TW533460B

TW533460B - Processing apparatus

Info

Publication number: TW533460B
Application number: TW091102936A
Authority: TW
Inventors: Kimio Motoda; Mitsuhiro Sakai
Original assignee: Tokyo Electron Ltd
Priority date: 2001-03-09
Filing date: 2002-02-20
Publication date: 2003-05-21
Also published as: JP4813540B2; JP5063817B2; JP2011187987A; JP2009062199A; JP2012094908A; KR100873099B1; KR20020072202A

Abstract

The processing apparatus 100 for performing a series of processes to the substrate G including a plurality of liquid processes, comprises liquid processing units 21, 23, 24 for performing the liquid process to the substrate G while transferring the wafer G horizontally and the heat processing unit sections 26, 27, 28 arranged a plurality of heat processing units collectively for performing heat processing to the substrate G. The liquid processing units 21, 23, 24 are arranged according to a process order such that the two parallel transfer lines A and B are formed as the transfer lines of the substrate G. The space 40 is formed between the transfer lines A and B. The substrate holding/moving member 41 for holding and transferring the substrate G to the transfer lines A and B is provided.

Description

533460533460

經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

【發明之技術領域】、本發明係有關於進行對液晶顯示裝置（咖）玻璃基板等被處理體塗布光阻劑及曝光後的顯像處理，以及該等處理之前後進行之熱處理的多數處理的處理裝置。【發明之技術背景】在LCD之製造中，於作為被處理基板2LCD玻璃基板形成-定的膜後，塗布光阻劑而形成光阻劑膜，並對應電路圖案而使卷阻劑膜曝光，將此等處理稱為顯像處理，即所謂以光刻技術來形成電路圖案。此光刻技術係作為被處理基板之LCD基板之主要步驟要經過洗淨處理—脫水烘乾—黏著（疏水化）處理—前烘烤 —曝光-> 顯像―後烘烤等一連申處理而於光阻劑層形成預定的電路圖案。驾知之如此的處理係以意識形態地將進行各處理的單元配置於搬送路徑之兩側的處理流程，以可行走的中央搬送裝置將搬送路徑，配置一個或多數配置以進行朝向各處理單元之被處理基板之搬入出的處理方塊所構成的處理系統來進行。如此的處理系統在基本上由於係隨機存取，故處理的自由度極高。但是近來強烈要求大型化的LCD基板，甚至發展到_ 邊達到1公尺的巨大基板的出現，而具有上述那樣平面配置之處理系統則裝置面積就會變得極大，而從節省空間的觀點來論乃被強烈要求縮小裝置面積。為了要縮小裝置面積，雖然考慮到將處理單元予以上 4 丨丨 1 τ·裝—-----訂---------· {請先閱讀背面之注音？事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 533460 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（2 ) 下方向重疊’然而現行的處理系統從提昇流通率的觀點來看，搬送裝置要將基板朝水平方向高速且高精密度地移動，而再加上在高度方向亦要高速且高精密度地移動的情形在裝置本身即有界限。又，隨著基板的大型化且處理單元亦大型化，對於光阻劑塗布處理單元及顯像處理單元等塗布裝置系統之單元要進行重疊設置的情形乃極為困難。又，要縮小裝置面積之其他手段固然考慮到不使用中央搬送裝置而依處理的順序來配置處理單元，然而，此情形下僅能對應預定之一連串的處理，而有處理自由度小的問題。【發明之概要】本發明係有鑑於上述諸般問題及情況而進行完成者，其目的在於提供具有能不降低流通量且不會伴隨裝置構成上的問題而能弄小裝置面積，且達到處理自由度高而具有多數處理單元的處理裝置者。本發明之第1觀點係提供一種處理裝置，對於被處理基板進行包含多數之液處理的一連串處理，係可一邊將被處理基板略水平地搬送而一邊進行液處理，處理之順序上具有搬送線呈二列配置之多數的液處理單元；進行附隨前述多數液處理之熱處理之多數的熱處理單元；設置於前述二列搬送線之間的空間部；及可移動地設置於前述空間部而在與前述搬送線之間交接被處理基板而保持並移動基板的基板保持·移動構件。本發明之第2觀點係提供一種處理裝置，對於被處理基 _____ . 5 本紙張尺度適用中關家標準（CNS)A4規格（2iq χ挪公£^ ------ — (請先閱讀背面之注意事項再填寫本頁) · I I I I--—訂 — — — — — —-- 533460 A7 B7 五、發明說明（3 經濟部智慧財產局員工消費合作社印製板進行包含多數之液處理的_❹處理，係_邊將被處理基板略水平地搬送而-邊進行液處理，具備有具有對應前 ^連串的處理而對各個被處理基板料預定處理之^ 早疋的處理部；載置可收納處理前之被處理基板及/或處理後的被處理基板之收納容H，及對前述處理部將被處= 基板予以搬入出的搬入出部；前述處理部具有一邊將被處理基板朝水平搬送而一邊進行液處理，而在處理之順序: 具有搬送線呈二列配置之多數的液處理單元；進行附隨前述多數液處理之熱處理之多數的熱處理單元；設置於前述一列搬迗線之間的空間部；及可移動地設置於前述空間部而在與則述搬送線之間交接被處理基板而保持並移動基板的基板保持·移動構件。於此等處理裝置中，具有前述多數熱處理單元構成對應前述各熱處理之各構件所彙集之多數熱處理單元部，並對應各熱處理單元部而在與其中的多數熱處理單元之間及與對應之液處理單元之間進行搬送被處理基板的搬送裝置又別述夕數熱處理單元部具有設置成可鄰接各個搬送裝置而以多數熱處理單元於垂直方向積層所構成之熱處理單元方塊。本發明之第3觀點係提供一種處理裝置，對於被處理基板進行包含洗淨、塗布光阻劑及曝光後的顯像的一連串處理’具備有具有對應前述一連串的處理而對各個被處理基板施予預定處理之處理單元的處理部；載置可收納處理前之被處理基板及/或處理後的被處理基板之收納容器，對[Technical Field of the Invention] The present invention relates to a plurality of processes for applying a photoresist to an object to be processed, such as a liquid crystal display device (coffee) glass substrate, and performing a development process after exposure, and a heat treatment performed before and after such processes. Processing device. [Technical background of the invention] In the manufacture of LCD, after a fixed film is formed as the substrate 2 to be processed on the LCD glass substrate, a photoresist is applied to form a photoresist film, and the roll resist film is exposed according to the circuit pattern. These processes are called development processes, and the so-called photolithography technique is used to form a circuit pattern. This photolithography technology is used as the main step of the LCD substrate to be processed. The cleaning process—dehydration drying—adhesion (hydrophobicization) treatment—pre-baking—exposure— > development—post-baking, etc. A predetermined circuit pattern is formed on the photoresist layer. The processing such as driving knows that the processing units are arranged ideologically on both sides of the conveying path, and one or more of the conveying paths are arranged by a walkable central conveying device to face the processing units. It is performed by a processing system composed of processing blocks for carrying in and out a substrate to be processed. Since such a processing system is basically random access, the degree of freedom in processing is extremely high. However, recently, large-scale LCD substrates have been strongly demanded, and even the development of huge substrates with a side of 1 meter has been developed, and a processing system with a planar configuration as described above will have a large device area, and from the perspective of saving space It is strongly demanded to reduce the device area. In order to reduce the area of the device, although it is considered that the processing unit is placed on the 4 丨丨 1 τ · install —----- order --------- · {Please read the note on the back first? Please fill in this page again for this matter) This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 533460 Printed by Employee Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention (2) Overlapping directions downward From the standpoint of improving the throughput rate of the current processing system, the conveying device needs to move the substrate at a high speed and high precision in the horizontal direction, and it also needs to move at a high speed and high precision in the height direction. There are bounds. In addition, with the increase in the size of the substrate and the increase in the size of the processing unit, it is extremely difficult to overlap the units of a coating device system such as a photoresist coating processing unit and a development processing unit. In addition, other means to reduce the area of the device take into consideration that the processing units are arranged in the order of processing without using a central transfer device. However, in this case, only a predetermined series of processing can be handled, and there is a problem of small degree of freedom in processing. [Summary of the Invention] The present invention has been completed in view of the above-mentioned problems and circumstances, and an object of the present invention is to provide a device with a small device area without reducing the throughput and accompanying problems with the device configuration, and achieve freedom of processing. A processing device having a high degree and having a large number of processing units. A first aspect of the present invention is to provide a processing apparatus that performs a series of processes including a large number of liquid processes on a substrate to be processed, and can perform liquid processing while conveying the substrate to be processed slightly horizontally, and has a transfer line in the processing order. The majority of the liquid processing units arranged in two rows; the majority of the heat treatment units that perform the heat treatment accompanying the majority of the liquid treatment; the space section provided between the two rows of the transfer line; and the space section movably provided in the space section. A substrate holding and moving member that transfers a substrate to be processed to the transfer line and holds and moves the substrate. The second aspect of the present invention is to provide a processing device for the substrate to be processed. _____. 5 This paper size applies the Zhongguanjia Standard (CNS) A4 specification (2iq χ Norwegian) £ ^ ------ — (please first Read the notes on the reverse side and fill out this page) · III I --- Order — — — — — — — 533460 A7 B7 V. Invention Description (3 The printed board of the employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs contains most of the liquid Processing _❹ processing, is _ while carrying the processed substrate slightly horizontally-while performing liquid processing, equipped with a processing unit that has a series of processing corresponding to the previous ^ and scheduled processing of each processed substrate material ^ early processing ; Place the storage capacity H that can store the processed substrate before processing and / or the processed substrate after processing, and a loading / unloading unit that will load the processing unit = the substrate is loaded in and out; the processing unit has The processing substrate is transported horizontally while liquid processing is performed on one side, and in the order of processing: a liquid processing unit having a plurality of liquid processing units arranged in two rows in a transfer line; a heat treatment unit performing a majority of the heat treatment accompanying the majority of the liquid processing; A space portion between a row of transfer lines; and a substrate holding and moving member movably provided in the space portion and transferring a substrate to be processed to and from the transfer line to hold and move the substrate. A plurality of heat treatment units having the aforementioned plurality of heat treatment units constitute a plurality of heat treatment unit sections that are assembled for each of the components corresponding to the aforementioned heat treatments, and corresponding to each heat treatment unit section are transported between the majority of the heat treatment units therein and between the corresponding liquid treatment units. In addition, the transfer device for processing substrates has a heat treatment unit block provided so that a plurality of heat treatment units can be stacked in a vertical direction adjacent to each transfer device. A third aspect of the present invention is to provide a processing device. The substrate to be processed is subjected to a series of processes including cleaning, coating with a photoresist, and development after exposure. The processing unit includes a processing unit having a processing unit that performs a predetermined process on each substrate to be processed in response to the series of processes; Stores the substrate to be processed before processing and / or the substrate to be processed after processing Carolina container, for

(請先閱讀背面之注意事項再填寫本頁) 一裝訂 . 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱）五、經濟部智慧財產局員工消費合作社印製 533460 發明說明（刖述處理部將被處理基板予以搬入出的搬入出部；及在處理部與曝光裝置之間進行交接被處理基板的界面部；前述處理部具有係一邊將被處理基板朝水平搬送而一邊進行以洗淨液進行洗淨處理及進行乾燥處理的洗淨處理單元；一邊將被處理基板朝水平搬送而一邊進行包含塗布光阻液的光阻劑處理的光阻劑處理單元；一邊將被處理基板朝水平搬送而一邊進行塗布顯像液、去除顯像後之顯像液、及乾燥處理的顯像處理單元；以前述洗淨處理單元、前述光阻劑處理單元及前述顯像處理單元所構成而可搬送被處理基板之平行的二列搬送線；進行附隨前述各處理單元之熱處理之多數的熱處理單元；設置於前述二列搬送線之間的空間部；及可移動地設置於前述空間部而在與前述搬送線之間交接被處理基板而保持並移動基板的基板保持·移動構件；且前述二列搬送線之中的—線可將從前述搬人出部所搬入之被處理基板經過前述洗淨處理單元及前述光阻劑處理單元而搬至前述界面部，另—線可將被處理基板從前述界面部經前述顯像處理單元而搬至前述搬入出部。於此等處理裝置中，具有前述多數熱處理單元構成對應從前述洗淨處理單元所搬出的被處理基板而進行預定之熱處理之多數減理單元所彙集之幻熱處理單元部；對於從前述光_處理單元所搬出的被處理基板而進行預定之熱處理之多數熱處理單元所彙集之第2熱處理單元部·及對於從前述顯像處理單元所搬出的被處理基板而進行預定之熱處理之多數熱處理單元所彙集之$3熱處理單元部；且可丨^ τ«裳-----—訂--------- (請先閱讀背面之注意事項再填寫本頁)(Please read the notes on the back before filling in this page) One binding. This paper size is applicable to China National Standard (CNS) A4 (210 X 297 public love) 5. Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 533460 Invention Description (The processing unit carries in and out the substrate to be processed; and an interface unit that transfers the substrate to be processed between the processing unit and the exposure device; and the processing unit has a side that transports the substrate to be processed horizontally. A cleaning processing unit that performs a cleaning treatment and a drying treatment with a cleaning solution; a photoresist processing unit that performs a photoresist treatment including a photoresist coating while conveying the substrate to be processed horizontally; The processing substrate is conveyed horizontally, and the developing processing unit is coated with the developing solution, the developing solution after the development is removed, and the drying processing unit; the cleaning processing unit, the photoresist processing unit, and the developing processing unit are performed. A two-line parallel transfer line configured to transfer substrates to be processed; most of the heat A processing unit; a space portion provided between the two rows of transfer lines; and a substrate holding and moving member movably provided in the space portion and transferring the substrate to be processed between the transfer line and the substrate and holding and moving the substrate; and Among the two lines of the above-mentioned transfer line, the line can be moved to the interface portion through the cleaning processing unit and the photoresist processing unit, and the other line can be transferred to the interface portion. The processing substrate is transferred from the interface portion to the loading / unloading portion through the development processing unit. In these processing apparatuses, the plurality of heat treatment units have the plurality of heat treatment units configured to be predetermined corresponding to the substrate to be removed from the cleaning processing unit. The second heat treatment unit unit, which is a collection of the majority of heat treatment units, is a magic heat treatment unit unit; the second heat treatment unit unit, which is a plurality of heat treatment units that performs a predetermined heat treatment on the substrate to be processed carried out from the aforementioned photo-processing unit The $ 3 heat place that most heat treatment units carry out a predetermined heat treatment like the substrate to be processed carried out by the processing unit Unit section; and can Shu ^ τ «Sang ------ --------- set (please read the note and then fill in the back of this page)

五發明說明（5 ) 更具有可將由前诚、、丰、、金老前述第m處理單Μ ;;理±單元所搬出之被處理基板搬入來的同時可將由前述第1熱處理單元部晋·可二:、反搬②至前述光阻劑處理單元的第1搬送裝 ::光阻職理單元所搬出之被處理基板搬入理單元部，同時可將由前述第2熱處理軍㈣被處理基板搬送至前述界面部的第2搬送裝置；可將由 =顯:象處理單元所搬出之被處理基板搬入前述第3熱處早疋。*5 @時可將由前述第3熱處理單元部來的被處理基板搬送至前述搬入出部的第3搬送裝置。又，前述第】、第2 及第3熱處理早几部具有分別設置成可鄰接第卜第2及第3 搬送裝置而以多數埶虛神留-#丄+ 数熱處理早疋於垂直方向積層所構成之熱處理單元方塊。在上述任何處理裝置中，前述基板保持·移動構件亦可採用具有將被處理基板支持在其上面的基座構件，及設置成對於前述基座構件自由著脫而覆蓋其上方空間的覆蓋構件。此情形下，最好是前述覆蓋構件之開閉係藉著設置在對應前述基板保持·移動構件之被處理基板之接收/交接位置的開閉機構而進行。又於上述第2或第3觀點中，前述搬入出部具有在與前$處理單元之間進行被處理基板之交接的基板搬送機構 ,前述處理部於鄰接前述空間部之前述基板搬送機構的部分，具有前述基板搬送機構與前述基板保持·移動構件之間進行被處理基板之交接的基板交接機構，此基板交接機構具有可改變被處理基板之方向的基板旋轉機構。此情形經濟部智慧財產局員工消費合作社印製 A7 " ' -----B7______ 五、發明說明（6 ) ' 下，前述基板交接機構具有可昇降的基板域部，前述基板保持.移動構件具有形成貫通前述基板支持部之孔而支持被處理基板的基座構件，前述基板交接機構之基板支持部以從前述基座構件之下貫通前述孔而突出於其上方狀態來接收被處理基板，且藉著前述基板旋轉機構而旋轉被處理基板，並藉著下降前述支持部而可將被前述支持部所支持之被處理基板載置於前述基座構件。依據本發明，乃能以進行洗淨處理、光阻劑處理、顯像處理的液處理之多數液處理單元為中心而構成一邊將被處理基板寓略水平方向搬送並一邊進行預定的液處理，將此等構件以處理的順序而將被處理基板之搬送線配置成平行的一列，可一邊將被處理基板沿著搬送線來搬送而一邊進行連串處理，因此此維持南流通率，同時基本上可不須要如習知那般地在多數處理單元之間行進之大規模的中央搬送裝置及此等構件所行進之中央搬送路徑，其功效乃月b達到節省空間化且能縮小裝置面積。又，設置一基板保持·移動構件，此基板保持·移動構件乃可移動地設置在一列搬送線之間的空間部，且在此基板保持·移動構件與前述搬送線之間進行基板的交接保持，因此，可進行一般處理之外更能進行其他各種模式的處理，因此處理的自由度高。此情形下，基板保持構件與習知中央搬送裝置不同 ’由於僅保持並移動被處理基板，故不須要大型的機構，而不必要如習知之中央搬送裝置所要行進之中央搬送路那般大的空間，而能維持節省空間的效果。本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Fifth invention description (5) It also has the ability to transfer the aforementioned mth processing unit M from Qiancheng, Fengfeng, and Jinlao; while the processed substrates carried out by the processing unit can be brought in, the first heat treatment unit can be upgraded. Possible 2: Reverse transfer ② The first transfer to the aforementioned photoresist processing unit: The substrate to be processed carried out by the photoresistor processing unit is moved into the processing unit, and the substrate to be processed by the aforementioned second heat treatment army can be transferred at the same time The second conveying device to the interface section; the substrate to be processed carried out by the = display: image processing unit can be moved into the aforementioned third heat place. * 5 @ When the substrate to be processed from the third heat treatment unit is transferred to the third transfer device of the loading / unloading unit. In addition, the first, second, and third heat treatment parts described above have a plurality of heat-retaining- # 丄 + number heat treatment units which are arranged adjacent to the second and third conveying devices, respectively. Constructed heat treatment unit block. In any of the processing apparatuses described above, the substrate holding and moving member may include a base member that supports the substrate to be processed thereon, and a cover member that is provided to freely move the base member to cover the space above the base member. In this case, it is preferable that the cover member is opened and closed by an opening and closing mechanism provided at a receiving / transferring position of the substrate to be processed corresponding to the substrate holding and moving member. In the second or third aspect, the carrying-in / out section has a substrate transfer mechanism for transferring a substrate to be processed to and from the former processing unit, and the processing section is adjacent to the substrate transfer mechanism of the space section. The substrate transfer mechanism includes a substrate transfer mechanism that transfers a substrate to be processed between the substrate transfer mechanism and the substrate holding and moving member. The substrate transfer mechanism includes a substrate rotation mechanism that can change the direction of the substrate to be processed. In this case, A7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs " '----- B7______ V. Description of the Invention (6)', the aforementioned substrate transfer mechanism has a substrate area which can be raised and lowered, and the aforementioned substrate is held. A base member for supporting the substrate to be processed is formed with a hole penetrating through the substrate supporting part, and the substrate supporting part of the substrate transfer mechanism receives the substrate to be processed in a state of penetrating the hole from below the base member and protruding above the hole, The substrate to be processed is rotated by the substrate rotating mechanism, and the substrate to be processed supported by the supporting portion can be placed on the base member by lowering the supporting portion. According to the present invention, a plurality of liquid processing units that perform liquid processing for cleaning processing, photoresist processing, and development processing can be used as a center to carry out a predetermined liquid processing while conveying a substrate to be processed in a horizontal direction, The processing lines of the substrates are arranged in parallel in the order of processing of these components, and a series of processing can be performed while the processing substrates are being transported along the transportation line. Therefore, the south circulation rate is maintained, and the basic flow rate is basically maintained at the same time. It is not necessary to use a large-scale central conveying device that travels between most processing units as well as the central conveying path that these components travel. The effect is to save space and reduce the area of the device. In addition, a substrate holding and moving member is provided, and the substrate holding and moving member is movably provided in a space portion between a row of transfer lines, and the substrate is held and transferred between the substrate holding and moving member and the transfer line. Therefore, in addition to general processing, processing in various other modes can be performed, and therefore, the degree of freedom of processing is high. In this case, the substrate holding member is different from the conventional central conveying device. 'Since only the substrate to be processed is held and moved, a large-scale mechanism is not necessary, and it is not necessary to be as large as the central conveying path to which the conventional central conveying device travels. Space while maintaining the effect of saving space. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

