CA2374008A1 - Cooling device for electronic components - Google Patents
Cooling device for electronic components Download PDFInfo
- Publication number
- CA2374008A1 CA2374008A1 CA002374008A CA2374008A CA2374008A1 CA 2374008 A1 CA2374008 A1 CA 2374008A1 CA 002374008 A CA002374008 A CA 002374008A CA 2374008 A CA2374008 A CA 2374008A CA 2374008 A1 CA2374008 A1 CA 2374008A1
- Authority
- CA
- Canada
- Prior art keywords
- heat transfer
- transfer medium
- heat
- cooling device
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a cooling device for electronic components, especially for cooling microprocessors. The inventive device has at least one passive heat-conducting cooling element (12). At least one part of the passive cooling element (12) is connected to at least one heat transmission medium (20) which is in a solid state of aggregation and is a phase change material (PCM) having a heat receiving capacity that is many times higher compared to water and is configured as a PCM device. The heat transmission medium (20) stores the heat quantity which is produced by charging the electronic component and cannot be received and discharged by the passive cooling element (18) any longer, whereby the solid state of aggregation is maintained. Said medium releases said heat when the electronic component is charged less.
Description
A COOLING DEVICE FOR ELECTRONIC COMPONENTS
Description:
The present invention relates to a cooling device for electronic components, in particular for cooling microprocessors, which has at least one passive thermo-conducting cooling elemenf.
io A wide variety of electronic component cooling devices of this type are known in the prior art. These especially comprise passive thermo-conducting cooling elements, in particular made of aluminum, which are mounted on the surfaces of said electronic components, thus effectively contacting them. The cooling elements are attached thereto by means of adhesive or special supports. Usually, there is also an additional is active cooling element in the form of a fan, which is either positioned on said passive cooling elements or integrated within said passive cooling elements.
The prior art cooling systems are all based on the principle of heat transfer by evaporation, condensation, convection and dissipation, or they are characterized by 2o different material combinations and surface structures of different thermo-conducting capacities andlor thermal resistances.
A disadvantage of the prior art cooling devices, however, is that in view of the ever more powerful electronic components, in particular due to the higher and higher 2s microprocessor clock rates, the development of heat also increases strongly. Since such electronic components will only function properly in a certain temperature range, however, and too high temperatures will cause them to either become inoperative or lose considerable power, ever increasing demands are also made on the respective cooling devices. The above mentioned coolers of the prior art are no longer capable 30 of achieving the desired and required degree of cooling.
Description:
The present invention relates to a cooling device for electronic components, in particular for cooling microprocessors, which has at least one passive thermo-conducting cooling elemenf.
io A wide variety of electronic component cooling devices of this type are known in the prior art. These especially comprise passive thermo-conducting cooling elements, in particular made of aluminum, which are mounted on the surfaces of said electronic components, thus effectively contacting them. The cooling elements are attached thereto by means of adhesive or special supports. Usually, there is also an additional is active cooling element in the form of a fan, which is either positioned on said passive cooling elements or integrated within said passive cooling elements.
The prior art cooling systems are all based on the principle of heat transfer by evaporation, condensation, convection and dissipation, or they are characterized by 2o different material combinations and surface structures of different thermo-conducting capacities andlor thermal resistances.
A disadvantage of the prior art cooling devices, however, is that in view of the ever more powerful electronic components, in particular due to the higher and higher 2s microprocessor clock rates, the development of heat also increases strongly. Since such electronic components will only function properly in a certain temperature range, however, and too high temperatures will cause them to either become inoperative or lose considerable power, ever increasing demands are also made on the respective cooling devices. The above mentioned coolers of the prior art are no longer capable 30 of achieving the desired and required degree of cooling.
Therefore, it is the object of the present invention to provide a cooling device for electronic components, in particular for cooling microprocessors, which has at least one passive thermo-conducting cooling element, which device will ensure sufficient cooling of the electronic components even in case of a strong heat build-up.
s This object is accomplished by a generic cooling device having the features of claim 1.
