TWI282323B - Cassette for substrate - Google Patents

Cassette for substrate Download PDF

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Publication number
TWI282323B
TWI282323B TW093123156A TW93123156A TWI282323B TW I282323 B TWI282323 B TW I282323B TW 093123156 A TW093123156 A TW 093123156A TW 93123156 A TW93123156 A TW 93123156A TW I282323 B TWI282323 B TW I282323B
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TW
Taiwan
Prior art keywords
substrate
frame
cassette
frame member
region
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TW093123156A
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Chinese (zh)
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TW200510227A (en
Inventor
Toshio Yoshida
Tasuku Arimitsu
Naoto Takami
Tomohisa Oe
Nobukazu Tanaka
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Yodogawa Hu Tech Co Ltd
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Publication of TW200510227A publication Critical patent/TW200510227A/en
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Publication of TWI282323B publication Critical patent/TWI282323B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

A tray cassette for substrate is provided to satisfy a variety of requirements such as accessibility of carriage and production, low dust-emitting property, heat resistance, chemical resistance, electrical conductivity, lightweight, low cost, dimensional accuracy, etc. The cassette, which is capable of supporting and storing one large glass substrate, comprises a tray member 150 for supporting the glass substrate directly from the lower surface side and a frame member 110 for supporting at least the peripheral edge of the tray member 150 from the lower surface side.

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1282323 九、發明說明: 【發明所屬之技術領域】 本發明係關於基板用卡匣,更特定而言,乃關於供收容 大型玻璃基板等用的基板用卡匣構造。 【先前技術】 在液晶顯示器等之中將使用玻璃基板,但是在製造程序 方面,為在各步驟間進行玻璃基板的搬送·儲存等,便採 用每次收容單片此玻璃基板的基板用卡匣。此基板用卡匣 有如下述專利文獻1所揭示者。 (專利文獻1 ) 日本專利特開平1 0 - 2 8 7 3 8 2號公報 【發明内容】 (發明所欲解決之問題) 近年,已朝平板顯示器等大型化方向演進,例如液晶顯 示器中所使用玻璃基板的大小,在習知技術中,Π 〇 〇 m οι (寬 度尺寸)x 1300mm(長度尺寸)屬於最大尺寸,但是考慮變為 更大,如:1500mm(寬度尺寸)χ 1800πιιιι(長度尺寸)、 1800mm(寬度尺寸)x 2100mm(長度尺寸)等,然後,玻璃基 板的大小亦被認為將加速朝大型化發展。結果,隨玻璃基 板的大型化,基板用卡匣亦將大型化。 今後,對此種基板用卡匣將要求必須滿足可在不致使基 板撓曲的情況下,安定地支撐收容著基板,可輕易搬送· 製造,且低起塵性、耐熱性能、耐藥物性、導電性、輕量 性、低成本性、尺寸制度化等各種要求。但是,為滿足此 5 312/發明說明書(補件)/93-11 /93123156 1282323 種要求,當僅欲依靠上述專利文獻1所揭示框構造滿足該 等要求的情況時,將無法迴避重量的增加,在搬送·製造 的觀點上將發生問題,結果將導致製造成本上升。 所以,本發明乃為解決上述課題而所構思,乃提供特別 在大型基板所採用的基板用卡匣中,具備可輕易地搬送· 製造,且滿足低起塵性、耐熱性能、耐藥物性、導電性、 輕量性、低成本性、尺寸制度化等各種要求之構造的基板 用卡匣。 (解決問題之手段) 為解決上述課題,根據本發明的基板用卡匣之某個佈 局,係供收容薄板狀基板用的基板用卡匣,具備有:由骨架 構造所構成的框架構件;以及沿上述框架構件上面側而配 設,並供從下方面側直接支撐上述基板用的支撐構件。 依此藉由將基板用卡匣設定為框架構件,與沿此框架構 件上面側配設,並供從下方面側直接支撐基板用之支撐構 件的雙層構造,例如將供從下方面側支撐著基板用之支撐 構件,就從輕量化觀點而採用樹脂系材料,且將框架構件 就從基板用卡匣的剛性、耐熱性觀點而採用金屬材料,藉 此便可滿足對基板用卡匣所要求的輕易地搬送·製造,及 低起塵性、耐熱性能、耐藥物性、導電性、輕量性、低成 本性、尺寸制度化等各種要求。 再者,上述基板用卡匣的較佳形態,上述框架構件係具 有外框框架、與外框框架内所設置的輔助框架;上述支撐 構件係供從下方面側直接支撐上述基板,而在上述框架構 6 312/發明說明書(補件)/93-11 /9312315 6 1282323 件大致整面上所配置的托盤構件;上述托盤構件係設置複 數個從其支撐基準面朝向下方的凹部區域。 依此的話,藉由框架構件與托盤構件的雙層構造,例如 將供從下方面側支撐著基板用之托盤構件,就從輕量化觀 點而採用樹脂系材料,且將框架構件就從基板用卡匣的剛 性、耐熱性觀點而採用金屬材料,藉此便可滿足對基板用 卡匣所要求的輕易地搬送·製造,及低起塵性、财熱性能、 耐藥物性、導電性、輕量性、低成本性、尺寸制度化等各 種要求。 再者,上述基板用卡匣的較佳形態,係在所選擇的上述 凹部區域中設置開口部。藉此構造,例如可使外部搬送裝 置所設置的基板升降栓、基板搬送滾輪等通過此開口部。 結果,因為可使基板相對於基板用卡匣進行上升,所以便 可輕易地實施基板對基板用卡匣的搬送·搬出。 再者,上述基板用卡匣的另一較佳形態,上述凹部區域 中設有覆蓋上述凹部區域,同時可彈性變形的薄片狀構 件。藉此構造,因為凹部區域將被薄片狀構件所覆蓋著, 因而可防止雜質、洗淨液等侵入與囤積於凹部區域内。此 外,當在凹部區域中設置開口部的情況時,於基板升降栓、 基板搬送滾輪等通過此開口部之情況時,因為薄片狀構件 仍不致因彈性變形而延伸,所以不致妨礙到基板升降栓、 基板搬送滾輪等的上升動作,可使基板上升。 再者,上述基板用卡匣的較佳形態,上述外框框架構件 係具有包圍周邊區域,截面形狀朝向外邊且開放的口形狀 7 312/發明說明書(補件)/93· 11 /93123156 1282323 的框架構造。藉由此構造,在基板用卡匣利用藥液等進行 清洗時,因為外框框架構件朝向外邊開放,所以藥液等液 體便不致滯留於外框框架構件内部而排放出,同時可輕易 地施行外框框架構件内面的乾燥。 再者,上述基板用卡匣的較佳形態,上述框架構件係具 有:外框框架,以及設置於外框框架内,配置成格子狀的輔 助框架;上述支樓構件係在上述輔助框架上面側,沿上述 輔助框架延伸的方向配設。 依此的話,藉由此輔助框架與支撐構件的雙層構造,例 如將供從下方面側支撐著基板用之托盤構件,就從輕量化 觀點而採用樹脂系材料,且將框架構件就從基板用卡匣的 剛性、耐熱性觀點而採用金屬材料,藉此便可滿足對基板 用卡匣所要求的輕易地搬送·製造,及低起塵性、耐熱性 能、财藥物性、導電性、輕量性、低成本性、尺寸制度化 等各種要求。 為解決上述課題,根據本發明的基板用卡匣之另一佈 局,係供收容薄板狀基板用的基板用卡匣,具備有:具外框 框架的框架構件,以及供連結上述框架構件之轉角部用的 樹脂製轉角連結構件;上述樹脂製轉角連結構件係具有沿 該基板用卡匣高度方向配設的金屬製塊狀物。 藉此構造,基板用卡匣的疊層厚度將由金屬製塊狀物所 支配。其中,經機械加工所製得金屬製塊狀物的高度尺寸 誤差,可設定較小於樹脂成形品。所以,即便將基板用卡 匣朝高度方向重疊的情況時,整體重疊尺寸誤差仍可形成 8 312/發明說明書(補件)/93· 11 /93123156 1282323 根據本發明之具有金屬製塊狀物的轉角連結構件,較小於 僅由樹脂成形品構成的轉角連結構件的情況。 再者,上述基板用卡匣的其他較佳形態,可舉例如下述 構造。例如上述托盤構件的上述凹部區域平面形狀,可形 成圓形形狀、矩形形狀、多角形、或該等的組合。此外, 托盤構件係由至少具備導電性與抗靜電性之任一特性的塑 膠材料所構成。而其他材料則有由金屬箔與發泡材料的複 合材料所構成。具備有當該基板用卡匣重疊時,避免上下 基板用卡匣間發生間隙用的密封構件。 【實施方式】 以下,針對根據本發明基板用卡匣的各實施形態,參照 圖式進行說明。 (實施形態1 ) 首先,參照圖1與圖2,針對本實施形態的基板用卡匣 1 0 0概略構造進行說明。另外,圖1所示係本實施形態的 基板用卡匣1 0 0構造整體立體示意圖,圖2所示係圖1中 的I I線切剖戴面圖。 (基板用卡匣100之整體構造) 此基板用卡匣1 0 0的一例,乃其外觀尺寸為1 6 3 0 m Π](寬 度尺寸)x 1930 mm (長度尺寸),收容著1片大型玻璃基板。 基板用卡匣 1 0 0的構造係具備有:供從下方面側整面直接 支撐著玻璃基板的托盤構件 1 5 0 ;以及供從下方面側至少 支撐著此托盤構件1 5 0周緣部的框架構件11 0。在本實施 形態中,托盤構件1 5 0與框架構件11 0係如圖2截面圖所 9 312/發明說明書(補件)/93-11 /93123156 1282323 示,在托盤構件1 5 0與框架構侔υ η Μ 傅件1 1 0的周緣部重疊區域處, 採用由適當的銘所形成鉚釘1 8 W盆 1 8 U C其他亦可使用螺栓、螺絲 等鎖固構件)將二者固定。 (托盤構件15 0之構造) 其次,參照圖3與圖4’針對托盤構件15〇構造進行說 明。另外,在圖3中,(a )係托盤構件j 5 〇的平面圖,(b ) 係托盤構件150的側視圖,圖4係圖3中的IV線切剖截面 圖。 本實施形態的托盤構件1 5 0係由利用真空成形法所形成 的單片塑膠板構成,材質可採用如:聚丙烯 (PP:Polypropylene)、聚乙埽(PE:Polyethylene)、聚苯乙 烯(PS:Polystyrene)、丙烯腈/ 丁二烯/苯乙烯共聚物 (ABS: ACRYLONITRILE BUTADIENE STYRENE)、聚砜 (?3?:?〇175111{〇!16)等。板厚約2.〇111111左右。另外,不僅限 於真空成形法,亦可採用發泡成形法、射出成形法等。 此托盤構件1 5 0係具有:矩形形狀的支撐框架區域1 5 1, 以及包圍此支撐框架區域151周圍的突出區域152。在本 實施形態中,於支撐框架區域1 5 1的轉角區域中,並未設 置突出區域1 5 2,而是沿支撐框架區域1 5 1四邊設置突出 區域1 5 2。 在支撐框架區域 151中的行列狀規則方正配置平面形 狀,乃將矩形形狀的凹部區域1 5 3設置成7行1 〇列。在支 撐框架區域1 5 1中,當將平面基準設為基準面S的情況時, 凹部區域1 5 3變由此基準面S朝下方凹陷的凹部形狀所構 10 312/發明說明書(補件)/93-11 /93123156 1282323 成。此凹部區域1 5 3的大小形成約1 8 0 m πι χ約1 4 5 m m左右, 深度係距基準面S約20mm左右。 依此的話,之所以設置凹部區域 1 5 3,乃為達托盤構件 1 5 0輕量化,且為達提昇托盤構件1 5 0剛性而設置的。所 以,凹部區域1 5 3的平面形狀並不僅限於矩形形狀,亦可 採用圓形形狀、矩形形狀、多角形、或該等的組合。另外, 在所選擇到的凹部區域1 5 3底面部分,設置複數個大小約 1 0 0 m m X 約 1 3 0 m m 的開口部 1 5 4。 再者,在支撐框架區域1 51的基準面S既定區域中,設 置有複數個從下方面側利用直接接觸而支撐著基板,並從 基準面S朝上方突出的基板支撐凸部1 5 6。此基板支撐凸 部1 5 6的高度係距基準面S約5 m m左右。另外,基板支撐 凸部1 5 6的數量乃就在從不致使基板產生應變的情況下, 支撐著基板的觀點,於本實施形態中,設置5x 7 = 35個, 此外,基板支撐凸部1 5 6頂點則設置成為於同一平面的狀 態。 - 再者,此基板支撐凸部1 5 6亦可在托盤構件1 5 0成形時 便同時設置,但是就從滑順與更進一步抑制起塵的觀點, 亦可利用後續步驟安裝防起塵性樹脂(例如:聚醚醚酮、聚 醯亞胺、聚醚醯亞胺、聚縮醛、聚醯胺、超高分子量聚乙 烯、聚四氟乙烯、各種彈性體等)的成形體。另外,當使用 防起塵性樹脂成形體的情況時,最好使用實質未調配入填 料的原始物質。 再者,突出區域1 5 2係如圖4所示,在為進行基板側面 11 312/發明說明書(補件)/93-11 /93123156 1282323 的定位,為從基準面 s卡接於朝向上方突出的第 1凸部 1 5 2 a、框架構件1 1 0,而設置比第1凸部1 5 2 a更朝上方突 出的第2凸部1 5 2 b ;以及為確實地對框架構件1 1 0進行定 位,因而設置反折部1 5 2 d。此外,在第2凸部1 5 2 b中設 置供適當地鉚接於框架構件1 1 0用下孔1 5 2 c。 (框架構件1 1 0之構造) 其次,參照圖5〜圖7所示,針對框架構件1 1 0的構造進 行說明。另外,圖5所示係框架構件1 1 0平面圖,圖6所 示係框架構件11 0的轉角部部分放大平面圖,圖7所示係 圖6中的V I I線切剖截面圖。 本實施形態的框架構件 1 1 0,乃如圖5所示係由矩形形 狀所形成,具備有:構成4邊框架的外框框架構件1 1 1、在 轉角部處連結各外框框架構件Π 1的轉角連結構件1 1 2、 及輔助框架1 1 3。 外框框架構件1 1 1與轉角連結構件1 1 2的連結,及外框 框架構件1 1 1與輔助框架1 1 3的連結,係採用由適當鋁所 構成的鉚釘(其他亦可使用螺栓、螺絲等螺鎖構件)。此外, 輔助框架1 1 3所設置數量並不僅限於一條,可配合框架構 件 11 0的大小,設置複數條,又亦可對外框框架構件1 1 1 配置成「=」、「+」、「丰」、「井」、「/」、「X」、「XX」等形 狀。 外框框架構件1 1 1就輕量化、剛性的觀點,採用不銹鋼 (S U S )、鋁(A 1 )構件等。截面形狀則如圖7所示乃由略j字 狀所構成,具備有:立壁部 1 1 1 a、上壁部 1 1 1 b、底壁部 12 312/發明說明書(補件)/93-11 /93123156 1282323 1 11 c、及突出於外邊的突出壁部1 1 1 d。此外,採用從底壁 部1 1 1 c與突出壁部1 1 1 d朝外邊開放的形狀。立壁部1 1 1 a 高度約50mm左右,上壁部111b寬度約17mm左右,突出壁 部llld突出長度約17mni左右。 依此的話,藉由採用朝外邊開放的形狀,即便對基板用 卡匣1 0 0進行藥液等洗淨時,因為外框框架構件1 1 1朝外 邊開放,因此藥液等液體便不致滯留於外框框架構件 111 内部,將被排放且可同時輕易地進行外框框架構件1 1 1内 面的乾燥。此外,藉由設置突出壁部1 1 1 d,除可利用人工 進行搬運之外,同時亦具有滾輪搬送的導執作用。 再者,如上述,在框架構件1 1 0的四個轉角部設置轉角 連結構件1 1 2,此轉角連結構件1 1 2的截面形狀,如圖7 所示,具備有:位於突出壁部llld上端的第1壁112a、從 此第1壁112a朝橫向延伸且位於上壁部111b上面的第2 壁112b、及在第1壁112a上端部處朝外側突出的第3壁 112c。在第1壁112a内側且位於較第2壁112b更下方的 位置處,形成朝下方板厚逐漸減少的推拔面11 2 d。藉此推 拔面1 1 2 d便可輕易地達成轉角連結構件1 1 2對外框框架構 件1 1 1的定位。 再者,在第1壁112a内側且位於較第2壁112b更上方 的位置處,形成朝上方板厚逐漸減少的推拔面1 1 2 e。藉此 推拔面1 1 2 e,當重疊基板用卡匣1 0 0之情況時,在第2壁 1 1 2 b上面載置著外框框架構件1 1 1之底壁部1 1 1 c,可輕易 地執行外框框架構件1 1 1的定位,同時亦可從處於重疊狀 13 312/發明說明書(補件)/93-11 /93123156 1282323 態的基板用卡匣1 Ο Ο,將載置於上面的基板用卡匣1 Ο 0輕 易的拆卸。 (作用·效果) 依照上述構造所構成基板用卡匣1 0 0的話,便如圖2截 面圖所示,在由基板支撐凸部1 5 6頂點所形成的平面上, 將不致對玻璃基板1產生應變,且藉由降低與托盤構件1 5 0 間的接觸面積便可降低起塵情況,可安定的保持著玻璃基 板1 〇 再者,藉由托盤構件1 5 0與框架構件1 1 0的雙層構造, 供從下面側支撐著玻璃基板1用的托盤構件1 5 0,就輕量 化的觀點而採用樹脂材料,且,供從下方面側支撐著框架 構件1 1 0用的框架構件1 1 0,就從剛性、耐熱性觀點而採 用金屬材料,藉此便可滿足對基板用卡匣1 0 0所要求的輕 易地搬送·製造,及低起塵性、耐熱性能、耐藥物性、導 電性、輕量性、低成本性、尺寸制度化等各種要求。 再者,藉由在所選擇到的凹部區域1 5 3底面部分設置複 數個開口部1 5 4,便如圖8所示,利用外部搬送裝置 2 0 0 上所設置的基板升降栓2 1 0,便可達成基板用卡匣1 0 0所 支#的玻璃基板之升降。結果,如圖9所示,形成可將堆 高機等的搬送臂400***於基板用卡匣100與玻璃基板1 之間,俾可輕易的對基板用卡匣1 0 0進行玻璃基板1的搬 入,以及從基板用卡匣1 0 0搬出玻璃基板1,可輕易地在 步驟間進行基板搬送。 再者,如圖1 0所示,藉由使開口部 1 5 4通過基板搬送 14 312/發明說明書(補件)/93-11 /93123156 1282323 滾輪2 2 Ο,便可如圖1 1所示,可使玻璃基板1對基板用卡 匣100進行上升,同時可輕易的執行搬送裝置500之搬送 滾輪5 1 0,對玻璃基板1進行搬送·搬出,可輕易地進行 步驟間的基板搬送。 再者,因為採取在框架構件110的四個轉角設置轉角連 結構件1 1 2,而形成可重疊基板用卡匣1 0 0的構造,因此 便如圖1 2所示,可在托板6 0 0上重疊複數個基板用卡匣 1 0 0,可在工廠間進行搬送。 另外,在上述基板用卡匣100中,考慮雜質、清洗液等 侵入與囤積於托盤構件1 5 0所設置的凹部區域1 5 3中,而 造成問題的情況。此種情況下,如圖1 3與圖1 4所示,亦 可採取設置覆蓋凹部區域1 5 3且可彈性變形的薄片狀構件 1 5 8的構造。藉此構造,因為凹部區域1 5 3被薄片狀構件 1 5 8所覆蓋著,便可防止雜質、清洗液等侵入與囤積於凹 部區域1 5 3内。另外,雖薄片狀構件1 5 8圖示著配合各凹 部區域1 5 3設置的情況,但是亦可採取利用單片薄片狀構 件1 5 8,覆蓋著複數凹部區域1 5 3的構造。 再者,即便具有開口部1 5 4的凹部區域1 5 3,但是因為 薄片狀構件 1 5 8採用可彈性變形的材料,因此便如圖 1 5 與圖1 6所示,當基板升降栓2 1 0等通過此開口部1 5 4的情 況時,因為薄片狀構件1 5 8將藉由彈性變形而延伸,所以 便不致妨礙到基板升降栓2 1 0等的上升動作,可使玻璃基 板上升。 (實施形態2 ) 15 312/發明說明書(補件)/93-11 /93123156 1282323 其次,參照圖1 7與圖1 8所示,針對本實施形態的基板 用卡匣3 0 0概略構造進行說明。另外,圖1 7所示係本實施 形態的基板用卡匣 3 0 0構造整體平面立體示意圖,圖 18 所示係圖1 7中的X V I I I - X V I I I線切剖截面圖。 (基板用卡匣300之整體構造) 此基板用卡匣3 0 0的外觀尺寸乃略同於上述實施形態1 的基板用卡匣1 0 0。雖在上述實施形態1的基板用卡匣1 0 0 構造中,特徵為托盤構件1 5 0與框架構件1 1 0的雙層構造, 但是,本實施形態的基板用卡匣 3 0 0,特徵在於並未採用 托盤構件,而是在框架構件3 1 0上配置成格子狀的輔助框 架 3 1 3上面,沿輔助框架 3 1 3延伸方向配設著支撐構件 3 1 4,而形成雙層構造。 具體構造,首先如圖1 7所示,框架構件3 1 0係由矩形 形狀所形成,具備有:構成4邊框架的外框框架構件3 1 1、 在轉角部處連結各外框框架構件 311的轉角連結構件 3 1 2、及複數排列成格子狀的輔助框架3 1 3。 外框框架構件3 1 1與轉角連結構件3 1 2的連結,及外框 框架構件3 1 1與輔助框架3 1 3的連結構造,係如同上述實 施形態1。另外,輔助框架 3 1 3所設置數量可配合框架構 件3 1 0的大小而適當的變更。此外,亦可配置成相對於外 框框架構件3 1 1為「丰」、「/」、「X」、「X X」等形狀。 外框框架構件3 1 1就輕量化、剛性的觀點,採用不錄鋼 (S U S )、鋁(A 1 )構件等。截面形狀則如上述實施形態1。此 外,在框架構件3 1 0四個轉角的轉角部處所設置的轉角連 16 312/發明說明書(補件)/93-11 /93123156 1282323 結構件3 1 2構造,亦如同上述實施形態1。 輔助框架3 1 3的截面形狀,如圖1 8 ( a )所示,形成上方 具有開口部的略C通道形截面形狀。此外,在輔助框架3 1 3 的開口部分中嵌合著支撐構件3 1 4,此支撐構件3 1 4係由 下述部分所構成:收容於輔助框架 3 1 3内部的身體區域 314a ;從此身體區域 314a朝外邊且寬度較窄於身體區域 314a的頸部區域314b;以及從輔助框架313上面裸露出於 外邊,並直接支撐著基板且表面設計成彎曲形狀的頭部區 域3 1 4 c。基板係載置於由支撐構件 3 1 4之頭部區域3 1 4 c 之頂部區域所規定的同一平面上。 此支撐構件3 1 4基本上最好在整個輔助框架3 1 3上面, 沿輔助框架3 1 3延伸方向配設,但是亦可部分性的設置於 適當選擇到的部分區域。 再者,輔助框架3 1 3的截面形狀,不僅限於圖1 8 ( a )所 示,例如圖1 8 ( b )所示,亦可採用截面T形的輔助框架3 1 3, 將大致覆蓋此輔助框架 3 1 3,且具有表面設計成彎曲形狀 之頭部區域的支撐構件3 1 4,沿輔助框架 3 1 3延伸方向配 設。 支樓構件3 1 4對辅助框架3 1 3的安裝,可在組裝框架構 件3 1 0之前,便從輔助框架3 1 3長度方向,預先***支撐 構件3 1 4,便可輕易地完成安裝。 支撐構件3 1 4的材料,就從滑順與更進一步抑制起塵的 觀點,亦可使用防起塵性樹脂(例如:聚醚醚酮、聚醯亞胺、 聚醚醯亞胺、聚縮醛、聚醯胺、超高分子量聚乙烯、聚四 17 312/發明說明書(補件)/93· 11/93123156 1282323 氟乙烯、各種彈性體等)的成形體。另外,當使用防起塵性 樹脂成形體的情況時,最好使用實質未調配入填料的原始 物質。 (作用·效果) 依照由上述構造所構成基板用卡匣3 0 0的話,在由支撐 構件3 1 4頂點所形成的平面上,可在不致使玻璃基板1產 生應變的情況下,安定地保持著玻璃基板1。 (實施形態3 ) 其次,參照圖1 9,針對本實施形態的基板用卡匣概略構 造進行說明。另外,圖1 9所示係本實施形態的基板用卡匣 所採用的轉角連結構件3 5 0構造圖,(A )為平面圖,(B )為 側視圖。 在上述實施形態1與2中,基板用卡匣1 0 0所採用的轉 角連結構件1 1 2,及基板用卡匣3 0 0所採用的轉角連結構 件3 1 2,均由樹脂成形品所構成。 在此請再度參照圖1 2所示,轉角連結構件 1 1 2係在托 板6 0 0上相互定位重疊複數基板用卡匣1 0 0,可在工廠間 進行搬送。但是,當樹脂成形品的情況時,因為尺寸誤差 較大,因此當重疊基板用卡匣1 0 0的情況時,誤差便將累 積,所累積的基板用卡匣 1 0 0整體高度可判斷誤差將變 大。相關基板用卡匣3 0 0所使用的轉角連結構件3 1 2亦相 同。 然而,在本實施形態的轉角連結構件3 5 0中,基本構造 雖如同上述轉角連結構件1 1 2、3 1 2,但是特徵在於重疊區 18 312/發明說明書(補件)/93-11/93123156 1282323 域採用埋入金屬製塊狀物的構造。 具體而言,如圖1 9所示,此轉角連結構件 3 5 0係具備 有:連結於外框框架的樹脂連結臂 3 5 2、3 5 3,以及樹脂製 轉角構件3 5 1。在樹脂製轉角構件3 5 1中設置定位壁3 5 1 a, 並在樹脂製轉角構件3 5 1略中央區域處’埋藏由銘所構成 筒狀金屬製塊狀物3 5 5。在金屬製塊狀物3 5 5上面所對應 的位置處,設置由朝上方突出的區域上端抵接區域351u, 且在金屬製塊狀物3 5 5下面所對應的位置處,設置由朝下 方突出的區域下端抵接區域351d。上端抵接區域351u與 下端抵接區域351d均為由膜厚0.5mm〜1.0mm左右,且覆蓋 金屬製塊狀物3 5 5上下端面的區域所構成。另外,亦可構 成裸露出金屬製塊狀物3 5 5上下端面,並利用金屬製塊狀 物3 5 5本身,形成抵接區域3 5 1 u與下端抵接區域3 5 1 d。 (作用·效果) 依此的話,藉由將金屬製塊狀物3 5 5埋藏於樹脂製轉角 構件3 5 1中,轉角連結構件3 5 0的高度即便在屬於樹脂成 形品的情況下,仍可由金屬製塊狀物3 5 5高度所支配著。 因此,經機械加工所製得金屬製塊狀物的高度尺寸誤差, 便可較小於樹脂成形品的情況。所以,即便採用樹脂製轉 角構件3 5 1將基板用卡匣朝高度方向重疊的情況下,因為 仍可在抵接著上端抵接區域3 5 1 u與下端抵接區域3 5 1 d的 情況下進行重疊,所以整體重疊尺寸誤差在相較於僅由樹 脂成形品所構成的轉角連結構件之情況下,具有金屬製塊 狀物之樹脂製轉角構件3 5 1者的誤差較小。 19 312/發明說明書(補件)/93-11/93123156 1282323 再者,在上述各實施形態中,雖舉搬送玻璃基板的基板 用卡匣1 0 0為一例,但是針對具有由相同性質的大型薄板 狀所構成基盤仍可適用。 再者,托盤構件與框架構件所採用的材料,並不僅限定 於上述材料,配合適當要求的條件進行變更。 所以,本發明的技術範圍,並非僅由上述實施形態解 釋,應界定為根據申請專利範圍所記載的内容。此外,亦 涵蓋與申請專利範圍具均等涵義與範圍内的所有變更。 (發明效果) 依照根據本發明之基板用卡匣的話,便可提供具備可輕 易地搬送·製造,且滿足低起塵性、耐熱性能、耐藥物性、 導電性、輕量性、低成本性、尺寸制度化等各種要求之構 造的基板用卡匣。 【圖式簡單說明】 圖1(a)、(b)為實施形態1的基板用卡匣構造整體立體 示意圖。 圖2為圖1中的I I線切剖截面圖。 圖 3 ( a )為托盤構件的平面圖,圖 3 ( b )為托盤構件的側 視圖。 圖4為圖3中的IV線切剖截面圖。 圖5為實施形態1的框架構件平面圖。 圖 6為實施形態 1的框架構件轉角部之部分放大平面 圖。 圖7為圖6中的VI I線切剖截面圖。 20 312/發明說明書(補件)/93-11 /93123156 1282323 圖8為實施形態1的基板用卡匣使用形態之第1立體示 意圖。 圖9為實施形態1的基板用卡匣使用形態之第2立體示 意圖。 圖1 0為實施形態1的基板用卡匣使用形態之第3立體 示意圖。 圖1 1為實施形態1的基板用卡匣使用形態之第4立體 示意圖。 圖1 2為實施形態1的基板用卡匣使用形態之第5立體 示意圖。 圖 1 3為當設有覆蓋著托盤構件凹部區域的薄片狀構件 之情況時的部分立體示意圖。 圖14為圖13中的XIV - XIV線切剖截面圖。 圖 1 5為薄片狀構件利用基板升降栓而延伸的狀態之部 分立體示意圖。 圖1 6為圖1 5中的X V I - X V I線切剖截面圖。 圖1 7為實施形態2的基板用卡匣構造整體立體示意圖。 圖18(a)、(b)為圖17中的XVIII-XVIII線切剖截面圖。 圖1 9 ( A )、( B )為實施形態3的基板用卡匣所採用轉角連 結構件的構造圖。 【主要元件符號說明】 1 玻璃基板 1 0 0, 3 0 0 基板用卡匣 110,310 框架構件 21 312/發明說明書(補件)/93-11 /93123156 1282323 111,311 外框框架構件 111a 立壁部 111b 上壁部 111c 底壁部 1 1 1 d 突出壁部 1 1 2, 3 1 2, 3 5 0 轉角連結構件 1 12a 第1壁 112b 第2壁 112c 第3壁 11 2d, 1 12e 推拔面 113, 313 輔助框架 1 50 托盤構件 15 1 支撐框架區域 1 52 突出區域 152a 第1凸部 1 52b 第2凸部 1 52c 下孔 1 52d 反折部 153 凹部區域 1 54 開口部 1 56 基板支禮凸部 1 58 薄片狀構件 180 鉚釘 200 外部搬送裝置 312/發明說明書(補件)/93-11/93123156 1282323 21 0 基 板 升 降 栓 220 基 板 搬 送 滾 輪 314 支 撐 構 件 314a 身 體 區 域 3 14b 頸 部 域 3 14c 頭 部 區 域 35 1 樹 脂 製 轉 角 構件 35 1a 定 位 壁 35 1 d 下 端 抵 接 區 域 3 5 1 u 上 端 抵 接 域 352,353 樹 脂 連 結 臂 355 金 屬 製 塊 狀 物 400 搬 送 臂 500 搬 送 裝 置 51 0 搬 送 滾 輪 600 托 板 S 基 準 面 312/發明說明書(補件)/93-11 /93123156[Technical Field] The present invention relates to a substrate cassette, and more particularly to a cassette structure for housing a large glass substrate or the like. [Prior Art] A glass substrate is used in a liquid crystal display or the like. However, in order to carry out the transfer and storage of the glass substrate between the steps in the manufacturing process, a substrate cassette for accommodating a single glass substrate is used. . The substrate cassette is as disclosed in Patent Document 1 below. (Patent Document 1) Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 1 - 2 8 7 3 8 2 (Problems to be Solved by the Invention) In recent years, it has evolved toward a large-scale direction such as a flat panel display, for example, used in a liquid crystal display. The size of the glass substrate, in the prior art, Π 〇〇m οι (width dimension) x 1300 mm (length dimension) is the largest size, but considers to become larger, such as: 1500mm (width size) χ 1800πιιι (length size) 1800mm (width dimension) x 2100mm (length dimension), etc., and then the size of the glass substrate is also expected to accelerate toward large-scale development. As a result, as the size of the glass substrate increases, the substrate cassette is also increased in size. In the future, it is required to be able to stably support and store the substrate without being deflected by the substrate, and it is easy to transport and manufacture, and has low dusting, heat resistance, and drug resistance. Various requirements such as conductivity, light weight, low cost, and institutional size. However, in order to satisfy the requirements of the 5 312 / invention specification (supplement) / 93-11 / 93123156 1282323, when only the frame structure disclosed in the above Patent Document 1 is to be satisfied to satisfy the requirements, the weight increase cannot be avoided. There will be problems in terms of transportation and manufacturing, and as a result, manufacturing costs will increase. Therefore, the present invention has been conceived to solve the above-mentioned problems, and is provided in a substrate for a large-sized substrate, which can be easily transported and manufactured, and which has low dust-collecting property, heat resistance, and drug resistance. A substrate cassette having various structures such as conductivity, light weight, low cost, and dimensional system. (Means for Solving the Problem) In order to solve the above-mentioned problems, a certain arrangement of the substrate cassette according to the present invention is a frame member for housing a thin plate-shaped substrate, and includes a frame member composed of a skeleton structure; It is disposed along the upper surface side of the frame member, and supports the support member for the substrate directly from the lower side. In this way, by setting the substrate cassette as a frame member, a double-layer structure that is disposed along the upper surface side of the frame member and directly supports the support member for the substrate from the lower side, for example, is supported from the lower side. In the case of the support member for the substrate, a resin-based material is used from the viewpoint of weight reduction, and the frame member is made of a metal material from the viewpoint of rigidity and heat resistance of the substrate cassette, thereby satisfying the substrate for the substrate. It is required to be easily transported and manufactured, and has various requirements such as low dusting, heat resistance, chemical resistance, electrical conductivity, light weight, low cost, and institutionalized size. Further, in a preferred embodiment of the substrate cassette, the frame member includes an outer frame and an auxiliary frame provided in the outer frame; and the support member directly supports the substrate from the lower side. Frame structure 6 312 / invention specification (supplement) / 93-11 /9312315 6 1282323 A tray member disposed substantially on the entire surface; the tray member is provided with a plurality of recessed regions from the support reference surface toward the lower side. In this case, by using the two-layer structure of the frame member and the tray member, for example, a tray member for supporting the substrate from the lower side is used, and a resin-based material is used from the viewpoint of weight reduction, and the frame member is used from the substrate. The metal material is used for the rigidity and heat resistance of the cassette, thereby satisfying the ease of transport and manufacture required for the substrate jam, and low dusting, heat recovery, chemical resistance, electrical conductivity, and lightness. Various requirements such as quantity, low cost, and institutionalization of size. Further, in a preferred embodiment of the substrate cassette, an opening is provided in the selected recessed portion. With this configuration, for example, the substrate lifting bolt, the substrate conveying roller, and the like provided in the external conveying device can pass through the opening. As a result, the substrate can be lifted with respect to the substrate cassette, so that the substrate-to-substrate cassette can be easily transported and carried out. Further, in another preferred embodiment of the substrate cartridge, the recessed portion is provided with a sheet-like member that covers the recessed portion and is elastically deformable. With this configuration, since the concave portion region is covered by the sheet-like member, it is possible to prevent intrusion and accumulation of impurities, cleaning liquid, and the like in the concave portion region. Further, when the opening portion is provided in the concave portion region, when the substrate lifting pin, the substrate conveying roller, or the like passes through the opening portion, since the sheet-like member does not extend due to elastic deformation, the substrate lifting bolt is not hindered. The substrate can be raised by the rising operation of the substrate transfer roller or the like. Further, in a preferred embodiment of the substrate cassette, the outer frame member has a port shape 7 312/invention description (supplement)/93·11 /93123156 1282323 which surrounds the peripheral region and has a cross-sectional shape that faces outward. Frame construction. According to this configuration, when the substrate is cleaned by the chemical solution or the like, since the outer frame member is opened to the outside, the liquid such as the chemical liquid is not retained in the outer frame member and discharged, and can be easily performed. Drying of the inner surface of the outer frame member. In a preferred embodiment of the substrate cassette, the frame member includes: an outer frame frame; and an auxiliary frame disposed in the outer frame frame and arranged in a lattice shape; and the branch member is attached to the upper surface of the auxiliary frame , arranged along the direction in which the auxiliary frame extends. In this case, by the double-layer structure of the auxiliary frame and the support member, for example, the tray member for supporting the substrate from the lower side is used, and the resin-based material is used from the viewpoint of weight reduction, and the frame member is removed from the substrate. By using a metal material from the viewpoint of rigidity and heat resistance of the cassette, it is possible to easily carry and manufacture the substrate for the cassette, and to have low dusting, heat resistance, chemical properties, conductivity, and lightness. Various requirements such as quantity, low cost, and institutionalization of size. In order to solve the above problems, another layout of the substrate cassette according to the present invention is a substrate cassette for housing a thin plate-shaped substrate, and includes a frame member having an outer frame and a corner for connecting the frame member. The resin corner connecting member for the part; the resin corner connecting member has a metal block which is disposed along the height direction of the substrate. With this configuration, the laminated thickness of the substrate cassette is governed by the metal block. Among them, the height dimension error of the metal block obtained by the machining can be set smaller than that of the resin molded article. Therefore, even if the substrate is overlapped with the cassette in the height direction, the overall overlap size error can be formed. 8 312 / Inventive specification (supplement) / 93· 11 /93123156 1282323 According to the present invention, there is a metal block The corner connecting member is smaller than the corner connecting member composed only of the resin molded article. Further, in another preferred embodiment of the substrate cassette, for example, the following structure is exemplified. For example, the planar shape of the recessed portion of the tray member may be formed into a circular shape, a rectangular shape, a polygonal shape, or a combination thereof. Further, the tray member is composed of a plastic material having at least one of conductivity and antistatic properties. Other materials consist of a composite of metal foil and foamed material. When the substrate cassette is overlapped, it is possible to prevent a gap from occurring between the upper and lower substrate cassettes. [Embodiment] Hereinafter, each embodiment of the substrate cassette according to the present invention will be described with reference to the drawings. (Embodiment 1) First, a schematic structure of a card cassette 100 of the present embodiment will be described with reference to Figs. 1 and 2 . Further, Fig. 1 is a perspective view showing the entire structure of the substrate for use in the present embodiment, and Fig. 2 is a cross-sectional view taken along the line I I in Fig. 1. (Overall structure of the substrate cassette 100) An example of the substrate cassette 100 is an external size of 1 6 3 0 m Π] (width size) x 1930 mm (length dimension), and accommodates one large piece. glass substrate. The structure for the substrate cassette 100 includes a tray member 150 that directly supports the glass substrate from the lower surface side, and a bottom member that supports at least the peripheral portion of the tray member 150 from the lower side. Frame member 110. In the present embodiment, the tray member 150 and the frame member 10 0 are shown in Fig. 2, sectional view 9 312 / invention specification (supplement) / 93-11 /93123156 1282323, in the tray member 150 and the frame structure侔υ η Μ 重叠 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 。 。 。 。 (Structure of Pallet Member 150) Next, the structure of the tray member 15A will be described with reference to Figs. 3 and 4'. Further, in Fig. 3, (a) is a plan view of the tray member j 5 ,, (b) is a side view of the tray member 150, and Fig. 4 is a cross-sectional view taken along line IV of Fig. 3. The tray member 150 of the present embodiment is composed of a single plastic plate formed by a vacuum forming method, and the material may be, for example, polypropylene (PP: Polypropylene), polyethylene (PE: Polyethylene), or polystyrene ( PS: Polystyrene), acrylonitrile/butadiene/styrene copolymer (ABS: ACRYLONITRILE BUTADIENE STYRENE), polysulfone (?3?:?〇175111{〇!16), and the like. The thickness of the plate is about 2. 〇111111 or so. Further, it is not limited to the vacuum forming method, and a foam molding method, an injection molding method, or the like may be employed. This tray member 150 has a rectangular-shaped support frame region 155, and a protruding region 152 surrounding the support frame region 151. In the present embodiment, in the corner region of the support frame region 151, the projecting region 152 is not provided, but the projecting region 152 is provided along the four sides of the support frame region 151. The wal-like rule in the support frame region 151 is arranged in a planar shape, and the rectangular-shaped recessed portion 1 5 3 is set to 7 rows and 1 column. In the case of the support frame region 151, when the plane reference is set as the reference plane S, the recessed region 1 5 3 is changed to the shape of the recess in which the reference plane S is recessed downward. 10 312 / Invention specification (supplement) /93-11 /93123156 1282323 成. The size of the recessed portion 1 5 3 is formed to be about 1 800 m π χ about 1 4 5 m m, and the depth is about 20 mm from the reference plane S. In this case, the reason why the recessed portion 1 5 3 is provided is that the tray member 150 is lightweight and is provided to raise the rigidity of the tray member 150. Therefore, the planar shape of the recessed portion 153 is not limited to a rectangular shape, and a circular shape, a rectangular shape, a polygonal shape, or a combination thereof may be employed. Further, a plurality of openings 1 5 4 having a size of about 10 m 2 X and about 1 3 0 m m are provided in the selected bottom portion of the recessed portion 1 5 3 . Further, in a predetermined region of the reference plane S of the support frame region 151, a plurality of substrate supporting projections 156 which are supported by the direct contact from the lower side and which protrude upward from the reference plane S are provided. The height of the substrate supporting projections 156 is about 5 m from the reference plane S. Further, the number of the substrate supporting convex portions 156 is such that 5× 7 = 35 is provided in the present embodiment, and the substrate supporting convex portion 1 is provided in the case where the substrate is not strained. 5 6 vertices are set to be in the same plane state. Further, the substrate supporting convex portion 156 may be simultaneously provided when the tray member 150 is formed, but the dustproofing property may be installed by using a subsequent step from the viewpoint of smoothing and further suppressing dusting. A molded body of a resin (for example, polyetheretherketone, polyimide, polyetherimine, polyacetal, polyamine, ultrahigh molecular weight polyethylene, polytetrafluoroethylene, various elastomers, etc.). Further, when a dust-proof resin molded body is used, it is preferable to use a raw material which is substantially unmixed into the filler. Further, as shown in FIG. 4, the protruding region 15 2 is positioned to protrude from the reference surface s in order to perform positioning of the substrate side surface 11 312 / invention specification (supplement) / 93-11 /93123156 1282323 The first convex portion 1 5 2 a and the frame member 1 10 0 are provided with the second convex portion 1 5 2 b protruding upward from the first convex portion 1 5 2 a ; and the frame member 1 1 is surely 0 is positioned, and thus the reverse folding portion 1 5 2 d is set. Further, the second convex portion 1 5 2 b is provided to be appropriately caulked to the lower hole 1 5 2 c for the frame member 1 1 0. (Structure of Frame Member 110) Next, the structure of the frame member 110 will be described with reference to Figs. 5 to 7 . Further, Fig. 5 is a plan view of the frame member 1 10 0, and Fig. 6 is an enlarged plan view showing a corner portion of the frame member 110, and Fig. 7 is a cross-sectional view taken along the line V I I in Fig. 6. The frame member 110 of the present embodiment is formed of a rectangular shape as shown in Fig. 5, and includes an outer frame frame member 1 1 1 constituting a four-sided frame and a frame member at a corner portion. 1 corner joint member 1 1 2, and auxiliary frame 1 1 3 . The connection between the outer frame member 1 1 1 and the corner connecting member 1 1 2, and the connection between the outer frame member 1 1 1 and the auxiliary frame 1 1 3 are rivets made of a suitable aluminum (other bolts, Screw and other screw components). In addition, the number of the auxiliary frames 1 1 3 is not limited to one, and a plurality of bars may be provided in accordance with the size of the frame member 110, or the outer frame frame members 1 1 1 may be configured as "=", "+", "Feng". Shapes such as "well", "/", "X", "XX". The outer frame member 1 1 1 is made of stainless steel (S U S ), aluminum (A 1 ) member or the like from the viewpoint of weight reduction and rigidity. The cross-sectional shape is formed by a slightly j-shaped shape as shown in Fig. 7, and includes a standing wall portion 1 1 1 a, an upper wall portion 1 1 1 b, and a bottom wall portion 12 312 / invention manual (supplement) / 93- 11 /93123156 1282323 1 11 c, and protruded from the outer protruding wall 1 1 1 d. Further, a shape is opened from the bottom wall portion 1 1 1 c and the protruding wall portion 1 1 1 d toward the outer side. The vertical wall portion 1 1 1 a has a height of about 50 mm, the upper wall portion 111b has a width of about 17 mm, and the protruding wall portion 11ld has a protruding length of about 17 mni. In this case, even if the substrate is sealed with the cartridge 100 by using the shape opened to the outside, the outer frame member 1 1 1 is opened to the outside, so that the liquid such as the chemical liquid does not remain. Inside the outer frame member 111, it is discharged and the inner surface of the outer frame member 11 1 can be easily dried at the same time. Further, by providing the protruding wall portion 1 1 1 d, in addition to being manually transportable, it also has a guiding function of the roller transport. Further, as described above, the corner connecting member 1 1 2 is provided at the four corner portions of the frame member 110, and the cross-sectional shape of the corner connecting member 112 is provided as shown in FIG. The first wall 112a at the upper end, the second wall 112b extending from the first wall 112a in the lateral direction and located on the upper surface of the upper wall portion 111b, and the third wall 112c projecting outward at the upper end portion of the first wall 112a. Inside the first wall 112a and at a position lower than the second wall 112b, a pushing surface 11 2 d which gradually decreases toward the lower thickness is formed. The positioning of the corner joint member 1 1 2 to the outer frame frame member 1 1 1 can be easily achieved by pushing the surface 1 1 2 d. Further, inside the first wall 112a and at a position above the second wall 112b, a pushing surface 1 1 2 e whose thickness gradually decreases toward the upper side is formed. Thereby, the surface 1 1 2 e is pushed out, and when the stacking plate 1 0 0 is overlapped, the bottom wall portion 1 1 1 c of the outer frame member 1 1 1 is placed on the second wall 1 1 2 b. The positioning of the frame member 1 1 1 can be easily performed, and the substrate can be loaded from the substrate 1 Ο 处于 in the state of the overlap 13 312 / invention specification (supplement) / 93-11 /93123156 1282323 The substrate placed on the top is easily removed by the cassette 1 Ο 0. (Operation and Effect) When the substrate is formed by the above-described structure, as shown in the cross-sectional view of Fig. 2, the glass substrate 1 is not formed on the plane formed by the apex of the substrate supporting convex portion 156. The strain is generated, and the dusting condition can be reduced by lowering the contact area with the tray member 150, and the glass substrate 1 can be stably held, by the tray member 150 and the frame member 1 10 The two-layer structure is a tray member 150 for supporting the glass substrate 1 from the lower side, a resin material is used from the viewpoint of weight reduction, and a frame member 1 for supporting the frame member 1 10 from the lower side is provided. In the case of using a metal material from the viewpoint of rigidity and heat resistance, it is possible to easily carry out the easy transport and manufacture required for the substrate jam 100, and to have low dusting, heat resistance, and drug resistance. Various requirements such as conductivity, light weight, low cost, and institutional size. Further, by providing a plurality of openings 1 5 4 in the bottom portion of the selected concave portion region 153, the substrate lifting pin 2 1 0 provided on the external transfer device 2000 is used as shown in FIG. In order to achieve the lifting and lowering of the glass substrate of the substrate card #100. As a result, as shown in FIG. 9, the transfer arm 400 of the stacker or the like can be inserted between the substrate cassette 100 and the glass substrate 1, and the glass substrate 1 can be easily applied to the substrate cassette 100. By carrying in and carrying out the glass substrate 1 from the substrate cassette 100, the substrate can be easily transferred between steps. Furthermore, as shown in FIG. 10, by opening the opening portion 154 through the substrate 14 312 / invention manual (supplement) / 93-11 / 93123156 1282323 roller 2 2 Ο, as shown in FIG. The glass substrate 1 can be raised to the substrate cassette 100, and the transfer roller 5 10 of the transfer apparatus 500 can be easily executed, and the glass substrate 1 can be transported and carried out, whereby the substrate transfer between steps can be easily performed. Further, since the corner joint member 1 1 2 is provided at the four corners of the frame member 110 to form the structure for stacking the substrate cassettes 100, it can be placed on the pallet 60 as shown in FIG. A stack of a plurality of substrates is stacked on the 0, and can be transported between factories. Further, in the above-described substrate cassette 100, a problem arises in which impurities, a cleaning liquid, and the like are intruded and accumulated in the recessed region 1 5 3 provided in the tray member 150. In this case, as shown in Figs. 13 and 14 , a configuration in which the sheet-like member 158 which covers the recessed portion 1 53 and is elastically deformable may be employed. With this configuration, since the concave portion region 153 is covered by the sheet-like member 158, it is possible to prevent intrusion and accumulation of impurities, cleaning liquid, and the like in the concave portion region 153. Further, although the sheet-like member 158 is illustrated as being fitted to each of the recessed regions 153, a configuration in which the plurality of recessed regions 1 153 are covered by the single-sheet-like member 158 may be employed. Furthermore, even if the recessed portion 1 53 has the opening portion 154, since the sheet-like member 158 is made of an elastically deformable material, as shown in FIGS. 15 and 16, the substrate lifting pin 2 is used. When the first and the like pass through the opening portion 154, the sheet-like member 158 is extended by elastic deformation so that the glass substrate can be raised without hindering the upward movement of the substrate lifting bolt 2 1 0 or the like. . (Embodiment 2) 15 312/Invention Manual (Supplement)/93-11/93123156 1282323 Next, a schematic structure of a substrate cassette 300 according to the present embodiment will be described with reference to FIG. 17 and FIG. . Further, Fig. 17 is a schematic plan view showing the overall structure of the substrate for the substrate of the present embodiment, and Fig. 18 is a cross-sectional view taken along the line X V I I I - X V I I I in Fig. 17. (The entire structure of the substrate cassette 300) The external dimensions of the substrate cassette 300 are slightly the same as those of the substrate cassette 1 of the first embodiment. In the structure for the substrate cassette 10 of the first embodiment, the two-layer structure of the tray member 150 and the frame member 1 1 0 is characterized. However, the substrate cassette 300 of the present embodiment is characterized. In the case where the tray member is not used, the upper surface of the auxiliary frame 3 1 3 arranged in a lattice shape on the frame member 310 is disposed, and the support member 3 1 4 is disposed along the extending direction of the auxiliary frame 3 1 3 to form a double layer structure. . Specifically, first, as shown in FIG. 17, the frame member 301 is formed of a rectangular shape, and includes an outer frame frame member 31 that constitutes a four-sided frame, and a frame member 311 that is coupled to each other at a corner portion. The corner joint member 3 1 2 and the auxiliary frame 3 1 3 which are arranged in a lattice shape. The connection between the outer frame member 3 1 1 and the corner connecting member 3 1 2 and the connection structure between the outer frame frame member 31 1 and the auxiliary frame 3 1 3 are as in the first embodiment described above. Further, the number of the auxiliary frames 3 1 3 can be appropriately changed in accordance with the size of the frame member 301. Further, it may be arranged to have a shape such as "bump", "/", "X", or "X X" with respect to the outer frame member 31. The outer frame member 3 1 1 is made of a non-recorded steel (S U S ), an aluminum (A 1 ) member or the like from the viewpoint of weight reduction and rigidity. The cross-sectional shape is as in the first embodiment described above. Further, the corner joint 16 312 / invention specification (supplement) / 93-11 / 93123156 1282323 structural member 3 1 2 is provided at the corner portion of the four corners of the frame member 310, and is also the same as the above-described first embodiment. The cross-sectional shape of the auxiliary frame 3 1 3 is formed as a slightly C-channel cross-sectional shape having an opening portion as shown in Fig. 18 ( a ). Further, a support member 314 is fitted in the opening portion of the auxiliary frame 3 1 3, and the support member 314 is constituted by a body portion 314a housed inside the auxiliary frame 3 1 3; The region 314a faces outward and has a narrower width than the neck region 314b of the body region 314a; and a head region 3 1 4 c that is exposed from the auxiliary frame 313 to the outside and directly supports the substrate and whose surface is designed to have a curved shape. The substrate is placed on the same plane defined by the top region of the head region 3 1 4 c of the support member 314. Preferably, the support member 314 is disposed over the entire auxiliary frame 3 1 3 in the direction in which the auxiliary frame 3 1 3 extends, but may be partially disposed in a suitably selected partial region. Furthermore, the cross-sectional shape of the auxiliary frame 3 1 3 is not limited to that shown in FIG. 18 ( a ). For example, as shown in FIG. 18 ( b ), an auxiliary frame 3 1 3 having a T-shaped cross section may be used, which will substantially cover this. The auxiliary frame 3 1 3 and the support member 3 1 4 having a head region whose surface is designed to have a curved shape are disposed along the extending direction of the auxiliary frame 3 1 3 . The attachment of the sub-building member 3 1 4 to the sub-frame 3 1 3 can be easily installed by inserting the support member 3 1 4 from the longitudinal direction of the sub-frame 3 1 3 before assembling the frame member 310. The material of the support member 3 1 4 can also be used as a dust-proofing resin from the viewpoint of smoothing and further suppressing dusting (for example, polyetheretherketone, polyethylenimine, polyetherimide, polycondensation) A shaped body of an aldehyde, a polyamine, an ultrahigh molecular weight polyethylene, a polytetrasole 17 312/invention specification (supplement)/93·11/93123156 1282323 vinyl fluoride, various elastomers, and the like. Further, in the case of using a dust-preventing resin molded body, it is preferred to use a raw material which is substantially unmixed into the filler. (Operation and Effect) According to the substrate cassette 300 having the above-described structure, on the plane formed by the apex of the support member 314, the glass substrate 1 can be stably maintained without causing strain on the glass substrate 1. The glass substrate 1 is placed. (Embodiment 3) Next, a schematic configuration of a substrate cassette according to the present embodiment will be described with reference to Fig. 1 . Further, Fig. 19 is a structural view of a corner connecting member 350 as used in the substrate cassette of the present embodiment, wherein (A) is a plan view and (B) is a side view. In the above-described first and second embodiments, the corner connecting member 1 1 2 used for the substrate cassette 100 and the corner connecting member 3 1 2 used for the substrate cassette 300 are both made of a resin molded article. Composition. Here, as shown in Fig. 12 again, the corner connecting members 1 1 2 are positioned to overlap the plurality of substrate cassettes 1000 on the pallet 60, and can be transported between factories. However, in the case of a resin molded article, since the dimensional error is large, the error will accumulate when the substrate is overlapped by the card 100, and the accumulated substrate can be judged by the overall height of the card. Will become bigger. The corner joint member 3 1 2 used for the relevant substrate cassette 300 is also the same. However, in the corner joint member 350 of the present embodiment, the basic structure is the same as the above-described corner joint member 1 1 2, 3 1 2, but is characterized by the overlap region 18 312 / invention specification (supplement) / 93-11 / 93123156 1282323 The structure of the embedded metal block is used. Specifically, as shown in Fig. 19, the corner connecting member 350 includes a resin connecting arm 3 5 2, 3 5 3 connected to the outer frame, and a resin corner member 35 1 . A positioning wall 35 1 a is provided in the resin corner member 35, and a cylindrical metal block 35 5 is formed by a portion in the central portion of the resin corner member 35. At a position corresponding to the upper surface of the metal block 35 5, an upper end abutment region 351u protruding from the upper side is provided, and is disposed downward at a position corresponding to the lower portion of the metal block 35 5 The protruding region lower end abuts the region 351d. The upper end contact region 351u and the lower end abutment region 351d are each formed of a region having a film thickness of about 0.5 mm to 1.0 mm and covering the upper and lower end faces of the metal block 355. Further, the upper and lower end faces of the metal block 3 5 5 may be exposed, and the abutting region 3 5 1 u and the lower end abutting region 3 5 1 d may be formed by the metal block 3 5 5 itself. (Effects and effects) In this case, the metal block material 35 5 is buried in the resin corner member 35 1 , and the height of the corner connecting member 350 is still in the case of the resin molded article. It can be dominated by the height of the metal block 3 5 5 . Therefore, the height dimension error of the metal block obtained by machining can be made smaller than that of the resin molded article. Therefore, even when the resin-made corner member 35 is used to overlap the substrate jam in the height direction, it is possible to abut the upper end abutment region 3 5 1 u and the lower end abutment region 3 5 1 d. Since the overlap is performed, the overall overlap size error is smaller than that of the resin-made corner member 351 having a metal block. 19 312/Invention Manual (Supplement)/93-11/93123156 1282323 In the above embodiments, the substrate cassette 100 for transporting the glass substrate is taken as an example, but has a large size of the same nature. The base plate formed of a thin plate shape is still applicable. Further, the materials used for the tray member and the frame member are not limited to the above materials, and are changed in accordance with appropriately required conditions. Therefore, the technical scope of the present invention is not limited only by the above embodiments, and should be defined as what is described in the scope of the patent application. In addition, all changes within the meaning and scope of the patent application are covered. (Effect of the Invention) According to the substrate cartridge according to the present invention, it is possible to provide easy transport and manufacture, and to satisfy low dusting, heat resistance, chemical resistance, electrical conductivity, light weight, and low cost. A substrate cassette for various structures such as the size of the system. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) and (b) are overall perspective views showing a structure for a substrate for use in a first embodiment. Figure 2 is a cross-sectional view taken along line I I of Figure 1. Figure 3 (a) is a plan view of the tray member, and Figure 3 (b) is a side view of the tray member. Fig. 4 is a cross-sectional view taken along line IV of Fig. 3; Fig. 5 is a plan view showing the frame member of the first embodiment. Fig. 6 is a partially enlarged plan view showing a corner portion of a frame member according to the first embodiment. Figure 7 is a cross-sectional view taken along line VI of Figure 6; 20 312/Invention Manual (Supplement)/93-11/93123156 1282323 Fig. 8 is a first perspective view showing a use form of the substrate for use in the first embodiment. Fig. 9 is a second perspective view showing a use form of the substrate for use in the first embodiment. Fig. 10 is a third perspective view showing a use form of the substrate for use in the first embodiment. Fig. 11 is a fourth perspective view showing a use form of the substrate for use in the first embodiment. Fig. 12 is a fifth perspective view showing a use form of the substrate for use in the first embodiment. Fig. 13 is a partial perspective view showing a state in which a sheet-like member covering a recessed portion of the tray member is provided. Figure 14 is a cross-sectional view taken along line XIV-XIV of Figure 13; Fig. 15 is a partial perspective view showing a state in which the sheet-like member is extended by the substrate lifting bolt. Figure 16 is a cross-sectional view taken along the line X V I - X V I in Figure 15. Fig. 17 is a schematic perspective view showing the overall structure of the substrate for use in the second embodiment. 18(a) and 18(b) are cross-sectional views taken along the line XVIII-XVIII in Fig. 17. Fig. 19 (A) and (B) are structural views of a corner connecting member used for the substrate cassette of the third embodiment. [Description of main component symbols] 1 Glass substrate 1 0 0, 3 0 0 Base card 110, 310 Frame member 21 312 / Invention manual (supplement) / 93-11 /93123156 1282323 111, 311 Frame member 111a Upper wall portion 111b Upper wall Part 111c bottom wall portion 1 1 1 d protruding wall portion 1 1 2, 3 1 2, 3 5 0 corner connecting member 1 12a first wall 112b second wall 112c third wall 11 2d, 1 12e pushing surface 113, 313 Auxiliary frame 1 50 tray member 15 1 support frame region 1 52 protruding region 152a first convex portion 1 52b second convex portion 1 52c lower hole 1 52d reverse folded portion 153 concave portion 1 54 opening portion 1 56 substrate brace convex portion 1 58 Sheet member 180 rivet 200 External conveying device 312 / invention specification (supplement) / 93-11/93123156 1282323 21 0 substrate lifting bolt 220 substrate conveying roller 314 support member 314a body region 3 14b neck region 3 14c head region 35 1 Resin angle member 35 1a Positioning wall 35 1 d Lower end abutment area 3 5 1 u Upper end abutment field 352, 353 Resin joint arm 355 Metal block 400 Transfer arm 500 Transfer device 51 0 Transfer Roller 600 Support plate S Base surface 312/Invention manual (supplement)/93-11 /93123156

Claims (1)

1282323 十、申請專利範圍: 1. 一種基板用卡匣,係供收容薄板狀基板(1 )用的基板 用卡匣(100,300),具備有: 框架構件(1 1 0,3 1 0 ),其由骨架構造所構成;以及 支撐構件(1 5 0,3 1 4 ),其沿上述框架構件(1 1 0,3 1 0 )上面 側而配設,並供從下方面側直接支撐上述基板用。 2. 如申請專利範圍第1項之基板用卡匣,其中,上述框 架構件(1 1 0 )係具有外框框架(1 1 1 )、與設於外框框架(1 1 1 ) 内的輔助框架(1 1 3 ); 上述支撐構件(1 5 0 )係供從下方面側直接支撐上述基板 (1 ),而在上述框架構件(1 1 0 )大致整面上所配置的托盤構 件(1 5 0 ); 上述托盤構件(1 5 0 )係設置複數個從其支撐基準面朝向 下方的凹部區域(153)。 3. 如申請專利範圍第1項之基板用卡匣,其中,上述框 架構件(3 1 0 )係具有:外框框架(3 1 1 ),以及設置於外框框架 (3 11 )内,配置成格子狀的輔助框架(3 1 3 ); 上述支撐構件(3 1 4 )係在上述輔助框架(3 1 3 )上面側,沿 上述輔助框架(3 1 3 )延伸的方向配設。 4. 一種基板用卡匣,係用以收容薄板狀基板(1 )者,具 備有: 框架構件(3 1 0 ),其具外框框架;以及 樹脂製轉角連結構件(3 5 0 ),其供連結上述框架構件之 轉角部(3 1 0 )用; 24 312/發明說明書(補件)/93-11/93123156 1282323 上述樹脂製轉角連結構件(3 5 Ο )係具有沿該基板用卡匣 高度方向配設的金屬製塊狀物(3 5 5 )。1282323 X. Patent application scope: 1. A substrate cassette, which is a substrate cassette (100, 300) for housing a thin plate-shaped substrate (1), comprising: a frame member (1 1 0, 3 1 0 ); And a support member (1, 50, 3 1 4) disposed along the upper side of the frame member (1 1 0, 3 1 0 ) and for directly supporting the substrate from the lower side . 2. The substrate cassette according to claim 1, wherein the frame member (1 1 0 ) has an outer frame frame (1 1 1 ) and an auxiliary device provided in the outer frame frame (1 1 1 ) a frame member (1 1 3 ); the support member (1 50) is a tray member (1) that directly supports the substrate (1) from the lower side, and is disposed substantially on the entire surface of the frame member (1 1 0) 5 0 ); The tray member (150) is provided with a plurality of recessed regions (153) directed downward from the support reference surface. 3. The substrate cassette according to claim 1, wherein the frame member (3 1 0) has an outer frame frame (3 1 1 ) and is disposed in the outer frame frame (3 11 ) A grid-shaped auxiliary frame (3 1 3 ); the support member (3 1 4 ) is disposed on an upper surface side of the auxiliary frame (3 1 3 ), and is disposed along a direction in which the auxiliary frame (3 1 3 ) extends. 4. A substrate cassette for accommodating a thin plate-shaped substrate (1), comprising: a frame member (3 1 0) having an outer frame frame; and a resin corner connecting member (305) For the corner portion (3 1 0 ) for connecting the frame member; 24 312 / invention specification (supplement) / 93-11/93123156 1282323 The above-mentioned resin corner joint member (3 5 Ο ) has a cassette along the substrate A metal block (3 5 5 ) in the height direction. 25 312/發明說明書(補件)/93-11 /9312315625 312/Invention Manual (supplement)/93-11 /93123156
TW093123156A 2003-08-04 2004-08-03 Cassette for substrate TWI282323B (en)

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JP4407586B2 (en) * 2005-07-25 2010-02-03 村田機械株式会社 Single wafer transfer tray
JP2007201066A (en) * 2006-01-25 2007-08-09 Murata Mach Ltd Tray for sheet transfer, and apparatus of storing or transferring tray for sheet transfer
JP2007201341A (en) * 2006-01-30 2007-08-09 Murata Mach Ltd Tray for sheet transfer
JP5115388B2 (en) * 2008-07-31 2013-01-09 株式会社Sumco Wafer transfer container
CN101673699B (en) * 2009-09-03 2011-05-11 东莞宏威数码机械有限公司 Carrying platform of substrate box
US9228256B2 (en) * 2009-12-11 2016-01-05 Kgt Graphit Technologie Gmbh Substrate support
KR101035628B1 (en) * 2010-01-11 2011-05-19 삼성모바일디스플레이주식회사 Tray for substrate
JP5665526B2 (en) * 2010-12-21 2015-02-04 サイデック株式会社 Transport tray for transported plate-like articles
JP2014504039A (en) * 2011-02-01 2014-02-13 株式会社テラセミコン Substrate support boat and support unit using the same
CN103264846B (en) * 2012-11-30 2016-01-20 上海中航光电子有限公司 A kind of wrapping pallet of liquid crystal indicator and packing method

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