(請先閱讀背面之注音j事項再填寫本頁) 533460 A7 B7 五、發明說明（7 ) 又’如上所述’前述多數的熱處理單元構成對應前述各個各熱處理而彙集之多數熱處理單元部，藉此，恣更縮小裝置面積且熱處理亦能沿著被處理基板之處理的流動而進行，因此能提高流通率。【發明之實施樣態】以下參照附件圖式來詳細說明本發明之實施樣態。第1圖表示本發明之第1實施樣態之LCD玻璃基板之光阻劑塗布現象處理裝置的平面圖。此光阻劑顯像處理裝置1〇〇具有載置其收容多數LCD玻璃基板G之卡匣C的卡匣站（搬入出部）丨、具有用以對基板G 施予包含塗布光阻劑及顯像之一連串處理之多數處理單元的處理站（處理部）2、用以在與曝光裝置4之間進行交接基板 G之界面站（界面部）3，且於處理站2之兩端分別配置卡匣站 1及界面站3。又，將第1圖之光阻劑塗布顯像處理裝置1〇〇之長邊方向設為X方向，將於平面上與X方向正交的方向設為Y方向。卡閘站1在卡匣C與處理站2之間具有用以進行LCD基板G之搬入出的搬送裝置11，於此卡匣站丨進行對外部的搬入出卡匣C。又，搬送裝置丨丨具有搬送臂丨u，可移動於沿著卡EC之配列方向的γ方向而設置的搬送路徑1〇上，並以搬送臀1 la進行在卡匣c與處理站2之間的搬入出基板G。處理站2具有基本上向X方向延伸之基板〇搬送用之平行的二列搬送線A、B，沿著搬送線A而從卡匣站1側朝向界面站3配列洗淨處理單元（scr)^、第}熱處理單元部％、光 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注音？事項再填寫本頁) 裝--------訂---------. 經濟部智慧財產局員工消費合作社印製 533460 A7 B7 五、發明說明（8 ) 阻劑處理單元23及第2熱處理單元部27。又，沿著搬送線B 而從界面站3側朝向卡匣站1配列著第2熱處理單元部27、顯像處理單元（DEV)24、i線UV照射單元（i —UV)25及第3熱處理單元28。殘渣洗淨處理單元（SCR)21上的一部分設置準分子UV照射單元（e — UV)22。又，準分子UV照射單元（e — UV)22係用以在洗淨殘渣之前先去除基板G的有機物而設置者，i線UV照射單元（i —UV)25係用以進行顯像之脫色處理而設置者。上述殘渣洗淨處理單元（SCR)21，在其中的基板G不會像習知技術那般地旋轉，而係呈一邊略水平地搬送而一邊進行洗淨處理及乾燥處理。上述顯像處理單元（DEV)24亦係在其中的基板G不會像習知技術那般地旋轉，而係呈一邊略水平地搬送而一邊進行顯像液塗布、顯像後之顯像液洗淨及乾燥處理。又，此等殘渣洗淨處理單元（SCR)21及顯像處理單元（DEV)24係藉由滾子搬送或傳送帶搬送而進行，基板 G之搬入口及搬出口設置相對向之短邊。又，朝向i線UV照射單元（i — UV)25之基板G的搬送係藉著與顯像處理單元 (DEV)24之搬送機構相同的機構而連續進行。光阻劑處理單元23如第2圖之其内部的砰面圖所示，順序地配置在杯50内一邊藉著旋壓失頭（spin chuck)51旋轉而一邊從圖式未顯示之噴嘴滴下光阻劑而進行塗布之光阻劑塗布處理裝置（CT)23a、在減壓容器52内將形成在基板G上之光阻劑膜予以減壓乾燥的減壓乾燥裝置（VD)23b、以及藉著可掃描的溶劑吐出頭53而將載置於載置台54之基板G的 -11 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 tT---------· 經濟部智慧財產局員工消費合作社印製 533460 A7 B7 五、發明說明（9 ) (請先閱讀背面之注意事項再填寫本頁) 四邊去除附著在基板G之周緣之多餘的光阻劑的周緣光阻劑去除裝置（ER)23c，且藉著被導軌55所導引而移動之一對副臂5 6而使基板G在此等裝置之間略水平地搬送。此光阻劑處理單元23於相對向之短邊設置此等搬入口 57及搬出口 58 ，導執55由此搬入口 57及搬出口 58向外側延伸並藉著副臂 56而形成可交接基板G的狀態。經濟部智慧財產局員工消費合作社印製第1熱處理單元部26具有可對基板G施予熱處理之熱處理單元所積層而構成之二個熱處理單元方塊（TB)31、32，熱處理單元方塊（TB)31設置於殘渣洗淨處理單元（SCR)21 側，熱處理單元方塊（TB)32設於光阻劑處理單元23側。而在此二個熱處理單元方塊（TB)31、32之間設置第1搬送裝置 33。如第3圖之側面圖所示，熱處理單元方塊（TB)31係從下方的順序積層進行交接基板G之通過單元（PASS)61、對基板 G進行脫水烘乾處理之二個脫水烘乾單元（DHP)62、63、對基板G施予疏水化處理之疏水化處理單元（AD)64之四段而構成，熱處理單元方塊（TB)32係從下方的順序積層進行交接基板G之通過單元（PASS)65、對基板G進行冷卻之二個冷卻單元（COL)66、67、對基板G施予疏水化處理之疏水化處理單元（AD)68之四段而構成。第1搬送裝置33藉由通過單元 (PASS)61而接受從殘渣洗淨處理單元（SCR)21來的基板G ，而進行上述熱處理單元間的基板G的搬入出、及進行藉由通過單元（PASS)65之光阻劑處理單元23的交接基板G。第1搬送裝置33具有向上下延伸之導執91、沿著導軌而昇降的昇降構件92、設置成可旋轉於昇降構件92上的基座 -12 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 533460 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（1Q ) 構件93、及設置成可前進後退於基座構件93上而保持基板G 的基板保持臂94。昇降構件92之昇降係藉著馬達95而進行，且基座93的旋轉係藉著馬達96而進行，且基板保持臂94 之前後動作係藉著馬達97而進行。由於第1搬送裝置33係可如此地上下動、前段動、旋轉動，因此熱處理單元方塊 (TB)31、32之其中任何一單元均可存取。第2熱處理單元部27具有對基板G施予熱處理之熱處理單元所積層而構成之熱處理單元方塊（TB)34、35，熱處理單元方塊（TB)34設置於光阻劑處理單元23側，熱處理單元方塊（TB)35設置於顯像處理單元（DEV)24側。此二個熱處理單元方塊（TB)34、35之間設置著第2搬送裝置36。如第4圖之側面圖所示，熱處理單元方塊（TB)34從下方順序地積層進行交接基板G之通過單元（PASS)69、對基板G進行預先烘乾處理之三個預先烘乾單元（PREBAKE)70、71、72之四段構成，熱處理單元方塊（TB)35從下方順序地積層進行交接基板G之通過單元（PASS)73、對基板G進行冷卻之冷卻單元 (COL)74、對基板G進行預先烘乾處理之二個預先烘乾單元 (PREBAKE)75、76之四段而構成。第2搬送裝置36進行接受藉由通過單元（PASS)69之光阻劑處理單元23來的基板，上述熱處理單元間之基板G的搬入出，接受藉由通過單元 (PASS)73之朝向顯像處理單元（DEV)24的基板G，及對將於後述之界面站3的基板交接部之伸展·冷卻台（EXT· COL)44 之基板G的交遞及接受。又，第2搬送裝置36具有與第1搬送裝置33相同的構成，而熱處理單元方塊34、35之其中任何 • 13 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)(Please read the note on the back j before filling out this page) 533460 A7 B7 V. Description of the invention (7) Also, as mentioned above, the majority of the above-mentioned heat treatment units constitute the majority of the heat treatment unit sections corresponding to each of the aforementioned heat treatments. In this way, the device area is further reduced, and the heat treatment can be performed along the processing flow of the substrate to be processed, so the flow rate can be improved. [Implementation Mode of the Invention] The following describes the implementation mode of the present invention in detail with reference to the attached drawings. Fig. 1 is a plan view showing a photoresist coating phenomenon processing apparatus for an LCD glass substrate according to a first embodiment of the present invention. This photoresist developing and processing device 100 has a cassette station (carry-in / out section) on which the cassette C containing a large number of LCD glass substrates G is accommodated. A processing station (processing section) 2 of a plurality of processing units that develops a series of processes, and an interface station (interface section) 3 for transferring a substrate G to and from the exposure device 4 is arranged at each end of the processing station 2 Cassette station 1 and interface station 3. In addition, the longitudinal direction of the photoresist-coated development processing apparatus 100 in FIG. 1 is set to the X direction, and the direction orthogonal to the X direction on the plane is set to the Y direction. The gate station 1 has a conveying device 11 between the cassette C and the processing station 2 for carrying in and out of the LCD substrate G, and the cassette station 丨 carries in and out of the cassette C to and from the outside. In addition, the conveying device 丨丨 has a conveying arm 丨 u, which can be moved on a conveying path 10 provided in the γ direction along the arrangement direction of the card EC, and is conveyed by the conveying hip 1 la between the cassette c and the processing station 2 The substrate G is carried in and out at a time. The processing station 2 includes substrates extending substantially in the X direction, and two parallel rows of transfer lines A and B for transporting. The cleaning processing units (scr) are arranged along the transfer line A from the cassette station 1 to the interface station 3. ^, The first} heat treatment unit%, light 10 This paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 public love) (Please read the note on the back? Matters before filling out this page) Pack ----- --- Order ---------. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533460 A7 B7 V. Description of the invention (8) Resist treatment unit 23 and second heat treatment unit 27. A second heat treatment unit 27, a development processing unit (DEV) 24, an i-line UV irradiation unit (i-UV) 25, and a third unit are arranged along the transfer line B from the interface station 3 side toward the cassette station 1. Heat treatment unit 28. A part of the residue cleaning processing unit (SCR) 21 is provided with an excimer UV irradiation unit (e — UV) 22. The excimer UV irradiation unit (e — UV) 22 is used to remove the organic matter of the substrate G before cleaning the residue, and the i-ray UV irradiation unit (i — UV) 25 is used to decolorize the image. It is set by processing. In the above-mentioned residue cleaning processing unit (SCR) 21, the substrate G therein is not rotated as in the conventional technique, but is cleaned and dried while being conveyed slightly horizontally. The above-mentioned development processing unit (DEV) 24 also has the substrate G therein which does not rotate like the conventional technology, but is developed while being transported slightly horizontally while being coated with the developing solution, and the developing solution after development Wash and dry. The residue cleaning processing unit (SCR) 21 and the development processing unit (DEV) 24 are carried by roller conveyance or belt conveyance. The entrance and exit of the substrate G are provided with relatively short sides. The transfer of the substrate G to the i-line UV irradiation unit (i-UV) 25 is continuously performed by the same mechanism as the transfer mechanism of the development processing unit (DEV) 24. The photoresist processing unit 23 is sequentially arranged in the cup 50 as shown in a ping-pong view in FIG. 2, and is dropped from a nozzle (not shown) while rotating by a spin chuck 51. Photoresist coating treatment device (CT) 23a for applying photoresist, pressure reduction drying device (VD) 23b for reducing pressure drying of a photoresist film formed on a substrate G in a pressure reduction container 52, and By scanning the solvent ejection head 53, the substrate G-11 on the mounting table 54 is used.-This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the note on the back first) Please fill in this page for the matter) Install tT --------- · Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533460 A7 B7 V. Invention Description (9) (Please read the notes on the back before filling this page ) The peripheral photoresist removal device (ER) 23c that removes excess photoresist attached to the peripheral edge of the substrate G on all four sides, and moves one pair of jib 5 6 by being guided by the guide 55 to make the substrate G at These devices are transported slightly horizontally. The photoresist processing unit 23 is provided with these carrying-in inlets 57 and carrying-out openings 58 on the opposite short sides, and the guide 55 extends outward from the carrying-in inlets 57 and carrying-out outlets 58 and forms a transferable substrate by means of a jib 56. G's status. The first heat treatment unit section 26, printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, has two heat treatment unit blocks (TB) 31, 32 and a heat treatment unit block (TB) formed by stacking heat treatment units capable of applying heat treatment to the substrate G. 31 is provided on the residue cleaning treatment unit (SCR) 21 side, and heat treatment unit block (TB) 32 is provided on the photoresist treatment unit 23 side. A first transfer device 33 is provided between the two heat treatment unit blocks (TB) 31 and 32. As shown in the side view of FIG. 3, the heat treatment unit block (TB) 31 is two pass-through units (PASS) 61 for transferring and transferring the substrate G from the lower order, and two dehydration and drying units for dehydrating and drying the substrate G. (DHP) 62, 63. It is composed of four sections of a hydrophobic treatment unit (AD) 64 that applies a hydrophobic treatment to the substrate G. The heat treatment unit block (TB) 32 is a pass-through unit for transferring the substrate G from the lower layer. (PASS) 65, two cooling units (COL) 66, 67 for cooling the substrate G, and four stages of hydrophobic processing units (AD) 68 for hydrophobicizing the substrate G. The first conveying device 33 receives the substrate G from the residue cleaning processing unit (SCR) 21 through the passage unit (PASS) 61, and carries in and out the substrate G between the heat treatment units and the passage unit ( Passive substrate G of the photoresist processing unit 23 of PASS) 65. The first conveying device 33 includes a guide 91 that extends upward and downward, a lifting member 92 that is raised and lowered along the guide rail, and a base -12 that is rotatable on the lifting member 92.-This paper size applies to Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) 533460 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (1Q) Member 93 and the substrate holder that is set to be able to move forward and backward on the base member 93 to hold the substrate G Arm 94. The raising and lowering member 92 is raised and lowered by the motor 95, the rotation of the base 93 is performed by the motor 96, and the back and forth movement of the substrate holding arm 94 is performed by the motor 97. Since the first conveying device 33 can move up, down, and rotate in this way, any one of the heat treatment unit blocks (TB) 31 and 32 can be accessed. The second heat treatment unit section 27 includes heat treatment unit blocks (TB) 34 and 35 formed by laminating heat treatment units that apply heat treatment to the substrate G. The heat treatment unit block (TB) 34 is provided on the photoresist treatment unit 23 side, and the heat treatment unit A block (TB) 35 is provided on the development processing unit (DEV) 24 side. A second transfer device 36 is provided between these two heat treatment unit blocks (TB) 34 and 35. As shown in the side view of FIG. 4, the heat treatment unit block (TB) 34 is sequentially stacked from below to pass the substrate G pass-through unit (PASS) 69, and three pre-baking units (B) for pre-baking the substrate G ( PREBAKE) 70, 71, 72 four-stage structure, heat treatment unit block (TB) 35 is sequentially stacked from below to transfer the substrate G pass unit (PASS) 73, cooling unit (COL) 74 to cool the substrate G, The substrate G is configured by performing four stages of two pre-baking units 75 and 76 of a pre-baking process. The second conveying device 36 accepts the substrate from the photoresist processing unit 23 of the pass unit (PASS) 69, and carries in and out the substrate G between the heat treatment units, and receives the image development by the direction of the pass unit (PASS) 73. Delivery and acceptance of the substrate G of the processing unit (DEV) 24 and the substrate G of the extension / cooling stage (EXT · COL) 44 at the substrate transfer section of the interface station 3 described later. In addition, the second conveying device 36 has the same structure as the first conveying device 33, and any of the heat treatment unit blocks 34 and 35 • 13-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling this page)

533460 A7 B7 五、發明說明（U ) 單元亦可進行存取。經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 第3熱處理單元部28具有對基板G施予熱處理之熱處理單元所積層而構成之熱處理單元方塊（TB)37、％，熱處理單元方塊（TB)37設置於顯像處理單元（DEV)24側’熱處理單元方塊（TB)38設置於卡匣站1側。而於此二個熱處理單元方塊（TB)37、38之間設置第3搬送裝置39。如第5圖之例面圖所示，熱處理單元方塊（TB)37從下方順序地積層進行交接基板G之通過單元（PASS)77、對基板G進行後烘乾處理之三個後烘乾單元（POBAKE)78、79、8〇之四段構成，熱處理單元方塊（TB)38從下方順序地積層後烘乾單元（POBAKE)81 、進行對基板G之交接及冷卻的通過·冷卻單元（PASS · COL)82、對基板G進行後烘乾處理之二個後烘乾單元 (PREBAKE)83、84之四段而構成。第3搬送裝置39接受藉由通過單元（PASS)77之i線UV照射單元（i 一 UV)25來的基板(} ’而進行上述熱處理早元間之基板的搬入出，並進行對夢_ 由通過·冷卻單元（PASS· COL)82之卡匣站之基板g的交接。又，第3搬送裝置39亦與第1搬送裝置33具有相同的構造，而能對熱處理單元方塊（TB)37、38之其中任何單元進行存取。又，上述殘渣洗淨處理單元（SCR)21及對準分子1；¥照射單元（e — UV)22之搬入基板G，係藉著卡匣站1之搬送裝置 11而進行。又，殘渣洗淨單元（SCR)21之基板G如上所述例如藉著滚子搬送而搬出至熱處理單元方塊（TB)3丨之通過單元（PASS)61 ’此處藉著圖式未顯示之銷的突出而將被提上 14 - 533460533460 A7 B7 5. The invention description (U) unit can also be accessed. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). The third heat treatment unit section 28 has a heat treatment unit block (TB) formed by stacking heat treatment units that apply heat treatment to the substrate G. 37%. The heat treatment unit block (TB) 37 is provided on the side of the development processing unit (DEV) 24. The heat treatment unit block (TB) 38 is provided on the cassette station 1 side. A third transfer device 39 is provided between the two heat treatment unit blocks (TB) 37 and 38. As shown in the example of FIG. 5, the heat treatment unit block (TB) 37 is sequentially stacked from below to transfer the substrate G pass-through unit (PASS) 77, and three post-drying units for post-drying the substrate G (POBAKE) consists of four sections of 78, 79, and 80. The heat treatment unit block (TB) 38 is laminated in order from below and the drying unit (POBAKE) 81 is passed. The cooling and passing unit (PASS) · COL) 82. It is composed of four sections of two post-drying units (PREBAKE) 83 and 84 for post-drying the substrate G. The third conveying device 39 receives the substrate (} 'from the i-ray UV irradiation unit (i-UV) 25 passing through the unit (PASS) 77, carries out the above-mentioned heat treatment of the substrate between the early cells, and performs the dream_ The substrate g of the cassette station passing through the cooling unit (PASS · COL) 82 is transferred. In addition, the third transfer device 39 has the same structure as the first transfer device 33, and can heat-treat the unit block (TB) 37. Access to any of the units 38 and 38. In addition, the residue cleaning processing unit (SCR) 21 and the aligning molecule 1; ¥ irradiation unit (e — UV) 22 are moved into the substrate G through the cassette station 1 It is carried out by the transfer device 11. The substrate G of the residue cleaning unit (SCR) 21 is transferred to the heat treatment unit block (TB) 3 through the pass unit (PASS) 61 as described above, for example, by roller transfer, as described above. 14-533460 for highlighting pins not shown

的基板G以第1搬送裝置33來搬送。又，對光阻劑處理單元 23之搬入基板g，係於基板G藉著第1搬送裝置33對通過單元（PASS)65進行交接後，以一對的副臂56而從搬入口 57進行。在光阻劑處理單元23係基板G藉著副臂56而通過搬出口 58並搬送至熱處理單元方塊（TB)34的通過單元（pASS)69，於此處基板G被搬出至突出的銷（圖式未顯示）。對顯像處理單元（DEV)24的基板G的搬入，係於熱處理單元方塊（ΤΒ)35 之通過單元（PASS)73使圖式未顯示之銷突出而使基板由上昇狀態至下降狀態，並使延長至通過單元（PASS)73之例如滾子搬送機構作用而進行。i線UV照射單元（i —UV)25的基板G藉著例如滚子搬送而搬出至熱處理單元方塊（TB)37的通過單元（PASS)77，此處藉著突出圖式未顯示之銷而提上的基板G乃以第3搬送裝置39而搬送。而且結束所有處理後的基板G被搬送至熱處理單元方塊（TB)38之通過·冷卻單元 (PASS · COL) 82並以卡匣站之搬送裝置11而搬出。在處理單元站2以上述方式構成二列的搬送線A、B，且呈基板上的處理順序來配置各處理單元及搬送裝置，於此搬送線A、B之間設置空間部40。並設置可往返於此空間部 40之梭（基板保持·移動構件）41。此梭41係構成可保持基板 G的狀態，而能在搬送線A、B之間交接基板G。具體而言如第6圖所示，梭41具有基座構件、設置成可出沒於基座構件1〇1表面而可昇降基板G之多數昇降銷 102、決定基板G位置之導引構件103、可驅動昇降銷之銷驅動部104、及連結部1〇5 ,連結部105係呈可滑動地連結 -15 - 本紙張尺度適而χ 297公爱〉一- (請先閱讀背面之注意事項再填寫本頁) 裝訂---------· 經濟部智慧財產局員工消費合作社印製 533460 A7 B7 五、發明說明（13 ) (請先閱讀背面之注意事項再填寫本頁) 在空間部40内朝X方向延伸之導軌1〇6。並藉著使用磁鐵之驅動、傳送帶驅動等適當的方式之圖式未顯示的驅動機構而使梭41沿著導執1〇6在空間部40内沿著X方向移動。從防塵的觀點而言，以磁鐵驅動的方式較有利。使基板朝向梭 41之交接係藉著上述第1至第3搬送裝置33、36、39來進行。又，對於梭41之基板的交接亦可藉著卡匣站1之搬送裝置 11而進行。界面站3具有在處理站2與曝光裝置4之間進行搬送基板G的搬送裝置42、配置緩衝卡匣之緩衝台（buF)43、具備冷卻功能之作為基板交接部的延伸·冷卻台（EXT · COL)44 ’且字幕器（TITLER)與周邊曝光裝置（EE)上下積層之外部裝置方塊45鄰接搬送裝置42而設置。搬送裝置42具有搬送臂42a ’藉此搬送臂42a而進行在處理站2與曝光裝置4之間之基板G的搬入出。經濟部智慧財產局員工消費合作社印製在如此構成之光阻劑塗布顯像處理裝置1〇〇 ,首先配置於卡匣站1之卡匣C内的基板G以搬送裝置11直接搬入處理站2之準分子UV照射單元（e — UV)22並進行殘潰前處理。接著以搬送裝置11將基板G搬入配置在準分子uv照射單元（e 一 UV)22下的殘渣洗淨處理單元（SCR)2i並進行殘渣洗淨。此殘渣洗淨並非如習知將基板G予以旋轉，而係一邊朝略水平地搬送基板而一邊進行洗淨處理及乾燥處理，藉此，能以更少的空間來實現相同於習知之旋轉型態使用二台殘渣洗淨處理單元所具有的處理能力。於殘渣洗淨後，例如以滾子搬送而將基板G搬出至第1熱處理單元部26所屬之熱 -16 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 533460 A7 B7 五、發明說明（14 ) 處理單元方塊（TB)31的通過單元（PASS)61。配置於通過單元（PASS)61之基板G藉圖式未顯示之銷的突出而被帶上，而被搬送至第1熱處理單元部26並進行以下的一連串處理。即，首先，最初被搬送至熱處理單元方塊（TB)3 1之脫水烘乾單元（DHP)62、63之其中任何之一並加熱處理，接著被搬送至熱處理單元方塊（TB)32之冷卻單元 (COL)66、67之其中任何之一並冷卻後，為了提高光阻劑之穩定性而搬送至熱處理單元方塊（TB)3 1之疏水化處理單元 (AD)64、及熱處理單元方塊（TB)32之疏水化處理單元 (AD)68之其中任何之一，而在此處以HMDS疏水化處理，其後搬送至上述冷卻單元（COL)66、67之其中任何之一並冷卻，而且搬送至熱處理單元方塊（TB)32之通過單元 (PASS)65。此時之搬送處理全部在第1搬送裝置33進行。又，亦有不進行疏水化處理的情形，此情形下係於脫水烘乾及冷卻之後立即搬送到通過單元（PASS)65。其後藉著光阻劑處理單元23之到臂56而將配置於通過單元（PASS)65之基板G搬入光阻劑處理單元23内。首先基板 G被搬至其中的光阻劑處理裝置（CT)23a，在此處實施對基板G光阻劑的旋轉塗布，其次藉著副臂56而搬送到減壓乾燥裝置（VD)23b並減壓乾燥，而且以副臂56搬送至周緣光阻劑去除裝置（ER)23c並去除基板G周緣之多餘部分。周緣光阻劑去除終了後，藉著副臂56而從光阻劑處理單元23搬出基板G。如此一來，光阻劑處理裝置（CT)23a之後設置減壓乾燥裝置（VD)23b之情形，其理由在於若是不設置此構件之情 -17 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) · ϋ ϋ ϋ a— —>i I 一 I ϋ ϋ ·1 ϋ ϋ ϋ _ 經濟部智慧財產局員工消費合作社印製 533460 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（15 ) 形下，係將已塗布光阻劑之基板G予以預先烘乾處理之後或是顯像處理之後的後烘乾處理後，則會有昇銷、固定銷等形狀複製到基板G的情形，然而如此藉著減壓乾燥裝置 (VD)以不加熱狀態而進行乾燥，而能慢慢地放出光阻劑中的溶劑，因此不會產生因加熱而乾燥之急劇乾燥狀態，因此能不會對光阻劑造成不良影響而能促使光阻劑的乾燥，並且能有效地防止複製到基板上者。如此進行以結束塗布處理，藉著副臂56從光阻劑處理單元23搬出的基板G交接至第2熱處理單元部27所屬之熱處理單元方塊（TB)34之通過單元（PASS)69。配置於通過單元 (PASS)69之基板G藉第2搬送裝置36而搬送至熱處理單元方塊（TB)34之預先烘乾單元（PREBAKE)70、71，或是熱處理單元方塊（TB)35之預先烘乾單元（PREBAKE)75、76之其中任何之一並進行預先烘乾處理，其後搬送至熱處理單元方塊（TB)35之冷卻單元（COL)74而冷卻至預定溫度。且藉著第 2搬送裝置36而搬送至熱處理單元方塊（TB)35之通過單元 (PASS)73 ° 其後，藉著第2搬送裝置36將基板G搬送至界面站3之延伸·冷卻台（EXT · COL)44，並以界面站3之搬送裝置42搬送至外部裝置方塊45之周邊曝光裝置（EE)並進行用以去除周邊光阻劑的曝光，其次以搬送裝置42搬送至曝光裝置4 而在此曝光基板G上的光阻劑膜以形成預1定的圖案。視情形將基板G收容在緩衝台（BUF)43上的緩衝卡匣之後將基板搬送至曝光裝置。 -18 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝--------訂---------. 533460 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（16 ) 曝光結束後，藉著界面站3的搬送裝置42而將基板G搬入外部裝置方塊45之上段的字幕器（TITLER)而對基板g記上預疋的資訊後，載置於延伸·冷卻台（EXT · c〇L)44，並從該處再度搬入處理站8。即，基板G藉著搬送裝置36而搬送至第2熱處理單元部27所屬之熱處理單元方塊（tb)352 通過單元（PASS)73。於通過單元（1>八“)73使銷突出而將基板G從上昇的狀態下降，藉此從顯像處理單元（DEV)24延長至通過單tg(PASS)73之例如使滚子機構作用而使基板G搬送至顯像處理單元（DEV)24並進行顯像處理。此顯像處理並非使基板如習知那般地旋轉，乃例如藉著滚子一邊朝向略水平方向搬送而一邊進行塗布顯像液、去除顯像後的顯像液，以及乾燥處理，如此一來，能以更少的空間來實現相同於習知之旋轉型態使用三台顯像處理處理單元所具有的處理能力。顯像處理結束後，從顯像處理單元（DEV)24將基板以連續的搬送機構，例如滾子搬送而搬送至1線1；乂照射單元（i —UV)25，並對基板G施予脫色處理。其後藉著照射單元（i—UV)25内的搬送機構，例如滾子搬送而將基板g搬出至第3熱處理單元部28所屬之熱處理單元方塊（丁…”的通過單元（PASS)77。經配置於通過單元（PASS)77之基板G藉著第3搬送裝置 39而搬送至熱處理單元方塊（TB)37之後供乾單元 (P〇BAKE)78、79、80，及熱處理單元方塊（TB)38之後烘$ 單元（POBAK聊、83、84之其中任何之—並進行後烘乾處0 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁} --------訂---------Ί 19 五、發明說明（17 ) 理，其後搬送至熱處理單元方塊（TB)38之通過·冷卻單元 (PASS · COL)82而冷卻至預定溫度後，藉著卡匣站〗之搬送裝置11而收容在配置於卡匣站丨]之預定的卡gc。如上所述，構成一邊將基板G以略水平地搬送於殘渣洗淨處理單元（SCR)21、光阻劑處理單元23及顯像處理單元 (DEV)24之中而一邊進行預定的液處理，以如此的處理順序將被處理基板之搬送線配置成平行的二列，可一邊將被處理基板沿著平行的二列搬送線A、；8來搬送而一邊進行一連串處理，因此能維持高流通率，同時可不須要如習知那般地在多數處理單元之間行進之大規模的中央搬送裝置及此等構件所行進之中央搬送路徑，其效果乃能達到節省空間化且能縮小裝置面積。又，殘渣洗淨處理單元（scr)2i及顯像處理單元（DEV)24乃可不旋轉基板〇而一邊朝水平方向搬送而一邊進行處理之所謂平流方式，因此可減少習知技術之旋轉基板G之際常發生的煙霧（mist)情形。又，於各個殘渣洗淨處理單元（SCR)21、光阻劑處理單几23及顯像處理單元（DEV)242各液處理單元，彙集要進行其後之熱處理之多數熱處理單元而從第1起設置熱處理單 ^ 27 28，且係將此等熱處理單元部以多數段積層 Μ理單元之減理單元方塊(TB)來構成，故其效果乃二 =小裝置面積同時可極力弄少基板G搬送之熱處理而能沿者基板之處理流路來進行，因此能更提高流通率。又，對應各個熱處理單元部而設置各熱處理單元部專用之第1至第3搬运裝置33、36、39，故亦可藉此提高流通率。 X 297公釐）本紙張尺度適财關家 -20 - 533460 A7The substrate G is transferred by the first transfer device 33. The substrate g carried in the photoresist processing unit 23 is transferred to the substrate G from the loading port 57 by a pair of jib 56 after the substrate G transfers the passing unit (PASS) 65 through the first transfer device 33. In the photoresist processing unit 23, the substrate G passes through the carrying port 58 through the sub-arm 56 and is transferred to the pass unit (pASS) 69 of the heat treatment unit block (TB) 34, where the substrate G is carried out to a protruding pin ( Schematic not shown). The carrying of the substrate G of the development processing unit (DEV) 24 is carried out by the pass unit (PASS) 73 of the heat treatment unit block (TB) 35 so that pins not shown in the figure are protruded and the substrate is moved from an ascending state to a descending state, and The extension is performed by, for example, the roller conveyance mechanism of the pass unit 73 (PASS). The substrate G of the i-ray UV irradiation unit (i-UV) 25 is carried out to the pass unit 77 (PASS) 77 of the heat treatment unit block (TB) 37 by roller conveyance, for example, by highlighting pins not shown in the figure. The lifted-up substrate G is transferred by the third transfer device 39. The substrate G after all the processing is completed is transferred to the pass / cool unit (PASS · COL) 82 of the heat treatment unit block (TB) 38 and is carried out by the transfer device 11 of the cassette station. The processing unit station 2 constitutes two rows of transfer lines A and B in the manner described above, and arranges each processing unit and transfer device in the processing order on the substrate. A space section 40 is provided between the transfer lines A and B. A shuttle (substrate holding / moving member) 41 is provided to and from this space portion 40. The shuttle 41 is configured so that the substrate G can be held, and the substrate G can be transferred between the transfer lines A and B. Specifically, as shown in FIG. 6, the shuttle 41 includes a base member, a plurality of lifting pins 102 provided to be able to move up and down the substrate G on the surface of the base member 101, a guide member 103 that determines the position of the substrate G, The pin driving part 104 that can drive the lifting pin, and the connecting part 105, and the connecting part 105 are slidably connected -15-This paper is of a suitable size and χ 297 public love> I-(Please read the precautions on the back before (Fill in this page) Binding --------- · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533460 A7 B7 V. Invention Description (13) (Please read the precautions on the back before filling this page) In the space The guide rail 106 extending in the X direction in the portion 40. The shuttle 41 is moved in the X direction in the space portion 40 along the guide 106 by a drive mechanism (not shown) in a suitable manner such as a magnet drive or a belt drive. From the viewpoint of dust prevention, it is advantageous to use a magnet drive. The transfer of the substrate to the shuttle 41 is performed by the first to third transfer devices 33, 36, and 39 described above. The transfer of the substrates of the shuttle 41 can also be performed by the transfer device 11 of the cassette station 1. The interface station 3 includes a transfer device 42 that transfers the substrate G between the processing station 2 and the exposure device 4, a buffer stage (buF) 43 provided with a buffer cassette, and an extension / cooling stage (EXT) as a substrate transfer unit having a cooling function. · COL) 44 ′, and the external device block 45 laminated on the top and bottom of the peripheral exposure device (EE) is disposed adjacent to the conveying device 42. The conveying device 42 has a conveying arm 42a ', thereby carrying in and out the substrate G between the processing station 2 and the exposure device 4. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the photoresist-coated imaging processing device 100 constructed in this way. First, the substrate G arranged in the cassette C of the cassette station 1 was directly transferred into the processing station 2 by the transport device 11 The excimer UV irradiates the unit (e — UV) 22 and performs a pre-crushed treatment. Next, the substrate G is carried into the residue cleaning processing unit (SCR) 2i disposed under the excimer UV irradiation unit (e_UV) 22 by the transfer device 11 and the residue is cleaned. This residue cleaning does not rotate the substrate G as it is conventionally, but performs a cleaning process and a drying process while conveying the substrate slightly horizontally, thereby realizing the same rotation type as the conventional one with less space. It uses the processing power of two residue washing treatment units. After the residue is cleaned, for example, the substrate G is carried out by rollers to the heat of the first heat treatment unit 26-16-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 533460 A7 B7 V. Description of the invention (14) Passing unit (PASS) 61 of processing unit block (TB) 31. The substrate G disposed on the pass unit (PASS) 61 is brought on by the protrusion of a pin (not shown), and is transferred to the first heat treatment unit unit 26 and is subjected to the following series of processes. That is, first, it is first transferred to any one of the dehydration and drying units (DHP) 62 and 63 of the heat treatment unit block (TB) 31 and heat-treated, and then is transferred to the cooling unit of the heat treatment unit block (TB) 32. (COL) 66 or 67 and cooled, and then transferred to the heat treatment unit block (TB) 3 1 of the hydrophobization treatment unit (AD) 64 and the heat treatment unit block (TB) to improve the stability of the photoresist. ) 32 of any of the hydrophobizing treatment unit (AD) 68, and here is HMDS hydrophobizing treatment, and then transferred to any of the above-mentioned cooling unit (COL) 66, 67 and cooled, and transferred to Passing unit (PASS) 65 of heat treatment unit block (TB) 32. All the transfer processes at this time are performed by the first transfer device 33. In addition, there are cases where the hydrophobization treatment is not performed. In this case, it is transported to the pass unit (PASS) 65 immediately after dehydration, drying and cooling. Thereafter, the substrate G disposed on the pass-through unit (PASS) 65 is carried into the photoresist processing unit 23 by reaching the arm 56 of the photoresist processing unit 23. First, the substrate G is transferred to a photoresist processing device (CT) 23a therein, and spin coating of the substrate G photoresist is performed here. Then, the substrate G is transferred to a decompression drying device (VD) 23b by a sub-arm 56 and It is dried under reduced pressure, and is conveyed to the peripheral photoresist removal device (ER) 23c by the sub-arm 56 to remove excess portions on the peripheral edge of the substrate G. After the peripheral photoresist is removed, the substrate G is carried out from the photoresist processing unit 23 by the auxiliary arm 56. In this case, the reason for the installation of a reduced pressure drying device (VD) 23b after the photoresist treatment device (CT) 23a is that if this component is not installed -17-This paper standard applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) (Please read the precautions on the back before filling out this page) · ϋ ϋ ϋ a— — &i; i I 1 I ϋ 1 · 1 ϋ ϋ ϋ _ Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed 533460 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (15) In the form, the substrate G coated with photoresist is pre-baked or post-baked after development After the drying process, the shape of the lifting pin and fixing pin may be copied to the substrate G. However, by using a vacuum drying device (VD) to dry without heating, the photoresist can be slowly released. Solvent, it does not produce a sharp dry state due to heating, so it can promote drying of the photoresist without adversely affecting the photoresist, and can effectively prevent copying onto the substrate. This is done to complete the coating process, and the substrate G carried out from the photoresist processing unit 23 by the sub-arm 56 is transferred to the pass unit (PASS) 69 of the thermal processing unit block (TB) 34 to which the second thermal processing unit 27 belongs. The substrate G disposed in the pass unit 69 is transferred to the pre-baking unit 70, 71 of the heat treatment unit block (TB) 34 by the second transfer device 36, or the pre-baking unit block (TB) 35 of the heat treatment unit Any one of the drying units (PREBAKE) 75 and 76 is subjected to a pre-drying treatment, and then transferred to a cooling unit (COL) 74 of the heat treatment unit block (TB) 35 and cooled to a predetermined temperature. Furthermore, the second transfer device 36 is used to transfer the heat treatment unit block (TB) 35 to the pass unit (PASS) 73 °. Thereafter, the second transfer device 36 is used to transfer the substrate G to the extension / cooling stage of the interface station 3 ( EXT · COL) 44, and transfer it to the peripheral exposure device (EE) of the external device block 45 by the transfer device 42 of the interface station 3 and perform exposure to remove the peripheral photoresist, and then transfer it to the exposure device 4 by the transfer device 42 Then, the photoresist film on the substrate G is exposed to form a predetermined pattern. If necessary, the substrate G is stored in a buffer cassette on a buffer stage (BUF) 43 and then the substrate is transported to the exposure device. -18-This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page). -------- Order ----- ----. 533460 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention (16) After the exposure, the substrate G is moved into the external device by the transfer device 42 of the interface station 3, and the subtitle above the block 45 The device (TITLER) records the information on the substrate g in advance, places it on the extension / cooling table (EXT · col) 44 and loads it into the processing station 8 again from there. That is, the substrate G is transferred to the heat treatment unit block (tb) 352 pass unit (PASS) 73 to which the second heat treatment unit unit 27 belongs by the transfer device 36. The substrate G is lowered from the raised state by protruding the pins through the unit (1 > eight ") 73, thereby extending from the development processing unit (DEV) 24 to the single tg (PASS) 73 for example to make the roller mechanism work The substrate G is transferred to a development processing unit (DEV) 24 and subjected to development processing. This development processing does not rotate the substrate as it is conventionally performed, for example, it is carried out while being transported in a slightly horizontal direction by a roller Applying the developing solution, removing the developing solution, and drying the process, so that it can achieve the same processing capacity as the conventional rotating type with three imaging processing units in less space. After the development process is completed, the substrate is transferred from the development processing unit (DEV) 24 to the first line 1 by a continuous transfer mechanism, such as a roller; the radon irradiation unit (i-UV) 25 is applied to the substrate G. After that, the substrate g is transferred to the heat treatment unit block (Ding ...) through the conveyance unit (i.e., UV) 25 in the irradiation unit (i-UV) 25, such as a roller. PASS) 77. Configured to pass The substrate G of the unit (PASS) 77 is transferred to the heat treatment unit block (TB) 37 by the third transfer device 39, and is then dried after the dry unit (POBAKE) 78, 79, 80, and the heat treatment unit block (TB) 38. $ Unit (any of POBAK chat, 83, 84-and post-drying place 0 This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling This page} -------- Order --------- Ί 19 V. Description of the invention (17), and then transfer it to the heat treatment unit block (TB) 38 through the cooling unit (PASS) · COL) 82, and after cooling to a predetermined temperature, it is accommodated in a predetermined card gc disposed at the cassette station by the transport device 11 of the cassette station. As described above, the substrate G is configured to be horizontally slightly It is conveyed in the residue cleaning processing unit (SCR) 21, photoresist processing unit 23, and development processing unit (DEV) 24 while performing predetermined liquid processing, and the processing line of the substrate to be processed is arranged in this processing sequence In two parallel rows, the substrate to be processed can be transported along the two parallel rows of the transfer lines A, 8; A series of processes can be carried out, so that a high flow rate can be maintained, and at the same time, a large-scale central conveying device that travels between most processing units as well as a central conveying path that these components travel does not need to be achieved. The effect can be achieved. Space saving and reduction of equipment area. The residue cleaning processing unit (scr) 2i and development processing unit (DEV) 24 are so-called advection systems that can carry the processing in the horizontal direction without rotating the substrate. It is possible to reduce the mist that often occurs when rotating the substrate G in the conventional technology. In addition, in each of the residue cleaning processing unit (SCR) 21, the photoresist processing unit 23, and the development processing unit (DEV) 242, each liquid processing unit collects most of the heat treatment units to be subjected to subsequent heat treatment, and starts from the first A heat treatment unit ^ 27 28 is set up, and these heat treatment unit parts are composed of a reduction unit block (TB) of a multi-layer laminated M unit, so the effect is two = small device area and the substrate G can be reduced as much as possible. The heat treatment of the conveyance can be performed along the processing flow path of the substrate, so the flow rate can be further improved. In addition, since the first to third conveying devices 33, 36, and 39 dedicated to each heat treatment unit section are provided corresponding to each heat treatment unit section, the flow rate can also be improved by this. X 297 mm) This paper is suitable for financial affairs -20-533460 A7

