TWD175852S - 電漿處理裝置用上腔室 - Google Patents
電漿處理裝置用上腔室Info
- Publication number
- TWD175852S TWD175852S TW104305548F TW104305548F TWD175852S TW D175852 S TWD175852 S TW D175852S TW 104305548 F TW104305548 F TW 104305548F TW 104305548 F TW104305548 F TW 104305548F TW D175852 S TWD175852 S TW D175852S
- Authority
- TW
- Taiwan
- Prior art keywords
- upper chamber
- treatment device
- plasma treatment
- processing device
- plasma processing
- Prior art date
Links
- 238000009832 plasma treatment Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是電漿處理裝置用上腔室，為一種在半導體製造時所使用的電漿處理裝置中，在進行半導體晶圓等之表面處理時，構成真空空間的上腔室。;【設計說明】;立體圖中，未表現在其他六面圖的細線，皆為用來呈現立體表面的形狀。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2015-13035F JP1546799S (zh) | 2015-06-12 | 2015-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD175852S true TWD175852S (zh) | 2016-05-21 |
Family
ID=55539623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104305548F TWD175852S (zh) | 2015-06-12 | 2015-10-06 | 電漿處理裝置用上腔室 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD804436S1 (zh) |
| JP (1) | JP1546799S (zh) |
| TW (1) | TWD175852S (zh) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD859333S1 (en) | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR112018077304A2 (pt) | 2016-06-29 | 2019-04-02 | Superior Industries, Inc. | britadeira de impacto de eixo vertical |
| USD826300S1 (en) * | 2016-09-30 | 2018-08-21 | Oerlikon Metco Ag, Wohlen | Rotably mounted thermal plasma burner for thermalspraying |
| JP1611626S (zh) * | 2017-01-20 | 2018-08-20 | ||
| USD849072S1 (en) * | 2017-04-05 | 2019-05-21 | Sundyne, Llc | Bearing box frame |
| USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
| USD882536S1 (en) * | 2017-04-28 | 2020-04-28 | Applied Materials, Inc. | Plasma source liner |
| USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
| USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD844768S1 (en) * | 2017-09-06 | 2019-04-02 | Rheem Manufacturing Company | Water heater top cap assembly |
| USD851237S1 (en) * | 2017-11-01 | 2019-06-11 | Systems Spray-Cooled, Inc | Watertight sidewall dustcover |
| USD849227S1 (en) * | 2017-12-12 | 2019-05-21 | Systems Spray-Cooled, Inc. | Burner bump out |
| USD851743S1 (en) * | 2017-12-19 | 2019-06-18 | Systems Spray-Cooled, Inc | Burner bump out |
| USD849228S1 (en) * | 2017-12-19 | 2019-05-21 | Systems Spray-Cooled, Inc | Burner bump out |
| JP1612766S (zh) * | 2018-03-29 | 2018-09-03 | ||
| JP1612908S (zh) * | 2018-03-29 | 2018-09-03 | ||
| JP1612912S (zh) * | 2018-03-29 | 2018-09-03 | ||
| USD892881S1 (en) * | 2018-03-29 | 2020-08-11 | Daihen Corporation | Power transmission unit and power receiving unit of an industrial robot arm |
| JP1619125S (zh) * | 2018-03-29 | 2018-11-26 | ||
| USD869376S1 (en) * | 2018-04-13 | 2019-12-10 | Protective Enclosures Company, Llc | Venting device |
| JP1638504S (zh) * | 2018-12-06 | 2019-08-05 | ||
| USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
| USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
| USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
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| US4153907A (en) * | 1977-05-17 | 1979-05-08 | Vactec, Incorporated | Photovoltaic cell with junction-free essentially-linear connections to its contacts |
| USD274836S (en) * | 1982-12-02 | 1984-07-24 | Smith Edward J | Space heater assembly |
| US5641375A (en) * | 1994-08-15 | 1997-06-24 | Applied Materials, Inc. | Plasma etching reactor with surface protection means against erosion of walls |
| USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
| US6623609B2 (en) * | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| USD448729S1 (en) * | 1999-12-14 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Stator of AC generator for vehicles |
| JP4470274B2 (ja) * | 2000-04-26 | 2010-06-02 | 東京エレクトロン株式会社 | 熱処理装置 |
| US20040069223A1 (en) * | 2002-10-10 | 2004-04-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wall liner and slot liner for process chamber |
| USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
| US9677188B2 (en) * | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
| TWI502617B (zh) * | 2010-07-21 | 2015-10-01 | 應用材料股份有限公司 | 用於調整電偏斜的方法、電漿處理裝置與襯管組件 |
| SG11201406133WA (en) * | 2012-03-28 | 2014-10-30 | Novellus Systems Inc | Methods and apparatuses for cleaning electroplating substrate holders |
| USD716240S1 (en) * | 2013-11-07 | 2014-10-28 | Applied Materials, Inc. | Lower chamber liner |
| US10049862B2 (en) * | 2015-04-17 | 2018-08-14 | Lam Research Corporation | Chamber with vertical support stem for symmetric conductance and RF delivery |
-
2015
- 2015-06-12 JP JPD2015-13035F patent/JP1546799S/ja active Active
- 2015-10-06 TW TW104305548F patent/TWD175852S/zh unknown
- 2015-10-30 US US29/544,068 patent/USD804436S1/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD859333S1 (en) | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1546799S (zh) | 2016-03-28 |
| USD804436S1 (en) | 2017-12-05 |
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