五、發明説明（1 ) 本發明係有關-種電子構件的冷卻裝置，尤其係供冷 卻微處理器者，其具有至少_被動導熱冷卻元件。 有許多不同該種型式的電子構件冷卻裝置乃被泛知於 習知技術中。其特別係含有被動式導熱冷卻元件，尤其是 由铭製成者，乃被固設在該電子構件上，而有效地與之觸 接。該等冷卻幻㈣利用黏劑或特定支撐物來貼附。通常， 亦會有-附加的主動式冷卻元件乃以風扇的形式，被固設 在該等被動式冷卻元件上，或與其一體整合。 該等習知的冷卻系統皆依據以蒸發、冷凝、對流、消 散來熱傳導的原理，或以不同的材料組合及不同的導熱能 力及/或熱阻抗之表面結構來進行熱傳導。 但是，習知冷卻裝置之一缺點係，由於更強功能的電 子構件，尤其是被一再提高的微處理器時間速度，使得熱 量的產生亦急遽地增加。但因該等電子構件僅能在一定的 溫度範圍内妥當地運作，太高的溫度會令他們故障失效， 或喪失可觀的功能，故對其冷卻裝置的要求亦逐漸增加。 而前述習知技術中的冷卻器已不能夠達到理想及所須的冷 卻程度。 因此，本發明之目的乃在提供一種電子構件的冷卻裝 置，尤其可供冷卻微處理器者，其具有至少一被動式導熱 元件，該裝置即使在有大量的熱產生時，亦可確保該等電 子構件獲得足夠的冷卻。 該目的係可由具有申請專利範圍第丨項之特徵的概括 性冷卻裝置來達成。 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐） 4 499749 A7 _______ Β7_ 五、發明説明（2 ) 較佳的實施例則被陳述於申請專利範圍的附屬項中。 本發明之電子構件的冷卻裝置，乃包含至少一被動導 熱冷卻元件，而至少有部份該被動冷卻元件會接觸至少一 呈集聚固體形悲的導熱媒體。該導熱媒體在本例中係為一 種相變材料（PCM)而具有例如比水更高甚多的吸熱能力。 並且，该導熱媒體係被設計作為一潛在的蓄熱器，而可儲 存該電子構件之負載所產生，而不能再被該被動冷卻元件 吸收並散發掉的熱量，同時保持其集聚的固態，並在該電 子構件的負載降低時，再釋出該等熱量。此將可在即使若 有高負載產生對應的高熱量時，亦能確保該電子構件，尤 其是微處理器，可被充分地冷卻。同時，該導熱媒體能夠 吸收暫時產生的額外熱量，並能夠在該負載回復正常時， 亦即該電子構件再度產生正常的熱量時，再將所蓄存的熱 量釋出。故可避免熱負載的尖峰，其通常會明顯地降低該 電子構件的功能，尤其是一使用傳統冷卻裝置的微處理器 者。因此，本發明之冷卻裝置亦可容許該被冷卻之構件在 功能上的提升。利用本發明的冷卻裝置來避免有害的尖峰 熱負載，將可更提高該電子構件的工作壽命以及操作性 育b。由於被作為導熱媒體之相變材料在吸熱時亦會保持集 聚的固體狀態，故其能較有利地免除任何因該相度材料之 膨脹所產生的問題，此係在習知的材料中所常見者。 在本發明的冷卻裝置之一較佳實施例中，該導熱媒體 由鹽類或富含有機物質的鹽混合物，以及呈金屬粉末的物 貝所構成以改善導熱能力。通常，導熱媒體的有機成分為 ---—-：--——__ 本紙張尺度_巾關家鮮(^7^(2觀97公釐厂----— (請先閲讀背面之注意事項再填寫本頁) 、可| 五、發明説明（3 ) 石蠟。此種導熱媒體在熱吸收期間亦保持其集聚的固體形 態，且可以塊狀及/或顆粒狀形態之固體設置於該冷卻元 件中以及/或其上。一方面這將使該冷卻構件能節約地製 造，及另一方面保證其冷卻構件在尺寸方面能保持微小。 此外，可依據本發明能獨立地調整該導熱媒體以適應用於 冷卻該電子構件之所需的操作溫度。此調整乃藉由變化該 導熱媒體之組份的種類以及含量來完成。特別地，亦可調 整由該導熱媒體所緩衝的熱含量。此外，該導熱媒體的其 他優點為不但無毒的且可再回收。 在本發明的冷卻裝置之一較佳實施例中，該被動式冷 卻元件乃包含至少一主動式冷卻元件，特別是風扇。此將 可更加確保增進該冷卻裝置的冷卻能力。 在本發明之冷卻裝置的另一較佳實施例中，該導熱媒 體係被谷裝於一導熱材料製成的容器内，而該容器會接觸 該被動冷卻元件。將該導熱媒體裝在一容器内，將可使被 固設於該被動冷卻元件中，或於其上的個別導熱元件易於 更換。 在本發明的冷卻裝置之又另一較佳實施例中，有一導 熱泊片乃被設在該被動冷卻元件之接觸面與電子構件的對 應接觸面之間。此等措施將可確保達到整個冷卻功能，因 忒冷部裝置可藉著增強由該電子構件對被動冷卻元件的熱 傳導’而更提升冷卻功能。 本發明亦有關於一種具有處理器插座，並至少有一冷 卻裝置固設其上的處理器，該冷卻裝置含有至少一被動式 499749 A7 B7 五、發明説明（4 :…--…ΙΦ:… (請先閲讀背面之注意事項再填寫本頁) 導熱冷卻兀件，而至少有部份該被動冷卻元件會接觸至少 -呈集聚固體形態的導熱媒體。在此例中，該導熱媒體係 為一種相變材料(PCM)，而具有例如比水更高甚多的吸熱 忐力。又，該導熱媒體係被設計作為一潛在的蓄熱器，其 可儲存該處理器之負載所產生，而不能再被該被動冷卻元 件吸收並散發掉的熱量，同時保持其集聚的固態，並在該 處理器的負載變小時，再釋出該等熱量。 訂丨 本發明亦有關於一種導熱媒體的用途，其係呈集聚的 固體形態，而可供冷卻微處理器，該導熱媒體為一種相變 材料（PCM) ’具有比水更两甚多的吸熱能力，而被設計作 為一潛在的蓄熱器。該導熱媒體會儲存由該微處理器的負 載所產生的熱篁，同時保持其集聚固態，並在該微處理器 的負載變小時，再釋出該等熱量。 圖示之簡單說明 本發明之其它細節、特徵及優點等，將可由所附圖式 中示出之一實施例得知；其中： 第1圖係本發明之冷卻裝置的截面示意圖； 第2圖係第1圖之冷卻裝置的頂視示意圖；及 第3圖係第1圖之冷卻裝置的側視示意圖。 器 冷 第1圖係為一供冷卻電子構件，特別是可冷卻微處理 之冷卻裝置1〇的剖視圖。該冷卻裝置1〇包含一被動導熱^ 卻元件12，該冷卻元件12含有許多的冷卻突片或葉片“該 等冷卻葉片14係被設在該冷卻元件12的底部元件“上。在 相反於該等冷卻葉片14的一側，該底部元件16乃形成一接V. Description of the invention (1) The present invention relates to a cooling device for an electronic component, especially a cooling microprocessor, which has at least a passive heat conduction cooling element. There are many different types of electronic component cooling devices that are widely known in the art. It especially contains passive heat-conducting cooling elements, especially those made by inscriptions, which are fixed on the electronic component and effectively contact it. These cooling maggots are attached using an adhesive or a specific support. Usually, there are also additional active cooling elements in the form of fans, which are either fixed on the passive cooling elements or integrated with them. These conventional cooling systems are based on the principle of heat transfer based on evaporation, condensation, convection, and dissipation, or heat transfer based on different material combinations and surface structures with different thermal conductivity and / or thermal resistance. However, one of the disadvantages of the conventional cooling device is that the heat generation has also increased sharply due to the more powerful electronic components, especially the microprocessor time speed that has been repeatedly increased. However, because these electronic components can only operate properly