五、發明說明（18 ) 以上所述係基本上的處理模式，而本實施樣態因於處理單元站2在二列的搬送線a、B之間設置空間部40，而設置可往返運動於此空間部4〇的梭41，故在上述基本上的處理模式之外可進行各種的處理模式而可達到高的處理自由度。例如在僅要進行光阻劑處理的情形下，可如以下的順序來進行。首先，預先將梭41移動至鄰接卡匣站1的位置，其次藉著搬送裝置11取出一片於匣c的基板G而載置於梭 41上，將梭41移動至對應第丨搬送裝置33的位置，藉著第1 搬送裝置33將梭41上的基板G搬送至疏水化處理單元 (AD)64、66之其中任何之一，對基板G進行疏水化處理後以冷卻單元（COL)66或67冷卻基板G並經過熱處理單元方塊（TB)32之通過單元（PASS)65而搬入光阻劑處理單元23。於光阻劑處理單元23以周緣光阻劑去除裝置（ER)23c進行去除光阻劑結束，將基板G搬出熱處理單元方塊（TB)34之通過單元（PASS)69，以第2搬送裝置36將基板G載置於梭41而回到卡匣站1。又，不進行疏水化處理的情形，係從梭41 接受基板G之第1搬送裝置33直接將基板搬送到通過單元 (PASS)65 〇又，僅進行顯像處理的情形乃可依以下順序來進行。首先，將從卡匣站1接受基板G之梭41移動至對應第2搬送裝置36的位置，以第2搬送裝置36將梭41上的基板G經過熱處理單元方塊（TB)35之通過單元（PASS)73而搬入顯像處理單元（DEV)24。結束了以顯像處理及i線UV照射單元（i 一 21 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 ----訂--------- 經濟部智慧財產局員工消費合作社印製V. Description of the invention (18) The above is the basic processing mode, and this embodiment is because the processing unit station 2 is provided with a space portion 40 between the two rows of the conveying lines a and B, and is provided with a reciprocating motion. The shuttle 41 of the space unit 40 can perform various processing modes in addition to the basic processing mode described above, and can achieve a high degree of processing freedom. For example, when only a photoresist treatment is to be performed, it can be performed in the following order. First, the shuttle 41 is moved to a position adjacent to the cassette station 1 in advance, and then the substrate G on the cassette c is taken out by the transfer device 11 and placed on the shuttle 41, and the shuttle 41 is moved to the position corresponding to the first transfer device 33. Position, the substrate G on the shuttle 41 is transferred to any of the hydrophobic processing units (AD) 64 and 66 by the first transfer device 33, and the substrate G is subjected to the hydrophobic processing and then the cooling unit (COL) 66 or 67 cools the substrate G and passes through the heat treatment unit block (TB) 32 pass unit (PASS) 65 to carry it into the photoresist processing unit 23. In the photoresist processing unit 23, the photoresist is removed by the peripheral photoresist removal device (ER) 23c, and the substrate G is taken out of the pass unit (PASS) 69 of the heat treatment unit block (TB) 34, and the second conveying device 36 The substrate G is placed on the shuttle 41 and returned to the cassette station 1. In the case where no hydrophobization treatment is performed, the first transfer device 33 that receives the substrate G from the shuttle 41 directly transfers the substrate to the pass unit (PASS) 65. Moreover, in the case where only the development processing is performed, the following procedures can be performed. get on. First, the shuttle 41 that receives the substrate G from the cassette station 1 is moved to a position corresponding to the second transfer device 36, and the second transfer device 36 passes the substrate G on the shuttle 41 through the passing unit of the heat treatment unit block (TB) 35 ( PASS) 73 and carried into a development processing unit (DEV) 24. The imaging processing and i-ray UV irradiation unit are finished (i ~ 21 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)) --- Order --------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

