TWI227034B - Substrate processing apparatus and method - Google Patents
Substrate processing apparatus and method Download PDFInfo
- Publication number
- TWI227034B TWI227034B TW090113578A TW90113578A TWI227034B TW I227034 B TWI227034 B TW I227034B TW 090113578 A TW090113578 A TW 090113578A TW 90113578 A TW90113578 A TW 90113578A TW I227034 B TWI227034 B TW I227034B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- substrate
- processing unit
- units
- unit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000169191A JP3732388B2 (ja) | 2000-06-06 | 2000-06-06 | 処理装置および処理方法 |
JP2000172338A JP2001351852A (ja) | 2000-06-08 | 2000-06-08 | 基板処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI227034B true TWI227034B (en) | 2005-01-21 |
Family
ID=35654728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090113578A TWI227034B (en) | 2000-06-06 | 2001-06-05 | Substrate processing apparatus and method |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100792828B1 (ko) |
TW (1) | TWI227034B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100958574B1 (ko) * | 2003-10-24 | 2010-05-18 | 엘지디스플레이 주식회사 | 액정표시장치의 제조장치 및 방법 |
JP4444154B2 (ja) * | 2005-05-02 | 2010-03-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100730735B1 (ko) * | 2005-11-21 | 2007-06-21 | 세메스 주식회사 | 기판 처리장치 및 그 처리방법 |
JP4428717B2 (ja) * | 2006-11-14 | 2010-03-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5788868A (en) * | 1995-09-04 | 1998-08-04 | Dainippon Screen Mfg. Co., Ltd. | Substrate transfer method and interface apparatus |
JP3552178B2 (ja) * | 1995-09-27 | 2004-08-11 | 大日本スクリーン製造株式会社 | 基板収納カセット、インターフェイス機構および基板処理装置 |
-
2001
- 2001-05-31 KR KR1020010030489A patent/KR100792828B1/ko active IP Right Grant
- 2001-06-05 TW TW090113578A patent/TWI227034B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100792828B1 (ko) | 2008-01-14 |
KR20010110650A (ko) | 2001-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101060093B (zh) | 基板搬送处理装置 | |
TW385488B (en) | substrate processing device | |
TW297910B (ko) | ||
US5677758A (en) | Lithography System using dual substrate stages | |
CN100538520C (zh) | 涂敷·显影装置和涂敷·显影方法 | |
TW480557B (en) | Substrate processing apparatus and substrate processing method | |
CN100495642C (zh) | 基板处理装置 | |
TW389977B (en) | Substrate transfer device and substrate processing device using the same | |
JP3649048B2 (ja) | レジスト塗布・現像装置、ならびにそれに用いる基板加熱処理装置および基板搬送装置 | |
TWI227034B (en) | Substrate processing apparatus and method | |
JP2002043208A (ja) | 塗布現像処理方法 | |
JP2000183019A (ja) | 多段基板処理装置 | |
JP3930244B2 (ja) | 処理装置 | |
JP2000124129A (ja) | 処理装置 | |
TW480549B (en) | Substrate treating device and method | |
JP3957445B2 (ja) | 基板処理装置および基板処理方法 | |
JP3732388B2 (ja) | 処理装置および処理方法 | |
JP3352636B2 (ja) | 処理装置及びその方法 | |
JP4408606B2 (ja) | 基板処理装置 | |
TW533460B (en) | Processing apparatus | |
JP3629434B2 (ja) | 処理装置 | |
JP4028351B2 (ja) | ベーキング方法及びベーキング装置 | |
JP2002324740A (ja) | 処理装置 | |
JP2001053125A (ja) | 処理システム | |
TW398021B (en) | Coating and developing apparatus, complex apparatus and processing method in coating and developing apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |