TW393405B - Compound membrane for packaging - Google Patents

Compound membrane for packaging Download PDF

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Publication number
TW393405B
TW393405B TW086113309A TW86113309A TW393405B TW 393405 B TW393405 B TW 393405B TW 086113309 A TW086113309 A TW 086113309A TW 86113309 A TW86113309 A TW 86113309A TW 393405 B TW393405 B TW 393405B
Authority
TW
Taiwan
Prior art keywords
layer
patent application
item
scope
composite film
Prior art date
Application number
TW086113309A
Other languages
Chinese (zh)
Inventor
Chi-Shiang Lin
Original Assignee
Four Pillars Entpr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Four Pillars Entpr Co Ltd filed Critical Four Pillars Entpr Co Ltd
Priority to TW086113309A priority Critical patent/TW393405B/en
Priority to TW086113309A priority patent/TW422784B/en
Priority to JP01853398A priority patent/JP3249942B2/en
Priority to SG9800287A priority patent/SG79225A1/en
Priority to GB9803510A priority patent/GB2334502B/en
Priority to GB0004056A priority patent/GB2346128B/en
Priority to FR9802901A priority patent/FR2768411B1/en
Priority to DE19810550A priority patent/DE19810550A1/en
Application granted granted Critical
Publication of TW393405B publication Critical patent/TW393405B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/20—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
    • B65D77/2024—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers the cover being welded or adhered to the container
    • B65D77/2028—Means for opening the cover other than, or in addition to, a pull tab
    • B65D77/2032—Means for opening the cover other than, or in addition to, a pull tab by peeling or tearing the cover from the container
    • B65D77/2044—Means for opening the cover other than, or in addition to, a pull tab by peeling or tearing the cover from the container whereby a layer of the container or cover fails, e.g. cohesive failure
    • B65D77/2048—Means for opening the cover other than, or in addition to, a pull tab by peeling or tearing the cover from the container whereby a layer of the container or cover fails, e.g. cohesive failure whereby part of the container or cover has been weakened, e.g. perforated or precut
    • B65D77/2056—Means for opening the cover other than, or in addition to, a pull tab by peeling or tearing the cover from the container whereby a layer of the container or cover fails, e.g. cohesive failure whereby part of the container or cover has been weakened, e.g. perforated or precut the cover being weakened
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/20—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
    • B65D77/2024—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers the cover being welded or adhered to the container
    • B65D77/2028—Means for opening the cover other than, or in addition to, a pull tab
    • B65D77/2032—Means for opening the cover other than, or in addition to, a pull tab by peeling or tearing the cover from the container
    • B65D77/2044—Means for opening the cover other than, or in addition to, a pull tab by peeling or tearing the cover from the container whereby a layer of the container or cover fails, e.g. cohesive failure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2577/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks, bags
    • B65D2577/10—Container closures formed after filling
    • B65D2577/20—Container closures formed after filling by applying separate lids or covers
    • B65D2577/2075—Lines of weakness or apertures
    • B65D2577/2091—Lines of weakness or apertures in cover
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Wrappers (AREA)
  • Adhesive Tapes (AREA)

Abstract

This invention is a compound membrane for packaging which cooperates with a carrier tape having a plurality of carrier grooves for loading the electronic components. This compound membrane has the following characteristics: a porous layer with a many randomly arranged small holes, a sticky layer coated onto such porous layer, and a non-sticky layer attached to porous layer to prevent electronic components from attaching to the sticky layer. Compound membrane for packaging is attached to the carrier grooves to form a stress concentration area such that the force necessary to tear the compound membrane away from carrier tapeis much smaller than the adhesive force in all areas and the compound membrane will split along the stress concentration area. It allows the compound membrane for packaging to peel off smoothly without shaking the carrier tape. It also makes separation for carrier tapes much easier.

Description

經濟部中央標準局員工消費合作社印裝 A7 B7 五、發明説明（） 【發明的技術領域] 本發明係關於一種封裝用覆膜，尤指一種配合承載槽 封裝電子兀件或其他物件之封裝覆膜。 【發明背景】 電子元件之封裝方法最早係以塑膠成型之承載槽配合 另一黏著膜將電子元件封合其中，其目的僅在於簡單之保 護與儲藏運送，而隨著生產設備逐漸走向自動化，所要求 之產能亦不斷提升，因而發展出帶狀之包裝方式，其係延 伸單一承載槽爲具有複數個承載槽之承載帶，以提高運作 上之效率，如美國第4724958號專利所述，該專利係描述 一種電子兀件之帶狀包裝法，其中該專利係提出將電子元 件置於具有複數個凹槽之帶狀結構，另於美國第49634〇5 號專利所述，其提出一種電子元件之帶狀組合式封裝結 構’其除了具有一複數個承載槽之承載帶，在將元件置入 承載槽後另以一覆膜藉由一黏著層將電子元件密封於承載 槽中，此一專利亦爲目前最常使用之包裝方法。 尤其對於目前大部份電子裝置使用表面封裝技術所常採用 小體積之表面黏著元件（SMD)，係以一具有相連之複數個 承載槽與一封裝覆膜形成可置放表面黏著元件之封閉空 間，並配合自動化機台’在自動化構裝製程中，取用該被 封裝元件時，僅需將整個封裝帶置於剝離機構中，並以自 動吸附端子從承載槽內取出表面黏著元件以供進一步製程 使用；然而在上述之封裝結構中’其結合封裝膜(cover tape)Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (Technical Field of the Invention) The present invention relates to a packaging film, especially a packaging coating for packaging electronic components or other objects with a supporting groove. membrane. [Background of the Invention] The earliest method of packaging electronic components was to seal the electronic components with a plastic-molded bearing groove and another adhesive film. The purpose was simply to protect and store and transport. As production equipment gradually moved towards automation, The required production capacity has also been continuously improved, so a belt-shaped packaging method has been developed, which extends a single bearing groove into a bearing belt with a plurality of bearing grooves to improve operational efficiency. As described in US Patent No. 4724958, the patent It describes a tape packaging method for an electronic component, wherein the patent proposes to place an electronic component in a belt structure having a plurality of grooves, and as described in U.S. Patent No. 49634405, it proposes an electronic component The belt-shaped combined packaging structure 'except for a carrier tape having a plurality of bearing grooves, after placing the component into the bearing groove, another electronic component is sealed in the bearing groove with a film through an adhesive layer. This patent also It is currently the most commonly used packaging method. Especially for most current electronic devices that use surface packaging technology, a small-volume surface-adhesive device (SMD) is often used. A closed space in which surface-adhesive components can be placed is formed by a plurality of connecting slots and a packaging film. And cooperate with the automation machine 'in the automatic assembly process, when taking the packaged component, only the entire packaging tape needs to be placed in the peeling mechanism, and the surface adhesive component is taken out of the bearing groove by the automatic suction terminal for further Used in the manufacturing process; however, in the above-mentioned packaging structure, its cover tape

Cover Tape 9/2/97 本紙張尺度通用中國國家標準（CNS ) A4规格（210X297公釐）Cover Tape 9/2/97 The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm)

Ver 99/08/27 (請先閱讀背面之注意事項再填寫本頁)Ver 99/08/27 (Please read the notes on the back before filling this page)

經濟部中央標率局員工消費合作社印装 A7 B7 五、發明説明（） 與承載帶（carrier tape)或承載盤（carrier tray)時，實務上常 於封裝膜靠貼合側 塗佈或黏貼有一黏著層，此黏著層材質可爲一感壓膠 (pressure sensitive adhesive, PSA)或是熱封型用熱塑性聚 合物（thermoplastics)，由於此一黏著層當於封裝貼合時或 剝離時，均會牽渉到的介面層，而此類黏著材料是否能於 目前表面封裝元件（SMD)應用上，就封裝膜與承載帶封合 時能同時具有足夠的黏著封合力與容易剝離，由於封裝貼 合時或剝離時均涉及此一黏著層，實務上很不幸的，此二 項高黏著與易剝璃因素是屬互相衝突而不可兼得者，目前 於市場實務應用上，常遭遇到當封裝膜自承載帶或承載盤 分離時，黏著層之黏著力有偏低、過大或不均的現象，致 使封裝帶會於使用上或儲運過程產生程度不一的問題；例 如（一）當黏著力偏低時，該封裝帶黏貼合處於儲運過程中 易受外力衝擊而使封裝覆膜與承載帶分離鬆脫，而造成被 封存元件的脫落（drop off);(二）當黏著力太高時，自承載 帶剝離封裝膜時會有因所需剝離力太大，而於實際應用上 常因製程上元件有逐個和間歇性被取用而有往前逐步移動 製程（step motion)，常引起不易控制其穩定性而伴隨有振 動現象產生，此會造成被封合之表面黏著元件自承載槽內 彈跳出之問題，尤其於近日電子業界使用之元件甚多，如 液晶顯示器元件(liquid crystal display chips)、整流半導體 (diodes)、被動元件電阻resisters、電桿conductors、電容Printed by A7 B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention () When the carrier tape or carrier tray is used, in practice, the packaging film is usually coated or pasted on the bonding side of the packaging film. Adhesive layer. The material of this adhesive layer can be a pressure sensitive adhesive (PSA) or a thermoplastic polymer for heat sealing. Because this adhesive layer will be used when the package is attached or peeled off, The interface layer involved, and whether this type of adhesive material can be used in current surface packaging device (SMD) applications. When the packaging film is sealed with the carrier tape, it can have sufficient adhesive force and easy peeling at the same time. This adhesive layer is involved at all times or when peeling off. It is very unfortunate in practice. These two factors of high adhesion and easy peeling are conflicting and cannot be obtained. At present, they are often encountered in packaging applications in market practice. When separated from the carrier tape or carrier disk, the adhesive force of the adhesive layer is low, too large, or uneven, causing the packaging tape to have problems of varying degrees in use or during storage and transportation; for example (1) When the adhesive force is low, the packaging tape is adhered during the storage and transportation process, which is susceptible to external forces, so that the packaging film and the carrier tape are separated and loosened, causing the sealed component to drop off; (2) ) When the adhesive force is too high, the peeling force of the self-supporting tape will be too large due to the required peeling force, and in practical applications, the components are gradually taken forward one by one and intermittently during the process. (Step motion) often causes difficulty in controlling its stability and is accompanied by vibration phenomenon, which will cause the problem that the sealed surface adhesive component bounces out of the bearing groove, especially in the electronics industry recently, there are many components, such as Liquid crystal display chips, liquid crystal display chips, diodes, passive resistors, resistors, and capacitors

Cover Tape 9/2/97 4 Ver 99/08/27 (請先閱讀背面之注意事項再填本頁) 訂 本紙乐尺度適用中國國家樣準（CNS ) A4規格（2丨0X297公釐） 經濟部中央樣準局貝工消费合作社印裝 A7 B7 五、發明説明（） capacitors與主動元件integrated circuit 1C在產品設備設 計應用上的訴求更加趨向積極微小化，小元件極易受微小 震動而掉落並延生出問題來；（三）當黏著力分廣與不均勻 時，自承載帶剝離封裝膜時，則可能會有綜合前兩項複雜 問題的產生’因此如何來製備一適當之黏著層材料，使能 ✓ 同時避免上述問題，的確是大大的限制了黏著層材料之標 的物上的使用選擇範圍與適用性，同時也使在製程上的限 制相對的提高了。此外當使用熱封型用熱塑性聚合物時， 於機具熱貼合時，必需考慮貼合時所需之貼合溫度、貼合 壓力和貼合速度，此又和該熱塑性材料之固化時間（Setting Time)有關，意即該熱塑性材料由固態物受熱熔融後再冷 卻下來固化成固態時所需之時間，一般於製程上需要能有 快一點貼合速度時，則需要使用較高的貼合溫度，如此材 料則必需有較高的導熱係數或較短的固化時間，但因高分 子材料本質上常是一種熱的不良導體，此一較差的熱傳導 特性又和所須較短的固化時間需求相衝突，此時若藉添加 混合具有較高熱傳導係數添加物，則可能伴生其他負面的 效應，如透明度的降低，至於貼合時所施加貼合壓力的大 小亦會影響貼合後黏著強度，其黏著強度大小將影響剝離 封裝覆膜時所需之剝離力大小不一，上述之因素將造成材 料開發時的困難度，因此如何開發出一適用之黏著層材料 使同時具有適當黏著力、剝離力和良好之封裝效果並且適 用於不同製程同上，使得在實際應用場合中不會產生上述Cover Tape 9/2/97 4 Ver 99/08/27 (Please read the notes on the back before filling this page) The paper scale is applicable to China National Standard (CNS) A4 specification (2 丨 0X297 mm) Ministry of Economic Affairs Printed by the Central Prototype Bureau Shellfish Consumer Cooperative A7 B7 V. Description of the invention () The requirements of capacitors and integrated circuit 1C in the design of products and equipment are more active and miniaturized, and small components are extremely vulnerable to small vibrations and fall and Problems continue to occur; (3) When the adhesive force is wide and uneven, when the self-supporting tape is peeled off from the packaging film, there may be a combination of the first two complex problems. Therefore, how to prepare an appropriate adhesive layer material, Enabling ✓ At the same time avoiding the above problems, it really greatly limits the scope and applicability of the use of the object of the adhesive layer material, and at the same time, it relatively increases the limitation on the process. In addition, when using a thermoplastic polymer for heat-seal type, when the machine is hot-laminated, it is necessary to consider the lamination temperature, lamination pressure and lamination speed required for lamination, which in turn is related to the curing time of the thermoplastic material. (Time), which means that the time required for the thermoplastic material to melt and solidify after being heated and melted from the solid material to solidify it. Generally, when a faster bonding speed is required in the manufacturing process, a higher bonding temperature is required. Such materials must have a high thermal conductivity or a short curing time, but because polymer materials are often a poor conductor of heat in nature, this poor thermal conductivity is in line with the required short curing time. Conflicts, if adding additives with higher thermal conductivity at this time, it may be accompanied by other negative effects, such as reduced transparency. As for the size of the bonding pressure applied during bonding, it will also affect the adhesive strength after bonding. The amount of adhesive strength will affect the amount of peeling force required to peel off the packaging film. The above factors will cause difficulties in the development of materials. Developed a suitable adhesive layer material, which has appropriate adhesion, peeling force and good packaging effect at the same time, and is suitable for different processes as above, so that the above will not occur in practical applications

Cover Tape 9/2/97 5 Ver 99/08/27 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家揉準（CNS ) A4规格（2丨0X297公釐） B7 B7 經濟部中央標準局負工消費合作社印裝 五、發明説明（） · 之問題，此的確是材料開發者的一個極大挑戰’此實爲封 裝結構材料科學領域硏究中重要課題之一。再者’封裝覆 膜與承載帶於正常的剝離過程中’應避免封裝覆膜層有非 預期中不正常的剝落現象及和有層內有不預期之裂離方向 現象，而此異常現象常造成封裝覆膜在不當地方裂離、中 斷或者有部份封裝覆膜仍殘留覆蓋在承載槽上’如此皆會 影響整個製程操作及其產能。 如「第1-1圖」與「第卜2圖J所示，爲美國第5208103 號專利，係描述一種封裝覆膜21之結構，該封裝覆膜21. 係由一雙軸延伸聚合物膜層22與一中間介層23所構成， 雙軸延伸聚合物膜層22與中間介層23藉由第一黏著層24 黏合，而中間介層23藉由第二黏著層25黏合於承載帶6 ’ 該封裝覆膜21藉由特殊之配方並設計具有適當之層間黏 著力使中間介層23具有相對較弱的內聚力強度（weaker cohesive strength)，使封裝覆膜21熱壓封合後形成一熱壓 封合部份26，當其再被剝開時該熱封合部份26之黏著力 大於中間介層23之內聚能強度，因此其剝離介面係於中 間介層23之中，其所需之剝離力約爲1〇至120克每黏著 毫米單位，然而此一封裝覆膜21於熱壓封合後再被剝璃 時，其裂離層之裂離方向係與撕力、剝離角度與方向 '剝 離速率及熱封合部份26有關，因此其裂離方向可能受上 述因素影響而產生不當之裂離方向，例如有沿著垂直封裝 覆膜21機械加工方向(machine direction)撕裂（意即Cover Tape 9/2/97 5 Ver 99/08/27 (Please read the notes on the back before filling in this page) The size of the paper is applicable to China National Standards (CNS) A4 (2 丨 0X297 mm) B7 B7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. V. Invention Description () · This is indeed a great challenge for material developers. 'This is really one of the important topics in the field of packaging structural materials science. Furthermore, 'the encapsulation film and the carrier tape are in the normal peeling process' should avoid unexpected peeling of the encapsulation film layer and unintended detachment in the layer, and this abnormal phenomenon is often As a result, the packaging film is cracked, interrupted, or some packaging film is still left on the bearing groove. This will affect the entire process operation and production capacity. As shown in "Figure 1-1" and "Figure 2J", it is US Patent No. 5,208,103, which describes the structure of a packaging film 21, which is a biaxially stretched polymer film. The layer 22 is composed of an intermediate interlayer 23, the biaxially stretched polymer film layer 22 and the intermediate interlayer 23 are bonded by a first adhesive layer 24, and the intermediate interlayer 23 is bonded to the carrier tape 6 by a second adhesive layer 25 '' The packaging film 21 uses a special formula and is designed to have an appropriate interlayer adhesion to make the intermediate interlayer 23 have a relatively weaker cohesive strength, so that the packaging film 21 forms a heat after thermocompression sealing. The sealing portion 26 is pressed. When it is peeled again, the adhesive force of the heat-sealed portion 26 is greater than the cohesive energy strength of the intermediate interlayer 23. Therefore, its peeling interface is in the intermediate interlayer 23. The required peeling force is about 10 to 120 grams per adhesive millimeter unit. However, when this packaging film 21 is peeled off after hot pressing, the cracking direction of the cracking layer is related to the tearing force and the peeling angle. It is related to the direction 'peeling rate and the heat-sealed part 26, so the cracking direction may be affected by the above factors. Effect crack is generated from the inappropriate direction, for example along a vertical package film 21 machine direction (machine direction) tear (meaning

Cover Tape 9/2/97 6 Ver 99/08/27 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨OX297公釐） (請先閱讀背面之注意事項再填对本頁) 訂 A7 B7 五、發明説明（） transverse direction)或有一角度方向撕裂，此造成封裝覆 膜21撕離機構的不當斷裂與製程之中斷。 如「第2-1圖」與「第2-2圖」所示，爲美國第5346765 號專利，係描述一種封裝覆膜31之結構，該封裝覆膜31 係由雙軸延伸聚合物膜層32與中間介層33所構成，雙軸 延伸聚合物膜層31與中間介層33藉由第—黏著層M黏 合，而中間介層33藉由第二黏著層35黏合於承載帶6， 該封裝覆膜31經熱壓封合後形成一熱封合部份36，當其 再被剝開時藉由特殊之配方使熱封合部份36之黏著力大 於中間介層33與第二黏著層35之黏著力，因而使其剝離 介面係發生於中間介層33與第二黏著層35之界面上，其 所需之剝離力約爲10至120克每黏著毫米單位，換言之 其與承載帶6間之黏著力亦爲1〇至120克每黏著毫米單 位’但此時於封裝覆膜與承載帶之間的黏著強度有偏低之 顧慮，則可能在儲存運送過程中因輕微之撞擊而使封裝覆 膜與承載帶分離。 經濟部中央標準局員工消費合作社印裝 (請先閱讀背面之注意事項孙填寫本頁) 上述之黏著層應用於熱壓封裝時，一般常使用熱融膠 或熱塑性聚合物及與其混合使用之添加物，其本質結構中 常具有反應性的官能基或熱不穩定性官能基，一般熱融膠 例如苯乙嫌/異戊烯/苯乙烯（styrene-isoprene-styrene, SIS)、苯乙烯 / 丁二稀 / 苯乙稀（styrene-butadiene-styrene， SBS)' 丁烷基橡膠（butyl rubber，BR)等崁段式共聚合物 (block copolymers)及其中使用之增黏樹脂添加齊！Kresins)，Cover Tape 9/2/97 6 Ver 99/08/27 This paper size applies Chinese National Standard (CNS) A4 specification (2 丨 OX297 mm) (Please read the precautions on the back before filling this page) Order A7 B7 5. Description of the invention () Transverse direction) or an angular tear, which causes improper fracture of the tearing mechanism of the packaging film 21 and interruption of the manufacturing process. As shown in "Figure 2-1" and "Figure 2-2", it is US Patent No. 5346765, which describes the structure of a packaging film 31, which is a biaxially-stretched polymer film layer 32 and the intermediate interlayer 33, the biaxially stretched polymer film layer 31 and the intermediate interlayer 33 are bonded by the first adhesive layer M, and the intermediate interlayer 33 is bonded to the carrier tape 6 by the second adhesive layer 35. The packaging film 31 is heat-sealed to form a heat-sealed portion 36. When it is peeled off again, the adhesive force of the heat-sealed portion 36 is greater than that of the intermediate interlayer 33 and the second by a special formula. The adhesive force of the layer 35 causes the peeling interface to occur at the interface between the intermediate interlayer 33 and the second adhesive layer 35. The required peeling force is about 10 to 120 grams per millimeter of adhesive, in other words, it is related to the carrier tape. The adhesion between 6 is also 10 to 120 grams per millimeter unit. However, at this time, there is a concern that the adhesion strength between the packaging film and the carrier tape is relatively low. It may be caused by slight impact during storage and transportation. Separate the packaging film from the carrier tape. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back page to fill in this page). When the above adhesive layer is used in thermocompression packaging, hot melt adhesives or thermoplastic polymers are often used and mixed with them. Substances, which have reactive functional groups or thermally labile functional groups in their essential structure, generally hot melt adhesives such as styrene-isoprene-styrene, styrene, butadiene Add styrene-butadiene-styrene (SBS) 'block copolymers such as butyl rubber (BR) and the tackifying resin used in it! Kresins),

Cover Tape 9/2/97 7 Ver 99/08/27 本紙浪尺度適用中國國家椋準（CNS ) A4规格（21〇X297公釐） 經濟部中央標準局負工消費合作社印製 A7 B7 五、發明説明（） 常具有未飽和雙鍵結構，而於熱塑性材料內一些具低玻璃 轉化溫度或熱穩定性較差的官能基，例如酯鏈鍵結（ester linkage)熱不穩定性官能基易受熱裂解，再者具有因受潮 (humidity)不穩定之官能基者，如具有形成極性氫鍵結構 者易受溼度影響，例如具有狻酸官能基(carboxyl functional group)結構者易受潮濕水氣之水解作用而質變，例如含有 乙嫌醋酸乙燦ethylene-vinyl acetate (EVA)摻合或共聚合 之共聚合物中含有之酯鏈鍵結(ester linkage)爲一種具有高 溫熱不穩定性的官能基，上述之材料極易受天候及儲放環 境周圍因素影響，例如陽光曝曬後的劣變現象及儲放環境 的溫度與濕度的影響，致使其原有物性會隨著時間過往而 變化’尤有甚者當同時遇有高溫與高溼度環境，則將加速其 裂變效應（deterioration)如此將使原先設計粘著層材料使用 物性偏’離其適用範圍進而影響其使用年限(shelf life)，較 常見之例子爲其黏著力物性會隨著存置時間越長而變的越 偏離適用範圍’若黏著力變的偏低時常導致封裝覆膜與承 載帶間有剝落分離現象，另者當黏著力若變高時則易導致 剝離時所需施力的變高與不均勻，而造成封裝覆膜被剝離 時伴隨產生之顫動問題。 本發明於黏著層的材料選擇上，原則上可以是任何種 類的膠系’只要其黏著層材料與被貼合物黏合後之黏著力 大於多孔性薄膜層之撕裂時所需之力（tear f〇rce)即可，黏 者層材料應用上可爲一感壓膠(pressure sensitive adhesive, (請先閲讀背面之注意事項再填寫本頁) 訂 绞Cover Tape 9/2/97 7 Ver 99/08/27 The paper scale is applicable to China National Standards (CNS) A4 (21 × 297 mm) Printed by A7 B7, Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs Note () often has an unsaturated double bond structure, and in the thermoplastic material some functional groups with low glass transition temperature or poor thermal stability, such as ester linkage thermal instability functional groups are susceptible to thermal cracking, Furthermore, those having functional groups that are unstable due to humidity, such as those having a polar hydrogen bond structure, are susceptible to humidity. For example, those having a carboxyl functional group structure are susceptible to hydrolysis by moisture. Qualitative changes, such as the ester linkage contained in copolymers containing ethylene-vinyl acetate (EVA) blended or copolymerized, is a functional group with high temperature thermal instability. The material is extremely susceptible to weather and storage environment surrounding factors, such as the deterioration after sunlight exposure and the temperature and humidity of the storage environment, causing its original physical properties to change over time. In particular, when it encounters high temperature and high humidity environment at the same time, its fission effect will be accelerated. This will make the original design of the adhesive layer material use physical properties' outside its scope of application and affect its shelf life. ), The more common example is that the adhesive physical properties will deviate from the applicable range as the storage time becomes longer. 'If the adhesive force becomes lower, it often results in peeling and separation between the packaging film and the carrier tape. If the adhesive force becomes high, it will easily lead to the increase and unevenness of the force required for peeling, which will cause the chattering problem that occurs when the packaging film is peeled. In the material selection of the adhesive layer of the present invention, in principle, it can be any kind of glue system, as long as the adhesive force of the adhesive layer material and the adherend is greater than the force required for tearing the porous film layer (tear f〇rce), the adhesive layer material application can be a pressure sensitive adhesive ((please read the precautions on the back before filling this page)

Cover Tape Q/?/97 本紙乐尺度適用中國國家標率（CNS > A4規格楚了Cover Tape Q /? / 97 This paper scale is applicable to China's national standard (CNS > A4 specifications are clear

Ver 99/08/27 A7 B7 五、發明説明（） PSA)或是熱封型用熱塑性聚合物(thermoplastics)，適格的 材料可以是壓克力膠，氰丙烯酯膠（cyanoacrylates)，聚 氨酯膠（polyurethane adheasive )，未飽合聚酯膠 (unsaturated polyester)，矽力康膠，天然或合成橡膠， 熱融膠’熱可塑性聚合物等，本發明比較建議使用具有飽 和鏈鍵結結構之黏著材料且兼具有耐燃、耐化學藥品、耐 溫濕、抗紫外線等特性。至於被貼合物，如承載帶或承載 盤其材料的選擇適用範圍亦極廣闊，可以是天然或人造合 成紙類、塑膠、陶瓷、金屬 '非金屬或以上材料之組合等， 此外上述之回收原料或其組合或相似者等均可列入適格對 象。 經濟部中央標準局只工消費合作社印製 (錡先閲讀背面之注$項再填寫本頁) 至於一些影響貼合黏著力大小與貼合時的封合狀況因 素’除了黏著層與被貼合物的材料爲考量因素外，黏著層 表面與被貼合物表面的結構型態（morph〇l〇gy)、表面能量 (surface energy or tension)或表面張力亦是很重要因素，貼 合前爲提高黏著力，多孔層12、不黏層14之材料表面或 被貼合物表面可經由火焰處理(flame treatment)，電獎處理 (plasma treatment) ' 電暈放電（corona discharge)加工處理 或以塗佈底膠(primer coating)以提高表面黏著力，甚者可 藉機械噴砂加工、電鍍或電解拋光處理被貼物，以提高表 面黏著力。 如「第3圖」所示，爲另外一種封裝覆膜結構，該封 裝覆膜41係由一雙軸延伸聚合物膜層42，一中間介層43Ver 99/08/27 A7 B7 V. Description of the invention () PSA) or thermoplastic polymers for heat-sealing type, the suitable materials can be acrylic glue, cyanoacrylates, polyurethane glue ( polyurethane adheasive), unsaturated polyester, silicon rubber, natural or synthetic rubber, hot-melt adhesives, thermoplastic polymers, etc., the present invention relatively recommends the use of adhesive materials with saturated chain bonding structure and It has both flame resistance, chemical resistance, temperature and humidity resistance, and UV resistance. As for the bonded material, such as the carrier tape or carrier disk, the choice of materials is also very wide. It can be natural or artificial synthetic paper, plastic, ceramic, metal, non-metal or a combination of the above materials, etc. Raw materials or their combinations or similar can be included in the eligible object. Printed by the Central Standards Bureau of the Ministry of Economic Affairs only for consumer cooperatives (锜 read the note on the back and then fill out this page). As for some factors that affect the size of the adhesive force and the sealing condition during bonding, except for the adhesive layer and the material being bonded In addition to the consideration of the material of the material, the structure (morphology, surface energy or tension) or surface tension of the surface of the adhesive layer and the surface of the adherend is also a very important factor. To improve the adhesion, the material surface of the porous layer 12 and the non-adhesive layer 14 or the surface of the adherend can be processed by flame treatment, plasma treatment '' corona discharge processing or coating Primer coating to improve the surface adhesion, and even mechanical sandblasting, electroplating or electrolytic polishing treatment of the object to improve the surface adhesion. As shown in "Figure 3", it is another packaging film structure. The packaging film 41 is composed of a biaxially stretched polymer film layer 42 and an intermediate interposer 43.

Cover Tape 9/2/97___9 Ver 本紙張尺度適用中國國家標芈（CNS ) A4規格（210X297公釐 經濟部中央標準局ωί工消費合作社印製 B7 _ 五、發明説明（） 與一背黏層47所構成，雙軸延伸聚合物膜層42與中間介 層43藉由第一黏著層44黏合，中間介層43藉由第二黏 著層45黏合於承載帶6，而背黏層47藉由第二黏著層45 黏合於中間介層43，該封裝覆膜41另於雙軸延伸聚合物 膜層42有縱向刻劃46加工，由於該縱向刻劃46之切口 處強度最弱，此封裝覆膜41表面上的縱向刻劃46加工製 程不論是於封裝貼合前或者是在封裝的同時施行後，均會 形成一結構上較弱的地方，此一有縱向刻劃46的封裝覆 膜41在被熱壓封合後，當其再被剝開時係沿該刻劃處裂 離，雖然該結構沒有控制黏著力之問題，且具有一定之裂 離方向，但本應用製程上需有一精密槽溝線切割製程，這 其中牽涉到切槽溝用之刀具及刀具上是否需用及加壓和加 熱裝置與及壓力和溫度控系統，再者撕裂時所需之力和縱 向刻劃‘ 46槽溝深度與薄膜厚度間比例有絕對的關係亦一 定影響實際上的應用，相信此種槽溝線式的雙軸延伸聚合 物膜層42極易受環境外力輕微撞擊影響而輕易破裂。 由於被封裝物件，不論是主動元件或被動元件，物件 大小和形狀不一，當被組合在一起時，其過程中可能會因 直接或間接涉及靜電衝擊而被破壞，組合前不論該被封裝 物件是否帶有靜電，但當由個別物件被集合組裝在一起時 則會因有帶靜電荷體的直接接觸或間接的感應而造成靜電 衝擊傷害，所以抗靜電（antistatic or charge dissipation)或 傳導消散掉靜電的處理在本發明應用亦是壹項很重要的訴Cover Tape 9/2/97 ___ 9 Ver This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm printed by the Central Standards Bureau of the Ministry of Economics, ωί Industrial Consumer Cooperative) _5. Description of the invention () and a back adhesive layer 47 As a result, the biaxially stretched polymer film layer 42 and the intermediate interposer 43 are bonded by a first adhesive layer 44, the intermediate interposer 43 is bonded to the carrier tape 6 by a second adhesive layer 45, and the back adhesive layer 47 is The two adhesive layers 45 are adhered to the intermediate interlayer 43, and the packaging film 41 is further processed with a longitudinal scribe 46 on the biaxially stretched polymer film layer 42. Since the strength of the cut of the longitudinal scribe 46 is the weakest, this packaging film 41 The longitudinal scribe 46 on the surface. Whether the packaging process is performed before the package is attached or after the packaging is performed at the same time, a structurally weak place will be formed. This packaging film 41 with the longitudinal scribe 46 is in After being sealed by heat pressing, when it is peeled again, it will be split along the score line. Although the structure does not have the problem of controlling adhesion and has a certain direction of splitting, a precision groove is required in this application process Grooving process, which involves grooving Is it necessary to use pressure and heating devices and pressure and temperature control systems on tools and knives, and the force required for tearing and longitudinal scoring? 46 There is an absolute relationship between the ratio of groove depth and film thickness. Affecting practical applications, it is believed that such a grooved biaxially stretched polymer film layer 42 is extremely susceptible to slight impact from environmental external forces and easily breaks. Because the packaged object, whether it is an active component or a passive component, the object size and The shapes are different. When assembled together, the process may be damaged due to direct or indirect electrostatic shock. Regardless of whether the packaged object is static or not before assembly, when individual objects are assembled together It will cause electrostatic shock damage due to direct contact or indirect induction of the charged body, so antistatic or charge dissipation or conduction to dissipate static electricity is also an important complaint in the application of the present invention.

Cov^r Tape 9/?/97_LD_Ver 99/0R/7.7 本紙張尺度適用中國國家標準（CNS )八4规格（2!〇X 297公釐） (诗先閲讀背面之注意事項再填寫本頁) -3一6 線 i、發明説明（ A7 B7 經濟部中央標準局負工消費合作社印裝 求’應用上尤其需要在封裝覆膜41與被封裝物件接觸之 面上或最外層材料上具有抗靜電或傳導消散掉靜電的功 能’一般於材料選擇與製程方法上：（1)可使用離子型與非 離子型介面活性劑(ionic and non-ionic surfactants)並藉內 部》比 口（internal blending)或外表面塗佈（external coating)的 方式處理；（2)混合有導電性材料，例如碳黑（carbon black powder)、碳纖維粉末（graphite fiber powder)或金屬粉末 等；（3)金屬膜蒸鍍或塗佈具金屬導電特性材料方法，如鋁 金屬蒸鍍膜或導電性聚苯胺（intrinsically conductive polyaniline)的油墨（lacquers)。 美國第5441809號專利與第5599621號專利，係描述 —種封裝覆膜之結構，其藉由高分子微粒或導電材料摻雜 於用以黏著承載帶之黏著層，由於高分子微粒異相結構特 性使得該封裝覆膜所需之撕離力爲30至80克每黏著 毫米單位，其係由於該高分子微粒之邊界不同相結構 (boundary and different phases)所造成之應力集中效果，而 該微粒材料可配合鍍上導電膜而使封裝覆膜具有抗靜電效 果，然而該封裝覆膜因爲材料的多相結構與相間之相容性 問題，其配方僅具有特定材質之承載帶使用對象，如聚苯 乙烯等，另外，其配方設計上雖具有適當的使用撕離力71， 其結構多相設計於實務使用上會隨時間與環境溫濕影響而 有潛在的物性變化，如相分離而導致其封合後所需之撕離 力71偏離所設計之適用範圍，因而造成前述之封合脫落、 rnver Tape_9/2/Q7Cov ^ r Tape 9 /? / 97_LD_Ver 99 / 0R / 7.7 This paper size applies to China National Standard (CNS) 8-4 specifications (2! 〇X 297 mm) (Read the notes on the back of the poem before filling this page)- 3-6 Line i. Description of the invention (A7 B7 Printing of the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives for printing requires that, in particular, the surface of the packaging film 41 in contact with the packaged object or the outermost material has antistatic or The function of conducting and dissipating static electricity is generally used in material selection and manufacturing methods: (1) ionic and non-ionic surfactants can be used and internal blending or external Surface coating (external coating); (2) mixed with conductive materials, such as carbon black (carbon black powder), carbon fiber powder (graphite fiber powder) or metal powder; (3) metal film evaporation or coating Methods for fabricating materials with metal conductive properties, such as aluminum metal vapor-deposited films or inks of conductively conductive polyaniline (lacquers). US Patent No. 5,441,809 and Patent No. 5,599,621 are descriptions -A kind of packaging film structure, which is doped with polymer particles or conductive materials in the adhesive layer used to adhere the carrier tape. Due to the heterophasic structure of the polymer particles, the required peeling force of the packaging film is 30 to 80 grams per adhesive millimeter unit, which is due to the stress concentration effect caused by the boundary and different phases of the polymer particles, and the particulate material can be coated with a conductive film to make the packaging film antistatic Effect, however, because of the multi-phase structure and compatibility between the materials of the packaging film, its formula has only the object of using the carrier tape of a specific material, such as polystyrene, etc. In addition, its formula design has appropriate use The tearing force 71, its structural multi-phase design is practically used, and will have potential physical changes with time and environmental temperature and humidity effects. For example, the phase separation causes the tearing force 71 required after sealing to deviate from the designed application. Range, thus causing the aforementioned seal to fall off, rnver Tape_9 / 2 / Q7

Ver QQ/0X/?.7 (請先閏讀背面之注意事項再填寫本頁)Ver QQ / 0X / ?. 7 (Please read the notes on the back before filling this page)

、1T " 用中國國家標準（CNS〉A4^格（2!0X297公釐） B7 B7 經濟部中央標糸.局負工消費合作社印製 12 五、發明説明（） 過緊和裂離方向不當的缺點。此一藉由不同之層間材料特 性開發及適當控制其各層間之黏著特性係爲目前一般表面 封裝膠帶使用硏發者主要之參考改良方向，然而卻常受限 於諸多互相衝突之變因並且增加硏發製造成本，正如前面 所述，若增加該封裝覆膜與承載帶之黏著力，則可能使得 撕離力71過大不易控制，而有震動元件掉落問題，另〜 方面若降低該封裝覆膜與承載帶之黏著力，則易使封裝覆 膜脫落。 【發明目的】 本發明主要目的在於提供一種封裝用複合膜，使得封 裝用複合膜和被貼或被封合之處有一很好的接著結果，其 良好的高黏著力封合使被封物不易因黏著力不足而造成封 合脫開。 本發明另一目的在於提供一種封裝用複合膜，使得封 裝用複合膜剝離承載器時具有一非常均勻平順的撕離現 象’無有因撕離力71不均而導致震動現象並使被封裝物 跳掉(jumping off problem)現象。 【簡要圖式說明】 第1-1圖，爲習知封裝件結合截面圖； 第1-2圖，爲習知封裝件圖撕離截面圖： 弟2-1圖，爲另一習知封裝件結合截面圖； 第2-2圖，爲另一習知封裝件圖撕離截面圖； 第3圖，爲又另一習知封裝件結合結構截面圖； _C_over Tanfi 9/2/07 本纸扶尺度適用中國国家標準（Cjs.s )六4規格（210X297公釐） .— I. r 訂R-「辞先聞¾背面之注意事項再填轉本I」 經濟部中失梂绛局貝工消費合作.社印製 A 7 _ B7 五、發明説明（） '~ 第4圖’爲本發明之立體結構圖之一； 第5_1圖，爲本發明實施例之封裝結合截面圖； 第5-2圖，爲本發明實施例之封裝後撕離截面圖； 第ό圖’爲本發明實施例之封裝後撕離時各種力量間之 比較截面圖 第7圖’爲本發明另一實施例之俯視圖 【較佳具體實例的說明】 有關本發明之詳細實施例說明，現就配合圖式說明如 下： 請參閱「第4圖」，爲本發明之立體結構圖，其包括 有：一複合膜1與一承載帶ό，被封裝之電子元件9則置 於承載帶6中其所具有之凹槽封閉區間(recess)中，該複合 膜1係由數層材料所結合而成，其最外部爲〜塗佈離形層 11，其次爲一多孔層12，該多孔層12係以雙軸延伸聚合 物膜’如聚酯（polyester)、聚丙嫌（p〇lypr〇pyiene，PP)、 聚苯乙烯（polystyrene，PS)、聚碳酸酯（p〇lyCarb〇nate，PC)、 聚醯亞胺(Polyimide，PI)、聚氯乙烯(p〇iyVinyi chi〇ride，PVC) 或合成紙（synthetic paper)等材料製成，沿著此多孔層12 表面則有複數個隨機性排列之孔洞，此類孔洞是用帶有尖 凸狀輪面之滾輪壓製而成，該多孔層12另一靠近被封合 物側表面則塗佈有一黏著層13，黏著層13靠近被封合物 側再貼合一不黏層14 ’該不黏層14靠近該承載帶6之表 面蒸鍍或表面塗佈有一抗靜電層》 _r^Vfr Tapp^Q/9Jg?---LI _Vpr QQ/OR/97 冬紙伕尺度適用中國國家標準（CN$ ) A4規格（210X297公釐） (討先閲讀背面之注意事項再填寫本頁) -,?τ 線 A7 ______B7__ 五、發明説明（） — 該離型層Π亦可以是靜電消除或抗靜電塗佈層或一 印刷層或兼有上述多種功能塗層取代之，其中靜電消除或 抗靜電塗佈層材料選擇與製程方法：（1)可使用離子型與非 離子型yM面活丨生劑（ionic and non-ionic surfactants)並藉內 部')比合(internal blending)或外表面塗佈（external coating)的 方式處理；（2)混合有導電性材料，例如碳黑（carb〇n black powder)、碳纖維粉末（graphite fiber powder)或金屬粉末 等；（3)金屬膜蒸鍍或塗佈具金屬導電特性材料方法，如鋁 金屬蒸鑛膜或本質具導電性聚苯胺（intrinsically conductive polyaniline)的油墨（lacquers)。此一抗靜電塗佈 層或導電層其表面電阻阻抗範圍爲小於10E13歐姆每平 方，而該多孔層12所選用之基材需爲一兼具有透明性與 機械強度相當之材料，其厚度可介於6至150微米之間， 爲提高各界層間貼合表面黏著強度，該多孔層12與不黏 層14之表面可藉由火焰處理(flame treatment)，電漿處理 (plasma treatment)、電暈放電（Corona discharge)加工處理 或以塗佈底膠(primer coating)，來提高表面能量並提高貼 合後之黏著強度，而黏著層13則可以是一種感壓膠或可 熱封合用材料、其主膠成份可以是感壓膠(pressure sensitive adhesive，PSA)或是熱封型用熱塑性聚合物 (thermoplastics)，適格的材料可以是壓克力膠，氰丙烯酯 膠（cyanoacrylates )，聚氣酯膠（polyurethane adheasive)， 未飽合聚醋膠（unsaturated polyester)，砂力康膠，天然 _Cover Taoe 9/7/97___L4_Ver 99/08/27 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ·-"-先閲讀背面之注意事項再填寫本頁)1T " Use Chinese National Standard (CNS> A4 ^ Grid (2! 0X297mm) B7 B7 Printed by the Central Ministry of Economic Affairs Standards Bureau. Consumers' Cooperatives of the Bureau of Work 12) 5. Description of the invention () Too tight and the direction of separation is improper The disadvantage of this is that the development of different interlayer material properties and the proper control of the interlayer adhesion properties are the main reference improvement directions for current developers of surface packaging tapes, but they are often limited by many conflicting changes. Because it also increases the manufacturing cost of the hairpin, as mentioned earlier, if the adhesion between the packaging film and the carrier tape is increased, the tearing force 71 may be too large to be easily controlled, and there will be a problem of falling vibration elements. The adhesion between the packaging film and the carrier tape can easily cause the packaging film to fall off. [Objective of the invention] The main purpose of the present invention is to provide a packaging composite film, so that the packaging composite film and the place to be pasted or sealed have one place. Very good adhesion results, and its good high adhesion sealing makes it difficult for the object to be sealed off due to insufficient adhesion. Another object of the present invention is to provide a packaging The film is combined, so that the packaging composite film has a very uniform and smooth tearing phenomenon when peeling off the carrier. 'There is no unevenness due to the uneven tearing force 71 and the phenomenon of jumping off the packaged object. Brief description of the diagram] Figure 1-1 is a cross-sectional view of a conventional package; Figure 1-2 is a cross-sectional view of a conventional package; Figure 2-1 is another conventional package Combined cross-sectional view; Figure 2-2 is a cross-sectional view of another conventional package; Figure 3 is a cross-sectional view of another conventional package's combined structure; _C_over Tanfi 9/2/07 The standard is applicable to China National Standard (Cjs.s) 6-4 specifications (210X297 mm). — I. r Order R- “Ci Xianxunwen ¾ Note on the back and fill in this I” Shellfisher in the Ministry of Economic Affairs Consumption cooperation. Printed by the society A 7 _ B7 V. Description of the invention () '~ Figure 4' is one of the three-dimensional structural drawings of the present invention; Figure 5_1 is a cross-sectional view of the package combination of the embodiment of the present invention; FIG. 2 is a cross-sectional view of the tear-off after packaging according to the embodiment of the present invention; FIG. Comparison cross-sectional view Figure 7 'is a top view of another embodiment of the present invention [Description of a preferred specific example] For the detailed embodiment description of the present invention, the description with the drawings is as follows: Please refer to "Figure 4" Is a three-dimensional structure diagram of the present invention, which includes: a composite film 1 and a carrier tape; the encapsulated electronic component 9 is placed in a recessed recess in the carrier tape 6; Composite film 1 is composed of several layers of materials, the outermost of which is ~ coated release layer 11, followed by a porous layer 12, which is a biaxially stretched polymer film such as polyester ( polyester), polypropylene (PP), polystyrene (PS), polycarbonate (PolyCarbonate, PC), polyimide (PI), polyvinyl chloride (p〇iyVinyi chi〇ride, PVC) or synthetic paper (synthetic paper) and other materials, along the surface of this porous layer 12 there are a plurality of randomly arranged holes, such holes are used with a pointed convex wheel The surface of the porous layer 12 is pressed by a roller, and the other side of the porous layer 12 is An adhesive layer 13 is disposed, and the adhesive layer 13 is close to the sealed compound side and then a non-adhesive layer 14 is bonded to the surface of the non-adhesive layer 14 near the carrier tape 6 or an antistatic layer is coated on the surface. _R ^ Vfr Tapp ^ Q / 9Jg? --- LI _Vpr QQ / OR / 97 Winter paper 伕 standard is applicable to Chinese National Standard (CN $) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)-, ? τ line A7 ______B7__ 5. Description of the invention () — The release layer Π may also be replaced by a static elimination or antistatic coating layer or a printing layer or a combination of the above-mentioned multiple functional coatings, among which static elimination or antistatic coating Material selection and manufacturing method: (1) ionic and non-ionic surface active agents (ionic and non-ionic surfactants) can be used and internal blending) or external surface coating ( external coating); (2) mixed with conductive materials, such as carbon black (carbon black powder), carbon fiber powder (graphite fiber powder) or metal powder; (3) metal film evaporation or coating tools Metallic conductive material methods, such as aluminum metal vaporized mineral film or essentially Electrical polyaniline (intrinsically conductive polyaniline) ink (lacquers). The surface resistance range of this antistatic coating layer or conductive layer is less than 10E13 ohms per square, and the substrate used for the porous layer 12 needs to be a material with both transparency and mechanical strength, and its thickness can be Between 6 and 150 microns, in order to improve the adhesion strength of the bonding surface between the various layers, the surfaces of the porous layer 12 and the non-adhesive layer 14 can be subjected to flame treatment, plasma treatment, corona Corona discharge processing or primer coating to increase surface energy and adhesion strength after bonding, and the adhesive layer 13 can be a pressure-sensitive adhesive or heat-sealable material, The main rubber component can be pressure sensitive adhesive (PSA) or heat-sealable thermoplastic polymers (thermoplastics). Eligible materials can be acrylic adhesives, cyanoacrylates, and polyurethane adhesives. (Polyurethane adheasive), unsaturated polyester, sandalcon, natural _Cover Taoe 9/7/97 ___ L4_Ver 99/08/27 This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 mm) ·-" -Read the precautions on the back before filling in this page)

*1T 線 經濟部中央標隼局員工消費合作社印製 B7 五、發明説明（） 或合成橡膠，熱融膠，熱可塑性聚合物等，膠的型態可以 是水性膠或油性膠，再者，該不黏層14所選用之材料爲 一般聚合物膜或延伸性聚合物膜，材料可以是聚酯 (polyester)、聚丙烯（polypropylene，PP)、聚苯乙燦 (polystyrene，PS)、聚碳酸酯（polycarbonate, PC)、聚酿亞 胺(polyimide，PI)或聚氯乙烯(polyvinyl chloride，PVC)等材 料製成，材料且具有相當強度與可有或可無之透明性，其 厚度可視實際需要而定，另外該不黏層14亦可用油墨 (lacquer)印刷藉由加熱熟化（thermal cure)或放射線熟化 (radiation cure)而成0 經濟部中央標準局負工消費合作社印製 (¾先閔讀背面之注意事項再填寫本頁) 訂 婊 如「第5-1圖」與「第5-2圖」所示，分別爲本發明 實施例之結合截面圖與撕離截面圖，其中在結合狀態時多 孔層12可區分爲撕裂部份121(tear strip portion)，黏合部 份 122(adhesion portion)與應力集中區 123(stress concentration zone)，當複合膜1與承載帶6以壓合、熱封 合或其它封合手段結合後，黏合部份122爲多孔層12與 承載帶6黏著貼合處，並使得機械抗張強度增加之部份， 另一由多孔層12與不黏層14藉黏著層13貼合後亦形成 另一具有較高機械抗張強度複合膜區，並使得其本身更具 較高的抗撕強度，而應力集中區123介於被貼合承載帶6 邊緣與不黏層14邊緣間，意即爲不黏層14與黏合部份122 間無任何強化作用區域，由於該應力集中區123結構上只 有一層主要的多孔層12，其本身具有的機械抗張強度和兩* 1T printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. B7. 5. Description of the invention () or synthetic rubber, hot melt glue, thermoplastic polymer, etc. The type of glue can be water-based glue or oil-based glue. The non-stick layer 14 is made of a general polymer film or an extensible polymer film. The material can be polyester, polypropylene (PP), polystyrene (PS), or polycarbonate. Polyester (PC), Polyimide (PI) or Polyvinyl chloride (PVC) and other materials, materials with considerable strength and transparency with or without, the thickness can be based on the actual Depending on the need, the non-stick layer 14 can also be printed with ink (lacquer) and made by thermal curing or radiation curing. 0 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. (Please read the notes on the back and fill in this page again.) As shown in "Figure 5-1" and "Figure 5-2", these are the combined cross-sectional view and tear-away cross-sectional view of the embodiment of the present invention. Porous layer 12 in the state In order to tear the portion 121 (tear strip portion), the adhesion portion 122 (adhesion portion) and the stress concentration zone 123 (stress concentration zone), when the composite film 1 and the carrier tape 6 are laminated, heat sealed or other sealed After the means are combined, the adhesive portion 122 is a portion where the porous layer 12 and the carrier tape 6 adhere to each other, and the mechanical tensile strength is increased, and the other portion is bonded by the porous layer 12 and the non-adhesive layer 14 through the adhesive layer 13 It also forms another composite film area with higher mechanical tensile strength and makes it more tear-resistant, while the stress concentration area 123 is between the edge of the bonded carrier tape 6 and the edge of the non-adhesive layer 14, This means that there is no strengthening area between the non-adhesive layer 14 and the bonding portion 122. Since the stress concentration area 123 has only one main porous layer 12, its mechanical tensile strength and two

Cover Tape 9/2/Q7_LS_ Ver 99/08/27 A 7 B7 經濟部中央標準局負工消費合作社印製 五、發明説明（ 側黏合部份122和含多孔層12與不黏層14之中央複合膜 所具有之機械抗撕裂強度比較是爲最弱的(weakest)，由於 該多孔層12爲一具有複數個隨機排列之孔洞，該孔洞在 撕裂時具有引導此一撕裂應力集中之特性，因此僅需極小 之撕離力71，換言之，本發明對該撕裂部份121撕離該黏 合部份122所需最小之力具有同時小於該黏合部份122與 該承載帶6之黏著力和小於該撕裂部份121中多孔層12 與不黏層14間之黏著力，其中撕裂部份121於被撕離過 程中具有非常均勻平順的特色（extremely smooth and uniform) 〇 如「第6圖」所示，當中間撕裂部份121沿著預先設 計之應力集中區123被撕離時，該撕離線(tear line)有一方 向性並且沿著預先設計之應力集中區（stress concentration z〇ne)123裂離，此撕離線(tear line)的位置和撕裂截面外觀 與所施加之撕離力71大小、撕離速度和所施加撕離力71(F1) 和多孔層與不黏層間之第一黏著力72 (F2)以及多孔層與 承載體接觸表面間之第二黏著力73(F3)相對大小有關。 請參閱「表1」一 29微米厚之封裝用雙軸延伸多孔性 聚丙烯(polypropylene，ΡΡ)膠帶對不同被貼黏材料在不同剝 離角度之黏著力實驗： (錡先閲讀背面之注意事項再填寫本頁) 訂 绞.Cover Tape 9/2 / Q7_LS_ Ver 99/08/27 A 7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (Side-bonded part 122 and the central composite with porous layer 12 and non-adhesive layer 14 The comparison of the mechanical tear strength of the membrane is the weakest. Since the porous layer 12 is a plurality of randomly arranged holes, the holes have the property of guiding the concentration of the tear stress during tearing. Therefore, only a very small tearing force 71 is required. In other words, the minimum force required for the tearing portion 121 to tear off the adhesive portion 122 is smaller than the adhesive force of the adhesive portion 122 and the carrier tape 6 at the same time. And less than the adhesive force between the porous layer 12 and the non-adhesive layer 14 in the tearing portion 121, wherein the tearing portion 121 has a very uniformly smooth and uniform characteristic during the tearing process. As shown in Figure 6, when the middle tear portion 121 is torn off along the pre-designed stress concentration area 123, the tear line has a directionality and follows the pre-designed stress concentration area (stress concentration z). 〇ne) 123 split, this tear off line ( position of the tear line) and the appearance of the tear section and the magnitude of the applied tearing force 71, the tearing speed and the applied tearing force 71 (F1) and the first adhesion force 72 (F2) between the porous layer and the non-adhesive layer, and The second adhesive force 73 (F3) between the porous layer and the contact surface of the carrier is related to the relative size. Please refer to "Table 1"-29 micron thick biaxially stretched porous polypropylene (PP) tape for packaging Adhesion experiments of adhesive materials at different peeling angles: (锜 Read the precautions on the back before filling this page)

Tap^ Q/7/Q7 -U. 表紙伕尺度適用中國國家標孪（CNS ) A#，"格（2丨OX297公釐） QQ/ng/97 Λ7 B7 Μ濟部中央標準局另工消費合作社印褽 五、發明説明（Tap ^ Q / 7 / Q7 -U. The paper sheet scale is applicable to the Chinese National Standard (CNS) A #, " Grid (2 丨 OX297 mm) QQ / ng / 97 Λ7 B7 Μ The Central Bureau of Standards of the Ministry of Economic Affairs and Consumer Cooperatives印 褽 5. Description of the invention (

本測試用膠帶爲具一吋窗， ,, 1 之义軸延伸多孔性聚丙烯 (polypropylene，ΡΡ)膜’於一側途 A 诹堡佈有2〇微米厚之亞克力 感壓膠，其中A代表剝離角度（_抓帅e㈣），f代 表黏著力（克/每英吋g/in) ’ SS代表不鏽鋼板，psc代表抗 靜電性聚苯乙烯板（混有導電性碳黑），pcc代表抗靜電性 聚碳酸酯板(混有導電性碳黑）。 另一例子’以一吋寬29微米厚雙軸延伸聚丙烯 (polypropylene，PP)多孔性膜膠帶，膠的另一側正中央貼 合有半吋寬25微米厚之雙軸延伸聚酯膜(polyester film)， 最後再將此一複合膜膠帶分別貼合於標準測試用不銹鋼板 與聚苯乙烯板上，測驗時自中央不黏層兩側邊緣之應力集 中區撕開其撕裂部份，並以180度剝離角度每分鐘24吋 剝離速率撕離，量測自不銹鋼板與聚苯乙烯板撕離時所需 用之撕離力71，其結果幾乎相同，24克’其中之所量測 撕離力71亦隨撕離速率增加而變大，且撕離線(tear Hne) »1 - --- - - : — I I I II! - ^ n II 1 I: II —1 · 丁< I— HI 1— I . ·.----6、‘ . - · 产. (讀先K讀背面之注意事項再填寫本頁) ；τ、紐尺) A4M (2!ϋχ29ϋ B7 五、發明説明（） - 亦會隨撕離速率增加而越靠近不黏層的邊緣兩側且撕裂部 份兩側外觀因撕離速率增加所伴生之應力集中效應變大， 而使裂離線斷層表面更具尖銳平整性(sharpen edge)。 請參閱「表2」，係爲一吋寬不同厚度與不同材料之 多孔性雙軸延伸聚丙烯和聚乙二醇對苯二甲酸酯 (polyethylene terephthalate，PET)膠帶對 25 微米厚之不黏 聚酯薄膜之背黏著力實驗，剝離速率爲每分鐘24寸： 多孔性雙軸延伸聚合物膜 KF0PP KF0PP KF0PP 厚度(微米） 20 29 40 背黏力（克/每吋） 1146 1033 1091 K] 12 1463 表2 其中KFOPP與KFPET分別代表多孔性雙軸延伸聚丙烯 (OPP)和聚乙二醇對苯二甲酸酯膜(PET)膠帶。 請參閱「表3」，係爲具有一寸寬，不同厚度與不同 材料之多孔性雙軸延伸聚丙烯和聚乙二醇對苯二甲酸酯 (polyethylene terephthalate, PET)膠帶，膠的另一側正中央 再貼合一半吋寬25微米厚雙軸延伸聚酯膜（polyester film)，最後再將此一複合膜膠帶貼合於標準測試不銹鋼 板，實驗時自中央不黏層兩側邊緣之應力集中區撕開其撕 裂部份，並自180度以每分鐘24吋剝離速率撕離，量測 自不銹鋼板撕離所需用之撕離力71實驗： CNS ) Α4夫u各（21&Χ297公及） CV先K讀背面之注意事項再填寫本百The tape used for this test is a polypropylene film with a one-inch window, 1, and 1 meaning axis extension. On one side, A bunker cloth has a 20-micron-thick acrylic pressure-sensitive adhesive, where A represents Peeling angle (_Grassing e㈣), f represents adhesion (g / in) g 'in SS stands for stainless steel plate, psc stands for antistatic polystyrene plate (mixed with conductive carbon black), and pcc stands for resistance Electrostatic polycarbonate sheet (mixed with conductive carbon black). Another example 'is a one-inch wide 29 micron thick biaxially stretched polypropylene (PP) porous film tape. A half inch wide 25 micron thick biaxially stretched polyester film ( polyester film). Finally, this composite film tape was attached to the standard test stainless steel plate and polystyrene plate. During the test, the tear part was torn from the stress concentration areas on the sides of the central non-stick layer. And peeled off at a peeling rate of 24 inches per minute at a 180-degree peeling angle. The peeling force 71 measured from the stainless steel plate and the polystyrene plate when peeling off was measured. The results were almost the same. The tearing force 71 also increases as the tearing rate increases, and the tear line (tear Hne) »1------:-III II!-^ N II 1 I: II —1 · D < I— HI 1— I. · .---- 6, '.-· Product. (Read K first, read the notes on the back, then fill in this page); τ, button) A4M (2! Ϋχ29ϋ B7 V. Description of the invention ( )-It will also get closer to the two sides of the edge of the non-sticky layer as the peeling rate increases, and the stress concentration effect associated with the appearance of the two sides of the torn part due to the increased peeling rate Larger, so that the fracture surface has sharper edge. Please refer to "Table 2", which is a one-inch wide biaxially stretched polypropylene and polyethylene glycol p-benzene with different thickness and different materials. Back adhesion test of polyethylene terephthalate (PET) tape on 25 micron thick non-stick polyester film, peeling rate is 24 inches per minute: Porous biaxially stretched polymer film KF0PP KF0PP KF0PP thickness (micron) 20 29 40 Back tack (g / inch) 1146 1033 1091 K] 12 1463 Table 2 Where KFOPP and KFPET represent porous biaxially stretched polypropylene (OPP) and polyethylene glycol terephthalate film ( PET) tape. Please refer to "Table 3", which is a porous biaxially-stretched polypropylene and polyethylene terephthalate (PET) tape with one inch width, different thickness and different materials. On the other side, a half inch width 25 micron-thick biaxially-stretched polyester film was laminated in the middle of the center. Finally, a composite film tape was attached to a standard test stainless steel plate. Stress set of side edges The tearing part was torn in the middle area, and it was peeled off from 180 degrees at a peeling rate of 24 inches per minute, and the tearing force required for tearing off from the stainless steel plate was measured. 71 Experiment: CNS) Α4 夫夫 each (21 & Χ297 公 和) CV first read the notes on the back of K before filling in this hundred

PET 經濟部中央梂€.局兵工消費合作社印製Printed by the Central Ministry of Economic Affairs of PET

Vei 99/08/27 B7 五'發明説明（） 多孔性雙軸延伸聚合物膜 KF〇pp KF0PP KF0PP KF 1 PET 厚度(微米） 20 29 40 12 1 撕離力（克） 11 24 28 14 r. ' 1 表3 讀— 背1 意 事 項 再 填 寫 本 頁 由表1、表2與表3可知本發明並不受限於使用任何 一種黏著材質，端視被貼合物材料所需而定，且由於該多 孔層12被撕離時所需之撕離力71僅爲1〇至1〇〇克，而 由於第一黏著力72(F2)與第二黏著力73(F3)亦遠大於此一 撕離力71，因此對於黏著力大小無需設有任何限制，撕離 時撕離部份必可沿著兩旁應力集中區123裂離，並與被貼 封合之承載帶6分離’且因撕離部份(tear strip portion)自 複合覆膜1撕離在不同剝角度下所需之撕離力71均很小， 撕離時具有非常均勻平順的特性，不會造成承載器因有震 動現象而使得被封裝元件有被震動彈出問題，且因有應力 集中區的撕裂引導作用而避免掉有不當之裂離方向問題。 經濟部中央標华局負工消費合作社印製 請參閱「第7圖」，爲本發明之另一實施例，該複合 膜1亦可用於封合容納具有複數不同大小、不同形狀、不 同深淺承載槽51之承載器5，可容納不同種類之物件，該 承載器5材料可爲紙材、合成紙、塑膠、陶瓷、金屬、非 金屬或可爲以上材料之混合體或可爲上述之回收材料，另 外’該複合膜1的表面亦可藉油墨表面印刷（surface ink printing)來標示公司名稱（company name)、商標名（trade name)、產品名稱(product name)、產品識別代號 ) A4iUI· ( 210 X 297-¾ vet 99/0'8ΑΓ7 A7 B7 五、發明説明（ (identification bar code)等，以供使用者做爲手動、半自動 或全自動設備辨視之用。 本發明雖藉由實施例來描述，仍可變化其形態與細 節，但亦不脫離本發明之精神而達成，並由熟悉此項技藝 之人士可了解。 (.-.7---:¾¾背面之注意事項再填寫本頁) ---；----χί-- -訂 線--- 經濟部中央標隼局！.·<工消費合作社印製 -¥&r 99/mHrh t®ai：VW9(7CNS ) A4.iU^· ( 210Χ297Ϊ^-Vei 99/08/27 B7 Five 'invention description () Porous biaxially stretched polymer film KF〇pp KF0PP KF0PP KF 1 PET thickness (micron) 20 29 40 12 1 tearing force (g) 11 24 28 14 r. '1 Table 3 Read — Back to the first page and fill in this page. From Table 1, Table 2 and Table 3, you can know that the present invention is not limited to using any kind of adhesive material. Since the tearing force 71 required for the porous layer 12 to be peeled off is only 10 to 100 grams, and because the first adhesive force 72 (F2) and the second adhesive force 73 (F3) are also much larger than this one The tearing force 71, therefore, there is no need to set any restrictions on the magnitude of the adhesive force. When tearing off, the tearing off part must be separated along the stress concentration areas 123 on both sides, and separated from the sealed carrier tape 6 '. Tear strip portion The peeling force 71 required to tear off the composite film 1 at different peeling angles is very small. It has a very uniform and smooth characteristic when peeling off, which will not cause the carrier to vibrate. As a result, the packaged component has the problem of being popped by vibration, and due to the tear guiding effect of the stress concentration area, it is prevented from being improperly dropped. The problem of separation direction. Printed by the Central Standardization Bureau of the Ministry of Economic Affairs and Consumer Cooperatives, please refer to "Figure 7", which is another embodiment of the present invention. The composite film 1 can also be used for sealing and accommodating a plurality of different sizes, different shapes, and different depths. The carrier 5 of the slot 51 can accommodate different kinds of objects. The material of the carrier 5 can be paper, synthetic paper, plastic, ceramic, metal, non-metal or a mixture of the above materials or the above-mentioned recycled materials. In addition, 'the surface of the composite film 1 can also be marked with a company name, a trade name, a product name, and a product identification code by surface ink printing. A4iUI · ( 210 X 297-¾ vet 99 / 0'8ΑΓ7 A7 B7 5. Identification bar code, etc., for users to use as manual, semi-automatic or fully automatic equipment for identification. Although the present invention uses the embodiment For description, its form and details can still be changed, but it is also achieved without departing from the spirit of the present invention, and can be understood by those familiar with this technology. (.-. 7 ---: ¾¾ Note on the back, please fill out this Page) ---; ---- χί-- -Booking --- Central Standards Bureau of the Ministry of Economic Affairs !. < Printed by Industry and Consumer Cooperatives- ¥ & r 99 / mHrh t®ai: VW9 (7CNS) A4 .iU ^ · (210 × 297Ϊ ^-

Claims (1)

ABCD 六、申請專利範圍 L 一種封裝用複合膜，其係用以將物件封裝於一承載件， 其構造包括： 一黏著層； 一不黏層； 一多孔層，其內含有複數個隨機性排列之孔洞，而該 黏著層係塗佈於該多孔層之一表面，且該不黏層係 藉由該黏著層黏合於該多孔層，該多孔層包括一黏 合部份，其係爲該多孔層中藉由該黏著層黏合於被 黏著承載件之部份；一撕裂部份，其係爲該多孔層 中藉由該不黏層強化其內聚能強度，具有較高機械 抗張強度之部份；以及一應力集中區，其係爲該多 孔層中介於該黏合部份邊緣與該不黏層邊緣間之區 域，該撕裂部份係於被封裝物件被取出前，沿該應 力集中區具方向性地裂離。 2·如申請專利範圍第1項所述之封裝用複合膜，其中該撕 裂部份自應力集中區撕離時，裂離所需之撕離力係小於 該黏合部份中多孔層藉黏著層與該承載件間之黏著力。 經濟部中央標準局貝工消費合作社印製 (請先閱讀背面之注f項再填寫本頁) 線 3·如申請專利範圍第1項所述之封裝用複合膜，其中該撕 裂部份自應力集中區撕離時，裂離所需之撕離力係小於 該撕裂部份中多孔層藉黏著層與不黏層間之黏著力。 4. 如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層相對於該黏著層之另一表面塗佈有離型層。 5. 如申請專利範圍第4項所述之封裝用複合膜，其中該離 型層係爲一般塗佈乾燥、加熱熟化或放射線熟化印刷層 本纸張尺度逍用中國國家標準（CNS )A4規格（210X297公釐） AS Βδ _§1__ 六、申請專利範圍 族群方法中的任一者和其相似者。 6·如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層相對於該黏著層之另一表面塗佈有抗靜電層。 7. 如申請專利範圍第6項所述之封裝用複合膜，其中該抗 靜電層係選自抗靜電介面活性劑表面塗層、抗靜電放射 線熟化印刷層、導電性塗料表面塗層、金屬蒸鍍層所組 成的族群中的任一者和其相似者。 8. 如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層相對於該黏著層之另一表面係包含表面印刷層。 9. 如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層之材質係選自雙軸延伸聚合物如耐龍膜(nylon)、聚 酯膜（polyester film, PET)、聚丙稀膜（polypropylene， PP) '聚碳酸酯膜（polycarbonate，PC)、聚苯乙烯膜 (polystyrene, PS)、聚璞膜 polysulfone film、聚醯亞胺 膜（polyimide，PI)、聚氯乙嫌膜（polyvinyl chloride, PVC)、聚丙烯合成紙(PP synthetic paper)、聚酯合成紙 (PET synthetic paper)所組成的族群中的任一者和其相 似者。 10. 如申請專利範圍第1項所述之封裝用複合膜_，其中該不 黏層之材質係選自延伸性聚合物如耐龍膜(nylon)、聚酯 膜（polyester film，PET)、聚丙烯膜（polypropylene, PP)、 聚碳酸酯膜(polycarbonate, PC)、聚苯乙稀膜（polystyrene, PS)、聚璞膜 polysulfone film、聚醯亞胺膜(polyimide， PI)、聚氯乙烯膜(polyvinyl chloride，PVC)、聚丙烯合 計先閲讀背面之注意事項再填寫本頁) 訂 線！ 經濟部中央標牟局貝工消費合作社印製 經濟部中央標準局貝工消費合作社印製 Α8 Β8 C8 D8 六、申請專利範圍 成紙（PP synthetic paper)、聚酯合成紙（PET synthetic paper)所組成的族群中的任一者和其相似者。 11. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層之材質係一導電性金屬薄膜。 12. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層靠近被封裝物件之表面，塗佈有一抗靜電層。 13. 如申請專利範圍第12項所述之封裝用複合膜，其中該 抗靜電層係選自抗靜電介面活性劑表面塗層、抗靜電放 射線熟化印刷層與導電性塗料表面塗層所組成的族群中 的任一者和其相似者。 14. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層靠近該承載件之表面塗佈有電荷傳導層。 15. 如申請專利範圍第14項所述之封裝用複合膜，其中該 電荷傳導層係選自導電性塗料表面塗佈層、金屬蒸鍍層 與金屬薄膜層所組成的族群中的任一者和其相似者。 16. 如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層之表面係以塗底膠加強表面黏著。 Π.如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層之表面係以火燄處理加強表面黏著。‘ 18. 如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層之表面係以電漿加工加強表面黏著。 19. 如申請專利範圍第1項所述之封裝用複合膜，其中該多 孔層之表面係以電暈放電加工加強表面黏著。 20. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 ：-----------y — (锖先閲讀背面之注意事項再填寫本頁) 訂 線 本紙張尺度逋用中國國家標準（CNS ) A4規格（210Χ297公釐） ABCD 六、申請專利範圍 黏層之表面係以塗底膠加強表面黏著。 21. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層之表面係以火燄燃燒加強表面黏著。 22. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層之表面係以電暈放電加工加強表面黏著。 23. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層之表面係以電漿加工加強表面黏著。 24. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層係爲複數個不黏條。 25. 如申請專利範圍第24項所述之封裝用複合膜，其中該 不黏條彼此間相鄰一間距。 26. 如申請專利範圍第1項所述之封裝用複合膜，其中該不 黏層係爲配合具有不一樣的形狀和大小之該承載件，而切 割成形狀和不同大小之複數個不黏區。 ^ ^---y------IT------線’- * , (請先閎讀背面之注意事項再填寫本頁) 經濟部中央揉準局負工消費合作社印製 本紙張尺度適用中國國家標準（CNS )八4极格（210X297公釐）ABCD VI. Patent Application Range L A composite film for packaging, which is used to encapsulate an object in a carrier. Its structure includes: an adhesive layer; a non-adhesive layer; a porous layer, which contains a plurality of randomness. Arrayed holes, and the adhesive layer is coated on one surface of the porous layer, and the non-adhesive layer is adhered to the porous layer through the adhesive layer, the porous layer includes an adhesive portion, which is the porous layer The layer is adhered to the part of the adhered carrier by the adhesive layer; a tearing part is the cohesive energy strength of the porous layer by the non-adhesive layer, and has higher mechanical tensile strength And a stress concentration region, which is an area between the edge of the adhesive portion and the edge of the non-adhesive layer in the porous layer, and the tear portion is along the stress before the packaged object is taken out The concentration area is directionally split. 2. The composite film for encapsulation according to item 1 of the scope of the patent application, wherein when the tearing part is torn off from the stress concentration area, the tearing force required for the separation is smaller than that of the porous layer in the bonding part by adhesion The adhesion between the layer and the carrier. Printed by the Central Laboratories of the Ministry of Economic Affairs, Shellfish Consumer Cooperative (please read the note f on the back, and then fill out this page) Line 3 · The composite film for encapsulation as described in item 1 of the scope of patent application, where the tear part is from When the stress concentration area is torn off, the tearing force required for the tearing is smaller than the adhesive force between the porous layer and the non-sticky layer in the tearing portion. 4. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the other surface of the porous layer with respect to the adhesive layer is coated with a release layer. 5. The composite film for encapsulation as described in item 4 of the scope of the patent application, wherein the release layer is a general coating drying, heat curing or radiation curing printing layer. The paper size is in accordance with China National Standard (CNS) A4. (210X297 mm) AS Βδ _§1__ VI. Any one of the patent application scope ethnic methods and its similar. 6. The composite film for encapsulation according to item 1 of the scope of the patent application, wherein the other surface of the porous layer with respect to the adhesive layer is coated with an antistatic layer. 7. The composite film for encapsulation according to item 6 of the scope of the patent application, wherein the antistatic layer is selected from the group consisting of an antistatic surface active agent surface coating, an antistatic radiation curing printing layer, a conductive coating surface coating, and a metal vaporizer. Any one of the groups made up of plating and its similar. 8. The composite film for encapsulation according to item 1 of the patent application scope, wherein the other surface of the porous layer with respect to the adhesive layer includes a surface printing layer. 9. The composite film for encapsulation according to item 1 of the scope of the patent application, wherein the material of the porous layer is selected from biaxially stretched polymers such as nylon, polyester film (PET), polypropylene Thin film (polypropylene, PP) 'Polycarbonate (PC), polystyrene (PS), polysulfone film, polyimide (PI) film, polyvinyl chloride film (Polyvinyl chloride, PVC), polypropylene synthetic paper (PP synthetic paper), polyester synthetic paper (PET synthetic paper), and any one of them is similar. 10. The composite film for encapsulation according to item 1 of the scope of the patent application, wherein the material of the non-stick layer is selected from the group consisting of an extensible polymer such as nylon, polyester film (PET), Polypropylene (PP), Polycarbonate (PC), Polystyrene (PS), Polysulfone Film, Polyimide (PI), Polyvinyl Chloride Film (polyvinyl chloride, PVC), polypropylene total, please read the precautions on the back before filling this page) Order! Printed by the Shell Standard Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. Printed by the Shell Standard Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. A8, B8, C8, D8. 6. Patent application scope: PP synthetic paper, PET synthetic paper. Any one of the formed groups and its similar. 11. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the material of the non-stick layer is a conductive metal film. 12. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the non-adhesive layer is near the surface of the packaged object and coated with an antistatic layer. 13. The composite film for encapsulation according to item 12 of the scope of the patent application, wherein the antistatic layer is selected from the group consisting of an antistatic surface active agent surface coating, an antistatic radiation curing printing layer, and a conductive coating surface coating. Any one of the ethnic groups and its similar. 14. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the surface of the non-adhesive layer near the carrier is coated with a charge-conducting layer. 15. The composite film for encapsulation according to item 14 of the scope of patent application, wherein the charge-conducting layer is selected from the group consisting of a conductive coating surface coating layer, a metal evaporation layer, and a metal thin film layer, and Its similar. 16. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the surface of the porous layer is coated with primer to enhance surface adhesion. Π. The composite film for encapsulation according to item 1 of the scope of the patent application, wherein the surface of the porous layer is flame-treated to enhance surface adhesion. ‘18. The composite film for encapsulation according to item 1 of the scope of the patent application, wherein the surface of the porous layer is strengthened by plasma processing. 19. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the surface of the porous layer is surface-bonded by corona discharge processing. 20. The composite film for encapsulation as described in item 1 of the scope of patent application, which should not: ----------- y — (锖 Read the precautions on the back before filling in this page) Binding book Paper size: Chinese National Standard (CNS) A4 specification (210 × 297 mm) ABCD VI. Patent application The surface of the adhesive layer is coated with primer to enhance surface adhesion. 21. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the surface of the non-adhesive layer is flame-bonded to enhance surface adhesion. 22. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the surface of the non-adhesive layer is strengthened by corona discharge processing. 23. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the surface of the non-adhesive layer is strengthened by plasma processing. 24. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the non-adhesive layer is a plurality of non-adhesive strips. 25. The composite film for encapsulation according to item 24 of the patent application, wherein the non-adhesive strips are adjacent to each other by a distance. 26. The composite film for encapsulation according to item 1 of the scope of patent application, wherein the non-adhesive layer is cut into a plurality of non-adhesive regions with different shapes and sizes to fit the carrier with different shapes and sizes. . ^ ^ --- y ------ IT ------ line '-*, (Please read the notes on the back before filling out this page) Printed by the Central Consumers Bureau of the Ministry of Economy This paper size applies to Chinese National Standard (CNS), 8 poles (210X297 mm)
TW086113309A 1997-09-13 1997-09-13 Compound membrane for packaging TW393405B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
TW086113309A TW393405B (en) 1997-09-13 1997-09-13 Compound membrane for packaging
TW086113309A TW422784B (en) 1997-09-13 1997-11-15 Mounting composite film
JP01853398A JP3249942B2 (en) 1997-09-13 1998-01-30 Composite film for package
SG9800287A SG79225A1 (en) 1997-09-13 1998-02-10 Cover tape for packaging
GB9803510A GB2334502B (en) 1997-09-13 1998-02-19 Cover tape for packaging
GB0004056A GB2346128B (en) 1997-09-13 1998-02-19 Cover tape for packaging
FR9802901A FR2768411B1 (en) 1997-09-13 1998-03-10 COMPOSITE COVERING STRIP FOR ENCAPSULATING ELECTRONIC COMPONENTS
DE19810550A DE19810550A1 (en) 1997-09-13 1998-03-11 Multipart cover strip for wrapping electronic components in a carrier strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086113309A TW393405B (en) 1997-09-13 1997-09-13 Compound membrane for packaging

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Publication Number Publication Date
TW393405B true TW393405B (en) 2000-06-11

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TW086113309A TW422784B (en) 1997-09-13 1997-11-15 Mounting composite film

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JP (1) JP3249942B2 (en)
DE (1) DE19810550A1 (en)
FR (1) FR2768411B1 (en)
GB (2) GB2346128B (en)
SG (1) SG79225A1 (en)
TW (2) TW393405B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8520180B2 (en) 2009-02-19 2013-08-27 E Ink Holdings Inc. Display device having transparent layer partially covered with sealant and method for fabricating same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1167464A3 (en) * 2000-06-23 2003-04-09 Sonoco Development, Inc. Antistatic membrane lidding for a container
US7343832B2 (en) 2003-02-14 2008-03-18 Luk Lamellen Und Kupplungsbau Beteiligungs Kg Torsional vibration damper
CN100571872C (en) * 2004-04-07 2009-12-23 安捷伦科技有限公司 Capping with recloseable aperture
US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture
US8247057B2 (en) * 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
US9453146B2 (en) 2011-10-14 2016-09-27 Denka Company Limited Cover tape
JP2014060245A (en) * 2012-09-18 2014-04-03 Mitsubishi Electric Corp Semiconductor device
CN108000953A (en) * 2017-12-15 2018-05-08 常熟市长江胶带有限公司 A kind of antistatic anticorrosion adhesive tape of high-tenacity

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944979A (en) * 1989-10-19 1990-07-31 At&T Bell Laboratories Tape conveyers for components
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8520180B2 (en) 2009-02-19 2013-08-27 E Ink Holdings Inc. Display device having transparent layer partially covered with sealant and method for fabricating same
TWI457875B (en) * 2009-02-19 2014-10-21 Prime View Int Co Ltd Display device and method for fabricating the same

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JPH11165364A (en) 1999-06-22
GB0004056D0 (en) 2000-04-12
GB2346128A (en) 2000-08-02
DE19810550A1 (en) 1999-03-18
TW422784B (en) 2001-02-21
FR2768411B1 (en) 2000-01-28
JP3249942B2 (en) 2002-01-28
SG79225A1 (en) 2001-03-20
FR2768411A1 (en) 1999-03-19
GB9803510D0 (en) 1998-04-15
GB2334502A (en) 1999-08-25
GB2334502B (en) 2000-06-28
GB2346128B (en) 2001-01-24

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