TWI253433B - Substrate transportation device, substrate transportation method, and substrate transportation apparatus - Google Patents

Substrate transportation device, substrate transportation method, and substrate transportation apparatus Download PDF

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Publication number
TWI253433B
TWI253433B TW093133852A TW93133852A TWI253433B TW I253433 B TWI253433 B TW I253433B TW 093133852 A TW093133852 A TW 093133852A TW 93133852 A TW93133852 A TW 93133852A TW I253433 B TWI253433 B TW I253433B
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Taiwan
Prior art keywords
substrate
processing
lifting
sheet
loading
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TW093133852A
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Chinese (zh)
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TW200519018A (en
Inventor
Yasuyoshi Kitazawa
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Shinko Electric Co Ltd
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Priority claimed from JP2003376429A external-priority patent/JP4608870B2/en
Priority claimed from JP2003382207A external-priority patent/JP2005150199A/en
Priority claimed from JP2004033041A external-priority patent/JP2005228771A/en
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of TW200519018A publication Critical patent/TW200519018A/en
Application granted granted Critical
Publication of TWI253433B publication Critical patent/TWI253433B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A substrate is made so that it can be transported into and out of an optional shelf of a substrate cassette. A shelf 1R is formed in a cassette body 1 comprising a substrate cassette 1C by making a plurality of wires 4, installed in a tensioned manner, into a shelf base. When transporting out a substrate 1G housed in a respective shelf 1R, respective substrate elevating arms 14 which are formed in a pair of elevating units 1U1 are made to advance into the shelf 1R' which is immediately below the shelf 1R in which the substrate 1G is housed. Then, by actuating air cushion units 21 installed in the upper face of each substrate elevating arm 14, pressurized air is expelled causing the substrate 1G to be raised, and the substrate 1G is transported out in this raised condition.

Description

1253433 (1) 九、發明說明 【發明所屬之技術領域】 本發明，是有關供搬入搬出被收納於基板片匣的預定 的棚的基板用的裝置。 且，本發明，是有關於對於依序經過多數過程使半導 體元件成形於基板的半導體製造裝置，沿著爲了進行各過 程的處理而以過程順序配置的多數的處理裝置所構成的處 理裝置群來搬運前述基板的方法、及裝置。 本案，是主張：2003年11月06日申請的日本國專 利申請第2003-376429號、2003年11月12日申請的日 本國專利申請第2003-382207號、及2004年02月10日 申請的日本國專利申請第2 0 0 4 - 0 3 3 0 4 1號的優先權，在此 援用那些內容。 【先前技術】 多段收納在液晶顯示裝置等所使用的基板（玻璃基板 )用的基板片匣，有很多種（例如，專利文獻1參照）。 此基板’是平面視爲長方形的薄板狀，其大小，是從 5 OOmmX 6 0 0mm ，隨著最近的技術的發展，也有 2000mmX1800mm。而且，將前述基板搬入搬出至基板片 匣用的技術，有很多種（例如，專利文獻2參照）。[Brief Description of the Invention] [Technical Field] The present invention relates to a device for loading and unloading a substrate housed in a predetermined shed of a substrate sheet. Further, the present invention relates to a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes in sequence, and a processing apparatus group including a plurality of processing apparatuses arranged in a process order for performing processing of each process is provided. A method and apparatus for transporting the substrate. In the case of Japanese Patent Application No. 2003-376429, filed on November 06, 2003, and Japanese Patent Application No. 2003-382207, filed on November 12, 2003, and filed on February 10, 2004 The priority of Japanese Patent Application No. 2 0 0 - 4 3 3 0 4 1 is hereby incorporated by reference. [Prior Art] There are many types of substrate sheets for use in a substrate (glass substrate) used for a liquid crystal display device or the like (see, for example, Patent Document 1). This substrate 'is a thin plate whose plane is regarded as a rectangle, and its size is from 5000 mm X 60 mm. With the recent development of technology, there are also 2000 mm X 1800 mm. Further, there are many techniques for loading and unloading the substrate onto the substrate sheet (for example, refer to Patent Document 2).

如第Π圖所示，在習知的基板片匣1 C ’的內側面部 ，供支撐基板1 G的兩端部用的支撐構件5〗，是在高度方 向隔有預定間隔地突出，供支撐前述基板1 G用的棚1 R -4 - (2) (2)1253433 是多段形成。被收納於基板片匣1 C 1的各基板l G，是藉由 對應的支撐構件5 1只有支撐各基板1 G的兩端部。此情 況，各基板1 G的中央部會撓曲，搬入搬出時可能會干渉 正下方的基板1G。且，爲了搬入搬出各基板]G，基板拉 出裝置1 B (第5圖參照）的基板拉出臂5 2也必需可以進 入。爲了防止這些的問題，必需加大各棚i R的高度（棚 間距1 Η )。此結果，1基的基板片匣1 CV的基板1 G的收 納枚數會減少。 爲了防止上述問題，公知如第1 2圖所示，沿著基板 片匣1 C "的左右方向架設拉線5 3，藉此形成各棚1 R。此 基板片匣1C1’的情況，藉由貫通其底面部昇降的附滾子框 架5 4使基板1 G稍微被抬起，在此狀態下搬入搬出該基 板1G。但是，搬出基板1 G時，是需從被收容於最下段的 棚1 :R的基板1 G，依序搬出上段的基板1 G。 且，收納基板1 G時，是需從最上段的棚1 R，依序收 納於下段的棚1 R。因此，想搬出被收納於任意段的棚1 R 的基板1 G，或將基板1 G收納至任意的段的棚1 R是困難 的。 且，當將連續的複數不同過程構成一過程群的情況時 ，成形於如此基板的半導體元件’多會經過同一或是近似 的複數過程群而成爲多層後，再成形於基板。 例如，如第2 6圖所示的基板W中，藉由洗淨裝置A 洗淨基板W的表面之後’藉由CVD裝置B’在其表面形 成氧化膜]5 ]。之後’藉由照像裝置C ’在前述氧化膜 (3) (3)1253433 1 5 1塗抹感光劑1 5 2，依據曝光圖案的曝光、顯像。接著 ，藉由蝕刻裝置D溶化曝光圖案以外的部分，進一步， 去除感光劑1 5 2。由此，在基板w的表面，就會成形第1 層的半導體元件。在某種的基板 W中，在其表面多層成 形有半導體元件，且，各層的成形過程，也有與如第26 圖所示者不同的情況。 因此，如第2 7圖所示，成形半導體元件的各層的複 數過程群之中，以並列狀態配置供進行同一或是近似的過 程的處理用的複數處理裝置A〜D，或者是，將以並列狀 態配置者相面對配置，在各層可整批進行同一或是近似的 處理的稱爲「海灣（BAY )」的處理裝置群並配置於1處 ，將對應各層的過程數的複數「海灣（BAY )」設置於不 同場所進行（例如，專利文獻3參照）。 而且，有關於基板的搬運，是在多數枚的基板被收納 於片匣的狀態下進行，在全部的過程，被收納於片匣的多 數枚的基板是整批進行同一處理（分批處理）。各海灣（ BAY )間的基板群（被收納於片匣的多數枚的基板）的移 動，是藉由連結各海灣（BAY)間的專用的搬運車153進 行。爲了在基板多層成形半導體元件，基板群需在各層的 各過程的各海灣（BAY )間多次往復。然而，在第27圖 ，符號1 5 4，是供暫置片匣用的貯藏庫。 如此，上述「海灣（BAY )方式」，爲了將多數枚的 基板整批在各過程分批處理，從將基板投入製造線，至結 束全過程的處理並成爲完成品（製品）爲止包含全待機時 -6- (4) (4)1253433 間的在製造線內所需要時間（製品製作時間τ 1 2 ) ’是相 當長（第2 2圖參照）。此結果，在製造線內多數的製作 品（製造途中的未完成品）因爲成爲在庫狀態滯溜於製造 線內，從接單後起算完成品可以送達至買主爲止的期間也 就是交貨期很長。因此，在短交貨期的製品的製造是不適 合。且，製品製作時間Τ 1 2很長，無法計爲製品，即使在 製造線內也如在庫的滯溜的未完成品的數量（製作在庫） 因爲很多，從經營面來看，投下資本的周轉率（回收率） 差。進一步，在最近，因爲基板也變大，隨著其也成爲高 價’而使上述的問題更顯著。然而，「製品製作時間」及 「製作在庫」，是分別稱爲「TAT( Turn Around Time) 」5 「WIP(Work-in-Pr〇cess)」，前者的略稱「TAT」 ’是被使用於以下的說明。 [專利文獻1 ]日本特開平8 - 1 9 8 4 0 5號公報 [專利文獻2 ]日本特開平1 1 - 2 2 7 9 4 3號公報 [專利文獻3]日本特開2002-26106號公報 【發明內容】 (本發明所欲解決的課題） 本發明’是鑑於上述問題，其課題爲可將基板從基板 片E的任意的棚內搬入搬出。 且’本發明的課題，是對於半導體製造裝置，可縮短 基板的製品製作時間（TAT )。 (5) (5)1253433 (用以解決課題的手段） 爲了解決上述課題，本發明，是一種基板搬入搬出裝 置，其特徵爲，由：在片匣本體的內部形成多數供多段支 撐基板的棚，前述片匣本體的特定的側面是成爲基板的搬 入搬出開口，前述棚，是隔有預定間隔並貫通片匣本體的 複數條的支撐材構成的基板片匣；及具備基板昇降手段的 基板昇降板是各別從前述基板片匣的側面出入前述基板片 匣內，前述基板昇降板已進入基板片匣內的狀態下將正上 方的基板從前述支撐材稍微抬起的基板昇降元件所構成； 而前述基板片匣及前述基板昇降元件是相對昇降的結構。 使目的基板取出可能地，讓基板片匣及基板昇降元件 相對地昇降後，將昇降元件的基板昇降板從基板片匣的側 面進入基板各別基板片匣內。在此狀態下，作動各基板昇 降元件的基板昇降手段的話，正上方的基板是對於支撐材 稍微被抬起（上昇）。在上述的狀態下，藉由適宜的拉出 手段將基板從基板片匣朝外部拉出。 將基板搬入基板片匣，只要進行上述相反的操作即可 。即，在基板的搬入時，當***於基板片匣內的基板昇降 板所具備的基板昇降手段作動的狀態下進行。在此基板片 匣中因爲具有供貫通基板收納容器的支撐材所以基板的撓 曲減少，可以縮小基板的相互間隔，而增加收納枚數，且 因爲使被支撐於特定的棚的目的基板的搬出、或朝目的棚 的基板的搬入成爲可能地，使基板片匣及基板昇降元件相 對地昇降，所以對於任意的棚的基板的搬入.搬出成爲可 (6) 1253433 能。 且本發明，是以前述發明爲前提，具備前述基板昇降 手段的各基板昇降板是各別從與前述搬入搬出開口鄰接的 二個相面對的側面出入前述基板片匣內。在此發明中’因 爲具備一對的基板昇降元件，所以可縮短具備昇降手段的 懸臂狀的基板昇降板的長度，因爲可以減少其撓曲’所以 可縮小基板片匣的棚間距而使總棚數變大’並增加基板的 收容枚數。 · 進一步本發明，是以前述發明爲前提，其中，前述基 板昇降手段，是由形成有無數的空氣噴出口的基板昇降板 、及供從各空氣噴出口噴出壓力空氣用的壓力空氣源所構 . 成，且使基板對於支撐材浮起的結構。在此發明中’因爲 藉由非接觸將基板對於支撐材搬入搬出，所以無損瘍基板 ‘ 的可能性。 進一步本發明，是以前述發明爲前提，其中，前述基 板昇降手段，是由：形成有無數的空氣噴出口的基板昇降 # 板、及供從各空氣噴出口噴出壓力空氣用的壓力空氣源、 及稍微浮起基板昇降板的基板浮起補助手段所構成，且藉 由壓力空氣及基板浮起補助手段，使基板對於支撐材浮起 的結構。在此發明中，基板，可藉由壓力空氣、及基板浮 起補助手段的雙方從支撐材確實地浮起。 進一步本發明，是以前述發明爲前提，其中，前述基 板昇降手段，是安裝於基板昇降板的上面的多數的支撐滾 子’前述基板，是藉由基板昇降板稍微上昇而從支撐材被 -9- 1253433 抬起。在此發明中，是藉由在基板昇降板的上面安裝多數 的支撐滾子的簡單的機械結構，將基板抬起對於支撐材。 進一步本發明，是一種基板搬入搬出裝置，其特徵爲 ，由：在片匣本體的內部形成多數供多段支撐基板的棚， 前述片匣本體的特定的側面是成爲基板的搬入搬出開口， 前述棚，是隔有預定間隔並貫通片匣本體的複數條的支撐 材構成的基板片匣；及具備基板昇降手段的基板昇降板是 各別從前述基板片匣的側面出入前述基板片匣內，前述基 板昇降板已進入基板片匣內的狀態下將正上方的基板從前 述支撐材稍微抬起的基板昇降元件所構成；前述基板昇降 元件，是使對應於基板片匣的棚數的複數基板昇降板被支 撐於昇降板支撐構件，各基板昇降板，是具有將正上方的 基板從前述支撐材稍微抬起的基板昇降手段，各基板昇降 板的基板昇降手段的動作，是個別切換可能。 對於基板片匣的基板的搬入搬出，是在讓基板昇降元 件的基板昇降板進入基板片匣內的狀態下，藉由作動對應 目的棚的基板昇降手段來進行。此發明的情況，因爲不需 要使基板片匣及基板昇降元件相對地昇降，所以不需要前 述昇降用的裝置，使基板昇降元件的結構很簡單。 進一步本發明，是以前述發明爲前提，其中，前述基 板昇降手段，是使壓力空氣從無數的空氣噴出口噴出的結 構，從各基板昇降手段噴出的壓力空氣的噴出口，是個別 切換可能。對於基板片匣的基板的搬入搬出，是在讓基板 昇降元件的基板昇降板進入基板片匣內的狀態下，只有從 -10- (8) (8)1253433 對應目的棚的基板昇降板噴出壓力空氣。因此，藉由選擇 讓壓力空氣噴出的基板昇降板’基板片匣的複數棚之中’ 就可搬入搬出被收納於任意的棚的基板。 進一步本發明，是一種基板搬運方法，對於依序經過 多數過程使半導體元件成形於基板的半導體製造裝置，沿 著爲了進行各過程的處理而以過程順序配置的多數的處理 裝置所構成的處理裝置群來搬運前述基板的方法，其特徵 爲：前述基板，是姑且暫置在配置於前述各處理裝置之間 的第1暫置台之後，再藉由對應於各處理裝置配置的基板 交接裝置被取出，並1枚1枚地搬運至後續過程的處理裝 置。 藉由此發明，可獲得與後述幾乎同樣的作用效果。 且，本發明，是一種基板搬運方法，對於依序經過多 數過程使半導體元件成形於基板的半導體製造裝置，沿著 爲了進行各過程的處理而以過程順序配置的多數的處理裝 置所構成的處理裝置群來搬運前述基板的方法，其特徵爲 :前述基板的搬運路徑，是具有：爲了對於前述基板依序 進行各過程的處理，透過配置於前述各處理裝置之間的第 1暫置台朝後續過程側依序搬運的正規搬運路；及爲了對 於處理途中的基板進行附帶處理，將基板往復搬運於前述 第]暫置台、或與前述第1暫置台不同的第2暫置台及附 帶處理裝置之間的支線搬運路。 藉由此發明，可獲得與後述幾乎同樣的作用效果。 進一步本發明，一種基板搬運方法，對於依序經過多 -11 - (9) (9)1253433 數過程使半導體兀件成形於基板的半導體製造裝置，沿著 爲了進行各過程的處理而以過程順序配置的多數的處理裝 置所構成的處理裝置群來搬運前述基板的方法，其特徵爲 :藉由配設於各處理裝置及輸送帶裝置之間的基板交接裝 置’ f昔由則述輸送帶裝置將1枚1枚地被搬運的基板交接 至各處理裝置’將在各處理裝置被處理過的基板藉由前述 基板父接裝置父接至輸送帶裝置並搬運至後續過程的處理 裝置。 藉由此發明，可獲得與後述幾乎同樣的作用效果。 進一步本發明，是一種基板搬運裝置，對於依序經過 多數過程使半導體元件成形於基板的半導體製造裝置，沿 者爲了進行各過程的處理而以過程順序配置的多數的處理 裝置所構成的處理裝置群來搬運前述基板的裝置，其特徵 爲’具備·爲了 一時地暫置搬運中的基板，而配置於負責 前後的過程的各處理裝置之間的多數的第1暫置台；及在 該處理裝置處理從前過程側的第1暫置台取出的基板後， 將基板搬運至鄰接前述第1暫置台的後續過程側的別的第 1暫置台用的多數的基板交接裝置；藉由前述第1暫置台 將處理途中的基板1枚1枚地依序朝後續過程側搬運。 爲了將基板從前過程的處理裝置朝後續過程的處理裝 置搬運’將基板姑且暫置在配置於各處理裝置之間的第i 暫置台’利用前述第1暫置台藉由基板交接裝置將基板依 序朝後續過程搬運，所以即使各處理裝置的節拍時間（對 於該處理裝置的連續處理的每]個基板的處理需要時間， -12- (10)1253433 或者是 隔或是 基板交 同期（ 在 過程之 的處理 基板交 置台將 被消解 因 搬運基 變短。 著的處 因爲前 製作品 期變短 5具有 經營面 本周轉 進 1暫置 程的處 理已結 被連續處理的基板的對於該處理裝置 從該處理裝置排出的時間間隔）上有 接裝置，也不需與前後過程的基板交 連動），可獨自進行基板的交接（搬 前後的各基板交接裝置之間直接交接 中只結束了特定的過程爲止的處理， 未進行的狀態）的基板，是有會損瘍 接裝置的構造變複雜的問題，但是因 處理中的基板朝後續過程搬運，所以 〇 爲是沿著依過程順序配置的處理裝置 板’進行多過程的處理的方式，所以 因此，與將多數枚的基板整批進行同 理也同樣整批進行「海灣（BAY )方 述製品製作時間顯著變短的同時，在 (未完成品）的滯溜基板的數量也激 ，就可對應短交貨期、或者是極短交 上述基板搬運方法的特徵的半導體的 看的話，投下資本的回收（周轉）快 率（回收率）。 一步本發明，是以前述發明爲前提， 台，可以暫置複數枚的基板。在此發 理裝置一時故障的情況等，前過程的 束的處理途中的基板，不會滯溜於處 的投入時間間 一些偏差，各 接裝置的動作 運）。 處理途中（全 但剩下的過程 基板，或者是 爲藉由第1暫 上述各問題可 群1枚1枚地 製品製作時間 一處理後，接 式」相比較， 製造線內成爲 減，所以交貨 貨期。此結果 製造方法，從 ’而可提高資 其中，前述第 明中，後續過 處理裝置的處 理裝置內、或 -13- (11) (11)1253433 者是交接裝置內，而可從這些的各裝置搬出並整批地暫置 〇 進一步本發明，是以前述發明爲前提，其中，前述第 1暫置台是多段收納構造，並藉由先進先出方式被搬入搬 出。在此發明中，複數枚的基板即使暫置於第1暫置台， 因爲是以先進先出方式進行搬入搬出，可以防止因只有特 定的基板長時間滯溜於製造線內所導致的製品品質的下降 等的發生。 進一步本發明，是以前述發明爲前提，其中，具備： 配置在基板的正規搬運路的所期位置並與前述第1暫置台 不同的附帶處理裝置專用的第2暫置台、及將從前述第2 暫置台取出的基板支線搬運至附帶處理裝置爲止用的基板 支線搬運車。 被附帶處理的處理途中的基板，是藉由基板交接裝置 暫置於第2暫置台之後，交接至基板支線搬運車並經過支 線路徑搬運至附帶處理裝置爲止，在處理後，是藉由前述 基板支線搬運車，被搬運至配置於接著的過程的處理可能 的位置的第2暫置台爲止加以暫置。 之後，是已附帶處理過的基板，是與通常的基板同樣 經過正規搬運路依序搬運至未處理的各過程。各過程的節 拍時間，因爲設定成幾乎一定，所以當藉由上述抽取進行 抽取時、及結束附帶處理返回至正規搬運路時，對於以被 抽取的過程爲基準的前後的過程，藉由變化節拍時間直到 預定枚數的處理結束爲止（當抽取時，藉由縮短後續過程 -14- (12) (12)1253433 的節拍時間，當返回至原處時，藉由縮短前過程的節拍時 間），其以後是以原來的節拍時間平順地處理。 在此，因特定的處理裝置的故障等原因，讓別的基板 是貯藏在配置於進行抽取的位置的第]或是第2的任一的 暫置台的情況時，抽取了附帶處理用的基板之後，結束了 與前述被抽取的基板同一處理的別的基板是藉由被搬運至 後續過程，就可在可維持後續過程的節拍時間的狀態下， 進行基板的處理。 進一步本發明，是以前述發明爲前提，其中，暫置於 前述第2暫置台的基板的搬運，是藉由第2暫置台本身的 搬運進行。第2暫置台的基板的搬入口及搬出口多爲同一 的設計5且第2暫置台，因爲配置於正規搬運路及支線搬 運路之間，所以藉由搬運第2暫置台本身，就不需要將搬 入口（搬出口）設在2處。 進一步本發明，是以前述發明爲前提，由多數的處理 裝置構成的處理裝置群，是沿著正規搬運路被二分割且相 面對配置，被二分割的各處理裝置群之間是成爲支線搬運 路。支線搬運路，是因爲對應於兩側的處理裝置群的雙方 ’所以與正規搬運路爲直線的情況相比較，其長度成爲一 半，藉由基板支線搬運車將基板搬運於附帶處理裝置及第 2暫置台之間所需要的時間就可縮短。 進一步本發明，是一種基板搬運裝置，對於依序經過 多數過程使半導體元件成形於基板的半導體製造裝置，沿 著爲了進行各過程的處理而以過程順序配置的多數的處理 -15- (13) (13)1253433 裝置所構成的處理裝置群來搬運前述基板的裝置，其特徵 爲’具備：沿著各處理裝置的配列方向配設，1枚1枚地 搬運基板用的輸送帶裝置；及配設於前述輸送帶裝置及各 處理裝置之間，在兩者之間進行基板的交接用的基板交接 裝置；在前述各處理裝置被處理的基板，是藉由前述輸送 帶裝置搬運至後續過程的處理裝置。 因爲沿著依過程順序配置的處理裝置群1枚1枚地搬 運基板，進行多過程的處理的方式，所以製品製作時間縮 短。因此，與將多數枚的基板整批進行同一處理後，在接 著的處理也同樣進行整批「海灣（BAY )方式」相比較， 因爲前述製品製作時間（TAT )顯著縮短的同時，在製造 線內成爲製作品（未完成品）的滯溜基板的數量也激減， 所以交貨期變短，就可對應短交貨期、或者是極短交貨期 。此結果’具有上述基板搬運方法的特徵的半導體的製造 方法，從經營面看的話，投下資本的回收（周轉）快，而 可提高資本周轉率（回收率）。 進一步本發明，是以前述發明爲前提，其中，前述基 板，是在被收容於托盤的狀態下被搬運。基板，是直接載 置於輸送帶裝置的狀態下被搬運的話，基板的輸送帶裝置 的接觸面雖可能被污染或損塲，但是在此發明中，基板是 因爲被收容於托盤內，所以不需擔心。 進一步本發明，是以前述發明爲前提，其中，在輸送 帶裝置的處理裝置的正下流側，配設供一時保管已結束前 述處理裝置的處理的基板用的基板保管裝置。即使因後續 -16- (14) (14)1253433 過程的處理裝置的故障或維修檢點等，而無法將基板搬運 至後續過程，但藉由將處理途中（其上流側的過程的處理 已結束）的基板，一時保管於基板保管裝置，就不需讓前 過程的處理已結束的基板，保持滯溜的狀態（例如，收容 於處理裝置內的狀態）。 進一步本發明，是以前述發明爲前提，其中，前述輸 送帶裝置是周轉輸送帶裝置，使半導體元件成形於基板用 的各處理裝置群，是配設於周轉輸送帶裝置的周圍。在此 發明中，輸送帶裝置是周轉輸送帶裝置，且，各處理裝置 群是配設於其周圍。因此，爲了將多層的半導體元件成形 於基板，即使需配設多數的處理裝置的情況，也可以縮小 的整體的設置面積。 進一步本發明，是以前述發明爲前提，其中，爲了對 於處理途中的基板進行附帶處理，而在各處理裝置之間配 設可搬運前述基板的支線搬運裝置。因此，進行處理途中 的基板的倒角檢查，或任一的處理裝置故障時，可藉由其 他的處理裝置替代進行處理，或將基板搬運至前述其他的 處理裝置，就可提高基板的處理效率。 (發明之效果） 本發明，是一種基板搬入搬出裝置，其特徵爲，由： 在片匣本體的內部形成多數供多段支撐基板的棚，前述片 匣本體的特定的側面是成爲基板的搬入搬出開□，前述棚 ’是隔有預定間隔並貫通片匣本體的複數條的支撐材構成 - 17- (15) 1253433 的基板片匣；及具備基板昇降手段的基板昇降板是各別從 前述基板片匣的側面出入前述基板片匣內，前述基板昇降 板已進入基板片匣內的狀態下將正上方的基板從前述支撐 材稍微抬起的基板昇降元件所構成；而前述基板片匣及前 述基板昇降元件是相對昇降的結構。因此，可無損攥地搬 出被收納於任意的棚的基板、及將基板搬入基板片匣的任 意的棚。 且，本發明，是一種基板搬運方法，對於依序經過多 數過程使半導體元件成形於基板的半導體製造裝置，沿著 爲了進行各過程的處理而以過程順序配置的多數的處理裝 置所構成的處理裝置群來搬運前述基板的方法，其特徵爲 :前述基板，是姑且暫置在配置於前述各處理裝置之間的 第1暫置台之後，再藉由對應於各處理裝置配置的基板交 接裝置被取出，並1枚1枚地搬運至後續過程的處理裝置 。因此，各處理裝置的節拍時間即使有一些偏差，但各基 板交接裝置，也不需與前後過程的基板交接裝置的動作同 期（連動），可獨自進行基板的交接（搬運）。且，因爲 沿著依過程順序配置的處理裝置群1枚1枚地搬運基板， 進彳了多過程的處理的方式，所以製品製作時間縮短，同時 ，因爲在製造線內成爲製作品（未完成品）的滯溜基板的 數量也激減，所以交貨期變短，就可對應短交貨期 '或者 是極短交貨期。 進一步，本發明，是一種基板搬運裝置，對於依序經 過多數過程使半導體元件成形於基板的半導體製造裝置， -18- (16) (16)1253433 沿著爲了進行各過程的處理而以過程順序配置的多數的處 理裝置所構成的處理裝置群來搬運前述基板的裝置，其特 徵爲，具備：爲了一時地暫置搬運中的基板，而配置於負 責前後的過程的各處理裝置之間的多數的第1暫置台；及 在該處理裝置處理從前過程側的第1暫置台取出的基板後 ，將基板搬運至鄰接前述第1暫置台的後續過程側的別的 第1暫置台用的多數的基板交接裝置；藉由前述第1暫置 台將處理途中的基板1枚1枚地依序朝後續過程側搬運。 即，因爲沿著依過程順序配置的處理裝置群1枚1枚地搬 運基板，進行多過程的處理的方式，所以製品製作時間（ TAT )顯著縮短的同時，在製造線內成爲製作品（未完成 品）的滯溜基板的數量也激減，所以交貨期變短，就可對 應短交貨期、或者是極短交貨期。 【實施方式】 以下，舉例本發明的最良實施例，來更詳細說明本發 明。 [實施例1] 首先，依據第1〜第3實施例說明本發明的基板搬入 搬出裝置。 第1圖是本發明的第1實施例的基板搬入搬出裝置 ]A1的整體立體圖，第2圖是基板片匣1C的立體圖，第 3圖是第1實施例的基板搬入搬出裝置1 A ]的前視圖’第 -19- (17) 1253433 4圖是一對的基板昇降元件1 U 1的各基板昇降臂1 4已進 入了基板片匣1 C內的狀態的平面圖’第5圖是基板拉出 裝置1 B的平面圖，第6圖是相同的側面剖面圖。As shown in the figure, on the inner side surface portion of the conventional substrate sheet C1 C ', the support members 5 for supporting both end portions of the substrate 1 G are protruded at a predetermined interval in the height direction for support. The shed 1 R -4 - (2) (2) 1253433 for the substrate 1 G is formed in multiple stages. Each of the substrates 135 accommodated in the substrate sheet C1 C 1 has only the both end portions of the respective substrates 1 G supported by the corresponding supporting members 51. In this case, the center portion of each of the substrates 1 G is deflected, and the substrate 1G directly under the surface may be dried during loading and unloading. Further, in order to carry in and out the respective substrates]G, the substrate drawing arm 5 2 of the substrate pulling device 1 B (refer to FIG. 5) must be allowed to enter. In order to prevent these problems, it is necessary to increase the height of each shed i R (the shed spacing is 1 Η). As a result, the number of sheets of the substrate 1 G of the one-base substrate sheet C 1 CV is reduced. In order to prevent the above problem, it is known that the shackles 1 R are formed by arranging the wires 5 in the left-right direction of the substrate sheet 1 C " as shown in Fig. 2 . In the case of the substrate piece 1C1', the substrate 1 G is slightly lifted by the roller frame 5 4 which is raised and lowered through the bottom surface portion, and the substrate 1G is carried in and out in this state. However, when the substrate 1 G is carried out, the substrate 1 G of the upper stage is sequentially carried out from the substrate 1 G of the shed 1 : R accommodated in the lowermost stage. Further, when the substrate 1 G is housed, it is necessary to sequentially receive the shed 1 R from the uppermost shed 1 R in the lower stage. Therefore, it is difficult to carry out the substrate 1 G of the shed 1 R accommodated in any stage or to store the substrate 1 G in the shed 1 R of an arbitrary stage. Further, when a plurality of successive plural processes are formed into a process group, the semiconductor elements s formed on such a substrate are formed into a plurality of layers by the same or similar complex process group, and then formed on the substrate. For example, in the substrate W shown in Fig. 26, after the surface of the substrate W is washed by the cleaning device A, an oxide film [5] is formed on the surface thereof by the CVD device B'. Thereafter, the sensitizer 1 5 2 is applied to the oxide film (3) (3) 1253433 151 by the photographic device C', and exposure and development are performed in accordance with the exposure pattern. Next, the portion other than the exposure pattern is melted by the etching device D, and the photosensitive agent 15 2 is further removed. Thereby, the semiconductor element of the first layer is formed on the surface of the substrate w. In a certain substrate W, a semiconductor element is formed in a plurality of layers on the surface thereof, and the forming process of each layer may be different from that shown in Fig. 26. Therefore, as shown in FIG. 27, in the complex process group of each layer of the formed semiconductor element, the complex processing apparatuses A to D for performing the same or similar processes are arranged in a parallel state, or The parallel state configurator faces the configuration, and the processing device group called "Bay (BAY)" which can perform the same or similar processing in batches at each layer is disposed at one place, and the number of processes corresponding to each layer is "Bay". (BAY) is installed in a different place (for example, refer to Patent Document 3). In addition, in the case where a plurality of substrates are stored in a sheet, the substrate is transported in a plurality of sheets, and the plurality of substrates accommodated in the sheet are processed in the same batch (batch processing). . The movement of the substrate group (the plurality of substrates accommodated in the cassette) between the bays (BAY) is performed by connecting a dedicated transport vehicle 153 between the bays (BAY). In order to multilayerly form a semiconductor device on a substrate, the substrate group needs to reciprocate a plurality of times between bays (BAY) of each process of each layer. However, in Fig. 27, the symbol 154 is a repository for temporary placement. In the above-mentioned "BAY" method, in order to batch-process a plurality of substrates in batches, the substrate is put into the manufacturing line, and the entire process is completed, and the finished product (product) is completely standby. The time required for the production line between the time -6- (4) and (4) 1253433 (product production time τ 1 2 ) 'is quite long (refer to Figure 2). As a result, most of the productions in the manufacturing line (unfinished products in the middle of the manufacturing process) are in the state of being in the manufacturing line, and the delivery period can be delivered to the buyer from the time of the order, that is, the delivery time is very high. long. Therefore, the manufacture of articles in short delivery times is not suitable. Moreover, the production time of the product Τ 1 2 is very long and cannot be counted as a product. Even in the manufacturing line, the number of unfinished products in the warehouse (made in the warehouse) is a lot. From the management point of view, the turnover of the capital is invested. The rate (recovery rate) is poor. Further, recently, since the substrate has also become large, the above problem has become more remarkable as it has become expensive. However, "Production Time" and "Production in Library" are respectively called "TAT (Turn Around Time)" 5 "WIP (Work-in-Pr〇cess)", and the former "TAT" is used. In the following description. [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. Hei. No. 2002-26106 [Problems to be Solved by the Invention] The present invention has been made in view of the above problems, and it is an object of the invention that the substrate can be carried in and out from any shed of the substrate piece E. Further, the problem of the present invention is that the semiconductor manufacturing apparatus can shorten the product manufacturing time (TAT) of the substrate. (5) (5) 1253433 (Means for Solving the Problem) In order to solve the above problems, the present invention is a substrate loading/unloading device characterized in that a plurality of sheds for supporting a plurality of stages of support substrates are formed inside the sheet body The specific side surface of the sheet body is a substrate loading/unloading opening, and the shed is a substrate sheet composed of a plurality of supporting materials that are spaced apart from each other by a predetermined interval, and a substrate lifting device including a substrate lifting means The board is formed by a substrate lifting and lowering element which is inserted into the substrate sheet from the side surface of the substrate sheet, and the substrate lifting plate has entered the substrate sheet while the substrate is slightly lifted from the support member; The substrate piece 匣 and the substrate lifting element are configured to move up and down. When the target substrate is taken out, the substrate sheet and the substrate elevating member are relatively lifted and lowered, and the substrate elevating plate of the elevating element is inserted into the substrate substrate sheet from the side of the substrate sheet. In this state, when the substrate elevating means for each of the substrate raising and lowering elements is actuated, the substrate directly above is slightly raised (raised) to the supporting member. In the above state, the substrate is pulled out from the substrate sheet to the outside by a suitable pulling means. The substrate is carried into the substrate sheet, and the reverse operation described above may be performed. In other words, when the substrate is loaded, the substrate elevating means provided in the substrate elevating plate inserted in the substrate piece is moved. Since the substrate sheet has a support material for penetrating the substrate storage container, the deflection of the substrate is reduced, and the distance between the substrates can be reduced, and the number of storage sheets can be increased, and the substrate to be supported by the specific shed can be carried out. In addition, it is possible to carry out the loading and unloading of the substrate of any shed (6) 1253433. According to the present invention, in the premise of the invention, each of the substrate elevating plates including the substrate elevating means is inserted into the substrate piece from the side faces facing the loading/unloading opening. In the present invention, since a pair of substrate lifting and lowering members are provided, the length of the cantilever-shaped substrate lifting and lowering plate having the lifting and lowering means can be shortened, and since the deflection can be reduced, the slab pitch of the substrate piece can be reduced to make the total shed The number becomes larger 'and increases the number of substrates accommodated. Further, the present invention is based on the premise that the substrate lifting and lowering means is constituted by a substrate lifting plate in which a plurality of air ejection ports are formed, and a pressure air source for discharging pressurized air from each air ejection port. And a structure in which the substrate floats on the support material. In the present invention, since the substrate is carried into and out of the support material by non-contact, the possibility of the substrate is not impaired. Further, the present invention is based on the premise that the substrate lifting and lowering means includes a substrate lifting and lowering plate in which an infinite number of air ejection ports are formed, and a pressure air source for discharging pressurized air from each of the air ejection ports. And a substrate floating assisting means for slightly lifting the substrate lifting plate, and a structure in which the substrate floats on the supporting member by the pressurized air and the substrate floating assisting means. In the invention, the substrate can be surely floated from the support member by both the pressurized air and the substrate floating support means. Further, the present invention is based on the premise that the substrate lifting and lowering means is a plurality of supporting rollers attached to the upper surface of the substrate lifting plate, and the substrate is lifted from the support material by the substrate lifting plate. 9- 1253433 Lifted up. In this invention, the substrate is lifted up against the support by a simple mechanical structure in which a plurality of support rollers are mounted on the upper surface of the substrate lifting plate. Further, the present invention is a substrate loading/unloading device characterized in that a plurality of sheds for supporting a plurality of stages of support substrates are formed inside the sheet body, and a specific side surface of the sheet body is a loading/unloading opening for the substrate, and the shed a substrate sheet that is formed by a plurality of support members that are spaced apart from each other by a predetermined interval; and a substrate lifting and lowering plate that includes a substrate lifting and lowering means that enters and exits the substrate sheet from the side surface of the substrate sheet The substrate lifting and lowering plate is formed by a substrate lifting and lowering element that slightly lifts the substrate directly above from the supporting material in a state where the substrate lifting plate has entered the substrate sheet; the substrate lifting and lowering member is a plurality of substrates that are raised in accordance with the number of the substrate sheets. The plate is supported by the lifting plate supporting member, and each of the substrate lifting plates is a substrate lifting and lowering means for slightly lifting the substrate directly above from the supporting member, and the operation of the substrate lifting and lowering means of each of the substrate lifting plates may be individually switched. The loading and unloading of the substrate of the substrate sheet is performed by moving the substrate lifting and lowering means of the corresponding target shed in a state where the substrate lifting plate of the substrate lifting member enters the substrate sheet. In the case of this invention, since it is not necessary to relatively raise and lower the substrate piece and the substrate elevating element, the above-described device for lifting and lowering is not required, and the structure of the substrate elevating element is simple. Further, the present invention is based on the above-described invention, wherein the substrate lifting and lowering means is a structure in which pressurized air is ejected from an innumerable air ejection port, and the ejection port of the pressurized air ejected from each of the substrate elevating means is individually switched. The loading and unloading of the substrate of the substrate sheet is performed in a state in which the substrate lifting and lowering plate of the substrate lifting and lowering member enters the substrate sheet, and only the pressure is ejected from the substrate lifting plate of the target shelf of -10- (8) (8) 1253433. air. Therefore, the substrate to be stored in any of the sheds can be carried in and out by selecting the substrate hoisting plate of the substrate sheet 让 which allows the compressed air to be ejected. Further, the present invention is a substrate transporting method, and a processing apparatus comprising a plurality of processing apparatuses arranged in a process order for performing processing of each process in a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate through a plurality of processes in sequence A method of transporting the substrate, wherein the substrate is temporarily placed in a first temporary stage disposed between the processing devices, and then removed by a substrate transfer device disposed corresponding to each processing device And transported one by one to the processing device of the subsequent process. According to this invention, almost the same effects as those described later can be obtained. Further, the present invention is a substrate transport method, and a semiconductor processing apparatus for sequentially molding a semiconductor element on a substrate through a plurality of processes, and processing by a plurality of processing apparatuses arranged in a process order for performing processing of each process. The method of transporting the substrate by the device group is characterized in that the transport path of the substrate has a process of performing a process for the substrate, and the first temporary stage disposed between the processing devices is sequentially a normal transport path that is sequentially transported on the process side; and a process for carrying out the processing on the substrate in the process, and the substrate is reciprocally transported to the second temporary stage or the second temporary stage different from the first temporary stage and the processing device The branch line between the roads. According to this invention, almost the same effects as those described later can be obtained. Further, according to the present invention, there is a substrate transport method for a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes of a plurality of -11 (9) (9) 1253433, and a process sequence is performed along the process for performing each process. A method of transporting the substrate by a processing device group constituted by a plurality of processing devices arranged, wherein the substrate transfer device disposed between each processing device and the conveyor device is described as a conveyor device The substrate to be transported one by one is transferred to each processing device'. The substrate processed by each processing device is transported to the processing device of the subsequent process by the parent of the substrate parent device to the conveyor device. According to this invention, almost the same effects as those described later can be obtained. Further, the present invention relates to a substrate transporting apparatus, and a processing apparatus comprising a plurality of processing apparatuses arranged in a process sequence for performing processing of each process in a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate in a plurality of processes. A device for transporting the above-mentioned substrate is characterized in that it includes a plurality of first temporary stages disposed between the respective processing devices responsible for the process before and after the substrate is temporarily placed, and the processing device After processing the substrate taken out from the first temporary stage on the front process side, the substrate is transported to a plurality of substrate transfer devices for the other first temporary stage adjacent to the subsequent process side of the first temporary stage; and the first temporary stage is The substrates in the middle of the process are sequentially transported one by one to the subsequent process side. In order to transport the substrate from the processing device of the previous process to the processing device of the subsequent process, the substrate is temporarily placed in the i-th temporary stage disposed between the processing devices. The substrate is sequentially transferred by the substrate transfer device by using the first temporary table. It is transported to the subsequent process, so even if the tact time of each processing device (for each processing of the continuous processing of the processing device requires time), -12-(10)1253433 is either a partition or a substrate overlap (in the process The handling of the substrate transfer table will be diminished due to the shortening of the handling base. The position is shortened because the pre-production period is 5, and the processing surface is transferred to the temporary setting. This process has been processed for the continuous processing of the substrate. The time interval from the processing device is connected to the substrate, and the substrate is not connected to the substrate before and after the process. The substrate can be transferred by itself (only the specific transfer between the substrate transfer devices before and after the transfer is completed) The process of the process up to the process, the state of the process which is not performed) is a problem that the structure of the damage-damping device becomes complicated, but the cause is complicated. Since the substrate is transported to the subsequent process, it is a method of performing multi-process processing along the processing device board arranged in the order of the process. Therefore, the same batch is performed in the same batch as the plurality of substrates. "At the same time, the production time of the BAY product is significantly shorter, and the number of the stagnation substrates in the (unfinished product) is also increased, and it is possible to correspond to the short delivery time or the characteristics of the above-mentioned substrate transportation method. In the case of the semiconductor, the recycling rate (recovery rate) of the capital is dropped. One step of the present invention is based on the premise of the invention, and a plurality of substrates can be temporarily placed. In the process of processing the beam of the pre-process, there is no deviation between the input time of the stagnation and the operation of each device, and the process substrate (all but the remaining process substrate, or 1 For each of the above problems, the production time of one piece of the product can be processed once, and the production line is reduced. Therefore, the delivery time is the result. In addition, in the above-mentioned first, the processing device of the subsequent processing device, or -13-(11)(11)1253433 is the transfer device, and can be carried out from each of these devices. Further, the present invention is based on the premise that the first temporary stage is a multi-stage storage structure and is carried in and out by a first-in first-out method. In the invention, a plurality of substrates are temporarily suspended. When it is placed in the first temporary stage, it is carried out by the FIFO method, and it is possible to prevent the occurrence of deterioration of the product quality due to the stagnation of the specific substrate in the manufacturing line for a long time. Further, the present invention is In the above-mentioned invention, the second temporary stage for the processing device that is disposed at a predetermined position of the normal conveyance path of the substrate and different from the first temporary stage, and the substrate that is taken out from the second temporary stage are provided. The branch line is transported to the substrate feeder truck for use with the processing unit. The substrate in the middle of the processing to be processed is temporarily placed on the second temporary stage by the substrate transfer device, transferred to the substrate branch conveyance vehicle, and transported to the attached processing device via the branch line. After the processing, the substrate is processed by the substrate. The feeder truck is transported to the second temporary stage placed at a possible position for processing in the subsequent process. Thereafter, it is a substrate that has been processed, and is transported to the unprocessed process in the same manner as a normal substrate through a regular conveyance path. Since the tact time of each process is set to be almost constant, when the extraction is performed by the above extraction and the attached processing is returned to the normal conveyance path, the process is changed before and after the process of the extraction. The time until the end of the processing of the predetermined number of numbers (when extracting, by shortening the tact time of the subsequent process -14 (12) (12) 1253433, when returning to the original position, by shortening the tact time of the previous process), It is then processed smoothly with the original beat time. Here, when another substrate is stored in the temporary stage of either the second or the second position where the extraction is performed due to a failure of a specific processing device or the like, the substrate for processing is extracted. Thereafter, the other substrate which has been processed in the same manner as the substrate to be extracted is transported to the subsequent process, and the substrate can be processed while maintaining the tact time of the subsequent process. Further, the present invention is based on the above invention, wherein the conveyance of the substrate temporarily placed on the second temporary stage is performed by the conveyance of the second temporary stage itself. Since the second inlet and the outlet of the substrate of the second temporary stage are the same design 5 and the second temporary stage is disposed between the regular conveyance path and the branch conveyance path, it is not necessary to convey the second temporary stage itself. Set the entrance (transport) to 2 locations. Further, the present invention is based on the premise of the invention, and the processing device group including a plurality of processing devices is divided into two along the normal transport path and arranged to face each other, and the two processing units are divided into branch lines. Carrying the road. The branch line is the same as the case where the normal conveyance path is straight, and the length is half, and the substrate is transported by the substrate feeder to the attached processing device and the second The time required between the temporary stations can be shortened. Further, the present invention is a substrate transporting apparatus, and a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes in sequence, and a plurality of processes arranged in a process order for performing processing of each process -15-(13) (13) A device for transporting the above-mentioned substrate in a group of processing apparatuses, which is constituted by a device, is characterized in that: "a conveyor belt device for transporting substrates one by one along the arrangement direction of each processing device; and a substrate transfer device for transferring a substrate between the conveyor device and each of the processing devices; and the substrate processed by each of the processing devices is transported to the subsequent process by the conveyor device Processing device. Since the processing device group arranged in the order of the process transports the substrate one by one and performs the processing of the multi-process, the product production time is shortened. Therefore, after the same process is performed in the same batch as the plurality of substrates, the entire batch of "BAY" method is similarly compared in the subsequent process, because the manufacturing time (TAT) of the above product is significantly shortened, and the manufacturing line is The number of slippage substrates that become a work (unfinished product) is also reduced, so that the delivery time is shortened, and it is possible to correspond to a short delivery time or a very short delivery time. As a result, the manufacturing method of the semiconductor having the characteristics of the substrate transfer method described above, when viewed from the management side, the recovery (turnover) of the invested capital is fast, and the capital turnover rate (recovery rate) can be improved. Further, the present invention is based on the above invention, wherein the substrate is conveyed while being housed in a tray. When the substrate is transported in a state of being directly placed on the conveyor belt device, the contact surface of the conveyor belt device of the substrate may be contaminated or damaged. However, in the invention, the substrate is housed in the tray, so Need to worry. Further, the present invention is based on the above-described invention, in which a substrate storage device for a substrate for temporarily storing the processing of the above-described processing device is disposed on the downstream side of the processing device of the conveyor device. Even if the substrate cannot be transported to the subsequent process due to the failure of the processing device of the subsequent-16-(14) (14)1253433 process or the maintenance checkpoint, etc., the processing is in progress (the processing of the process on the upstream side has ended) When the substrate is temporarily stored in the substrate storage device, the substrate that has been processed by the previous process is not required to remain in a stagnant state (for example, in a state of being accommodated in the processing device). Further, the present invention is based on the premise that the conveyor belt device is a revolving belt device, and the semiconductor element is formed on each of the processing device groups for the substrate, and is disposed around the revolving conveyor device. In the invention, the conveyor belt device is a revolving conveyor belt device, and each of the treatment device groups is disposed around the conveyor belt device. Therefore, in order to form a plurality of semiconductor elements on a substrate, even if a large number of processing apparatuses are required, the entire installation area can be reduced. Further, the present invention is based on the premise that the branch line conveying device capable of transporting the substrate is disposed between the respective processing devices in order to perform an additional process on the substrate in the middle of the process. Therefore, when the chamfering inspection of the substrate in the middle of the process is performed, or when any of the processing devices fails, the processing efficiency can be improved by replacing the processing with another processing device or by transporting the substrate to the other processing device. . (Effect of the Invention) The present invention provides a substrate loading/unloading device in which a plurality of shelves for supporting a plurality of stages are formed inside a sheet body, and a specific side surface of the sheet body is carried into and out of the substrate. In the opening, the shed 'is a substrate piece - 17- (15) 1253433 which is formed by a plurality of support materials which are spaced apart from each other by a predetermined interval; and the substrate lifting plate provided with the substrate lifting means is separately from the substrate The side surface of the sheet is inserted into the substrate sheet, and the substrate lifting and lowering plate is inserted into the substrate sheet, and the substrate is lifted from the support member by the substrate lifting member. The substrate sheet and the substrate are The substrate lifting element is a structure that is relatively lifted and lowered. Therefore, it is possible to carry out the substrate accommodated in any shed and the shed which carries the substrate into the substrate sheet without any damage. Further, the present invention is a substrate transport method, and a semiconductor processing apparatus for sequentially molding a semiconductor element on a substrate through a plurality of processes, and processing by a plurality of processing apparatuses arranged in a process order for performing processing of each process. The method of transporting the substrate by the device group is characterized in that the substrate is temporarily placed after the first temporary stage disposed between the processing devices, and then the substrate transfer device disposed corresponding to each processing device is It is taken out and transported one by one to the processing device of the subsequent process. Therefore, even if there is some variation in the tact time of each processing device, the substrate transfer device does not need to be connected (transported) in the same manner as the substrate transfer device in the front and rear processes, and the substrate can be transferred (transported) by itself. In addition, since the processing device group is transported one by one in the order of the process, and the processing of the multi-process is performed, the production time of the product is shortened, and at the same time, the production is made in the manufacturing line (unfinished) The number of slippery substrates of the product is also reduced, so the delivery time is shortened, and it is possible to correspond to a short delivery time or a very short delivery time. Further, the present invention is a substrate transfer apparatus for a semiconductor manufacturing apparatus which sequentially forms a semiconductor element on a substrate through a plurality of processes, -18-(16)(16)1253433 in order of processing for performing each process A device for transporting the substrate is disposed in a processing device group including a plurality of processing devices, and is characterized in that a plurality of devices are disposed between the processing devices responsible for the process before and after the substrate is temporarily placed. And the first temporary stage for processing the first temporary stage on the subsequent process side of the first temporary stage In the substrate transfer device, the substrate in the middle of the process is sequentially transported to the subsequent process side by the first temporary stage. In other words, since the processing device group is transported one by one in the order of the process, and the multi-process processing is performed, the product production time (TAT) is remarkably shortened, and the production is made in the manufacturing line (not The number of slippage substrates of the finished product is also reduced, so that the delivery time is shortened, and it is possible to correspond to a short delivery time or a very short delivery time. [Embodiment] Hereinafter, the present invention will be described in more detail by way of a preferred embodiment of the invention. [Embodiment 1] First, a substrate loading/unloading device of the present invention will be described based on the first to third embodiments. 1 is an overall perspective view of a substrate loading/unloading device A1 according to a first embodiment of the present invention, FIG. 2 is a perspective view of a substrate sheet 1C, and FIG. 3 is a substrate loading/unloading device 1A of the first embodiment. Front view '第-19- (17) 1253433 4 is a plan view of a state in which the substrate lifting arms 1 of the pair of substrate lifting elements 1 U 1 have entered the substrate sheet 匣 1 C. FIG. 5 is a substrate pulling The plan view of the device 1 B is shown in Fig. 6, which is the same side cross-sectional view.

如第]圖及第3圖所示’第1實施例的基板搬入搬出 裝置1A1，是由：基板片匣1C、及與該基板片匣1C的基 板1 G的特定的側面（搬入搬出開口 1 K )相鄰接的一對的 側面1 F a、1 F b相面對配置的各基板昇降元件1 U 1所構成 。在各基板昇降元件1 U 1中，分別安裝供給壓力空氣用 的壓力空氣源IV。而且，如第4圖所示，基板拉出裝置 1 B，是配設成與前述基板片匣1 C的各基板1 G的搬入搬 出開口 1 K相面對。The substrate loading/unloading device 1A1 of the first embodiment shown in FIG. 3 and FIG. 3 is a substrate sheet 1C and a specific side surface of the substrate 1 G of the substrate sheet 1C (loading and unloading opening 1) K) The adjacent side faces 1 F a, 1 F b of the pair are arranged to face each of the substrate lifting elements 1 U 1 disposed. A pressure air source IV for supplying pressurized air is attached to each of the substrate lifting elements 1 U 1 . Further, as shown in Fig. 4, the substrate drawing device 1 B is disposed to face the loading/unloading opening 1 K of each of the substrates 1 G of the substrate sheet 1 C.

首先，說明基板片匣1 C。如第2圖所示，構成此基 板片匣1 C的直方體框狀的片匣本體1，是由樹脂、或者 是金屬及樹脂的複合材所構成。而且，在其左右的側面 1 Fa、1 Fb及裏面，複數條（本實施例的情況，在左右的 側面1 Fa、1 Fb各4條，在裏面有二條）的縱板2是安裝 成隔有預定間隔的同時，在其上下面複數條（本實施例的 情況，3本）的橫板3是安裝成隔有預定間隔。且，片匣 本體1的前方的側面，是爲了搬入搬出基板1 G而開口， 而形成搬入搬出開口 1 K。基板1 G，是藉由基板拉出裝置 1 B，通過前述搬入搬出開口 1 K被搬入搬出至基板片匣 1C。基板1G的搬入搬出方向爲搬出搬入方向1P，與前述 搬入搬出方向1 P垂直的水平方向（基板片匣1 C的寬方 向）爲左右方向1 Q。 -20- (18) (18)1253433 如第2圖所示，安裝於前述基板片匣I C的左右的側 面1 Fa、1 Fb的各縱橫2彼此，是安裝成相面對。而且， 如第3圖所示，在一對的縱板2的同一高度的位置，是沿 著基板片匣1C的寬方向（左右方向1Q)，安裝有供支撐 基板1 G用的各支撐材。本賓施例的基板片匣1 C的情況 ，前述支撐材，是貫通片匣本體1，且，被保持在張力附 與狀態的拉線4。由此，在高度方向的各拉線4彼此之間 ，該拉線4是被作爲棚板，而形成可分別收納基板1 G並 多段支撐用的棚1 R。 接著，說明一對的基板昇降元件1 U 1。如第3圖及第 4圖所示，一對的基板昇降元件1 U 1，是挾持基板片匣1 C ，在相面對於各側面1 F a、1 Fb的形態下，配置成幾乎對 稱。各基板昇降元件1 U 1的結構因爲完全相同，在此， 只有說明從正面看的左側的基板昇降元件1 U 1的結構。 在平面視的方形平板狀的底基5的上面，可動框架6是配 設成可沿著左右方向1Q進退。即，在底基5的上面，一 對的導引軌道7是沿著左右方向1 Q舖設在前方側及深側 的端部。而且，在前述可動框架6的底面部，是安裝有被 裝設於前述一對的導引軌道7的4個的導引體8。且，蝸 軸安裝溝9是沿著左右方向1 Q設置在底基5的一對的導 引軌道7之間，蝸軸]1是配設在該蝸軸安裝溝9。此蝸 軸1 1，是與安裝於可動框架6的底面部的螺帽體（無圖 示）螺合。且，其一端部，是與安裝於托架12的水平移 動馬達1 3連接。作動此水平移動馬達1 3 ,使水平移動馬 -21 - (19) (19)1253433 達1 3的馬達軸朝預定方向旋轉的話，前述可動框架6， 是被一對的導引軌道7導引，並只沿著左右方向1 Q進退 預定量。 前述可動框架6，是具有比底基5稍狹窄的寬的同時 ，其下端部的裏面側是成爲比上端部寬的形態的平板，並 安裝成對於底基5成爲立起狀態。在此可動框架6的前面 部（與基板片匣1 C的側面1 Fa、1 Fb相面對的部分）， 從側面看爲略L字狀的基板昇降臂1 4，是配設成昇降可 能。即，在可動框架6的前面部，與前述底基5同樣，在 其深進行方向（搬入搬出方向1 P )的兩端部，是沿著高 度方向舖設一對的導引軌道1 5。而且，在前述基板昇降 臂1 4的裏面部，是安裝有被裝設於前述一對的導引軌道 15的4個導引體16。進一步，在可動框架6的一對的導 引軌道1 5之間，是沿著高度方向配設蝸軸1 7。此蝸軸1 7 ，是與設置於可動框架6的螺帽體（無圖示）螺合。且， 其一端部，是與設置在供安裝於可動框架6的上端部用的 馬達安裝板1 8的昇降馬達1 9連接。作動此昇降馬達1 9 ’使昇降馬達]9的馬達軸朝預定方向旋轉的話，前述基 板昇降臂14，是被一對的導引軌道15導引，並只沿著高 度方向昇降預定量。 前述基板昇降臂1 4，是平面視爲從基板片匣1 C的各 側面1 F a、1 F b三叉分離，使回避與構成該基板片匣1 C 的各縱板2的干渉而可進入內部，在與前述各縱板2相面 對的部分，分別設有遊隙部1 4a。而且，在基板昇降臂]4 -22 - (20) (20)1253433 的上面，安裝有空氣浮起元件21。當然，基板昇降臂14 及空氣浮起元件2 1的厚度的合計，是比基板片匣1 C的棚 間距1 Η小。此空氣浮起元件2 1，是具有：將從壓力空氣 源1 V供給的壓力空氣，從設置於其上面的多數的空氣噴 出口 2 1 a噴出，並將配置於正上方在基板丨G，從各拉線4 浮起的功能。 上述結果，作動昇降馬達1 9，將基板昇降臂1 4配置 於預定的棚位置（對應於收納有欲搬入搬出的基板1 G的 棚1 R的正下方的棚1 R·的位置），在該狀態下作動水平 移動馬達1 3，藉由將可動框架6沿著左右方向1 Q移動（ 前進），就可讓前述基板昇降臂14，進入前述正下方的 棚1R’。在第2圖，已進入基板片匣1C的正下方的棚1R’ 的狀態的各基板昇降臂1 4是以二點鎖線顯示。 接著，說明基板拉出裝置1B。此基板拉出裝置1B， 是具有：對於基板片匣1 C相對昇降可能，可搬出被收納 於該基板片匣1 c的基板1 G的同時，將該基板1 G搬入基 板片匣1 C的功能。如第5圖及第6圖所示，在被配設成 對於基板片匣1 c相對昇降可能的基板載置台2 2的上面， 是沿著左右方向1 Q，安裝有複數條的導引滾子2 3。這些 的導引滾子23，是供支撐搬入搬出基板1 G用。而且，在 前述基板載置台22的上面，在左右方向1Q的幾乎中央 部，沿著基板I G的搬入搬出方向1 P，舖設有導引軌道 24。在被裝設於此導引軌道24的導引體25，是安裝有平 面視爲略T字狀的基板拉出臂2 6。且’在前述基板載置 -23- (21) (21)1253433 台2 2的左右方向1 Q的幾乎中央部，是沿著基板1 G的搬 入&出方向1P設置蝸軸安裝溝27，禍軸28是配設在該 蝸軸安裝溝2 7。此蝸軸2 8，是與安裝於基板拉出臂2 6的 後端部的螺帽體2 9螺合。 且’其端部，是與安裝於托架3 1的拉出馬達3 2連接 。作動此拉出馬達3 2，使拉出馬達3 2的馬達軸朝預定方 向旋轉的話，前述基板拉出臂26，會被導引軌道24導引 ，並只沿著基板iG的搬入搬出方向1P進退預定量。且 ，在前述基板拉出臂2 6的前端部的上面，是設有供真空 吸著基板1 G的端部的下面用的各吸著襯墊2 6 a。這些的 吸著襯墊26a，是連接真空吸著裝置（無圖示）。 說明本發明的基板搬入搬出裝置1 A 1的作用中，將 被收納基板片匣1 C的棚1 R在特定的基板1 G搬出的情況 。如第3圖所示，各基板昇降元件1 U ]的昇降馬達1 9作 動的話，藉由蝸軸1 7的作用，各基板昇降臂1 4，是藉由 一對的導引軌道15導引昇降。由此，前述基板昇降臂14 ，是配置在與被收納於基板片匣1 C的棚1 R的特定的基 板1 G的正下方的棚1 R’幾乎同樣高度。在此狀態下，如 第4圖所示，各基板昇降元件1 U 1的水平移動馬達1 3作 動的話，藉由蝸軸1 1的作用，使各可動框架6沿著左右 方向1 Q前進。由此，各基板昇降元件1 U 1的基板昇降臂 14，是直接進入基板片匣1C的棚1R的正下方的棚1R’。 在前述基板昇降臂]4，在構成基板片匣1 C的各縱板2及 千渉部分，因爲分別形成遊隙部】4 a，所以該基板昇降臂 -24 - (22) (22)1253433 1 4不會與各縱板2干渉。且，於收納於基板片匣1 C的各 基板1 G，因爲是藉由4條的拉線4被支撐而不會撓曲， 就不會與基板昇降臂]4接觸。 如第7圖所示，從各基板昇降元件1 U1的壓力空氣 源1 v供給的壓力空氣，是從空氣浮起元件2 1的多數的 空氣噴出口 21a噴出。由此，特定的基板1G，.會稍微從 各拉線4浮起。 接著，一邊參照第5圖及第6圖，一邊說明搬出已浮 起的特定的基板1 G的作用（基板拉出裝置1 B的作用） 。基板拉出裝置1B的基板拉出臂26，是預先，藉由使基 板片匣1 C及基板載置台22相對地昇降，並配置於對應特 定的基板1 G的正下方的棚1 R’的高度（第6圖參照）。 作動基板拉出裝置1B的拉出馬達32，使禍軸28朝預定 方向旋轉，使基板拉出臂2 6沿著基板1 G的搬入搬出方 向1P前進。由此，基板拉出臂26的前端部，是通過基板 片匣1 C的搬入搬出開口 1 K，使特定的基板1 G進入收納 棚1 R的正下方的棚1 R ’的前方側的部分，並配置於該基 板1 G的前端部的正下方。在此狀態下，作動真空吸著裝 置的話，基板1 G的前端部的下面，會被真空吸著於基板 拉出臂26的真空吸著襯墊26a。再度，作動基板拉出裝 置1 B的拉出馬達3 2，使拉出馬達3 2的馬達軸朝逆方向 旋轉的話，基板拉出臂2 6會後退。收納於基板片匣1 C的 棚]R的特定的基板1 G，會從拉線4浮起狀態（與拉線4 非接觸的狀態）並直接被拉出，而支撐在被安裝於基板載 -25- (23) 1253433 置台22的各導引滾子23。因此，搬出途中的特定的基板 1 G不會與拉線4磨擦，而使該基板1 G損瘍，就不會產生 異物。 將前述基板1 G，搬入於基板片匣1 C時，是進行與上 述相反的作用。這時，在基板1 G欲搬入的棚1R的正下 方的棚1R'的部分，預先，讓各基板昇降元件1U1的基板 昇降臂1 4進入，從空氣浮起元件2 1的多數的噴出口 2 1 a 噴出壓力空氣。因此，被搬入基板片匣1C的基板1G是 在浮起狀態下進入，就不會與各拉線4磨擦。 各基板昇降元件1 U 1的基板昇降臂1 4的高度位置’ 是藉由作動昇降馬達1 9，就可以自由設定。且，基板片 匣1 C及基板拉出裝置1 B因爲相對地昇降可能，所以基 板拉出裝置1 B的基板拉出臂2 6的高度位置，也可以自由 設定。這是，從被收納於基板片匣1 C的任意的棚1 R搬 出基板1 G、及朝基板片匣1 C的任意的棚1 R搬入基板1 G 的任一皆可能的意思。且，在本實施例的基板搬入搬出裝 置1A 1中，因爲是對於1基的基板片匣1 C，配設一對的 基板搬入搬出裝置1 A ]，各基板昇降臂1 4可以從前述基 板片匣1C的兩側面1 Fa、lFb進入。由此，可以縮短各 基板昇降臂1 4的長度，即使是被安裝成懸臂狀態’撓曲 也小。其結果，可以縮小的基板片匣1 C的棚間距1 Η ’可 以增加1基的基板片匣1 C中的基板1 G的收納枚數。 在上述實施例中，雖藉由壓力空氣使基板1 G浮起的 形態。但是，如第8圖所示，在基板昇降臂1 4的上面’ -26- (24) 1253433 將多數個的支撐滾子3 3可旋轉自如地安裝，並藉由各支 撐滾子3 3將基板1 G抬起的形態也無妨。此情況，使各 基板搬入搬出裝置1 A 1的基板昇降臂1 4，進入基板片匣 1 C的正下方的棚1 R’之後，需要稍微作動昇降馬達1 9， 讓前述基板昇降臂1 4稍微上昇。 構成上述基板搬入搬出裝置1 A 1的基板昇降元件1 U 1 ，是使1條基板昇降臂1 4對於基板片匣1 C昇降可能的形 態。但是，基板昇降臂1 4及基板片匣1 C，是相對地昇降 可能即可。因此，例如，對於可動框架6，前述基板昇降 臂14是固定於高度方向，基板片匣1C是可昇降的形態’ 或者是，兩者同時昇降可能的形態也無妨。 在上述實施例中，昇降基板1 G的手段，只有壓力空 氣。但是，藉由壓力空氣所產生的基板1G的浮起量因爲 微小（0 · 1 m m程度），所以設置供基板1 G浮起用的補助 手段（無圖示），與壓力空氣同時使用也無妨。由此’可 以確實浮起前述基板1 G。此基板浮起補助手段’可考慮 例如：電磁線圈等的電磁力、或由氣壓缸等的空氣壓。 [實施例2] 上述第1實施例的基板搬入搬出裝置】A 1雖是對於1 個的基板片匣1 C配設一對的基板昇降元件1U1的形態， 基板昇降臂1 4雖是分別從該基板片匣1 C的兩側面1 F a、 1 Fb進入的形態。但是’如第9圖所不’由1基的基板片 匣1 C及]基的基板昇降元件1 U2所構成的基板搬入搬出 -27 - (25) 1253433 裝置1 A 2也無妨。在此第2實施例的基板搬入搬出裝置 1 A2中，是有基板昇降元件1 U2只要1基即可的優點。然 而，如第 9圖所示的基板搬入搬出裝置1A2中，基板昇 降元件]U2的基板昇降臂3 4是從基板片匣1 C的一方側 的側面1 Fa進入的一形態。但是，前述基板昇降臂3 4， 是從：基板片匣1 C的其他方側的側面1 Fb、基板片匣！ C 的正面（搬入搬出開口 1 K )、或者是裏面進入的形態也 無妨。 [實施例3] 進一步，如第1 〇圖所示的基板昇降元件1U3，除了 基板片匣1 C的最上段的棚1 R的棚1 R的數在對應各基板 昇降臂3 5，是固定於可動框架6的設置也無妨。在構成 此第3實施例的基板搬入搬出裝置1 A3的一對的基板昇 降元件1U3中，各空氣浮起元件21是安裝在各基板昇降 臂 3 5 ’這些，是分別形成空氣配管路並分別獨立作動。 且’各基板昇降臂3 5，是以懸臂狀態安裝在可動框架6。 而且’藉由無圖示的切換手段，切換空氣配管路，而只有 從對應於特定的基板1 G的空氣浮起元件2 1噴出壓力空 氣。如此的話，多段支撐的各基板1 G之中，只有特定的 基板1 G會浮起，使該基板〗G藉由基板拉出裝置1 B被搬 出。且，搬入基板1 G時，只有從對應於該基板1 G欲搬 入的棚1 R的空氣浮起元件2 1噴出壓力空氣。此實施例的 情況’不需要供相對地昇降基板昇降臂3 5或是基板片匣 >28- (26) (26)1253433 1 C用的昇降手段，而有結構簡單的優點。 在上述各實施例’支撐基板1 G的支撐材，是貫通片 匣本體1，且，安裝成張力附與狀態的各拉線4。由此， 有：各棚1 R的廣度可保持相同，只有縮小的棚間距1Η 即可的優點。但是，拉線4以外的支撐材，例如，由細的 棒材也無纟方。 [實施例4 1 接著，依據第4〜第6實施例說明本發明的基板搬運 方法及其裝置。 第圖，是半導體製造裝置U的整體平面圖，第14 圖是相同的前視圖，第1 5圖是顯示第1群的處理裝置A 〜D的正規搬運路的基板W的流程的平面圖，第1 6圖是 第1洗淨裝置All及CVD裝置B1的平面圖，第17圖是 顯示從主基板片匣1 〇 1搬出基板W的狀態的正面剖面圖 ，第1 8圖是顯示第1群的處理裝置A〜D的支線搬運路 的基板W的流程的平面圖。 首先，說明半導體製造裝置u的整體結構。如第13 圖所示，此半導體製造裝置U，是在基板W成形5層的 半導體元件，由第1層成形過程P1至第5層成形過程P5 爲止的5個過程群構成的各處理裝置A〜D，是考慮無塵 _的設計效率，而分成2個群。即，依過程順序配列的各 處埋裝置A〜D，是對應於無塵室的廣度分成第1及第2 的2個群，進一步，各群的處理裝置A〜D，是配設成相 - 29- (27) (27)1253433 面對的形態且2列分割的狀態。在前述第丨層成形過程 P ]中’依處理過程順序，第]洗淨裝置A ]丨、^ VD裝置 弟2洗淨裝置a 1 2、照像裝置C 1、0虫刻裝置d 1，是 沿者裝置配列方向Q配設在幾乎同樣直線上。同樣地， 1二弟2層成形過程p 2中，依處理過程順序，第1洗淨裝 置A21、第1CVD裝置B21，第2CVD裝置]β22，第2洗 淨裝置A22，照像裝置C2，蝕刻裝置D2是配設。在第3 層成形過程P3中，依處理過程順序、第1洗淨裝置A3 } 、CVD裝置B3、第2洗淨裝置A32、照像裝置C3、蝕刻 裝置D3，是配設成橫跨第1及第2的各群。在第4層成 形過程P4中，依處理過程順序，配設：洗淨裝置A4、 CVD裝置B4、照像裝置C4、蝕刻裝置。在第5層成 形過程P 5中，依處理過程順序，配設：洗淨裝置 A5、 CVD裝鼇B5、照像裝置C5、蝕刻裝置D5。在相面對的 各處理裝置群之間，沿著裝置配列方向Q，設有：二條的 基板交接列L 1、及二條的基板暫置台列L2、及1條的支 線搬運列L3。而且，在各群的末端部，配設有作爲附帶 處理裝置的一例的各檢查裝置M a、M b。 即’，在相面對的各處理裝置A〜D附近，設有各基 板父：r妾列L 1，且設有對應於各處理裝置A〜D的基板交 接衣置E a、£ b。在前述基板交接列L 1的內側，設有各基 板暫置台列L2，在各處理裝置A〜D彼此之間，在固定 狀怒、下分別設置主基板片匣1 01 (第]暫置台）。此主基 板片11 1 〇丨，是爲了將處理途中的基板w交接至接著的過 -30- (28) (28)1253433 程的處理裝置A〜D，姑且收納該基板W來暫置用。因此 ’可多段收納多數枚的基板W，且，藉由先進先出方式（ 後述），可搬入搬出任意的基板W。在此，「處理途中」 是指，是已結束全過程之中特定的過程爲止的處理，而剩 下的過程的處理未進行的狀態。 且，藉由前述各基板暫置台列L2，在與特定的處理 裝置A〜D對應的部分，爲了進行處理途中的基板W的抽 取檢查，而載置：供收納該基板W用的檢查用基板片匣 102 (第2暫置台）。此檢查用基板片匣1〇2，是藉由設 置於支線搬運列L3的支線搬運車103，搬運至第1及第2 各群的檢查裝置Ma、Mb (後述）。進一步，在前述基板 暫置台列L2的始端部及末端部中，是載置：從前過程搬 運的基板W、及供收納朝接著過程搬運的基板W用的搬 運用基板片匣104。然而，在第13圖，是在各主基板片 匣1 0 1中施加斜線，在各檢查用基板片匣1 02中施加對角 線，且，在各搬運用基板片匣1 04中施加與前述主基板片 匣1 0 1相反方向的斜線，來加以區別。 而且，在相面對配置的二條的基板暫置台列L2之間 ，設有支線搬運列L 3，自走可能的支線搬運車1 〇 3是沿 著裝置配列方向Q配設。裝設於上述二條的基板交接列 L1的各基板交接裝置Ea、Eb，藉由設置於各基板暫置台 列L 2的各基板片匣1 〇 1、1 〇 2、1 04、及配設於支線搬運 列L 3的支線搬運車1 0 3，形成基板搬運裝置S。然而，在 第]3圖，M a是第1群的基板W的檢查裝置，M b是第2 -31 - (29) (29)1253433 群的基板W的撿查裝置。且，μ c是最終過程（第5層成 形過程P 5 )結束後的基板W的檢查裝置。在此，對應於 檢查裝置Ma、Mb設置的複數個檢查用基板片匣1〇2，是 搬運從各處理裝置A〜D的途中過程被抽取的基板W，並 交接至檢查裝置Ma、Mb的狀態。 且’如第13圖及第14圖所示，第1群的各處理裝置 A〜D、及第2群的各處理裝置A〜D，是藉由平面視分別 沿著與處理裝置A〜D的裝置配列方向Q垂直的方向設置 的軌道搬運車105連接。此軌道搬運車1〇5，是具有：在 各基板暫置台列L2的始端部或是末端部之間，進行搬運 用基板片匣1 04的交接功能。藉由第1群的處理裝置a〜 D施加了預定處理的基板W，是在被收納於搬運用基板片 ® 1 〇4的狀態下交接至軌道搬運車1 〇5。而且，被搬運至 第2群的處理裝置A〜D，並被載置於基板暫置台列L2 的始端部。 本實施例的半導體製造裝置U，是使基板W在製造 線中]枚1枚地搬運處理的形態（單片處理）（對於此， 習知的海灣（BAY )方式，是將多數枚的基板W整批處 理的形態（分批處理））。即，如第1 5圖所示，1枚的 基板W，是藉由基板搬違裝置s，搬運於各處理裝置a〜 D之間。藉由特定的處理裝置a〜D被施加處理的基板W ，是藉由對應於該處理裝置A〜D配設的基板交接裝置E a 、E b從該處理裝置A〜D被搬出，被收納於主基板片匣 ]0 ]，並一時地暫置。暫置於前述主基板片匣1 〇 1的基板 -32- (30) 1253433 w，是藉由對應於接著的過程的處理裝置A〜D配設的基 板交接裝置Ea、Eb，搬運至該處理裝置A〜D。是藉由返 覆此作用，對於前述基板W施加預定的處理。第1 5圖的 各箭頭，是顯示施加於1枚的基板W的處理的流程（動 線）。然而，在本實施例，上述基板W的搬運路徑稱爲 「正規搬運路」。 詳細說明上述基板搬運裝置S的正規搬運路。在此， 第1〜第5的各層成形過程P1〜P5的各處理裝置A〜D 間的基板搬運裝置S的作用（各處理裝置A〜D及基板交 接裝置Ea、Eb之間的基板W的交接作用），因爲對於任 一的過程皆幾乎同樣，所以在本實施例，說明第1層成形 過程P 1的基板W的交接作用。如第1 6圖所示，在本實 施例的基板搬運裝置S的基板交接列l 1，是對應於各處 理裝置A〜D，配設2種類的基板交接裝置e a、E b之中 的任一。在此，對於各處理裝置A〜D，是否使用任一的 基板交接裝置Ea、Eb，是藉由該處理裝置a〜D決定。 即5如洗淨裝置A或照像裝置c，基板W是在通常的環 境下處理的情況時是使用基板交接裝置E a，如c V D裝置 B或触刻裝置ϋ，基板w是在真空的環境下處理的情況時 ，在處理中因爲需要關閉那些的搬入搬出開口，所以使用 基板交接裝置Eb。因此，在第1層成形過程p 1，基板交 接裝置Ea，是對應於第丨及第2各洗淨裝置A11、A12及 照像裝置c】設置，相同的基板交接裝置E b，是對應於 C V D裝置B 1及蝕刻裝置d 1設置（第1 5圖參照）。 -33- (31) (31)1253433 如第14圖及第16圖所示，各基板交接裝置Ea、Eb ，是被舖設於地面的一對的導引軌道Π 1導引，沿著裝置 配列方向 Q自走可能。且，那些的底基l〇6a、106b，是 在水平面內旋轉可能的同時，可昇降自如。而且，在構成 前述基板交接裝置Ea的底基106a，是設有：吸著基板W 並搬入搬出用的真空吸著裝置107、及供支撐被搬入搬出 的基板W用的複數條的支撐滾子1 〇 8。前述真空吸著裝置 1 〇 7，是例如，藉由驅動旋轉蝸軸而進退。且，在構成基 板父接裝置Eb的底基106b，是抬起基板W並搬入搬出 用的支撐臂109，是成對設置。 如第1 5圖及第1 6圖所示，對應於第1洗淨裝置A1 1 設置的基板交接裝置Ea，是具有：搬出（拉出）被收納 於搬運用基板片匣1 04的基板W，並搬入至第1洗淨裝置 A ]1的同時，將已結束洗淨處理的基板W，從第1洗淨裝 置 A1 1搬出，並可收納在設置於第1洗淨裝置 A 1 1及 CVD裝置B 1之間的主基板片匣1 0 1的功能。而且，對應 於CVD裝置B1配設的基板交接裝置Eb，是具有：搬出 被收納於前述主基板片匣1 0 ]的基板W，並搬入C V D裝 置B 1的同時，將已結束了在前述CVD裝置B 1的處理的 基板w，從該C V D裝置B 1搬出，並可收納在設置於 CVD裝置B1及第2洗淨裝置A12之間的主基板片匣1〇1 的功能。因此，基板交接裝置Ea及基板交接裝置Eb的各 行走範圍Ra、Rb，是在主基板片匣101的部分有重複。 如此，被收納於主基板片匣]0 1的基板W，是藉由任 -34 - (32) (32)1253433 一的基板交接裝置Ea、Eb被搬出，並被搬入至各處理裝 置 A〜D。且，將已結束了各處理裝置A〜D的處理的基 板W，是藉由任一的基板交接裝置Ea、Eb被搬出，並被 收納於後續過程側的主基板片匣1 01。以下，藉由返覆上 述的過程，對於基板W施加各處理裝置A〜D的處理。因 此，被收納於前述主基板片匣1 0 1的基板W的枚數，通 常的情況（換言之，各處理裝置A〜D作動順利的情況時 )是1枚。 說明主基板片匣1 0 1。如第 1 7圖所示，本實施例的 主基板片匣101是直方體框狀，爲了搬入搬出基板W，而 使與基板交接裝置Ea、Eb相面對的面開口。而且，沿著 其寬方向（裝置配列方向Q )，複數條的拉線1 1 2是被安 裝成張力附與狀態。這些的拉線1 1 2，是在高度方向安裝 成隔有預定間隔，在各段形成以前述拉線1 1 2作爲棚板的 基板收納棚1 1 3。由此，在1個的主基板片匣1 〇 1內，可 以多段收納複數枚的基板W。且，此主基板片匣1 〇 !，是 先進先出方式（F i r s t - i n F i r s t - Ο u t )。即，藉由讓從側方 昇降的臂1】4，出入於主基板片匣1 0丨內，就可將基板w 收納至任意的段的基板收納棚1 1 3，並從各拉線1 1 2稍微 脫離。因此，任意的基板W的搬入搬出是可能的。此結 果，即使因任何的原因（各處理裝置A〜D的故障等）， 而在前述主基板片匣1 01內收納2枚以上的基板W，可將 先處理結束的基板W先取出，就可以防止··處理途中的 基板W因長時間放置所導致的製品品質的下降等。如此 -35- (33) (33)1253433 ，本發明的主基板片匣1 0 1 ’不只具有：將被交接的基板 W —時地暫置的功能，且各處理裝置A〜D故障的情況等 ，也可讓滯溜於上流側的過程的基板W，從製造線的流程 脫離，並一時地收納的功能’即，也具有製造線的緩衝功 能。 對於此，檢查用基板片匣1 0 2及搬運的用基板片匣 1 〇 4，是順序存取方式的例。如第1 4圖所示，與上述主基 板片匣1 〇 1同樣，藉由各拉線1 1 2，多段設置基板收納棚 1 1 3的同時，在各基板片匣102、104的正下方，設有昇 降可能的附滾子框架1 1 5。搬入搬出被收納於這些的基板 片匣1 0 2、1 0 4的基板W的情況時，藉由上昇前述附滾子 框架1 1 5，就可使被收納於最下段的基板收納棚1 1 3的基 板W從拉線1 1 2脫離。在此狀態下，藉由構成基板交接 裝置Ea、Eb的真空吸著裝置1 07或是支撐臂109，搬入 搬出前述基板W。此結構的基板片匣1 〇 2、1 0 4的情況， 是具有上昇基板W的手段（附滾子框架1 1 5 )的結構簡單 的優點。且，此檢查用基板片匣1 〇 2，是與主基板片匣 1 〇 1相同方式（先進先出方式）的基板片匣也可以，這種 情況，在基板W的檢查過程的隨機存取也可能。 接著，說明基板搬運裝置S的支線搬運路。在半導體 製造裝置U中，爲了進行基板W的抽取檢查’會有從預 定的過程處理的途中抽取基板W的情況。前述支線搬運 路，是將被抽取的基板W，搬運至各群的檢查裝置Ma、 Mb。例如，在本實施例的第]層成形過程P ]中，如第]8 -36- (34 (341253433 圖所示，對應於第1層成形過程p】的照像裝置C ]及蝕 刻裝置D ]及基板暫置台列L2的部分，分別設有供收納 被抽取的基板W用的檢查用基板片匣1 0 2。這是，在本實 施例的第1層成形過程P 1中，對於已結束了照像裝置C 1 的處理的基板W，或者是，對於已結束了蝕刻裝置D 1的 處理的基板W，進行抽取檢查。 如第1 4圖所示，在構成支線搬運路的支線搬運列L3 5是沿著裝置配列方向Q舖設一對的導引軌道1 1 6，在該 導引軌道1 1 6配設有支線搬運車1 〇 3。此支線搬運車1 03 ’是被前述導引軌道Π6導引而自走可能。且，在此支線 搬運車103中，具有：設有片匣交接裝置1 17，可將承接 了收納有被抽取的基板W檢查用基板片匣1 〇 2，並交接至 檢查裝置M a、M b的功能、及進行與其相反作用的功能。 第1 8圖的各箭頭，是顯示被抽取的基板W的處理的 流程（動線）。如第1 8圖所示，被抽取檢查的基板w , 是藉由任一的基板交接裝置Ea、Eb，被收納於檢查用基 板片匣1 0 2。收納有該基板W的檢查用基板片匣1 〇 2，是 直接交接至支線搬運車1 〇 3。而且，藉由前述支線搬運車 1 〇3，搬運至基板暫置台列L2的檢查裝置Ma的接近位置 爲止，並載置於基板暫置台列L 2的前述接近位置的部分 。此基板W，是藉由對應於檢查裝置Ma配設的基板交接 裝置Ea，搬入至檢查裝置Ma。已結束了前述檢查裝置 M a的檢查的基板W，是被收納於檢查用基板片匣1 〇 2 , 再度藉由支線搬運車]03，搬運至被抽取的過程的接著的 -37 - (35) (35)1253433 過程的位置爲止，被載置至基板暫置台列L 2。 接著’說明基板搬運裝置S的作用。在此，只有說明 從第1洗淨裝置Al 1至cvd裝置B 1之間的基板W的交 接作用。如第】9圖所示，對應於第I洗淨裝置a ；[ 1配設 的基板交接裝置Ea被移動，而相面對配置於搬運用基板 片匣1 〇 4。被收納於前述搬運用基板片匣丨〇 4的基板W， 是藉由設置於基板交接裝置Ea的真空吸著裝置107，從 搬運用基板片匣104搬出，並被載置於基板交接裝置Ea 的底基106a。而且，前述底基106a，是在水平面內旋轉 1 8 0 °。在此狀態下，基板交接裝置Ea會朝下流側（後續 過程側）移動，並與第1洗淨裝置A1 1的搬入開口 118 相面對配置。基板W，是藉由設置於基板交接裝置Ea的 真空吸著裝置1 0 7的作用，通過第丨洗淨裝置a 1 1的搬 入開口 1 1 8被搬入至該裝置 a 1 1內，進行洗淨處理後， 從搬出開口 1 1 9被搬出。 如萊；2 0 Η所不，基板W的洗淨處理進彳了其間，基板 交接裝置E a ’是沿著裝置配列方向q朝後續過程側移動 ’並與第1洗淨裝置A1 1的搬出開口 1 1 9相面對配置。 藉由與上述幾乎的同樣的作用，從第1洗淨裝置A 1 1搬 出的基板W，是再度被交接至基板交接裝置Ea，就這樣 地，移動至與主基板片匣I 〇丨相面對的位置爲止。而且， 前述基板W，是被收納於主基板片匣1 〇 1。前述基板交接 裝置Ea，是移動至與搬運用基板片匣丨04相面對的位置 ’並返覆上述作用。 -38- (36) (36)1253433 而且，如第2 1圖所示，基板W是被收納於主基板片 匣1 0 1，基板交接裝置Ea退避的話，對應於C VD裝置B 1 配設的基板交接裝置Eb會被移動，而與前述主基板片匣 1 0 1相面對配置。 藉由設置於基板交接裝置Eb的支撐臂1 〇 9的作用， 使基板W從主基板片匣1 Q〗搬出。此基板W，是保持被 載置於前述基板交接裝置Eb的狀態，被移動至後續過程 側，進一步在水平面內只旋轉預定角度，與CVD裝置B 1 的搬入開口丨21相面對配置。而且，被搬入至CVD裝置 B 1內。 已結束了前述CVD裝置B1的處理的基板W，是藉由 基板交接裝置Eb，被收納於接著的過程的主基板片匣1 〇 1 。之後，對於第2洗淨裝置a 1 2、照像裝置C 1、蝕刻裝 置D1，是進彳了幾乎同樣的作用。而且，如第15圖所示， 第1群的處理裝置A〜D之中，從被配設於最下流的部分 的CVD裝置B3搬出的基板W，是藉由基板交接裝置Eb 被收納於搬運用基板片匣1 04，藉由支線搬運車，姑且被 載置至基板暫置台列L2的接近軌道搬運車1 0 5的位置後 ，藉由前述軌道搬運車1〇5，搬運至第2群的處理裝置A 〜D。進一步，在第 2群的處理裝置 A〜D，進行幾乎同 樣的作用。 接著，將上述正規搬運路的基板W的處理時間，與 習知的海灣（BAY )方式相比較來加以說明。第22圖， 是意示地顯示處理途中的基板w爲藉由單片處理、及分 -39- (37) (37)1253433 批處理的正常處理的情況時的基板w的流程的時間圖表 。然而，在第22圖至第24圖中，因爲是爲了容易理解而 意示的基板W的正常流動的時間圖表，所以未對應前述 實施例的處理過程，有減少過程數量。以下，顯示1枚的 基板W時，是添加符號「1」〜「^」。然而，各處理裝 置的處理時間（節拍時間），是設定成幾乎同樣。 军寸於本發明的早片處理，各基板（W]〜Wn)，是以 設定節拍時間（T 1 )投入過程（I )的處理裝置被處理後 ，通過主基板片匣101 (第1暫置台）投入過程（II)的 處理裝置被處理。進一步，從過程（II )的處理裝置被取 出的基板W，是通過別的主基板片匣1 0 1投入過程（111 )的處理裝置被處理。如此，不需爲了檢查在處理途中的 基板 W而進行抽取，或者是特定的處理裝置的故障未發 生的正常的處理的情況中，各基板（w 1〜Wn )，是只有 姑且暫置在各主基板片匣1 〇 1，不會一直被收納於前述主 基板片匣1 〇 1，而依序朝下流的過程搬運，在各過程，以 幾乎同樣的設定節拍時間（T 1 )被處理。 具體說明以上的情況。本發明的情況，如第2 2圖所 示，第1枚的基板W1被投入過程（I )的話，藉由該過 程（I )的處理裝置，對於基板W 1施加預定的處理。此 處理是結束的話，該基板W 1，會通過主基板片厘101 ( 第1暫置台），投入過程（11 )的處理裝置。隨此，第2 枚的基板W 2被投入過程（I )的處理裝置。 如此，在本發明中，基板W 1〜W3，是]枚1枚地分 -40- (38) (38)1253433 別投入各過程（i) 、 （ π) 、 （ m)被處理（單片處理 )。對於此，在習知的海灣（B A Y )方式中，多數枚的基 板W，因爲在各過程是整批地被處理，所以各過程的處理 時間會變長。但是，本發明的情況，與海灣（B A Y )方式 的情況的T A T ( T 1 2 )相比較，各基板W 1〜W 3的T A T ( T2 )，會非常短。且，與海灣（BAY )方式的節拍時間 T 1 1相比較，本發明的各基板w 1〜W 3的節拍時間T 1也 矢百 〇 且’如第23圖所示的圖表，是顯示本發明的單片處 理及分批處理的對於時間的基板 W的處理枚數的關係。 在此圖中’實線1 2 2，是顯示本發明的單片處理的情況， 二點鎖線1 23，是顯示習知的海灣（bay )方式的情況。 但是’本圖’從將基板w投入製造線直到完成品取出爲 止所需要的每1枚基板W的總處理時間，若假定單片處 理及分批處理爲相同一的情況。在習知的海灣（B A Y )方 式中，因爲整批處理例如2 0枚的基板W，若不經過T AT (T 1 2 )的話，無法獲得完成品的基板w。但是，本發明 的情況，因爲是1枚1枚地處理的形態，只要經過1枚分 的T A T ( T 2 )的話，就可生産1枚的基板w。 上述結果，在製造線內成爲製作品（未完成品）滯溜 的基板W (製作在庫）的數量也會減少，少量運轉資金即 可，因爲對於投下資本的回收短時間即可所以具有資本周 轉率佳等的經理上的優點。且，藉由製作在庫的減少，製 造線內的基板W的保管空間因爲少量即可，所以具有無 -41 - (39) (39)1253433 塵室的建設費便宜的優點。特別是，在最近，基板W的 尺寸變大，每1枚基板W的單價也變高，上述T A T的短 縮或製作在庫的減少，可產生大的利益。進一步，交貨期 縮短’就可對應短交貨期，或者是極短交貨期。 接著，說明處理途中的基板W被抽取的情況。第24 圖’是爲了容易理解供抽取處理途中的基板W用的檢查 情況的基板W的流程用的意示性的時間圖表。各過程（I )、(Π ) 、 （ III )的設定節拍時間皆是T1，從投入開 始第4枚的基板W4結束過程（I )後就被抽取，經過檢 查時間T3後，在基板W ( n-m-4 )的下一個插隊投入過程 (11 )的例子。如此，基板W ( η - 4 )投入過程（11 )的話 ’對於之後的複數枚（圖示例中是2枚）的基板W ( n-m-3 )、问 w ( η - m - 2 )的過程（I )的投入間隔也就是節拍 時間（T1 + α )，是比前述設定節拍時間Τ1大，隨後的 基板 W ( n - m - 1 )、同 W ( η - m )，是以原來的節拍時間 T 1投入過程（I )的處理裝置，之後，對於全過程以設定 節拍時間T 1將基板W平順地處理。如此，抽取檢查結束 的基板W 4從過程（11 )***隨後的數枚的基板的過程（I )的投入間隔（節拍時間）是比設定節拍時間T1長的話 ’之後，對於全過程就可用通常的節拍時間進行處理。 一方面，結束過程（I )的處理後，抽取基板w 4的 話，基板因爲不會投入負責之後的過程（11 ) 、 （ 111 )的 處理裝置，過程（11 ) 、 （ 111 )的基板的排出間隔（節拍 時間）會成爲通常的2倍，使生産能率下降。在此，本發 一 42- (40) (40)1253433 明，在過程（II )的配置於處理裝置附近的主基板片匣 101 (第1暫置台）或是檢查用基板片匣102 (第2暫置 台）’結束過程（Ϊ )後，將未流動於製造線的基板被一 時地收納的情況（那種情況需一時地收納是如後述）時， 將此基板 w ( n-m+1 )投入過程（π )的處理裝置的話， 即使爲了抽取檢查而從正規搬運路抽取基板W4，隨後的 後續過程的節拍時間會成爲設定節拍時間T 1，而使生産 能率下降。 接著說明特定的處理裝置故障的情況。第2 5圖，是 爲了容易理解特定的處理裝置一時地故障的情況的基板W 的流程用的意示性的時間圖表。在過程（II )結束基板 W3的處理後，過程（II )的處理裝置故障的情況時，即 使故障後，數枚（4枚）的基板W4〜W 7，是以設定節拍 時間T1進行過程（I )的處理，接下來的數枚（3枚）的 基板 W 8〜W 1 0，是爲了因過程（II )的處理裝置的停止 所產生的處理調整而以比設定節拍時間T 1長的節拍時間 (T 1 +々）進行處理。這些複數枚的基板W4〜W 1 0，即使 後續的基板（例如，對於基板W 4是基板W 5 )已結束了 過程（I )的處理後，因無法投入過程（II )，所以依序 被搬入並收納於過程（I )及過程（11 )之間的主基板片 匣 1 0 1。 第3枚的基板W 3從過程（11 )的處理結束直到經過 停止時間T4後，使過程（Π )的處理裝置再開的話，被 收納於主基板片匣]0 1的複數枚的基板W4〜W 1 0，是先 (41) (41)1253433 從被搬入的基板依序搬出，以設定節拍時間T 1投入過程 (11 )的處理裝置。而且，以最終比設定節拍時間 T 1大 的節拍時間（T1 +冷），使包含被投入過程（I )的基板 W 1 1的接著的基板\¥12的之後的基板，是依序以設定的 節拍時間T 1投入過程（I )，在全過程平順地連續處理。 在本實施例的基板搬運裝置S中，支線搬運列L3， 是對應分割配置於兩側的各處理裝置A〜D群的雙方。因 此，可以縮短支線搬運車1 03的行走距離，並可以短縮支 線搬運車1 〇 3的基板W的搬運時間。 在上述實施例的基板搬運裝置S中，主基板片匣101 ，是設成固定於基板暫置台列L2的狀態。因此，在本實 施例中，主基板片匣1 0 1之外，另設置檢查用基板片匣 1 02，將被抽取的基板W收納至前述檢查用片匣1 02，藉 由支線搬運車1 0 3，將檢查該檢查用基板片匣1 0 2本身搬 運至裝置Ma、Mb爲止。此結果，前述檢查用基板片匣 1 02的基板W的搬入口或是搬出口只要1處即可，而具有 結構簡單的優點。 在本實施例的基板搬運裝置S中，將供檢查而被抽取 的基板W，不是收納於檢查用基板片匣1 02，而是主基板 片匣1 〇 1，並該基板W交接至支線搬運車1 0 3是困難的。 但是，例如，前述主基板片匣1 〇 1，是設置於水平面內且 旋轉可能的情況時，將被檢查的基板W從前述基板片匣 1 0 1，交接至支線搬運車1 0 3也可以。由此，具有不需要 檢查用基板片匣1 02，基板搬運裝置S的結構簡單的優點 -44- (42) (42)1253433 且，在本實施例中，抽取基板w ’是在被收納於檢查 用基板片匣102的狀態下，連同該檢查用基板片匣102 — 起交接至支線搬運車1 03的形態。但是，不被收納被於檢 查用基板片匣1 02，而以基板W單體交接至支線搬運車 1 〇 3的形態也無妨。由此，具有不需要檢查用基板片匣 102的優點。 在本實施例的基板搬運裝置s中’藉由任一的基板交 接裝置Ea、Eb，透過主基板片匣101 (第1暫置台）進行 基板W的交接的形態。但是，基板交接裝置e a、E b，是 直接交接基板W的形態也無妨。此情況，基板w的交接 所需要的時間可大幅短縮，可更縮短TAT。 在本實施例中，對於處理途中的基板 W所進行的附 帶處理，是說明抽取檢查的情況。但是，附帶處理，是抽 取檢查以外的處理也無妨。也有例如，當處理圖案非如設 計的情況等，支線搬運至供補修問題部分用的補修裝置的 例等。 在本實施例的第1及第2各群的二條的基板暫置台列 L 2，將安裝有主基板片匣1 〇 1的部分以外的空間，可以使 用作爲貯藏供收納處理途中的基板W的基板片匣用的保 管空間。由此，特定的處理裝置A〜D故障，或製造線整 體的維修時，可將更多的基板W，一時地從製造線取下收 納。即，具有可增大由基板暫置台列L 2所產生的「製造 線的緩衝功能」的效果。 -45 - (43) (43)1253433 [實施例5] 接著，說明第5實施例。然而，在本實施例，對於與 上述第4實施例的構成要素共通的構成要素，是附加同一 符號。 第28圖是第1實施例的半導體製造裝置ui的整體 平面圖，第29圖是托盤P的立體圖，第30圖是在對於洗 淨裝置A的基板搬出位置Ra配置托盤p的狀態的平面圖 ’第31圖是基板交接裝置Ga的擴大平面圖，第32圖是 周轉輸送帶裝置K的側面剖面圖，第3 3圖是相同的正面 剖面圖。 首先’說明半導體製造裝置U1的整體結構。如第2 8 圖所不’此半導體製造裝置U1，是由：在平面視角落部 是依基板w的處理過程的順序配設於成爲緩和的圓弧形 狀的周轉輸送帶裝置K的周圍的各處理裝置（洗淨裝置A 、（:VD裝置B、照像裝置C、蝕刻裝置〇、檢查裝置E ) 、及由供保管處理前後的基板W用的基板保管庫F所構 成。而且，在周轉輸送帶裝置K及各處理裝置A〜E及基 板保管庫F之間，是配設有在兩者之間進行基板w的交 接用的基板交接裝置Ga、Gb。且，在周轉輸送帶裝置K 的內側對應各處理裝置A〜E的位置，配設有基板W的一 時保管裝置L。藉由上述的周轉輸送帶裝置κ及各基板交 接裝置Ga、Gb，構成基板搬運裝置s。 在本實施例的基板搬運裝置S中，基板W，是藉由周 -46- (44) (44)1253433 轉輸送帶裝置K，1枚1枚地收納於托盤P的狀態下被搬 運。此托盤P，是藉由周轉輸送帶裝置K的作用被搬運（ 前進）的同時，停止在對應的各處理裝置A〜E的位置。 而且，藉由對應那些配設的基板交接裝置G a、G b，從托 盤P搬出基板W，並搬入至各處理裝置A〜E。在各處理 裝置A〜E的已結束處理的基板W，再度，藉由基板交接 裝置Ga、Gb從各處理裝置A〜E搬出，搬入至待機於周 轉輸送帶裝置K上的空的托盤P (未收納基板W的托盤P )，搬運至下流側。之後，從托盤P搬出基板W的位置 標示爲「基板搬出位置R a」，朝空的托盤P搬入基板W 的位置標示爲「基板搬入位置Rb」。在各處理裝置A〜E ，藉由依序進行上述過程，對於前述基板 W施加預定的 處理後，收納於基板保管庫F。在第2 8圖，基板W的處 理的流程（動線）如箭頭所示。 首先，說明托盤P。如第2 9圖所示，本實施例的托 盤P，是藉由樹脂或是樹脂及金屬的複合材構成。構成此 托盤P的托盤本體2 0 1，是只可收納〗枚基板W的直方體 框狀，爲了搬入搬出前述基板 W而在一側面（與基板交 接裝置G a、G b相對的面）開口，並形成搬入搬出開口 2 〇 1 a。在前述托盤本體2 0 1的兩側及上下的各面中，由縱 板202及橫板203所構成的3條補強板，是隔有預定間隔 地周設。同樣地，在托盤本體2 0 1的上下的各面及裏面的 幾乎中央部，設有：由縱板2 0 4及橫板2 0 5所構成，與前 述各補強板垂直的別的補強板。而且，在設置於兩側面的 -47 - (45) (45)1253433 各縱板2 Ο 2彼此的同一高度位置，各支撐拉線2 0 6是被安 裝成張力附與狀態。被搬入托盤Ρ的基板w，是藉由各支 撐拉線2 0 6支撐。然而，第2 9圖的箭頭，是顯示基板W 的搬入搬出方向Q。 對於周轉輸送帶裝置K說明。如第3 0圖所示，本實 施例的周轉輸送帶裝置K，是動力式的滾子輸送帶。即， 在內外的各裝置框2 0 7、2 0 8之間，以預定間隔平行並列 的多數條的基板搬運滾子2 0 9，是安裝成可旋轉自如。前 述內外的各裝置框2 0 7、2 0 8的間隔，是比托盤P的深度 方向（長度方向）的長度稍寬，各托盤P，是將其搬入搬 出開口 2 Ο 1 a，配置成與外側（外周側）的裝置框2 0 8相 面對的狀態。各基板搬運滾子2 0 9的一端部’是從內側（ 內周側）的裝置框2 0 7突出，且分別裝設有鎖齒輪2 1 1。 在各鎖齒輪2 1 1中，卡止有鎖2 1 2。因此，作動驅動馬達 Μ來驅動旋轉鎖齒輪2 1 1的話，藉由鎖2 1 2使全部的鎖齒 輪2 1 1被驅動旋轉。此結果，各基板搬運滾子2 0 9會朝同 一方向旋轉，使被載置於其上的托盤Ρ被搬運（前進）。 在前述外側的裝置框20 8，對應於基板搬出位置Ra及基 板搬入位置Rb的部分，是爲了搬入搬出基板W而各別被 切除，並形成各切口部2 0 8 a、2 0 8 b。 接著，說明基板昇降裝置Η。然而，以下說明的基板 昇降裝置Η及托盤停止裝置J，是對應於各處理裝置Α〜 E配設，且’那些的結構因爲完全相同，在此，只有說明 配設在供洗淨裝置A用的基板搬出位置Ra的基板昇降裝 -48- (46) (46)1253433 置Η及托盤停止裝置J。此基板昇降裝置Η，是如第3 ! 圖至第3 3圖所示，搬出被收納於托盤ρ的基板w時，或 者是，將基板W搬入空的托盤p時，可將該基板w從支 撐拉線2 06抬起的狀態下搬入搬出，且配設在周轉輸送帶 裝置K的基板搬出位置Ra及基板搬入位置Rb的正下方 。而且，可進入各基板搬運滾子2 0 9彼此的間隙的4條的 基板昇降臂2 1 3，是被安裝成可昇降。在各基板昇降臂 213的上面，安裝有：可支撐基板W的同時，當搬入搬出 該基板W時供導引用的支撐滾子214。各支撐滾子214, 是沿著與基板W的搬入搬出方向Q (第3 1圖參照）垂直 的水平方向設置的支點軸爲中心可旋轉自如。 收納有基板W的托盤P是配置於基板搬出位置Ra時 ’各基板昇降臂213會上昇。而且，從各基板搬運滚子 2 〇 9彼此的間隙突出，從托盤本體2 0 1的底面部進入托盤 P內，抬起被各支撐拉線2 0 6支撐的基板W。由此，被收 納於托盤P的基板W，會從各支撐拉線2 0 6脫離，而可藉 由基板交接裝置Ga、Gb被搬出。且，空的托盤P是配置 於基板搬入位置R b時，各基板昇降臂2 1 3也會上昇。因 此3藉由基板交接裝置Ga、Gb搬入的基板W，會被支撐 於基板昇降裝置Η的各支撐滾子214，就不會與托盤P的 各支撐拉線2 0 6干渉。而且，前述基板w的整體被搬入 托盤Ρ內的話，各基板昇降臂2 1 3會下降。由此，基板W 是被各支撐拉線2 0 6支撐。 接著’ δ兌明托盤停止裝置《]。如第3 3圖所不，在刖 -49 ► (47) (47)1253433 述基板昇降裝置Η的正下方流側，配設有：藉由周轉輸 送帶裝置Κ將被搬運的托盤Ρ停止於基板搬出位置Ra用 的托盤停止裝置此托盤停止裝置]，是使被安裝成昇 降可能的停止器托板2 1 5，藉由從基板搬運滾子2 〇 9彼此 的間隙突出，停止被搬運的托盤P。此托盤停止裝置j， 是藉由安裝於周轉輸送帶裝置K的內外的各裝置框207、 208的預定位置的接近開關（無圖示）而作動^由此，托 盤P，是在定位狀態下配置於周轉輸送帶裝置κ的基板搬 出位置Ra。 接著，說明基板交接裝置Ga、Gb。如第28圖所示， 在各處理裝置A〜E及周轉輸送帶裝置κ之間，分別配設 有基板交接裝置Ga、Gb。此基板交接裝置Ga、Gb，是藉 由周轉輸送帶裝置K使被搬運的托盤P內的基板W交接 至各處理裝置A〜E，各處理裝置A〜E被處理的基板W 是藉由則述基板父接裝置G a、G b交接至周轉輸送帶裝置 K並搬運至後續過程的處理裝置A〜E。 在本實施例的半導體製造裝置U 1中，是配設有：對 應成各處理裝置A〜E的2種類的基板交接裝置Ga、Gb 之中的任一。在此，對於各處理裝置A〜E使用任一的基 板交接裝置Ga、Gb，是藉由該處理裝置A〜E的結構來 決定。即，如洗淨裝置A、照像裝置C及檢查裝置E，基 板W是在通常的環境下被處理的情況時，是使用：真空 吸著裝置2 ] 6 a是設置於拉出臂2 1 6的前端部的基板交接 裝置Ga，如CVD裝置B或蝕刻裝置D，基板W是在真空 -50- (48) (48)1253433 的環境下被處理的情況時，在處理中因爲需要關閉那些的 搬入搬出開口，所以是使用設有一對交接臂2 1 7 (第2 8 圖參照）的基板交接裝置Gb。 如第30圖至第32圖所不’各基板父fe裝置Ga、Gb 5是被舖設於地面的一對的導引軌道2 1 8所導引，且沿著 托盤P的搬運方向自走可能。且，那些的底基219，是在 水平面內旋轉的可能。在構成前述基板交接裝置Ga的底 基219，是設有：吸著基板W來搬入搬出用的拉出臂216 、及供導引被搬入搬出的基板 W用的複數條的導引滾子 221。前述拉出臂216，是例如，藉由驅動馬達222驅動 旋轉蝸軸2 2 3而進退。 如此，被收納於托盤P的搬運基板W，是在基板搬出 位置Ra，藉由任一的基板交接裝置Ga、Gb被搬出，並被 搬入至各處理裝置A〜E。且，被施加了各處理裝置a〜E 的處理的基板W，是藉由任一的基板交接裝置G a、G b被 搬出，並被搬入待機於周轉輸送帶裝置K的基板搬入位 置R b的空的托盤P。而且，被搬運至對應後續過程的處 理裝置A〜E的基板搬出位置Ra爲止。在各處理裝置a 〜E內藉由返覆上述的過程，就可在各處理裝置a〜]b內 搬運被施加了預定的處理的基板W。 接著’說明基板W的一時保管裝置l。如第2 8圖及 第3 〇圖所不，在周轉輸送帶裝置κ的內側，除了檢查裝 直E的對應各處理裝置A〜D的位置，是配設有基板w 的一時保管裝置L。此一時保管裝置L，是爲了對於例如 -51 - (49) (49)1253433 處理途中的基板W，進行之後的過程的處理裝置a〜E的 故障或是維修檢點，而無法將前述基板W朝下流側搬運 時5將收納了該基板W的托盤P —時地保管用。此一時 保管裝置L，是由：多段收納多數枚的托盤p用的托盤棚 部224、及收取周轉輸送帶裝置κ上的托盤P並從前述托 盤棚部224搬入搬出托盤p用的托盤搬入搬出裝置22 5所 構成。前述托盤搬入搬出裝置22 5是在水平面內可旋轉自 如’且與周轉輸送帶裝置K及對面配置並可搬入搬出托 盤P、及與托盤棚部224對面配置並可搬入搬出托盤P。 因此，在周轉輸送帶裝置K的基板搬入位置Rb的內側的 裝置框2 07的部分，是爲了可以搬入搬出托盤P而被切除 ’並形成切口部2 0 7 a。在第3 0圖，從托盤棚部2 2 4搬入 搬出的托盤P的處理的流程（動線），是由一點鎖線的箭 頭所顯示。然而，在本實施例的半導體製造裝置U.]中， 檢查裝置E的檢查已結束的基板w因爲直接被收容於基 板保管庫F，所以未設置對於檢查裝置E的一時保管裝置 L (第2 8圖參照）。 接著，說明基板搬運裝置S的作用。在此，各處理裝 置A〜E的基板搬運裝置S的作用（周轉輸送帶裝置κ上 的托盤P及各處理裝置A〜E之間的基板W的交接作用） ，因爲對於任一的處理裝置A〜E幾乎同樣，所以在本實 施例，只有說明洗淨裝置A的基板w的交接作用。如第 2 8圖所示，從前過程的裝置藉由基板搬運車（無圖示） 等被搬入基板保管庫F的基板w，是只藉由基板交接裝置 -52- (50) (50)1253433 G a被搬出〗枚，並被收納於待機在周轉輸送帶裝置κ的 空的托盤Ρ。在第2 8圖，由實線顯示收納了基板W的托 盤Ρ ’由二點鎖線顯示空的托盤Ρ。在此狀態下使驅動馬 達Μ作動。各基板搬運滾子2 0 9被驅動旋轉，並使托盤Ρ 朝下流側搬運。藉由接近開關（無圖示）的作用，使托盤 停止裝置J作動並使停止器托板2 1 5上昇，其上端部，是 從各基板搬運滾子2 0 9彼此的間隙突出。由此，在周轉輸 送帶裝置Κ中，托盤Ρ是被定位並停止在與洗淨裝置A 對應的基板搬出位置Ra。 如第3 1圖至第3 3圖所示，托盤P是停止於基板搬出 位置Ra的話，基板昇降裝置Η會作動，使各昇降臂213 上昇。由此，被收納於托盤Ρ的基板W會被抬起，並從 各支撐拉線206脫離。使構成基板交接裝置Ga的拉出臂 2 1 6前進，而將其前端部，配置於基板W的先端部的正下 方。作動真空吸著裝置216a來吸著拉出臂216及基板W ，就這樣地後退。從托盤P拉出的基板W，是被支撐於構 成基板交接裝置Ga的各導引滾子221，並被配置於底基 2 1 9的上面。接著，前述底基2 1 9旋轉，並與洗淨裝置A 的搬入開口 2 2 6相面對配置。前述拉出臂2 1 6前進，使基 板W通過搬入開口 226被搬入洗淨裝置A。 如第3 0圖所示，藉由洗淨裝置A使前述基板W被洗 淨處理的期間’基板交接裝置G a，是被一對的導引軌道 2 ] 8導引移動，並與洗淨裝置A的搬出開口 2 2 7相面對配 置。且，托盤停止裝置J的停止器托板2 1 5下降的同時驅 -53- (51) (51)1253433 動馬達Μ作動，使前述托盤p朝下流側被搬運，並停止 於基板搬入位置Rb。 洗淨裝置A的處理已結束的基板w，是通過洗淨裝 直A的搬出開口 2 2 7被交接至基板交接裝置g a，並被搬 入待機在周轉輸送帶裝置K的基板搬入位置Rb的空的托 盤P。這時的基板交接裝置Ga的作用，是與供搬出被收 納於托盤P的基板W的過程相反。之後，在c V D裝置B 、照像裝置C '蝕刻裝置D、檢查裝置E，進行同樣的作 用使基板W被搬運，依序對於1枚的基板w，施加預定 的處理（單片處理）後，被收納於基板保管庫F。 接著，將上述基板搬運裝置S的基板W的處理時間 ’與習知的海灣（B A Y )方式的分批處理的情況比較說明 。第34圖，是顯示處理途中的基板w是藉由單片處理及 分批處理被正常處理的情況的基板W的流程的意示性的 時間圖表。然而，第3 4圖及第3 6圖，是爲了理解基板W 的正常的流動用的意示性的時間圖表，但未對應前述實施 例的處理過程，而有減少過程數。以下，顯示1枚的基板 W時，是在符號添加「丨」〜「n」。然而，各處理裝置的 處理時間（節拍時間），是設定成幾乎同樣。 在本發明的單片處理，各基板（W 1〜Wn )，是以設 定節拍時間T 1投入過程（I )的處理裝置進行處理後，投 入過程（11 )的處理裝置進彳了處理。進一步’從過程（π )的處理裝置取出的基板W，是投入過程（III)的處理 裝置進行處理。如此，基板W是正常流動的情況（換言 -54 - (52) 1253433 之，各處理裝置皆無故障發生的情況）時，各基板（W 1 〜W η )會依序朝下流的過程流動，在各過程，是以幾乎 同樣的設定節拍時間Τ 1進行處理。First, the substrate sheet 匣 1 C will be described. As shown in Fig. 2, the rectangular frame-shaped sheet body 1 constituting the substrate sheet 1 C is made of a resin or a composite of metal and resin. Further, in the left and right side faces 1 Fa, 1 Fb and the inside thereof, a plurality of vertical plates 2 (in the case of the present embodiment, four on the left and right side faces 1 Fa, 1 Fb, and two on the inside) are installed as partitions. At the same time as the predetermined interval, the horizontal plates 3 of the plurality of upper and lower sides (in the case of the present embodiment, three) are installed with a predetermined interval therebetween. Further, the front side surface of the sheet body 1 is opened to carry in and out the substrate 1 G, and the loading/unloading opening 1 K is formed. The substrate 1 G is carried in and out to the substrate sheet 匣 1C by the substrate loading/unloading opening 1 K by the substrate pulling-out device 1 B. The loading/unloading direction of the substrate 1G is the carry-in/out direction 1P, and the horizontal direction (the width direction of the substrate sheet 匣 1 C) perpendicular to the loading/unloading direction 1 P is the left-right direction 1 Q. -20-(18) (18)1253433 As shown in Fig. 2, the longitudinal and lateral sides 2 of the left and right side faces 1 Fa, 1 Fb attached to the substrate piece 匣I C are mounted to face each other. Further, as shown in FIG. 3, at the same height of the pair of vertical plates 2, each support material for supporting the substrate 1 G is attached along the width direction of the substrate sheet 1C (1Q in the left-right direction). . In the case of the substrate sheet 匣 1 C of the present embodiment, the support material is a wire 4 that is passed through the sheet body 1 and held in a tension-applied state. Thereby, between the respective pull wires 4 in the height direction, the pull wire 4 is used as a shelf, and the shed 1 R for accommodating the substrate 1 G and supporting the plurality of stages is formed. Next, a pair of substrate lifting elements 1 U 1 will be described. As shown in Fig. 3 and Fig. 4, the pair of substrate lifting and lowering elements 1 U 1 are sandwiched by the substrate piece 匣 1 C and arranged to be almost symmetrical with respect to the respective side faces 1 F a and 1 Fb. Since the structure of each of the substrate lifting and lowering elements 1 U 1 is completely the same, only the structure of the substrate lifting and lowering element 1 U 1 on the left side as viewed from the front will be described. On the upper surface of the square flat substrate 5 which is viewed in plan view, the movable frame 6 is disposed to advance and retreat in the left-right direction 1Q. That is, on the upper surface of the base 5, a pair of guide rails 7 are laid on the front side and the deep side at the left and right direction 1 Q. Further, on the bottom surface portion of the movable frame 6, four guide bodies 8 attached to the pair of guide rails 7 are attached. Further, the worm shaft mounting groove 9 is provided between the pair of guide rails 7 of the base 5 in the left-right direction 1 Q, and the worm shaft 1 is disposed in the worm shaft mounting groove 9. The worm shaft 1 1 is screwed to a nut body (not shown) attached to the bottom surface portion of the movable frame 6. Further, one end portion thereof is connected to a horizontally-moving motor 13 attached to the bracket 12. When the horizontal moving motor 1 3 is actuated to rotate the motor shaft of the horizontal moving horse 21 - (19) (19) 1253433 up to 13 in the predetermined direction, the movable frame 6 is guided by a pair of guiding rails 7 And only advance and retreat a predetermined amount along the left and right direction 1 Q. The movable frame 6 has a width slightly narrower than that of the base 5, and the back side of the lower end portion is a flat plate that is wider than the upper end portion, and is attached to the base 5 to be in an upright state. In the front portion of the movable frame 6 (portion facing the side faces 1 Fa, 1 Fb of the substrate sheet 1 C), the substrate lifting arm 14 having a slightly L-shaped shape as viewed from the side is configured to be lifted and lowered. . In other words, in the front portion of the movable frame 6, similarly to the above-described base 5, a pair of guide rails 15 are laid along the height direction at both end portions in the deep direction (the loading/unloading direction 1P). Further, four guide bodies 16 attached to the pair of guide rails 15 are attached to the inner surface of the substrate lifting arm 14 . Further, between the pair of guide rails 15 of the movable frame 6, the worm shaft 17 is disposed along the height direction. The worm shaft 17 is screwed to a nut body (not shown) provided in the movable frame 6. Further, one end portion thereof is connected to a lift motor 19 which is provided to the motor mounting plate 18 for attachment to the upper end portion of the movable frame 6. When the hoist motor 1 9 is rotated to rotate the motor shaft of the hoist motor 9 in a predetermined direction, the base lifting arm 14 is guided by a pair of guide rails 15 and is only raised and lowered by a predetermined amount in the height direction. The substrate elevating arm 14 is planarly separated from the side faces 1 F a and 1 F b of the substrate piece 1 C, and is detached from the vertical plates 2 constituting the substrate piece 1 C to enter. Inside, a portion facing each of the longitudinal plates 2 is provided with a clearance portion 14a. Further, an air floating element 21 is attached to the upper surface of the substrate lifting arm 4 4 - 22 - (20) (20) 1253433. Of course, the total thickness of the substrate elevating arm 14 and the air floating element 21 is smaller than the slab pitch 1 of the substrate piece 匣 1 C. The air floating element 21 has a pressure air supplied from a pressurized air source 1 V, and is ejected from a plurality of air ejection ports 21 1 a provided thereon, and is disposed directly above the substrate 丨G. The function of floating from each pull wire 4. As a result of the above-described operation, the lifting/lowering motor 1 9 is disposed at a predetermined shed position (corresponding to the position of the shed 1 R· directly below the shed 1 R in which the substrate 1 G to be loaded and unloaded is housed). In this state, the horizontal movement motor 13 is actuated, and by moving (moving) the movable frame 6 in the left-right direction 1 Q, the substrate elevating arm 14 can be made to enter the shed 1R' directly below. In Fig. 2, each of the substrate elevating arms 14 in a state in which the shed 1R' directly under the substrate piece 匣 1C has entered is shown by a two-dot lock line. Next, the substrate pull-out device 1B will be described. The substrate drawing device 1B has a possibility that the substrate sheet 1 C can be lifted and lowered, and the substrate 1 G accommodated in the substrate sheet 1 c can be carried out, and the substrate 1 G can be carried into the substrate sheet 1 C. Features. As shown in FIG. 5 and FIG. 6, the upper surface of the substrate stage 2 2 which is disposed to be relatively raised and lowered with respect to the substrate piece 1c is a plurality of guide rolls mounted in the left-right direction 1 Q. Sub 2 3 . These guide rollers 23 are for supporting the loading and unloading of the substrate 1 G. Further, on the upper surface of the substrate stage 22, a guide rail 24 is placed along the loading/unloading direction 1 P of the substrate I G at a substantially central portion in the left-right direction 1Q. The guide body 25 mounted on the guide rail 24 is a substrate pull-out arm 26 which is mounted on a plane which is slightly T-shaped. Further, the worm-axis mounting groove 27 is provided along the loading/outlet direction 1P of the substrate 1 G at almost the center portion of the substrate mounting -23-(21) (21)1253433 table 2 in the left-right direction 1Q. The murder shaft 28 is disposed in the worm shaft mounting groove 27. The worm shaft 28 is screwed to a nut body 29 attached to the rear end portion of the substrate drawing arm 26. And the end portion thereof is connected to the pull-out motor 3 2 attached to the bracket 31. When the pull-out motor 3 2 is actuated to rotate the motor shaft of the pull-out motor 32 in a predetermined direction, the substrate pull-out arm 26 is guided by the guide rail 24 and only moves along the loading/unloading direction of the substrate iG 1P. Advance and return a predetermined amount. Further, on the upper surface of the front end portion of the substrate drawing arm 26, each of the suction pads 2 6 a for the lower surface of the end portion for vacuum-absorbing the substrate 1 G is provided. These suction pads 26a are connected to a vacuum suction device (not shown). In the operation of the substrate loading/unloading device 1 A 1 of the present invention, the shed 1 R in which the substrate sheet 匣 1 C is housed is carried out on the specific substrate 1 G. As shown in Fig. 3, when the lifting motor 19 of each of the substrate lifting elements 1 U ] is actuated, the substrate lifting arms 14 are guided by a pair of guiding tracks 15 by the action of the worm shaft 17. Lifting. Thereby, the substrate elevating arm 14 is disposed at almost the same height as the shed 1 R' directly under the specific substrate 1 G housed in the shed 1 R of the substrate piece 匣 1 C. In this state, as shown in Fig. 4, when the horizontal movement motor 13 of each of the substrate elevating elements 1 U 1 is actuated, the movable frames 6 are advanced in the left-right direction 1 Q by the action of the worm shaft 11. Thereby, the substrate lifting arm 14 of each of the substrate lifting and lowering elements 1 U 1 is the shed 1R' directly under the shed 1R of the substrate sheet 匣 1C. In the substrate lifting arm 4, the vertical plate 2 and the minute portion constituting the substrate piece 1 C are formed by the respective gap portions 4 a, so the substrate lifting arm - 24 - (22) (22) 1253433 1 4 will not dry up with each vertical plate 2. Further, since each of the substrates 1 G accommodated in the substrate sheet 1 C is supported by the four wires 4 without being bent, it does not come into contact with the substrate lifting arm 4 . As shown in Fig. 7, the pressurized air supplied from the pressurized air source 1v of each of the substrate lifting and lowering elements 1 U1 is ejected from a plurality of air ejection ports 21a of the air floating element 2 1 . Thus, the specific substrate 1G,. It will float slightly from each cable 4.  then, Referring to Figures 5 and 6, The action of the specific substrate 1 G that has floated (the action of the substrate pull-out device 1 B) will be described. The substrate pull-out arm 26 of the substrate pull-out device 1B, Yes in advance, By raising and lowering the substrate sheet 1 C and the substrate stage 22, It is disposed at a height corresponding to the shed 1 R' directly below the specific substrate 1 G (refer to Fig. 6).  Actuating the pull-out motor 32 of the substrate pull-out device 1B, Rotating the shaft 28 in a predetermined direction, The substrate drawing arm 26 is advanced along the loading/unloading direction 1P of the substrate 1G. thus, The front end portion of the substrate pull-out arm 26, It is through the loading and unloading opening 1 K of the substrate sheet 1 C, The specific substrate 1 G is brought into the front side of the shed 1 R ' directly below the storage shed 1 R, And disposed directly under the front end portion of the substrate 1 G. In this state, If the vacuum suction device is activated, Below the front end of the substrate 1 G, The vacuum suction pad 26a of the arm 26 is pulled by the vacuum. once again, Actuating the pull-out motor 3 2 of the substrate pull-out device 1 B, When the motor shaft of the pull-out motor 3 2 is rotated in the reverse direction, The substrate pull-out arm 26 will retreat. The specific substrate 1 G housed in the shed]R of the substrate sheet 匣1 C, Will be lifted from the pull wire 4 (without the state of the pull wire 4) and pulled straight out, It is supported by the respective guide rollers 23 mounted on the substrate carrier -25-(23) 1253433. therefore, The specific substrate 1 G on the way out is not rubbed against the pull wire 4, And the substrate 1 G is damaged, No foreign matter will be produced.  The aforementioned substrate 1 G, When moving into the substrate sheet 匣 1 C, It is the opposite of the above. At this time, In the portion of the shed 1R' directly below the shed 1R where the substrate 1 G is to be carried, advance, Letting the substrate lifting arms 14 of the substrate lifting and lowering elements 1U1 enter, The pressurized air is ejected from a plurality of discharge ports 2 1 a of the air floating element 2 1 . therefore, The substrate 1G that has been carried into the substrate sheet 匣 1C enters in a floating state. It will not rub with each cable 4.  The height position ' of the substrate lifting arm 14 of each of the substrate lifting elements 1 U 1 is actuated by the lifting motor 19 It can be set freely. And, The substrate sheet 匣1 C and the substrate pull-out device 1 B may be lifted and lowered relatively, Therefore, the substrate of the substrate pull-out device 1 B pulls out the height position of the arm 26, It can also be set freely. this is, The substrate 1 G is carried out from any of the shelves 1 R accommodated in the substrate sheet 1 C, It is possible to carry any of the slabs 1 R of the substrate sheet 匣 1 C into the substrate 1 G. And, In the substrate loading/unloading device 1A 1 of the present embodiment, Because it is for a 1-base substrate sheet 匣1 C, A pair of substrate loading/unloading devices 1 A] are disposed, Each of the substrate lifting arms 14 can be 1 Fa from both sides of the aforementioned substrate sheet 1C, lFb enters. thus, The length of each of the substrate lifting arms 14 can be shortened. Even if it is mounted in a cantilever state, the deflection is small. the result, The slab pitch 1 Η ' of the substrate sheet 匣 1 C which can be reduced can increase the number of substrates 1 G in the substrate sheet 匣 1 C of the one base.  In the above embodiment, The form in which the substrate 1 G is floated by the pressurized air. but, As shown in Figure 8, On the upper surface of the substrate lifting arm 14 -26- (24) 1253433, a plurality of supporting rollers 3 3 are rotatably mounted. It is also possible to lift the substrate 1 G by the respective support rollers 3 3 . In this case, The substrates are carried into the substrate lifting arm 1 4 of the unloading device 1 A 1 , After entering the shed 1 R' directly below the substrate sheet 匣 1 C, Need to operate the lift motor a little bit  The substrate lifting arm 14 is slightly raised.  a substrate lifting and lowering element 1 U 1 constituting the substrate loading/unloading device 1 A 1 , It is a possible state in which one of the substrate elevating arms 14 is lifted and lowered with respect to the substrate sheet 匣1 C . but, The substrate lifting arm 14 and the substrate sheet 匣 1 C, It is possible to raise and lower relatively. therefore, E.g, For the movable frame 6, The substrate lifting arm 14 is fixed in the height direction. The substrate piece 匣 1C is in a form that can be lifted and lowered' or It is no harm that both can move up and down at the same time.  In the above embodiment, The means of lifting the substrate 1 G, Only pressure air. but, The amount of floating of the substrate 1G by the pressurized air is small (about 0·1 mm), Therefore, a subsidy means (not shown) for the substrate 1 G to float is provided. It can also be used with pressurized air. Thus, the aforementioned substrate 1 G can be surely floated. This substrate floating aid means can be considered, for example: Electromagnetic force such as an electromagnetic coil, Or air pressure by a pneumatic cylinder or the like.  [Embodiment 2] The substrate loading/unloading device A1 of the first embodiment is a configuration in which a pair of substrate lifting and lowering elements 1U1 are disposed for one substrate sheet 匣1 C.  The substrate lifting arm 14 is respectively formed from both side faces 1 F a of the substrate piece 匣 1 C,  1 Fb entering form. However, as shown in Fig. 9, the substrate composed of the one-base substrate sheet 匣1 C and the substrate lifting element 1 U2 is carried in and out -27 - (25) 1253433 The device 1 A 2 may be used. In the substrate loading/unloading device 1 A2 of the second embodiment, There is an advantage that the substrate lifting and lowering element 1 U2 is only required to have one base. However, In the substrate loading/unloading device 1A2 shown in Fig. 9, The substrate elevating arm 34 of the substrate elevating element] U2 is in a form of entering from the side surface 1 Fa of one side of the substrate piece 匣 1 C. but, The aforementioned substrate lifting arm 34,  From: Side surface 1 Fb of the other side of the substrate piece 匣 1 C, Substrate film 匣!  The front side of C (moving in and out of the opening 1 K), Or it is the form that enters inside.  [Embodiment 3] Further, The substrate lifting element 1U3 as shown in Fig. 1 In addition to the uppermost section of the substrate sheet C1 C, the number of sheds 1 R of the shed 1 R corresponds to each of the substrate lifting arms 35, It is also possible to fix the setting to the movable frame 6. In the pair of substrate lifting elements 1U3 constituting the substrate loading/unloading device 1 A3 of the third embodiment, Each of the air floating elements 21 is attached to each of the substrate lifting arms 3 5 ', The air distribution pipes are separately formed and independently operated.  And 'each substrate lifting arm 35, It is attached to the movable frame 6 in a cantilever state.  And 'by means of switching without a graphic, Switch the air distribution line, Only the air floating element 21 is ejected from the air floating element 21 corresponding to the specific substrate 1 G. In this case, Among the substrates 1 G supported by the multi-stage, Only a specific substrate 1 G will float, The substrate G is carried out by the substrate pull-out device 1 B. And, When moving into the substrate 1 G, Only the air floating element 21 from the shed 1 R corresponding to the substrate 1 G is ejected with pressurized air. The case of this embodiment does not require the relative lifting of the substrate lifting arm 35 or the substrate sheet > 28- (26) (26)1253433 1 C lifting method, And has the advantage of simple structure.  In the above embodiments, the support material of the substrate 1 G is supported, Is a through piece 匣 body 1, And, Each of the pull wires 4 that are attached to the tension state is mounted. thus,  Have: The breadth of each shed 1 R can remain the same. Only the narrow shed spacing is 1 Η. but, Support material other than the wire 4, E.g, The thin bar is also flawless.  [Embodiment 4 1 Next, The substrate transporting method and apparatus of the present invention will be described based on the fourth to sixth embodiments.  Figure, Is an overall plan view of the semiconductor manufacturing device U, Figure 14 is the same front view, Fig. 15 is a plan view showing the flow of the substrate W of the normal conveyance path of the processing apparatuses A to D of the first group. Figure 16 is a plan view of the first cleaning device All and the CVD device B1. Figure 17 is a front cross-sectional view showing a state in which the substrate W is carried out from the main substrate sheet 1 〇 1 , Fig. 18 is a plan view showing the flow of the substrate W of the branch conveyance path of the processing apparatuses A to D of the first group.  First of all, The overall structure of the semiconductor manufacturing apparatus u will be described. As shown in Figure 13, This semiconductor manufacturing device U, It is a semiconductor element in which five layers are formed on the substrate W, Each of the processing devices A to D composed of five process groups from the first layer forming process P1 to the fifth layer forming process P5, Is considering the design efficiency of dust-free _ And divided into 2 groups. which is, Each of the buried devices A to D arranged in the order of the process, It is divided into two groups of the first and second in accordance with the breadth of the clean room. further, Processing units A to D of each group, It is a state in which the phase is set to 29-(27) (27)1253433 and the two columns are divided. In the aforementioned second layer forming process P] in accordance with the processing sequence, The first] cleaning device A] 丨, ^ VD device brother 2 cleaning device a 1 2 Photographic device C 1, 0 insect engraving device d 1, Yes, the direction of the device arrangement Q is arranged on almost the same straight line. Similarly,  1 second brother 2 layer forming process p 2, In the order of processing, The first washing device A21, First CVD device B21, Second CVD device] β22, The second cleaning device A22, Photographic device C2, The etching device D2 is provided. In the third layer forming process P3, In the order of processing, The first washing device A3 } , CVD device B3, The second cleaning device A32, Photographic device C3, Etching device D3, It is arranged in groups that span the first and second. In the fourth layer forming process P4, In the order of processing, Equipped with: Cleaning device A4,  CVD device B4, Photographic device C4, Etching device. In the fifth layer forming process P 5, In the order of processing, Equipped with: Cleaning device A5,  CVD mounting B5, Photographic device C5, Etching device D5. Between the groups of processing devices facing each other, Along the direction of the device, Q, Featuring: Two substrate transfer columns L 1 , And two substrates temporarily placed in the column L2 And one branch line transport column L3. and, At the end of each group, Each inspection device Ma is provided as an example of an attached processing device, M b.  which is', Near the respective processing devices A to D facing each other, With each base parent: r妾 column L 1, And a substrate transfer device E a corresponding to each of the processing devices A to D is provided, £ b. Inside the aforementioned substrate transfer column L 1 , There are various base plate temporary rows L2. Between each of the processing devices A to D, In fixed anger, The main substrate sheet 匣1 01 (the first temporary stage) is set separately. This main substrate sheet 11 1 〇丨, In order to transfer the substrate w in the process to the subsequent processing devices A to D of -30-(28) (28)1253433, The substrate W is housed for temporary use. Therefore, a plurality of substrates W can be accommodated in multiple stages. And, By means of FIFO (described later), Any substrate W can be carried in and out. here, "Processing in transit" means It is the processing until the specific process in the whole process has been completed. The state of the remaining process is not processed.  And, By temporarily mounting the column L2 on each of the substrates, In the portion corresponding to the specific processing devices A to D, In order to perform the extraction inspection of the substrate W in the process of processing, And placed: The inspection substrate sheet 102 (second temporary stage) for accommodating the substrate W. This inspection substrate piece 匣1〇2, It is provided by the branch transport truck 103 placed in the branch transport column L3. The inspection device Ma that is transported to the first and second groups, Mb (described later). further, In the beginning end portion and the end portion of the substrate temporary stage L2, Is placed: The substrate W transported from the previous process, And a transfer substrate sheet 104 for storing the substrate W that is transported in the subsequent process. however, In Figure 13, A diagonal line is applied to each of the main substrate sheets 匣1 0 1 , A diagonal line is applied to each of the inspection substrate sheets 匣102. And, A diagonal line in a direction opposite to the main substrate sheet 匣1 0 1 is applied to each of the transport substrate sheets 匣10, To distinguish them.  and, Between the two substrate temporary stage columns L2 facing each other, There is a branch line L 3, The self-propelled possible branch truck 1 〇 3 is arranged along the direction of the device arrangement Q. Each of the substrate transfer devices Ea mounted on the two substrate transfer rows L1, Eb, By the substrate pieces 匣1 〇 1 provided in each of the substrate temporary stages L 2 , 1 〇 2 1 04, And the feeder truck 1 0 3 equipped in the branch handling column L 3, A substrate transfer device S is formed. however, In the third picture, M a is an inspection device of the substrate W of the first group, M b is a device for inspecting the substrate W of the 2 -31 - (29) (29) 1253433 group. And, μ c is an inspection device for the substrate W after the end of the final process (the fifth layer forming process P 5 ). here, Corresponding to the inspection device Ma, A plurality of inspection substrate sheets M1〇2 set by Mb, Is a substrate W that is taken from the middle of each processing device A to D, And handed over to the inspection device Ma, The state of Mb.  