within a certain temperature range, too high temperatures will cause them to fail or lose considerable functions, so the requirements for their cooling devices have gradually increased. However, the cooler in the aforementioned conventional technology is no longer capable of achieving the desired and required degree of cooling. Therefore, the object of the present invention is to provide a cooling device for electronic components, especially those capable of cooling microprocessors, which have at least one passive heat conducting element. The device can ensure the electronics even when a large amount of heat is generated. The components are adequately cooled. This object can be achieved by a generalized cooling device having the features of the scope of the patent application. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 4 499749 A7 _______ B7_ V. Description of the invention (2) The preferred embodiment is stated in the appendix of the scope of patent application. The cooling device of the electronic component of the present invention includes at least one passive heat-conducting cooling element, and at least part of the passive cooling element will contact at least one heat-conducting medium in the form of an aggregate solid. The thermally conductive medium is a phase change material (PCM) in this example and has, for example, a much higher heat absorption capacity than water. In addition, the thermally conductive medium is designed as a potential heat accumulator, which can store the heat generated by the load of the electronic component, and can no longer be absorbed and dissipated by the passive cooling element, while maintaining its accumulated solid state, and When the load of the electronic component is reduced, the heat is released again. This will ensure that the electronic components, especially the microprocessor, can be adequately cooled even if a correspondingly high heat is generated by a high load. At the same time, the thermally conductive medium can absorb the extra heat temporarily generated, and can release the stored heat when the load returns to normal, that is, when the electronic component generates normal heat again. Therefore, spikes in the thermal load can be avoided, which usually significantly reduces the function of the electronic component, especially a microprocessor using a conventional cooling device. Therefore, the cooling device of the present invention can also allow the function of the cooled component to be improved. The use of the cooling device of the present invention to avoid harmful peak heat load will further improve the working life and operability of the electronic component b. Since the phase change material used as the thermally conductive medium will also maintain an aggregated solid state when it absorbs heat, it can more advantageously avoid any problems caused by the expansion of the phase material, which is common in conventional materials By. In a preferred embodiment of the cooling device of the present invention, the heat-conducting medium is composed of a salt or an organic-rich salt mixture, and a metal powder to improve the heat-conducting ability. In general, the organic component of the thermally conductive medium is ------: ------ __ This paper size _ towel Guan Jiaxian (^ 7 ^ (2View 97mm factory -------- (Please read the note on the back first) (Please fill in this page again for more details), May | V. Description of the invention (3) Paraffin. This heat-conducting medium also maintains its agglomerated solid form during heat absorption, and can be set in the solid in block and / or granular form on the cooling In and / or on the component. On the one hand, this will enable the cooling member to be manufactured economically, and on the other hand, it will ensure that the cooling member can be kept small in size. In addition, the heat conductive medium can be independently adjusted according to the present invention to Adapt to the required operating temperature for cooling the electronic component. This adjustment is done by changing the type and content of the components of the thermally conductive medium. In particular, the amount of heat buffered by the thermally conductive medium can also be adjusted. In addition Other advantages of the thermally conductive medium are not only non-toxic and recyclable. In a preferred embodiment of the cooling device of the present invention, the passive cooling element includes at least one active cooling element, especially a fan. The cooling capacity of the cooling device is further ensured. In another preferred embodiment of the cooling device of the present invention, the thermally conductive medium is filled in a container made of a thermally conductive material, and the container will contact the passive cooling. The heat-conducting medium is contained in a container, and the individual heat-conducting element fixed in the passive cooling element or easily replaced can be easily replaced. In another preferred embodiment of the cooling device of the present invention, In this case, a thermally conductive sheet is placed between the contact surface of the passive cooling element and the corresponding contact surface of the electronic component. These measures will ensure that the entire cooling function is achieved. The heat conduction of the component to the passive cooling element further enhances the cooling function. The present invention also relates to a processor having a processor socket and at least one cooling device fixed on the processor. The cooling device contains at least one passive 499749 A7 B7. Description of the invention (4: ...--... ΙΦ: ... (Please read the precautions on the back before filling out this page) Heat-conducting cooling elements, and at least some of them should be passively cooled The element will contact at least-a thermally conductive medium in the form of an aggregated solid. In this example, the thermally conductive medium is a phase change material (PCM) and has, for example, a much higher heat absorption force than water. Furthermore, the thermally conductive medium It is designed as a potential heat accumulator, which can store the heat generated by the load of the processor, and can no longer be absorbed and dissipated by the passive cooling element, while maintaining its accumulated solid state, and the load on the processor When the temperature becomes smaller, the heat is released. The present invention also relates to the use of a thermally conductive medium, which is in the form of an aggregated solid and can be used to cool a microprocessor. The thermally conductive medium is a phase change material (PCM) 'It has more than two heat absorbing capabilities than water, and is designed as a potential heat accumulator. The thermally conductive medium stores the heat generated by the load of the microprocessor, while maintaining its agglomerated solid state, and in the micro When the load on the processor becomes smaller, this heat is released. Other details, features, and advantages of the present invention which are briefly described in the drawings will be known from an embodiment shown in the accompanying drawings; wherein: FIG. 1 is a schematic cross-sectional view of a cooling device of the present invention; FIG. 2 FIG. 1 is a schematic top view of the cooling device of FIG. 1; and FIG. 3 is a schematic side view of the cooling device of FIG. 1. Device Cooling Figure 1 is a cross-sectional view of a cooling device 10 for cooling electronic components, particularly a microprocessing cooling device. The cooling device 10 includes a passive heat-conducting cooling element 12, which includes a plurality of cooling fins or blades "the cooling blades 14 are provided on the bottom element of the cooling element 12." On the side opposite to the cooling blades 14, the bottom element 16 forms a connection
499749 A7 _______B7 _ 五、發明説明~ '— 觸面18，其可接觸所要冷卻的電子構件。 «亥被動冷卻元件12係由銘或紹合金所製成，且通常為 單一片塊。在圖式中可見到有許多導熱媒體2〇被設在該冷 部兀件12的冷卻葉片14之間。該等導熱媒體2〇係形成集聚 的固體形態，而能分別與該等冷卻葉片14及底部元件16或 冷部το件12導熱接觸。在本例中，該導熱媒體係為一種相 變材料，具有例如比水更高出甚多的吸熱能力。由於該導 熱媒體係呈集聚的固態，且在吸熱時亦會保持固態，故該 導熱媒體20或冷卻元件12不必具有密封的性質。只要將個 別的導熱媒體20裝在該被動冷卻元件丨2中即可。該導熱媒 體並被设成一 PCM裝置的形式，俾使該導熱媒體2〇能夠儲 存该電子構件所產生而不能再被該被動冷卻元件〗2吸收並 散發掉的熱能，同時保持其集聚的固態，並在談電子構件 的負載降低時再釋出該等熱能。 第2圖係為第1圖之冷卻裝置1〇的頂視示意圖。該圖式 乃示出個別的導熱媒體2〇列設於該冷卻元件丨2的各冷卻葉 片14之間。 第3圖為第1圖之冷卻裝置的側視圖。該圖式乃示出該 冷卻元件12在該底部元件16的兩側區域含有固接裝置22， 可將該冷卻裝置1〇與電子構件固接在一起。又，在所示實 施例中乃可看出，該導熱媒體2〇係呈碟狀來設置。但，該 導熱媒體20的大小及形狀係可任意選擇。該導熱媒體2〇的 大小與數目’將可視各要被冷卻之電子構件所須的操作溫 度，配合其它因素而來調整。 本紙張尺度適用中國國家標準（CNS) A4規格（210X297公釐) ----- ------------------------tr............ (請先閲讀背面之注意事項再填窝本頁) 499749 A7 B7 五、發明説明（6 ) 元件標號對照 10…冷卻裝置 12…冷卻元件 14…葉片 16…底部元件 18…接觸面 20…導熱媒體 22…固接裝置 本紙張尺度適用中國國家標準（CNS) Α4規格（210X297公釐〉 9 ............. 訂 (請先閲讀背面之注意事項再填寫本頁)499749 A7 _______B7 _ 5. Description of the invention ~ '— Contact surface 18, which can contact the electronic components to be cooled. «The passive cooling element 12 is made of Ming or Shao alloy and is usually a single piece. It can be seen in the drawing that a plurality of heat-conducting media 20 are provided between the cooling blades 14 of the cold part element 12. The thermally conductive media 20 form an aggregated solid state, and can be in thermal contact with the cooling blades 14 and the bottom element 16 or the cold section το member 12, respectively. In this example, the thermally conductive medium is a phase change material and has, for example, a much higher heat absorption capacity than water. Since the heat-conducting medium is in an aggregated solid state and will remain solid when it absorbs heat, the heat-conducting medium 20 or the cooling element 12 need not have a sealed property. All that is required is to mount a separate thermally conductive medium 20 in the passive cooling element 2. The thermally conductive medium is also provided in the form of a PCM device, so that the thermally conductive medium 20 can store the thermal energy generated by the electronic component and can no longer be absorbed and dissipated by the passive cooling element 2 while maintaining its accumulated solid state , And release the heat when the load of the electronic components is reduced. Fig. 2 is a schematic top view of the cooling device 10 of Fig. 1. The figure shows that individual heat-conducting media 20 are arranged between the cooling blades 14 of the cooling element 2. Fig. 3 is a side view of the cooling device of Fig. 1. The drawing shows that the cooling element 12 includes fixing devices 22 on both sides of the bottom element 16, and the cooling device 10 and the electronic component can be fixed together. Also, it can be seen in the illustrated embodiment that the thermally conductive medium 20 is provided in a dish shape. However, the size and shape of the thermally conductive medium 20 can be arbitrarily selected. The size and number of the heat-conducting medium 20 will be adjusted according to the operating temperature required for each electronic component to be cooled, and other factors. This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) ----- ------------------------ tr ... ......... (Please read the precautions on the back before filling this page) 499749 A7 B7 V. Description of the invention (6) Comparison of component numbers 10 ... Cooling device 12 ... Cooling element 14 ... Blade 16 ... Bottom Element 18 ... Contact surface 20 ... Heat conducting medium 22 ... Fixed device This paper size applies to China National Standard (CNS) A4 specification (210X297 mm> 9 ......... Order (Please read first (Notes on the back then fill out this page)