1332145 099年05月28日梭正替換頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別係指一種帶有熱管之散 熱裝置。 【先前技術】 [0002] 隨著大型積體電路技術之不斷進步，電子產業得到快速 而長足之發展，電腦中央處理器及晶片等電子元件之集 成度越來越高，運行速度越來越快，因此，伴隨其產生 之熱量亦隨之增加，如果該熱量不及時散發出去，將導 致電子元件内部溫度迅速升高，從而影響其運行之穩定 性和速度，目前電腦内部之雙熱丨問题之影響日益突出， 成為高速處理器推出之障礙。 [0003] 由於新型晶片及處理器不斷推出，發熱量越來越高，僅 依靠電子元件自身之散熱已遠遠無法滿足實際應用之需 要’業界通常在電子元件表面加裝一散熱器來輔助散熱 ，伴隨對散熱需求之不斷提高，散熱器相關之技術亦得 到快速之發展。 [0_較早之健雜直接彻金屬進行熱料，傳導效率較 低。隨後業界推出-種新之聽器，其不再單純利用金 屬傳導散熱，而係主要利用液體在兩相變化時溫度保持 不變而可吸收或放出大量熱之物理現象來實現熱量之傳 遞’如熱管°由於熱管之熱傳導性能較佳，因此倍受業 界青睞。 096115859 目則業界運用熱管之散熱器層出不窮，最常見之散熱器 包括一基座、複數L形或U形熱管及複數散熱鰭片，其中 表單編號A0101 第3頁/共16頁 0993190824-0 [0005] 1332145 099年05月28日梭正替換頁 該等散熱片水準並間隔平行放置；該等熱管包括豎直段 和水準段，豎直段向上貫穿散熱片，水準段熱連接基座 。然而，這類散熱器之散熱片一般為銘、銅等金屬薄片 ，故其加工複雜且與熱管接觸面積有限。 【發明内容】 [0006] 本發明旨在提供一種能夠有效利用熱管具有高效熱傳導 特性之散熱裝置。 [0007] —種散熱裝置，用於冷卻發熱電子元件，其包括一導熱 體、從該導熱體侧向延伸而出之複數導熱臂以及從該等 導熱臂上延伸而出之複數散熱鰭片，該導熱體包括與該 電子元件接觸之吸熱部，還包括複數具有蒸發部和冷凝 部之熱管，該等熱管之蒸發部與該導熱體之吸熱部導熱 連接，冷凝部分別與該等導熱臂導熱連接。 [0008] 上述散熱裝置在使用時，其吸熱塊從發熱電子元件吸收 之熱量直接傳導到導熱體上，另一部分通過熱管均勻傳 導到各個導熱臂上，且該等導熱臂地與熱管緊密及充分 接觸，從而有效地增加散熱裝置之整體導熱性能。 【實施方式】 [0009] 請同時參閱圖1至圖3，本發明第一實施例中之散熱裝置1 用於安裝在電路板（圖未示）對發熱電子元件（圖未示 )散熱，其包括與發熱電子元件接觸之一吸熱塊12、複 數導熱連接吸熱塊12之熱管14、位於吸熱塊12之上並交 替夾置熱管12之複數散熱體組合。 [0010] 上述吸熱塊12由導熱性能良好之金屬材料如銅等製成， 096115859 表單編號A0101 第4頁/共16頁 0993190824-0 1.332145 099年05月28日修正替換頁 其大致為一矩形板體。該吸熱塊12上表面中部開設有二 間隔並均與一侧邊平行之容置槽120，該容置槽120靠外 之一側壁中部向内突伸一接觸部122。該接觸部122形成 一弧形面（未標號）以增加與熱管14之接觸面積。 [0011] 上述複數熱管14在本實施例中為二大小形狀一致，均由 扁平熱管彎曲而成，並大致呈U形之熱管14。該熱管14包 括一平直之蒸發部142及自該蒸發部142兩端傾斜向一侧 延伸之二冷凝部144。該蒸發部142放置在吸熱塊12容置 槽120内，並與容置槽120之側壁及接觸部122緊密接觸 〇 [0012] 上述散熱體組合在本實施例中為一對第一散熱體16和一 對第二散熱體18。該第一散熱體Ϊ6由鋁擠一體成型，其 包括一平板矩形狀之第一導熱板160、二從該第一導熱板 160相對兩側傾斜向外延伸之第一翼板162及從該第一翼 板162及第一導熱板160向外延伸之複數第一散熱鰭片 164。每一第一翼板162外側壁沿對角線上開設一向上傾 斜之第一容置槽1620。該等第一散熱鰭片164均垂直第一 導熱板160向外延伸且位於第一翼板162之間。 [0013] 上述第二散熱體18形狀與第一散熱體16相似，均由鋁擠 一體成型，該第二散熱體18包括一第二導熱板180、二從 該第二導熱板180相對兩側傾斜向外延伸之第二翼板182 及從第二翼板182及第二導熱板180向外延伸之複數第二 散熱鰭片184。該第二導熱板180之高度與第一導熱板 160之相同，但寬度較其小。每一第二翼板182外側壁沿 對角線上開設一與第一凹槽1 620對應之第二容置槽1820 096115859 表單編號A0101 第5頁/共16頁 0993190824-0 13321451332145 On May 28, 099, the shuttle is replacing the page. 6. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device with a heat pipe. [Prior Art] [0002] With the continuous advancement of large-scale integrated circuit technology, the electronics industry has developed rapidly and rapidly, and the integration of computer central processing units and chips and other electronic components is getting higher and higher, and the operation speed is getting faster. Therefore, the heat generated along with it increases accordingly. If the heat is not released in time, the internal temperature of the electronic component will rise rapidly, which will affect the stability and speed of its operation. The impact has become increasingly prominent and has become a barrier to the launch of high-speed processors. [0003] As new types of chips and processors continue to be introduced, the heat generation is getting higher and higher, and relying solely on the heat dissipation of the electronic components is far from being able to meet the needs of practical applications. The industry usually installs a heat sink on the surface of the electronic components to assist heat dissipation. With the continuous improvement of the demand for heat dissipation, the technology related to heat sinks has also been rapidly developed. [0_Early, the raw materials are directly used for hot materials, and the conduction efficiency is low. Then the industry introduced a new kind of hearing device, which no longer uses metal conduction heat dissipation, but mainly uses the physical phenomenon that the liquid maintains the temperature in the two-phase change and can absorb or release a large amount of heat to realize the heat transfer. The heat pipe ° is favored by the industry because of its better heat transfer performance. 096115859 The heat sinks in the industry are endless. The most common heat sinks include a base, a plurality of L-shaped or U-shaped heat pipes and a plurality of heat sink fins. Form No. A0101 Page 3 of 16 0993190824-0 [0005 ] 1332145 On May 28, 2008, the shuttle is replacing the pages of the heat sinks in parallel with each other; the heat pipes include vertical sections and leveling sections, the vertical sections penetrate upward through the fins, and the leveling sections are thermally connected to the base. However, the heat sink of such a heat sink is generally a metal foil such as Ming, copper, etc., so the processing thereof is complicated and the contact area with the heat pipe is limited. SUMMARY OF THE INVENTION [0006] The present invention is directed to a heat sink capable of effectively utilizing a heat pipe having high heat transfer characteristics. [0007] A heat dissipating device for cooling a heat-generating electronic component includes a heat conductor, a plurality of heat-conducting arms extending laterally from the heat-conducting body, and a plurality of heat-dissipating fins extending from the heat-conducting arms, The heat conductor includes a heat absorbing portion in contact with the electronic component, and further includes a plurality of heat pipes having an evaporation portion and a condensation portion, wherein the evaporation portions of the heat pipes are thermally connected to the heat absorbing portion of the heat conductor, and the condensing portions respectively conduct heat with the heat conducting arms connection. [0008] When the heat dissipating device is in use, the heat absorbed by the heat absorbing block from the heat generating electronic component is directly transmitted to the heat conducting body, and the other portion is uniformly conducted to the respective heat conducting arms through the heat pipe, and the heat conducting arms are closely and fully insulated with the heat pipe. Contact, thereby effectively increasing the overall thermal conductivity of the heat sink. [0009] Referring to FIG. 1 to FIG. 3, the heat dissipating device 1 of the first embodiment of the present invention is used for heat dissipation of a heat-generating electronic component (not shown) mounted on a circuit board (not shown). The heat pipe 14 is in contact with the heat-generating electronic component, the heat pipe 14 of the plurality of heat-conducting heat-absorbing blocks 12, and the plurality of heat-dissipating bodies disposed above the heat-absorbing block 12 and alternately sandwiching the heat pipe 12. [0010] The heat absorbing block 12 is made of a metal material such as copper having good thermal conductivity, 096115859 Form No. A0101 Page 4 / Total 16 pages 0993190824-0 1.332145 Modified on May 28, 2008, the replacement page is roughly a rectangular plate. body. A accommodating groove 120 is formed in the middle of the upper surface of the heat absorbing block 12 and is spaced apart from the one side. The accommodating groove 120 protrudes inwardly from a central portion of the outer side wall to form a contact portion 122. The contact portion 122 forms a curved surface (not numbered) to increase the contact area with the heat pipe 14. [0011] In the present embodiment, the plurality of heat pipes 14 are two heat pipes 14 which are uniform in shape and shape and are bent by a flat heat pipe and are substantially U-shaped. The heat pipe 14 includes a flat evaporation portion 142 and two condensation portions 144 extending obliquely from one end of the evaporation portion 142 to one side. The evaporating portion 142 is disposed in the accommodating groove 120 of the heat absorbing block 12 and is in close contact with the side wall of the accommodating groove 120 and the contact portion 122. [0012] The heat dissipating body combination is a pair of first heat dissipating bodies 16 in this embodiment. And a pair of second heat sinks 18. The first heat sink body 6 is integrally formed by extrusion of aluminum, and includes a first heat conducting plate 160 having a flat rectangular shape, and a first wing plate 162 extending obliquely outward from opposite sides of the first heat conducting plate 160 and A wing plate 162 and a plurality of first heat dissipation fins 164 extending outward from the first heat conduction plate 160. An outer accommodating groove 1620 is inclined upwardly on the outer side wall of each of the first wings 162. The first heat dissipation fins 164 extend outwardly from the first heat conduction plate 160 and are located between the first wings 162. [0013] The shape of the second heat dissipating body 18 is similar to that of the first heat dissipating body 16, and is integrally formed by extrusion of aluminum. The second heat dissipating body 18 includes a second heat conducting plate 180 and two opposite sides of the second heat conducting plate 180. The second wing 182 extends obliquely outward and the plurality of second heat dissipation fins 184 extend outward from the second wing 182 and the second heat conducting plate 180. The height of the second heat conducting plate 180 is the same as that of the first heat conducting plate 160, but the width is smaller. A second accommodating groove corresponding to the first groove 1 620 is formed on the outer side wall of each second wing 182 along a diagonal line. 1820 096115859 Form No. A0101 Page 5 of 16 0993190824-0 1332145
099年05月28日修正替換頁I ’ s亥第一翼板182之末端設置一開放之圓筒186，用以將 風扇（圖未示）安裝到散熱裝置1之頂部。第二容置槽 1820對應與第一散熱體16之第一容置槽1620配合，以形 成容置熱管14之冷凝部144之容置空間。 [0014] 請再次參閲圖1和圖2 ’上述散熱裝置1為一矩形散熱結構 組合’該第一散熱體16及第二散熱體18組合在一起並位 於吸熱塊12之上。每一第一散熱體16之第一翼板162與一 第二散熱體18相鄰之第二翼板182結合形成導熱臂。該熱 管14之冷凝部144容置在第一散熱體16之第一容置槽 1 620和第二散熱體18之第二容置槽1820形成之容置空間 内，並可通過焊接或填充導熱:介質等方式固定在該容置 空間内’以提高到導熱效率。該熱管14之蒸發部14 2與吸 熱塊12之容置槽120侧壁及接觸部122焊接固定。該兩第 二導熱板180與兩第一散熱體16之第一導熱板豎立在 吸熱塊12上形成一中空導熱筒，該導熱筒與吸熱塊12結 合形成一導熱體，該吸熱塊12充當導熱體之吸熱部與吸 熱塊12連接，β玄導熱體各角上向外延伸由第一翼板162及 第一翼板182組成之導熱臂；該二熱管η之冷凝部144分 別穿置在該等導熱臂内，以將吸熱塊12吸收之熱量傳遞 到整個散熱體上。 [0015] 請參閱圖4至圖6，本發明第二實施例中之散熱裝置2，其 包括一吸熱塊21、四相同之熱管23和一散熱器25。 [0016] 上述吸熱塊21為扁圓柱形板體，其由導熱性能優越之金 屬如銅製成，該吸熱塊四周對稱開設四半圓形凹槽21〇， 以與熱管23配合。 096115859 表單編號Α0101 第6頁/共丨6頁 0993190824-0 1332145 [0017] 上述熱管23均由圓形熱管彎折呈u形， 拐角且略向上延伸之蒸發部23〇、 之第一冷凝部232、 099年05月28日 其包括一位於U形 位於蒸發部230上方 與第-冷凝部232平行之第二冷凝 部234和一連接蒸發部23〇及第二冷凝部如之第 部236 » 三冷凝 [0018] 上述散熱器25大致呈矩形，由鋁擠一體成型其包括一 導熱筒252、四從該導熱體252周緣均勻向外延伸之導熱 臂254和複數從導㈣252及導熱臂…向四周延伸之散 熱趙片256 »該導熱筒252内壁上關於其中心軸線對稱開 設四賢直之半圓形凹槽252〇，用以容置熱管㈡之第一冷 凝部232。該導熱臂254對應:專熱筒2唆上.凹槽mo處對 稱向外延伸，其兩側壁及導熱筒252¥緣向.外延伸有間隔 平行並垂直該矩形散熱器25—對邊之散熱鰭片256 ;該導 熱臂254近末端開設一垂直之容置孔mm，用於容置熱管 23之第二冷凝部234 ;該導熱臂254之末端設置一開放之 圓筒2542 ’用以將風扇（圖未示）安裝到散熱裝置2之頂 部；該導熱臂254之底部開設一容置槽2544，用於容置熱 管23之第三冷凝部236，該容置槽2544連通導熱筒252之 凹槽2520與導熱臂254之容置孔2540。該等散熱鰭片25 之底部在圍繞在導熱筒252周圍除容置槽2544經過處形成 一圓形凸部（未標號），該凸部與導熱筒252底部及容置 在導熱筒252内之吸熱塊21底面形成一與發熱電子元件接 觸之平面’該導熱筒252底部與吸熱塊21及電子元件接觸 之部分為其吸熱部。此外，在本實施例中該吸熱塊21與 圓筒狀導熱筒252分離設計，可以理解在其他實施例中， 096115859 表箪编珑A0101 第7頁/共16頁 0993190824-0 1332145 __ 099年05月28日按正替換頁 該吸熱塊21可以與該導熱筒252—體形成或該導熱筒252 為一實心柱體，該熱管23之一冷凝部234自下向上穿置在 該一體形成之導熱體内。 [0019] 請再次參閱圖4及圖5，該散熱裝置2在組裝狀態下，該吸 熱塊21結合在導熱筒252内形成一導熱體，該吸熱塊21為 該導熱體之吸熱部，並使其上之凹槽210與導熱筒252凹 槽2520底部部分形成容置熱管23蒸發部230之通孔；該 熱管23之第三冷凝部236容置在導熱臂254底端之容置槽 2544内，其第二冷凝部234容置在導熱臂254之容置孔 2540内，第一冷凝部232穿過吸熱塊21之凹槽210與導 熱筒252之凹槽2520形成之穿孔，而容置在導熱筒252之 凹槽2520内。 [0020] 由上所述可知，上述應用熱管之本發明第一、二實施例 中之散熱裝置均由鋁擠成型，其生產過程簡單、生產成 本低，且其成品組裝便捷。此外，鋁擠形成之熱管容置 空間能更緊密及充分地與熱管接觸，有效地增加散熱裝 置之整體導熱性能。上述散熱裝置在使用時，吸熱塊從 發熱電子元件吸收之熱量部分直接傳導到散熱體上，另 一部分通過熱管均勻傳導到各個導熱臂上，從而能有效 之散發發熱電子元件產生之熱量。 [0021] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 表單編號A0101 096115859 第8頁/共16頁 0993190824-0 1332145 099年05月28日修正替換頁 [0022] 圖1係本發明第一實施例中散熱裝置之立體組合圖。 [0023] 圖2係圖1中散熱裝置之部分分解圖。 [0024] 圖3係圖1中散熱裝置分解圖。 [0025] 圖4係本發明第二實施例中散熱裝置之立體組合圖。 [0026] 圖5係圖4中散熱裝置之倒置視圖。 [0027] 圖6係圖4中散熱裝置之分解圖。 【主要元件符號說明】 [0028] 散熱裝置：1、2 [0029] 吸熱塊：12、21 [0030] 容置槽：120 [0031] 接觸部：122 [0032] 熱管：14 、23 [0033] 蒸發部：142、230 、 [0034] 冷凝部：144 [0035] 第一散熱體：16 [0036] 第一導熱板：160 [0037] 第一翼板：162 [0038] 第一容置槽：1620 [0039] 第一散熱鰭片：164 [0040] 第二散熱體：18 096115859 表單編號A0101 第9頁/共16頁 0993190824-0 1332145 [0041] 第二導熱板：180 [0042] 第二翼板：182 [0043] 第二容置槽：1820 [0044] 第二散熱鰭片：184 [0045] 圓筒：186、2542 [0046] 凹槽：210、2520 [0047] 第一冷凝部：232 [0048] 第二冷凝部：234 [0049] 第三冷凝部：236 [0050] 散熱器：25 [0051] 導熱筒：252 [0052] 導熱臂：254 [0053] 容置孔：2540 [0054] 容置槽：2544 [0055] 散熱鰭片：256 096115859 表單編號A0101 第10頁/共16頁 099年05月28日俊正替换頁 0993190824-0An open cylinder 186 is provided at the end of the first replacement flap 182 of the modified replacement page I's on the 28th of May, 1989, for mounting a fan (not shown) to the top of the heat sink 1. The second accommodating groove 1820 cooperates with the first accommodating groove 1620 of the first heat radiating body 16 to form an accommodating space for accommodating the condensing portion 144 of the heat pipe 14. Referring again to FIG. 1 and FIG. 2, the heat dissipating device 1 is a rectangular heat dissipating structure. The first heat dissipating body 16 and the second heat dissipating body 18 are combined and placed on the heat absorbing block 12. The first wing 162 of each first heat sink 16 is combined with a second wing 182 adjacent to a second heat sink 18 to form a heat conducting arm. The condensing portion 144 of the heat pipe 14 is received in the accommodating space formed by the first accommodating groove 1 620 of the first heat radiating body 16 and the second accommodating groove 1820 of the second heat radiating body 18, and can be thermally conductive by welding or filling. : The medium is fixed in the accommodating space to improve the heat transfer efficiency. The evaporation portion 14 2 of the heat pipe 14 is welded and fixed to the side wall of the accommodating groove 120 of the heat absorbing block 12 and the contact portion 122. The two heat conducting plates 180 and the first heat conducting plates of the first heat radiating bodies 16 are erected on the heat absorbing block 12 to form a hollow heat conducting tube. The heat conducting tube and the heat absorbing block 12 are combined to form a heat conducting body, and the heat absorbing block 12 serves as a heat conducting body. The heat absorbing portion of the body is connected to the heat absorbing block 12, and the heat conducting arms composed of the first wing plate 162 and the first wing plate 182 extend outward from the corners of the β 玄 heat conductor; the condensation portions 144 of the two heat pipes η are respectively disposed therein. In the heat conducting arm, the heat absorbed by the heat absorbing block 12 is transferred to the entire heat sink. Referring to FIG. 4 to FIG. 6, a heat dissipating device 2 according to a second embodiment of the present invention includes a heat absorbing block 21, four identical heat pipes 23, and a heat sink 25. [0016] The heat absorbing block 21 is a flat cylindrical plate body made of a metal such as copper having excellent thermal conductivity, and the heat absorbing block is circumferentially symmetrically opened with a semicircular recess 21 〇 to be engaged with the heat pipe 23. 096115859 Form No. 1010101 Page 6/Total 6 Pages 0993190824-0 1332145 [0017] The heat pipes 23 are all bent by a circular heat pipe into a u-shaped, corner-shaped and slightly upwardly extending evaporation portion 23A, the first condensation portion 232 On May 28, 099, it includes a second condensation portion 234 located in a U shape above the evaporation portion 230 in parallel with the first condensation portion 232, and a connection evaporation portion 23 and a second condensation portion such as the first portion 236 » Condensation [0018] The heat sink 25 is substantially rectangular and is integrally formed by extrusion. The heat sink 25 includes a heat conducting tube 252, a heat conducting arm 254 extending uniformly outward from the periphery of the heat conducting body 252, and a plurality of conductive guides (four) 252 and a heat conducting arm. The heat dissipating 236 of the heat conducting tube 252 is symmetrically opened on the inner wall of the heat conducting tube 252 with respect to the central axis thereof to accommodate the first condensing portion 232 of the heat pipe (2). The heat conducting arm 254 corresponds to: the heat collecting cylinder 2 is 唆. The groove mo is symmetrically extended outward, and the two side walls and the heat conducting tube 252 are spaced outwardly and have a space parallel to the vertical and the vertical heat sink 25 is opposite to the side. The fin 256 has a vertical receiving hole mm at the proximal end of the heat conducting arm 254 for accommodating the second condensation portion 234 of the heat pipe 23; an end of the heat conducting arm 254 is provided with an open cylinder 2542' for the fan (not shown) is mounted on the top of the heat dissipating device 2; a receiving groove 2544 is defined in the bottom of the heat conducting arm 254 for receiving the third condensation portion 236 of the heat pipe 23, and the receiving groove 2544 communicates with the concave portion of the heat conducting tube 252. The slot 2520 and the heat conducting arm 254 receive the hole 2540. The bottom of the heat dissipating fins 25 forms a circular protrusion (not labeled) around the accommodating groove 2544 around the heat conducting tube 252. The protrusion and the bottom of the heat conducting tube 252 are received in the heat conducting tube 252. The bottom surface of the heat absorbing block 21 forms a plane in contact with the heat-generating electronic component. The portion of the heat-conductive tube 252 that is in contact with the heat-absorbing block 21 and the electronic component is a heat absorbing portion. In addition, in the present embodiment, the heat absorbing block 21 is separated from the cylindrical heat conducting tube 252, and it can be understood that in other embodiments, 096115859 箪 箪 珑 A0101 page 7 / total 16 pages 0993190824-0 1332145 __ 099 year 05 On the 28th of the month, the heat absorbing block 21 can be formed integrally with the heat conducting tube 252 or the heat conducting tube 252 is a solid cylinder. The heat condensing portion 234 of the heat pipe 23 is disposed in the integrally formed heat conduction from the bottom to the top. in vivo. [0019] Referring again to FIG. 4 and FIG. 5, in the assembled state, the heat absorbing block 21 is combined with a heat conducting body formed in the heat conducting tube 252, and the heat absorbing block 21 is a heat absorbing portion of the heat conducting body, and The groove 210 and the bottom portion of the groove 2520 of the heat conducting tube 252 form a through hole for accommodating the evaporation portion 230 of the heat pipe 23; the third condensation portion 236 of the heat pipe 23 is received in the receiving groove 2544 at the bottom end of the heat conducting arm 254. The second condensing portion 234 is received in the receiving hole 2540 of the heat conducting arm 254. The first condensing portion 232 passes through the groove 210 formed by the heat absorbing block 21 and the groove 2520 formed by the heat conducting tube 252, and is accommodated in the hole. Inside the recess 2520 of the heat conducting cylinder 252. [0020] As can be seen from the above, the heat dissipating devices of the first and second embodiments of the present invention, which are applied to the heat pipes, are all extruded from aluminum, which has a simple production process, low production cost, and convenient assembly of the finished products. In addition, the heat pipe accommodating space formed by aluminum extrusion can be more closely and fully contacted with the heat pipe, effectively increasing the overall heat conduction performance of the heat sink. When the heat dissipating device is in use, the heat absorbed by the heat-absorbing block from the heat-generating electronic component is directly transmitted to the heat-dissipating body, and the other portion is uniformly conducted to the respective heat-conducting arms through the heat pipe, so that the heat generated by the heat-generating electronic component can be effectively dissipated. [0021] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat dissipating device in a first embodiment of the present invention. FIG. 1 is a perspective view of a heat dissipating device according to a first embodiment of the present invention. [0020] FIG. 2 is a partially exploded view of the heat sink of FIG. 1. 3 is an exploded view of the heat sink device of FIG. 1. 4 is a perspective assembled view of a heat sink device in a second embodiment of the present invention. 5 is an inverted view of the heat sink of FIG. 4. 6 is an exploded view of the heat sink of FIG. 4. [Main component symbol description] [0028] Heat sink: 1, 2 [0029] Heat absorbing block: 12, 21 [0030] accommodating groove: 120 [0031] Contact portion: 122 [0032] Heat pipe: 14, 23 [0033] Evaporation section: 142, 230, [0034] Condensation section: 144 [0035] First heat sink: 16 [0036] First heat conducting plate: 160 [0037] First wing: 162 [0038] First receiving groove: 1620 [0039] First heat sink fin: 164 [0040] Second heat sink: 18 096115859 Form number A0101 Page 9 / Total 16 page 0993190824-0 1332145 [0041] Second heat conducting plate: 180 [0042] Second wing Plate: 182 [0043] Second accommodating groove: 1820 [0044] Second heat sink fin: 184 [0045] Cylinder: 186, 2542 [0046] Groove: 210, 2520 [0047] First condensing part: 232 [0048] Second condensation portion: 234 [0049] Third condensation portion: 236 [0050] Heat sink: 25 [0051] Heat conduction tube: 252 [0052] Thermal conduction arm: 254 [0053] accommodating hole: 2540 [0054] Socket: 2544 [0055] Heat sink fin: 256 096115859 Form number A0101 Page 10 / Total 16 page 099 May 28th, the replacement page 0993190824-0