USD404369S - Manifold cover for use in a semiconductor wafer heat processing apparatus - Google Patents
Manifold cover for use in a semiconductor wafer heat processing apparatus Download PDFInfo
- Publication number
- USD404369S USD404369S US29/082,981 US8298198F USD404369S US D404369 S USD404369 S US D404369S US 8298198 F US8298198 F US 8298198F US D404369 S USD404369 S US D404369S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- semiconductor wafer
- heat processing
- wafer heat
- manifold cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 a perspective view of a cover manifold cover for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a rear elevational view thereof;
FIG. 4 a top plan view thereof;
FIG. 5 a bottom plan view thereof;
FIG. 6 a right side view thereof;
FIG. 7 a left side view thereof; and,
FIG. 8 a cross-sectional view taken along line VIII-VIII in FIG. 2.
Claims (1)
- I claim the ornamental design for a manifold cover for use in a semiconductor wafer heat processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9-65097 | 1997-08-20 | ||
JP6509797 | 1997-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD404369S true USD404369S (en) | 1999-01-19 |
Family
ID=71729422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/082,981 Expired - Lifetime USD404369S (en) | 1997-08-20 | 1998-02-02 | Manifold cover for use in a semiconductor wafer heat processing apparatus |
Country Status (1)
Country | Link |
---|---|
US (1) | USD404369S (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD802545S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
USD804436S1 (en) * | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD812578S1 (en) * | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD849227S1 (en) * | 2017-12-12 | 2019-05-21 | Systems Spray-Cooled, Inc. | Burner bump out |
USD849228S1 (en) * | 2017-12-19 | 2019-05-21 | Systems Spray-Cooled, Inc | Burner bump out |
USD851237S1 (en) * | 2017-11-01 | 2019-06-11 | Systems Spray-Cooled, Inc | Watertight sidewall dustcover |
USD851743S1 (en) * | 2017-12-19 | 2019-06-18 | Systems Spray-Cooled, Inc | Burner bump out |
USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
USD953985S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD953986S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD954649S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD954648S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD1003243S1 (en) * | 2021-06-28 | 2023-10-31 | Kokusai Electric Corporation | Heat insulator cover of semiconductor manufacturing apparatus |
USD1003834S1 (en) * | 2021-06-28 | 2023-11-07 | Kokusai Electric Corporation | Heat insulator cover of semiconductor manufacturing apparatus |
USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
-
1998
- 1998-02-02 US US29/082,981 patent/USD404369S/en not_active Expired - Lifetime
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD802545S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
USD804436S1 (en) * | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD812578S1 (en) * | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD851237S1 (en) * | 2017-11-01 | 2019-06-11 | Systems Spray-Cooled, Inc | Watertight sidewall dustcover |
USD849227S1 (en) * | 2017-12-12 | 2019-05-21 | Systems Spray-Cooled, Inc. | Burner bump out |
USD851743S1 (en) * | 2017-12-19 | 2019-06-18 | Systems Spray-Cooled, Inc | Burner bump out |
USD849228S1 (en) * | 2017-12-19 | 2019-05-21 | Systems Spray-Cooled, Inc | Burner bump out |
USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
USD953985S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD953986S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD954649S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD954648S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD1003243S1 (en) * | 2021-06-28 | 2023-10-31 | Kokusai Electric Corporation | Heat insulator cover of semiconductor manufacturing apparatus |
USD1003834S1 (en) * | 2021-06-28 | 2023-11-07 | Kokusai Electric Corporation | Heat insulator cover of semiconductor manufacturing apparatus |
USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
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