And as shown in Figures 13 and 14, Each processing device of the first group A to D, And each of the processing devices A to D of the second group, The rail transport vehicles 105 are arranged in a direction perpendicular to the apparatus arrangement direction Q of the processing apparatuses A to D in a plan view. This rail car is 1〇5, Is with: Between the beginning end or the end portion of each substrate temporary stage L2, Handling the transfer function of the substrate sheet 匣1 04. The substrate W subjected to the predetermined processing is applied by the processing devices a to D of the first group, It is delivered to the rail transport vehicle 1〇5 while being stored in the transporting substrate piece ® 1 〇4. and, It is transported to the processing devices A to D of the second group, It is placed on the beginning of the substrate temporary stage L2.  The semiconductor manufacturing apparatus U of the present embodiment, In the form in which the substrate W is transported one by one in the manufacturing line (single sheet processing) (for this,  The familiar bay (BAY) way, It is a form in which a plurality of substrates W are processed in batches (batch processing). which is, As shown in Figure 15, One substrate W, Is to use the substrate to move the device s, It is transported between the processing devices a to D. The substrate W to be processed by the specific processing devices a to D, By the substrate transfer device E a corresponding to the processing devices A to D, E b is carried out from the processing devices A to D, Stored in the main substrate sheet 匣]0], And temporarily put it. The substrate -32- (30) 1253433 w temporarily placed on the main substrate sheet 〇 1 〇 1 It is a substrate delivery device Ea that is disposed by the processing devices A to D corresponding to the subsequent processes, Eb, Transfer to the processing devices A to D. By returning this effect, A predetermined process is applied to the aforementioned substrate W. The arrows in Figure 15 It is a flow (moving line) showing the process of applying the substrate W to one piece. however, In this embodiment, The conveyance path of the substrate W is referred to as a "regular conveyance path".  The normal conveyance path of the above-described substrate transfer device S will be described in detail. here,  The functions of the substrate transfer device S between the respective processing devices A to D of the first to fifth layer forming processes P1 to P5 (each processing device A to D and the substrate transfer device Ea, The transfer of the substrate W between Eb), Because the process is almost the same for any one, So in this embodiment, The transfer action of the substrate W in the first layer forming process P 1 will be described. As shown in Figure 16, In the substrate transfer column l 1 of the substrate transfer device S of the present embodiment It corresponds to the various devices A to D, Two kinds of substrate transfer devices e a, Either of E b. here, For each processing device A to D, Whether to use any of the substrate transfer devices Ea, Eb, It is determined by the processing devices a to D.  That is, 5 such as the washing device A or the photographing device c, When the substrate W is processed in a normal environment, the substrate transfer device E a is used, Such as c V D device B or etch device, When the substrate w is processed in a vacuum environment, In the process, because it is necessary to close those moving in and out openings, Therefore, the substrate transfer device Eb is used. therefore, In the first layer forming process p 1, Substrate transfer device Ea, Corresponding to the third and second cleaning devices A11, A12 and photo device c] settings, Same substrate transfer device E b, It corresponds to the setting of the C V D device B 1 and the etching device d 1 (refer to Fig. 15).  -33- (31) (31)1253433 As shown in Figures 14 and 16, Each substrate transfer device Ea, Eb, It is guided by a pair of guiding rails 铺设 1 laid on the ground. It is possible to walk along the direction of the device. And, Those substrates l〇6a, 106b, Yes, while rotating in the horizontal plane, It can be lifted and lowered freely. and, In the base 106a constituting the substrate transfer device Ea, It is equipped with: a vacuum suction device 107 that sucks the substrate W and carries it in and out. And a plurality of support rollers 1 〇 8 for supporting the substrate W loaded and unloaded. The aforementioned vacuum absorbing device 1 〇 7, Is for example, Advance and retreat by driving the rotating worm shaft. And, In the base 106b constituting the substrate parent device Eb, It is a support arm 109 for lifting the substrate W and carrying it in and out. It is set in pairs.  As shown in Figures 15 and 16, Corresponding to the substrate transfer device Ea provided in the first cleaning device A1 1 , Is with: Carrying out (drawing out) the substrate W accommodated in the transport substrate sheet 匣104 And moved into the first cleaning device A ]1, The substrate W that has finished the cleaning process, Move out from the first washing device A1 1 , The function of the main substrate sheet 匣1 0 1 provided between the first cleaning device A 1 1 and the CVD device B 1 can be accommodated. and, Corresponding to the substrate transfer device Eb disposed on the CVD device B1, Is with: Carrying out the substrate W accommodated in the main substrate sheet 匣1 0 ], And when moving into the C V D device B 1 , The substrate w which has finished the processing of the aforementioned CVD apparatus B1, Moving out from the C V D device B 1 , It can be stored in the main substrate sheet 匣1〇1 provided between the CVD apparatus B1 and the second cleaning apparatus A12. therefore, The traveling range Ra of the substrate transfer device Ea and the substrate transfer device Eb, Rb, It is repeated in the portion of the main substrate sheet 101.  in this way, The substrate W accommodated in the main substrate sheet 0 0 1 , It is a substrate transfer device Ea of any -34 - (32) (32) 1253433 Eb was moved out, It is carried into each processing unit A to D. And, The substrate W on which the processing of each of the processing devices A to D has been completed is Is by any substrate transfer device Ea, Eb was moved out, And it is accommodated in the main substrate sheet 101 of the subsequent process side. the following, By returning to the above process, The processing of each of the processing apparatuses A to D is applied to the substrate W. Therefore, The number of substrates W accommodated in the main substrate sheet 匣1 0 1 , Normal situation (in other words, When each of the processing apparatuses A to D is operated smoothly, it is one.  Describe the main substrate sheet 匣1 0 1 . As shown in Figure 17, The main substrate sheet 101 of the present embodiment has a rectangular frame shape. In order to carry in and out the substrate W, And the substrate transfer device Ea, The Eb faces the face opening. and, Along its width direction (device alignment direction Q), A plurality of pull wires 1 1 2 are mounted in a tension attached state. These pull wires 1 1 2, Is installed in the height direction with a predetermined interval, A substrate storage booth 1 1 3 having the above-mentioned wire 1 1 2 as a shelf is formed in each stage. thus, In one main substrate sheet 匣1 〇 1, A plurality of substrates W can be accommodated in a plurality of stages. And, This main substrate is 匣1 〇 ! , It is a first-in first-out method (F i r s t - i n F i r s t - Ο u t ). which is, By letting the arm 1]4 rise and fall from the side, Enter and exit the main substrate sheet 匣1 0丨, The substrate w can be stored in the substrate storage booth 1 1 3 of any stage. And slightly separated from each pull line 1 1 2 . therefore, It is possible to carry in and out the arbitrary substrate W. This result, Even for any reason (the failure of each processing device A to D, etc.),  In the main substrate sheet 匣101, two or more substrates W are housed, The substrate W that has been processed first can be taken out first. It is possible to prevent the deterioration of the quality of the product due to the long-term placement of the substrate W during processing. So -35- (33) (33) 1253433 , The main substrate sheet 匣1 0 1 ' of the present invention has not only: The function of temporarily transferring the substrate W to be placed, And the failure of each processing device A to D, etc. It is also possible to allow the substrate W of the process to stagnate on the upstream side, Detach from the flow of the manufacturing line, And the functions that are temporarily stored ‘that is, It also has the buffering function of the manufacturing line.  For this, The substrate piece for inspection 匣1 0 2 and the substrate piece for transport 1 〇 4, It is an example of a sequential access method. As shown in Figure 14, Like the above main substrate sheet 〇1 〇 1, With each pull line 1 1 2, When the substrate storage shed 1 1 3 is set in multiple stages, In each substrate sheet 102, Just below 104, There is a possible roller frame 1 1 5 for lifting. Carrying in and unloading the substrate accommodated in these sheets 匣1 0 2. In the case of the substrate W of 1 0 4 By raising the aforementioned roller frame 1 1 5, The substrate W of the substrate storage booth 1 1 3 accommodated in the lowermost stage can be detached from the wire 1 1 2 . In this state, By constituting the substrate transfer device Ea, Eb vacuum suction device 107 or support arm 109, Move in and out of the substrate W. The substrate piece of this structure 匣1 〇 2 In the case of 1 0 4,  It is an advantage of a simple structure of the means for raising the substrate W (with the roller frame 1 15). And, This inspection substrate piece 匣1 〇 2, It is the same as the main substrate sheet 匣 1 〇 1 (first in, first out) substrate sheet 匣, In this case, Random access during the inspection process of the substrate W is also possible.  then, The branch conveyance path of the board conveyance device S will be described. In the semiconductor manufacturing apparatus U, In order to perform the extraction inspection of the substrate W, the substrate W may be taken from the middle of the predetermined process. The aforementioned branch line handling road, Is the substrate W to be extracted, Handling to the inspection equipment Ma of each group,  Mb. E.g, In the first layer forming process P] of the present embodiment, As shown in the figure]8-36- (34 (341253433), Corresponding to the photographic device C] and the etching device D] of the first layer forming process p] and the portion of the substrate temporary stage L2, Each of the inspection substrate sheets 匣1 0 2 for accommodating the extracted substrate W is provided. this is, In the first layer forming process P 1 of the present embodiment, For the substrate W that has finished the processing of the photographing device C 1 , or, For the substrate W that has finished the processing of the etching apparatus D1, Perform an extraction check.  As shown in Figure 14, The branch transport line L3 5 constituting the branch line transport path is a pair of guide rails 1 1 6 which are laid along the apparatus arrangement direction Q. A branch line transport vehicle 1 〇 3 is disposed on the guide rail 1 16 . This branch line truck 103' is guided by the aforementioned guide rails 而6 and may be self-propelled. And, In this branch truck 103, have: There is a sheet conveying device 1 17, The substrate piece 匣1 〇 2 for inspecting the substrate W to be taken out can be received, And handed over to the inspection device Ma, M b function, And perform the opposite function.  The arrows in Figure 18, It is a flow (moving line) of the process of displaying the extracted substrate W. As shown in Figure 18, The substrate w to be inspected,  Is by any substrate transfer device Ea, Eb, It is stored in the inspection substrate sheet 匣1 0 2 . The inspection substrate sheet 匣1 〇 2 in which the substrate W is housed, It is directly delivered to the feeder truck 1 〇 3. and, With the aforementioned feeder truck 1 〇 3, After being transported to the approach position of the inspection device Ma of the substrate temporary stage L2, And placed in the portion of the substrate temporary stage L 2 at the aforementioned approximate position. This substrate W, By the substrate transfer device Ea corresponding to the inspection device Ma, Moved into the inspection device Ma. The substrate W of the inspection of the aforementioned inspection device M a has been completed, It is stored in the inspection substrate sheet 匣1 〇 2 ,  Once again by the feeder truck]03, Move to the position of the next -37 - (35) (35)1253433 process of the extracted process, It is placed on the substrate temporary stage L 2 .  Next, the action of the substrate transfer device S will be described. here, Only the transfer action of the substrate W from the first cleaning device A1 to the cvd device B1 will be described. As shown in Figure 9, Corresponding to the first cleaning device a; [1) The substrate transfer device Ea is moved, On the other hand, it is placed on the substrate for transport 1 〇 4 . The substrate W accommodated in the transport substrate sheet 4,  Is by the vacuum absorbing device 107 provided on the substrate transfer device Ea, It is carried out from the transport substrate sheet 104, And placed on the substrate 106a of the substrate transfer device Ea. and, The aforementioned base 106a, It is rotated 1 80 ° in the horizontal plane. In this state, The substrate transfer device Ea moves toward the downstream side (subsequent process side), It is disposed facing the loading opening 118 of the first cleaning device A1 1 . Substrate W, It is by the action of the vacuum suction device 107 provided in the substrate transfer device Ea. The loading opening 1 1 8 of the second cleaning device a 1 1 is carried into the device a 1 1 , After washing,  It was carried out from the carry-out opening 1 1 9 .  Such as Lai; 2 0 No, no, The cleaning process of the substrate W is in progress, The substrate transfer device E a ' is moved toward the subsequent process side along the device arrangement direction q and is disposed facing the carry-out opening 1 1 9 of the first cleaning device A1 1 .  By almost the same effect as above, The substrate W carried out from the first cleaning device A 1 1 Is again handed over to the substrate transfer device Ea, In this way, Move to the position facing the main substrate sheet 匣I 。. and,  The aforementioned substrate W, It is stored in the main substrate sheet 匣1 〇 1. The substrate transfer device Ea, It is moved to the position facing the substrate sheet 搬运04 for transporting, and the above-described action is repeated.  -38- (36) (36)1253433 Also, As shown in Figure 21, The substrate W is housed in the main substrate sheet 01 0 1, If the substrate transfer device Ea is retracted, The substrate transfer device Eb corresponding to the C VD device B 1 is moved, The surface of the main substrate sheet 匣 1 0 1 is disposed facing each other.  By the action of the support arm 1 设置 9 provided on the substrate transfer device Eb,  The substrate W is carried out from the main substrate sheet 1Q. This substrate W, Is kept in the state of being placed on the substrate transfer device Eb, Moved to the side of the subsequent process, Further rotating only a predetermined angle in the horizontal plane, It is disposed to face the loading opening 丨 21 of the CVD apparatus B 1 . and, It is carried into the CVD apparatus B1.  The substrate W of the above-described processing of the CVD apparatus B1 has been completed, By the substrate transfer device Eb, The main substrate sheet 匣 1 〇 1 accommodated in the subsequent process. after that, For the second cleaning device a 1 2 Photographic device C 1, Etching device D1, It is almost the same effect. and, As shown in Figure 15,  Among the processing devices A to D of the first group, The substrate W carried out from the CVD apparatus B3 disposed at the most downstream portion, The substrate transfer device Eb is housed in the transport substrate sheet 匣1 04, With a feeder bus, After being placed on the substrate temporary stage L2 close to the position of the rail transport vehicle 105, With the aforementioned rail car 1〇5, Transfer to the processing units A to D of the second group. further, In the second group of processing devices A to D, Perform almost the same effect.  then, The processing time of the substrate W of the above conventional transport path, It is compared with the conventional Bay (BAY) method. Figure 22,  It is intended to indicate that the substrate w in the process of processing is processed by a single piece, And -39- (37) (37) 1253433 Time chart of the flow of the substrate w in the case of normal processing of batch processing. however, In Figures 22 to 24, Because it is a time chart of the normal flow of the substrate W for easy understanding, Therefore, it does not correspond to the processing of the foregoing embodiment, There is a reduction in the number of processes. the following, When one substrate W is displayed, The symbols "1" to "^" are added. however, Processing time (takt time) of each processing device, It is set to be almost the same.  Military in the early treatment of the invention, Each substrate (W]~Wn), After the processing device that sets the tact time (T 1 ) input process (I ) is processed, The processing device that has been loaded into the process (II) by the main substrate sheet 101 (first temporary stage) is processed. further, The substrate W taken out from the processing device of the process (II), It is processed by a processing device of another main substrate piece 匣1 0 1 input process (111). in this way, It is not necessary to perform the extraction in order to check the substrate W in the process of processing. Or in the case of a normal process in which a failure of a specific processing device does not occur, Each substrate (w 1~Wn ), It is only temporarily placed on each main substrate sheet 〇1 〇 1, It will not always be stored in the aforementioned main substrate sheet 匣1 〇 1, And the process of moving down the flow, In each process, It is processed with almost the same set tact time (T 1 ).  The above situation will be specifically described. In the case of the present invention, As shown in Figure 2, When the first substrate W1 is put into the process (I), With the processing device of the process (I), A predetermined process is applied to the substrate W 1 . If this process is over, The substrate W 1, Will pass through the main substrate sheet 101 (the first temporary table), The processing device of the input process (11). With this, The second substrate W 2 is loaded into the processing device of the process (I).  in this way, In the present invention, Substrate W 1~W3, Yes] 1 piece of land -40- (38) (38)1253433 Don't invest in each process (i),  ( π) ,  (m) is processed (single-chip processing). For this, In the traditional Bay (B A Y) approach, Most of the boards W, Because the processes are processed in batches, Therefore, the processing time of each process will become longer. but, In the case of the present invention, Compared with T A T (T 1 2 ) in the case of the Bay (B A Y ) method, T A T ( T2 ) of each of the substrates W 1 to W 3 , It will be very short. And, Compared with the beat time T 1 1 of the Bay (BAY) mode, The tact time T 1 of each of the substrates w 1 to W 3 of the present invention is also approximately the same as shown in Fig. 23, It is a relationship showing the number of processes of the substrate W for the time of the single-chip process and the batch process of the present invention.  In this figure, 'solid line 1 2 2, Is a case of displaying the monolithic process of the present invention,  Two-point lock line 1 23, It is the case of the conventional bay method.  However, the "this figure" is the total processing time per substrate W required for putting the substrate w into the manufacturing line until the finished product is taken out. If it is assumed that the single-chip processing and the batch processing are the same one. In the traditional Bay (B A Y) method, Because the entire batch processes, for example, 20 substrates W, If you do not pass T AT (T 1 2 ), The substrate w of the finished product could not be obtained. but, In the case of the present invention, Because it is a form that is processed one by one, As long as one minute of T A T ( T 2 ) is passed, It is possible to produce one substrate w.  The above results, The number of substrates W (made in the library) that become stagnation in the manufacturing line (unfinished product) is also reduced. A small amount of working capital is available, Because of the short-term recovery of the invested capital, it has the advantage of a manager with good capital turnover. And, By making a reduction in the library, The storage space of the substrate W in the manufacturing line may be a small amount, Therefore, there is an advantage that the construction cost of the dust chamber without -41 - (39) (39) 1253433 is cheap. especially, recently, The size of the substrate W becomes large, The unit price per one substrate W also becomes high. The shortening of the above T A T or the reduction in the production of the library, Can generate big benefits. further, The delivery time is shortened, which corresponds to a short delivery time. Or it is a very short lead time.  then, The case where the substrate W in the middle of the process is extracted will be described. Fig. 24 is an explanatory time chart for explaining the flow of the substrate W for the inspection of the substrate W in the middle of the extraction process. Each process (I), (Π),  (III) sets the tact time to be T1. After the fourth substrate W4 is completed, the process (I) is completed, and then it is extracted. After the inspection time T3, An example of the next cut-in process (11) of the substrate W (n-m-4). in this way, When the substrate W ( η - 4 ) is supplied to the process (11), the substrate W (n-m-3) of a plurality of subsequent (two in the illustrated example), The input interval of the process (I) of w ( η - m - 2 ) is also the tact time (T1 + α ), It is larger than the above set beat time Τ1, Subsequent substrate W ( n - m - 1 ), Same as W ( η - m ), Is the processing device of the process (I) with the original tact time T 1 , after that, The substrate W was smoothly processed for the entire process by setting the tact time T 1 . in this way, After the substrate W 4 from which the inspection is completed is inserted into the subsequent plurality of substrates from the process (11), the input interval (takt time) is longer than the set tact time T1. For the whole process, the usual tact time can be used for processing.  on the one hand, After the end of the process (I), When the substrate w 4 is extracted, The substrate is not responsible for the subsequent process (11),  ( 111 ) processing device, Process (11),  The discharge interval (beat time) of the substrate of (111) is twice as normal. The production energy rate is reduced. here, 本发一 42- (40) (40)1253433 Ming, After the main substrate sheet 101 (first temporary stage) or the inspection substrate sheet 102 (second temporary stage) disposed in the vicinity of the processing apparatus in the process (II) is finished (Ϊ), When the substrate that does not flow on the manufacturing line is temporarily stored (in that case, it is necessary to temporarily store it as will be described later),  When the substrate w ( n-m+1 ) is put into the processing device of the process (π ),  Even if the substrate W4 is taken out from the regular conveyance path for the purpose of extracting the inspection, The tick time of subsequent subsequent processes will become the set tact time T 1, And the production capacity rate is reduced.  Next, the case where a specific processing device fails will be described. Figure 25, It is an intentional time chart for the flow of the substrate W in order to easily understand the case where the specific processing device is temporarily broken. After the process of the substrate W3 is finished in the process (II), When the processing device of the process (II) fails, Even after the fault, Several (4) substrates W4~W 7, The process (I) is performed by setting the tact time T1. The next few (3) substrates W 8~W 1 0, The processing is performed at a tact time (T 1 + 々) longer than the set tact time T 1 due to the processing adjustment caused by the stop of the processing device of the process (II). These plurality of substrates W4 to W 1 0, Even the subsequent substrate (for example, After the substrate W 4 is the substrate W 5 ) has been processed by the process (I), Due to the inability to invest in the process (II), Therefore, the main substrate sheets 匣 1 0 1 which are carried in and between the process (I) and the process (11) are sequentially loaded.  The third substrate W 3 is processed from the end of the process (11) until the elapse of the stop time T4. If the processing device of the process (Π) is reopened, a plurality of substrates W4 to W 1 0 housed in the main substrate sheet 00 1 , First (41) (41)1253433, the substrates that are carried in are sequentially carried out, The processing device of the process (11) is input with the set tact time T1. and, In the final tact time (T1 + cold) which is greater than the tact time T 1 is set, The substrate after the subsequent substrate \¥12 including the substrate W 1 1 to which the process (I) is put, The process (I) is sequentially input with the set tact time T 1 . Smooth processing in the whole process smoothly.  In the substrate carrying device S of the present embodiment, Branch line handling column L3,  Both of the processing devices A to D are arranged to be divided on both sides. Therefore, The walking distance of the feeder truck 103 can be shortened. It is also possible to shorten the conveyance time of the substrate W of the carrier 1 〇 3 .  In the substrate carrying device S of the above embodiment, Main substrate sheet 101, It is set in a state of being fixed to the substrate temporary stage L2. therefore, In this embodiment, Outside the main substrate sheet 匣1 0 1 , Another set of inspection substrate sheets 匣 1 02, The substrate W to be extracted is stored in the inspection sheet 匣102, By the feeder truck 1 0 3, The inspection substrate piece 匣1 0 2 itself is inspected and transported to the device Ma, Mb so far. This result, The substrate W of the inspection substrate sheet 匣102 may have only one transfer port or a transfer port. It has the advantage of simple structure.  In the substrate carrying device S of the present embodiment, The substrate W to be taken for inspection, It is not stored in the inspection substrate sheet 匣1 02, But the main substrate is 匣1 〇 1, It is difficult to transfer the substrate W to the branch transport truck 103.  but, E.g, The aforementioned main substrate sheet 匣1 〇 1, When it is set in the horizontal plane and the rotation is possible, The substrate W to be inspected is from the aforementioned substrate sheet 匣 1 0 1, It is also possible to transfer to the feeder truck 1 0 3 . thus, There is no need to inspect the substrate piece 匣1 02, Advantages of the simple structure of the substrate transfer device S -44- (42) (42) 1253433 In this embodiment, The extraction substrate w ′ is in a state of being housed in the inspection substrate sheet 102, This inspection is carried out together with the inspection substrate sheet 102 to the branch conveyance truck 103. but, It is not stored in the substrate for inspection 匣1 02, However, it is also possible to transfer the substrate W to the branch carrier 1 〇 3 in a single unit. thus, There is an advantage that the substrate sheet 102 for inspection is not required.  In the substrate transfer device s of the present embodiment, by any of the substrate transfer devices Ea, Eb, The substrate W is transferred through the main substrate sheet 101 (first temporary stage). but, Substrate transfer device e a, E b, It is also possible to directly transfer the substrate W. In this case, The time required for the transfer of the substrate w can be greatly shortened. Can shorten the TAT.  In this embodiment, For the tape processing performed on the substrate W in the process, It is a description of the extraction check. but, With processing, It is no problem to take a process other than the inspection. There are also, for example, When the processing pattern is not as designed, etc. The branch line is transported to an example of a repair device for repairing the problem.  In the first and second groups of the first and second groups of the present embodiment, the substrate stage L 2 is temporarily placed. A space other than the portion where the main substrate sheet 匣 1 〇 1 is to be mounted, A storage space for the substrate sheet for storing the substrate W in the middle of the storage process can be used. thus, The specific processing device A~D is faulty, Or when manufacturing the entire line, More substrates W can be placed, The harvest is taken off from the manufacturing line at one time. which is, It has an effect of increasing the "buffering function of the manufacturing line" generated by the substrate temporary stage L 2 .  -45 - (43) (43) 1253433 [Embodiment 5] Next, The fifth embodiment will be described. however, In this embodiment, The components common to the constituent elements of the fourth embodiment described above, Is attached to the same symbol.  Figure 28 is a plan view showing the entire semiconductor manufacturing apparatus ui of the first embodiment. Figure 29 is a perspective view of the tray P, Fig. 30 is a plan view showing a state in which the tray p is placed at the substrate carrying-out position Ra of the cleaning device A. Fig. 31 is an enlarged plan view showing the substrate transfer device Ga. Figure 32 is a side cross-sectional view of the revolving conveyor device K, Figure 3 3 is the same front cross-sectional view.  First, the overall structure of the semiconductor manufacturing apparatus U1 will be described. As shown in Fig. 2, the semiconductor manufacturing apparatus U1, By: In the plane of view of the substrate, the processing means (the cleaning device A, the cleaning device A, the cleaning device A, which is disposed around the revolving conveyor device K in the form of a reduced arc shape, is arranged in the order of the processing of the substrate w. (: VD device B, Photographic device C, Etching device Inspection device E), And a substrate storage F for the substrate W before and after the storage process. and, Between the revolving conveyor device K and each of the processing devices A to E and the substrate storage F, A substrate transfer device Ga for performing the transfer of the substrate w between the two, Gb. And, The inside of the revolving conveyor device K corresponds to the position of each of the processing devices A to E, The temporary storage device L of the substrate W is disposed. By the above-described revolving conveyor device κ and each substrate transfer device Ga, Gb, The substrate conveying device s is configured.  In the substrate carrying device S of the present embodiment, Substrate W, It is by the week -46- (44) (44) 1253433 transfer conveyor device K, One piece is stored in the state of the tray P. This tray P, While being transported (advanced) by the action of the revolving conveyor device K, The position of each of the corresponding processing devices A to E is stopped.  and, By corresponding to those disposed substrate transfer devices G a , G b, The substrate W is carried out from the tray P, And moved into each processing device A~E. The substrate W that has been processed in each of the processing devices A to E, once again, By the substrate transfer device Ga, Gb is carried out from each of the processing devices A to E. Moved to an empty tray P (tray P in which the substrate W is not stored) that is waiting on the transfer conveyor device K, Move to the downstream side. after that, The position at which the substrate W is carried out from the tray P is indicated as "substrate carry-out position R a", The position at which the empty tray P is carried into the substrate W is indicated as "substrate carrying position Rb". In each processing device A~E, By performing the above process in sequence, After a predetermined process is applied to the substrate W, Stored in the substrate storage F. In Figure 28, The flow of the processing of the substrate W (moving line) is as indicated by an arrow.  First of all, Description tray P. As shown in Figure 29, The tray P of this embodiment, It is made of resin or a composite of resin and metal. The tray body 2 0 1, which constitutes the tray P It is a rectangular frame that can accommodate only the substrate W. In order to carry in and out the substrate W, on one side (with the substrate transfer device G a, G b opposite face), And the loading/unloading opening 2 〇 1 a is formed. In the two sides of the tray body 20 1 and the upper and lower surfaces, Three reinforcing plates composed of a vertical plate 202 and a horizontal plate 203, It is set at intervals of a predetermined interval. Similarly, On the upper and lower sides of the tray main body 210 and the almost central portion of the inside, Featuring: It is composed of a vertical plate 2 0 4 and a horizontal plate 2 0 5 , Other reinforcing plates perpendicular to each of the reinforcing plates described above. and, -47 - (45) (45)1253433 on both sides at the same height position of each of the vertical plates 2 Ο 2, Each of the support wires 2 0 6 is mounted in a tension attached state. The substrate w that is carried into the tray, It is supported by the support wires 2 0 6 . however, The arrow in Figure 29, This is the display loading/unloading direction Q of the substrate W.  Description of the revolving conveyor device K. As shown in Figure 30, The revolving conveyor device K of the present embodiment, It is a dynamic roller conveyor belt. which is,  Each device frame inside and outside 2 0 7 Between 2 0 8 , A plurality of substrates carrying rollers arranged in parallel at predetermined intervals are 2 0 9, It is installed to be rotatable. Each of the above-mentioned internal and external device frames 2 0 7 2 0 8 interval, It is slightly wider than the length of the tray P in the depth direction (longitudinal direction). Each tray P, Move it into and out of the opening 2 Ο 1 a, It is disposed in a state facing the outer casing (outer peripheral side) of the device frame 208. One end portion of each of the substrate carrying rollers 209 protrudes from the inner frame (inner peripheral side) of the device frame 207. And a lock gear 2 1 1 is respectively installed.  In each lock gear 2 1 1 , The lock has a lock 2 1 2 . therefore, Actuating the drive motor Μ to drive the rotary lock gear 2 1 1 All of the lock gears 2 1 1 are driven to rotate by the lock 2 1 2 . This result, Each of the substrate carrying rollers 2 0 9 will rotate in the same direction. The tray 载 placed thereon is carried (advanced).  On the outer device frame 208 a portion corresponding to the substrate carry-out position Ra and the substrate carrying position Rb, In order to move in and out of the substrate W, each is removed. And forming each cut portion 2 0 8 a, 2 0 8 b.  then, Describe the substrate lifting device Η. however, The substrate lifting device Η and the tray stopping device J described below, Corresponding to each processing device Α~E, And the structures of those are exactly the same, here, Only the substrate elevating device -48-(46) (46)1253433 disposed at the substrate carrying-out position Ra for the cleaning device A is placed and the tray stopping device J is placed. The substrate lifting device is It is like the third!  Figure to Figure 3, When the substrate w stored in the tray ρ is carried out, or, When the substrate W is carried into the empty tray p, The substrate w can be carried in and out from the state where the support wire 626 is lifted up. Further, it is disposed immediately below the substrate carrying-out position Ra and the substrate loading position Rb of the revolving conveyor device K. and, Four substrate lifting arms 2 1 3 that can enter the gap between the respective substrate carrying rollers 2 0 9 , It is installed to be lifted and lowered. On the upper surface of each of the substrate elevating arms 213, Installed with: While supporting the substrate W, The support roller 214 for guiding is introduced when the substrate W is carried in and out. Each support roller 214,  It is rotatably centered on the fulcrum axis provided in the horizontal direction perpendicular to the loading/unloading direction Q (refer to the third drawing) of the substrate W.  When the tray P in which the substrate W is housed is placed at the substrate carry-out position Ra, the substrate lift arms 213 rise. and, The gap between the respective substrate carrying rollers 2 〇 9 protrudes, Entering the tray P from the bottom surface of the tray body 210 The substrate W supported by the respective support wires 206 is lifted. thus, The substrate W that is received in the tray P, Will be separated from each support cable 2 0 6 By means of the substrate transfer device Ga, Gb was moved out. And, When the empty tray P is disposed at the substrate loading position R b , Each of the substrate lifting arms 2 1 3 also rises. Therefore, by the substrate transfer device Ga, The substrate W into which Gb is carried, Supporting rollers 214 supported by the substrate lifting device ,, It will not dry up with the support wires 2 0 6 of the tray P. and, When the entire substrate w is carried into the tray, Each of the substrate lifting arms 2 1 3 will descend. thus, The substrate W is supported by the respective support wires 206.  Then 'δ 明 托盘 托盘 托盘 托盘 。 。 。. As shown in Figure 3, In the 流 -49 ► (47) (47)1253433, the flow side of the substrate lifting device 正 directly below, Equipped with: By the revolving conveyor belt device, the tray Ρ to be transported is stopped at the tray stop device for the substrate carry-out position Ra, the tray stop device], Is to make the stopper plate 2 1 5 installed to rise and fall, By protruding from the substrate carrying rollers 2 〇 9 to each other, Stop the pallet P being transported. This tray stops the device j,  It is mounted on each of the device frames 207 inside and outside the revolving conveyor device K,  Actuating a proximity switch (not shown) at a predetermined position of 208, thereby Pallet P, It is a substrate carrying position Ra that is disposed in the revolving conveyor device κ in the positioned state.  then, Describe the substrate transfer device Ga, Gb. As shown in Figure 28,  Between each of the processing devices A to E and the revolving conveyor device κ, A substrate transfer device Ga, Gb. The substrate transfer device Ga, Gb, The substrate W in the conveyed tray P is transferred to the respective processing devices A to E by the revolving conveyor device K, The substrate W to be processed by each of the processing devices A to E is by the substrate parent device G a , G b is transferred to the revolving conveyor device K and transported to the processing devices A to E of the subsequent process.  In the semiconductor manufacturing apparatus U 1 of the present embodiment, Is equipped with: Two types of substrate transfer devices Ga corresponding to each of the processing devices A to E, Any of the Gb. here, For each of the processing apparatuses A to E, any of the substrate delivery devices Ga, Gb, It is determined by the configuration of the processing devices A to E. which is, Such as cleaning device A, Photographic device C and inspection device E, When the substrate W is processed in a normal environment, Is using: The vacuum absorbing device 2] 6 a is a substrate transfer device Ga provided at the front end portion of the pull-out arm 2 16 , Such as CVD device B or etching device D, When the substrate W is processed in a vacuum -50-(48) (48)1253433 environment, In the process, because of the need to close those moving in and out openings, Therefore, a substrate transfer device Gb provided with a pair of transfer arms 2 17 (refer to FIG. 28) is used.  As shown in Figures 30 to 32, the substrate parent device Ga, Gb 5 is guided by a pair of guiding rails 2 1 8 laid on the ground. It is possible to take a self-propelled along the carrying direction of the tray P. And, Those bases 219, It is possible to rotate in the horizontal plane. In the base 219 constituting the aforementioned substrate transfer device Ga, It is equipped with: The substrate W is sucked to carry in and out the pull-out arm 216, And a plurality of guide rollers 221 for guiding the substrate W loaded and unloaded. The aforementioned pull-out arm 216, Is for example, The drive shaft 222 drives the rotary worm shaft 2 2 3 to advance and retreat.  in this way, The transport substrate W accommodated in the tray P, It is at the substrate carry-out position Ra, By any substrate transfer device Ga, Gb was moved out, It is carried into each of the processing devices A to E. And, The substrate W to which the processing of each of the processing devices a to E is applied, Is by any substrate transfer device G a, G b was moved out, It is carried into an empty tray P which is placed in the substrate loading position Rb of the revolving conveyor apparatus K. and, It is transported to the substrate carrying-out position Ra of the processing apparatuses A to E corresponding to the subsequent processes. By repeating the above process in each of the processing devices a to E, The substrate W to which the predetermined treatment is applied can be carried in each of the processing apparatuses a to lb.  Next, the temporary storage device 1 of the substrate W will be described. As shown in Figure 2 and Figure 3, On the inside of the revolving conveyor device κ, Except for checking the position of each processing device A to D corresponding to the straightening E, It is a one-time storage device L equipped with a substrate w. This time, the storage device L, Is for the substrate W in the process of, for example, -51 - (49) (49)1253433, Failure of the processing devices a to E of the subsequent processes or maintenance checkpoints, When the substrate W cannot be transported to the downstream side, the tray P in which the substrate W is accommodated is stored in a timely manner. This time, the storage device L, By: A tray shed 224 for storing a plurality of trays p in a plurality of stages, And a tray loading/unloading device 22 for loading and unloading the tray p from the tray shed 224 is received. The tray loading/unloading device 22 5 is rotatably slidable in a horizontal plane, and is disposed opposite to the revolving conveyor device K and can be carried in and out of the tray P, And disposed opposite to the tray shed portion 224 and can be carried into and out of the tray P.  therefore, a portion of the device frame 2 07 inside the substrate carrying position Rb of the epitaxial conveyor device K, In order to be carried in and out of the tray P, it is cut off and a notch portion 2 0 7 a is formed. In Figure 30, The flow (moving line) of the processing of loading the pallet P from the pallet shed 2 2 4, It is displayed by the arrow of a little lock line. however, In the semiconductor manufacturing apparatus U of the present embodiment. In the case where the substrate w in which the inspection of the inspection device E has been completed is directly accommodated in the substrate storage F, the temporary storage device L for the inspection device E is not provided (refer to Fig. 28). Next, the action of the substrate transfer device S will be described. Here, the operation of the substrate transfer device S of each of the processing devices A to E (the transfer of the substrate P between the transfer conveyor device κ and the substrate W between the respective processing devices A to E) is performed for any of the processing devices. Since A to E are almost the same, in this embodiment, only the transfer function of the substrate w of the cleaning device A will be described. As shown in Fig. 28, the device w of the previous process is carried into the substrate w of the substrate storage F by a substrate transport vehicle (not shown), and is only transferred by the substrate transfer device - 52 - (50) (50) 1253433 G a is carried out and stored in an empty tray 待机 that is in standby on the revolving conveyor device κ. In Fig. 28, the tray 收纳 in which the substrate W is housed is indicated by a solid line, and the tray 空 is displayed by the two-point lock line. In this state, the drive motor is activated. Each of the substrate conveyance rollers 209 is driven to rotate, and the tray Ρ is conveyed toward the downstream side. By the action of the proximity switch (not shown), the tray stop device J is actuated and the stopper pallet 2 15 is raised, and the upper end portion thereof protrudes from the gap between the respective substrate conveyance rollers 2000. Thereby, in the epicyclic belt device Κ, the tray Ρ is positioned and stopped at the substrate carry-out position Ra corresponding to the cleaning device A. As shown in Figs. 31 to 3, when the tray P is stopped at the substrate carry-out position Ra, the substrate lifting device 作 is actuated to raise the lift arms 213. Thereby, the substrate W accommodated in the tray 会 is lifted and detached from each of the support wires 206. The drawing arm 2 16 constituting the substrate delivery device Ga is advanced, and the distal end portion thereof is disposed directly below the leading end portion of the substrate W. The vacuum suction device 216a is actuated to suck the pull-out arm 216 and the substrate W, and is thus retracted. The substrate W pulled out from the tray P is supported by the respective guide rollers 221 constituting the substrate transfer device Ga, and is disposed on the upper surface of the substrate 2 1 9 . Then, the base 2 1 9 is rotated and disposed facing the loading opening 2 26 of the cleaning device A. The pull-out arm 2 16 advances, and the substrate W is carried into the cleaning device A through the carry-in opening 226. As shown in Fig. 30, during the period in which the substrate W is cleaned by the cleaning device A, the substrate transfer device Ga is guided by a pair of guide tracks 2, 8 and washed. The carry-out openings 2 27 of the apparatus A are arranged facing each other. When the stopper plate 2 15 of the tray stop device J is lowered, the drive -53-(51) (51)1253433 is actuated to move the tray p toward the downstream side, and stops at the substrate carry-in position Rb. . The substrate w that has been processed by the cleaning device A is transferred to the substrate transfer device ga by the carry-out opening 2 27 of the cleaning device A, and is carried into the space at the substrate loading position Rb of the peripheral conveyor device K. Tray P. The function of the substrate transfer device Ga at this time is opposite to the process of carrying out the substrate W accommodated in the tray P. After that, the c VD apparatus B, the photographing apparatus C' etching apparatus D, and the inspection apparatus E perform the same action to transport the substrate W, and sequentially apply predetermined processing (single sheet processing) to one substrate w. It is stored in the substrate storage F. Next, the processing time of the substrate W of the substrate transfer device S will be described in comparison with the conventional batch processing of the Bay (B A Y ) method. Fig. 34 is an explanatory time chart showing the flow of the substrate W in the case where the substrate w in the middle of the processing is normally processed by the single-chip processing and the batch processing. However, Figs. 4 and 3 are an explanatory time chart for understanding the normal flow of the substrate W, but do not correspond to the processing of the foregoing embodiment, but have a reduced number of processes. Hereinafter, when one substrate W is displayed, "丨" to "n" are added to the symbols. However, the processing time (takt time) of each processing device is set to be almost the same. In the monolithic process of the present invention, each of the substrates (W 1 to Wn ) is processed by a processing device that sets the tact time T 1 into the process (I), and then the processing device of the process (11) performs the process. Further, the substrate W taken out from the processing device of the process (π) is processed by the processing device of the input process (III). Thus, when the substrate W is normally flowing (in other words, -54 - (52) 1253433, each processing device has no fault occurrence), each of the substrates (W 1 to W η ) flows in a downward flow process in sequence. Each process is processed with almost the same set tact time Τ 1.

具體說明以上的情況。本發明的情況，如第3 4圖所 示，第1枚的基板W1投入過程（I )的話，藉由該過程 (I )的處理裝置，對於基板 W 1施加預定的處理。此處 理結束的話，該基板W1，是藉由周轉輸送帶裝置Κ被搬 運，投入過程（II )的處理裝置。隨此，讓第2枚的基板 W2投入過程（I )的處理裝置。如此，在本發明中，基板 W1〜W3，是分別1枚1枚地投入各過程（I ) 、 （ II )、The above situation will be specifically described. In the case of the present invention, as shown in Fig. 34, when the first substrate W1 is loaded into the process (I), a predetermined process is applied to the substrate W1 by the processing device of the process (I). At the end of this process, the substrate W1 is transported by the revolving conveyor device and fed into the processing device of the process (II). Then, the second substrate W2 is placed in the processing device of the process (I). As described above, in the present invention, the substrates W1 to W3 are put into each of the processes (I) and (II) one by one.

(ΠΙ)的處理（單片處理）。對於此，在習知的海灣（ BAY )方式中，多數枚的基板W，是因爲在各過程進行整 批處理，所以各過程的處理時間變長。但是，本發明的情 況’各基板 W1〜W3的 TAT(T2)，與海灣（BAY)方 式的情況的T A T ( Τ 1 2 )相比較，非常短。且，本發明的 各基板 W】〜W 3的節拍時間 丁 1，與海灣（B A Y )方式的 節拍時間T 1 1相比較，也會變短。 且，如第3 5圖所示的圖表，是顯示對於本發明的單 片處理及分批處理的時間的基板W的處理枚數的關係。 在此圖中，實線2 2 8，是顯示本發明的單片處理的情況， 二點鎖線2 2 9，是顯示習知的海灣（B A Y )方式的情況。 但是，本圖，從將基板W投入製造線後直到成爲完成品 取出爲止所需要的每1枚基板W的總處理時間，假定單 片處理及分批處理是相同的情況。在習知的海灣（B A Y ) -55 - (53) (53)1253433 方式中’因爲整批處理例如2 〇枚的基板w，若只經過 T AT ( T 1 2 )的話，無法獲得完成品的基板|。但是，本 發明的情況，因爲是1枚1枚地處理的形態，所以只要經 過1枚分的T A T (了 2 )就可生産]枚的基板w。 上述結果，在製造線內成爲製作品（未完成品）滯溜 的基板W (製作在庫）的數量也減少，少量運轉資金即可 ’因爲對於投下資本可短時間回收，所以具有資本周轉率 佳等的經理上的優點。且，因爲藉由製作在庫的減少，所 以少量的製造線內的基板W的保管空間即可，而有無麈 室的建設費便宜的優點。特別是，在最近，基板w的尺 寸變大，每1枚基板w的單價也變高，上述TAT的短縮 或製作在庫的減少，可產生大的利益。進一步，交貨期縮 短’就可對應短交貨期，或者是極短交貨期。 接著’說明特定的處理裝置故障的情況。第3 6圖， 是爲了容易理解特定的處理裝置一時故障的情況的基板W 的流程用的意示性的時間圖表。在過程（Π)結束了基板 w 3的處理後，過程（丨的處理裝置故障的情況時，在 故障後，數枚（4枚）的基板w 4〜W 7，是以設定節拍時 間T1進行過程（I )的處理，接下來的數枚（3枚）的基 板W 8〜W 1 0，是爲了因過程（！〗）的處理裝置的停止所 產生的處理調整而以比設定節拍時間T 1長的節拍時間（ T ] + /3 )進行處理。這些複數枚的基板W4〜W 1 〇，即使後 續的基板（例如，對於基板W 4是基板W 5 )已結束了過 程（I )的處理後，因無法投入過程（11 )，所以依序被 -56- (54) (54)1253433 搬入並收納於過程（I )及過程（11 )之間的主基板片匣 10 1。 第3枚的基板W3從過程（II )的處理結束直到經過 停止時間T4後，使過程（Π )的處理裝置再開的話，被 收納於主基板片匣1 0 1的複數枚的基板 W4〜W 1 0，是先 從被搬入的基板依序搬出，以設定節拍時間T 1投入過程 (II )的處理裝置。而且，以最終比設定節拍時間T 1大 的節拍時間（T1 +点），使包含被投入過程（I )的基板 W 1 1的接著的基板w 1 2的之後的基板，是依序以設定的 節拍時間T 1投入過程（I )，在全過程平順地連續處理。 [實施例6 ] 如第2 8圖所示的第5實施例的半導體製造裝置u 1， 是在基板W只成形一層的半導體元件用的情況。但是， 此半導體製造裝置U1，是在基板W成形多層的半導體元 件也無妨。例如，如第3 7圖所示的第6實施例的半導體 製造裝置U2，是在基板成形三層的半導體元件的情況。 此實施例的情況，在周轉輸送帶裝置K的周圍，成形第1 至第3各層用的處理裝置A〜E是成爲一群，依其過程順 序配設。即，藉由第1處理裝置群A 1〜E 1，在基板W形 成第I層的成形，藉由第2處理裝置群A2〜E2，在基板 W形成第2層的成形，藉由第3處理裝置群A3〜E3，在 基板W形成第3層的成形。且，在最終過程的部分，抽 取檢查裝置2 3 ]是配設成鄰接第3處理裝置群a 3〜E 3的 -57- (55) (55)1253433 檢查裝置E3。而且，在此實施例的半導體製造裝置U2中 ’在周轉輸送帶裝置K的內側，配設有支線搬運裝置V。 此支線搬運裝置V，是具備：在周轉輸送帶裝置K的內側 並沿著半導體製造裝置U2的長度方向舖設的支線搬運路 2 3 2、及可往復移動地裝設於前述支線搬運路2 3 2的支線 搬運車2 3 3。 藉由前述支線搬運車2 3 3，可將基板W從任一的處理 裝置A〜E朝其他的處理裝置a〜E搬運。如第37圖所示 的半導體製造裝置U 2的情況中，在第1處理裝置群的蝕 刻裝置D 1的處理已結束的基板W被抽取，藉由支線搬運 車233’搬運至抽取檢查裝置231。在前述抽取檢查裝置 23 1的檢查已結束的基板w，是再度藉由支線搬運車233 ’通過與周轉輸送帶裝置K不同的搬運路徑，被搬運至 第2處理裝置群的洗淨裝置A2，並施加之後的處理。且 ，藉由前述支線搬運車2 3 3，當任一的處理裝置 A〜E故 障時，由其他的處理裝置替代進行處理，而將基板W搬 運至前述其他的處理裝置也可能。此半導體製造裝置U2 的情況，可對於處理途中的基板W施加預定的附帶處理 (例如，抽取檢查等），而具有基板W的處理效率提高 的優點。 此支線搬運車2 3 3，即使是被收納於托盤P的基板W 直接搬運的形態，或考是，只搬運已從前述托盤P取出的 基板W的形態也無妨。且，上述實施例的半導體製造裝 置U2的支線搬運裝置v，雖是支線搬運車2 3 3 ,但是例 -58 - (56) (56)1253433 如，機械手臂也無妨。 如此3輸送帶裝置是周轉輸送帶裝置K的情況時， 因可在其周圍配設各處理裝置A〜E，所以整體的設置面 積小，無塵室的建設費可以便宜。 在上述的實施例5、實施例6，基板W，是在被收納 於托盤P的狀態下被搬運。若將前述基板w，直接載置於 各基板搬運滾子2 0 9的狀態下被搬運的話，基板w的與 基板搬運滾子2 0 9的接觸面有會被污染、損瘍的可能。但 是，在本實施例中，基板W因爲被收納於托盤P，所以無 上述問題發生的可能。 在實施例5、實施例6的半導體製造裝置U1、U2中 ，在周轉輸送帶裝置K的周圍配設各處理裝置A〜E。因 此，供設置各半導體製造裝置U 1、U2用無塵室的敷地面 積可以減少。但是，此輸送帶裝置，不是周轉形狀，例如 一直線形狀也無妨。且，各實施例的周轉輸送帶裝置K， 是動力式的滾子輸送帶。但是，別的形態的輸送帶裝置， 例如，托盤P是藉由從舖設於頂棚的輸送帶軌道吊下的吊 車搬運的形態的輸送帶裝置，或組合將托盤P朝縱方向搬 運用的輸送帶裝置、及相同地朝橫方向搬運用的輸送帶裝 置而形成周轉構造也無妨。 以上，雖說明本發明的較佳實施例，但是本發明不限 定於這些實施例。在未脫離本發明的宗旨的範圍內，結構 的附加、省略、置換及其他的變更是可能的。本發明並非 藉由前述說明限定，只由添付的申請專利範圍所限定。 -59- (57) (57)1253433 (產業上的利用可能性） 本發明，是對於依序經過多數過程並在基板上製造半 導體元件的半導體製造過程最佳。 【圖式簡單說明】 [第1圖]本發明的第1實施例的基板搬入搬出裝置 φ 1 A 1的整體立體圖。 [第2圖]基板片匣1C的立體圖。 [第3圖]第1實施例的基板搬入搬出裝置1A1的前視 圖。 [第4圖]一對的基板昇降元件1 u 1的各基板昇降臂 / 1 4，已進入基板片匣1 C內的狀態的平面圖。 [第5圖]基板拉出裝置1B的平面圖。 [第6圖]相同的側面剖面圖。 φ [第7圖]顯不浮起基板1 G的狀態的圖。 [第8圖]顯示藉由各支撐滾子3 3抬起基板1 G的狀飯 的圖。 [第9圖]第2實施例的基板搬入搬出裝置1 A2的前視 圖。 [第10圖]第3實施例的基板搬入搬出裝置1 A3的前 視圖。 [第1 ]圖]顯示被收納於習知的基板片匣1 C，內的基板 (58) (58)1253433 1 G的彎曲狀態的圖。 [第1 2圖]顯示藉由附滾子框架5 4搬出被收納於習知 的基板片匣1 C ”的基板1 G的狀態的圖。 [第1 3圖]第4實施例的半導體製造裝置u的整體平 面圖。 [第14圖]相同的前視圖。 [弟15圖]頒不弟1群的處理裝置a〜D的正規搬運路 的基板W的流程的平面圖。 [弟16圖]弟1洗淨裝置All及CVD裝置B1的平面 圖。 [第1 7圖]顯示從主基板片匣1 0 1搬出基板w的狀態 的正面剖面圖。 [第18圖]顯示第1群的處理裝置A〜D的支管搬運路 的基板W的流程的平面圖。 [第1 9圖]收納於搬運用基板片匣1 04的基板w，被 搬入第1洗淨裝置Α Π的狀態的作用說明圖。 [第2 0圖]從第1洗淨裝置A 1 1排出的基板W，被收 納於主基板片匣]〇1的狀態的作用說明圖。 [第2 1圖]收納於主基板片匣1 〇 1的基板W，被搬入 CVD裝置B 1的狀態的作用說明圖。 [第22圖]顯示處理途中的基板W是藉由單片處理及 分批處理的正常處理的情況時的基板w的流程的意示性 的時間圖表。 [第2 3圖]顯示對於本發明的單片處理及分批處理及 -61 - (59) 1253433 時間的基板W的處理枚數的關係的圖。 [第24圖]顯示處理途中的基板W被抽取情況的基板 W的流程的意示性的時間圖表。 [第2 5圖]顯示特定的處理裝置故障的情況時的基板 W的流程的意示性的時間圖表。 [第2 6圖]顯示半導體元件成形於基板W的過程的圖(ΠΙ) processing (single processing). In this regard, in the conventional bay (BAY) method, the majority of the substrates W are processed in a batch process in each process, so the processing time of each process becomes long. However, in the case of the present invention, the TAT (T2) of each of the substrates W1 to W3 is extremely short compared to the T A T ( Τ 1 2 ) in the case of the Bay (BAY) mode. Further, the tact time D1 of each of the substrates W to W3 of the present invention is shorter than the tact time T 1 1 of the bay (B A Y ) mode. Further, the graph shown in Fig. 5 is a relationship showing the number of processes of the substrate W at the time of the single-chip processing and the batch processing of the present invention. In the figure, the solid line 2 2 8 is a case where the single-chip processing of the present invention is shown, and the two-point lock line 2 2 9 is a case where the conventional bay (B A Y ) method is displayed. However, in the figure, the total processing time per one substrate W required after the substrate W is placed in the manufacturing line until the finished product is taken out is assumed to be the same in the single chip processing and the batch processing. In the conventional bay (BAY) -55 - (53) (53) 1253433 mode, 'because the whole batch of processing, for example, 2 〇 of the substrate w, if only T AT (T 1 2 ) is passed, the finished product cannot be obtained. Substrate|. However, in the case of the present invention, since it is processed in one piece, the substrate w can be produced as long as one part of T A T (2) is passed. As a result of the above, the number of substrates W (produced in the library) that are stagnation in the manufacturing line (the unfinished product) is also reduced, and a small amount of operating capital can be used because it can be recovered for a short period of time, so it has a good capital turnover rate. The advantages of the manager. Further, since the storage space is reduced, a small amount of the storage space of the substrate W in the manufacturing line can be used, and there is an advantage that the construction cost of the chamber is low. In particular, recently, the size of the substrate w has increased, and the unit price per one substrate w has also increased, and the shortening of the TAT or the reduction in the production of the TTA has a large advantage. Further, the shortened delivery time can correspond to a short delivery time or a very short delivery time. Next, the case of a specific processing device failure will be described. Fig. 3 is an explanatory time chart for the flow of the substrate W in order to easily understand the case where the specific processing device is in a state of failure. After the process (Π) ends the processing of the substrate w 3, in the case where the processing device of the crucible is broken, after the failure, a plurality of (four) substrates w 4 to W 7 are set at the set tact time T1. In the process of the process (I), the next several (three) substrates W 8 to W 1 0 are set to the tact time T for the process adjustment by the stop of the processing device of the process (!). A long tact time (T] + /3) is processed. The plurality of substrates W4 to W1 〇, even if the subsequent substrate (for example, the substrate W 4 is the substrate W 5 ) has finished the process (I) After the process, since the process (11) cannot be input, the main substrate sheet 10 1 that is carried in the process between (I) and process (11) by the -56-(54)(54)1253433 is sequentially placed. When the processing of the process (II) is completed from the end of the process of the process (II) until the process time (T) has elapsed, the substrate W3 is placed in the plurality of substrates W4 to W1 0 of the main substrate sheet 匣1 0 1 . , the processing is carried out in order from the substrate to be loaded in order to set the tact time T 1 into the process (II). Further, with the tact time (T1 + point) which is finally larger than the set tact time T 1 , the subsequent substrate including the substrate w 1 2 of the substrate W 1 1 to which the process (I ) is applied is sequentially The set tact time T 1 is input to the process (I), and is continuously processed smoothly in the entire process. [Embodiment 6] The semiconductor manufacturing apparatus u1 of the fifth embodiment shown in Fig. 28 is formed only on the substrate W. In the case of a semiconductor element of one layer, the semiconductor manufacturing apparatus U1 may be a semiconductor element in which a plurality of layers are formed on the substrate W. For example, the semiconductor manufacturing apparatus U2 of the sixth embodiment shown in Fig. 3 is In the case of the semiconductor element in which three layers are formed on the substrate. In the case of this embodiment, the processing apparatuses A to E for forming the first to third layers are formed in a group around the epitaxial conveyor device K, and are arranged in the order of the processes. In other words, the first processing layer is formed on the substrate W by the first processing device groups A1 to E1, and the second layer is formed on the substrate W by the second processing device groups A2 to E2, and the third layer is formed by the third processing device group A1 to E2. Processing device groups A3 to E3 form a third layer on the substrate W Further, in the final process, the extraction inspection device 2 3 ] is a -57-(55) (55) 1253433 inspection device E3 disposed adjacent to the third processing device group a 3 to E 3 . In the semiconductor manufacturing apparatus U2 of the example, the branch conveying apparatus V is disposed inside the revolving conveyor apparatus K. The branch conveying apparatus V is provided inside the revolving conveyor apparatus K along the semiconductor manufacturing apparatus U2. A branch conveyance path 2 3 2 that is laid in the longitudinal direction, and a branch conveyance cart 2 3 3 that is reciprocally mounted on the branch conveyance path 2 3 2 . The substrate W can be transported from any of the processing apparatuses A to E to the other processing apparatuses a to E by the above-described branch transporter 23 3 . In the case of the semiconductor manufacturing apparatus U 2 shown in FIG. 37, the substrate W that has been processed by the etching apparatus D1 of the first processing apparatus group is extracted, and is transported to the extraction inspection apparatus 231 by the branch transportation vehicle 233'. . The substrate w that has been inspected by the extraction inspection device 23 1 is again transported to the cleaning device A2 of the second processing device group by the branch conveyance cart 233 ′ through a different conveyance path from the revolving conveyor device K. And apply the subsequent processing. Further, when the processing units A to E are in trouble, the processing unit A to E may be replaced by another processing unit, and the substrate W may be transported to the other processing unit. In the case of the semiconductor manufacturing apparatus U2, a predetermined incidental process (e.g., extraction inspection or the like) can be applied to the substrate W in the middle of the process, and the processing efficiency of the substrate W can be improved. In the form of the substrate W accommodated directly on the tray P, it is possible to transport only the substrate W that has been taken out from the tray P. Further, although the branch line transport device v of the semiconductor manufacturing apparatus U2 of the above-described embodiment is the branch line transport vehicle 23 3 , the example - 58 - (56) (56) 1253433 may be a robot arm. When the conveyor belt device is the case of the revolving conveyor device K, since the respective processing devices A to E can be disposed around the conveyor device, the overall installation area is small, and the construction cost of the clean room can be reduced. In the fifth and sixth embodiments described above, the substrate W is conveyed while being stored in the tray P. When the substrate w is directly placed in the state in which the substrate transfer rollers are placed in the state of the substrate, the contact surface of the substrate w with the substrate conveyance roller 209 may be contaminated or damaged. However, in the present embodiment, since the substrate W is housed in the tray P, there is no possibility that the above problem occurs. In the semiconductor manufacturing apparatuses U1 and U2 of the fifth and sixth embodiments, the respective processing apparatuses A to E are disposed around the revolving conveyor apparatus K. Therefore, the floor space for providing the clean room for each of the semiconductor manufacturing apparatuses U1 and U2 can be reduced. However, this conveyor belt device is not a revolving shape, and for example, a straight shape may be used. Further, the revolving conveyor device K of each embodiment is a power type roller conveyor belt. However, in another type of conveyor belt device, for example, the pallet P is a conveyor belt device that is transported by a crane that is suspended from a conveyor belt rail that is laid on a ceiling, or a conveyor belt that transports the pallet P in the vertical direction in combination. It is also possible to form a revolving structure by means of a device and a conveyor belt device that is conveyed in the same direction in the lateral direction. The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments. Additions, omissions, substitutions, and other modifications of the structure are possible without departing from the scope of the invention. The invention is not limited by the foregoing description, but only by the scope of the appended claims. -59- (57) (57)1253433 (Industrial Applicability) The present invention is optimized for a semiconductor manufacturing process in which a plurality of processes are sequentially performed to fabricate a semiconductor element on a substrate. [Brief Description of the Drawings] [Fig. 1] An overall perspective view of a substrate loading/unloading device φ 1 A 1 according to a first embodiment of the present invention. [Fig. 2] A perspective view of the substrate piece 匣 1C. [Fig. 3] A front view of the substrate loading/unloading device 1A1 of the first embodiment. [Fig. 4] A plan view showing a state in which the respective substrate elevating arms / 14 of the pair of substrate elevating elements 1 u 1 have entered the substrate sheet 匣 1 C. [Fig. 5] A plan view of the substrate pull-out device 1B. [Fig. 6] The same side sectional view. φ [Fig. 7] A diagram showing a state in which the substrate 1 G is not floated. [Fig. 8] A view showing a rice having the substrate 1 G lifted by the respective support rollers 3 3 . [Fig. 9] A front view of the substrate loading/unloading device 1 A2 of the second embodiment. Fig. 10 is a front view of the substrate loading/unloading device 1 A3 of the third embodiment. [Fig. 1] A view showing a curved state of a substrate (58) (58) 1253433 1 G accommodated in a conventional substrate piece 匣 1 C. [Fig. 1 2] A view showing a state in which the substrate 1 G accommodated in the conventional substrate piece 匣 1 C ′ is carried out by the roller frame 5 4 . [Fig. 1] The semiconductor manufacturing of the fourth embodiment The whole plan view of the device u. [Fig. 14] The same front view. [Department 15] A plan view showing the flow of the substrate W of the normal conveyance path of the processing devices a to D of one group. 1 is a plan view showing a state in which the substrate w is carried out from the main substrate sheet 10 1 1 [Fig. 18] shows the processing device A of the first group. A plan view of the flow of the substrate W of the pipe-transporting path of the branching of the first cleaning device. [FIG. 1] FIG. 1 is a view explaining the operation of the substrate w stored in the transporting substrate sheet 匣104 in the state of being carried into the first cleaning device 。. Fig. 20 is a view explaining the operation of the substrate W discharged from the first cleaning device A 1 1 in the state of being stored in the main substrate sheet 〇 1 [Fig. 2] is housed in the main substrate sheet 匣 1 〇 The operation diagram of the state in which the substrate W of 1 is carried in the CVD apparatus B1. [22] The normal processing of the substrate W in the middle of processing by the single-chip processing and the batch processing is shown. The time chart of the flow of the substrate w in the case of the case. [Fig. 2 3] shows the number of processed substrates and the batch processing of the substrate of the present invention and -61 - (59) 1253433 [Fig. 24] An explanatory time chart showing the flow of the substrate W in the case where the substrate W is being processed in the process. [Fig. 25] shows the substrate W in the case where the specific processing device fails. An intent time chart of the flow. [Fig. 26] A diagram showing a process in which a semiconductor element is formed on a substrate W

[第27圖]由習知的海灣（BAY)方式所產生的半導 體製造裝置U的整體平面圖。 [第28圖]第5實施例的半導體製造裝置U1的整體平 面圖。 [第29圖]托盤P的立體圖。 [第3 0圖]托盤P是配置在對於洗淨裝置A的基板搬 出位置Ra的狀態的平面圖。 [第31圖]基板交接裝置Ga的擴大平面圖。[Fig. 27] An overall plan view of a semiconductor manufacturing apparatus U produced by a conventional bay (BAY) method. [Fig. 28] An overall plan view of a semiconductor manufacturing apparatus U1 of the fifth embodiment. [Fig. 29] A perspective view of the tray P. [Fig. 30] The tray P is a plan view showing a state in which the substrate P is placed at the substrate carrying position Ra of the cleaning device A. [31] An enlarged plan view of the substrate transfer device Ga.

[第3 2圖]周轉輸送帶裝置K的側面剖面圖。 [第33圖]相同的正面剖面圖。 [第3 4圖]顯示處理途中的基板W是藉由單片處理及 分批處理的正常處理的情況時的基板W的流程的意示性 的時間圖表。 [第3 5圖]顯示對於本發明的單片處理及分批處理及 時間的基板W的處理枚數的關係的圖。 [第3 6圖]顯不特定的處理裝置故障的情況時的基板 W的流程的意示性的時間圖表。 -62 - (60) 1253433 [第3 7圖]第6實施例的半導體製造裝置U2的整體平 面圖。 [主要元件符號說明】 A洗淨裝置（處理裝置）[Fig. 3] A side cross-sectional view of the revolving conveyor device K. [Fig. 33] The same front sectional view. [Fig. 34] An intentional time chart showing the flow of the substrate W in the case where the substrate W in the middle of processing is a normal process by single chip processing or batch processing. [Fig. 3] Fig. 3 is a view showing the relationship between the number of processes of the substrate W and the processing of the batch processing and the time of the substrate W of the present invention. [Embodiment 3] An intentional time chart of the flow of the substrate W when a specific processing device failure is indicated. -62 - (60) 1253433 [Fig. 3] Fig. 3 is an overall plan view of the semiconductor manufacturing apparatus U2 of the sixth embodiment. [Main component symbol description] A cleaning device (processing device)

All第1洗淨裝置 A 1 2第2洗淨裝置All 1st cleaning device A 1 2 2nd cleaning device

A2洗淨裝置 A21第1洗淨裝置 A22第2洗淨裝置 A31第1洗淨裝置 A32第2洗淨裝置 A4洗淨裝置 A5 洗淨裝置 B CVD裝置（處理裝置）A2 cleaning device A21 first cleaning device A22 second cleaning device A31 first cleaning device A32 second cleaning device A4 cleaning device A5 cleaning device B CVD device (processing device)

B1 CVD裝置 B21 第1CVD裝置 B22 第2CVD裝置 B3 CVD裝置 B 4 C V D裝置 B5 CVD裝置 C照像裝置（處理裝置） C 1照像裝置 C2照像裝置 -63- (61) (61)1253433 C 3照像裝置 C4照像裝置 C 5照像裝置 D蝕刻裝置（處理裝置） D 1蝕刻裝置 D2蝕刻裝置 D3蝕刻裝置 D4蝕刻裝置 D 5蝕刻裝置 E檢查裝置（處理裝置） Ea基板交接裝置 Eb基板交接裝置 F基板保管庫 Ga基板交接裝置 Gb基板交接裝置 Η基板昇降裝置 J托盤停止裝置 Κ周轉輸送帶裝置 L 一時保管裝置 L〗基板交接列 L2基板暫置台列 L3支管搬運列 Μ驅動馬達 M a檢查裝置 -64 - (62) 1253433 P 托盤B1 CVD apparatus B21 first CVD apparatus B22 second CVD apparatus B3 CVD apparatus B 4 CVD apparatus B5 CVD apparatus C photographic apparatus (processing apparatus) C 1 photographic apparatus C2 photographic apparatus -63- (61) (61) 1253433 C 3 Photographic device C4 Photographic device C 5 Photographic device D etching device (processing device) D 1 etching device D2 etching device D3 etching device D4 etching device D 5 etching device E inspection device (processing device) Ea substrate transfer device Eb substrate transfer Device F substrate storage Ga substrate delivery device Gb substrate transfer device Η substrate lifting device J tray stop device Κ turnover conveyor device L one time storage device L 〖 substrate transfer column L2 substrate temporary stage L3 branch pipe train Μ drive motor M a check Device -64 - (62) 1253433 P tray

P ]第1層成形過程 P 2 第2層成形過程 P 3第3層成形過程 P4第4層成形過程 P 5第5層成形過程 Q 搬入搬出方向 Q 裝置配列方向 Ra各行走範圍 Ra基板搬出位置 Rb基板搬入位置 S基板搬運裝置 T1節拍時間 τ 1 2製品製作時間 T 1 1節拍時間 T 3檢查時間 丁4停止時間 U半導體製造裝置 U1半導體製造裝置 U2半導體製造裝置 W 基板 1片匣本體 1 A 1基板搬入搬出裝置 ]A 2基板搬入搬出裝置 -65 - (63) (63)1253433 I A 3 基板搬入搬出裝置 1 B 基板拉出裝置 1 C基板片匣 1 C 1基板片匣 1 C ’ |基板片匣 1 F a、1 F b 側面 1G基板 1 Η棚間距（預定間隔） 1 Κ搬入搬出開口 1Ρ 搬入搬出方向 1 Q 左右方向 1R棚 1R’棚 1 U 1基板昇降元件 】U2基板昇降元件 1 U 3基板昇降元件 1 V 壓力空氣源 2縱板 3 橫板 4拉線（支撐材） 5 底基 6可動框架（昇降板支撐構件） 7導引軌道 S導引體 - 66- (64) 1253433 9 蝸軸安裝溝 1 〇 主基板片匣 1 1 蝸軸 1 2 托架 1 3 水平移動馬達 1 4基板昇降臂 1 4 a遊隙部P] first layer forming process P 2 second layer forming process P 3 third layer forming process P4 fourth layer forming process P 5 fifth layer forming process Q loading and unloading direction Q device arrangement direction Ra each traveling range Ra substrate carrying out position Rb substrate loading position S substrate conveyance device T1 tact time τ 1 2 product preparation time T 1 1 tact time T 3 inspection time D 4 stop time U semiconductor manufacturing apparatus U1 semiconductor manufacturing apparatus U2 semiconductor manufacturing apparatus W substrate 1 sheet body 1 A 1 substrate loading/unloading device] A 2 substrate loading/unloading device-65 - (63) (63) 12534343 IA 3 substrate loading/unloading device 1 B substrate pulling device 1 C substrate sheet C 1 C 1 substrate sheet 匣 1 C ' | substrate Sheet 匣 1 F a, 1 F b Side 1G substrate 1 Η shed spacing (predetermined interval) 1 Κ Loading and unloading opening 1 搬 Loading and unloading direction 1 Q Left and right direction 1R Shed 1R' Shed 1 U 1 Substrate lifting element U2 Substrate lifting element 1 U 3 base plate lifting element 1 V pressure air source 2 vertical plate 3 horizontal plate 4 wire (support material) 5 base 6 movable frame (lifting plate support member) 7 guide track S guide body - 66- (64) 1253433 9 worm shaft installation groove 1 〇 Main substrate sheet 匣 1 1 worm shaft 1 2 bracket 1 3 horizontal movement motor 1 4 base plate lifting arm 1 4 a clearance

15 導引軌道 16 導引體 17 蝸軸 1 8 馬達安裝板 1 9 昇降馬達 2 1空氣浮上元件（基板昇降手段） 21a 空氣噴出口15 Guide rail 16 Guide body 17 Worm shaft 1 8 Motor mounting plate 1 9 Lift motor 2 1 Air floating element (substrate lifting method) 21a Air outlet

2 1 a 噴出口 22基板載置台 23 導引滾子 24 導引軌道 25導引體 2 6基板拉出臂 2 6 a真空吸著襯墊 2 7蝸軸安裝溝 2 8蝸軸 2 9 螺帽體 -67- (65) 1253433 3 1 托架 3 2 拉出馬達 3 3 支撐滾子（基板昇降手段） 3 4基板昇降臂（基板昇降板） 3 5基板昇降臂（基板昇降板）2 1 a discharge port 22 substrate mounting table 23 guide roller 24 guide rail 25 guide body 2 6 substrate pull-out arm 2 6 a vacuum suction pad 2 7 worm shaft mounting groove 2 8 worm shaft 2 9 nut Body-67- (65) 1253433 3 1 Bracket 3 2 Pull out motor 3 3 Support roller (substrate lifting means) 3 4 Substrate lifting arm (substrate lifting plate) 3 5 Substrate lifting arm (substrate lifting plate)

5 1支撐構件 5 2基板拉出臂 5 3 拉線 5 4 附滾子框架 101主基板片匣（第1暫置台） 102檢查用基板片匣（第2暫置台） 103 支管搬運車（基板支管搬運車） 104搬運用基板片匣 1 〇 5 軌道搬運車 106a 底基5 1 support member 5 2 substrate pull-out arm 5 3 pull wire 5 4 main frame piece with roller frame 101 (first temporary stage) 102 substrate piece for inspection (second temporary stage) 103 branch pipe (substrate branch) Pallet truck) 104 transporting substrate 匣1 〇5 rail transporter 106a base

106b 底基 1 〇 7 真空吸著裝置 1 〇 8 支撐滾子 1 〇 9 支撐臂 111導引軌道 1 1 2 拉線 113基板收納棚 1 ] 4昇降臂 ]1 5滾子附加框架 -68- (66) 1253433106b Substrate 1 〇7 Vacuum suction device 1 〇8 Support roller 1 〇9 Support arm 111 Guide rail 1 1 2 Pull wire 113 Substrate storage shed 1 ] 4 Lift arm]1 5 Roller additional frame -68- ( 66) 1253433

]16 導引軌道 ]1 7 片匣交接裝置 1 1 8 搬入開口 Π 9搬出開口 1 2 1搬入開口 1 2 2 實線 1 2 3 二點鎖線 1 5 1 氧化膜 1 5 2 感光劑 1 5 3 搬運車 2 0 1 托盤本體]16 Guide track]1 7 piece transfer device 1 1 8 Carrying in opening Π 9 Carrying out opening 1 2 1 Loading opening 1 2 2 Solid line 1 2 3 Two-point lock line 1 5 1 Oxide film 1 5 2 Sensitizer 1 5 3 Pallet 2 0 1 tray body

2 0 1 a搬入搬出開口 202縱板 2 0 3 橫板 2 0 4縱板 2 0 5 橫板 2 0 6 支撐拉線 2 0 7 裝置框 207a 切口部 2 0 8 裝置框 208a、 208b 切□部 2 0 9基板搬運滾子 2 1 1鎖齒輪 2 12 鎖 -69- (67) 12534332 0 1 a Loading and unloading opening 202 Vertical plate 2 0 3 Horizontal plate 2 0 4 Vertical plate 2 0 5 Horizontal plate 2 0 6 Support wire 2 0 7 Device frame 207a Notch portion 2 0 8 Device frame 208a, 208b Cutting portion 2 0 9 substrate carrying roller 2 1 1 locking gear 2 12 lock -69- (67) 1253433

2 13 2 14 2 1 5 2 16 2 16a 2 17 2 18 2 19 22 1 222 223 224 225 226 227 228 229 23 ] 23 2 〇 ο ο Ζ D J 基板昇降臂 支撐滾子 停止器托板 拉出臂 真空吸著裝置 交接臂 導引軌道 底基 導引滾子 驅動馬達 蝸軸 托盤棚部 托盤搬入搬出裝置 搬入開口 搬出開口 實線 二點鎖線 抽取檢查裝置 支管搬運路 支管搬運車 -70>2 13 2 14 2 1 5 2 16 2 16a 2 17 2 18 2 19 22 1 222 223 224 225 226 227 228 229 23 ] 23 2 〇ο ο Ζ DJ Substrate Elevator Support Roller Stopper Pull-out Arm Vacuum Suction device, transfer arm, guide rail, base guide roller drive motor, worm shaft tray, shed tray, loading and unloading device, loading opening, carrying out, opening, solid line, two-point lock line, extraction inspection device, branch, transportation, road, tube, transport vehicle, 70>

Claims (1)

(1) (1)1253433 十、申請專利範圍 1 · 一種基板搬入搬出裝置，其特徵爲，由： 在片！1本體的內部形成多數供多段支撐基板的棚，前 述片*「圼本體的特定的側面是成爲基板的搬入搬出開口，前 述棚’是隔有預定間隔並貫通片匣本體的複數條的支撐材 構成的基板片匣；及 具備基板昇降手段的基板昇降板是各別從前述基板片 匣的側面出入前述基板片匣內，前述基板昇降板已進入基 板片匣內的狀態下將正上方的基板從前述支撐材稍微抬起 的基板昇降元件所構成； * 而前述基板片匣及前述基板昇降元件是相對昇降的結 構。 2. 如申請專利範圍第1項的基板搬入搬出裝置，其 中，具備前述基板昇降手段的各基板昇降板是各別從與前 述搬入搬出開口鄰接的二個相面對的側面出入前述基板片 匣內。 3. 如申請專利範圍第1項的基板搬入搬出裝置，其 中，前述基板昇降手段，是由形成有無數的空氣噴出口的 基板昇降板、及供從各空氣噴出口噴出壓力空氣用的壓力 空氣源所構成，且使基板對於支撐材浮起的結構。 4. 如申請專利範圍第1項的基板搬入搬出裝置’其 中，前述基板昇降手段，是由：形成有無數的空氣噴出口 的基板昇降板、及供從各空氣噴出口噴出壓力空氣用的壓 力空氣源、及稍微浮起基板昇降板的基板浮起補助手段所 (2) (2)1253433 構成，且藉由壓力空氣及基板浮起補助手段，使基板對於 支撐材浮起的結構。 5 .如申請專利範圍第1項的基板搬入搬出裝置，其 中，前述基板昇降手段，是安裝於基板昇降板的上面的多 數的支撐滾子，前述基板，是藉由基板昇降板稍微上昇而 從支撐材被抬起。 6. 一種基板搬入搬出裝置，其特徵爲，由： 在片匣本體的內部形成多數供多段支撐基板的棚，前 述片匣本體的特定的側面是成爲基板的搬入搬出開口，前 述棚，是隔有預定間隔並貫通片匣本體的複數條的支撐材 構成的基板片厘，及 具備基板昇降手段的基板昇降板是各別從前述基板片 匣的側面出入前述基板片匣內，前述基板昇降板已進入基 板片匣內的狀態下將正上方的基板從前述支撐材稍微抬起 的基板昇降元件所構成； 前述基板昇降元件，是使對應於基板片匣的棚數的複 數基板昇降板被支撐於昇降板支撐構件，各基板昇降板’ 是具有將正上方的基板從前述支撐材稍微抬起的基板昇降 手段，各基板昇降板的基板昇降手段的動作，是個別切換 可能。 7. 如申請專利範圍第6項的基板搬入搬出裝置，其 中，前述基板昇降手段，是使壓力空氣從無數的空氣噴出 口噴出的結構，從各基板昇降手段噴出的壓力空氣的噴出 口，是個別切換可能。 -72- (3) (3)1253433 8 . —種基板搬運方法，對於依序經過多數過程使半 導體元件成形於基板的半導體製造裝置，沿著爲了進行各 過程的處理而以過程順序配置的多數的處理裝置所構成的 處理裝置群來搬運前述基板的方法，其特徵爲：前述基板 ，是姑且暫置在配置於前述各處理裝置之間的第1暫置台 之後，再藉由對應於各處理裝置配置的基板交接裝置被取 出，並1枚1枚地搬運至後續過程的處理裝置。 9 · 一種基板搬運方法，對於依序經過多數過程使半 導體元件成形於基板的半導體製造裝置，沿著爲了進行各 過程的處理而以過程順序配置的多數的處理裝置所構成的 處理裝置群來搬運前述基板的方法，其特徵爲： 前述基板的搬運路徑，是具有： 爲了對於前述基板依序進行各過程的處理，透過配置 於前述各處理裝置之間的第1暫置台朝後續過程側依序搬 運的正規搬運路；及 爲/對於處理途中的基板進行附帶處理，將基板往復 搬運於前述第1暫置台、或與前述第1暫置台不同的第2 暫置台及附帶處理裝置之間的支線搬運路。 1 〇 · —種基板搬運方法，對於依序經過多數過程使半 導體元件成形於基板的半導體製造裝置，沿著爲了進行各 過程的處理而以過程順序配置的多數的處理裝置所構成的 處理裝置群來搬運前述基板的方法，其特徵胃. 藉由配設於各處理裝置及輸送帶裝置之間的基板交接 裝置’藉由前述輸送帶裝置將1枚Ϊ枚地被搬運的基板交 -73- (4) (4)1253433 接至各處理裝置，將在各處理裝置被處理過的基板藉由前 述基板交接裝置交接至輸送帶裝置並搬運至後續過程的處 理裝置。 11· 一種基板搬運裝置，對於依序經過多數過程使半 導體元件成形於基板的半導體製造裝置，沿著爲了進行各 過程的處理而以過程順序配置的多數的處理裝置所:構成白勺 處理裝置群來搬運前述基板的裝置，其特徵爲，具{庸： 爲了 一時地暫置搬運中的基板，而配置於負責前後的 過程的各處理裝置之間的多數的第1暫置台；及 在該處理裝置處理從前過程側的第1暫置台取出的基 板後，將基板搬運至鄰接前述第1暫置台的後續過程側的 別的第1暫置台用的多數的基板交接裝置； 藉由前述第1暫置台將處理途中的基板1枚1枚地依 序朝後續過程側搬運。 12.如申請專利範圍第1 1項的基板搬運裝置，其中 ，前述第1暫置台，可以暫置複數枚的基板。 1 3 .如申請專利範圍第1 1項的基板搬運裝置，其中 ，前述第1暫置台是多段收納構造，並藉由先進先出方式 被搬入搬出。 14.如申請專利範圍第1 1項的基板搬運裝置，其中 ，具備：配置在基板的正規搬運路的所期位置並與前述第 1暫置台不同的附帶處理裝置專用的第2暫置台、及將從 前述第2暫置台取出的基板支線搬運至附帶處理裝置爲止 用的基板支線搬運車。 -74 - (5) (5)1253433 ]5 .如申請專利範圍第1 4項的基板搬運裝置，其中 ，暫置於前述第2暫置台的基板的搬運，是藉由第2暫置 台本身的搬運進彳了。 16.如申請專利範圍第]1項的基板搬運裝置，其中 ，由多數的處理裝置構成的處理裝置群，是沿著正規搬運 路被二分割且相面對配置，被二分割的各處理裝置群之間 是成爲支線搬運路。 17· —種基板搬運裝置，對於依序經過多數過程使半 導體元件成形於基板的半導體製造裝置，沿著爲了進行各 過程的處理而以過程順序配置的多數的處理裝置所構成的 處理裝置群來搬運前述基板的裝置，其特徵爲，具備： 沿著各處理裝置的配列方向配設，1枚1枚地搬運基 板用的輸送帶裝置；及 配設於前述輸送帶裝置及各處理裝置之間，在兩者之 間進行基板的交接用的基板交接裝置； 在前述各處理裝置被處理的基板，是藉由前述輸送帶 裝置搬運至後續過程的處理裝置。 18. 如申請專利範圍第1 7項的基板搬運裝置，其中 ’則述基板，是在被收容於托盤的狀態下被搬運。 19. 如申請專利範圍第1 7項的基板搬運裝置，其中 ’在fe送帶裝置的處理裝置的正下流側，配設供一時保管 已結束前述處理裝置的處理的基板用的基板保管裝置。 2 0.如申請專利範圍第1 7項的基板搬運裝置，其中 ’前述輸送帶裝置是周轉輸送帶裝置，使半導體元件成形 -75- (6) (6)1253433 於基板用的各處理裝置群，是配設於周轉輸送帶裝置的周 圍。 2 1.如申請專利範圍第1 7項的基板搬運裝置，其中， 爲了對於處理途中的基板進行附帶處理，而在各處理裝置 之間配設可搬運前述基板的支線搬運裝置。(1) (1) 1253433 X. Patent application scope 1 · A substrate loading/unloading device characterized by: In-slice! In the inside of the main body, a plurality of sheds for supporting a plurality of stages of the support substrate are formed, and the specific side surface of the cymbal body is a loading/unloading opening that serves as a substrate, and the shed is a plurality of supporting materials that are spaced apart from each other by a predetermined interval. The substrate sheet constituting the substrate and the substrate lifting and lowering plate including the substrate lifting and lowering means are respectively inserted into the substrate sheet from the side surface of the substrate sheet, and the substrate is raised directly into the substrate sheet. A substrate lifting and lowering device that is slightly lifted from the support material; and the substrate sheet and the substrate lifting and lowering member are configured to move up and down. 2. The substrate loading/unloading device according to claim 1, wherein the substrate loading/unloading device includes In the substrate loading and unloading device of the first aspect of the invention, the substrate lifting and lowering device of the substrate lifting and lowering device is inserted into the substrate sheet. The substrate lifting and lowering means is a substrate lifting plate formed with a plurality of air ejection ports, and a supply port for each air outlet 4. The structure of the pressure air source for the pressure air and the structure for floating the support material. 4. The substrate loading/unloading device of the first aspect of the patent application, wherein the substrate lifting means is formed by a myriad The substrate elevating plate of the air ejection port, the pressure air source for discharging the pressurized air from each air ejection port, and the substrate floating support means (2) (2) 1253433 for slightly lifting the substrate lifting plate, and The substrate loading/unloading device according to the first aspect of the invention, wherein the substrate lifting and lowering means is mounted on the upper surface of the substrate lifting plate by the pressure air and the substrate floating assisting means. In the majority of the supporting rollers, the substrate is lifted from the support by the substrate lifting plate slightly rising. 6. A substrate loading/unloading device, characterized in that: a plurality of segments are formed inside the sheet body In the shed supporting the substrate, the specific side surface of the sheet body is a loading/unloading opening that serves as a substrate, and the shed is separated by a predetermined interval. A substrate sheet composed of a plurality of support members of the sheet body and a substrate lifting sheet including the substrate lifting and lowering means are respectively inserted into the substrate sheet from the side surface of the substrate sheet, and the substrate lifting sheet has entered the substrate sheet. In the inner state, the substrate lifting element is slightly raised from the support material; the substrate lifting element is a plurality of substrate lifting plates corresponding to the number of the substrate sheets supported by the lifting plate supporting member. Each of the substrate lifting plates ′ is a substrate lifting and lowering means for slightly lifting the substrate directly above the support material, and the operation of the substrate lifting and lowering means of each of the substrate lifting plates is possible to individually switch. 7. As claimed in claim 6 In the substrate loading/unloading device, the substrate lifting and lowering means is configured to eject pressurized air from an infinite number of air ejection ports, and the ejection ports of the pressurized air ejected from the respective substrate lifting means may be individually switched. -72- (3) (3)1253433 8 . A substrate transfer method for a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes in sequence, and is arranged in a process order along a process for performing each process. A method of transporting the substrate by the processing device group constituted by the processing device, wherein the substrate is temporarily placed after the first temporary stage disposed between the processing devices, and corresponding to each processing The substrate transfer device disposed in the apparatus is taken out and transported to the processing device of the subsequent process one by one. 9. A substrate transport method in which a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes is transported along a processing apparatus group including a plurality of processing apparatuses arranged in a process order for performing processing of each process. In the method of the substrate, the substrate transport path has a process of sequentially performing a process for the substrate, and sequentially passing the first temporary stage disposed between the processing devices toward the subsequent process side. a normal conveyance path for conveyance; and an additional process for the substrate in the middle of the process, and the substrate is reciprocally conveyed to the first temporary stage or the second temporary stage different from the first temporary stage and the branch line between the processing apparatuses Carrying the road. In the semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes in sequence, a processing apparatus group including a plurality of processing apparatuses arranged in a process order for performing processing of each process is provided. A method for transporting the substrate, wherein the substrate is transferred by a substrate transfer device disposed between each of the processing devices and the conveyor device, and the substrate is transported by the conveyor device. (4) (4) 1253433 is connected to each processing device, and the substrate processed by each processing device is transferred to the conveyor device by the substrate transfer device and transported to the processing device of the subsequent process. 11. A substrate transporting apparatus, wherein a plurality of processing apparatuses arranged in a process order for performing processing of each process are sequentially performed on a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate through a plurality of processes: a processing apparatus group The apparatus for transporting the substrate is characterized in that: a plurality of first temporary stages disposed between the respective processing devices responsible for the process before and after the substrate being temporarily placed; and After the apparatus processes the substrate taken out from the first temporary stage on the front process side, the substrate is transported to a plurality of substrate transfer apparatuses for the other first temporary stage adjacent to the subsequent process side of the first temporary stage; The table is transported one by one to the subsequent process side in order. 12. The substrate transfer device according to claim 1, wherein the first temporary stage can temporarily store a plurality of substrates. The substrate transfer device according to the first aspect of the invention, wherein the first temporary stage is a multi-stage storage structure, and is carried in and out by a first-in first-out method. The substrate transfer device according to the first aspect of the invention, further comprising: a second temporary stage dedicated to the processing device disposed at a predetermined position of the normal conveyance path of the substrate and different from the first temporary stage; The substrate branch line taken out from the second temporary stage is transported to the substrate branch transport vehicle for use with the processing apparatus. In the substrate transfer device of the first aspect of the invention, the substrate temporarily placed on the second temporary stage is transported by the second temporary stage itself. Handling in. 16. The substrate transfer device according to the first aspect of the invention, wherein the processing device group consisting of a plurality of processing devices is divided into two according to a normal conveyance path and disposed to face each other, and each of the processing devices is divided into two. Between the groups is to become a branch line. In a semiconductor manufacturing apparatus in which a semiconductor element is formed on a substrate by a plurality of processes in sequence, a processing apparatus group including a plurality of processing apparatuses arranged in a process order for performing processing of each process is used. The apparatus for transporting the substrate is provided with: a conveyor belt device for transporting a substrate one by one along a direction in which the processing devices are arranged; and an arrangement between the conveyor belt device and each processing device A substrate transfer device for transferring substrates between the two; and a substrate processed by each of the processing devices is a processing device that is transported to a subsequent process by the transfer device. 18. The substrate transfer device of claim 17, wherein the substrate is transported while being stored in the tray. 19. The substrate transfer device according to the seventh aspect of the invention, wherein the substrate storage device for the substrate that temporarily terminates the processing of the processing device is disposed on the downstream side of the processing device of the fe tape feeding device. The substrate transfer device of claim 17, wherein the conveyor belt device is a revolving conveyor device, and the semiconductor element is formed by -75-(6) (6)1253433 for each processing device group for the substrate. It is equipped around the circumference of the conveyor belt device. (2) The substrate transfer device according to the seventh aspect of the invention, wherein a branch conveyance device capable of transporting the substrate is disposed between the respective processing devices in order to perform an additional process on the substrate in the middle of the process. -76 --76 -
TW093133852A 2003-11-06 2004-11-05 Substrate transportation device, substrate transportation method, and substrate transportation apparatus TWI253433B (en)

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