-ϋ ϋ ϋ (請先閱讀背面之注意事項再填寫本頁) 533460 A7 I---------B7__ 五、發明說明（19 ) UV)25之脫色處理之後，將基板（}搬出熱處理單元方塊 (TB)37之通過單元（PASS)77而藉著第3搬送裝置π將基板g 載置於梭41上並回到卡匣站1。又，不使用梭41時，可藉著將梭41退避到空間部4〇之 I 知部的方式而能將空間部40作為保養維護空間使用。如此構成的梭41乃與習知之中央搬送裝置不同，由於僅保持被處理基板並移動而已，故不必要大型的機構，而不必要習知之用以行進中央搬送裝置之中央搬送路徑那般大的空間，因此即使是設置梭41亦可維持節省空間的效其次，說明本發明之第2實施樣態。第7圖表示本發明之第2實施樣態之1^〇玻璃基板之光阻劑塗布顯像處理裝置的平面圖。上述第1實施樣態係將基板G從位於卡匣站丨之丫方向的一側端部來搬入處理站），並從另一側端部搬出，惟，本實施樣態之光阻劑塗布顯像處理裝置100’係具有從卡匣站丨之中央進行搬入出基板G的處理站2。具體而g，處理站2’係取代上述第3熱處理單元部 28而於對應卡匣站丨之丫方向中央的部分配置積層與熱處理單元方塊（TB)38相同單元之熱處理單元方塊（Τβ)38，，於搬送線B之終點没置其配設與熱處理單元方塊（Tg)3 7相同單元之熱處理單元方塊（TB)37,之第3熱處理單元部28，，而將第3搬送裝置39,設置於空間部40之卡匣站丄側端部，而將基板G之對於處理站2’之搬入出以透過任何熱處理單元方塊 (TB)38,之通過·冷卻單元（PASS · c0L)而藉著第3搬送裝 22 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）裝 ----訂--------- 經濟部智慧財產局員工消費合作社印製 533460 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（2Q ) 置39’來進行。又，基板G之搬入出樣態與第丨實施樣態不同的關係上’本實施樣態之搬入口係對應第3搬送裝置39，而使設置在空間部40側之殘渣洗淨處理單元（SCR)21，及準分子UV照射單元（e —UV)22,與第i實施樣態同樣地積層設置。又，從i線UV照射單元（i —UV)25至熱處理單元方塊 (TB)37’的基板G搬送係例如藉著滾子來進行。本實施樣態亦進行與第1實施樣態相同的滾子處理。此時第3搬送裝置39’於基板G之交接時一定旋轉9〇度，故從第 3搬送裝置39’將基板G搬入例如殘渣洗淨處理單元（scr)2 1 的時點，基板G之方向會錯開90度。為了防止此一情形，乃預先於熱處理單元方塊（TB)38,之通過·冷卻單元（pASS · COL)設置旋轉機構。由於本實施樣態係從卡匣站1之中央進行基板的搬入出，因此卡匣站並非如圖式之構造，而係例如搬送裝置不能朝向Y方向移動的型態，而可對應指定為泛用性高的裝置〇其次說明本發明之第3實施樣態。第8圖表示本發明之第3實施樣態之lcd玻璃基板之光阻劑塗布顯像處理裝置的平面圖。本實施樣態之光阻劑塗布顯像處理裝置1〇〇,與第1及第2實施樣態之梭41不同點乃具有不同型態的梭41，，且在空間部40之卡匣站！的側端部具有進行在卡匣站1之搬送裝置U與梭41，之間交接基板G 的交接機構110。其他則與第1實施樣態相同構成。梭41如第9圖所示具有基座121、設置於基座121表面之 ^ t--------IT--------- (請先閱讀背面之注意事項再填寫本頁) 23 533460 A7 B7 經濟部智慧財產局員工消費合作社印製五、發明說明（21 四角落近處而支持基板G的4根支持銷122、以及連結部123 ，連結部123乃可滑動地連結於在空間部4〇内朝著χ方向延伸的導執124。基座構件121之中央形成圓形而中空的中空部 125。另一方面，交接機構11〇如第10圖所示，具有用以支持基板G之支持部131、可昇降支持部131之圓柱132、及藉著旋轉圓柱132而旋轉被支持之基板g的旋轉機構133。支持部 131具有安裝於圓柱132之活塞134上端的十字形狀構件135 、及支持從十字形狀構件135之四個端部向上方突出之基板 G的四個支持銷136。將基板G從搬送機構11交遞至梭4 Γ之際，如第1 〇圖所示，將梭41’設成其中空部125對應於搬送裝置11〇之支持銷 136。具體而言，如第11圖（a)〜（c)所示進行交接。首先，如第11圖（a)所示，將梭41，移動到對應交接機構110的位置 ’以此狀態下如第11圖⑻所示，支持銷136藉著圓柱132而通過中空部125並向上方突出那般地使支持部13丨上昇。從搬送機構11將基板G交接至支持部121上，並在此狀態下藉著旋轉機構133而旋轉圓柱132而使基板G呈90度旋轉。接著以圓柱132來下降支持部13 1，如此一來，基板g如第11圖（c) 所示被載置於設置在基座構件121的支持銷122上。將基板G從梭41’交接至第1〜第3搬送機構33、36、39 的清形’乃精者將各搬送機構的臂***基板G與基座構件 121之間的空間之後’將臂帶上而實現，此一將基板〇從搬送機構交接至梭41’的情形，係將基板g置於基座構件121 -24 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱) ----^-------·裝--------訂---------^9. (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（22 ) 之際，藉著下降該臂而將基板G載置於支持銷122上。如此藉在著父接機構110而能調整將基板G從搬送機構父接至梭41之際之基板G的方向。亦即搬送裝置11係將基板G之長邊方向設為χ方向而保持基板〇，因此在僅從搬送機構11將基板父接至梭41，的情形，在梭41，上的話，基板G 之長邊方向成為X方向。以此狀態下，將基板G從梭41，交接至第1〜第3搬送機構33、36、39之其中任之一時，從此等搬送機構將基板搬送至各處理單元之際，基板G之方向會錯開90度。相對於此，藉著在交接機構11〇將基板G旋轉9〇度而能化解此一不良情形。如此藉著設置交接機構11〇而能不必在各個搬送機構設置用以旋轉基板(}的機構而可使基板朝向一定的方向來搬送。又，本實施樣態因在梭41，不存在銷驅動部，故能達到輕里化，且能減輕對驅動機構的負擔。又，由於梭4丨，不存在圓柱，因此對於移動之梭41，不必要空氣配管。其次說明梭之其他例子。此例子之梭41”如第12圖所示，具有支持基板G之空間構件141、及相對於空間構件141設置成可自由著脫而覆蓋工間構件上方的覆蓋構件142。在搬送基板G時，如第丨2圖 (句所示，藉著該覆蓋構件142而使基板G存在於密閉空間。並形成包圍該空間構件142的側壁狀態，基座構件141與覆蓋構件142藉著圖式未顯示之鎖機構形成圖（a)之鎖上的狀態。在各搬送機構與梭，，之間進行交接基板^之際，鎖機構呈開啟狀悲’而如第12圖（b)所示藉著設置於交接梭41，，本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）-ϋ ϋ ϋ (Please read the precautions on the back before filling this page) 533460 A7 I --------- B7__ V. Description of the invention (19) UV) 25 After decoloring, remove the substrate () The heat treatment unit block (TB) 37 passes through the unit (PASS) 77 and the substrate g is placed on the shuttle 41 by the third transfer device π and returned to the cassette station 1. When shuttle 41 is not used, the The shuttle 41 can be used as a maintenance space by retreating the shuttle 41 to the control unit 40. The shuttle 41 thus constructed is different from the conventional central conveying device in that it only holds the substrate to be processed and moves it. Therefore, it is not necessary to have a large-scale mechanism, and it is not necessary to know the space as large as the central conveying path of the central conveying device. Therefore, even if the shuttle 41 is installed, the space saving effect can be maintained. Next, the second aspect of the present invention is explained. Fig. 7 shows a plan view of a photoresist-coated development processing device for a 1 ^ 〇 glass substrate in a second embodiment of the present invention. The above-mentioned first embodiment includes the substrate G from a cassette station. To the processing station), and from Unloading one end, but, the present embodiment is applied photoresist developing treatment like state of the device 100 'performs the carrying system having a substrate processing station 2 from the center G of the cassette station Shu. Specifically, the processing station 2 'is a heat treatment unit block (Tβ) 38 which is the same unit as the heat treatment unit block (TB) 38, instead of the third heat treatment unit part 28, and is disposed in the center of the corresponding direction of the cassette station. At the end of the transfer line B, there is no heat treatment unit block (TB) 37 equipped with the same unit as the heat treatment unit block (Tg) 37, the third heat treatment unit section 28, and the third transfer device 39, It is installed at the end of the cassette station 丄 side of the space section 40, and the substrate G is moved into and out of the processing station 2 'to pass through any heat treatment unit block (TB) 38, and passed through the cooling unit (PASS · c0L). The third paper size is 22. This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm). ---- Order --------- Printed by the Employees' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 533460 Printing of A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The Invention Note (2Q) is set at 39 '. In addition, the loading and unloading state of the substrate G is different from the first embodiment. The loading port of this embodiment corresponds to the third conveying device 39, and a residue cleaning processing unit (on the side of the space unit 40) is provided. SCR) 21 and excimer UV irradiation unit (e-UV) 22 are laminated in the same manner as in the i-th embodiment. The substrate G transfer from the i-ray UV irradiation unit (i-UV) 25 to the heat treatment unit block (TB) 37 'is performed by, for example, a roller. This embodiment also performs the same roller processing as the first embodiment. At this time, the third transfer device 39 'must rotate 90 degrees when the substrate G is transferred. Therefore, when the substrate G is transferred from the third transfer device 39' to, for example, the residue cleaning processing unit (scr) 2 1, the direction of the substrate G Will be staggered 90 degrees. In order to prevent this, a rotation mechanism is set in advance in the heat treatment unit block (TB) 38, the pass-cooling unit (pASS · COL). Since the form of this embodiment is to carry in and out the substrate from the center of the cassette station 1, the cassette station is not structured as shown in the figure, but for example, the type in which the conveying device cannot move in the Y direction can be designated as a pan. A highly usable device. Next, a third embodiment of the present invention will be described. Fig. 8 is a plan view of a photoresist coating development processing apparatus for an LCD glass substrate according to a third embodiment of the present invention. The photoresist coating development processing device 100 of this embodiment is different from the shuttle 41 of the first and second embodiments in that the shuttle 41 has a different type of shuttle 41 and is located at the cassette station of the space section 40. !! The side end portion has a transfer mechanism 110 for transferring the substrate G between the transfer device U and the shuttle 41 of the cassette station 1. The other configurations are the same as those of the first embodiment. The shuttle 41 has a base 121 as shown in FIG. 9 and is provided on the surface of the base 121 ^ t -------- IT --------- (Please read the precautions on the back before filling This page) 23 533460 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (21 Four support pins 122 near the four corners and supporting the substrate G, and the connecting part 123, the connecting part 123 is slidably It is connected to a guide 124 extending in the χ direction in the space portion 40. The center of the base member 121 forms a circular and hollow hollow portion 125. On the other hand, the transfer mechanism 11 has, as shown in FIG. A supporting portion 131 for supporting the substrate G, a cylinder 132 for raising and lowering the supporting portion 131, and a rotation mechanism 133 for rotating the supported substrate g by rotating the cylindrical 132. The supporting portion 131 has an upper end of a piston 134 mounted on the cylinder 132. The cross-shaped member 135 and the four supporting pins 136 supporting the substrate G protruding upward from the four ends of the cross-shaped member 135. When the substrate G is delivered from the conveying mechanism 11 to the shuttle 4 Γ, it is the same as the first one. As shown in the figure, the shuttle 41 ′ is provided as a support pin in which the hollow portion 125 corresponds to the conveying device 11. 136. Specifically, the transfer is performed as shown in Figs. 11 (a) to (c). First, as shown in Fig. 11 (a), the shuttle 41 is moved to a position corresponding to the transfer mechanism 110 'in this state. As shown in FIG. 11 (a) below, the support pin 136 rises through the hollow portion 125 and projects upward through the cylindrical portion 132. The substrate G is transferred from the transfer mechanism 11 to the support portion 121, and In this state, the rotation of the cylinder 132 by the rotation mechanism 133 causes the substrate G to rotate 90 degrees. Then, the supporting portion 13 1 is lowered by the cylinder 132, so that the substrate g is loaded as shown in FIG. 11 (c). It is placed on the support pin 122 provided on the base member 121. The substrate G is transferred from the shuttle 41 'to the clear shape of the first to third transfer mechanisms 33, 36, and 39. The inserter inserts the arms of each transfer mechanism into the substrate. After the space between G and the base member 121 is realized by 'on the armband, the case of transferring the substrate 0 from the conveying mechanism to the shuttle 41' is to place the substrate g on the base member 121 -24-this paper Standards apply to China National Standard (CNS) A4 specifications (210 X 297 public love) ---- ^ ------- · installation -------- order --------- ^ 9. (Please Read the notes on the back and fill in this page again.) A7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. In the description of the invention (22), the substrate G is placed on the support pin 122 by lowering the arm. The direction of the substrate G when the substrate G is transferred from the transfer mechanism to the shuttle 41 can be adjusted under the parent receiving mechanism 110. That is, the conveying device 11 holds the substrate G by setting the longitudinal direction of the substrate G to the χ direction. Therefore, in the case where the substrate is only connected to the shuttle 41 ′ from the transport mechanism 11, the longitudinal direction of the substrate G becomes the X direction when the substrate is on the shuttle 41 ′. In this state, when the substrate G is transferred from the shuttle 41 to any of the first to third transfer mechanisms 33, 36, and 39, when the substrate is transferred from these transfer mechanisms to each processing unit, the direction of the substrate G Will be staggered 90 degrees. On the other hand, this problem can be resolved by rotating the substrate G by 90 degrees at the transfer mechanism 110. By providing the transfer mechanism 11 in this way, the substrate can be transported in a certain direction without having to provide a mechanism for rotating the substrate () in each transport mechanism. In addition, since the pin 41 is not driven in the shuttle 41 It can reduce the weight and reduce the load on the drive mechanism. Moreover, since the shuttle 4 丨 does not have a cylinder, air piping is unnecessary for the moving shuttle 41. Next, another example of the shuttle will be described. This example As shown in FIG. 12, the shuttle 41 ″ includes a space member 141 supporting the substrate G, and a cover member 142 which is provided on the space member 141 so as to be able to freely move on and off so as to cover the upper part of the workshop member. FIG. 2 (as shown in the sentence, the substrate G exists in the closed space by the cover member 142. A side wall state surrounding the space member 142 is formed, and the base member 141 and the cover member 142 are not shown in the drawings The lock mechanism forms the state of the lock shown in (a). When the transfer mechanism and the shuttle are transferred to and from the substrate ^, the lock mechanism is opened, and it is installed as shown in FIG. 12 (b). In transfer shuttle 41, This paper scale applicable Chinese National Standard (CNS) A4 size (210 X 297 mm)

_'I φ Μ--------tr--------- (請先閱讀背面之注意事項再填寫本頁) 25 533460 A7_'I φ Μ -------- tr --------- (Please read the precautions on the back before filling this page) 25 533460 A7

經濟部智慧財產局員工消費合作社印製五、發明說明（23 ) 位置之多數例如四根圓柱143(圖式僅顯示二根）而使覆蓋構件142上昇。如此一來，因藉著覆蓋構件142而使基座構件 141上的基板G存在領域成為密閉空間，故以梭，，搬送基板G 時’能防上微粒附著在基板G的情形。又，由於在梭41，，未設置覆蓋構件142開閉用的圓柱，故能避免空氣配管之繁雜作業。又，本發明並不限於上述實施樣態，而在本發明之思想範圍内可作各種的變化。例如裝置配置狀態始終為例示，而不限於此。又，在梭的構造上亦不限於上述構造，例如亦可與使用上述實施樣態之光阻劑處理單元23之副臂56 同樣的構造。又，對於梭亦可設成能保持多數片基板的狀態。而在處理上亦不限於上述藉著光阻劑塗布顯像處理裝置的處理’而係亦可應用進行液處理與熱處理之外的裝置。而且上述雖說明了使用CD基板作為被處理基板的情形，惟’本發明並不限於此，當然亦可應用於濾色器等其他被處理基板的處理。【發明效果】如以上說明，依據本發明係在進行液處理之多數液處理單元之中，一邊將被處理基板朝略水平地搬送而一邊進行預定的液處理的構成，以此為處理順序將被處理基板之搬送線呈平行的二列狀態，故能維持高流通率之同時，基本上可不須要如習知那般地在多數處理單元之間行進之大規模的中央搬送裝置及此等構件所行進之中央搬送路徑，其功效乃能達到節省空間化且能縮小裝置面積。又，設置 26 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I ^--------II--------- (請先閱讀背面之注意事項再填寫本頁) 533460 A7 B7__ 五、發明說明（24 ) 一可移動於二列搬送線之間的空間而在前述搬送線之間進行父接基板並保持的基板保持構件，因此，可進行一般處理之外更能進行其他各種模式的處理，而使處理的自由度高。又，如上所述，前述多數熱處理單元構成對應前述各熱處理之各構件所彙集之多數熱處理單元部，因此，能縮小裝置面積且熱處理亦沿著被處理基板之處理的流通而進行，故能更提高流通率。【圖式之簡單說明】第1圖表示本發明之第1實施樣態之LCD玻璃基板之光阻劑塗布顯像處理裝置之平面圖。第2圖表示本發明之第1實施樣態之LCD玻璃基板之光阻劑塗布顯像處理單元之内部平面圖。第3圖表示本發明之第1實施樣態之L C D玻璃基板之光阻劑塗布顯像處理裝置之第1熱處理單元部側面圖。第4圖表示本發明之第1實施樣態之LCD玻璃基板之光阻劑塗布顯像處理裝置之第2熱處理單元部側面圖。第5圖表示本發明之第1實施樣態之LCD玻璃基板之光阻劑塗布顯像處理裝置之第3熱處理單元部側面圖。第6圖表示本發明之第1實施樣態之LCD玻璃基板之光阻劑塗布顯像處理裝置所使用之梭構造立體圖。第7圖表示本發明之第2實施樣態之LCD玻璃基板之光阻劑塗布顯像處理裝置之平面圖。第8圖表示本發明之第3實施樣態之LCD玻璃基板之光 -27 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) (請先閱讀背面之注咅？事項再填寫本頁) 裝 tr--------- 經濟部智慧財產局員工消費合作社印製 533460 經濟部智慧財產局員工消費合作社印製 A7 ____B7 五、發明說明（25 ) 阻劑塗布顯像處理裝置之平面圖。第9圖表示本發明之第3實施樣態之Lcd玻璃基板之光阻劑塗布顯像處理裝置所使用之梭構造立體圖。第10圖表示本發明之第3實施樣態之LCD玻璃基板之光阻劑塗布顯像處理裝置所使用之交接機構之構造立體圖〇第11圖係用以說明使用第10圖之交接機構而將基板載置於第9圖之梭之動作側面圖。第12圖表示本發明之第3實施樣態之lcd玻璃基板之光阻劑塗布顯像處理裝置所使用之梭構造斷面圖。【元件標號對照】 1 卡匣站 26 第1熱處理單元部 2 處理站 27 第2熱處理單元部 3 界面站 28 第3熱處理單元部 4 曝光裝置 3卜 32 熱處理單元方塊 10 搬送路徑 33 第1搬送裝置 11 搬送裝置 34、 35 熱處理單元方塊 11a 搬送臂 36 第2搬送裝置 21 洗淨處理單元 37 ^ 38 熱處理單元方塊 22 準分子UV照射單元 39 第3搬送裝置 23 光阻劑處理單元 40 空間部 23b 減壓乾燥裝置（VD) 41、 41，、41” 梭 23c 周緣光阻劑去除裝置 42 搬送裝置 24 顯像處理單元 43 緩衝台 25 i線UV照射單元 44 延伸·冷卻台 -28 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注音？事項再填寫本頁) 讎 am mm ΜΗ I μη 一必^ ·1 II ^1 ϋ >ϋ I · 533460 A7 B7 五、發明說明（26 經濟部智慧財產局員工消費合作社印製 45 外部裝置方塊 94 保持臂 50 杯 95 ^ 96、97 馬達 51 旋壓夾頭 100 、100,、100” τί 52 減壓容器像處理裝置 53 溶劑吐出頭 101 基座構件 54 載置台 102 昇降銷 55 導執 103 導引構件 56 副臂 104 銷驅動部 57 搬入口 105 連結部 58 搬出口 106 導軌 61 通過單元 110 交接機構 62 ^ 63 脫水烘乾單元 121 基座 64 疏水化處理單元 122 支持銷 65 通過單元 123 連結部 66、 67 冷卻單元 124 導軌 68 疏水化處理單元 125 中空部 69 通過單元 131 支持部 70 > 71、72預先烘乾單元 132 圓柱 73 通過單元 133 旋轉機構 74 冷卻單元 134 活塞 75 > 76 預先烘乾單元 135 十字形狀構件 78 > 79、80、81後烘乾單元 136 支持銷 82 通過·冷卻單元 141 空間構件 83 > 84 後烘乾單元 142 覆蓋構件 91 導軌 143 圓柱 92 昇降構件 G LCD玻璃基板 93 基座構件 0Ά . (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (23) Most of the positions, such as four cylinders 143 (the figure shows only two), cause the covering member 142 to rise. In this way, since the substrate G existing area on the base member 141 is a closed space by the cover member 142, when the substrate G is transferred, it is possible to prevent particles from adhering to the substrate G. In addition, since the cylinder for opening and closing the covering member 142 is not provided on the shuttle 41, it is possible to avoid a complicated operation of the air piping. In addition, the present invention is not limited to the above-mentioned embodiments, and various changes can be made within the scope of the present invention. For example, the device configuration status is always illustrative, and is not limited to this. In addition, the structure of the shuttle is not limited to the above-mentioned structure. For example, the structure may be the same as that of the sub-arm 56 of the photoresist processing unit 23 using the embodiment described above. The shuttle may be provided in a state capable of maintaining a plurality of substrates. And the processing is not limited to the above-mentioned processing by the photoresist coating and developing processing device ', but it can also be applied to devices other than liquid processing and heat processing. In addition, although the case where the CD substrate is used as the substrate to be processed has been described above, the present invention is not limited to this, and it can be applied to other substrates such as color filters. [Effects of the Invention] As described above, according to the present invention, in most liquid processing units that perform liquid processing, a predetermined liquid processing is performed while the substrate to be processed is transported slightly horizontally. The processing lines of the substrates are arranged in two parallel rows, so while maintaining a high flow rate, a large-scale central transfer device and such components that basically need to travel between most processing units as is conventionally not required. The central conveying path traveled has the effect of saving space and reducing the device area. Also, set 26 paper sizes to the Chinese National Standard (CNS) A4 (210 X 297 mm) I ^ -------- II --------- (Please read the note on the back first Please fill in this page again for details) 533460 A7 B7__ V. Description of the invention (24) A substrate holding member that can move in the space between two rows of transfer lines and parentally hold and hold the substrates between the aforementioned transfer lines. In addition to general processing, various other modes of processing can be performed, and the degree of freedom of processing is high. In addition, as described above, the plurality of heat treatment units constitute a plurality of heat treatment unit sections that are assembled by the components corresponding to the respective heat treatments. Therefore, the device area can be reduced and the heat treatment can be performed along the flow of the processing of the substrate to be processed. Improve circulation. [Brief description of the drawings] Fig. 1 shows a plan view of a photoresist-coated development processing device for an LCD glass substrate according to a first embodiment of the present invention. Fig. 2 is a plan view showing the interior of the photoresist-coated development processing unit of the LCD glass substrate according to the first embodiment of the present invention. Fig. 3 is a side view of a first heat treatment unit portion of a photoresist-coated development processing device for an L C D glass substrate according to a first embodiment of the present invention. Fig. 4 is a side view of the second heat treatment unit portion of the photoresist-coated development processing device for the LCD glass substrate according to the first embodiment of the present invention. Fig. 5 is a side view of the third heat treatment unit portion of the photoresist-coated development processing device for the LCD glass substrate according to the first embodiment of the present invention. Fig. 6 is a perspective view showing a shuttle structure used in a photoresist coating development processing device for an LCD glass substrate according to a first embodiment of the present invention. Fig. 7 is a plan view of a photoresist coating development processing device for an LCD glass substrate according to a second embodiment of the present invention. Figure 8 shows the light of the LCD glass substrate of the third embodiment of the present invention. -27-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the note on the back first? Matters? Refill this page) Install tr --------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed 533460 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed A7 ____B7 V. Description of Invention (25) Resistor coating display A plan view of an image processing device. Fig. 9 is a perspective view showing a shuttle structure used in a photoresist-coated development processing device for an Lcd glass substrate according to a third embodiment of the present invention. FIG. 10 is a perspective view showing the structure of a transfer mechanism used in a photoresist-coated development processing device for an LCD glass substrate according to a third embodiment of the present invention. FIG. 11 is a diagram for explaining the transfer mechanism using FIG. A side view of the operation of the substrate mounted on the shuttle of FIG. 9. Fig. 12 is a sectional view of a shuttle structure used in a photoresist-coated development processing device for an LCD glass substrate according to a third embodiment of the present invention. [Comparison of component numbers] 1 cassette station 26 1st heat treatment unit 2 processing station 27 2nd heat treatment unit 3 interface station 28 3rd heat treatment unit 4 exposure device 3b 32 heat treatment unit block 10 conveying path 33 first conveying device 11 Transfer device 34, 35 Heat treatment unit block 11a Transfer arm 36 Second transfer device 21 Wash processing unit 37 ^ 38 Heat treatment unit block 22 Excimer UV irradiation unit 39 Third transfer device 23 Photoresist processing unit 40 Space section 23b minus Pressure drying device (VD) 41, 41, 41 "shuttle 23c peripheral photoresist removal device 42 conveying device 24 imaging processing unit 43 buffer stage 25 i-ray UV irradiation unit 44 extension · cooling stage-28 This paper size applies to China National Standard (CNS) A4 Specification (210 X 297 mm) (Please read the phonetic on the back? Matters before filling out this page) 雠 am mm ΜΗ I μη I must ^ · 1 II ^ 1 ϋ > ϋ I · 533460 A7 B7 V. Description of the invention (26 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 45 External device box 94 Holding arm 50 Cup 95 ^ 96, 97 Motor 51 Spinning chuck 100, 100 ,, 100 ”τί 52 Decompression container image processing device 53 Solvent ejection head 101 Base member 54 Mounting table 102 Lifting pin 55 Guide 103 Guide member 56 Jib 104 Pin driving portion 57 Carrying port 105 Connecting portion 58 Carrying port 106 Guide rail 61 Passing unit 110 Transfer mechanism 62 ^ 63 Dehydration and drying unit 121 Base 64 Hydrophobizing treatment unit 122 Support pin 65 Passing unit 123 Link 66, 67 Cooling unit 124 Guide rail 68 Hydrophobizing treatment unit 125 Hollow part 69 Passing unit 131 Support section 70 > 71, 72 pre-drying unit 132 cylindrical 73 pass-through unit 133 rotation mechanism 74 cooling unit 134 piston 75 > 76 pre-drying unit 135 cross-shaped member 78 > 79, 80, 81 post-drying unit 136 Support pin 82 Pass · Cooling unit 141 Space member 83 > 84 Rear drying unit 142 Cover member 91 Rail 143 Cylinder 92 Lifting member G LCD glass substrate 93 Base member 0Ά. (Please read the precautions on the back before filling this page ) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims

533460 處理 Β8 C8 D8 六、申請專利範圍 I 一種處理裝置，係可對於被處理基板進行包含多數之液處理的一連串處理，具有：多數的液處理單元，係可一邊將被處理基板略水平地搬送而一邊進行液處理，而處理之順序上具有搬送線呈二列配置多數的熱處理單元，係可進行附隨前述多數液處理之熱工間部’係設置於前述二列搬送線之間；及基板保持·移動構件，係可移動地設置於前述空間部而在與前述搬送線之間交接被處理基板而保持並移動基板。 2·如申請專利範圍第1項之處理裝置，其中前述多數熱處理單元構成對應前述各熱處理之各構件所彙集之多數熱處理單元部，且具有對應各熱處理單元部而在與其中的多數熱處理單70之間及與對應之液處理單元之間進行搬送被處理基板的搬送裝置。 3·如申請專利範圍第1項之處理裝置，其中前述基板保持· 移動構件係具有將被處理基板支持在其上面的基座構件，及没置成對於前述基座構件自由著脫而其覆蓋其上方处門的覆蓋構件。 4.如申請專利範圍第3項之處理裝置，其中前述覆蓋構件之開閉係藉著設置在對應前述基板保持·移動構件之被严里基板之接收/交接位置的開閉機構而進行。地 5· —種處理裝置，係可對於被處理基板進行包含夕、理的一連串處理，具有：之液處本紙張尺度適用中國國家檩準（CNS) A4規格（210X297公釐） t - - (請先閲讀背面之注意事項再填寫本頁) 、^τ— ' 30 533460 申請專利範圍處理部，係具有對應前述一連串的處理而對各個被處理基板施予預定處理之處理單元；搬入出。卩係、載置可收納處理前之被處理基板及/或處理後的被處理基板之收納容器，且對前述處理部將被處理基板予以搬入出；前述處理部具有：夕數的液處理早係可—邊將被處絲板朝水平搬送而-邊進行液處理，而在處理之順序上具有搬送線呈二列配置；多數的熱處理單元，係進行附隨前述多數液處理之熱處理；空間部，係設置於前述二列搬送線之間；及基板保持#動構件，係可移動地設置於前述空間部而在與前述搬送線之間交接被處理基板而保持並移動基板。 6·如申請專利範圍第5項之處理裝置，其中前述多數熱處理 ^兀構成對應前述各熱處理之各構件所彙集之多數熱處理單，且具有對應各熱處理單元部而在與其中的多數熱處理單7L之間及與對應之液處理單元之間進行搬送被處理基板的搬送裝置。 (請先閲讀背面之注意事項再填寫本頁)533460 Processing B8 C8 D8 VI. Application for Patent Scope I A processing device can perform a series of processing on the substrate to be processed, including most liquid processing. It has: Most liquid processing units, which can transfer the substrate to be processed horizontally on one side On the other hand, liquid processing is performed on one side, and in the order of processing, there are a plurality of heat treatment units arranged in two rows with a transfer line, and a thermal room section capable of performing the aforementioned majority of liquid treatment is disposed between the two rows of transfer lines; and The substrate holding and moving member is movably provided in the space portion, and transfers the substrate to be processed between the substrate and the transfer line to hold and move the substrate. 2. The processing device according to item 1 of the scope of patent application, wherein the majority of the heat treatment units constitute a majority of heat treatment unit parts corresponding to the components of each heat treatment, and have a majority of heat treatment orders 70 corresponding to each heat treatment unit part. A transfer device that transfers a substrate to be processed between and to a corresponding liquid processing unit. 3. The processing device according to item 1 of the patent application range, wherein the substrate holding and moving member has a base member supporting the substrate to be processed thereon, and the base member is not placed on the base member to cover the base member freely. A cover member for the door above it. 4. The processing device according to item 3 of the scope of patent application, wherein the opening and closing of the cover member is performed by an opening and closing mechanism provided at a receiving / transferring position of the substrate which is tightly connected to the substrate holding and moving member.地 ·· —A kind of processing device that can perform a series of processing including substrates and substrates on the substrate to be processed. It has the following dimensions: The paper size is in accordance with China National Standard (CNS) A4 (210X297 mm) t--( Please read the notes on the back before filling in this page), ^ τ— '30 533460 The scope of the patent application processing unit has a processing unit that applies predetermined processing to each processed substrate in response to the aforementioned series of processing; carry in and out. Specifically, a storage container capable of storing the substrate to be processed before and / or the substrate to be processed is placed, and the substrate to be processed is carried in and out of the processing unit; the processing unit has: Can be-while the wire plate is being transported horizontally, the liquid treatment is performed, and the transfer line has a two-line configuration in the order of processing; most of the heat treatment units perform the heat treatment accompanying the majority of the liquid treatment; space And the substrate holding member is movably provided in the space portion and transfers a substrate to be processed between the transfer line and the transfer line to hold and move the substrate. 6. The processing device according to item 5 of the patent application range, wherein the majority of the heat treatments described above constitute a majority of the heat treatment orders collected by the components corresponding to the foregoing heat treatments, and have a majority of the heat treatment orders corresponding to each heat treatment unit section 7L. A transfer device that transfers a substrate to be processed between and to a corresponding liquid processing unit. (Please read the notes on the back before filling this page)

7·=申請專利範圍第6項之處理裝置，其中前述多數熱處理單元部具有設置成可鄰接各個搬送裝置而以多數熱處理單元於垂直方向積層所構成之熱處理單元方塊。 8·如申请專利範圍第5、6或7項之處理裝置，其中前述搬入出部具有在與前述處理單元之間進行被處理基板之交接的7 · = The processing device according to item 6 of the patent application range, wherein the majority of the heat treatment unit sections have heat treatment unit blocks which are arranged adjacent to each conveying device and are laminated in a vertical direction with a plurality of heat treatment units. 8. The processing device according to claim 5, 6, or 7, in which the aforementioned loading / unloading section has a processing unit for transferring the substrate to be processed to the aforementioned processing unit.

