TW546272B - Process for obtaining bulk mono-crystalline aluminum nitride - Google Patents

Process for obtaining bulk mono-crystalline aluminum nitride Download PDF

Info

Publication number
TW546272B
TW546272B TW091112458A TW91112458A TW546272B TW 546272 B TW546272 B TW 546272B TW 091112458 A TW091112458 A TW 091112458A TW 91112458 A TW91112458 A TW 91112458A TW 546272 B TW546272 B TW 546272B
Authority
TW
Taiwan
Prior art keywords
crystallization
supercritical
scope
aluminum nitride
temperature
Prior art date
Application number
TW091112458A
Other languages
English (en)
Inventor
Robert Dwilinski
Roman Doradzinski
Jerzy Garczynski
Leszek Piotr Sierzputowski
Yasuo Kanbara
Original Assignee
Nichia Corp
Ammono Sp Zoo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PL347918A external-priority patent/PL207400B1/pl
Priority claimed from PL35037501A external-priority patent/PL350375A1/xx
Application filed by Nichia Corp, Ammono Sp Zoo filed Critical Nichia Corp
Application granted granted Critical
Publication of TW546272B publication Critical patent/TW546272B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B21/00Unidirectional solidification of eutectic materials
    • C30B21/02Unidirectional solidification of eutectic materials by normal casting or gradient freezing
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B7/00Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B7/00Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
    • C30B7/10Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0281Coatings made of semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/102Apparatus for forming a platelet shape or a small diameter, elongate, generally cylindrical shape [e.g., whisker, fiber, needle, filament]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Luminescent Compositions (AREA)

Description

546272 A7 B7
五、發明説明(i 超臨界溶液在晶種上 以及氮化鋁塊狀單結 氨之技術,可以成長 發明之技術領域 本發明係有關由 塊狀單結晶之方法 其藉由利用超臨界 晶者。 先前技術 結晶來成長氮化鋁 晶之製造設備,尤 氮化鋁之塊狀單結 應用氮化物之電子光學機器,雖然一般是在與堆積之氣 化物層不同之藍寶石基板上或是碳化矽之基板上來造^ (不定向附晶生長法),但在異質基板上之定向成長,品質 上自然而然地受到限制。 在此期望不僅提供GaN也期望提供AiN之塊狀單結晶的 製造方法。做為製造GaN塊狀單結晶的方法有下面幾個建 議,利用氣相鹵素定向附晶生長法(HVPE) [,,〇pticai patterning of GaN films" Μ. K. Kelly, 〇. Ambacher, Appl. Phys. Lett. 69 (12) (1996) and "Fabrication of thin-film InGaN light-emitting diode membranes’丨 W. S. Wrong, T· Sands,Appl. Phys. Lett. 75 (10) (1999)]、用高壓氮氣之 HNP法[’’Prospects for high-pressure crystal growth of III-V nitrides*丨 S,Poro'vski et al·,Inst. Phys· Conf. Series,137, 3 69 ( 199 8)],為了降低成長步驟中之溫度與壓力,利用超 臨界氨之氨基法["Ammono method of BN,AIN,and GaN synthesis and crystal growth'丨 R. Dwilinski et al·,Proc. EGW-3, Warsaw, June 22-24, 1998, MRS Internet Journal of Nitride Semiconductor Research]及[’’Crystal Growth of _____-4- 本紙張尺度適用中國國家標準(CNS) A4規格(21〇x 297公釐) 546272 A7 B7 五、發明説明(2 ) gallium nitride in supercritical ammonian J. W. Kolis et al·, J. Cryst. Growth 222, 43 1-434 (2001)] 〇 然而,關於AIN塊狀單結晶,D· PETERS雖提議利用超臨 界氨自紹金屬形成氮化鋁結晶之方法(J〇urnal 〇f Crystal
Growth 104 (1990) 41 1-418),但只不過得到包裝用之微小 結晶,在此,近年,在定向附晶生長之用途中,Y、shi等 成功達成在SiC基板上通過A1N緩衝層,以昇華法成長Ain 單結晶之方法(MI J-NSR Vol. 6, Art· 5)。然而,因氣相成 長法畢竟是非平衡化學,要提高結晶之品質自然而然受到 限制。另外,使用半導體之光學元件的壽命特性,主要是 與含轉位密度之活性層結晶性有關,應用A1N基板之雷射 一極官的情形,GaN層之轉位密度以降低到1〇6/(:1112以下為 佳’但應用以往之方法就非常困難達到此目的。 發明所欲解決之課題 在此,本發明之第丨個目的是提供,在晶種上可以形成氮 化鋁塊狀單結晶的方法及裝置。 又,本發明之第2個目的是,成長品質上可以應用之做為 光學元件基板的氮化鋁物塊狀結晶。 此目的之特徵是藉由,在存有含鹼金屬離子之超臨界溶 — 劑的高壓鍋中溶解供料,作成超臨界溶液後,在比溶解溫 ”· 度更高溫度或比溶解壓力更低之壓力下,來自溶液中之氮 一 化鋁在晶種面上結晶,成長氮化鋁塊狀單結晶之方法,來 達成。 為了達成上述目的之本發明第丨構成,係有關在付與氨基 ^紙張尺度適财A4規格(2iqχ 297t) 546272 A7
五 、發明説明( 4 數之超臨界溶液,至少一 配置在南壓鍋内晶種領域中,上昇 声:…度或下降到所定之壓力下,超臨界溶液之、容解 ===領域中’調節到不產生自發結度: 鋼内所配置之晶種面上選擇性的成長氮化 第2構成中’在高壓鋼内同時形成所謂的溶解領域與結晶 /域之2個領域情形,是以針對晶種超臨界溶液藉由調敫 溶解溫度與結晶化溫度來控 日°正 領Μ夕、、w疮π — + ^ J、見不馮且,因此,結晶化 m皿度故疋在400〜 600t之溫度 壓鍋内溶解溫度與結晶化、.θ $夕、0 ¥ 勿4制在同 佔Β仅杜士 日日化/皿度之溫度差以在丨50t以下,較 在峨以下較容易控制。又,針對晶種超臨界溶 a 6和调整是在高壓鍋内設置1個或多數個可以巴八 ΐ低溫溶解領域與高溫結晶化領域”,也^藉由= 洛解領域與結晶化領域之對 9 。 厂堅鋼中形成有特定溫度差之所=2°再者’在特定高 2個領域之情形,針對晶種超:::解領域與心 心m人 裡欠L界各液之過飽和調整,也可 以利用含鋁供料,其是由做為 的謂結晶所投與而成。 &心日種總面積之總面積 同時,在上述第1構成中,μ、+、认入 述鹼金屬離子為投與鹼金屬 或不含齒素物質之鹼化劑形狀, 抖狀做為鹼金屬離子者,是選 自二;:、K+所組成族群中之1種或2種者。又,在超 ”;劑:所溶解之含有紹之供料,雖是以氮化紹為宜, 但也可以使用在超臨界溶液中 ㈣胃。 <tT-谷解生成紹化合物之銘 546272
時,因是平衡反應之故,所 此情形,是使用氮化鋁單結 成長,也可以使用優良品質 又’本舍明方法是依靠在氨基驗性(annTL〇n〇basic)反應者 ’含链之供料是以HVPE法所形成之氮化鋁,或是以化學反 應所形成之Α1Ν ’例如,即使本來在含有氯素之氨基鹼性 超臨界反應,也沒有阻害之問題存在。 利用上述第2構成之情形,做為供料在相對於超臨界氨溶 劑之平衡反應中,雖是使用溶解之氮化鋁或其前驅體,但 針對超臨界氨溶劑也可以使用不可逆反應之,與鋁金屬組 合,在對結晶化之平衡反應無害下,也可以避開過大量之 溶解。 使用上述做為供料之氮化|呂 以可以谷易控制結晶化反應。 晶做為晶種,為了進行選擇性 之晶種。 本發明是提供,同時進行上述第i溶解步驟與第2結晶化 步驟,且在高壓鍋内進行做為第3構成之分離方法。即,提 供其特徵為,得到氮化鋁塊狀單結晶之方法,在高壓鋼中 形成含有鹼金屬離子之超臨界氨溶劑,該超臨界氨溶劑中 溶解含有鋁之供料,對超臨界溶劑在比含有鋁供料溶^時 更π溫及/或更低壓之條件下,氮化鋁自上述溶 溶液中,在晶種面上結晶之方法。 知界 在第3構成中,在含有鋁供料溶解步驟之外,也可以具 在比超臨界溶液更高溫及/或更低壓中之移動步驟。又, 高壓鍋中同時形成有溫度差之至少2個領域,是藉由在低 溶解領域中配置含鋁供料,在高溫結晶化領域^配置晶
裝 訂
546272 A7
來進行。溶解領域I处B ,.^ , /、,、、〇日日化7員域之溫度差,必須設定確保 在起&(¾界溶液内,介風处认、、, 予此輸迗之範圍内,超臨界溶液内之 化學輸送主要是*机、ώ十^ 、 3由對机來進行,通常,溶解領域與結晶 化?頁域之溫度差是名:彳〇 疋在C以上,較佳是在5〜150°c,更好是 在10 0 °C以下。 在本I月中’氮化紹因應用途之需求,可以含有給予體 、、接受體或磁氣處理劑,超臨界溶劑是定義如了,含有氨 或其何生物、做為鹼化劑之鹼金屬離子、至少含有鈉或鉀 之離子另外,含有紹之供料者主要是由氣化銘或其前驅 體所構成,前驅體是選自含有鋁之疊氮基、亞胺基、胺基 亞胺基胺基、氫化物等。 一在本I明中,晶種也可以為氮化鋁,但也可以為不含氧 氣之秸子疋數接近六方晶或是兩面體構造。例如,可以使 用:1C 2 GaN等之單結晶,晶種之表面欠缺密度是使用在 10 /cm以下者為宜,做為其它之晶種者,因可以使用異質 基板’例如’在導電性基板上結晶AiN者,所以使用用途 廣。做為此之候補者,因應用途需求a 〇軸之格子定數為2.8 3.6之L自立方結晶系之铜、鶴,六方最密充填結晶 糸之α — Hf、α 一 Zr ,正方晶系金剛石,Wc構造結晶系 WC、W2C ’ ZnO構造結晶系 a -Sic、TaN、NbN、A1N,六 方晶(P6/mmm)系 AgB2、AuB2、HfB2,六方晶(P63/mmc)系 γ — MoC、ε — MbN等。體心立方結晶系之鉬、鎢是以使 用自[1,1,1 ]方向切出之晶種為宜。 在本發明中,氮化鋁之結晶是可以在100〜8〇〇。〇之範圍 ____ -9- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公爱) 546272 A7
進行,但較佳也可以在400〜6〇〇。〇之溫度進行,又,氮化 鋁之結晶化是可以在100〜1〇〇〇〇 bar進行,但較佳是在1〇⑽ 〜5 500 bar,最好是以在1 500〜3〇〇〇 bar之壓力進行較佳。 超臨界溶劑内鹼金屬離子之濃度,是調整確保可以供料 及氮化鋁的特定溶解度,針對超臨界溶液内之其它成=, 驗金屬離子之莫爾比控制在丨:2〇〇〜n 2,較佳者為1 ·· i 〇〇 〜1 · 5,更好為在1 ·· 2〇〜1 ·· 8之範圍以内者為宜。 同時’本發明是有關在含有付與氨基鹼性1種或多數鹼化 劑之超臨界氨溶劑中產生化學輸送,可得氮化鋁單結晶成 長,氨基鹼性結晶生成技術,為了認可原本的高技術,在 本發明中,所使用之以下用詞,是可以用以下之本案說明 書來定義其意思。 μ 氮化鋁,並不限上述氨基鹼性結晶成長技術,可以含有 雜質者。 氮化紹之塊狀單結晶,是指藉由M〇CVd或是HVPE等之 定向附晶(epi)成長方法,可以形成如led或LD般光及電子 令件的氮化鋁單結晶基板。在藍寶石基板上成長之情形是 必須有緩衝層,但使用A1N基板時,無緩衝層也可以成長 良質之氣相成長膜。在本發明方法所得之a1n基板的半值 寬是在2分鐘(120 arcsec)以下,較佳是在!分以下。在藍寶 石基板上成長之A1N因半值莧為4分鐘之故,所以品質之提 向極為優異。 又,A1N基板到200 nm為止不會光吸收,因GaN基板是在 短波長區之365 nm吸收,所以A1N基板做為(JV—LED之基
546272 A7 ------ B7 五、發明説明(8) " " " 板可望提问光輸出,又,因a in基板是放熱性,所以可適 於做電力零件基板。再者,使用A1N基板的話,可能成長 问此日日之AlGaN ’若有雷射元件的話,縱方向之關閉變得 很好。 氮化紹之可驅物質,是指用來代替氮化鋁之供料物,至 少要有結’要的話含有鹼金屬、XIII族元素、含氮氣及/或 疋氫氣或其混合物,金屬鋁、其合金或金屬間化合物、其 氫化物、胺基類、亞胺基類、胺基一亞胺基類、疊氮類等 ,以下定義是所謂的在超臨界氨溶劑中形成可溶解之鋁化 合物。 含链之供料,是指所謂之氮化鋁或其前驅物質。 超e品界氨溶劑者是認為,至少含有氨之超臨界氨溶劑, 疋含有為了溶解氮化鋁之丨種或多數之鹼金屬離子。 鹼化劑者,是所謂的在超臨界氨溶劑中,供給為了溶解 氮化鋁之1種或多數之鹼金屬離子者,在說明書中有具體例 示。 含鋁之供料的溶解,是指上述供料在超臨界溶劑之相對 溶解性鋁化合物,例如稱取得可逆性或非可逆性鋁錯體化 合物形態之過程。鋁錯體化合物者,是與N ^^ 生物顧2',般之配位,以紹為配位中心所== 了 化合物。 a肢 超臨界氨溶液,是指溶解上述超臨界氨溶劑與含有鋁供 料,產生溶解性鋁化合物之意。依吾等之經驗,可以預測 在充分高溫高壓下存在著固體氮化鋁與超臨界溶液間之平 -11 -
546272 A7
546272 A7
在比溶解領域更高溫度來達成較佳。 曰晶種在本案說明書中雖有例示,但也提供進行氮化_ 日日化之領域,因其支配結晶之生長〇拼 、、、口 結晶相同,能選擇品質良好者。 Μ與所成長之 自發之結日日日(Spontaneous erystallizatiGn)者,是指 和㈣氣溶液形成氣化紹的核及成長,纟高壓銷: -邊都會產生,這是不被期望之步驟,包含在晶種表面之 ,同方向性之成長(disoriented gr㈣帅若其它纟數_ 話,隨溫度之上昇,溶解界限及自發結晶界限是 般,有減少之傾向。 所不 的成長、結 成長中不可 對晶種之選擇性結晶,是指所謂之非自發性 晶是在晶種上進行之步驟,為達成塊狀單結晶 欠缺之步驟,為本案發明方法之一。 /高壓鍋,是不管形態、為了進行氨鹼性結晶成長之閉鎖 系反應室。又,在本發明中使用之氮化鋁顆粒為成形粉末 狀者,稱為燒成物,為極高密度者,例如可以取得99.8% 者0 同時’本案發明實施例中之高壓鍋内的溫度分布,因是 在沒有超臨界氨存在下,測定空高壓鍋者,並非實際之超 臨界溫度。又,壓力是直接測定的,是由最初導入之氨量 、南壓鋼之溫度及容積等來計算決定者。 上述方法於實施時,以使用如下之裝置為佳,即,本發 明是提供其特徵為備有產生超臨界溶劑之高壓鍋1之設備 、在上述高壓鍋中設置有對流控制管理裝置2、投入備有加
546272 A7 B7
五、發明説明(11 熱裝置5或冷卻震置6之爐體4中,之氮化紹塊狀單結晶的生 產設備。
裝 上述爐體4,是具有相當於高壓鍋丨之結晶化領域14、備 有加熱裝置5之高溫領域,及相當於高壓鍋丨之溶解領域u ,備有加熱裝置5或冷卻裝置6之低溫領域,或是,上述爐 體4 ,是相當於高壓鍋丨之結晶化領域14、備有加熱裝置$ 或冷卻裝置6之高溫領域及相當於高壓鍋丨之溶解領域u , 備有加熱裝S 5或冷卻裝置6之溫領域。冑流控制管理裝 置2,是區分成結晶化領域14與溶解領域丨3,在中心或周圍 由一張或多張之有孔洞橫型閥12所構成。在高壓鍋丨内,是 將供料16配置在溶解領域13中,晶種Π配置在結晶化領域 14中’ 與14領域間之超臨界溶液的對流是依控制管” 置2來設定所構成,其特徵為溶解領域13是位在橫型閥J 之上方,結晶化領域1 4是位在橫型閥1 2之下方。 圖式說明(元件符號說明) 圖1表示實施例”中’ p=常數中,因時間之變化,高尿 鍋内之溫度變化圖。 &
圖2表不貫施例2)中,j:丁 一受奴A J 在1 一 $數中,因時間之變化,高 壓鍋内之壓力變化圖。 圖3表示實施例3)中,固定容量中,因時間之變 取 鍋内之溫度變化圖。 圖4表示實施例4)中,因時間之變化,高墨鍋内之 化圖。 又 圖5表示實施例5)中,因時間之變化’高壓鍋内之溫度變 -14 - 546272 A7
線 546272 A7
裝 η
546272 五 Λ發明説明( 14 裝 度之減少係數(負的溫度係數)。利用此關係,在溶解度高 乂條件下,進行氮化鋁之溶解,在溶解度低之條件下,進 行結晶,可以成長氮化紹之塊狀單結晶。此負溫度係數, 是指在產生溫度差之情形,氮化紹之化學輸送為自低溫容 2領域邁向高溫之結晶化領域。其次,藉由適當變化加熱 寺條件來進行,藉由造成氮化紹之過飽和溶液,在晶種面 上成長結晶。本發明之方法是,在晶種面上可以成長氮化 鋁之塊狀單結晶,在由氮化紹或碳化砂等結晶所成之晶種 上,可得到塊狀單結晶層是得到氮化紹的化學理論成長。 士述之單結晶’因是在含有驗金屬離子之超臨界溶液:成 因此所得之單結晶也含有01 ppm以上之驗金屬。又, 為了防止設備腐钱需保持超臨界溶液之驗性,期望 中不要投入函素物質。再者’氮化紹之塊狀單結晶中; 以接受處理濃度10】7〜102丨/cm3之給 m 丁 (Sl、0等)、接受體 (Mg、Zri寺)、磁性物質(Mn、Cr等),葬士 /上 ㈣卜 稽由接受處理可以改 •交氮化鋁之光學、電性、磁性特性。在 ^ ^ 共匕之物理特性中 ’成長之氮化銘塊狀單結晶表面之欠缺宓 ^ e . 5 , 人尺在度是在l〇6/cm2以 下,較佳疋在10 /cm-以下,更佳是在1〇4 ,mi以下。又,斜 (0002)面之X線半值寬是在6〇〇 arc Λ下’較佳是在300 arcsec以下,更佳是在60 arcsec以下成具 ^ .„ a θ ^ _ /戍長。最佳之塊狀Α1Ν 早結晶疋,可以在欠缺密度為l〇4/cm2 , 卜’對表面(0002) 之X線測定半值寬為60 arcsec以下成長。 貫施例 使用導入有2台掛鋼,容積為10.9 - <向壓加壓鍋[Η· -17 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐) 546272
Jacobs, D. Schmidt, Current Topics in Material Science, v〇l.8,ed. E. Kaldis (north—Holland, Amsterdam,19810, 381設計)。可以使用之供料為以HvpE法生成之氮化鋁薄板 ,氮化鋁粉體燒結品(德山蘇打製)。做為晶種者是可以使 用以HVPE法所得之AIN、GaN、及SiC。 做為超臨界狀態之氨溶液之形成及結晶方法,以下面之 例子來表示。同時,除了 T丨,丁2〜丁5可以設定在4〇〇〜6〇〇 °c之範圍。 ① 在高壓鍋中投入〇·72克純度為4N之金屬鉀。再投入4.81 克氨後,緊閉高壓鍋,藉由下面之溫度控制(圖2)形成超臨 界氨溶液,即加熱到丁2,高壓鍋内之壓力為2 kbar。數曰後 ’溫度加熱到丁4 ’壓力保持在2 kbar之狀態,再放置數曰, 使結晶(圖1)。 ② 在高壓鍋中投入0.82克純度為4N之金屬鉀。再投入5.43 克氣後’緊閉向壓銷。將高壓鋼投入爐中,加熱到5 〇 〇 , 高壓鍋内之壓力為3.5 kbar,形成超臨界氨溶液,數日後, 壓力降到2 kbar·,溫度保持在500°C之狀態,再放置數曰, 使結晶(圖2)。 ③ 在高壓鍋中投入0.6克純度為4N之金屬鉀,再投入4克 氨後,緊閉高壓鍋。將高壓鍋投入爐後,加熱到Τι,形成 超臨界氨溶液,2天後,溫度加到500°C,加壓到2 kbar,此 狀態再放置4天使結晶(圖3)。 ④ 在容積35.6 cm3之高壓加壓鍋1(圖6)中,以HVPE法所 得之A1N同量分開配置在溶領域1 3與結晶化領域1 4中,其 -18-
本纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 546272 A7 ___B7 五、發明説明(16 ) 次投入2 · 4克純度為4 N之金屬卸,其次投入1 5 · 9克之氨水 (5N),緊閉高壓鍋1,投入爐體4内,加熱到T3,高壓鍋内 之壓力約為2 kbar,1天後,結晶化領域丨4之溫度增加到丁4 ,將溶解領域1 3之溫度降到T 2,在此狀態之高壓鍋1再放置 6天(圖4)。 ⑤ 在容積36 cm3之高壓加壓鍋1(圖6)之溶解領域13中,配 置以HVPE法所得之A1N所做成之供料,投入〇·47克純度為 4Ν之金屬鉀,在結晶化領域14中同樣配置以HVPE法所得之 Α1Ν晶種,其次投入16.5克之氨水(5Ν),緊閉高壓鍋1。將 高壓鍋1投入爐體4中,加熱到Τ4,高壓鍋内之壓力為3 kbar ,:I天後,溶解領域13之溫度降到T3,將結晶化領域14之溫 度增加到A,此狀態之高壓鍋再放置8天(圖5)。 ⑥ 在容積3 5.6 cm*5之高壓加壓鋼1之溶解領域1 3中,配置 以HVPE法所得之A1N板所成之供料,在結晶化領域14中配 置以HVPE法所得之GaN晶種,再投入〇·4 1克純度為3N之金 屬鉀,其次投入14.4克之氨水(5Ν),緊閉高壓鍋1。將高壓 锅1技入爐體4中,結晶化領域之溫度加熱到,溶解領域 之溫度加熱到Ts,所得壓力為2.6 kbar,將此狀態之高壓鍋 放置8天(圖7)。 有關本發明之方法,是利用在超臨界溶劑内生產含氮化 紹之塊狀單結晶設備來進行,此設備之主要部分是由生成 超臨界溶劑之高壓鍋丨,與高壓鍋丨中可以在超臨界溶液内 控制化學輸送的控制裝置2所組成,將上述之高壓鋼1投入 備有加熱措施5或冷卻措施6之爐(2台)體4的室内3中,為了 _— _19_ 本紙張尺度通用中國國家標準(CNS) A4規格(21GX 297公爱) ' - 546272
對爐體4保有一定之位置,以帶子之固定裝置7來固定。爐 體4設置在爐床8中,在爐體4與爐床8之周圍以圍繞鋼帶9 來固定,爐床8與爐體4在回轉台1〇上設置,藉由特定之角 度栓住固定裝置1 1加以固定,可以控制高壓鍋丨内之對流種 類與對流速度。將投入爐體4之高壓鍋丨内超臨界溶液之對 流’區分成結晶化領域丨4與溶解領域丨3,在中心或周圍設 定一個或數個有孔洞之橫型閥12所組成的對流控制裝置2 。將高壓鍋1内之兩領域溫度,藉由設置在爐體4上之控制 扃置1 5,ό又疋在1〇〇〜8〇〇。〇之範圍内,相當爐體4低溫領域 的高壓銷1内之溶解領域13,是位於橫型閥12之上方,在此 領域1 3内配置供料丨6。相當爐體4高溫領域的高壓鍋内之結 晶化領域14是,位於橫型閥12之下方,在此領域14中雖配 置有晶種1 7 ’但將此配置之位置設定在對流之上流與下流 為交差場所之下方。 發明之效果
如此所得之含氮化鋁塊狀單結晶,因結晶性良好,可以 應用在如利用氮化物半導體之雷射二極體等光學元件基板 上。例如形成做為 A1N基板/under dope AlGaN/Si—AlGaN/ under dope AlGaN/Mg — GaN之定向附晶成長構造,自AIN 基板側邊取得光的話,AlGaN之A1混晶若高的話,短波長 之光感度提高,不僅在360 nm程度之短波長,若是 Al0.5Ga〇.5N的話,到28〇 ηιτ^ι度都有光感度。此基板因是 Α1Ν之故’有可能高混晶在GaN基板則是困難值。 _ -20- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)

Claims (1)

  1. 本口 624 5 A BCD 申請專利範圍 1· 一種氮化鋁塊狀單結晶之製造方法,其係在高壓鍋中形 成含有驗金屬離子之超臨界氨溶劑、在該超臨界氨溶劑 中溶解έ鋁ί、料、以比超臨界溶劑溶解含紹供料時更高 溫及/或更低壓條件下,自溶解上述供料之超臨界溶液在 晶種面上結晶氮化鋁出來。 2. 如申請專利範圍第丨項之製造方法,其具備與上述供料 溶解步驟分開且在更高溫及/或更低壓移動超臨界溶液 之步驟。 3. 如申請專利範圍第}項之製造方法,其中在高壓鋼中同 時形成至少有2個有溫度差之領域,在低溫之溶解領域 中配置含紹供料’並在高溫之結晶化領域中配置晶種。 4. 如申請專利範圍第3項之製造方法,其中溶解領域與結 晶化領域之溫度差’是設定在能確保於超臨界溶液内之 化學輸送之範圍内。 其中超臨界溶液内 其中溶解領域與結 5·如申凊專利範圍第4項之製造方法 之化學輸送主要是藉由對流來進行 6.如申請專利範圍第4項之製造方法 晶化領域之溫度差在11以上。 其中氮化鋁是可以 7·如申請專利範圍第1項之製造方法 έ有給予體、接受體或磁性之處理劑 8. 如申請專利範圍第1項之製造方法,其中超臨界溶劑是 含有氨或其衍生物者。 9. 如申請專利範圍第i項之製造方法,其中超臨界溶劑至 少含有鈉或_之離子。 -21 - 本紙張尺度適财X 297公釐)
    546272 申請專利範圍 •如申凊專利範圍第1項之势生 . e ^ ^ 乐貝之衣坆方法,其中含鋁供料主要 疋由氮化鋁或是其前驅體所構成。 11·如申請專利範圍第10項製 人 ^戶、心衣k方法,其中前驅體是選自 :有鋁之疊氮物、亞胺基、醯胺基亞胺基、醯胺 物0 12·:πί利範圍第1項之製造方法,其中晶種至少含有 s鋁或其它之111族元素的氮化物結晶層。 如申請專利範圍第1 萝 # Λ 吊貝之衣4方法,其中在含晶種之氮 、,呂之結晶層中之表面欠缺密度為106/em2以下。 14·如申請專利範圍第1項之掣 图珩1貝之衣k方法,其中氮化鋁之結晶 匕是在400〜6〇〇。〇之溫度進行。 15.如:請專利範圍第!項之製造方法,其中氮化鋁之結晶 匕疋在1000〜55〇〇 bar,較佳在15〇〇〜3〇⑽bar之壓力下 進行。 A如申請專利範圍第1項之製造方法,其中超臨界溶劑内 之驗金屬離子濃度是調整到可以確保供料與氮化紹之 特定溶解度。 /合液内之其它成分的鹼金屬離子莫爾比,控制在1 : 200 1 · 2,較佳在丨·· 100〜丨·· 5,更佳在1 ·· 2〇〜 々々 m Α · Ο 乾圍以内。 18·:種氮化鋁塊狀單結晶之生產設備,其備有生成超臨界 溶劑之高壓銷i、纟上述高壓㉟中設置有^空制對流之裝 置 彳又入備有加熱裝置5或冷卻裝置6之爐體4中。 22- 本紙張尺度適财_家解(CNS) M規格τ^Χ297公董)
    546272 A8 B8 C8 - ----—- D8 六、申請專利範圍 19·如申請專利範圍第18項之生產設備,其中爐體*含有高 /凰領域其具備適合高壓鍋1之結晶化領域14之加熱裝置 5 ’以及低溫領域其具備適合高壓鍋1之溶解領域13之加 熱裝置5或冷卻裝置6。 2〇·如申請專利範圍第18項之生產設備,其中爐體4含有高 溫領域其具備適合高壓鍋1之結晶化領域14之加熱裝置 5或冷卻裝置6,以及低溫領域其具備適合高壓鍋丨之溶 解領域1 3之加熱裝置5或冷卻裝置6。 21.如申請專利範圍第丨8項之生產設備,其中對流控制裝置 2 ’是區分成結晶化領域14與溶解領域13,在中心或周 圍由1張或多張有孔洞之橫型閥丨2所構成。 2· 士申明專利範圍苐1 8項之生產設備,其中高壓鋼1内, 在供料16溶解領域13中,將晶種17配置在結晶化領域14 上,藉由控制裝置2設定13與14領域間之超臨界溶液的 對流。 · 23. 如申明專利範圍弟2 1項之生產設備,其中溶解領域1 3是 位於;^型闊1 2之上方’結晶化領域1 4是位於橫型閥1 2之 下方。 24. 種以造氦^化铭塊狀單結晶之方法,其係在高壓鋼内含 有溶解銘供料於含有氨與鹼金屬離子之超臨界溶劑中 、供給氮化鋁之溶解度有負溫度係數的超臨界溶液,上 述超臨界溶液利用氱化鋁之溶解度負溫度係數,只有在 高壓鍋内所配置之晶種面上,選擇性成長氮化鋁結晶。 25·種製造氮化铭塊狀單結晶之方法,其係在高壓鋼内溶 -23- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 546272 六、申請專利範圍 解鋁供料於含有氨與鹼金屬離子之超臨界溶劑中、供給 鼠化鋁之溶解度有正壓力係數的超臨界溶液,上述超臨 界溶液利用氮化鋁之溶解度正壓力係數,只有在高壓= 内所配置之晶種面上,選擇性成長氮化鋁結晶。 26·如:請專利範圍第24或25項之方法,其中上述鹼金屬離 子是以鹼金屬或不含鹵素物質之鹼化劑形態來投盥。 27·二申請專利範圍第26項之方法,其中鹼金屬離子為含有 選自Li+、Na+、K+中1種或2種以上者。 28. 如申請專利範圍第24或25項之方法,其中超臨界溶劑所 溶解之含鋁供料是由在氮化鋁或在超臨界溶液中生成 可溶解之鋁化合物之鋁前驅體所組成。 29. 如申請專利範圍第24或25項之方法,其中含铭供料為以 HVPE所形成之氮化链或是以其它化學反應所形成之氮 化鋁且含有對氨基鹼性超臨界反應無害之元素。 3〇·如申請專利範圍第24或25項之方法,^中超臨界氨溶液 之形成,為含鋁供料在超臨界氨溶劑之平衡反應中所溶 解的氮化鋁,與在超臨界氨溶劑為不可逆反應之鋁金屬 所組成。 31.如申請專利範圍第24或25項之方法,其中上述供料為氮 化鋁燒結體。 32·如申請專利範圍第24或25項之方法,其中上述晶種是氮 化鋁單結晶。 33.種氮化|g塊狀單結晶之結晶方法,其係溶解在含有氨 與鹼金屬離子之超臨界溶劑中、將氮化鋁之溶解度有負 -24- 本紙張尺度適财_家料(CNS) A4規格?210X297公釐) 546272 申清專利祀園 溫度係數之超臨尺、、六 置之領域中 '合液,至少放在高壓鍋内之晶種所配 綠上昇到所定溫度〇降到所定壓力,將超 =生=解度調至對晶種為過飽和領域,調節到不 曰曰=發性結晶之濃度下後,只在高㈣内所配置之 :,上’選擇性成長氮化紹結晶。 .二範圍第33項之結晶方法,其編鋼内同時 7、域與結晶化領域等2個領域’針對晶種之超 π:::和控—度與結晶化溫 35·1°Π:Ι?圍第34項之結晶方法,其中結晶化領域之 /皿度故疋為400〜60(rc。 36·:;Γ=範圍第34項之結晶方法,其中在高壓銷内同 /成冷解領域與結晶化領域等2個領域, 度差是在Hot以下,較佳是保持在·c以下Μ之恤 37· ^申請專利範圍第34項之結晶方法,其中針對晶種 甌界溶液過飽和調整’是設計有1個或多數個用來區分 成低溫溶解領域與高溫結晶化領域之閥,以刀 域與結晶化領域之對流量。 …貝 38.如申請專利範圍第34項之結晶方法,其中在高壓鋼中形 成有特定溫度差之溶解領域與結晶化領域2個領域,在 對日日種之超8品界溶液過飽和調整是,利用投與有提古曰 種總面積之總面積氮化鋁結晶之含鋁供料來進行。 -25-
TW091112458A 2001-06-06 2002-06-06 Process for obtaining bulk mono-crystalline aluminum nitride TW546272B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PL347918A PL207400B1 (pl) 2001-06-06 2001-06-06 Sposób i urządzenie do otrzymywania objętościowego monokryształu azotku zawierającego gal
PL35037501A PL350375A1 (en) 2001-10-26 2001-10-26 Epitaxial layer substrate

Publications (1)

Publication Number Publication Date
TW546272B true TW546272B (en) 2003-08-11

Family

ID=26653399

Family Applications (4)

Application Number Title Priority Date Filing Date
TW091110622A TWI277666B (en) 2001-06-06 2002-05-17 Process and apparatus for obtaining bulk mono-crystalline gallium-containing nitride
TW091112459A TW588016B (en) 2001-06-06 2002-06-06 Process for obtaining bulk mono-crystalline gallium nitride
TW091112458A TW546272B (en) 2001-06-06 2002-06-06 Process for obtaining bulk mono-crystalline aluminum nitride
TW091112457A TW569471B (en) 2001-06-06 2002-06-06 Process for forming bulk mono-crystalline gallium-containing nitride on heterogeneous substrate

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW091110622A TWI277666B (en) 2001-06-06 2002-05-17 Process and apparatus for obtaining bulk mono-crystalline gallium-containing nitride
TW091112459A TW588016B (en) 2001-06-06 2002-06-06 Process for obtaining bulk mono-crystalline gallium nitride

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW091112457A TW569471B (en) 2001-06-06 2002-06-06 Process for forming bulk mono-crystalline gallium-containing nitride on heterogeneous substrate

Country Status (16)

Country Link
US (5) US7160388B2 (zh)
EP (2) EP1432853B1 (zh)
JP (6) JP4116535B2 (zh)
KR (2) KR100850293B1 (zh)
CN (2) CN100453710C (zh)
AU (1) AU2002328130B2 (zh)
CA (1) CA2449714C (zh)
CZ (1) CZ306997B6 (zh)
HU (1) HUP0401866A3 (zh)
IL (2) IL159165A0 (zh)
MY (1) MY141883A (zh)
NO (1) NO20035437D0 (zh)
PL (1) PL219109B1 (zh)
RU (1) RU2296189C2 (zh)
TW (4) TWI277666B (zh)
WO (2) WO2002101120A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402217B (zh) * 2005-07-08 2013-07-21 Univ California 使用高壓釜於超臨界氨中成長第三族氮化物晶體之方法

Families Citing this family (178)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
PL207400B1 (pl) 2001-06-06 2010-12-31 Ammono Społka Z Ograniczoną Odpowiedzialnością Sposób i urządzenie do otrzymywania objętościowego monokryształu azotku zawierającego gal
JP4116535B2 (ja) * 2001-06-06 2008-07-09 アンモノ・スプウカ・ジ・オグラニチョノン・オドポヴィエドニアウノシツィオン ガリウム含有窒化物の単結晶の製造法及び装置
US7132730B2 (en) 2001-10-26 2006-11-07 Ammono Sp. Z.O.O. Bulk nitride mono-crystal including substrate for epitaxy
KR100679387B1 (ko) * 2001-10-26 2007-02-05 암모노 에스피. 제트오. 오. 질화물 반도체 레이저 소자 및 이의 제조방법
US7063741B2 (en) * 2002-03-27 2006-06-20 General Electric Company High pressure high temperature growth of crystalline group III metal nitrides
US8809867B2 (en) 2002-04-15 2014-08-19 The Regents Of The University Of California Dislocation reduction in non-polar III-nitride thin films
WO2003089695A1 (en) * 2002-04-15 2003-10-30 The Regents Of The University Of California Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
US20030209191A1 (en) * 2002-05-13 2003-11-13 Purdy Andrew P. Ammonothermal process for bulk synthesis and growth of cubic GaN
US20060138431A1 (en) 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
AU2002354467A1 (en) * 2002-05-17 2003-12-02 Ammono Sp.Zo.O. Light emitting element structure having nitride bulk single crystal layer
EP1514958B1 (en) * 2002-05-17 2014-05-14 Ammono S.A. Apparatus for obtaining a bulk single crystal using supercritical ammonia
US7364619B2 (en) 2002-06-26 2008-04-29 Ammono. Sp. Zo.O. Process for obtaining of bulk monocrystalline gallium-containing nitride
US7119217B2 (en) * 2002-09-23 2006-10-10 Genta Incorporated Tri(alkylcarboxylato)gallium (III) products and pharmaceutical compositions containing them
US7314517B2 (en) 2002-12-11 2008-01-01 Ammono Sp. Z.O.O. Process for obtaining bulk mono-crystalline gallium-containing nitride
TWI334890B (en) * 2002-12-11 2010-12-21 Ammono Sp Zoo Process for obtaining bulk mono-crystalline gallium-containing nitride, eliminating impurities from the obtained crystal and manufacturing substrates made of bulk mono-crystalline gallium-containing nitride
EP1581675B1 (en) * 2002-12-11 2009-10-14 AMMONO Sp. z o.o. A template type substrate and a method of preparing the same
US8089097B2 (en) * 2002-12-27 2012-01-03 Momentive Performance Materials Inc. Homoepitaxial gallium-nitride-based electronic devices and method for producing same
US9279193B2 (en) * 2002-12-27 2016-03-08 Momentive Performance Materials Inc. Method of making a gallium nitride crystalline composition having a low dislocation density
KR101284932B1 (ko) 2002-12-27 2013-07-10 제너럴 일렉트릭 캄파니 갈륨 나이트라이드 결정, 호모에피택셜 갈륨 나이트라이드계 디바이스 및 이들의 제조 방법
US7261775B2 (en) * 2003-01-29 2007-08-28 Ricoh Company, Ltd. Methods of growing a group III nitride crystal
JP2004335559A (ja) * 2003-04-30 2004-11-25 Nichia Chem Ind Ltd Iii族窒化物基板を用いる半導体素子
US7170095B2 (en) * 2003-07-11 2007-01-30 Cree Inc. Semi-insulating GaN and method of making the same
US7009215B2 (en) * 2003-10-24 2006-03-07 General Electric Company Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates
JP4534631B2 (ja) * 2003-10-31 2010-09-01 住友電気工業株式会社 Iii族窒化物結晶の製造方法
JP2005183947A (ja) * 2003-11-26 2005-07-07 Ricoh Co Ltd Iii族窒化物の結晶成長方法およびiii族窒化物結晶およびiii族窒化物半導体デバイスおよび発光デバイス
JP4622447B2 (ja) * 2004-01-23 2011-02-02 住友電気工業株式会社 Iii族窒化物結晶基板の製造方法
JP5356933B2 (ja) * 2004-03-10 2013-12-04 三菱化学株式会社 窒化物結晶の製造装置
JP4819677B2 (ja) * 2004-03-31 2011-11-24 パナソニック株式会社 Iii族元素窒化物結晶の製造方法、それに用いる製造装置、およびそれらにより得られた半導体素子
EP1740674A4 (en) * 2004-04-27 2009-09-09 Univ Arizona State METHOD FOR PRODUCING HIGH LUMINESCENT DOPED METAL NITRIDE POWDERS
WO2005121415A1 (en) 2004-06-11 2005-12-22 Ammono Sp. Z O.O. Bulk mono-crystalline gallium-containing nitride and its application
WO2005122232A1 (en) * 2004-06-11 2005-12-22 Ammono Sp. Z O.O. High electron mobility transistor (hemt) made of layers of group xiii element nitrides and manufacturing method thereof.
US7339205B2 (en) * 2004-06-28 2008-03-04 Nitronex Corporation Gallium nitride materials and methods associated with the same
US7687827B2 (en) * 2004-07-07 2010-03-30 Nitronex Corporation III-nitride materials including low dislocation densities and methods associated with the same
PL211286B1 (pl) * 2004-08-15 2012-04-30 Inst Wysokich Ciśnień Polskiej Akademii Nauk Azotkowa dioda laserowa i sposób wytwarzania azotkowej diody laserowej
PL371405A1 (pl) * 2004-11-26 2006-05-29 Ammono Sp.Z O.O. Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku
US7558631B2 (en) * 2004-12-21 2009-07-07 Ebr Systems, Inc. Leadless tissue stimulation systems and methods
JP4603498B2 (ja) 2005-03-14 2010-12-22 株式会社リコー Iii族窒化物結晶の製造方法及び製造装置
DE102005020741A1 (de) * 2005-05-02 2006-03-30 Basf Ag Verwendung von flüssigen Farbmittelzubereitungen zur Einfärbung von Cellulose/Polymer-Verbundwerkstoffen
JP4277826B2 (ja) * 2005-06-23 2009-06-10 住友電気工業株式会社 窒化物結晶、窒化物結晶基板、エピ層付窒化物結晶基板、ならびに半導体デバイスおよびその製造方法
US9708735B2 (en) 2005-06-23 2017-07-18 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
US8771552B2 (en) 2005-06-23 2014-07-08 Sumitomo Electric Industries, Ltd. Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
KR100623271B1 (ko) * 2005-06-24 2006-09-12 한국과학기술연구원 갈륨망간나이트라이드 단결정 나노선의 제조방법
JP5023312B2 (ja) * 2005-07-01 2012-09-12 三菱化学株式会社 超臨界溶媒を用いた結晶製造方法、結晶成長装置、結晶およびデバイス
WO2007004495A1 (ja) * 2005-07-01 2007-01-11 Mitsubishi Chemical Corporation 超臨界溶媒を用いた結晶製造方法、結晶成長装置、結晶およびデバイス
JP5454829B2 (ja) * 2006-03-06 2014-03-26 三菱化学株式会社 超臨界溶媒を用いた結晶製造方法および結晶製造装置
JP5454830B2 (ja) * 2006-03-06 2014-03-26 三菱化学株式会社 超臨界溶媒を用いた結晶製造方法および結晶製造装置
US8728234B2 (en) * 2008-06-04 2014-05-20 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
US9670594B2 (en) 2006-04-07 2017-06-06 Sixpoint Materials, Inc. Group III nitride crystals, their fabrication method, and method of fabricating bulk group III nitride crystals in supercritical ammonia
US20100095882A1 (en) * 2008-10-16 2010-04-22 Tadao Hashimoto Reactor design for growing group iii nitride crystals and method of growing group iii nitride crystals
US9885121B2 (en) 2006-04-07 2018-02-06 Sixpoint Materials, Inc. High pressure reactor and method of growing group III nitride crystals in supercritical ammonia
US9909230B2 (en) 2006-04-07 2018-03-06 Sixpoint Materials, Inc. Seed selection and growth methods for reduced-crack group III nitride bulk crystals
US9803293B2 (en) 2008-02-25 2017-10-31 Sixpoint Materials, Inc. Method for producing group III-nitride wafers and group III-nitride wafers
US10161059B2 (en) 2006-04-07 2018-12-25 Sixpoint Materials, Inc. Group III nitride bulk crystals and their fabrication method
US7803344B2 (en) * 2006-10-25 2010-09-28 The Regents Of The University Of California Method for growing group III-nitride crystals in a mixture of supercritical ammonia and nitrogen, and group III-nitride crystals grown thereby
US9466481B2 (en) 2006-04-07 2016-10-11 Sixpoint Materials, Inc. Electronic device and epitaxial multilayer wafer of group III nitride semiconductor having specified dislocation density, oxygen/electron concentration, and active layer thickness
US9518340B2 (en) 2006-04-07 2016-12-13 Sixpoint Materials, Inc. Method of growing group III nitride crystals
US9834863B2 (en) 2006-04-07 2017-12-05 Sixpoint Materials, Inc. Group III nitride bulk crystals and fabrication method
EP2004882A2 (en) * 2006-04-07 2008-12-24 The Regents of the University of California Growing large surface area gallium nitride crystals
JP2007290921A (ja) * 2006-04-26 2007-11-08 Mitsubishi Chemicals Corp 窒化物単結晶の製造方法、窒化物単結晶、およびデバイス
KR100839757B1 (ko) * 2006-05-03 2008-06-19 주식회사 엘지화학 배가스 제거 시스템을 이용한 질화갈륨 결정체 분말의 제조방법 및 그 제조 장치
US7488384B2 (en) * 2006-05-03 2009-02-10 Ohio University Direct pyrolysis route to GaN quantum dots
US7534714B2 (en) * 2006-05-05 2009-05-19 Applied Materials, Inc. Radial temperature control for lattice-mismatched epitaxy
JP4832221B2 (ja) * 2006-09-01 2011-12-07 パナソニック株式会社 半導体レーザ装置の製造方法
EP2100990A1 (en) * 2006-10-16 2009-09-16 Mitsubishi Chemical Corporation Process for producing nitride semiconductor, crystal growth rate enhancement agent, nitride single crystal, wafer and device
US8458262B2 (en) * 2006-12-22 2013-06-04 At&T Mobility Ii Llc Filtering spam messages across a communication network
KR20090107073A (ko) * 2007-01-30 2009-10-12 램 리써치 코포레이션 초임계 용매를 사용하여 반도체 기판 상에 금속막을 형성하는 조성물 및 방법
JP2008285383A (ja) * 2007-05-21 2008-11-27 Lucelabo:Kk Iii族窒化物の製造方法及び遷移金属窒化物の製造方法
KR101428481B1 (ko) * 2007-08-17 2014-08-11 삼성전자 주식회사 인쇄매체이송장치 및 이를 구비하는 화상형성장치
FR2921200B1 (fr) * 2007-09-18 2009-12-18 Centre Nat Rech Scient Heterostructures semi-conductrices monolithiques epitaxiees et leur procede de fabrication
WO2009039398A1 (en) 2007-09-19 2009-03-26 The Regents Of The University Of California Gallium nitride bulk crystals and their growth method
US20090223440A1 (en) * 2008-03-04 2009-09-10 Boris Feigelson Method of growing GaN crystals from solution
EP3330413B1 (en) 2008-06-04 2020-09-09 SixPoint Materials, Inc. Method of growing group iii nitride crystals using high-pressure vessel
US8871024B2 (en) 2008-06-05 2014-10-28 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US20090301388A1 (en) * 2008-06-05 2009-12-10 Soraa Inc. Capsule for high pressure processing and method of use for supercritical fluids
US9157167B1 (en) 2008-06-05 2015-10-13 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8097081B2 (en) * 2008-06-05 2012-01-17 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
WO2009151642A1 (en) * 2008-06-12 2009-12-17 Sixpoint Materials, Inc. Method for testing group-iii nitride wafers and group iii-nitride wafers with test data
US8303710B2 (en) 2008-06-18 2012-11-06 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US20100006873A1 (en) * 2008-06-25 2010-01-14 Soraa, Inc. HIGHLY POLARIZED WHITE LIGHT SOURCE BY COMBINING BLUE LED ON SEMIPOLAR OR NONPOLAR GaN WITH YELLOW LED ON SEMIPOLAR OR NONPOLAR GaN
US20090320745A1 (en) * 2008-06-25 2009-12-31 Soraa, Inc. Heater device and method for high pressure processing of crystalline materials
US9404197B2 (en) 2008-07-07 2016-08-02 Soraa, Inc. Large area, low-defect gallium-containing nitride crystals, method of making, and method of use
WO2010005914A1 (en) * 2008-07-07 2010-01-14 Soraa, Inc. High quality large area bulk non-polar or semipolar gallium based substrates and methods
US8284810B1 (en) 2008-08-04 2012-10-09 Soraa, Inc. Solid state laser device using a selected crystal orientation in non-polar or semi-polar GaN containing materials and methods
JP2011530194A (ja) 2008-08-04 2011-12-15 ソラア インコーポレーテッド 物質および蛍光体を含んだ非分極性あるいは半極性のガリウムを用いた白色灯デバイス
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US8979999B2 (en) 2008-08-07 2015-03-17 Soraa, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US8323405B2 (en) * 2008-08-07 2012-12-04 Soraa, Inc. Process and apparatus for growing a crystalline gallium-containing nitride using an azide mineralizer
US20100031873A1 (en) * 2008-08-07 2010-02-11 Soraa, Inc. Basket process and apparatus for crystalline gallium-containing nitride
US8021481B2 (en) * 2008-08-07 2011-09-20 Soraa, Inc. Process and apparatus for large-scale manufacturing of bulk monocrystalline gallium-containing nitride
US8430958B2 (en) 2008-08-07 2013-04-30 Soraa, Inc. Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride
US8148801B2 (en) 2008-08-25 2012-04-03 Soraa, Inc. Nitride crystal with removable surface layer and methods of manufacture
US7976630B2 (en) 2008-09-11 2011-07-12 Soraa, Inc. Large-area seed for ammonothermal growth of bulk gallium nitride and method of manufacture
JP5093033B2 (ja) * 2008-09-30 2012-12-05 ソニー株式会社 半導体レーザの製造方法、半導体レーザ、光ピックアップおよび光ディスク装置
US20100295088A1 (en) * 2008-10-02 2010-11-25 Soraa, Inc. Textured-surface light emitting diode and method of manufacture
US8354679B1 (en) 2008-10-02 2013-01-15 Soraa, Inc. Microcavity light emitting diode method of manufacture
US8455894B1 (en) 2008-10-17 2013-06-04 Soraa, Inc. Photonic-crystal light emitting diode and method of manufacture
KR20110097813A (ko) * 2008-11-07 2011-08-31 더 리전츠 오브 더 유니버시티 오브 캘리포니아 Ⅲ족 질화물 결정들의 암모노열 성장을 위한 신규한 용기 설계 및 소스 물질과 씨드 결정들의 상기 용기에 대한 상대적인 배치
WO2010060034A1 (en) * 2008-11-24 2010-05-27 Sixpoint Materials, Inc. METHODS FOR PRODUCING GaN NUTRIENT FOR AMMONOTHERMAL GROWTH
USRE47114E1 (en) 2008-12-12 2018-11-06 Slt Technologies, Inc. Polycrystalline group III metal nitride with getter and method of making
US9589792B2 (en) 2012-11-26 2017-03-07 Soraa, Inc. High quality group-III metal nitride crystals, methods of making, and methods of use
US8461071B2 (en) * 2008-12-12 2013-06-11 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US8878230B2 (en) 2010-03-11 2014-11-04 Soraa, Inc. Semi-insulating group III metal nitride and method of manufacture
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
US8987156B2 (en) 2008-12-12 2015-03-24 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US20110100291A1 (en) * 2009-01-29 2011-05-05 Soraa, Inc. Plant and method for large-scale ammonothermal manufacturing of gallium nitride boules
KR100999695B1 (ko) * 2009-02-16 2010-12-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
US8299473B1 (en) 2009-04-07 2012-10-30 Soraa, Inc. Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors
WO2010129718A2 (en) 2009-05-05 2010-11-11 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
US8306081B1 (en) 2009-05-27 2012-11-06 Soraa, Inc. High indium containing InGaN substrates for long wavelength optical devices
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
US8509275B1 (en) 2009-05-29 2013-08-13 Soraa, Inc. Gallium nitride based laser dazzling device and method
US9800017B1 (en) 2009-05-29 2017-10-24 Soraa Laser Diode, Inc. Laser device and method for a vehicle
EP2267197A1 (en) 2009-06-25 2010-12-29 AMMONO Sp.z o.o. Method of obtaining bulk mono-crystalline gallium-containing nitride, bulk mono-crystalline gallium-containing nitride, substrates manufactured thereof and devices manufactured on such substrates
US8435347B2 (en) 2009-09-29 2013-05-07 Soraa, Inc. High pressure apparatus with stackable rings
US9175418B2 (en) 2009-10-09 2015-11-03 Soraa, Inc. Method for synthesis of high quality large area bulk gallium based crystals
KR101746562B1 (ko) * 2009-11-12 2017-06-13 다이헤이요 세멘토 가부시키가이샤 알칼리금속 질화물 또는 알칼리토금속 질화물의 제조방법
JP2011124253A (ja) * 2009-12-08 2011-06-23 Sony Corp 半導体レーザの製造方法、半導体レーザ、光ディスク装置、半導体装置の製造方法および半導体装置
JP2011153055A (ja) * 2010-01-28 2011-08-11 Asahi Kasei Corp 窒化物単結晶の製造方法
JP2011153052A (ja) * 2010-01-28 2011-08-11 Asahi Kasei Corp 窒化物単結晶の製造方法
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
US8729559B2 (en) 2010-10-13 2014-05-20 Soraa, Inc. Method of making bulk InGaN substrates and devices thereon
US9025635B2 (en) 2011-01-24 2015-05-05 Soraa Laser Diode, Inc. Laser package having multiple emitters configured on a support member
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
JP2012158481A (ja) * 2011-01-29 2012-08-23 Soraa Inc アンモノサーマル法によるガリウムナイトライドボウルの大規模製造設備および製造方法
US20140205840A1 (en) 2011-06-23 2014-07-24 Tohoku University Method for producing nitride single crystal and autoclave for use in the method
US8492185B1 (en) 2011-07-14 2013-07-23 Soraa, Inc. Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices
US9694158B2 (en) 2011-10-21 2017-07-04 Ahmad Mohamad Slim Torque for incrementally advancing a catheter during right heart catheterization
JP2013091596A (ja) * 2011-10-24 2013-05-16 Mitsubishi Chemicals Corp 窒化物結晶の製造方法
US10029955B1 (en) 2011-10-24 2018-07-24 Slt Technologies, Inc. Capsule for high pressure, high temperature processing of materials and methods of use
US8482104B2 (en) 2012-01-09 2013-07-09 Soraa, Inc. Method for growth of indium-containing nitride films
CN104271815A (zh) * 2012-04-10 2015-01-07 加利福尼亚大学董事会 用于利用含碳纤维材料生长iii族氮化物晶体的设备和通过其生长的iii族氮化物
JP2012184162A (ja) * 2012-04-27 2012-09-27 Mitsubishi Chemicals Corp 窒化物単結晶の製造方法、窒化物単結晶、およびデバイス
US10145026B2 (en) 2012-06-04 2018-12-04 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules
IN2015DN01983A (zh) 2012-08-23 2015-08-14 Sixpoint Materials Inc
EP2888390A1 (en) 2012-08-24 2015-07-01 Sixpoint Materials Inc. A bismuth-doped semi-insulating group iii nitride wafer and its production method
WO2014035481A1 (en) 2012-08-28 2014-03-06 Sixpoint Materials, Inc. Group iii nitride wafer and its production method
US9275912B1 (en) 2012-08-30 2016-03-01 Soraa, Inc. Method for quantification of extended defects in gallium-containing nitride crystals
KR102096421B1 (ko) 2012-09-25 2020-04-02 식스포인트 머터리얼즈 인코퍼레이티드 Iii 족 질화물 결정의 성장 방법
KR101812736B1 (ko) 2012-09-26 2017-12-27 식스포인트 머터리얼즈 인코퍼레이티드 Iii 족 질화물 웨이퍼 및 제작 방법과 시험 방법
US9299555B1 (en) 2012-09-28 2016-03-29 Soraa, Inc. Ultrapure mineralizers and methods for nitride crystal growth
US9761763B2 (en) 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
WO2014144463A1 (en) * 2013-03-15 2014-09-18 The University Of Houston System Methods and systems for recovering rare earth elements
US9650723B1 (en) 2013-04-11 2017-05-16 Soraa, Inc. Large area seed crystal for ammonothermal crystal growth and method of making
PL229568B1 (pl) 2013-05-30 2018-07-31 Ammono Spolka Akcyjna Sposób wytwarzania monokrystalicznego azotku zawierającego gal i monokrystaliczny azotek zawierający gal, wytworzony tym sposobem
JP6516738B2 (ja) 2013-07-11 2019-05-22 シックスポイント マテリアルズ, インコーポレイテッド Iii族窒化物半導体を用いた電子デバイスおよびその製造方法、および該電子デバイスを製作するためのエピタキシャル多層ウエハ
WO2015109211A1 (en) 2014-01-17 2015-07-23 Sixpoint Materials, Inc. Group iii nitride bulk crystals and fabrication method
RU2568585C2 (ru) * 2014-03-24 2015-11-20 Федеральное государственное бюджетное учреждение "Всероссийский научно-исследовательский институт по проблемам гражданской обороны и чрезвычайных ситуаций МЧС России" (федеральный центр науки и высоких технологий) Индикаторный состав для экспресс-обнаружения окислителей
EP3146093A1 (en) 2014-05-23 2017-03-29 Sixpoint Materials, Inc. Group iii nitride bulk crystals and their fabrication method
PL231548B1 (pl) 2014-09-11 2019-03-29 Ammono Spolka Akcyjna Sposób wytwarzania monokrystalicznego azotku zawierającego gal
WO2016090045A1 (en) 2014-12-02 2016-06-09 Sixpoint Materials, Inc. Group iii nitride crystals, their fabrication method, and method of fabricating bulk group iii nitride crystals in supercritical ammonia
US10094017B2 (en) 2015-01-29 2018-10-09 Slt Technologies, Inc. Method and system for preparing polycrystalline group III metal nitride
JP6474920B2 (ja) 2015-06-25 2019-02-27 シックスポイント マテリアルズ, インコーポレイテッド 高圧反応器および超臨界アンモニア中のiii族窒化物結晶の成長方法
JP6623969B2 (ja) * 2015-08-26 2019-12-25 豊田合成株式会社 Iii族窒化物半導体単結晶の製造方法
US9899564B2 (en) * 2016-03-23 2018-02-20 Panasonic Intellectual Property Management Co., Ltd. Group III nitride semiconductor and method for producing same
US10141435B2 (en) 2016-12-23 2018-11-27 Sixpoint Materials, Inc. Electronic device using group III nitride semiconductor and its fabrication method
US10174438B2 (en) 2017-03-30 2019-01-08 Slt Technologies, Inc. Apparatus for high pressure reaction
JP6931827B2 (ja) 2017-04-07 2021-09-08 日本製鋼所M&E株式会社 結晶製造用圧力容器
MD4552C1 (ro) * 2017-04-20 2018-09-30 Институт Прикладной Физики Академии Наук Молдовы Procedeu de obţinere a monocristalelor de arseniură de niobiu sau tantal
JP2020535092A (ja) 2017-09-26 2020-12-03 シックスポイント マテリアルズ, インコーポレイテッド 超臨界アンモニアの中での窒化ガリウムバルク結晶の成長のための種結晶および製造方法
US10354863B2 (en) 2017-09-26 2019-07-16 Sixpoint Materials, Inc. Seed crystal for growth of gallium nitride bulk crystal in supercritical ammonia and fabrication method
US10242868B1 (en) 2017-09-26 2019-03-26 Sixpoint Materials, Inc. Seed crystal for growth of gallium nitride bulk crystal in supercritical ammonia and fabrication method
US10287709B2 (en) 2017-09-26 2019-05-14 Sixpoint Materials, Inc. Seed crystal for growth of gallium nitride bulk crystal in supercritical ammonia and fabrication method
US11560625B2 (en) 2018-01-19 2023-01-24 Entegris, Inc. Vapor deposition of molybdenum using a bis(alkyl-arene) molybdenum precursor
JP2021512838A (ja) 2018-02-09 2021-05-20 シックスポイント マテリアルズ, インコーポレイテッド 低転位バルクGaN結晶およびこれを製作する方法
US11767609B2 (en) 2018-02-09 2023-09-26 Sixpoint Materials, Inc. Low-dislocation bulk GaN crystal and method of fabricating same
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US11466384B2 (en) 2019-01-08 2022-10-11 Slt Technologies, Inc. Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
US12000552B2 (en) 2019-01-18 2024-06-04 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system for a vehicle
RU2730315C1 (ru) * 2019-08-30 2020-08-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) Способ получения монокристаллов органо-неорганического комплексного галогенида
US11721549B2 (en) 2020-02-11 2023-08-08 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
CN115104174A (zh) 2020-02-11 2022-09-23 Slt科技公司 改进的iii族氮化物衬底、制备方法和使用方法
JP7483669B2 (ja) 2020-11-02 2024-05-15 エスエルティー テクノロジーズ インコーポレイテッド 窒化物結晶成長のための超高純度鉱化剤及び改良された方法
US11638470B2 (en) 2021-01-12 2023-05-02 Arash Kani Gallium nitride gemstones
WO2023064737A1 (en) 2021-10-11 2023-04-20 Slt Technologies, Inc. Improved heater for retrograde solvothermal crystal growth, method of making, and method of use
US20240247406A1 (en) 2023-01-19 2024-07-25 Slt Technologies, Inc. Process for retrograde solvothermal crystal growth and single crystal grown thereby

Family Cites Families (138)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US14631A (en) * 1856-04-08 Improvement in corn-planters
US63258A (en) * 1867-03-26 David king
US78881A (en) * 1868-06-16 libbey
US139912A (en) * 1873-06-17 Improvement in organ-reeds
US47113A (en) * 1865-04-04 Improvement in the manufacture of bolts
US31153A (en) * 1861-01-22 Needle
JPS6065798A (ja) * 1983-09-19 1985-04-15 Toyota Central Res & Dev Lab Inc 窒化ガリウム単結晶の成長方法
JPH0722692B2 (ja) 1988-08-05 1995-03-15 株式会社日本製鋼所 水熱合成用容器
JPH02137287A (ja) 1988-11-17 1990-05-25 Sanyo Electric Co Ltd 半導体レーザ装置
CN1014535B (zh) * 1988-12-30 1991-10-30 中国科学院物理研究所 利用改进的矿化剂生长磷酸钛氧钾单晶的方法
US5096860A (en) * 1990-05-25 1992-03-17 Alcan International Limited Process for producing unagglomerated single crystals of aluminum nitride
KR920004181B1 (ko) 1990-09-13 1992-05-30 한국과학기술연구원 입방정질화붕소의 제조방법
US5190738A (en) 1991-06-17 1993-03-02 Alcan International Limited Process for producing unagglomerated single crystals of aluminum nitride
US5156581A (en) * 1991-06-21 1992-10-20 Chow John W Finger conditioning device
JP2540791B2 (ja) 1991-11-08 1996-10-09 日亜化学工業株式会社 p型窒化ガリウム系化合物半導体の製造方法。
US5306662A (en) 1991-11-08 1994-04-26 Nichia Chemical Industries, Ltd. Method of manufacturing P-type compound semiconductor
CN1065289A (zh) 1992-04-28 1992-10-14 抚顺石油学院 洁厕灵
CN1036414C (zh) 1992-11-03 1997-11-12 程大酉 改进的回热并联复合双流体燃气轮机装置及其操作方法
US5456204A (en) 1993-05-28 1995-10-10 Alfa Quartz, C.A. Filtering flow guide for hydrothermal crystal growth
PL173917B1 (pl) * 1993-08-10 1998-05-29 Ct Badan Wysokocisnieniowych P Sposób wytwarzania krystalicznej struktury wielowarstwowej
JP3184717B2 (ja) 1993-10-08 2001-07-09 三菱電線工業株式会社 GaN単結晶およびその製造方法
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
JPH07249830A (ja) 1994-03-10 1995-09-26 Hitachi Ltd 半導体発光素子の製造方法
WO1995027815A1 (fr) 1994-04-08 1995-10-19 Japan Energy Corporation Procede de tirage d'un cristal semi-conducteur constitue par un compose de nitrure de gallium et dispositif semi-conducteur a composes de nitrure de gallium
US5599520A (en) * 1994-11-03 1997-02-04 Garces; Juan M. Synthesis of crystalline porous solids in ammonia
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
US5681405A (en) 1995-03-09 1997-10-28 Golden Aluminum Company Method for making an improved aluminum alloy sheet product
JPH08250802A (ja) * 1995-03-09 1996-09-27 Fujitsu Ltd 半導体レーザ及びその製造方法
US5670798A (en) * 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
US5679965A (en) * 1995-03-29 1997-10-21 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same
JP3728332B2 (ja) 1995-04-24 2005-12-21 シャープ株式会社 化合物半導体発光素子
WO1997008759A1 (fr) 1995-08-31 1997-03-06 Kabushiki Kaisha Toshiba Dispositif emetteur de lumiere bleue et son procede de fabrication
EP1081818B1 (en) * 1995-09-18 2004-08-18 Hitachi, Ltd. Semiconductor laser devices
WO1997013891A1 (en) 1995-10-13 1997-04-17 Centrum Badan Wysokocisnieniowych METHOD OF MANUFACTURING EPITAXIAL LAYERS OF GaN OR Ga(A1,In)N ON SINGLE CRYSTAL GaN AND MIXED Ga(A1,In)N SUBSTRATES
JPH09134878A (ja) * 1995-11-10 1997-05-20 Matsushita Electron Corp 窒化ガリウム系化合物半導体の製造方法
JP3778609B2 (ja) 1996-04-26 2006-05-24 三洋電機株式会社 半導体素子の製造方法
JPH107496A (ja) 1996-06-25 1998-01-13 Hitachi Cable Ltd 窒化物結晶の製造方法およびその装置
CN1065289C (zh) 1996-07-22 2001-05-02 中国科学院物理研究所 一种制备掺杂钒酸盐单晶的水热生长方法
JP3179346B2 (ja) * 1996-08-27 2001-06-25 松下電子工業株式会社 窒化ガリウム結晶の製造方法
JPH1084161A (ja) * 1996-09-06 1998-03-31 Sumitomo Electric Ind Ltd 半導体レーザ及びその製造方法
US6031858A (en) 1996-09-09 2000-02-29 Kabushiki Kaisha Toshiba Semiconductor laser and method of fabricating same
WO1998019375A1 (fr) 1996-10-30 1998-05-07 Hitachi, Ltd. Machine de traitement optique de l'information et dispositif a semi-conducteur emetteur de lumiere afferent
US6177292B1 (en) 1996-12-05 2001-01-23 Lg Electronics Inc. Method for forming GaN semiconductor single crystal substrate and GaN diode with the substrate
US6677619B1 (en) * 1997-01-09 2004-01-13 Nichia Chemical Industries, Ltd. Nitride semiconductor device
CN100485984C (zh) * 1997-01-09 2009-05-06 日亚化学工业株式会社 氮化物半导体元器件
US5868837A (en) 1997-01-17 1999-02-09 Cornell Research Foundation, Inc. Low temperature method of preparing GaN single crystals
PL184902B1 (pl) * 1997-04-04 2003-01-31 Centrum Badan Wysokocisnieniowych Pan Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N
JP3491492B2 (ja) * 1997-04-09 2004-01-26 松下電器産業株式会社 窒化ガリウム結晶の製造方法
WO1998047170A1 (en) 1997-04-11 1998-10-22 Nichia Chemical Industries, Ltd. Method of growing nitride semiconductors, nitride semiconductor substrate and nitride semiconductor device
US5888389A (en) 1997-04-24 1999-03-30 Hydroprocessing, L.L.C. Apparatus for oxidizing undigested wastewater sludges
PL186905B1 (pl) * 1997-06-05 2004-03-31 Cantrum Badan Wysokocisnieniow Sposób wytwarzania wysokooporowych kryształów objętościowych GaN
PL183687B1 (pl) * 1997-06-06 2002-06-28 Centrum Badan Sposób wytwarzania półprzewodnikowych związków grupy A-B o przewodnictwie elektrycznym typu p i typu n
GB2333521B (en) 1997-06-11 2000-04-26 Hitachi Cable Nitride crystal growth method
US6270569B1 (en) * 1997-06-11 2001-08-07 Hitachi Cable Ltd. Method of fabricating nitride crystal, mixture, liquid phase growth method, nitride crystal, nitride crystal powders, and vapor phase growth method
JP3533938B2 (ja) * 1997-06-11 2004-06-07 日立電線株式会社 窒化物結晶の製造方法、混合物、液相成長方法、窒化物結晶、窒化物結晶粉末、および気相成長方法
TW519551B (en) * 1997-06-11 2003-02-01 Hitachi Cable Methods of fabricating nitride crystals and nitride crystals obtained therefrom
JP3603598B2 (ja) * 1997-08-04 2004-12-22 住友化学株式会社 3−5族化合物半導体の製造方法
JP3234799B2 (ja) 1997-08-07 2001-12-04 シャープ株式会社 半導体レーザ素子の製造方法
JP3239812B2 (ja) 1997-08-07 2001-12-17 日本電気株式会社 InGaN層を含む窒化ガリウム系半導体層の結晶成長方法および窒化ガリウム系発光素子およびその製造方法
US6593589B1 (en) * 1998-01-30 2003-07-15 The University Of New Mexico Semiconductor nitride structures
JPH11307813A (ja) 1998-04-03 1999-11-05 Hewlett Packard Co <Hp> 発光装置、その製造方法およびディスプレイ
US6249534B1 (en) 1998-04-06 2001-06-19 Matsushita Electronics Corporation Nitride semiconductor laser device
JPH11340576A (ja) 1998-05-28 1999-12-10 Sumitomo Electric Ind Ltd 窒化ガリウム系半導体デバイス
TW428331B (en) 1998-05-28 2001-04-01 Sumitomo Electric Industries Gallium nitride single crystal substrate and method of producing the same
JP3727187B2 (ja) 1998-07-03 2005-12-14 日亜化学工業株式会社 窒化物半導体レーザ素子の製造方法
JP2000031533A (ja) 1998-07-14 2000-01-28 Toshiba Corp 半導体発光素子
TW413956B (en) * 1998-07-28 2000-12-01 Sumitomo Electric Industries Fluorescent substrate LED
JP2000082863A (ja) 1998-09-04 2000-03-21 Sony Corp 半導体発光素子の製造方法
JP2000091637A (ja) 1998-09-07 2000-03-31 Rohm Co Ltd 半導体発光素子の製法
US6423984B1 (en) * 1998-09-10 2002-07-23 Toyoda Gosei Co., Ltd. Light-emitting semiconductor device using gallium nitride compound semiconductor
US6252261B1 (en) * 1998-09-30 2001-06-26 Nec Corporation GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor
CN1260409A (zh) 1998-10-23 2000-07-19 黄石市皂素厂 L-半胱氨酸盐酸盐一水物生产工艺
TW498102B (en) 1998-12-28 2002-08-11 Futaba Denshi Kogyo Kk A process for preparing GaN fluorescent substance
US6372041B1 (en) * 1999-01-08 2002-04-16 Gan Semiconductor Inc. Method and apparatus for single crystal gallium nitride (GaN) bulk synthesis
JP2000216494A (ja) 1999-01-20 2000-08-04 Sanyo Electric Co Ltd 半導体発光素子およびその製造方法
EP1024524A2 (en) 1999-01-27 2000-08-02 Matsushita Electric Industrial Co., Ltd. Deposition of dielectric layers using supercritical CO2
US6177057B1 (en) 1999-02-09 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Process for preparing bulk cubic gallium nitride
ATE452445T1 (de) * 1999-03-04 2010-01-15 Nichia Corp Nitridhalbleiterlaserelement
JP3957918B2 (ja) 1999-05-17 2007-08-15 独立行政法人科学技術振興機構 窒化ガリウム単結晶の育成方法
US6592663B1 (en) 1999-06-09 2003-07-15 Ricoh Company Ltd. Production of a GaN bulk crystal substrate and a semiconductor device formed on a GaN bulk crystal substrate
JP4329229B2 (ja) * 1999-06-30 2009-09-09 住友電気工業株式会社 Iii−v族窒化物半導体の成長方法および気相成長装置
EP1065299A3 (en) 1999-06-30 2006-02-15 Sumitomo Electric Industries, Ltd. Group III-V nitride semiconductor growth method and vapor phase growth apparatus
FR2796657B1 (fr) * 1999-07-20 2001-10-26 Thomson Csf Procede de synthese de materiaux massifs monocristallins en nitrures d'elements de la colonne iii du tableau de la classification periodique
JP3968920B2 (ja) 1999-08-10 2007-08-29 双葉電子工業株式会社 蛍光体
JP4646359B2 (ja) 1999-09-09 2011-03-09 シャープ株式会社 窒化物半導体発光素子の製造方法
JP2001085737A (ja) 1999-09-10 2001-03-30 Sharp Corp 窒化物半導体発光素子
US6265322B1 (en) 1999-09-21 2001-07-24 Agere Systems Guardian Corp. Selective growth process for group III-nitride-based semiconductors
EP1142033A1 (en) 1999-09-27 2001-10-10 LumiLeds Lighting U.S., LLC A light emitting diode device that produces white light by performing complete phosphor conversion
JP4145437B2 (ja) 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
CN1113988C (zh) 1999-09-29 2003-07-09 中国科学院物理研究所 一种氮化镓单晶的热液生长方法
US6398867B1 (en) * 1999-10-06 2002-06-04 General Electric Company Crystalline gallium nitride and method for forming crystalline gallium nitride
EP1104031B1 (en) 1999-11-15 2012-04-11 Panasonic Corporation Nitride semiconductor laser diode and method of fabricating the same
US6653663B2 (en) 1999-12-06 2003-11-25 Matsushita Electric Industrial Co., Ltd. Nitride semiconductor device
JP2001168385A (ja) 1999-12-06 2001-06-22 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子及びiii族窒化物系化合物半導体発光素子
US7315599B1 (en) 1999-12-29 2008-01-01 Intel Corporation Skew correction circuit
US6355497B1 (en) 2000-01-18 2002-03-12 Xerox Corporation Removable large area, low defect density films for led and laser diode growth
US20010015437A1 (en) 2000-01-25 2001-08-23 Hirotatsu Ishii GaN field-effect transistor, inverter device, and production processes therefor
JP4429459B2 (ja) * 2000-03-03 2010-03-10 古河電気工業株式会社 高抵抗GaN結晶層の製造方法
US6596079B1 (en) 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
US6447604B1 (en) * 2000-03-13 2002-09-10 Advanced Technology Materials, Inc. Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
JP3946427B2 (ja) 2000-03-29 2007-07-18 株式会社東芝 エピタキシャル成長用基板の製造方法及びこのエピタキシャル成長用基板を用いた半導体装置の製造方法
JP2001339121A (ja) * 2000-05-29 2001-12-07 Sharp Corp 窒化物半導体発光素子とそれを含む光学装置
GB2363518A (en) 2000-06-17 2001-12-19 Sharp Kk A method of growing a nitride layer on a GaN substrate
US6693935B2 (en) 2000-06-20 2004-02-17 Sony Corporation Semiconductor laser
JP2002016285A (ja) 2000-06-27 2002-01-18 National Institute Of Advanced Industrial & Technology 半導体発光素子
US6586762B2 (en) * 2000-07-07 2003-07-01 Nichia Corporation Nitride semiconductor device with improved lifetime and high output power
JP3968968B2 (ja) * 2000-07-10 2007-08-29 住友電気工業株式会社 単結晶GaN基板の製造方法
US6749819B2 (en) 2000-07-28 2004-06-15 Japan Pionics Co., Ltd. Process for purifying ammonia
JP4154558B2 (ja) 2000-09-01 2008-09-24 日本電気株式会社 半導体装置
US6858882B2 (en) * 2000-09-08 2005-02-22 Sharp Kabushiki Kaisha Nitride semiconductor light-emitting device and optical device including the same
JP4416297B2 (ja) * 2000-09-08 2010-02-17 シャープ株式会社 窒化物半導体発光素子、ならびにそれを使用した発光装置および光ピックアップ装置
JP2002094189A (ja) * 2000-09-14 2002-03-29 Sharp Corp 窒化物半導体レーザ素子およびそれを用いた光学装置
US6936488B2 (en) 2000-10-23 2005-08-30 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
US7053413B2 (en) 2000-10-23 2006-05-30 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
JP4063520B2 (ja) 2000-11-30 2008-03-19 日本碍子株式会社 半導体発光素子
AU2002219966A1 (en) 2000-11-30 2002-06-11 North Carolina State University Methods and apparatus for producing m'n based materials
JP4003413B2 (ja) 2000-12-11 2007-11-07 日亜化学工業株式会社 13族窒化物結晶の製造方法
JP3785566B2 (ja) 2001-03-19 2006-06-14 株式会社日鉱マテリアルズ GaN系化合物半導体結晶の製造方法
US6806508B2 (en) 2001-04-20 2004-10-19 General Electic Company Homoepitaxial gallium nitride based photodetector and method of producing
PL350375A1 (en) 2001-10-26 2003-05-05 Ammono Sp Z Oo Epitaxial layer substrate
US6734530B2 (en) 2001-06-06 2004-05-11 Matsushita Electric Industries Co., Ltd. GaN-based compound semiconductor EPI-wafer and semiconductor element using the same
JP4116535B2 (ja) * 2001-06-06 2008-07-09 アンモノ・スプウカ・ジ・オグラニチョノン・オドポヴィエドニアウノシツィオン ガリウム含有窒化物の単結晶の製造法及び装置
PL207400B1 (pl) 2001-06-06 2010-12-31 Ammono Społka Z Ograniczoną Odpowiedzialnością Sposób i urządzenie do otrzymywania objętościowego monokryształu azotku zawierającego gal
US6488767B1 (en) * 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
KR100679387B1 (ko) 2001-10-26 2007-02-05 암모노 에스피. 제트오. 오. 질화물 반도체 레이저 소자 및 이의 제조방법
US7132730B2 (en) 2001-10-26 2006-11-07 Ammono Sp. Z.O.O. Bulk nitride mono-crystal including substrate for epitaxy
US7097707B2 (en) 2001-12-31 2006-08-29 Cree, Inc. GaN boule grown from liquid melt using GaN seed wafers
US20030209191A1 (en) 2002-05-13 2003-11-13 Purdy Andrew P. Ammonothermal process for bulk synthesis and growth of cubic GaN
EP1514958B1 (en) 2002-05-17 2014-05-14 Ammono S.A. Apparatus for obtaining a bulk single crystal using supercritical ammonia
AU2002354467A1 (en) 2002-05-17 2003-12-02 Ammono Sp.Zo.O. Light emitting element structure having nitride bulk single crystal layer
US20060138431A1 (en) 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
US7364619B2 (en) * 2002-06-26 2008-04-29 Ammono. Sp. Zo.O. Process for obtaining of bulk monocrystalline gallium-containing nitride
KR20050054482A (ko) 2002-06-26 2005-06-10 암모노 에스피. 제트오. 오. 질화물 반도체 레이저 디바이스 및 그의 성능을향상시키기 위한 방법
TWI334890B (en) * 2002-12-11 2010-12-21 Ammono Sp Zoo Process for obtaining bulk mono-crystalline gallium-containing nitride, eliminating impurities from the obtained crystal and manufacturing substrates made of bulk mono-crystalline gallium-containing nitride
EP1581675B1 (en) 2002-12-11 2009-10-14 AMMONO Sp. z o.o. A template type substrate and a method of preparing the same
US7314517B2 (en) 2002-12-11 2008-01-01 Ammono Sp. Z.O.O. Process for obtaining bulk mono-crystalline gallium-containing nitride
TW200502445A (en) 2003-04-03 2005-01-16 Mitsubishi Chem Corp The single crystal of zing oxide
PL371405A1 (pl) 2004-11-26 2006-05-29 Ammono Sp.Z O.O. Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402217B (zh) * 2005-07-08 2013-07-21 Univ California 使用高壓釜於超臨界氨中成長第三族氮化物晶體之方法
US8709371B2 (en) 2005-07-08 2014-04-29 The Regents Of The University Of California Method for growing group III-nitride crystals in supercritical ammonia using an autoclave
US9551088B2 (en) 2005-07-08 2017-01-24 The Regents Of The University Of California Method for growing group III-nitride crystals in supercritical ammonia using an autoclave

Also Published As

Publication number Publication date
JP4116535B2 (ja) 2008-07-09
JP2004168656A (ja) 2004-06-17
IL159165A (en) 2009-07-20
JP4358646B2 (ja) 2009-11-04
PL219109B1 (pl) 2015-03-31
US20040139912A1 (en) 2004-07-22
CN1526037A (zh) 2004-09-01
US7744697B2 (en) 2010-06-29
CA2449714A1 (en) 2002-12-19
JPWO2003098708A1 (ja) 2005-09-22
HUP0401866A3 (en) 2005-12-28
CN1300388C (zh) 2007-02-14
CN100453710C (zh) 2009-01-21
TW588016B (en) 2004-05-21
US7422633B2 (en) 2008-09-09
RU2296189C2 (ru) 2007-03-27
IL159165A0 (en) 2004-06-01
RU2004100115A (ru) 2005-04-10
NO20035437D0 (no) 2003-12-05
MY141883A (en) 2010-07-16
JP2008208024A (ja) 2008-09-11
KR20030036675A (ko) 2003-05-09
US20020189531A1 (en) 2002-12-19
TWI277666B (en) 2007-04-01
EP1770189B1 (en) 2013-07-10
HUP0401866A1 (hu) 2004-12-28
EP1432853A2 (en) 2004-06-30
EP1770189A3 (en) 2010-05-05
PL370418A1 (en) 2005-05-30
JP4726923B2 (ja) 2011-07-20
US20040255840A1 (en) 2004-12-23
EP1432853B1 (en) 2013-04-24
CZ20033564A3 (cs) 2004-06-16
CA2449714C (en) 2011-08-16
JP2003040699A (ja) 2003-02-13
US7252712B2 (en) 2007-08-07
KR20030095388A (ko) 2003-12-18
WO2002101120A3 (en) 2004-04-29
US6656615B2 (en) 2003-12-02
JP4113837B2 (ja) 2008-07-09
US20040089221A1 (en) 2004-05-13
WO2002101120A2 (en) 2002-12-19
EP1770189A2 (en) 2007-04-04
KR100850293B1 (ko) 2008-08-04
JPWO2002101126A1 (ja) 2004-09-24
AU2002328130B2 (en) 2008-05-29
AU2002328130A2 (en) 2002-12-23
US20020192507A1 (en) 2002-12-19
CZ306997B6 (cs) 2017-11-08
TW569471B (en) 2004-01-01
KR100865348B1 (ko) 2008-10-27
CN1463309A (zh) 2003-12-24
WO2002101126A1 (en) 2002-12-19
US7160388B2 (en) 2007-01-09
JP2004533391A (ja) 2004-11-04

Similar Documents

Publication Publication Date Title
TW546272B (en) Process for obtaining bulk mono-crystalline aluminum nitride
JP4113835B2 (ja) 窒化アルミニウムバルク単結晶の製造法
AU2002347692B2 (en) Bulk monocrystalline gallium nitride
TW200306945A (en) Bulk single crystal production facility employing supercritical ammonia

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent