TWD175855S - 電漿處理裝置用下腔室 - Google Patents

電漿處理裝置用下腔室

Info

Publication number
TWD175855S
TWD175855S TW104305551F TW104305551F TWD175855S TW D175855 S TWD175855 S TW D175855S TW 104305551 F TW104305551 F TW 104305551F TW 104305551 F TW104305551 F TW 104305551F TW D175855 S TWD175855 S TW D175855S
Authority
TW
Taiwan
Prior art keywords
lower chamber
treatment device
plasma treatment
article
processing device
Prior art date
Application number
TW104305551F
Other languages
English (en)
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
Original Assignee
日立全球先端科技股份有限&#x5
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限&#x5, Hitachi High Tech Corp filed Critical 日立全球先端科技股份有限&#x5
Publication of TWD175855S publication Critical patent/TWD175855S/zh

Links

Abstract

【物品用途】;本設計的物品是電漿處理裝置用下腔室，為一種在半導體製造時所使用的電漿處理裝置中，在進行半導體晶圓等之表面處理時，構成真空空間的下腔室。;【設計說明】;立體圖中，未表現在其他六面圖的細線，皆為用來呈現立體表面的形狀。
TW104305551F 2015-06-12 2015-10-06 電漿處理裝置用下腔室 TWD175855S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-13038F JP1546801S (zh) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
TWD175855S true TWD175855S (zh) 2016-05-21

Family

ID=55539625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305551F TWD175855S (zh) 2015-06-12 2015-10-06 電漿處理裝置用下腔室

Country Status (3)

Country Link
US (1) USD802545S1 (zh)
JP (1) JP1546801S (zh)
TW (1) TWD175855S (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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JP1611626S (zh) * 2017-01-20 2018-08-20
JP1584146S (zh) * 2017-01-31 2017-08-21
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
JP1638504S (zh) * 2018-12-06 2019-08-05
JP1704964S (ja) * 2021-04-19 2022-01-14 プラズマ処理装置用サセプタリング
JP1700629S (zh) * 2021-04-26 2021-11-29

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USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
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AU2003300375A1 (en) * 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
JP5296985B2 (ja) * 2003-11-13 2013-09-25 アプライド マテリアルズ インコーポレイテッド 整形面をもつリテーニングリング
KR20080031870A (ko) * 2005-05-24 2008-04-11 엔테그리스, 아이엔씨. Ｃｍｐ 리테이닝 링
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
TWD169790S (zh) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 基板處理裝置用氣化器之部分
USD722966S1 (en) * 2013-08-23 2015-02-24 Bridgeport Fittings, Inc. Split, non-metallic electrical insulating bushing
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD775710S1 (en) * 2015-05-19 2017-01-03 Il Han Kim End bushing for fishing reel spool
JP1546800S (zh) * 2015-06-12 2016-03-28

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD960216S1 (en) 2020-11-23 2022-08-09 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Also Published As

Publication number Publication date
JP1546801S (zh) 2016-03-28
USD802545S1 (en) 2017-11-14

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