperoxy)hexane and tert-butyl cumenyl peroxide. Examples of the nitrogen peroxides include diisopropylbenzene hydroperoxide and cumene hydroperoxide. Examples of the methyl ketone peroxides include: 3 - butyl trimethyl methacrylate peroxide, bis ( 3 - butyl ) dimethyl methacrylate peroxide, and 3 - butyl triethylene Base mercapto alkyl peroxide, bis(tert-butyl)divinylcarbenyl peroxide, tris(t-butyl)vinylformamido peroxide, 3 -butyltripropenyl The content of methotrexate peroxy paper is applicable to China National Standard (CNS) Α4 specification (210X297 mm) -9 - (Please read the notes on the back and fill out this page.) Printed by Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperatives 1290163 A7 B7 V. INSTRUCTION OF THE INVENTION (7) Examples of the compound, bis(tert-butyl)dipropenylcarbenyl peroxide, and tris(t-butyl)propenylmethyl decyl peroxide. (Please read the precautions on the back and fill out this page.) In the present invention, one or two or more of these compounds may be used as the curing agent. Further, such a curing agent (free radical generating agent) may also be used as a decomposition accelerator, an inhibitor or the like. In addition, in order to suppress the corrosion of the connection terminal of the wiring material, it is preferable that the chloride ion or the organic acid contained in the curing agent is 5,000 ppm or less, and the organic acid generated after the decomposition by heating is extremely rare. Further, the stability of the connection wiring material produced by the lift is preferably at room temperature (25 ° C) and at a normal pressure for 24 hours, and the weight retention ratio is 20% by weight or more. Further, it is preferable to coat the hardening agent such as a polyurethane-based or polyester-based polymer material to extend the time. B. Polyurethane Resin, Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumer Cooperative, printed as a polyurethane resin, which is obtained by reacting a resin having two hydroxyl groups in the molecule with two isocyanate groups. The stress relaxation is good, the polarity is increased, and the adhesion is improved, which is very suitable for the inventors. As the diol, the hydroxyl group can be used at the end of the linear compound, specifically, for example, polyethylene adipate, polydiethylene adipate, polypropylene adipate, poly Butylene adipate, polyhexamethylene adipate, polyneopentyl adipate, polycaprolactone polyalcohol, polyhexamethylene carbonate, anthrone polyalcohol, propylene polyalcohol , polyethylene glycol, polypropylene glycol, poly-paper standards apply to China National Standard (CNS) A4 specifications (210X297 mm) -1〇- 1290163 B7 V, invention description (8) tetramethyl glycol and other examples. These may be used singly in any of the compounds. It is also possible to use two or more compounds. (Please read the precautions on the back and fill out this page.) For example, isophorone diisocyanate, methene diisocyanate, 4,4 / diphenylmethane diisocyanate, naphthalene-1, 5 - diisocyanate, p-diphenyl diisocyanate, 4,4-monomethylene dicyclohexyl diisocyanate, hexamethylene diisocyanate, cyclohexane diisocyanate, and the like. These may be used alone or in combination of two or more. The weight average molecular weight of the polyurethane resin used in the present invention is preferably from 1 000 to 1 0 0 0 0 0. When the weight average molecular weight is less than 1 0 0 0, the cohesive force of the connection wiring material is lowered, and it is difficult to obtain sufficient adhesive strength. On the other hand, when the weight average molecular weight is more than 1 000, the compatibility and fluidity are deteriorated. Further, in the case of synthesizing the polyurethane resin, in addition to the diol and the diisocyanate, a polyvalent alcohol, an amine, an acid anhydride or the like may be further added, and then an appropriate reaction may be carried out, for example, an imine group obtained by reacting with an acid anhydride. Polyurethane is ideal for improving adhesion and heat resistance. The polyurethane resin used in the present invention may also be a transgender. In particular, the transaminator of the polymerized functional group of the former Ministry of Economic Affairs, the Intellectual Property Office of the Intellectual Property Bureau, can improve the heat resistance. Therefore, the polyurethane resin used in the present invention has a flow test method of 40 ° C. It is better to use a range of ~140 °C, and 50 °C to 100 r. In addition, the so-called flow method of the flow method refers to the use of a mold with a diameter of 1 mm, and after applying a pressure of 3 Μ P a , the paper scale is applied to the Chinese National Standard (CNS ) A4 specification (210X297) when the temperature is raised at a heating rate of 2 Å/min. (Director) - 11 - 1290163 A7 B7 V. INSTRUCTIONS (9) The temperature at which the cylinder begins to rotate is measured by a flow tester. When the flow point of the flow test method is less than 40 °C, the film formability and adhesion will be deteriorated. Conversely, when the flow rate is higher than 140 °C, the fluidity is deteriorated, which has an adverse effect on the electrical connection. Please read the C·film forming material printed on the film forming materials used in the invention as the film forming materials used in the invention, such as: fat, polyethylene methylal resin, polystyrene resin, polyethylene, poly Examples of the ester resin, the acrylic resin, the polyamide resin, and the diphenoxy resin. These can be used alone or in combination. In addition, the film forming material means that when the liquid material is solidified to form a composition and is formed into a film shape having self-supporting properties, it can be used as a film in a state where it is easy to be cracked, cut, or sticky. The mechanical characteristics used. As the film forming material, the yttrium imide resin having a heat resistance is suitable for the inventors. The polyimine resin can be an imidized polyamine synthesized by an additional reaction of a tetracarboxylic dianhydride with a diamine. The weight average molecular formability of the polyimine resin, the solubility of the acid dianhydride and the two solvent used in synthesizing the polyimine resin from 1 0000 to 1 500 00, and the atomic polymerizable materials are mutually Mutual solubility is appropriately selected. Further, they may be used alone or in combination of two or more. In addition, by enhancing the adhesion and flexibility, the polyamidene olefin acetal toluene resin is compounded and the like, and the film is formed into a film, in particular, for example. : It is preferred that the acid is reduced by heating. The amine can be combined with the same surface. The use of acid dianhydride and the second considerations apply to the Chinese National Standard (CNS) Α4 specification (210X297 mm) _ 12 _ 1290163 A7 B7 5. Invention Description (1) (D) At least one of the amines is preferably a fluorinated alkane skeleton. The film-forming material used in the present invention may also be modified by a functional group of a radical polymerizable group. The radical polymerizable substance used in the invention is a compound having a functional group after polymerization by a radical, such as an acrylate, a methacrylate, a maleic anhydride imide compound, etc. These may be used alone or in any compound. Further, the compound of two or more kinds of compounds may be combined. The atomic polymerizable substance may be used in any state of a monomer or an oligomer, or may be used in combination with a monomer and an oligomer. Specific examples of esters such as: methacrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene Diacrylate, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3-dipropoxypropane, 2,2-bis[4-(acryloxymethoxy) Phenyl)propane, 2,2-bis[4-(acryloxypolyethoxy)phenyl]propane, dicyclopentenyl acrylate, tricyclodecenyl acrylate, tris(propyleneoxy) Ethyl)trimeric isocyanate, trimeric isocyanate ethylene oxide-modified diacrylate, and urethane acrylate, etc. Further, methacrylate corresponding to these acrylates is also suitable for the present inventors. The cyclopentenyl group, the tricyclodecenyl group, and the triazine ring have at least one atomic group-polymerizable substance, which is excellent in heat resistance of the obtained connection wiring material. (Please read the back note and fill out this page. ) -•I Loading · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed Paper Size Applicable to China National Standard (CNS) A4 Specification (210X297 mm) -13 - 1290163 A7 B7 11, Ministry of Economic Affairs Intellectual Property Bureau Staff Consumption Cooperative Printing five, invention instructions (to do The atomic group polymerizable material used in the present invention is particularly preferably an amine ester acrylate having good adhesion. The amine ester acrylate is one having at least one urethane group in the molecule, for example, polytetramethylene glycol. The reaction product of a polyhydric alcohol with a polyisocyanate and a hydroxy group-containing compound containing a hydroxyl group, and a viewpoint of the adhesion strength of the surface of an inorganic substance such as a metal, in addition to the atomic group-polymerizable substance, It is preferred that the atomic group polymerizable substance of the ester structure is used as an atomic group polymerizable substance suitable for the phosphate structure of the present invention, for example, anhydrous phosphoric acid and 2-hydroxyethyl acrylate or a corresponding methacrylate thereof - An example of a reactant of hydroxyethyl methacrylate. Specifically, mono(2-methylpropoxyethyl) acid phosphate, bis(2-methylpropoxyethyl) acid phosphate, or the like can be used. These may be used as one type of compound, or may be used in combination of two or more types. As the maleic anhydride imide compound, those having at least two or more maleic anhydride imide groups in the molecule are suitable for the present invention. Examples of the maleic anhydride imide compound are: 1-mercapto-2,4-dimaleic anhydride imide benzene, N,N>-m-diphenylbismaleic anhydride imide, N,N > - p-diphenyl dimaleic anhydride imide, N, N > - m-toluene double maleic anhydride imine, N, N / - 4, 4 - bisdiphenyl bismalehydride Imine, N, N> 4,4-(3,3,1-dimethyldiphenylene) bismaleic acid imide, N,N > - 4,4 (3-3 dimethyl diphenyl) Methane) bismaleic acid imide, N, N / - 4, 4 one (3

二乙基二苯基甲烷）雙馬來酸酐縮亞胺、N 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -14 - 請 閱 讀 背 面 意 頁 1290163 A7 _B7___ 五、發明説明（12) - 4，4 一二苯基甲烷雙馬來酸酐縮亞胺、N， — 4，4 一二苯基丙烷雙馬來酸酐縮亞胺、N， —4，4 一二苯基醚雙馬來酸酐縮亞胺、N，N> — 3， (請先閲讀背面之注意事項再填寫本頁) 3 / —二苯磺雙馬來酸酐縮亞胺、2，2 -雙（4— (4 -馬來酸酐縮亞胺苯氧基）苯基）丙烷、2，2-雙（3 一 S -丁基一 3，4 一（4 —馬來酸酐縮亞胺苯氧基）苯 基）丙烷、1 ，1—雙（4 一（4 一馬來酸酐縮亞胺苯氧 基）苯基）癸烷、4，一環亞己基—雙（1— (4 — 馬來酸酐縮亞胺苯氧基）一 2 -環己基苯、2，2 —雙（ 4 -（ 4 -馬來酸酐縮亞胺苯氧基）苯基）六氟丙烷等例 〇 又，本發明中，除上等原子團聚合性物質外，必要時 ，亦可適時添加對苯二酚類、甲醚對苯二酚類等之聚合禁 止劑使用之。 E ·配合比 缝濟部智慧財產局員X消費合作社印製 本發明連接配線材料中之上述各成份配合量使聚胺酯 樹脂爲2〜7 5重量份，原子團聚合性物質爲3 0〜6 0 重量份，加熱產生游離原子團之硬化劑爲〇 . 1〜3 〇重 ®份者’含薄膜形成材料時，其含有量爲〇〜4 〇重量份 者。此等成份之配合量可於上述範圍內做適當選擇。 當聚胺酯樹脂之配合量小於2重量份時，則連接配線 材料硬化時，熱負荷時等應力緩和效果不足，降低黏著強 度。反之，大於7 5重量份則連接可靠性不足。 -15 1290163 A7 _B7 五、發明説明（13) 當原子團聚合性物質之配合量小於3 0重量份時，貝!] 硬化後連接配線材料之機械性強度降低，反之，大於6 0 重量份則硬化前連接配線材料之黏著性增加，使用性變差 (請先閱讀背面之注意事項再填寫本頁) 〇 又，藉由加熱產生游離原子團之硬化劑配合量小於 0 · 1重量份時，則無法取得上述充份反應率，不易取得 良好之黏著強度，小的連接抵抗。更且，此硬化劑配合量 大於3 0重量份時，則連接配線材料流動性降低，連接抵 抗上昇，連接配線材料之適用期變短。 當薄膜形成材料之配合量大於4 0重量份時，則連接 配線材料流動性降低，連接抵抗上昇。又，薄膜形成材料 若可藉由聚胺酯樹脂、原子團聚合性物質，加熱產生游離 之硬化劑除外之成份，只要可充份形成薄膜，則不配合亦 可〇 F .導電性粒子 經濟部智慧財產局員工消費合作社印製 本發明之連接配線材料即使未含導電性粒子亦可藉由 連接端子間之直接接觸取得連接，因此，無須特別含有導 電性粒子。惟，爲取得更安定之連接，以含有導電性粒子 者宜。 做爲導電性粒子者可使用An、 Ag、 Ni、 Cu、 焊錫等金屬粒子、碳粒子等。爲取得充份之適用期，粒子 表層不以Ni、 Cu等之適鍍金屬類而以Au、 Ag、鉑 族之貴金屬類者宜，特別以A u爲宜。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -16 - 1290163 A7 __B7_ 五、發明説明（14) 又，以A u等貴金屬類被覆N i等過鍍金屬類表面之 複合粒子、非導電性玻璃、陶瓷、塑料等粒子表面藉由上 述金屬等所成之導通層所被覆者，更且，其表面藉由由貴 金屬類所成之最外層所被覆之複合粒子類，其部份粒子具 有導電性之粒子亦可做爲導電性粒子用於本發明者。 此複合粒子中貴金屬類被覆層之厚度並無特別限定， 一般爲取得良好抵抗者以1 0 0 A以上者宜。惟，於N i 等過鍍金屬表面設置貴金屬類層時，藉由導電粒子混合分 散時所產生貴金屬類層之缺陷等產生氧化還原作用後，產 生游離原子團後，造成適用期降低。因此，貴金屬類層之 厚度以3 0 0 A以上者宜。又，貴金屬類層之厚度大於1 // m時，則有效果飽和之虞，因此，由成本面觀之，以1 // m以下之膜厚者爲效率性者。 另外，以塑料做成核之複合粒子、熱熔融金屬粒子藉 由加熱及加壓後變形性高，連接時容易藉由加熱及加壓變 形，增加與連接端子之接觸面積後，可提昇可靠性較爲理 想。 經濟部智慧財產局員工消費合作社印製 於本發明連接配線材料中配合導電性粒子時，其配合 量針對黏著劑成份以0 · 1〜3 0體積％者宜，可因應其 用途進行適當選擇。藉由過剩之導電性粒子可防止鄰接電 路之短路等，因此，以0 . 1〜10體積％者佳。 G .添加劑 本發明之連接配線材料除上述A〜F各成份之外，更 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -17 - 1290163 A7 B7 五、發明説明（15) 可含塡充材料、軟化劑、促進劑、防止老化劑、著色劑、 難燃化劑、觸變劑、偶合劑等。 配合塡充材料則可提昇所取得連接配線材料之連接可 靠性等’爲極理想者。塡充材料之最大徑以小於導電性粒 子之粒徑者宜。其配合量以5〜6 0體積％者佳。大於 6 0體積％則提昇可靠性之效果達飽和。 偶合劑之例以含有乙烯基、丙烯基、胺基、環氧基及 異氰酸酯基者較具提昇黏著性效果爲較理想者。 Η·薄膜結構 本連接配線材料之構成於單一層中無須存在所有成份 ，亦可做成2層以上之層合薄膜者。例如：做成含有產生 游離原子團之硬化劑層與含有導電性粒子層之雙.層結構後 ，分離此等成份後可有效進行高精密化，提昇適用期之效 果。 I.連接配線材料之特性 經濟部智慧財產局員工消費合作社印製 本發明連接配線材料係於連接時，其黏著劑使熔融流 動後接觸相向之連接端子後進行連合後，硬化之後維持連 接者，黏著劑之流動性爲重量因素者。本發明連接配線材 料使用厚度0 · 7 m m、 1 5 m m X 1 5 m m之玻璃後， 使厚度3 5 // m、5 m m x 5 m m之連接配線材料挾於此 玻璃後，進行1 6 0 °C、2 Μ P a、1 〇秒之加熱及加壓 時，使用初期面積（A )與加熱加壓後面積（B )所代表 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -18 - 1290163 A7 B7 五、發明説明（16) 之流動性（B ) / ( A )之値爲1 . 3〜3 . 0者宜， 1 . 5〜2 · 5爲更佳者。1 · 3以上即可取得足夠之流 (請先閲讀背面之注意事項再填寫本頁) 動性，良好之連接性。又，3 · 0以下則不易產生氣泡， 可取得良好信賴性。 本發明連接配線材料更利用示差掃描熱量計（D S C )以昇溫速度1 分鐘，進行測定時，其發熱反應之 上昇溫度（T a )爲7 0〜1 1 〇 °C之範圍者，頂點溫度 (Tp)爲Ta + 5〜30°C者，且，終了溫度（Te) 爲1 6 0 °C以下者宜。藉由具備此特性後，可於低溫連接 性，室溫下維持保存安定性。 又，本發明連接配線材料使連接後樹脂內部應力降低 ，對於提昇黏著力極爲有利者，且，可取得良好通路特性 ，硬化後2 5 °C之貯存彈性率爲1 0 0〜2 0 0 .0 Μ P a 者宜，300〜1 500MPa爲更理想。 J .配線板之製造方法 經濟部智慧財產局員工消費合作社印製 本發明連接配線材料亦可有效做爲IC Chip與chip搭 載基板間之黏著，電氣回路相互之黏著用薄膜狀黏著劑之 用者。 亦即，藉由使用本發明連接配線材料後，使具有第1 連接端子之第1配線構件與具有第2連接端子之第2配線 構件以第1連接端子與第2連接端子相向配置後使本發明 連接配線材料（薄膜狀黏著劑）介於第1配線構件與第2 配線構件間，藉由加熱及加壓後，使第1連接端子與第2 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -19 - 1290163 A7 B7 五、發明説明（17) 連接端子以電氣性連接後，製造出配線板。 又，做爲配線材料者如： 半導體chip、抵抗體chip、電容器chip等之chip零件 (請先閱讀背面之注意事項再填寫本頁) 者、 chip被搭載及/或施行光阻處理之印刷基板、 於 T A B ( Tape Outo Matid Bondeing )膠帶上搭載 chip後，施行光阻處理之T C P (膠帶攜帶捲裝） 液晶配電盤等例， 於矽_、鎘、砷、玻璃、陶瓷、玻璃、熱硬化性樹脂 之複合材料（玻璃、環氧複合體等），聚醯亞胺等塑料（ 塑料薄膜、塑料薄片等）所組之絕緣基板上，介著黏著劑 形成含形成導電性金屬箔之連接端子之配線者， 於絕緣基板上以電鍍、蒸鍍形成導電性配線者.， 塗佈電鍍觸媒等材料後形成導電性配線者等例亦可。 做爲本發明製造方法所使用理想之配線材料者以具有 T A B膠帶、F P C (撓性印刷電路基板）、P W B (印 刷配線基板）、I T〇（銦錫氧化物）、連接墊片之半導 體chip做爲代表例者。 經濟部智慧財產局員工消費合作社印製 配線材料之材質並無特別限定，如：半導體chip類之 矽酮、鎘、砷等、玻璃、陶瓷、聚醯亞胺、玻璃、熱硬化 性樹脂之複合材料（玻璃、環氧複合體等），塑膠等任一 均可。 接於連接材料之導電性連接端子之表面由銅、鎳、等 過鍍金屬所組成時，藉由其氧化還原作用後產生游離原子 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 20 - 1290163 A7 B7 五、發明説明（） (請先閱讀背面之注意事項再填寫本頁) 團。爲此，於第1連接端子進行連接配線材料之假黏著後 ，放置一定之時間後，促進原子團之聚合’造成連接材料 不易流動，無法使對準第2連接端子與原連接之位置時充 份進行電氣性連接之困擾。因此，以至少1處連接端子表 面以至少1種選自金、銀、鉑族之金屬或錫所構成者宜。 亦可組合如銅/鎳/金類之複數金屬做成多層構成者。 更且，本發明製造配線板之方法中，至少1處連接端 子被直接配置於塑料基材表面者宜。其中，做爲塑料基材 者如：聚對苯二甲酸乙酯樹脂、聚萘二甲酸乙酯樹脂、聚 醚硕樹脂、聚碳酸酯樹脂、聚醯亞胺樹脂之薄膜，薄片之 例，以聚醯亞胺樹脂所成者爲較佳。 藉由使用此塑料基材者，可使配線板厚度更薄，且輕 量化者。本發明製造方法中，使用本發明連接配線材料後 ，可於低溫下連接，因此，其玻璃轉移溫度或融點可使用 轉低之塑料者，可取得經濟面佳之配線板。 經濟部智慧財產局員工消費合作社印製 又，由薄型、輕量化面觀之，以不使用黏著劑之連接 端子直接存在於塑料所構成之配線材料比使用黏著劑連接 做成連接材料之塑料與導電材料之連接端子者更爲理想。 市販者有未使用黏著劑於銅箔等金屬箔上直接使樹脂溶液 藉由一定厚度所形成之直接塗層法所取得之附金屬箔聚醯 亞胺樹脂者，將此金屬箔進行型板化後形成之配線材料適 用於本發明者。又，利用由擠壓機等直接擠出薄膜形狀之 薄膜與金屬箔之熱壓塗者後，將此金屬箔進行型板化者亦 可供本發明使用之。 本紙張尺度適用中國國家標隼（CNS ) A4規格（21〇Χ297公釐） -21 - 1290163 A 7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（19) 〔實施例〕 以下，依實施例進行本發明具體說明。 <實施例1 > (1) 聚胺酯樹脂之合成 混合4 5 0重量份之平均分子量2 0 0 0之聚丁烯己 二酸酯二醇、450重量份之平均分子量2000之聚氧 四甲二醇、1 0 0重量份之1，4 一丁二醇後，加入 4 0 〇 〇重量份之丁酮再均勻混合之，再加入3 9 0重量 份之二苯基甲烷二異氰酸酯後，於7 0 °C下進行反應後， 取得固形份20重量％，15Pa _S (25°C)之聚胺 酯樹脂A溶液。此聚胺酯樹脂之重量平均分子量爲3 5萬 者，流動測定法之流動點爲8 0 °C者。 (2) 連接配線材料之調製 固形重量比下，進行配合上述所合成之4 0 g聚胺酯 樹脂A (固形份）、3 9 g之二羥甲基三環癸烷二丙烯酸 酯、1 g之磷酸酯型丙烯酸酯（共榮社化學股份公司製商 品名；P2M)、20g之苯氧基樹脂、5g之月桂醯過 氧化物（做爲丁酮溶液者爲2 5 g )後，更使導電性粒子 進行3體積％配合分散後，使厚度8 0 // m之單面利用塗 工裝置於表面處理之PET (聚對苯二甲酸乙酯）薄膜上 (請先閲讀背面之注意事項再填寫本頁) 項再填」 裝_Diethyldiphenylmethane) Bismaleic acid imide, N This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) -14 - Please read the back page 1290163 A7 _B7___ V. Invention description ( 12) - 4,4 diphenylmethane bismaleimide imide, N, - 4,4 diphenylpropane dimaleic anhydride imine, N, -4,4 diphenyl ether double Maleic anhydride imide, N, N> — 3, (Please read the note on the back and fill out this page) 3 / — Diphenyl sulfonic acid imide anhydride, 2, 2 - double (4 - ( 4-maleic acid imide phenoxy)phenyl)propane, 2,2-bis(3-S-butyl-3,4-(4-maleic anhydride acetimidate)phenyl) Propane, 1, 1 - bis (4 - (4 - maleic anhydride) phenyloxy) phenyl) decane, 4, monocyclic hexylene - bis (1 - (4 - maleic anhydride) )) 2- 2 -cyclohexylbenzene, 2,2-bis(4-(4-maleic anhydride)- phenyloxy)phenyl)hexafluoropropane, etc. Further, in the present invention, in addition to the upper atomic group polymerization Except for sex, if necessary It is also possible to add a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone in a timely manner. E · The ratio of the above-mentioned each of the connecting wiring materials of the present invention printed by the Intellectual Property Department of the Ministry of Seizure The compounding amount is 2 to 7 5 parts by weight of the polyurethane resin, and the atomic group polymerizable substance is 30 to 60 parts by weight, and the hardening agent for heating to generate free radicals is 〇. 1 to 3 〇 by weight of the portion of the film-forming material. When the content is 〇~4 〇 by weight, the compounding amount of these components can be appropriately selected within the above range. When the compounding amount of the polyurethane resin is less than 2 parts by weight, the heat load when the connecting wiring material is hardened When the stress relaxation effect is insufficient, the adhesion strength is lowered. Conversely, if the amount is more than 75 parts by weight, the connection reliability is insufficient. -15 1290163 A7 _B7 V. Description of the invention (13) When the amount of the atomic group-polymerizable substance is less than 30 parts by weight , 贝!] The mechanical strength of the connection wiring material is reduced after hardening. On the contrary, if it is more than 60 parts by weight, the adhesion of the connection wiring material before hardening increases, and the usability is deteriorated (please read the back side first) Note: Please fill in this page again. 〇 Further, when the amount of the curing agent which generates free radicals by heating is less than 0.1 part by weight, the above-mentioned sufficient reaction rate cannot be obtained, and it is difficult to obtain good adhesion strength and small connection resistance. Further, when the amount of the curing agent is more than 30 parts by weight, the fluidity of the connection wiring material is lowered, the connection resistance is increased, and the pot life of the connection wiring material is shortened. When the compounding amount of the film forming material is more than 40 parts by weight, Then, the fluidity of the connection wiring material is lowered, and the connection resistance is increased. Further, if the film forming material is heated by a polyurethane resin or a radical polymerizable substance, a component other than the free hardener is heated, and if it is sufficient to form a film, it is not compatible. The conductive wiring material of the present invention can be printed by the direct contact of the connection terminals even if the conductive particles are not contained, so that it is not necessary to particularly contain conductive particles. . However, in order to obtain a more stable connection, it is preferable to contain conductive particles. As the conductive particles, metal particles such as An, Ag, Ni, Cu, and solder, carbon particles, or the like can be used. In order to obtain a sufficient application period, the surface layer of the particles is not preferably a metal such as Ni or Cu, but a noble metal such as Au, Ag or a platinum group, and particularly preferably Au. This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -16 - 1290163 A7 __B7_ V. Inventive Note (14) In addition, a composite metal particle coated with a metal such as N u is coated with a noble metal such as Au. a surface of a particle such as a non-conductive glass, a ceramic, or a plastic which is covered by a conductive layer made of the above-mentioned metal or the like, and a composite particle whose surface is covered by an outermost layer made of a noble metal. The particles in which the particles are electrically conductive may also be used as the conductive particles for the present inventors. The thickness of the noble metal-based coating layer in the composite particles is not particularly limited, and it is generally preferred that the resistance is 100% or more. However, when a noble metal layer is provided on a metal plating surface such as N i , a redox effect is generated by defects such as a noble metal layer generated when the conductive particles are mixed and dispersed, and a free atomic group is generated, resulting in a decrease in pot life. Therefore, the thickness of the noble metal layer is preferably 300 Å or more. Further, when the thickness of the noble metal layer is larger than 1 // m, the effect is saturated. Therefore, it is cost-effective to have a film thickness of 1 // m or less. In addition, the composite particles made of plastic and the hot-melt metal particles have high deformability after heating and pressurization, and are easily deformed by heating and pressurization during connection, and the contact area with the connection terminal is increased, thereby improving reliability. More ideal. When the conductive particles are blended in the connecting wiring material of the present invention, the amount of the conductive particles is preferably 0.1 to 30% by volume, and may be appropriately selected depending on the application. The excess conductive particles prevent the short circuit of the adjacent circuit and the like, and therefore it is preferably 0.1 to 10% by volume. G. Additives The connecting wiring material of the present invention is in addition to the above-mentioned components A to F, and the paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210×297 mm) -17 - 1290163 A7 B7 5. Invention Description (15) It may contain a chelating material, a softening agent, an accelerator, an anti-aging agent, a coloring agent, a flame retardant, a thixotropic agent, a coupling agent, and the like. It is highly desirable to improve the connection reliability of the connection wiring materials obtained by blending the materials. The maximum diameter of the charge material is preferably smaller than the particle size of the conductive particles. The amount of the compound is preferably from 5 to 60% by volume. When it is more than 60% by volume, the effect of improving reliability is saturated. Examples of the coupling agent are preferably those having a vinyl group, a propylene group, an amine group, an epoxy group, and an isocyanate group. Η·Thin film structure The connection wiring material is not required to have all the components in a single layer, and may be formed into a laminated film of two or more layers. For example, after forming a double layer structure containing a layer of a hardener which generates a free radical and a layer containing a conductive particle, the separation of these components can effectively achieve high precision and improve the pot life. I. Characteristics of connecting wiring materials Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printing The connecting wiring materials of the present invention are connected, and the adhesives are brought into contact with the connecting terminals after the molten flow, and then connected, and then the connectors are maintained after hardening. The fluidity of the adhesive is a weight factor. After the connection wiring material of the present invention is made of glass having a thickness of 0 · 7 mm and 15 mm × 1 5 mm, the connection wiring material having a thickness of 3 5 // m and 5 mm x 5 mm is placed on the glass, and 1 60 ° is performed. C, 2 Μ P a, 1 〇 second heating and pressurization, the initial area (A) and the area after heating and pressing (B) represent the paper size applicable to the Chinese National Standard (CNS) A4 specification (210X 297 PCT) -18 - 1290163 A7 B7 V. Inventive Note (16) The fluidity (B) / (A) is 1. 3~3. 0 is appropriate, 1. 5~2 · 5 is better. 1 · 3 or more to get enough flow (please read the notes on the back and fill out this page) Dynamic, good connectivity. Moreover, when it is 3 / 0 or less, bubbles are less likely to occur, and good reliability can be obtained. The connecting wiring material of the present invention is further measured by a differential scanning calorimeter (DSC) at a temperature rising rate of 1 minute, and the rising temperature (T a ) of the exothermic reaction is in the range of 70 to 1 1 〇 ° C, and the apex temperature ( Tp) is Ta + 5 to 30 ° C, and the final temperature (Te) is preferably 160 ° C or less. By having this property, the storage stability can be maintained at room temperature at low temperature connectivity. Further, the connecting wiring material of the present invention lowers the internal stress of the resin after the connection, and is extremely advantageous for improving the adhesion, and good channel characteristics can be obtained, and the storage elastic modulus at 25 ° C after hardening is 100 to 200. 0 Μ P a should be, 300~1 500MPa is more ideal. J. Manufacturing method of wiring board The Ministry of Economic Affairs, Intellectual Property Office, Employees' Consumption Co., Ltd. Printed the wiring material of the present invention, and can be effectively used as a bonding between the IC chip and the chip mounted substrate, and the user who adheres the electric circuit to the film-like adhesive. . In other words, after the wiring member is connected by using the present invention, the first wiring member having the first connection terminal and the second wiring member having the second connection terminal are disposed to face each other with the first connection terminal and the second connection terminal. In the invention, the connection wiring material (film-like adhesive) is interposed between the first wiring member and the second wiring member, and the first connection terminal and the second paper size are applied to the Chinese National Standard (CNS) A4 by heating and pressurization. Specifications (210X297 mm) -19 - 1290163 A7 B7 V. INSTRUCTIONS (17) After the connection terminals are electrically connected, a wiring board is manufactured. In addition, as a wiring material, for example, a chip of a semiconductor chip, a resistor chip, or a capacitor chip (please read the precautions on the back side and fill out this page), a chip mounted on and/or printed with a photoresist. After carrying a chip on a TAB (Tape Outo Matid Bondeing) tape, a TCP (tape carrying package), a liquid crystal switchboard, etc., which is subjected to photoresist processing, etc., in 矽, cadmium, arsenic, glass, ceramics, glass, thermosetting resin On the insulating substrate of a composite material (glass, epoxy composite, etc.), plastic such as polyimine (plastic film, plastic sheet, etc.), a wiring including a connection terminal for forming a conductive metal foil is formed via an adhesive. For example, a conductive wiring may be formed by plating or vapor deposition on an insulating substrate, and a material such as a plating catalyst may be applied to form a conductive wiring. As a wiring material which is ideal for the manufacturing method of the present invention, a semiconductor chip having a TAB tape, an FPC (flexible printed circuit board), a PWB (printed wiring substrate), an IT (indium tin oxide), and a connection pad is used. As a representative. The materials of the printed wiring materials of the Intellectual Property Bureau of the Ministry of Economic Affairs are not limited, such as: ketones, cadmium, arsenic, etc. of semiconductor chips, glass, ceramics, polyimide, glass, thermosetting resin Any material (glass, epoxy composite, etc.), plastic, etc. When the surface of the conductive connection terminal connected to the connecting material is composed of copper, nickel, or the like, the free atom is generated by the redox reaction. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). ) _ 20 - 1290163 A7 B7 V. INSTRUCTIONS () (Please read the notes on the back and fill out this page). Therefore, after the dummy connection of the connection wiring material is performed on the first connection terminal, the polymerization of the atomic group is promoted after a certain period of time, and the connection material is hard to flow, and the alignment of the second connection terminal to the original position cannot be made sufficient. Trouble with electrical connections. Therefore, it is preferable that at least one of the connection terminal surfaces is made of at least one metal selected from the group consisting of gold, silver, and platinum group or tin. It is also possible to combine a plurality of metals such as copper/nickel/gold to form a multilayer. Furthermore, in the method of manufacturing a wiring board of the present invention, at least one of the connection terminals is preferably disposed directly on the surface of the plastic substrate. Among them, as a plastic substrate such as: polyethylene terephthalate resin, polyethylene naphthalate resin, polyether resin, polycarbonate resin, polyimide film, sheet, for example, Polyimide resin is preferred. By using this plastic substrate, the thickness of the wiring board can be made thinner and lighter. In the production method of the present invention, after the wiring material of the present invention is used, it can be connected at a low temperature. Therefore, if the glass transition temperature or the melting point of the glass can be reduced, a wiring board having a good economical surface can be obtained. The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, printed and thinned, lightweight, and the connection material that does not use the adhesive directly exists in the wiring material composed of plastic than the plastic that is connected to the connecting material by using an adhesive. It is more desirable to connect the terminals of the conductive material. A commercially available metal foil polyimide resin obtained by a direct coating method in which a resin solution is directly formed on a metal foil such as copper foil without using an adhesive to a predetermined thickness is used for singulation of the metal foil. The wiring material formed later is suitable for the inventors. Further, it is also possible to use the film which is directly extruded from a film shape and a metal foil by an extruder or the like, and then the metal foil is patterned. This paper scale applies to China National Standard (CNS) A4 specification (21〇Χ297 mm) -21 - 1290163 A 7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (19) [Embodiment] The invention will be specifically described by way of examples. <Example 1> (1) Synthesis of polyurethane resin 450 parts by weight of polybutene adipate diol having an average molecular weight of 2,000, 450 parts by weight of polyoxytetraethylene having an average molecular weight of 2000 After the diol and 100 parts by weight of 1,4-butanediol, 40 parts by weight of methyl ketone is added and then uniformly mixed, and then 390 parts by weight of diphenylmethane diisocyanate is added, After the reaction was carried out at 70 ° C, a 20% by weight solids solution of 15 Pa _S (25 ° C) of the polyurethane resin A was obtained. The polyurethane resin has a weight average molecular weight of 35,000, and the flow point of the flow measurement is 80 °C. (2) 40 g of polyurethane resin A (solids), 39 g of dimethylol tricyclodecane diacrylate, and 1 g of phosphoric acid were prepared by mixing the above-mentioned synthesized solid weight ratio of the wiring material. Conductive acrylate (trade name of Kyoeisha Chemical Co., Ltd.; P2M), 20 g of phenoxy resin, 5 g of laurel peroxide (25 g as a butanone solution) After the particles are mixed and dispersed at 3 vol%, a single surface having a thickness of 80 // m is applied to the surface treated PET (polyethylene terephthalate) film by a coating device (please read the notes on the back and fill in the form). Page) item refill"

、1T, 1T

II 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） -22 - 1290163 經濟部智慧財產局員工消費合作社印製 A7 __ B7_五、發明説明（ 進行塗佈，藉由7 0 °C、1 0分之熱風乾燥後，取得黏著 劑層厚度爲3 5 // m之連接配線材料。 又，原子團聚合性物質係使用二羥甲基三環癸烷二丙 烯酸酯者。做爲薄膜形成材料者係使用苯氧基樹脂（Union carbait公司製商品名「PKHC」··重量平均分子量 4 5 0 0 0 )者。又，做爲加熱產生游離原子團之硬化劑 者係使用月桂醯過氧化物（室溫（2 5 °C )常壓下開放放 置2 4小時時重量保持率9 7%)之2 0重量％丁酮溶液 者。做爲導電性粒子者係於以聚苯乙烯做爲核之粒子表面 設定0 · 2 // m厚度之鎳層，於此鎳層之外側設定厚度 0 · 0 4 // m之金層作成平均粒徑1 〇 // m之導電性粒子 後使用之。 (3 )配線之連接 如圖1 ( c )所示，於聚醯亞胺薄膜1 8介著黏著劑 1 7使厚度1 8 // m之銅箔連接之3層構成之附銅箔聚醯 亞胺薄膜使用之，將此銅箔於線寬1 0 0 // m，間距 2 0 0 // m進行型板化後，施與光阻處理之後，於銅箔所 形成之配線及連接端子1 6表面施與鍍S η後，搭載chip ，於2 0 0 t下以樹脂（無圖示）進行密封後作成T C P (膠帶攜帶卷裝）19者。 又，如圖1 (a)所示，使用設定厚度爲3 5//m之 銅箔層合基板1 1，使銅箔於線寬1 0 // m，間距2 0 0 // m進行型板化後形成電路1 2，施與光阻處理，進行銅 (請先閲讀背面之注意事 •Π 項再填· 裝-- :寫本頁) 、?! 本紙張尺度適用中國國家標準（〇奶）六4規格（210><29<7公釐） -23 - 1290163 A7 __B7_ 五、發明説明（21) 箔表面之鍍金後，作成印刷基板（p w B ) 1 0。 再預先於第1配線構件之p w B 1 0表面上貼附含有 樹脂組成物1 3與導電性粒子1 4之連接配線材料1 5之 連接面後，7 0 °C，0 · 5 Μ P a進行5秒鐘加熱加壓後 做成假連接，之後，剝離P E T薄膜（圖1 ( b )) ’於 此對準第2配線構件之T C P 1 9之位置載置後（圖1 ( c ))，加熱之同時加壓進行連接後，取得配線板2 1 ( 圖 1 ( d ))。 <實施例2 > (1) 胺酯丙烯酸酯之合成 將4 0 0重量份之平均分子量8 0 0之聚己.內酯二醇 與1 3 1重量份之2 -羥基丙基丙烯酯酸，0 . 5重量份 之做爲觸媒之二丁錫二月桂酸酯，1·0重量份之做爲聚 合禁止劑之對苯二酚單甲醚進行攪拌之同時，於5 0°C下 加熱混合之。再滴入2 2 2重量份之異佛爾酮二異氰酸酯 後，更進行攪拌之同時昇溫至8 0 °C後進行尿烷化反應。 確定N C〇反應率爲9 9 %以上後，降低反應溫度後，取 得胺酯丙烯酸酯B。 (2) 聚醯亞胺樹脂之合成 將酸二無水物之2，2 —雙（4 一（3，4 一二羧基 苯氧基）苯基）丙烷二酐（26 · lg)溶於120g之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -24 - jlpj-辦衣-- (請先閲讀背面之注意事項再填寫本頁) 、-5't> 經濟部智慧財產局員工消費合作社印製 1290163 A7 B7 五、發明説明（22) 環己酮後，取得酸二酐溶液。 又，將二胺之2，2 -雙（4— (4 一胺基苯氧基） 苯基）丙院（14 · 4g) ，1，3 —雙（3 —胺基丙基 )—1 ，1 ，3 ，3 —四甲基二矽氧烷（3 . 8g)溶於 1 2 0 g之環己酮後，取得二胺溶液。 調整此二胺溶液之反應系溫度爲5 〇 °C以內，同時滴 入酸二酐溶液之燒瓶內，滴完後更攪拌1 〇小時。再裝置 水分餾管，加入5 0 g之甲苯後昇溫至1 2 0 °C後保持8 小時後，進行亞胺化。 將取得溶液冷却至室溫後，於甲醇中再沈降取得沈澱 物經乾燥後，取得重量平均分子量3 2 0 〇 0之聚醯亞胺 樹脂。此溶於四氫呋喃後做爲2 0重量％之聚醯亞胺溶液 C 〇 (3)連接配線材料之調製及配線板之製造 除做爲聚胺酯樹脂以實施例1所合成之4 0 g聚胺酯 樹脂（固形份），做爲原子團聚合性物質以（1 )所合成 之3 9 g胺酯丙烯酸酯B及1 g之磷酸酯型丙烯酸酯，做 爲薄膜形成材料者以（2 )所合成之2 0 g聚醯亞胺樹脂 C (固形份）使用之外，與實施例1同法調製連接配線材 料後，製造配線板。 <實施例3 > 使用如圖2所示之聚醯亞胺薄膜2 2與厚度1 8 /zm (請先閲讀背面之注意事項再填寫本頁) -裝. 訂 經濟部智慧財產局員工消費合作社印製 木紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -25 - 1290163 Μ _______Β7_ 五、發明説明（23) 之銅箔所成之雙層構成附銅箔之聚醯亞胺薄膜後，將此銅 箔於線寬1 0 0 # m，間距2 0 0 // m進行型板化後形成 電路及連接端子2 3，進行光阻處理後，於連接端子2 3 表面施與鍍Au後，製成撓性配電板（FPC) 24。此 F P C2 4取代TCP 1 9使用之外，與實施例2同法取 得配線板。 <實施例4 > 於玻璃基板2 5之表面藉由I 丁〇設置連接端子及配 線2 6之液晶配電盤2 7做爲取代印刷基板（p w B ) 1 0使用之外與實施例3同法利用厚度1 5 //m之連接配 線材料取得配線板。 <比較例1 > 經濟部智慧財產局員工消費合作社印製 使用苯氧基樹脂（PKHC Union carbaid公司製商品名「 PKHC」：重量平均分子量45000)，雙酹A型環 氧樹脂（油化shell epoxi股份公司製商品名「γ [ 9 8 0 」及咪唑系微膠囊型硬化劑（旭化成工業股份公司製商品 名「3941HP」）’使苯氧基樹脂/雙酚a型環氧樹 脂/咪唑系微膠囊型硬化劑之固形重量比爲4 〇/2 〇/ 4 0 ’於此配合與實施例1相同之導電性粒子後，使用調 製之連接配線材料之外’與貫施例1同法製造配線板。 <比較例2 > -26- 大後尺唐適用中國國家標準（CNS)A4規格（210X297公酱） 1290163 A7 B7 五、發明説明（24) 以苯氧基樹脂（P K H C )取代聚胺酯樹脂使用之外 ，與實施例1同法取得連接配線材料，製造配線板。 利用以上實施例1〜4及比較例1、2所取得之連接 配線材料及配線板後，測定其黏著力、連接抵抗、保存性 、絕緣性、聚胺酯樹脂之流動性、連接配線材料之流動性 、硬化後之彈性率、D S C後進行評定。結果如表1所示 。又，測定及評定之方法如下。 (1 )黏著力之測定 將取得之配線材料連接體（配線板）往9 0度方向以 剝離速度5 0 m m /分鐘進行剝離，測定其黏著力。黏著 力係於製作配線板初期與8 5 °C、8 5 % R Η之高溫高濕 槽中保持5 0 0小時之後進行測定之。 (2 )連接抵抗之測定 利用所取得之連接配線材料，使進行線寬1 Ο Ο /ζ m ，間距2 0 0 // m，厚度1 8 // m鍍錫之銅電路配線 1 0 0條撓性電路板（F P C )以及於整體形成I T〇膜 之玻璃板於1 6 0 °C，3 Μ P a，進行1 0秒鐘之加熱加 壓後連接2 m m寬度者。 此連接體鄰接電路間之抵抗値於初期與8 5 °C， 8 5 % R Η之高溫高濕槽中保持5 0 0小時後，以 multimeten進行測定。抵抗値代表鄰接電路間之抵抗5 0點 之平均。 (請先閲讀背面之注意事項再填寫本頁) -裝. 訂 經濟部智慧財產局員工消費合作社印製 欠祕.後尺疳谪用中國國家標準（CNS ) A4規格（210X297公釐） -27 - 1290163 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（25) (3)保存性之評定 將取得連接配線材料於3 0 t恒溫槽內保持3 0天後 ，與該（2 )同法進行連接電路後，進行評定保存性。 (4 )絕緣性之評定 使用取得之連接配線材料後將具有交互配置2 5 0條 之線寬1 0 0//m，間距20 0//m，厚度3 5//m之銅 電路之梳形電路印刷基板與具有5 0 0條線寬1 0 0 # m ，間距2 0 0 //m，厚度1 8 之銅電路之撓性電路板 (F P C )以1 6 0 °C，3 Μ P a進行1 0秒鐘加熱加壓 後連接寬度2 m m者。於此連接體之梳形電路外加1 0 0 V電壓後，測定8 5 °C，8 5 % R Η之高溫高濕試.驗 5 0 0小時後之絕緣抵抗値。 (5) 聚胺酯樹脂之流動點測定 使用流動測定器（股份公司島津製作所製商品名「 CFT — 100型」），直徑lmm之模，以3MPa之 壓力，2 分鐘之昇溫速度下測定圓筒移動溫度做成流 動點。 (6) 連接配線材料之流動性評定 利用厚度3 5 // m，5 m m X 5 m m之連接配線材料 ，將此挾於厚度0 _ 7 m m，1 5 m m x 1 5 m m之玻璃 (請先閲讀背面之注意事項再填寫本頁) -裝. 訂 線· 太紙檨尺膚iS用中國國家標準（CNS ) A4規格（210X297公釐） -28- 1290163 A7 B7 五、發明説明（26) 後，於1 6 0 °c，2 Μ P a，進行1 0秒鐘加熱加壓。以 初期面積（A )與加熱加壓後之面積（B )求取流動性（ B ) / ( A )之値做爲流動性。 (7 )硬化後之彈性率 將連接配線材料浸漬於1 6 0 t之油中1分鐘後使硬 化之。利用動態黏彈性測定裝置測定硬化之薄膜貯存彈性 率（昇溫速度5 °C /分鐘，1 0 Η z )，測定2 5 °C之彈 性率。 (8 ) D S C之測定 使用取得之連接配線材料利用示差掃描熱量計（ D S C、TA Qnstulment公司製商品名「9 1 0型」）求取 1 〇 °C /分鐘測定中發熱反應之上昇溫度（T a )、頂點 溫度（T p )及結束溫度（T e )。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 太紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 29 - 1290163 五、發明説明（27) 表1 項目 實施例1 實施例2 實施例3 實施例4 比較例1 比較例2 黏著力 初期 1000 1000 800 1000 100 200 (gf/cm) 85t，85%RH，500h 800 900 600 900 剝離 剝離 連接抵 初期 2.2 2.3 2.1 2.1 90.6 2.1 抗(Ω) 85°C，85%RH，500h 2.6 2.6 2.5 2.5 >500 2.6 保存性[連接抵抗(Ω)] 2.2 2.4 2.3 2.2 120 2.3 絕緣抵 初期 lx 109< lx 109< lx 109< lx 109< lx 109< lx 109< 抗(Ω) 85〇C，85%RH，500h lx 109< lx 109< lx 109< lx 109< lx 106< lx 109< 流動性 1.9 1.9 1.9 1.9 2.4 1.8 彈性率(25〇C)(MPa) 800 600 600 600 1800 1400 發熱反 上昇溫度⑽ 89 92 92 92 98 86 應 頂點溫度(Tp) 107 106 106 106 125 101 (DSCX °〇 終了溫度(Te) 148 150 150 150 160 142 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 3〇 - 1290163 A7 B7 五、發明説明（2δ) 任一實施例中，其黏著力初期値均爲7 · 8 5〜 9.81N/cm(800〜1000gf/cm)，耐 濕試驗後均爲5·88〜8·83N/cm(600〜 (請先閲讀背面之注意事項再填寫本頁) 9 0 0 g f / c m )無明顯降低黏著強度，顯示良好之黏 著性。比較例1其硬化反應不全，比較例2未使用聚胺酯 樹脂故黏著強度僅爲1·96N/cm(200gf/ c m )之極低黏著力者。 實施例1所取得之連接配線材料顯示其初期連接抵抗 低，高溫高濕試驗後之抵抗上昇極有限之良好連接信賴性 者。又，實施例2、3、4，比較例2之連接配線材料亦 同樣可取得良好連接信賴性者。相較於比較例1則比較例 1之硬化反應較爲不足，因此，黏著狀態不良，初期連接 抵抗變高。 實施例1〜4中，與於3 0 °C之恆溫槽未處理3 0日 之狀態（初期）取得同等之連接結果。又，實施例1〜4 中，取得1 · 0 X 1 0 9 Ω以上良好之絕緣性，未出現絕緣 性降低現象。 經濟部智慧財產局員工消費合作社印製 針對流動性其實施例1及2均爲1 · 9者。又，測定 實施例1之連接配線材料硬化後之2 5 °C彈性率爲8 0 0 Μ P a 者。 更且，實施例1連接配線材料之硬化反應中上昇溫度 爲8 9 °C，頂點溫度爲1 〇 7 t，結束溫度爲1 4 8 °C者 ，實施例2之上昇溫度爲9 2 °C，頂點溫度爲1 0 6 t， 結束溫度爲1 5 0 t者。由此，顯示於更低溫度下進行硬 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -31 - 1290163 A7 B7 _ 五、發明説明（29) 化者，且，由保存性之評定結果顯示良好保存性者。 另外，連接抵抗之測定中，準備未於銅電路鍍鍚者， 利用實施例1所製作之連接配線材料，與實施例1相同條 件下，於F P C進行假連接，放置1天後，進行正式連接 後，測其連接抵抗後，針對鑛錫時之2 · 3 Ω，其未鍍鍚 之銅表面所露出者爲5 Ω。 〔產業上可利用性〕 根據如上述之本發明可提供一種比先行環氧樹脂系更 低溫連硬化性更良好，且具有可使用時間，電路腐蝕性極 少之電氣，電子用的連接配線材料者。 (請先閲讀背面之注意事項再填寫本頁) 裝·II This paper scale applies to China National Standard (CNS) Α4 specification (210X297 mm) -22 - 1290163 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 __ B7_5, invention description (coating, by 70 ° C. After 10 minutes of hot air drying, a connection wiring material having a thickness of the adhesive layer of 35 @ m was obtained. Further, as the atomic polymerizable substance, dimethyloltricyclodecane diacrylate was used. For the material to be formed, a phenoxy resin (trade name "PKHC" manufactured by Union carbait Co., Ltd., weight average molecular weight of 4,500) was used, and as a hardener for heating to generate free radicals, laurel was used for peroxidation. The product (20% by weight of the butanone solution at room temperature (25 ° C) at room temperature and open for 24 hours at a weight retention rate of 9 7%) is used as a conductive particle in polystyrene. The surface of the particle of the core is set to a nickel layer of 0 · 2 // m thickness, and a gold layer having a thickness of 0 · 0 4 // m is set on the outer side of the nickel layer to be used as an electroconductive particle having an average particle diameter of 1 〇//m. (3) Wiring connection as shown in Figure 1 (c), on the polyimide film 1 8 using a copper foil polyimide film composed of 3 layers of a copper foil having a thickness of 1 8 // m by means of an adhesive 1 7 , the copper foil is used at a line width of 1 0 0 // m, pitch 2 0 0 // m After the slab is formed, after the photoresist treatment, the wiring formed on the copper foil and the surface of the connection terminal 16 are plated with S η , and then chip is mounted, and the resin is used at 200 t. (not shown) After sealing, it is made into a TCP (tape carrying package) 19. Further, as shown in Fig. 1 (a), a copper foil laminated substrate 1 1 having a thickness of 35/m is used to make copper. The foil is lined at a width of 1 0 // m, and the pitch is 2 0 0 // m. After the slab is formed, the circuit 1 2 is formed, and the photoresist is applied to perform copper (please read the back of the note first) Π refill and install -- : Write this page ) , ?! This paper scale applies to the Chinese national standard (〇奶) six 4 specifications (210 >< 29 < 7 mm) -23 - 1290163 A7 __B7_ five, invention description (21) foil surface After the gold plating, the printed circuit board (pw B ) 10 is formed. The connection of the connection wiring material 15 including the resin composition 13 and the conductive particles 14 is attached to the surface of the pw B 1 0 of the first wiring member. After the face, 7 0 °C, 0 · 5 Μ P a is heated and pressurized for 5 seconds to make a false connection, and then the PET film is peeled off (Fig. 1 (b)) 'This is aligned with the TCP of the second wiring member. After the position is placed (Fig. 1 (c)), the connection is made while heating, and the wiring board 2 1 is obtained (Fig. 1 (d)). <Example 2 > (1) Synthesis of amine ester acrylate 400 parts by weight of a polycaprolactone diol having an average molecular weight of 800 and 1 31 parts by weight of 2-hydroxypropyl acrylate Acid, 0.5 parts by weight of dibutyltin dilaurate as a catalyst, and 1.0 part by weight of hydroquinone monomethyl ether as a polymerization inhibitor, while stirring at 50 ° C Mix under heat. Further, 22 2 parts by weight of isophorone diisocyanate was added dropwise, and the mixture was heated to 80 ° C while stirring, and then subjected to urethane reaction. After the reaction rate of N C 确定 was determined to be 99% or more, the amine ester acrylate B was obtained after lowering the reaction temperature. (2) Synthesis of polyimine resin 2,2-bis(4-(3,4-dicarboxyphenoxy)phenyl)propane dianhydride (26 · lg) of acid di-anhydride is dissolved in 120 g This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -24 - jlpj-clothing-- (please read the notes on the back and fill out this page), -5't> Ministry of Economic Affairs Intellectual Property Bureau Employee consumption cooperative printed 1290163 A7 B7 V. Invention description (22) After cyclohexanone, the acid dianhydride solution was obtained. Further, a diamine of 2,2-bis(4-(4-aminophenoxy)phenyl)propylamine (14·4g), 1,3-bis(3-aminopropyl)-1, After the 1,3,3-tetramethyldioxane (3.8 g) was dissolved in 120 g of cyclohexanone, a diamine solution was obtained. The reaction temperature of the diamine solution was adjusted to be within 5 〇 ° C while dropping into the flask of the acid dianhydride solution, and the mixture was further stirred for 1 hr. The apparatus was further equipped with a water-reducing tube, and after adding 50 g of toluene, the temperature was raised to 1,200 ° C and maintained for 8 hours, followed by imidization. After the obtained solution was cooled to room temperature, it was further precipitated in methanol to obtain a precipitate, which was dried to obtain a polyimine resin having a weight average molecular weight of 3,200 Å. This is dissolved in tetrahydrofuran and used as a 20% by weight solution of polyimine. C 〇 (3) Preparation of wiring material and wiring board manufacturing. In addition to the polyurethane resin, 40 g of polyurethane resin synthesized in Example 1 ( Solid content), as a radical polymerizable substance, (9) synthesized 39 9 amino ester acrylate B and 1 g phosphate ester acrylate, as a film forming material, (2) synthesized 2 0 A wiring board was produced by disposing a wiring material in the same manner as in Example 1 except that the poly-imine resin C (solid content) was used. <Example 3 > The use of the polyimide film 2 2 and the thickness of 1 8 /zm as shown in Fig. 2 (please read the back of the note before refilling this page) - Installed. Ministry of Economic Affairs Intellectual Property Office staff Consumer Cooperatives Printed Wood Paper Scale Applicable to China National Standard (CNS) A4 Specification (210X297 mm) -25 - 1290163 Μ _______Β7_ V. Invention Description (23) The two-layered copper foil is made of copper foil. After the amine film, the copper foil is patterned by a line width of 1 0 0 # m and a pitch of 2 0 0 // m to form a circuit and a connection terminal 23, and after photoresist treatment, the surface of the connection terminal 2 3 is applied. After Au plating, a flexible switchboard (FPC) 24 is fabricated. This F P C2 4 was used in the same manner as in Example 2 except that the TCP 19 was used. <Example 4> The liquid crystal switchboard 27 provided with the connection terminal and the wiring 26 on the surface of the glass substrate 25 as the substitute printed circuit board (pw B ) 10 is used in the same manner as in the third embodiment. The wiring board is obtained by using a connection wiring material having a thickness of 1/5 //m. <Comparative Example 1 > Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative printed and sold phenoxy resin (trade name "PKHC" manufactured by PKHC Union carbaid Co., Ltd.: weight average molecular weight 45,000), double bismuth A type epoxy resin (oilification) The product name "γ [ 9 8 0 " and the imidazole-based microcapsule type hardener (trade name "3941HP" by Asahi Kasei Kogyo Co., Ltd.) made by epoxi Co., Ltd. - phenoxy resin / bisphenol a type epoxy resin / imidazole The solid weight ratio of the microcapsule-type hardener is 4 〇 / 2 〇 / 40 ′. The same conductive particles as in the first embodiment are used, and the prepared connecting wiring material is used, and the same method as in the first embodiment is used. Manufacturing of wiring board. <Comparative Example 2 > -26- China National Standard (CNS) A4 specification (210X297 public sauce) 1290163 A7 B7 5. Invention description (24) Phenoxy resin (PKHC) The wiring material was obtained by the same method as in Example 1 except that the polyurethane resin was used in the same manner as in Example 1. The connection wiring material and the wiring board obtained in the above Examples 1 to 4 and Comparative Examples 1 and 2 were used, and the adhesion was measured. Connection resistance, The storage, the insulating properties, the fluidity of the polyurethane resin, the fluidity of the connection wiring material, the elastic modulus after curing, and the DSC were evaluated. The results are shown in Table 1. Further, the methods of measurement and evaluation are as follows: (1) Adhesion Measurement of the force The wiring material connector (wiring board) obtained was peeled off at a peeling speed of 50 mm / min in the direction of 90 degrees, and the adhesive force was measured. The adhesive force was at the initial stage of making the wiring board with 8 5 ° C, 8 The measurement was carried out after maintaining the temperature in the high-temperature and high-humidity tank of 5 % R 5 for 500 hours. (2) Measurement of connection resistance Using the obtained connection wiring material, the line width was 1 Ο Ο /ζ m , and the pitch was 2 0 0 // m, thickness 1 8 // m tin-plated copper circuit wiring 1 0 0 flexible circuit board (FPC) and a glass plate integrally forming an IT film at 1 60 ° C, 3 Μ P a, After heating and pressurizing for 10 seconds, connect the width of 2 mm. The resistance between the adjacent circuits of this connector is maintained for 500 hours in the high temperature and high humidity tank at 8 5 °C, 8 5 % R ,. The measurement is performed in multimeten. The resistance 値 represents the average of the resistance between adjacent circuits of 50 points. Read the notes on the back and fill out this page. - Install. The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, prints the secret. After the rule, the Chinese National Standard (CNS) A4 specification (210X297 mm) -27 - 1290163 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (25) (3) assessment of preservability will be obtained after connecting the wiring material in the 30 t thermostat for 30 days, with the same (2) After the connection circuit is performed, the evaluation is preserved. (4) Insulation evaluation After using the obtained connection wiring material, there will be a comb of copper circuits with an interconnecting arrangement of 250 lines with a line width of 1 0 0//m, a pitch of 20 0//m and a thickness of 3 5//m. The printed circuit board has a flexible circuit board (FPC) with a copper circuit of 500 line width 100° m, a pitch of 2 0 0 //m, and a thickness of 18, at 160 ° C, 3 Μ P a After heating and pressurizing for 10 seconds, the connection width is 2 mm. After adding a voltage of 100 V to the comb-shaped circuit of the connector, the high-temperature and high-humidity test of 85 ° C, 8 5 % R 测定 was measured to test the insulation resistance after 500 hours. (5) Measurement of the flow point of the polyurethane resin Using a flow measuring device (trade name "CFT-100 type" manufactured by Shimadzu Corporation), a mold having a diameter of 1 mm, the cylinder moving temperature was measured at a temperature of 3 MPa and a heating rate of 2 minutes. Make a point of flow. (6) Fluidity evaluation of the connection wiring material Using a connection wiring material with a thickness of 3 5 // m, 5 mm X 5 mm, the glass is placed at a thickness of 0 _ 7 mm, 1 5 mm x 15 mm (please read first) Precautions on the back side of this page) - Packing. Ordering line too paper size iS with Chinese National Standard (CNS) A4 size (210X297 mm) -28- 1290163 A7 B7 V. Invention description (26) At 1 60 °c, 2 Μ P a, heating and pressurization was carried out for 10 seconds. The fluidity (B) / (A) was determined as the fluidity by the initial area (A) and the area (B) after heating and pressurization. (7) Elasticity after hardening The connecting wiring material was immersed in the oil of 160 k for 1 minute and then hardened. The elastic modulus of the film of the hardened film was measured by a dynamic viscoelasticity measuring device (temperature rising rate of 5 ° C / min, 10 Η z ), and the elastic modulus at 25 ° C was measured. (8) The measurement of the DSC is performed by using a differential scanning calorimeter (product name "9 1 0" manufactured by DSC, TA Qnstulment Co., Ltd.) using the obtained connection wiring material. The rise temperature of the exothermic reaction in the measurement of 1 〇 ° C / min (T a), vertex temperature (T p ) and end temperature (T e ). (Please read the notes on the back and fill out this page.) Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printed too paper scale Applicable to China National Standard (CNS) A4 Specification (210X297 mm) _ 29 - 1290163 V. Invention Description (27 Table 1 Project Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Adhesive initial 1000 1000 800 1000 100 200 (gf/cm) 85t, 85% RH, 500h 800 900 600 900 Peel-off joint Early arrival 2.2 2.3 2.1 2.1 90.6 2.1 Resistance (Ω) 85 ° C, 85% RH, 500 h 2.6 2.6 2.5 2.5 > 500 2.6 Preservation [connection resistance (Ω)] 2.2 2.4 2.3 2.2 120 2.3 Insulation resistance initial lx 109 < Lx 109< lx 109< lx 109< lx 109< lx 109< resistance (Ω) 85〇C, 85% RH, 500h lx 109< lx 109< lx 109< lx 109< lx 106< lx 109< liquidity 1.9 1.9 1.9 1.9 2.4 1.8 Elasticity (25〇C) (MPa) 800 600 600 600 1800 1400 Heating reverse rising temperature (10) 89 92 92 92 98 86 Shoulder temperature (Tp) 107 106 106 106 125 101 (DSCX ° end temperature ( Te) 148 150 150 150 160 142 (Please read the notes on the back first) Fill in this page) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed Paper Size Applicable to China National Standard (CNS) A4 Specification (210X297 mm) _ 3〇- 1290163 A7 B7 V. Invention Description (2δ) In any embodiment The initial adhesion of the adhesive is 7 · 8 5 ~ 9.81 N / cm (800 ~ 1000gf / cm), after the humidity test is 5 · 88 ~ 8 · 83N / cm (600 ~ (Please read the back of the note first) Matters fill in this page) 9 0 0 gf / cm ) No significant reduction in adhesion strength, showing good adhesion. Comparative Example 1 has incomplete hardening reaction, Comparative Example 2 does not use polyurethane resin, so the adhesion strength is only 1.96 N/cm The extremely low adhesion of (200 gf/cm). The connection wiring material obtained in Example 1 showed low initial connection resistance and good connection reliability after the high temperature and high humidity test. Further, in the second, third, and fourth embodiments, the connection wiring material of Comparative Example 2 can also achieve good connection reliability. In Comparative Example 1, the hardening reaction of Comparative Example 1 was insufficient, so that the adhesion state was poor and the initial connection resistance was high. In Examples 1 to 4, the same connection results were obtained as in the state (initial) in which the thermostatic chamber at 30 °C was not treated for 30 days. Further, in Examples 1 to 4, good insulating properties of 1 · 0 X 1 0 9 Ω or more were obtained, and the insulation property was not lowered. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives. For the liquidity, the examples 1 and 2 are 1 · 9. Further, the elastic modulus at 25 ° C after curing of the connecting wiring material of Example 1 was measured to be 80 Μ P a . Further, in the hardening reaction of the connection wiring material of Example 1, the rising temperature was 8 9 ° C, the peak temperature was 1 〇 7 t, and the end temperature was 148 ° C. The rising temperature of Example 2 was 9 2 ° C. The vertex temperature is 1 0 6 t, and the end temperature is 1 50 0 t. Therefore, it is displayed at a lower temperature for the hard paper scale. Applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -31 - 1290163 A7 B7 _ V. Invention description (29), and, by preservative The results of the assessment showed good preservation. In addition, in the measurement of the connection resistance, the copper wire was not plated, and the connection wiring material produced in Example 1 was used, and under the same conditions as in Example 1, the FPC was dummy-connected, and the connection was made for one day, and then the connection was made. After that, after measuring the connection resistance, it is 2 Ω for the tin-plated tin, and the surface of the un-plated copper is 5 Ω. [Industrial Applicability] According to the present invention as described above, it is possible to provide a connection wiring material for electrical and electronic use which is more excellent in curing ability than the prior epoxy resin, and which has a usable time and is extremely corrosive to the circuit. . (Please read the notes on the back and fill out this page)

、1T k 經濟部智慧財產局員工消費合作社印製 本、氏張尺度適用中國國家榡準（CNS ) A4規格（210X297公釐）-32 -, 1T k Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing Ben, Zhang scale applicable China National Standard (CNS) A4 specifications (210X297 mm) -32 -

Claims (1)

六、申請專利範圍 1 (請先閲讀背面之注意事項再填寫本頁) 1 _ 一種連接配線材料，其特徵係含有2〜7 5重量 份之聚胺酯樹脂、3 0〜6 0重量份之原子團聚合性物質 、及0·1〜30重量份之加熱後產生游離原子團之硬化 劑者。 2 .如申請專利範圍第1項之連接配線材料，其中該 材料更含有0〜4 0重量份之薄膜形成材料者。 3.如申請專利範圍第2項之連接配線材料，其中該薄 膜形成材料爲選自聚醯亞胺樹脂、聚乙烯甲縮醛樹脂、聚 苯乙烯樹脂、聚乙烯丁縮醛樹脂、聚酯樹脂、丙烯酸樹脂 '聚醯胺樹脂、二甲苯樹脂、苯氧基樹脂。 4 ·如申請專利範·圍第2項之連接配線材料，其中該薄 膜形成材料爲聚醯亞胺樹脂者。 5 ·如申請專利範圍第1項至第4項中任一項之連接配 線材料，其中該材料更含有導電性粒子者。 6.如申請專利範圍第1項至第4項中任一項之連接配 線材料，其中該聚胺酯樹脂的重量平均分子量爲 10000〜1000000 〇 經濟部智慧財產局員工消費合作社印製 7 .如申請專利範圍第1至第4項中任一項之連接配線 材料，其中該聚胺酯樹脂藉由流動測定法所測定之流動點 爲 40 t：〜140 °C 者。 8 ·如申請專利範圍第1項至第4項中任一項之連接配 線材料，其中該硬化劑之2 5 °C、2 4小時重量保持率爲 20重量％以上者。 9.如申請專利範圍第1項至第4項中任一項之連接配 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1290163 A8 B8 C8 D8 六、申請專利範圍 2 線材料，其中該原子團聚合性物質爲1種以上選自丙烯酸 酯、甲基丙烯酸酯、馬來酸酐縮亞胺化合物。 I 0 .如申請專利範圍第1項至第4項中任一項之連接 配線材料，其中該原子團聚合性物質爲胺酯丙烯酸酯者。 II · 一種製造配線板之方法，其特徵爲包含使分別具 有連接端子之配線材料間連接可導通該連接端子間之連接 步驟，該連接步驟係包含有下述步驟：使如申請專利範圍 第1項至第4項中任一項之連接配線材料夾置於具有該連 接端子之面呈相互面對而配置之2個以上配線構件之間， 經由該配線構件進行加壓並同時加熱。 12 ·如申請專利範圍第11項之製造配線板方法，其中 該連接端子中至少1個之表面係由至少1種選自金、銀及 鉛族之金屬所成者。 I3, —種配線板，係使具有第1連接端子之第1配線 構件與具有第2連接端子之第2配線構件以第1連接端子 與第2連接端子相互面對而配置，該等相互面對配置之第1 配線構件與第2配線構件之間介由連接配線材料，經由加 熱及加壓，使該第1連接端子與該第2連接端子以電連接 之配線板，其特徵爲該連接配線材料爲含有2〜7 5重量 份之聚胺酯樹脂' 3 0〜6 0重量份之原子團聚合性物質 、及0 · 1〜3 0重量份之加熱後產生游離原子團的硬化 劑者。 1 4 ·如申請專利範圍第1 3項之配線板，其中該連接配 線材料更含有〇〜重量份之薄膜形成材料。 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） — (請先聞讀背面之注意事項再填寫本頁) 訂 d 經濟部智慧財產局員工消費合作社印製 -34- 1290163 A8 B8 C8 __D8 六、申請專利範圍 3 (請先閲讀背面之注意事項再填寫本頁) 1 5 ·如申請專利範圍第1 4項之配線板，其中該薄膜形 成材料爲選自聚醯亞胺樹脂、聚乙烯甲縮醛樹脂、聚苯乙 烯樹脂、聚乙烯丁縮醛樹脂、聚酯樹脂、丙烯酸樹脂、聚 醯胺樹脂、二甲苯樹脂、苯氧基樹脂。 16.如申請專利範圍第14項之配線板，其中該薄膜形 成材料爲聚醯亞胺樹脂者。 1 7 .如申請專利範圍第1 3項至第1 6項中任一項之配 線板，其中該連接配線材料更含有導電性粒子者。 1 8 ·如申請專利範圍第ι·3項至第1 6項中任一項之配 線板’其中該聚胺酯樹脂的重量平均分子量爲 10000〜1000000 ° 19 ·如申請專利範圍第13至第16項中任一項之配線 板’其中該聚胺酯樹脂藉由流動測定法所測定之流動點爲 40^〜140<1：者。 2 〇 ·如申請專利範圍第1 3項至第1 6項中任一項之配 線板，其中該硬化劑之2 5 °C、2 4小時重量保持率爲 20重量％以上者。 經濟部智慧財產局員工消費合作社印製 2 1 ·如申請專利範圍第1 3項至第i 6項中任一項之配 線板，其中該原子團聚合性物質爲1種以上選自丙烯酸酯 、甲基丙烯酸酯、馬來酸酐縮亞胺化合物。 22 ·如申請專利範圍第1 3項至第1 6項中任一項之配 線板，其中該原子團聚合性物質爲胺酯丙燒酸酯者。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）Sixth, the scope of application for patent 1 (please read the note on the back and then fill out this page) 1 _ A connection wiring material characterized by containing 2 to 7 5 parts by weight of polyurethane resin, 30 to 60 parts by weight of atomic group polymerization The substance, and 0 to 1 to 30 parts by weight of the hardener which generates a free radical after heating. 2. The connecting wiring material of claim 1, wherein the material further contains 0 to 40 parts by weight of the film forming material. 3. The connection wiring material according to claim 2, wherein the film forming material is selected from the group consisting of a polyimide resin, a polyvinyl acetal resin, a polystyrene resin, a polyvinyl butyral resin, and a polyester resin. , acrylic resin 'polyamide resin, xylene resin, phenoxy resin. 4. For example, the connection wiring material of the second application of Patent No. 2, wherein the film forming material is a polyimide resin. 5. The connecting wiring material according to any one of claims 1 to 4, wherein the material further contains conductive particles. 6. The connection wiring material according to any one of claims 1 to 4, wherein the weight average molecular weight of the polyurethane resin is 10,000 to 1,000,000. 〇 Printing by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economy 7 . The connecting wiring material according to any one of items 1 to 4, wherein the polyurethane resin has a pour point of 40 t: to 140 ° C as measured by a flow measurement method. The connecting wiring material according to any one of claims 1 to 4, wherein the curing agent has a weight retention ratio of 20% by weight or more at 25 ° C for 24 hours. 9. For the connection paper size of any of the scopes 1 to 4 of the patent application, apply the Chinese National Standard (CNS) A4 specification (210X297 mm) 1290163 A8 B8 C8 D8 6. Apply for the patent scope 2 line material, Among these, the atomic group-polymerizable substance is one or more selected from the group consisting of an acrylate, a methacrylate, and a maleic anhydride imide compound. The connection wiring material according to any one of claims 1 to 4, wherein the atomic group-polymerizable substance is an amine ester acrylate. II. A method of manufacturing a wiring board, comprising the step of connecting between wiring materials each having a connection terminal to electrically connect the connection terminals, the connection step comprising the steps of: The connection wiring material according to any one of the items 4 to 4 is placed between two or more wiring members which are disposed to face each other with the surface of the connection terminal, and are heated by the wiring member while being heated. The method of manufacturing a wiring board according to claim 11, wherein the surface of at least one of the connection terminals is made of at least one metal selected from the group consisting of gold, silver and lead. I3, a wiring board in which a first wiring member having a first connection terminal and a second wiring member having a second connection terminal are disposed such that a first connection terminal and a second connection terminal face each other, and the mutual interface A wiring board that electrically connects the first connection terminal and the second connection terminal via a connection wiring material via the connection wiring material between the first wiring member and the second wiring member, and is characterized in that the connection is The wiring material is a radical polymerizable material containing 2 to 75 parts by weight of a polyurethane resin '30 to 60 parts by weight, and 0 to 1 to 30 parts by weight of a hardener which generates a free radical after heating. 1 4 The wiring board of claim 13 wherein the connecting wiring material further comprises 〇-parts by weight of a film forming material. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) — (please read the note on the back and fill out this page). Order d Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Print -34- 1290163 A8 B8 C8 __D8 VI. Patent Application No. 3 (Please read the note on the back and fill out this page) 1 5 · If you apply for the wiring board of Article 14 of the patent scope, the film forming material is selected from polyimine. Resin, polyvinyl acetal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, acrylic resin, polyamide resin, xylene resin, phenoxy resin. 16. The wiring board of claim 14, wherein the film forming material is a polyimide resin. The wiring board according to any one of claims 1 to 16, wherein the connecting wiring material further contains conductive particles. 1 8 . The wiring board of any one of the items of the first to sixth aspects of the invention, wherein the weight average molecular weight of the polyurethane resin is 10000 to 1000000 ° 19 · as disclosed in claims 13 to 16 In the wiring board of any one of the above, the flow point of the polyurethane resin measured by a flow measurement is 40^ to 140<1. The wiring board according to any one of claims 1 to 16, wherein the curing agent has a weight retention ratio of 20% by weight or more at 24 ° C for 24 hours. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Employees' Consumer Cooperatives. 1 1 . The wiring board of any one of the above-mentioned patents, the one or more of A acrylate, maleic anhydride imide compound. The wiring board according to any one of claims 1 to 16, wherein the atomic group-polymerizable substance is an amine ester propionate. This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm)
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