本紙張尺度適财_家標準（CNSU4規格⑽χ29» A8 B8 ____ C8 ^^ ---- D8 申請專利範園 -— ί板搬送機構’前述處理部於鄰接前輕間部之前述基板 ±适機構的部分，具有前述基板搬送機構與前述基板保、·移動構件之間進行被處縣板之交接的基板交接機構此基板父接機構具有可改變被處理基板之方向的基板旋轉機構。 9.如申請專利範圍第8項之處理裝置，其中前述基板交接機、有可昇降的基板支持部，前述基板保持移動構件具有形成貫通前述基板支持部之孔而支持被處理基板的基座構件，前述基板交接機構之基板支持部以從前述基座構件之:貫通前述孔而突出於其上方狀態來接收被處理基板， j藉著前述基板旋轉機構而旋轉被處理基板，並藉著下降前述支持部而可將被前述支持部所支持之被處理基板載置於前述基座構件。 1〇_如申請專利«第5、6或7項之處理裝置，其中前述基板保持.移動構件亦可採用具有將被處理基板支持在其上面的基座構件，及設置成對於前述基座構件自由著脫而覆蓋其上方空間的覆蓋構件。 11.如申請專利範圍第H)項之處理裝置，其中前述覆蓋構件之開閉係藉著設置在對應前述基板保持·移動構件之被處理基板之接收/交接位置的開閉機構而進行。 12· -種處理裝置，係可對於被處理基板進行包含洗淨、塗布光阻劑及曝光後的顯像的一連串處理，具有：處理單元的處理部，係對應前述—連串的處理而對各個被處理基板施予預定處理；本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐）This paper is suitable for financial standards _ home standard (CNSU4 specification ⑽χ29 »A8 B8 ____ C8 ^^ ---- D8 Patent Application Fanyuan --- Board transportation mechanism 'The aforementioned processing section is adjacent to the aforementioned substrate ± adapted mechanism of the front light room section. In part, the substrate transfer mechanism includes the substrate transfer mechanism and the substrate holding and moving member. The substrate transfer mechanism has a substrate rotation mechanism that can change the direction of the substrate to be processed. The processing device according to the eighth aspect of the patent application, wherein the substrate transfer machine has a substrate support portion that can be raised and lowered, and the substrate holding and moving member has a base member that forms a hole penetrating the substrate support portion to support the substrate to be processed. The substrate supporting part of the transfer mechanism receives the substrate to be processed from the above-mentioned base member: penetrating the hole and protruding above it, j, the substrate to be processed is rotated by the substrate rotating mechanism, and the substrate is lowered by lowering the supporting portion. The substrate to be processed supported by the support section can be placed on the base member. 1〇_If a patent is applied «No. 5, 6 or 7 The processing device according to the above item, wherein the substrate holding and moving member may include a base member supporting the substrate to be processed thereon, and a cover member provided to freely move the base member to cover the space above the base member. The processing device according to item H) of the patent application, wherein the opening and closing of the cover member is performed by an opening and closing mechanism provided at a receiving / transferring position of the substrate to be processed corresponding to the substrate holding and moving member. 12 ·-A processing device capable of performing a series of processing on the substrate to be processed including cleaning, coating with a photoresist, and development after exposure. The processing device includes a processing unit of a processing unit corresponding to the above-mentioned series of processing. Each substrate to be processed is scheduled to be processed; This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)

餐 (請先閲讀背面之注意事项再填寫本頁) t. 32 數；申請專利範圍理/人Λ部’係载置可收納處理前之被處理基板及/或處後的被處理基板之收納容器，對前述處理部將被處理基板宁以搬入出；及板·界面#’係在處理部與曝光裝置之間進行交接被處理基前述處理部具有：洗淨處理單亓，後π ^ 邊係可一邊將被處理基板朝水平搬送而一二以洗精進行洗淨處理及進行乾燥處理；光阻W處理單π’係可_邊將被處理基板朝水平搬送而〜邊進行包含塗布光阻液的光阻劑處理；邊、顯像處理單元’係可-邊將被處理基板朝水平搬送而- tk布顯像液、去除顯像後之顯像液、及乾燥處理；节平行之一列搬送線，係以前述洗淨處理單元、前述光阻 ^處理單70及前述顯像處理單元所構成而可搬送被處理基板；熱處理單元，係進行附隨前述各處理單元之熱處理之多空間部，係設置於前述二列搬送線之間；及基板保持·移動構件，係可移動地設置於前述空間部而在與刖述搬送線之間交接被處理基板而保持並移動基板；且前述二列搬送線之中的一線可將從前述搬入出部所搬入之被處理基板經過前述洗淨處理單元及前述光阻劑處理單元而搬至前述界面部，另一線可將被處理基板從前述界面部經前述顯像處理單元而搬至前述搬入出部。 33 本紙張尺度適用中國國豕標準（CNS) Α4規格（210X297公楚） _·訂！ __^ϋι. 镛 (請先閲讀背面之注意事項再填寫本頁) 533460 申請專利範圍 13·如申請，利範圍第12項之處理裝置，其中更具有前述多數熱處理單元構成對應從前述洗淨處理單元所搬出的被處理基板而進行預定之熱處理之多數熱處理單元所彙集之第1 熱處理單元部；對於從前述光阻劑處理單元所搬出的被處理基板而進行預定之熱處理之多數熱處理單元所彙集之第 2熱處理單元部；及對於從前述顯像處理單元所搬出的被處理基板而進行預定之熱處理之多數熱處理單元所彙集之第 3熱處理單το部；且更具有可將由前述洗淨處理單元所搬出之被處理基板搬入前述第丨熱處理單元部，同時可將由前述第1熱處理單元部來的被處理基板搬送至前述光阻劑處理單兀的第1搬送裝置；可將由前述光阻劑處理單元所搬出之被處理基板搬入前述第2熱處理單元部，同時可將由前述第2熱處理單元部來的被處理基板搬送至前述界面部的第2搬送裝置；及可將由前述顯像處理單元所搬出之被處理基板搬入前述第3熱處理單元部，同時可將由前述第3 熱處理早元部來的被處理基板搬送至前述搬入出部的第3 搬送裝置。 14·如申請專利範圍第13項之處理裝置，其中前述第1、第2 及第3熱處理早元部具有分別設置成可鄰接第1、第2及第 3搬送裝置而以多數熱處理單元於垂直方向積層所構成之熱處理單元方塊。 15.如申請專利範圍第12、13或14項之處理裝置，其中前述搬入出部具有在與前述處理單元之間進行被處理基板之交接的基板搬送機構，前述處理部於鄰接前述空間部之前述 34 本紙張尺度適用中國國家標準（哪）Α4規格（210X297公釐） t 鳙« (請先閲讀背面之注意事項再填寫本頁) 、^τ— 令Μ專利範園土板搬送機構的部分，具有前述純搬送機構與前述基板保持移動構件之間進行被處絲板之交接的基板交接機構’此基板交接機構具有可改變被處理基板之方向的基板旋轉機構。申明專利fen第15項之處理裝置，其巾前述基板交接機構具有可昇降的基板支持部，前述基板保持·移動構件具有形成f通前述基板支持部之孔而支持被處理基板的基座構件則述基板交接機構之基板支持部以從前述基座構件 I貝述孔*犬出於其上方狀態來接收被處理基板，且藉著别述基板旋轉機構而旋轉被處理基板，並藉著下降前述支持部而可將被前述支持部所支持之被處理基板載置於前述基座構件。 17·如申請專利範圍第12、13或14項之處理裝置，盆中前述前述基板保持·移動構件亦可採用具有將被處理基板支持在其上面的基座構件，及設置成對於前述基座構件自由著脫而覆蓋其上方空間的覆蓋構件。 18·如申請專利範圍第17項之處理裂置，其中前述覆蓋構件之開閉係藉著設置在對應前述基板保持·移動構件之被處理基板之接收/交接位置的開閉機構而進行。 35Meal (please read the precautions on the back before filling in this page) t. 32 number; Patent application scope / person Λ Department 'is for storing the processed substrate before processing and / or the processed substrate after processing A container for carrying the substrate to be processed into and out of the processing section; and the plate interface # 'is used to transfer between the processing section and the exposure device. The processing section has: a cleaning processing unit, and a rear π ^ side It can transport the substrate to be processed horizontally, and perform cleaning treatment and drying with one or two detergents. Photoresistance W processing single π 'can _ while transporting the substrate to be processed horizontally ~ while applying coating light Liquid-blocking photoresist treatment; The side and the development processing unit can be-while the substrate to be processed is transported horizontally-tk cloth development solution, the development solution after the development is removed, and drying treatment; A line of conveying line is composed of the aforementioned cleaning processing unit, the aforementioned photoresist processing sheet 70, and the aforementioned developing processing unit, and can transport the substrate to be processed; the heat treatment unit performs the heat treatment accompanying the aforementioned processing units The multi-space section is provided between the two rows of the transfer lines; and the substrate holding and moving member is movably provided in the space section and transfers the substrate to be processed between the transfer section and the transfer line to hold and move the substrate. ; And one of the two rows of the transfer lines can be moved to the interface portion through the cleaning processing unit and the photoresist processing unit, and the other line can be processed by the cleaning substrate and the photoresist processing unit. The substrate is transferred from the interface portion to the carry-in / out portion via the development processing unit. 33 This paper size applies to China National Standard (CNS) Α4 size (210X297). _ · Order! __ ^ ϋι. 镛 (please read the precautions on the back before filling this page) 533460 Patent application scope 13 · If applied, the processing equipment of the profit scope item 12, which has most of the aforementioned heat treatment units constitutes corresponding to the aforementioned cleaning treatment The first heat treatment unit unit is a collection of a plurality of heat treatment units that carry out a predetermined heat treatment of the substrate to be processed carried out by the unit; the majority of the heat treatment units that perform a predetermined heat treatment of the substrate to be processed carried out from the photoresist processing unit are collected. A second heat treatment unit section; and a third heat treatment unit το that is assembled by a plurality of heat treatment units that perform predetermined heat treatment on the substrate to be processed carried out from the aforementioned development processing unit; and further includes a cleaning treatment unit The removed substrate to be processed is transferred to the aforementioned heat treatment unit section, and at the same time, the processed substrate from the first heat treatment unit section can be transferred to the first transfer device for the photoresist processing unit; the photoresist can be processed The substrate to be processed carried out by the unit is carried into the second heat treatment unit section, and at the same time, The substrate to be processed from the second thermal processing unit is transferred to the second transfer device of the interface unit; and the substrate to be processed from the development processing unit can be transferred to the third thermal processing unit, and the third substrate can be transferred from the third The substrate to be processed from the heat treatment early part is transferred to the third transfer device of the loading / unloading part. 14. The processing device according to item 13 of the patent application scope, wherein the aforementioned first, second, and third heat treatment early parts have a plurality of heat treatment units arranged vertically adjacent to the first, second, and third conveying devices, respectively. A heat treatment unit block composed of directional layers. 15. The processing device according to claim 12, 13, or 14, wherein the carrying-in / out section has a substrate transfer mechanism for transferring a processed substrate to and from the processing unit, and the processing section is adjacent to the space section. The aforementioned 34 paper standards are applicable to the Chinese national standard (where) A4 size (210X297 mm) t 鳙 «(Please read the precautions on the back before filling this page), ^ τ— part of the ordering patent patent garden soil transfer mechanism A substrate transfer mechanism including the aforementioned pure transfer mechanism and the aforementioned substrate holding and moving member for transferring a processed wire plate. This substrate transfer mechanism includes a substrate rotation mechanism capable of changing the direction of a substrate to be processed. The processing device of claim 15 of the patent states that the substrate transfer mechanism has a substrate support portion that can be raised and lowered, and the substrate holding and moving member has a base member that supports the substrate to be processed by forming holes through the substrate support portion. The substrate supporting part of the substrate transfer mechanism receives the substrate to be processed from the above-mentioned base member I through the hole, and the substrate to be processed is rotated by another substrate rotation mechanism, and the substrate is lowered by The supporting unit may place the substrate to be processed supported by the supporting unit on the base member. 17. If the processing device of the scope of patent application No. 12, 13 or 14 is applied, the aforementioned substrate holding / moving member in the basin may also have a base member which supports the substrate to be processed thereon, and is provided to the aforementioned base A covering member that allows the member to move freely to cover the space above it. 18. The processing split according to item 17 of the scope of patent application, wherein the opening and closing of the cover member is performed by an opening and closing mechanism provided at a receiving / transfer position of the substrate to be processed corresponding to the substrate holding and moving member. 35