Advantageous embodiments are described in the subclaims.
to An inventive cooling device for electronic components includes at least one passive thermo-conducting cooling element, with at least part of said passive cooling element contacting at least one heat transfer medium which is in a solid aggregation state.
Said heat transfer medium in this case is a phase change material (PCM) which has a is much higher heat capacity than water, for example. Moreover, said heat transfer medium has been designed as a latent heat accumulator to store the amount of heat generated by the load on the electronic component that can no longer be absorbed and carried off by said passive cooling element, at the same time maintaining its solid state of aggregation, and release said heat again at a time when there is a lower load 20 on the electronic component. This will ensure that electronic components, in particular microprocessors, will be sufficiently cooled even if there is a high load and a corresponding high heat build-up. At the same time, the heat transfer medium is capable of absorbing temporarily occurring additional amounts of heat and of releasing them again once the load is back to normal, i.e. the electronic component 2s develops a normal amount of heat again. Peak thermal loads are thus avoided which usually clearly diminish the power of the electronic component and especially that of a microprocessor when conventional cooling devices are used. Consequently, the inventive cooling device also allows an increase in power of the cooled components.
Avoiding damaging peak heat loads will furthermore increase the working life and the 30 operativeness of the electronic components cooled by means of the cooling device of the invention. Since the phase change material used as a heat transfer medium will retain its solid state of aggregation also during heat absorption, there will advantageously not be any problems due to an expansion of the phase change material, as opposed to what is always the case with known materials.
In an advantageous embodiment of the cooling device of the invention, the heat s transfer medium consists of salts or salt mixtures enriched with organic substances as well as of substances in the form of fine metallic powders for improving the thermo-conducting capacity. Usually, the organic ingredient of the heat transfer medium is paraffin. A heat transfer medium of this kind will also retain its solid state of aggregation during heat absorption, and may thus be mounted in the form of a io tablet or pellet and/or as a solid body within andlor on said cooling element. This will allow said cooling device to be manufactured economically, on the one hand, and, on the other hand, it will ensure that it can be kept small in size. Moreover, it is possible according to the invention to individually adjust the heat transfer medium to the required operational temperatures for cooling the electronic components. Such is adjustment is done by varying the kind and amount of the ingredients of the heat transfer medium. In particular, it is also possible to adjust the amount of heat to be buffered by the heat transfer medium. Moreover, another advantage of said heat transfer medium is that it is non-toxic as well as recyclable.
2o In an advantageous embodiment of the cooling device of the invention, the passive cooling element includes at least one active cooling element, in particular a fan. This will advantageously ensure a further increase of the cooling power of the cooling device.
2s In yet another advantageous embodiment of the cooling device of the invention, the heat transfer medium is accommodated in a container made of thermo-conducting material, said container contacting said passive cooling element. Providing said heat transfer medium within a container will allow easy replacement of the individual heat transfer elements mounted within or on said passive cooling element.
In yet another advantageous embodiment of the cooling device of the invention, a thermo-conducting foil is provided between a contact surface of said passive cooling element and a corresponding contact surface of said electronic component. This measure will ensure that the total cooling power achieved by means of said cooling device is increased further by an optimized heat transfer from the electronic component to the passive cooling element.
The invention furthermore relates to a processor with a processor socket and at least one cooling device mounted on said processor, which cooling device includes at least one passive thermo-conducting cooling element, with at least part of said passive cooling element contacting at least one heat transfer medium which is in a solid state to of aggregation. In this case, the heat transfer medium is a phase change material (PCM) which has a much higher heat absorption capacity than water for example.
Moreover, said heat transfer medium has been designed as a latent heat accumulator so as to store the amount of heat generated by the load on the processor that can no longer be absorbed and carried off by the passive cooling element, at the same time is retaining its solid state of aggregation, and to release said heat again at a time when there is a smaller load on the processor.
The invention furthermore relates to the use of a heat transfer medium, which is in a solid state of aggregation, for cooling microprocessors, said heat transfer medium 2o being a phase change material (PCM) that has a much higher heat absorption capacity than water and has been designed as a latent heat accumulator. The heat transfer medium will store the amount of heat generated by the load on the microprocessor, at the same time retaining its solid state of aggregation, and release said heat again at a time when the load on the microprocessor is smaller.
Further details, features and advantages of the present invention may be gathered from an embodiment shown in the attached drawings, of which:
Fig. 1 is a schematic sectional view of a cooling device of the invention;
Fig. 2 is a schematic top view of the cooling device of the invention as shown in Fig.
1; and Fig. 3 is a schematic lateral view of the cooling device of the invention as shown in Fig. 1.
s Figure 1 is a sectional view of a cooling device 10 for cooling electronic components, in particular for cooling microprocessors. Said cooling device 10 comprises a passive thermo-conducting cooling element 12, which cooling element 12 consists of a plurality of cooling ribs or fins 14. Said cooling ribs or fins 14 are mounted on a bottom element 16 of said cooling element 12. On the side opposing said cooling ribs io or fins 14, said bottom element 16 exhibits a contact surface 18 which contacts the electronic component intended to be cooled.
The passive cooling element 12 is made of aluminum or an aluminum alloy, and is usually a single piece. It can be seen in this drawing that plural heat transfer media is 20 are provided between the cooling ribs or fins 14 within said cooling element 12.
Said heat transfer media 20 are in a solid state of aggregation and in thermo-conducting contact with said cooling ribs or fins 14 and said bottom element 16 or said cooling element 12, resp. In this case, the heat transfer medium is a phase change material which has a much higher heat absorption capacity than water, for 2o example. Since the heat transfer medium is in a solid state of aggregation which it will also retain during heat absorption, it will not be necessary to provide the heat transfer medium 20 or the cooling element 12 with sealing properties.
Supporting the individual heat transfer media 20 within said passive cooling element 12 will suffice.
Said heat transfer medium is moreover provided in the form of a PCM device so as to 2s cause said heat transfer medium 20 to store the thermal energy generated by the load on the electronic component that can no longer be absorbed and carried off by the passive cooling element 18, at the same time retaining its solid state of aggregation, and to release said heat again at a time when the load on the electronic component is lower.
Figure 2 is a schematic top view of the cooling device 10 according to Figure 1. This drawing shows the arrangement of the individual heat transfer media 20 between the individual cooling ribs or fins 14 of said cooling element 12.
s Figure 3 is a lateral view of the cooling device according to Figure 1. This drawing shows that said cooling element 12 includes attachment means 22, at the area of said bottom element 16 and on its sides, for attaching said cooling device 10 together with the electronic component to be cooled. Furthermore, one can see that, in the embodiment illustrated, the heat transfer media 20 are provided in the form of disks.
io However, the size and shape of said heat transfer media 20 may be chosen at random. The size and the number of said heat transfer media 20 will allow, amongst other things, the adjustment of the required operational temperatures for the respective electronic components intended to be cooled.
s This object is accomplished by a generic cooling device having the features of claim 1.
Advantageous embodiments are described in the subclaims.
to An inventive cooling device for electronic components includes at least one passive thermo-conducting cooling element, with at least part of said passive cooling element contacting at least one heat transfer medium which is in a solid aggregation state.
Said heat transfer medium in this case is a phase change material (PCM) which has a is much higher heat capacity than water, for example. Moreover, said heat transfer medium has been designed as a latent heat accumulator to store the amount of heat generated by the load on the electronic component that can no longer be absorbed and carried off by said passive cooling element, at the same time maintaining its solid state of aggregation, and release said heat again at a time when there is a lower load 20 on the electronic component. This will ensure that electronic components, in particular microprocessors, will be sufficiently cooled even if there is a high load and a corresponding high heat build-up. At the same time, the heat transfer medium is capable of absorbing temporarily occurring additional amounts of heat and of releasing them again once the load is back to normal, i.e. the electronic component 2s develops a normal amount of heat again. Peak thermal loads are thus avoided which usually clearly diminish the power of the electronic component and especially that of a microprocessor when conventional cooling devices are used. Consequently, the inventive cooling device also allows an increase in power of the cooled components.
Avoiding damaging peak heat loads will furthermore increase the working life and the 30 operativeness of the electronic components cooled by means of the cooling device of the invention. Since the phase change material used as a heat transfer medium will retain its solid state of aggregation also during heat absorption, there will advantageously not be any problems due to an expansion of the phase change material, as opposed to what is always the case with known materials.
In an advantageous embodiment of the cooling device of the invention, the heat s transfer medium consists of salts or salt mixtures enriched with organic substances as well as of substances in the form of fine metallic powders for improving the thermo-conducting capacity. Usually, the organic ingredient of the heat transfer medium is paraffin. A heat transfer medium of this kind will also retain its solid state of aggregation during heat absorption, and may thus be mounted in the form of a io tablet or pellet and/or as a solid body within andlor on said cooling element. This will allow said cooling device to be manufactured economically, on the one hand, and, on the other hand, it will ensure that it can be kept small in size. Moreover, it is possible according to the invention to individually adjust the heat transfer medium to the required operational temperatures for cooling the electronic components. Such is adjustment is done by varying the kind and amount of the ingredients of the heat transfer medium. In particular, it is also possible to adjust the amount of heat to be buffered by the heat transfer medium. Moreover, another advantage of said heat transfer medium is that it is non-toxic as well as recyclable.
2o In an advantageous embodiment of the cooling device of the invention, the passive cooling element includes at least one active cooling element, in particular a fan. This will advantageously ensure a further increase of the cooling power of the cooling device.
2s In yet another advantageous embodiment of the cooling device of the invention, the heat transfer medium is accommodated in a container made of thermo-conducting material, said container contacting said passive cooling element. Providing said heat transfer medium within a container will allow easy replacement of the individual heat transfer elements mounted within or on said passive cooling element.
In yet another advantageous embodiment of the cooling device of the invention, a thermo-conducting foil is provided between a contact surface of said passive cooling element and a corresponding contact surface of said electronic component. This measure will ensure that the total cooling power achieved by means of said cooling device is increased further by an optimized heat transfer from the electronic component to the passive cooling element.
The invention furthermore relates to a processor with a processor socket and at least one cooling device mounted on said processor, which cooling device includes at least one passive thermo-conducting cooling element, with at least part of said passive cooling element contacting at least one heat transfer medium which is in a solid state to of aggregation. In this case, the heat transfer medium is a phase change material (PCM) which has a much higher heat absorption capacity than water for example.
Moreover, said heat transfer medium has been designed as a latent heat accumulator so as to store the amount of heat generated by the load on the processor that can no longer be absorbed and carried off by the passive cooling element, at the same time is retaining its solid state of aggregation, and to release said heat again at a time when there is a smaller load on the processor.
The invention furthermore relates to the use of a heat transfer medium, which is in a solid state of aggregation, for cooling microprocessors, said heat transfer medium 2o being a phase change material (PCM) that has a much higher heat absorption capacity than water and has been designed as a latent heat accumulator. The heat transfer medium will store the amount of heat generated by the load on the microprocessor, at the same time retaining its solid state of aggregation, and release said heat again at a time when the load on the microprocessor is smaller.
Further details, features and advantages of the present invention may be gathered from an embodiment shown in the attached drawings, of which:
Fig. 1 is a schematic sectional view of a cooling device of the invention;
Fig. 2 is a schematic top view of the cooling device of the invention as shown in Fig.
1; and Fig. 3 is a schematic lateral view of the cooling device of the invention as shown in Fig. 1.
s Figure 1 is a sectional view of a cooling device 10 for cooling electronic components, in particular for cooling microprocessors. Said cooling device 10 comprises a passive thermo-conducting cooling element 12, which cooling element 12 consists of a plurality of cooling ribs or fins 14. Said cooling ribs or fins 14 are mounted on a bottom element 16 of said cooling element 12. On the side opposing said cooling ribs io or fins 14, said bottom element 16 exhibits a contact surface 18 which contacts the electronic component intended to be cooled.
The passive cooling element 12 is made of aluminum or an aluminum alloy, and is usually a single piece. It can be seen in this drawing that plural heat transfer media is 20 are provided between the cooling ribs or fins 14 within said cooling element 12.
Said heat transfer media 20 are in a solid state of aggregation and in thermo-conducting contact with said cooling ribs or fins 14 and said bottom element 16 or said cooling element 12, resp. In this case, the heat transfer medium is a phase change material which has a much higher heat absorption capacity than water, for 2o example. Since the heat transfer medium is in a solid state of aggregation which it will also retain during heat absorption, it will not be necessary to provide the heat transfer medium 20 or the cooling element 12 with sealing properties.
Supporting the individual heat transfer media 20 within said passive cooling element 12 will suffice.
Said heat transfer medium is moreover provided in the form of a PCM device so as to 2s cause said heat transfer medium 20 to store the thermal energy generated by the load on the electronic component that can no longer be absorbed and carried off by the passive cooling element 18, at the same time retaining its solid state of aggregation, and to release said heat again at a time when the load on the electronic component is lower.
Figure 2 is a schematic top view of the cooling device 10 according to Figure 1. This drawing shows the arrangement of the individual heat transfer media 20 between the individual cooling ribs or fins 14 of said cooling element 12.
s Figure 3 is a lateral view of the cooling device according to Figure 1. This drawing shows that said cooling element 12 includes attachment means 22, at the area of said bottom element 16 and on its sides, for attaching said cooling device 10 together with the electronic component to be cooled. Furthermore, one can see that, in the embodiment illustrated, the heat transfer media 20 are provided in the form of disks.
io However, the size and shape of said heat transfer media 20 may be chosen at random. The size and the number of said heat transfer media 20 will allow, amongst other things, the adjustment of the required operational temperatures for the respective electronic components intended to be cooled.
Claims (13)
What is claimed is:
1. A cooling device for electronic components, in particular for cooling microprocessors, which has at least one passive thermo-conducting cooling element (12) characterized in that at least part of said passive cooling element (12) contacts at least one heat transfer medium (20) which is in a solid state of aggregation, which heat transfer medium (20) is a phase change material (PCM) that has a much higher heat absorption capacity than water and that has been designed as a latent heat accumulator, which heat transfer medium (20) will store the amount of heat generated by the load on the electronic component that can no longer be absorbed and carried off by said passive cooling element (2), at the same time retaining its solid state of aggregation, and release said heat again at a time when the load on said electronic component is lower.
2. The cooling device as claimed in claim 1 characterized in that said heat transfer medium (20) consists of inorganic salts or salt mixtures enriched with organic substances, as well as of substances in the form of fine metallic powders for improving the conducting capacity.
3. The cooling device as claimed in claim 2 characterized in that said organic ingredient of said heat transfer medium (20) is paraffin.
4. The cooling device as claimed in one of the preceding claims characterized in that said heat transfer medium (20) can be adjusted to the required operational temperatures.
5. The cooling device as claimed in one of the preceding claims characterized in that said heat transfer medium (20) is provided within and/or on said cooling element (12) in the form of a tablet or pellet and/or as a solid body.
6. The cooling device as claimed in one of the preceding claims characterized in that said heat transfer medium (20) is non-toxic as well as recyclable.
7. The cooling device as claimed in one of the preceding claims characterized in that said passive cooling element (12) is made of aluminum or of an aluminum alloy.
8. The cooling device as claimed in one of the preceding claims characterized in that at least one active cooling element is provided on said passive cooling element (12).
9. The cooling device as claimed in claim 8 characterized in that said active cooling element is a fan.
10. The cooling device as claimed in one of the preceding claims characterized in that said heat transfer medium (20) is accommodated in a container of thermo-conducting material, said container contacting said passive cooling element (12).
11. The cooling device as claimed in one of the preceding claims characterized in that a thermo-conducting foil is provided between one contact surface (18) of said passive cooling element (12) and a corresponding contact surface of said electronic component.
12. A processor with a processor socket and at least one cooling device mounted on said processor characterized in that said cooling device (10) includes at least one passive thermo-conducting cooling element (12), with at least part of said passive cooling element (12) contacting at least one heat transfer medium (20) which is in a solid state of aggregation, said heat transfer medium (20) being a phase change material (PCM) which has a much higher heat absorption capacity than water, and which is designed as a latent heat accumulator, which heat transfer medium (20) will store the amount of heat generated by the load on the processor that can no longer be absorbed and carried off by the passive cooling element (18), at the same time retaining its solid state of aggregation, and release said heat again at a time when the load on the processor is lower.
13. Use of a heat transfer medium, which is in a solid state of aggregation, for cooling microprocessors, said heat transfer medium being a phase change material (PCM) which has a much higher heat absorption capacity than water, and which is designed as a latent heat accumulator, which heat transfer medium will store the amount of heat generated by the load on the microprocessor, at the same time retaining its solid state of aggregation, and release said heat again at a time when the load on the processor is lower.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10012990.0 | 2000-03-16 | ||
| DE2000112990 DE10012990A1 (en) | 2000-03-16 | 2000-03-16 | Cooling device for electronic components has latent heat store for heat from electronic component that can no longer be absorbed by passive cooling element |
| PCT/EP2001/002631 WO2001069360A1 (en) | 2000-03-16 | 2001-03-08 | Cooling device for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2374008A1 true CA2374008A1 (en) | 2001-09-20 |
Family
ID=7635072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002374008A Abandoned CA2374008A1 (en) | 2000-03-16 | 2001-03-08 | Cooling device for electronic components |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1198745A1 (en) |
| JP (1) | JP2003527753A (en) |
| CN (1) | CN1364251A (en) |
| CA (1) | CA2374008A1 (en) |
| DE (1) | DE10012990A1 (en) |
| TW (1) | TW499749B (en) |
| WO (1) | WO2001069360A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7184265B2 (en) | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
| US7188484B2 (en) | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
| CN102548355B (en) * | 2010-12-31 | 2015-04-29 | 联想(北京)有限公司 | Electronic equipment |
| TWI484089B (en) * | 2012-03-22 | 2015-05-11 | Univ Nat Cheng Kung | Module structure of smart solar window and curtain |
| KR102104919B1 (en) | 2013-02-05 | 2020-04-27 | 삼성전자주식회사 | Semiconductor package and method of manufacturing the same |
| DE102013204473A1 (en) | 2013-03-14 | 2014-09-18 | Robert Bosch Gmbh | Cooling arrangement for a control unit |
| US10597286B2 (en) * | 2017-08-01 | 2020-03-24 | Analog Devices Global | Monolithic phase change heat sink |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9505069D0 (en) * | 1995-03-14 | 1995-05-03 | Barr & Stroud Ltd | Heat sink |
| US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
-
2000
- 2000-03-16 DE DE2000112990 patent/DE10012990A1/en not_active Withdrawn
-
2001
- 2001-03-08 JP JP2001568171A patent/JP2003527753A/en not_active Withdrawn
- 2001-03-08 EP EP01913851A patent/EP1198745A1/en not_active Withdrawn
- 2001-03-08 CN CN 01800534 patent/CN1364251A/en active Pending
- 2001-03-08 CA CA002374008A patent/CA2374008A1/en not_active Abandoned
- 2001-03-08 WO PCT/EP2001/002631 patent/WO2001069360A1/en not_active Application Discontinuation
- 2001-04-09 TW TW90106088A patent/TW499749B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE10012990A1 (en) | 2001-10-11 |
| EP1198745A1 (en) | 2002-04-24 |
| WO2001069360A1 (en) | 2001-09-20 |
| TW499749B (en) | 2002-08-21 |
| JP2003527753A (en) | 2003-09-16 |
| CN1364251A (en) | 2002-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |