TW502102B - Thermal transfer devices - Google Patents

Thermal transfer devices Download PDF

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Publication number
TW502102B
TW502102B TW090125549A TW90125549A TW502102B TW 502102 B TW502102 B TW 502102B TW 090125549 A TW090125549 A TW 090125549A TW 90125549 A TW90125549 A TW 90125549A TW 502102 B TW502102 B TW 502102B
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TW
Taiwan
Prior art keywords
heat transfer
transfer device
scope
item
patent application
Prior art date
Application number
TW090125549A
Other languages
Chinese (zh)
Inventor
James Patrick Flint
Nancy F Dean
Original Assignee
Honeywell Int Inc
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Publication of TW502102B publication Critical patent/TW502102B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a composition which includes a polymer base matrix having a thermally conductive filler material dispersed therein. The housing can have a thermal conductivity of at least about 10 W/mK. The device can include a wick comprising woven carbon fibers.

Description

技術範圊_ 本發明係關於熱傳裝置，其包括熱管及蒸氣室。 發明背景_ 可參考圖1說明熱傳裝置實例。明確地說，圖1顯示結構 10，其含產生熱之組件12，散熱片14，及可以自組件12將 熱能轉移至散熱片14之熱傳裝置16。組件12可包含，例如 ’半導體結構’例 >，積體電路晶片。若未提供適合之冷 卻機構接近該組件以利熱散逸，則積體電路晶片或其它產 生熱之組件會發生問題。例如，若熱並未自該組件適合散 逸：熱能會積聚在該組件内，其程度可破壞部份該組件， 且最後致使該組件不能操作。 熱傳裝置16能夠有效地將熱自該產生熱之組㈣傳至散 熱片14。熱傳裝置16可包含，例如，$氣室。可以使裝置 ⑽組件U直接物理接觸，《，如圖示，或可以經由敎傳 導性界面材質18與組件12分隔。#面材質18可包含，例如 ，gelvet™材質（其係經由HoneyweU Internati嶋丨公 供）。 散熱片14可散發自裝置16轉移之熱，因此可以自组件12 各種熱傳導性材質(例如’金屬或熱傳導 :料，包括具高熱傳導性之塑膠)形成散熱片14。金 屬貫例包括銅與铭，且在特定應用方面，該金屬可包含呈 銅及鋁其中一種或兩種之合金。 /、 置16連^ 讀片⑽界面15處與裝 結構1 0係以橫斷面顯示在圖2中 以說明熱傳裝置16之操 -4-Technical Example _ The present invention relates to a heat transfer device, which includes a heat pipe and a steam chamber. BACKGROUND OF THE INVENTION An example of a heat transfer device can be described with reference to FIG. 1. Specifically, FIG. 1 shows a structure 10 that includes a heat generating component 12, a heat sink 14, and a heat transfer device 16 that can transfer thermal energy from the component 12 to the heat sink 14. The module 12 may include, for example, a "semiconductor structure" example, an integrated circuit wafer. If a suitable cooling mechanism is not provided to access the module to facilitate heat dissipation, problems may occur with integrated circuit chips or other heat-generating components. For example, if heat is not suitable for dissipation from the component: thermal energy will accumulate in the component to the extent that it can destroy part of the component and eventually render the component inoperable. The heat transfer device 16 is capable of efficiently transferring heat from the heat generating group to the heat sink 14. The heat transfer device 16 may include, for example, an air chamber. The device ⑽ component U can be brought into direct physical contact, as shown in the figure, or can be separated from the component 12 by the 敎 conductive interface material 18. # 面 材料 18 may include, for example, gelvet ™ material (provided by HoneyweU Internati 嶋 丨). The heat sink 14 can dissipate the heat transferred from the device 16, so the heat sink 14 can be formed from various thermally conductive materials of the component 12 (for example, a metal or a thermally conductive material, including a plastic with high thermal conductivity). Examples of metal include copper and copper, and for specific applications, the metal may include an alloy of one or both of copper and aluminum. / 、 Set 16th connection ^ The reader and the interface 15 at the interface 15 Structure 10 is shown in cross section in Figure 2 to explain the operation of the heat transfer device 16 -4-

裝 訂Binding

k 502102 A7 __ B7 五發明説明（~~ _ 作方面。裝置16包含包圍室22之外殼2〇。室22與空氣隔絕 ’且通常具有比維持於其内之常壓還小之壓力。芯24在室 22内延伸，且在該顯示之具體實例中，其係沿著外殼2〇之 内表面延伸。芯2 4可含有，例如，多個微粒以適合方法與 外设2 0黏結。在典型的結構中，外殼2 〇含有一種熱傳導性 金屬’例如’銅或銅合金，而芯2 4含有熱傳導性金屬顆粒 (例如’銅顆粒或燒結銅顆粒），在進行該燒結過程時，這 些金屬顆粒可以與外殼2 〇黏結。芯2 4包含粗糙表面2 6。最 後使用表面26以使室22内之流體可進行毛細流動。可經由 其它能夠產生毛細流動之結構取代芯24。例如，可經由在 外殼20之内表面中所形成之凹槽及裂隙以取代芯24。或許 ’可經由室22内所提供之篩或其它篩目取代芯24。 提供一種流體在室22内，並使用該流體以快速轉移熱能 通過熱傳裝置1 6。該流體通稱為該裝置之“操作流體，，。裝 置16包含相當溫熱區28接近組件12，及相當冷卻區30接近 散熱片14。可選擇室22内之條件（明確地說，係指室22内 之壓力，及該操作流體之化學性質）致使該操作流體可以 自溫熱區28蒸發，並於冷卻區3〇凝結。該蒸發流體由箭頭 32圖示，且該凝結流體係由箭頭34圖示。箭頭34亦顯示沿 著芯24之表面26自該熱傳裝置16之該冷卻器部份30返回該 加熱器部份28之該欲被芯吸之流體。自溫熱部份28使該流 體蒸發可以自組件12傳熱至該流體，且，該流體於冷卻部 份30進行之冷凝作用可以將得自該流體之熱轉移至該散熱 片14，該熱可以自其逸散入包圍散熱片14之空氣中。可以 -5- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)k 502102 A7 __ B7 Fifth invention description (~~ _ working aspect. The device 16 includes a housing 20 surrounding the chamber 22. The chamber 22 is isolated from the air 'and usually has a pressure lower than the normal pressure maintained therein. Core 24 Extending within the chamber 22, and in the specific example shown, it extends along the inner surface of the housing 20. The core 24 may contain, for example, a plurality of particles to adhere to the peripheral device 20 in a suitable manner. In a typical In the structure, the outer shell 20 contains a thermally conductive metal such as' copper or copper alloy, and the core 24 contains thermally conductive metal particles such as' copper particles or sintered copper particles. 'During the sintering process, these metal particles It can be bonded to the housing 20. The core 24 contains a rough surface 26. Finally, the surface 26 is used to allow capillary flow of the fluid in the chamber 22. The core 24 can be replaced by other structures capable of generating capillary flow. For example, Grooves and fissures formed in the inner surface of the housing 20 to replace the core 24. Perhaps the core 24 may be replaced by a sieve or other mesh provided in the chamber 22. A fluid is provided in the chamber 22, and the fluid is used to fast The heat transfer energy passes through the heat transfer device 16. The fluid is commonly referred to as the "operating fluid" of the device. The device 16 includes a relatively warm area 28 close to the module 12, and a relatively cool area 30 close to the fins 14. The inside of the chamber 22 can be selected Conditions (specifically, the pressure in the chamber 22 and the chemical nature of the operating fluid) cause the operating fluid to evaporate from the warm zone 28 and condense in the cooling zone 30. The evaporated fluid is illustrated by arrow 32 And the condensing flow system is illustrated by arrow 34. Arrow 34 also shows the wicking of the heat transfer device 16 from the cooler portion 30 of the heat transfer device 16 to the heater portion 28 along the surface 26 of the core 24 Fluid. The self-warming portion 28 causes the fluid to evaporate to transfer heat from the component 12 to the fluid, and the condensation of the fluid in the cooling portion 30 can transfer the heat from the fluid to the heat sink 14, The heat can escape from the air into the air surrounding the heat sink 14. The size of this paper applies to China National Standard (CNS) A4 (210X 297 mm)

在各種熱傳裝 水。 置内使用許多操作流體 通常使用之流體為 參考圖2所、+、> _ 之組件H 術可充份應用以有效冷卻產生熱 費產品口 ，通常將產生熱之半導體裝置併入可攜帶消 產生:\ 〇，手機及手提式電腦）内。通常較佳可提供該 重-二：件之冷卻機構，然:而卻可避免與散熱片有關之 、才、tl·插2、及/肖耗能源之問題。可以將參考圖1及圖2所描 二:、傳結構併人此種可攜帶消費產⑼，且可以構成 :"、有效性及相當小型的冷卻機構 '然而，在將參考圖i 圖2所述此種冷卻裝置利用在可攜帶式消費產品時，較 二’1Λ此種裝置之重量及成本。冷卻裝置的另-項應用 :、較佳減少該裝置之重量及成本）為空間技術。明確地 =，冷部裝置通常使用在人造衛星構造中，且較佳發展相 备輕I的新冷卻裝置，且此種裝置更佳具相當低成本。 =3係說明顯示具有與圖丨及圖2裝置16不同之構形之熱 傳裝置42之結構4〇。所說明該圖3之裝置42係被提供在產 生熱之組件44與熱逸散組件46之間。產生熱之組件料可包 含’例如’積體電路晶片，而熱逸散組件46可包含，例如 ’散熱片或熱槽。 熱傳裝置42係呈管路形狀，且其包含一個包圍室5〇之外 殼48。外殼48通常包含一種熱傳導性金屬材質，例如，銅 或銅合金。芯52係沿著該室50之内壁延伸。芯52可包含， 例如’篩或其它篩目，且在尤佳具體實例中，可包含一種 銅筛。室50可以與周圍大氣隔絕，並提供操作流體在該室 -6 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 502102 發明説明（ 内。該操作流體係自接近組件44處蒸發，然後凝結在接近 組件46之區域。提供箭頭53以顯示該管路内向上朝組件α 移動之該操作流體蒸汽，而另一個箭號54係顯示沿著芯W 返回接近產生熱之組件44之㈣域之該已冷凝流體。熱傳 裝置42通稱為熱管，而該熱傳裝置16通稱為蒸汽室。 先前參考圖1及圖2該熱傳裝置所描述之所要特性亦適用 於圖3該熱傳裝置42。明確地說，較佳發展具有該裝置42 構形之裝置’且與現有結構比較，其重量相當冑，而且較 佳其製造成本相當低。 發明概述 本發明一方面係關於一種熱傳裝置。該裝置包括一種可 限定至少部份室（其與大氣隔絕）之外殼。該裝置亦包括該 室内所含之操作流體。該外殼係由含聚合物基質（其具有 熱傳導性填料分散於其中）之組合物製成。 本發明另一方面係關係於一種含導熱度至少约丨〇瓦/公 尺-飢氏溫度之外殼之熱傳裝置；且該外殼含有一種聚合 物0 本發明又另一方面係關於一種含芯（其含有織造碳纖維） 之熱傳裝置。 附圖簡述 參考以下附圖說明本發明較佳具體實例。 圖1為先前技藝熱傳結構之側視圖。 圖2為該圖1結構之橫斷面圖。 圖3為第二先前技藝熱傳結構之局部斷面圖。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) A7Load water in various heat transfers. Many operating fluids are used in the equipment. The fluids commonly used are the components shown in Figure 2, +, & _. The technology can be fully applied to effectively cool the heat generating products. Generally, the heat-generating semiconductor devices are incorporated into the portable consumer electronics. Generated: \ 〇, mobile phones and laptops). Usually it is better to provide the cooling mechanism of this weight-two: however, it can avoid the problems related to the heat sink, energy, tl, 2, and / or energy consumption. It can be described with reference to Figures 1 and 2: Second, the portable structure of this type of portable consumer product, and can constitute: ", effectiveness and a relatively small cooling mechanism 'However, in reference to Figure i Figure 2 Such a cooling device is used in a portable consumer product, which is more weight and cost than two such devices. Another application of cooling device: it is better to reduce the weight and cost of the device) is space technology. It is clear that the cold part device is usually used in the satellite structure, and it is better to develop a new cooling device with a lighter weight, and such a device is better and has a relatively low cost. = 3 indicates that the structure 40 of the heat transfer device 42 having a configuration different from that of the device 16 in FIGS. 丨 and 2 is shown. The illustrated device 42 of FIG. 3 is provided between a heat generating component 44 and a heat dissipation component 46. The heat generating component material may include 'e.g.' an integrated circuit wafer, and the heat dissipation component 46 may include, e.g., 'a heat sink or a heat sink. The heat transfer device 42 is in the shape of a pipe and includes a casing 48 surrounding the chamber 50. The housing 48 typically comprises a thermally conductive metal material, such as copper or a copper alloy. The core 52 extends along the inner wall of the chamber 50. The core 52 may include, for example, a ' sieve or other mesh, and in a particularly preferred embodiment, may include a copper screen. The chamber 50 can be isolated from the surrounding atmosphere and provide operating fluid in the chamber-6-This paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 mm) 502102 Description of the invention (inside. The operating flow system self-closes to the components 44 evaporates and then condenses in the area close to the module 46. An arrow 53 is provided to show the operating fluid vapor moving upwards towards the module α in the pipe, and another arrow 54 shows the return along the core W to approach the heat generating The condensed fluid in the area of the module 44. The heat transfer device 42 is generally referred to as a heat pipe, and the heat transfer device 16 is generally referred to as a steam chamber. The desired characteristics previously described with reference to Figs. 3The heat transfer device 42. Specifically, it is preferable to develop a device having the configuration of the device 42 ', and compared with the existing structure, its weight is relatively heavy, and its manufacturing cost is preferably relatively low. SUMMARY OF THE INVENTION Regarding a heat transfer device, the device includes a housing that can define at least a part of the room (which is isolated from the atmosphere). The device also includes the operating fluid contained in the room. The housing is made of polymer-containing And a thermally conductive filler having a thermally conductive filler dispersed therein. Another aspect of the present invention relates to a heat transfer device containing a housing having a thermal conductivity of at least about 0 watts / meter-hunger temperature; and the The shell contains a polymer. The present invention, on the other hand, relates to a heat transfer device containing a core (which contains woven carbon fibers). Brief Description of the Drawings The preferred embodiment of the present invention will be described with reference to the following drawings. Side view of the transmission structure. Figure 2 is a cross-sectional view of the structure of Figure 1. Figure 3 is a partial cross-sectional view of the second prior art heat transfer structure. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) A7

圖4為本發明該熱傳裝置之橫斷面圖。 圖5為本發明方法包含之芯之俯視圖。 圖6為尽發明第二項具體實例熱傳裝置之橫斷面圖。 圖7為沿著該圖6線7-7之該圖6裝置之圖示。 體f例詳沭 本^明係關於將新材f併人熱傳裝置内之方法及新熱傳 ^置、’Ό構。本發明一方面係參考圖4之熱傳裝置丨〇〇說明。 衣置1〇〇包括一種可限定至少部份室1〇4之外殼1〇2 (在該 顯不具體實{列中，該外殼可限定全部所暴員丨室i 〇4部份）。 使室104與大氣隔絕。在該顯示具體實例中，外殼1〇2包含 於界面110處與第二部份1〇8連接之第一部份1〇6。第一部 份106及第二部份108較佳含有具傳導性填料分散於其中之 永合物基質。第一部份1〇6及第二部份1〇8之該聚合物基質 可含有熱塑性塑膠，且更明確地說，可包含一或多種聚丙 烯，液晶聚合物，及聚苯硫醚。該熱傳導性填料可含有， 例如’金屬粉末或纖維，及/或碳粉末或纖維。在一項較 佳具體貫例中’該熱傳導性填料之碳纖維係以約丨〇體積0/〇 至約45體積％ (更佳為約3〇體積Q/❶至約4〇體積％)濃度提供 在聚合物基質内。外殼丨02内所使用之聚合物基質及傳導 性填料之組合物較佳具至少約丨〇瓦/公尺-凱氏溫度 (10 W/mK)之通過平面導熱度，且更佳具至少15 w/mK通 過平面導熱度。在一項特定具體實例中，已發現含聚丙烯 之外殼（其所含之碳纖維以約40體積％濃度分散於其中）之 導熱度至少約19 W/mK。 — -8- I紙張尺度適用中國國家標準(CNS) A4規格(21〇 X 297公爱)FIG. 4 is a cross-sectional view of the heat transfer device of the present invention. FIG. 5 is a top view of a core included in the method of the present invention. 6 is a cross-sectional view of a heat transfer device according to a second specific example of the invention. FIG. 7 is an illustration of the device of FIG. 6 along line 7-7 of FIG. 6. Examples of system f are detailed in this article about the method of incorporating new material f into a human heat transfer device and the new heat transfer device. One aspect of the present invention is described with reference to the heat transfer device of FIG. 4. The garment unit 100 includes an outer shell 102 that can define at least a portion of the chamber 104 (in the manifestation {column, the outer shell can define the entire room of the rioter 〇4). The chamber 104 is isolated from the atmosphere. In the specific example of the display, the housing 102 includes a first part 106 connected to the second part 108 at the interface 110. The first part 106 and the second part 108 preferably contain a permanent compound matrix in which a conductive filler is dispersed. The polymer matrix of the first part 106 and the second part 108 may contain a thermoplastic, and more specifically, may include one or more polypropylene, liquid crystal polymer, and polyphenylene sulfide. The thermally conductive filler may contain, for example, a 'metal powder or fiber, and / or a carbon powder or fiber. In a preferred embodiment, the carbon fibers of the thermally conductive filler are provided at a concentration of about 0 vol./0 to about 45 vol.% (More preferably about 30 vol.Q / ❶ to about 40 vol.%). Within the polymer matrix. The composition of the polymer matrix and the conductive filler used in the housing 02 preferably has a through-plane thermal conductivity of at least about 0 watts / meter-Kelvin temperature (10 W / mK), and more preferably at least 15 w / mK thermal conductivity through the plane. In a specific embodiment, it has been found that a polypropylene-containing shell, which contains carbon fibers dispersed therein at a concentration of about 40% by volume, has a thermal conductivity of at least about 19 W / mK. — -8- I paper size applies Chinese National Standard (CNS) A4 specification (21〇 X 297 public love)

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502102502102

除了垓上述聚合材質外，外殼丨〇2可含有金屬基質複合 材料。在具體實例中，外殼1〇2可包含一或多種銅/碳複合 材料鋼/鎢複合材料，銅/碳化碎複合材料，及铭/碳化石夕 複合材料，或由其組成，或本質上由上述材料組成。而且 ’外设102可含有熱膨脹係數小於約12 ppm厂C之材料，或 本質上由其組成；且在特定具體實例中，外殼102可含有 熱膨脹係數小於約10 ppmrc之材料，或由其組成，或本 i上由其組成。 可以由’例如，射出成形法或其它熱成形法形成外殼 102之部份106及1〇8。可經由提供適合黏著劑於界面11〇處 以使部份106及108連接在一起，其中黏著劑為環氧物。或 者，可經由任一種不同焊接技術（其包括，例如，超音速 焊接法）連接部份106及Γ〇8。在該顯示具體實例中，雖然 4伤1 0 6及1 〇 8彼此相同，但是必需瞭解本發明包括其它具 體實例（圖中未顯示），其中部份1〇6及丨〇8因為彼此形狀不 同及/或化學組成不同而互相不同。而且，雖然該顯示具 體實例包含一種由兩種分離部份互相連接所形成之外殼， 但是必需瞭解本發明包括其它具體實例，其中該外殼包括 超過兩種分離部份連接在一起，且尚包括由，例如，該外 殼之實體經射出成形所形成之該外殼之單一單位結構。 提供芯112在室104内’且亦提供操作流體（圖中未顯示） 在該室内。在該顯示具體實例中，芯1 1 2係沿著室1 04之内 壁延伸以將該室分成第一區114 (該蒸發器）及第二區n6 (該冷凝器）。芯1 12較佳能透過該操作流體，因此該操作 -9- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）In addition to the above-mentioned polymeric materials, the outer shell 02 may contain a metal matrix composite material. In a specific example, the housing 102 may comprise or consist of one or more copper / carbon composite materials steel / tungsten composite materials, copper / carbonized composite materials, and Ming / carbide stone composite materials. Composition of the above materials. Moreover, the peripheral device 102 may contain or consist essentially of a material with a thermal expansion coefficient of less than about 12 ppm; and, in a specific embodiment, the housing 102 may contain or consist of a material with a thermal expansion coefficient of less than about 10 ppmrc, Or this i consists of it. The portions 106 and 108 of the housing 102 may be formed by, for example, injection molding or other thermoforming. The parts 106 and 108 can be connected together by providing a suitable adhesive at the interface 110, wherein the adhesive is an epoxy. Alternatively, the portions 106 and Γ〇8 may be connected via any of a variety of welding techniques including, for example, supersonic welding. In this display example, although the four wounds 106 and 10 are the same as each other, it must be understood that the present invention includes other specific examples (not shown in the figure), of which some 106 and 008 are different in shape from each other. And / or different chemical compositions. Moreover, although the specific embodiment shown includes a shell formed by connecting two separate parts to each other, it must be understood that the present invention includes other specific examples in which the shell includes more than two separate parts connected together and includes For example, the shell's single unit structure is formed by injection molding. A core 112 is provided within the chamber 104 'and an operating fluid (not shown) is also provided within the chamber. In the specific example shown, the core 1 12 extends along the inner wall of the chamber 104 to divide the chamber into a first zone 114 (the evaporator) and a second zone n6 (the condenser). Core 1 12 is better able to pass through the operating fluid, so this operation -9- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

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502102 A7 B7 五、發明説明（7 ) 流體可以在芯1 1 2内通至該操作流體已蒸發之區域。雖然 所顯示該芯1 1 2係沿著室1 〇 4内壁延伸，但是應該瞭解。< 以在本發明方法中採用其它芯構形，其包括，例如，參考 圖2所述如芯24型之芯結構。然而，本發明之較佳芯結構 是一種排列在如圖示該室之内側蒸發器内壁之材料。此外 ，雖然所顯示該芯係沿著該室内側之底部及該室内側之側 壁延伸，應該瞭解本發明包括其它具體實例，其中該芯係 以其它構形延伸。例如，該芯只沿著其中一個側壁延伸之 具體實例，或該芯並未沿著該側壁側一側延伸之具體實例 ，或該芯排列在該室之頂部。 芯112較佳具有大毛細抽吸能力以使該芯能有效以和引 力相反之方向抽吸操作流體。此種抽吸能力在下述應用方 面尤其重要，尤其在可攜帶式消費裝置中使用熱傳裝置 100之應用，因為在操作該裝置時，此種裝置通常以相對 於引力之許多方向旋轉。 芯1 12之較佳材料為具有圖5所示構形之織造碳纖維^ ^ 碳纖維主要由第一組纖維120 (其主要係沿著第一軸“Y’’延 伸）及第二組碳纖維122 (其主要係沿著第二軸“X”延伸）組 成。該第二軸“X”實質上與該第一軸“γ”垂直。雖然該第 二軸被認為“實質上，，與該第一軸垂直，但是應該暸解’ 於該織造物之拉伸性及/或壓縮性，織造物之織绞式樣之 垂直性可以有變異。而且，被形容為分別“主要，，沿著第 及第二軸延伸之該第一及第二組纖維可顯示該第一及第/ 組之許多束狀纖維，且其可包括相對於該第一及第二軸之 -10- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 502102 A7 B7 五、發明説明（8 ) 多取向，而且該第一及第二組纖維之一般方向係分別沿著 該第一及第二軸。圖5中所示之該織紋式樣可稱為“平織 紋”式樣。應該瞭解其係為一種織紋式樣實例，且可以在 本發明織造芯中採用其它織紋式樣。 芯1 1 2所使用之該碳纖維可以是，例如，所謂瀝青碳纖 維或所謂聚丙烯腈（PAN)碳纖維。該名辭“瀝青碳纖維”係 指最初含瀝青於其上之碳纖維，且其係自該瀝青之石墨化 形成；該名辭“聚丙烯腈碳纖維”係指最初含丙烯酸纖維之 碳纖維，且其自該丙烯酸之石墨化形成。瀝青碳纖維之實 例為在商業上購自BP Amoco之K-800X™纖維，EWC-300X™ 及EWC-600X™織物，及購自 BP Amoco之THORNEL™ T-300™ 或T-650™之PAN碳纖維。已發現當使用水作為操作流體時 ，PAN碳纖維可以比pitch碳纖維更容易沾濕，因此，在特 定應用方面，PAN碳纖維優於瀝青碳纖維。 使用碳纖維之織造織物，或碳纖維之其它結構（其中該 纖維係以多方向延伸）之優點為該纖維可以在整個室1 04之 間以多方向有效地芯吸操作流體。反之，若該纖維全部沿 著單一主要方向排列，該操作流體傾向於只在該單一方向 被芯吸，因此會在裝置100之間造成無效的傳熱。 雖然圖5該芯結構可以是一種較佳芯結構，但是應該瞭 解可以在本發明方法中使用其它芯結構。例如，另一種芯 結構實例可包含已黏著性附著於外殼1 02之碳纖維，例如 ，可經由使GELVET™沿著外殼102之内表面附著於該空穴 1 04而完成該黏著步驟。或者，可沿著室1 04之内表面塗敷 -11 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐） A7502102 A7 B7 V. Description of the invention (7) The fluid can pass through the core 1 12 to the area where the operating fluid has evaporated. Although the core 1 12 is shown to extend along the inner wall of the chamber 104, it should be understood. < To adopt other core configurations in the method of the present invention, including, for example, the core structure of the core type 24 as described with reference to FIG. 2. However, the preferred core structure of the present invention is a material arranged on the inner wall of the evaporator inside the chamber as shown. In addition, although the core system is shown to extend along the bottom of the interior side and the side wall of the interior side, it should be understood that the present invention includes other specific examples in which the core system extends in other configurations. For example, a specific example in which the core extends along only one of the side walls, or a specific example in which the core does not extend along one side of the side wall, or the core is arranged on the top of the chamber. The core 112 preferably has a large capillary suction capability so that the core can effectively suck the operating fluid in a direction opposite to gravity. This suction capability is particularly important in applications such as the use of the heat transfer device 100 in portable consumer devices, since such devices typically rotate in many directions relative to gravity when operating the device. The preferred material for the core 1 12 is a woven carbon fiber having the configuration shown in FIG. 5 ^ The carbon fiber is mainly composed of a first group of fibers 120 (which mainly extends along the first axis "Y") and a second group of carbon fibers 122 ( It is mainly composed along the second axis “X”). The second axis “X” is substantially perpendicular to the first axis “γ”. Although the second axis is considered to be “substantially,” the first axis The axis is vertical, but it should be understood that the verticality of the woven twist pattern of the woven fabric may vary depending on the stretchability and / or compressibility of the woven fabric. Moreover, it is described as "mainly, the first and second groups of fibers extending along the first and second axes may display a plurality of bundled fibers of the first and third groups, and they may include relative to the first First and second axis of -10- This paper size applies to Chinese National Standard (CNS) A4 specification (210X 297 mm) 502102 A7 B7 V. Description of the invention (8) Multi-orientation, and the first and second group of fibers The general directions are respectively along the first and second axes. The weave pattern shown in Figure 5 can be referred to as a "flat weave" pattern. It should be understood that it is an example of a weave pattern and can be woven in the present invention Other weave patterns are used in the core. The carbon fibers used in the core 1 12 may be, for example, so-called pitch carbon fibers or so-called polyacrylonitrile (PAN) carbon fibers. The term "asphalt carbon fibers" refers to the asphalt originally contained thereon Carbon fiber, and it is formed from the graphitization of the pitch; the term "polyacrylonitrile carbon fiber" refers to the carbon fiber that originally contains acrylic fibers, and it is formed from the graphitization of acrylic acid. Examples of pitch carbon fibers are commercially Purchased from BP Amo co-K-800X ™ fiber, EWC-300X ™ and EWC-600X ™ fabric, and THORNEL ™ T-300 ™ or T-650 ™ PAN carbon fiber purchased from BP Amoco. It has been found that when water is used as the operating fluid, PAN carbon fiber can be more easily wetted than pitch carbon fiber, so in certain applications, PAN carbon fiber is better than pitch carbon fiber. Woven fabrics using carbon fiber, or other structures of carbon fiber (where the fiber extends in multiple directions) have the advantage The fibers can effectively wick the operating fluid in multiple directions throughout the chamber 104. Conversely, if the fibers are all aligned in a single main direction, the operating fluid tends to be wicked only in that single direction and therefore will be in the device Ineffective heat transfer between 100. Although the core structure of FIG. 5 may be a better core structure, it should be understood that other core structures may be used in the method of the present invention. For example, another example of a core structure may include adhesive adhesion The carbon fiber on the housing 102 can be completed by, for example, attaching GELVET ™ to the cavity 104 along the inner surface of the housing 102. Alternatively, Chamber 104 of the surface is coated -11-- This applies China National Standard Paper Scale (CNS) A4 size (210 X 297 mm) the A7

且：經由，例⑯，使用電場將碳纖維推進該黏著 如 ^ ^纖維聚集在該黏著劑内。或者，可經由，例 使该外殼材料經加熱以軟化外殼1〇2之聚合材料，且 ，維可以直接聚集在該外殼材料内。在又另一項其它具 體汽例中，可以使用已包埋在外殼聚合物 =作為芯吸材料，其方法為溶解部份該聚合物 路该填料。 + 相對於其它芯吸材料（例如，銅顆粒或纖維），使用碳纖 維作為芯吸材料之優點為碳纖維比習用芯結構具有較低抗 熱11，因此比習用芯結構更能夠有效將熱散佈在裝置i⑽ 之整個蒸發表面上。可併入本發明裝置内之其它芯結構包 括金屬顆粒或篩；具有細孔及/或溝槽於其中之聚合物材 料；具有添加物於其中或塗屬於其上以改良濕潤性之聚合 物材料。在特定具體實例中，聚合物芯材料可以經熱傳導 性材料塗覆以改良對於該芯材料（及經過該芯材料）之熱傳 性。 …、、 在特定應用方面，可以製造參考圖5所述該種類之織造 材料芯’然後將其切成適合大小以便在形成外殼1〇2時， 放置在外殼1 02内。可以將該芯放置在該外殼1 〇2之部份 106與1〇8之間，然後使部份1〇6與1〇8互相黏著，或可以將 其放在射出成形裝置内，接著可以在該芯周圍形成外殼 102。 該外殼1 02之聚合物材料較佳對於提供於室1 〇4内之操作 流體以及大氣氣體不具滲透性。因此，可以在室1 04内維 -12- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 502102 五、發明説明And: via, for example, using an electric field to push the carbon fibers into the adhesive, such as ^ ^ fibers are gathered in the adhesive. Alternatively, for example, the shell material may be heated to soften the polymer material of the shell 102, and the dimensions may be directly gathered in the shell material. In yet another specific example, the polymer embedded in the shell can be used as a wicking material by dissolving part of the polymer and the filler. + Compared to other wicking materials (for example, copper particles or fibers), the advantage of using carbon fiber as a wicking material is that carbon fibers have lower heat resistance than conventional core structures11, so they can distribute heat more effectively to the device than conventional core structures i⑽ on the entire evaporation surface. Other core structures that can be incorporated into the device of the present invention include metal particles or sieves; polymer materials having pores and / or grooves therein; polymer materials having additives therein or coated thereon to improve wettability . In certain specific examples, the polymer core material may be coated with a thermally conductive material to improve heat transfer to the core material (and through the core material). ... For a specific application, a woven material core of the kind described with reference to FIG. 5 can be manufactured and then cut to a suitable size so as to be placed inside the housing 102 when the housing 102 is formed. The core can be placed between the parts 106 and 108 of the housing 102, and then the parts 106 and 108 can be adhered to each other, or it can be placed in an injection molding device, and then A shell 102 is formed around the core. The polymer material of the housing 102 is preferably impermeable to the operating fluid and atmospheric gas provided in the chamber 104. Therefore, it can be maintained in room 1 04 -12- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 502102 V. Description of the invention

持真空，而且亦可以將該操作流體滯留在室ι〇4内。牡播 外殼102^.材料對於該操作流體及大氣氣體其中之一或兩 者’非*透性不足之具體實例中，可以提供障壁層在外殼 1 02之内及/或外表面。此種障壁層可以包含，例如， MYLAR $金屬。根據該障壁層所使用之材料，可經 由，例如，噴霧法，浸漬法，電化學沈積法，及/或賤鑛 沈積法形成該障壁層。 必需瞭解外殻102可界定部份或全部該所示密封室104。 明確地。兄’必需瞭解一部份該室密封材料可以由不同於外 殼102中所使用之材質所形成。例如，該外殼102可界定且 有小孔於其：之室。可以使用該小孔以將操作流體插至該 至内X接著將該至内之真空抽出。然後以任何材料堵住 該小洞以防止該室内之操作流體及/或真空損《。而且， 必需瞭解本發明包括其中熱傳導性聚合物材料外殼只可界 定少部份(亦即少於一半)已密封室之具體實例，以及其中The vacuum can be maintained, and the operating fluid can be retained in the chamber ι04. In the specific example in which the material is not sufficiently impervious to one or both of the operating fluid and the atmospheric gas, a barrier layer may be provided inside and / or the outer surface of the casing 102. Such a barrier layer may contain, for example, MYLAR $ metal. Depending on the material used for the barrier layer, the barrier layer may be formed by, for example, a spray method, a dipping method, an electrochemical deposition method, and / or a base ore deposition method. It is important to understand that the enclosure 102 may define some or all of the illustrated sealed chamber 104. Clearly. It is important to understand that a part of the chamber sealing material may be formed of a material different from that used in the housing 102. For example, the housing 102 may define and have small holes in it: the chamber. The small hole can be used to insert the operating fluid into the to X and then vacuum out the to. The hole is then blocked with any material to prevent damage to the operating fluid and / or vacuum in the chamber. Moreover, it must be understood that the present invention includes specific examples in which the outer shell of the thermally conductive polymer material can only define a small portion (i.e., less than half) of the sealed chambers, and among which

該聚合物材料外殼可器t I 叶m界疋大部份，f質上全 75%該室之表面積，並小 八 已密封室。若㈣傳導性=:該+室表面區域)，或全部 …、1寻导ί生♦合物材料外殼只界定少部份 ，則該室之剩餘部份可以由其它材質形成，該材質包括， 導性聚合物材料(例如，不具有熱傳導性纖 合物材料)及金屬。較佳至少某部㈣ 面之熱膨脹係數與經由該熱傳裝 : ==類似’所以在溫度變化時，可以在該熱傳2 /、、、且件之間維持良好之物理接觸。 _____,13, 本紙張尺度適用巾國國家標準(CNS) Αϋ(2ι〇χ 297公楚了 裝 訂The polymer material can cover a large part of the surface, and the surface area is 75% of the surface area of the chamber, and the chamber is sealed. If ㈣ conductivity =: + the surface area of the chamber), or all ..., 1 The shell of the composite material defines only a small part, the remaining part of the chamber can be formed of other materials, the material includes, Conductive polymer materials (eg, materials without thermally conductive fibrils) and metals. It is preferable that the thermal expansion coefficient of at least a certain surface is similar to that through the heat transfer device: so when the temperature changes, a good physical contact can be maintained between the heat transfer 2 and the heat transfer member. _____, 13, This paper size applies the National Standard of the Chinese National Towel (CNS) Αϋ (2ι〇χ 297)

502102 A7 ____ B7 五、發明説明（1彳） 外殼1 02較佳具有足夠強度及硬度以保有所要形狀，同 時在室104内具有真空。若外殼102之材料缺乏可維持所要 形狀之足夠強度及硬度’可提供柱狀物（圖中未顯示）越過 該室之中央區以得到額外的結構支撐。此種可以延伸於芯 1 1 2之周圍或經過該芯1 1 2。 參考圖6 ’本發明另一種具體實例稱為結構丨5〇。結構 150包含包圍室154之外殼152。其中芯156係排列於至少部 份該室154之内壁。芯156可包含，例如，參考上述圖5之 該織造材料芯112。外殼152包含芯156周圍之單元結構， 且尚包含多個散熱片158。外殼152可以由與此等參考上述 外殼1 02 (圖4)所使用之相同聚合組合物形成，且可以經射 出成形製成該所示構形。自該外殼i 52之聚合物模製散熱 片158 ’並將散熱片158及外殼152併入單元結構之一項優 點為其可去除散熱片材料與外殼間之界面（例如，參考上 述圖1之該界面丨5)。散熱片與熱傳裝置間之該界面可損害 該裝置與該散熱片間之熱傳，因此，相對於先前技藝結構 ’將該散熱片及外殼152併入單元結構内可改良結構15()内 之熱傳效率。 雖然該圖6結構顯示散熱片158在其外殼152總體之單元 結構内’但是應該瞭解本發明包括其它具體實例，其中散 熱片1 58係存在於只具有部份外殼之單元結構内。例如， 本發明包括一項具體實例（圖中未顯示），其中散熱片1 5 8 係併存於圖4結構中只具有該外殼構件部份1〇6及ι〇8其中 一種之單元結構内。 本紙張尺度適财關紐巧Ns)織格(摩挪公爱）502102 A7 ____ B7 V. Description of the invention (1 彳) The housing 10 02 preferably has sufficient strength and hardness to maintain a desired shape, and at the same time, a vacuum is provided in the chamber 104. If the material of the housing 102 lacks sufficient strength and rigidity to maintain the desired shape, columns (not shown) can be provided across the central area of the chamber for additional structural support. This type can extend around or through the core 1 1 2. Referring to FIG. 6 ', another specific example of the present invention is called a structure 50. The structure 150 includes a housing 152 surrounding the chamber 154. The core 156 is arranged on at least part of the inner wall of the chamber 154. The core 156 may include, for example, the woven material core 112 of FIG. 5 described above. The housing 152 includes a unit structure around the core 156 and further includes a plurality of heat sinks 158. The housing 152 may be formed of the same polymeric composition as those used with reference to the above-mentioned housing 102 (Fig. 4), and may be injection-molded to form the illustrated configuration. One advantage of molding the heat sink 158 ′ from the polymer of the housing i 52 and incorporating the heat sink 158 and the housing 152 into the unit structure is that it can remove the interface between the heat sink material and the housing (for example, refer to FIG. 1 above). This interface 5). The interface between the heat sink and the heat transfer device can impair the heat transfer between the device and the heat sink. Therefore, compared to the prior art structure, 'incorporating the heat sink and the housing 152 into the unit structure can improve the structure 15 (). Heat transfer efficiency. Although the structure of FIG. 6 shows that the heat sink 158 is within the overall unit structure of its housing 152, it should be understood that the present invention includes other specific examples, in which the heat sink 158 exists in the unit structure having only a part of the housing. For example, the present invention includes a specific example (not shown in the figure), in which the fins 158 coexist in a unit structure having only one of the shell member portions 106 and ι 08 in the structure of FIG. 4. This paper is suitable for wealth and wealth (Ns)

装 訂Binding

k- 502102 A7 B7 五、發明説明（12 ) 圖7表示該圖6裝置沿著該線7-7之圖示。此種圖示係說 明延伸經過室154總體（圖6)之芯156。更詳細地說，所說 明外殼152包含側壁160，162，164及166，且所說明芯156 係自側壁1 60延伸至對側側壁1 64，以及自側壁1 62延伸至 對側側壁1 66。雖然所說明之芯1 56包含簡單的平面結構， 但是應該瞭解芯156可含有參考圖5所述該織造材料種類作 為材質112。 所說明該圖4-7之熱傳裝置可作為真空室結構，且通常 含有圖7所述該種類之直角形狀。然而，必需瞭解可以將 本發明方法併至具有其它形狀之熱傳裝置（例如，加熱管） 内0 相對於該先前技藝裝置（例 π 1罔i岍返之裝置） ，本發明裝置之優點為本發明裝置比習用裝置明顯更輕之 重量，’圖m述該種類之先前技藝熱傳裝置⑽常 含大量銅或其它金屬’且每單位體積之密度為至少約3克/ 厘米，（克/厘米3)。反之，參考圖4所述作為裝置ι〇〇之該種 類熱傳裝置含有聚合材料(例如’塑料），因此，可以比， :前=構輕很多。例如’ 一般而t，具有圖4所㈣ :且本上明裝置實例之每單位體積密度為小於約(克/厘 在本rar體積之密度為，例如，約G·86克/厘米3。 材料模制應用方面’可以自存在於電裝置中之聚合 連積體晶片裝置之電…此種電=:括可滞留並電 料。在本發明特定應用方面，可遍亦包含聚合材 將該電路板聚合材料併 -15- 297^57 本紙張尺度適用中 502102 A7 B7 五、發明説明（13 ) 至熱傳裝置外殼内，因此該熱傳裝置必需具備該電路板， 且在應用實例中，其合稱為單元結構。 -16- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐） 502102 第090125549號專利申請案 — 中文說明書修正頁(91年7月） A7 -·: s b'/ ^ __67 : :華 Ά 五、發明説明（13a ) 主要元件符號說明 10, 40 結構 12, 44 產生熱之組件 14 散熱片 15 界面 16, 42 熱傳裝置 18 界面材質 20, 48 外殼 22, 50 室 24, 52 芯 26 粗Μ表面 28 溫熱區 30 冷卻器部份 32 蒸發流體 34 凝結流體 46 熱逸散組件 53 操作流體移動方向 54 冷凝流體移動方向 100 熱傳裝置 102, 152 外殼 104, 154 室 106 第一部分 108 第二部份 -16a- 裝 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）k-502102 A7 B7 V. Description of the invention (12) FIG. 7 shows a diagram of the device of FIG. 6 along the line 7-7. This illustration illustrates a core 156 that extends through the entirety of the chamber 154 (FIG. 6). In more detail, the illustrated housing 152 includes side walls 160, 162, 164, and 166, and the illustrated core 156 extends from the side wall 160 to the opposite side wall 164 and from the side wall 162 to the opposite side wall 166. Although the illustrated core 1 56 includes a simple planar structure, it should be understood that the core 156 may contain the type of weaving material described with reference to FIG. 5 as the material 112. The heat transfer device shown in Figs. 4-7 can be used as a vacuum chamber structure and usually contains a right-angled shape of the kind described in Fig. 7. However, it is necessary to understand that the method of the present invention can be incorporated into a heat transfer device (eg, a heating pipe) having other shapes. Compared to the prior art device (eg, a device of π 1 罔 i 岍 return), the advantages of the device of the invention are The device of the present invention is significantly lighter than conventional devices. 'Pictures describe prior art heat transfer devices of this type that often contain large amounts of copper or other metals' and have a density per unit volume of at least about 3 g / cm, (g / Cm 3). In contrast, this type of heat transfer device as the device ιOO described with reference to FIG. 4 contains a polymer material (e.g., 'plastic'), and therefore, can be much lighter than :: front = structure. For example, 'general and t,' as shown in Figure 4: and the density per unit volume of the present device example is less than about (g / centimeter in this rar volume, for example, about G · 86 g / cm3. Material In terms of molding application, the electricity of the polymer integrated wafer device that can exist in the electric device can be self-contained. This kind of electricity can be retained and charged. In the specific application of the present invention, the circuit can also include polymer materials. -15- 297 ^ 57 of the board polymer material 502102 A7 B7 V. Description of the invention (13) into the housing of the heat transfer device, so the heat transfer device must have the circuit board, and in the application example, its Collectively referred to as the unit structure. -16- This paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 502102 Patent Application No. 090125549 — Chinese Manual Correction Page (July 91) A7-·: s b '/ ^ __67:: Hua Hua V. Description of the invention (13a) Symbol description of main components 10, 40 Structure 12, 44 Components that generate heat 14 Heat sink 15 Interface 16, 42 Heat transfer device 18 Interface material 20, 48 Housing 22 , 50 chambers 24, 52 cores 26 coarse gauge 28 Warm zone 30 Cooler section 32 Evaporated fluid 34 Condensed fluid 46 Heat dissipation component 53 Operating fluid moving direction 54 Condensing fluid moving direction 100 Heat transfer device 102, 152 Housing 104, 154 Room 106 First part 108 Second part -16a- The size of this paper is applicable to China National Standard (CNS) A4 (210 X 297 mm)

訂Order

線 502102 第090125549號專利申請案 中文說明書修正頁(91年7月） A7 B7 補其 五 發明說明（13b 110 界面 112, 156 芯 114 第一區 116 第二區 120 第一組碳纖維 122 第二組碳纖維 150 結構 158 散熱片 160, 162, 164, 166 側壁 -16b- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Line 502102 No. 090125549 Patent Application Chinese Specification Revision Page (July 91) A7 B7 Supplementary Fifth Invention Description (13b 110 Interface 112, 156 Core 114 First Zone 116 Second Zone 120 First Group Carbon Fiber 122 Second Group Carbon fiber 150 structure 158 heat sink 160, 162, 164, 166 side wall-16b- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

A B c D 申請專利範圍 1··一種熱傳裝置，其包含 種外设，該外殼係由含具有熱傳導性填料分散於其 中之來合物基吳之組合物形成，該外殼可界定至少部份 室，該室係與大氣隔絕；及 該室内所包含之操作流體。 2.根據中請專利範圍第1項之熱傳裝置，#中卜殼可界 定該室之大部份區域。 )·根據申請專利範圍第彳g #电 固弟1項之熱傳裝置，其中該外殼可界 定實質上全部該室。 4·根據申請專利範圍第1項之熱傳裝置，纟中除了被提供 以封閉經由該外殼延伸至該室之開口之模塞外，該外殼 可界定全部該室。 5·根據申請專利範圍第丨項之熱傳裝置，其中該外殼可界 定全部該室。 6·根據申請專利範圍第丨項之熱傳裝置，其中該熱傳導性 填料包含碳纖維。 7·根據申請專利範圍第1項之熱傳裝置，其在該室内尚包 含一種芯。 8·根據申請專利範圍第1項之熱傳裝置，其在該室内尚包 含一種芯，該芯含有碳纖維。 9·根據申請專利範圍第1項之熱傳裝置，其在該室内尚包 含一種芯，該芯含有織物或碳纖維。 10·根據申請專利範圍第1項之熱傳裝置，其中該組合物之 導熱度為至少約10瓦/公尺-凱氏溫度（W/mK)。 -17- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)AB c D Patent Application Scope 1. A heat transfer device, which includes a variety of peripherals, the shell is formed of a composition containing a compound with a thermally conductive filler dispersed therein, the shell may define at least part A chamber which is isolated from the atmosphere; and an operating fluid contained in the chamber. 2. According to the heat transfer device in item 1 of the patent application, # 中 卜 壳 can define most of the area of the room. ) · According to the scope of application patent No. 彳 g # 电 固 弟 1 heat transfer device, wherein the shell can define substantially all the room. 4. According to the heat transfer device of the scope of application for patent, the outer shell can define the whole of the chamber except for the plug provided to close the opening extending through the outer shell to the chamber. 5. The heat transfer device according to item 丨 of the patent application scope, wherein the enclosure can define all the rooms. 6. The heat transfer device according to item 丨 of the application, wherein the thermally conductive filler comprises carbon fiber. 7. The heat transfer device according to item 1 of the scope of patent application, which still contains a core in the room. 8. The heat transfer device according to item 1 of the scope of patent application, which still contains a core in the room, the core containing carbon fibers. 9. The heat transfer device according to item 1 of the scope of patent application, which still contains a core in the room, the core containing fabric or carbon fiber. 10. The heat transfer device according to item 1 of the scope of patent application, wherein the composition has a thermal conductivity of at least about 10 watts / meter-Kelvin temperature (W / mK). -17- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 根據中請專利㈣第i項之熱傳裝m該外殼組合 物聚合物基質包含聚丙烯，且其中該熱傳導性填料含有 碳纖維。 12·根據申請專利圍第i項之熱傳裝置，#中該外殼組合 物聚合物基質包含聚笨硫_，且其中該熱傳導性填料含 有碳纖維。 a根據f請專利範圍第i項之熱傳裝置，纟中該外殼組合 物聚合物基質含有液晶聚合物’且其中該熱傳導性填料 含有碳纖維。 π.根據申請專利範圍第丨項之熱傳裝置，其在具有至少一 部份該外殼之單元結構中尚含有多片散熱片。 υ·，，申請專利範圍第1項之熱傳裝置，其中該外殼可界 定實質上全部該室，其中該外殼總體含有一種單元結構 ，且在具有該外殼之單元結構中尚含有多片散熱片。 U·—種熱傳裝置，其包含 -種外殼，該外殼含聚合物，且其導熱度為至少約1〇 瓦/公尺-凱氏溫度（w/mK)，該外殼可界定與大氣隔絕之 室之至少一部份；及 該室内所包含之操作流體。 Π.根據申請專利範圍第16項之熱傳裝置，其中該外殼可界 定大部份該室。 18·根據申請專利範圍第16項之熱傳裝置，其中該外殼可界 定至少實質上全部該室。 a根據f請專利範圍第16項之熱傳裝置，丨中 申請專利範圍 A BCD 封閉經由該外殼延伸至 h n 6 Μ至之開口之模塞外’該外殼可 界定全部該室 20.根據申請專利範圍第16項之熱傳裝置 含一種芯。 21_根據申請專利範圍第16項之 有一種芯，該芯含碳纖維。 、 22. 根據申請專利範圍第16項之熱傳裝置 有一種芯，該芯含織造碳纖維。、 23. 根據申請專利範圍第16項之熱傳裝置 熱度為至少15瓦/公尺·勃吒 24. 根據申請專利範圍第丨 步0積之熱傳裝置，其中該 物包含聚丙烯。 25. 根據"專利範圍第16項之熱傳裝置，其中該 物包含聚苯硫醚。 -Μ艮據申哨專利範圍第16項之熱傳裝置，其中該外殻聚合 物包含液晶聚合物。 27. —種熱傳裝置，其含有 種外设’該外殼可界定與大氣隔絕之室之至少，部 份； 該室内所包含之操作流體；及 該外设至内之芯，該芯含織造碳纖維。 28. 根據申請專利範圍第27項之熱傳裝置，其中該織造碳纖 維為瀝青碳纖維。 29·根據申請專利範圍第27項之熱傳裝置，其中該 其在該室内尚包 其在該室内尚含 其在該室内尚含 其中該材質之導 外殼聚合 外殼聚合 織造破纖 19 本紙張尺度適用中國國家標準(CNS) Α4規格(21Gχ 297公發） 申請專利範圍 維為聚丙稀腈碳纖維。 30.根據申請專利範圍第27項 …、傳裝置，其中該織造碳纖 、，隹王要由第一組主要沿菩坌 第—軸延伸之纖維及第二組主 要/口耆貫質上與該第一轴岙古 直之第二軸延伸之碳纖維組 成0 3!·—種熱傳裝置，其含有 種外/>又該外设係界定與大氣隔絕之室之至少一部 份，該外殼含熱膨脹餘小於約i2ppm/u材質； 該室内所含之操作流體；及 該外殼室内之芯。 32.根據f請專利範圍第31項之熱傳裝置，其中該外殼之整 體本質上由熱膨脹係數小於約12 p—C之材質組成。 3 3 ·根據申請專利範圍第3 1# 祀項之熱傳裝置，其中該材質之熱 膨脹係數小於約1〇 ppm/t。 其中該外殼包含 其中該外殼包含 34. 根據申請專利範圍第31.項之熱傳裝置 一種金屬基質複合材料。 35. 根據申請專利範圍第31項之熱傳裝置 -種金屬基質複合㈣；且其中該金屬基質複合材 熱膨脹係數小於約1〇 ppm/t。 36. 根據申請專利範圍第31項之熱傳裝置，纟中該外殼包含 -種金屬基質複合材料；且其中該金職質複合材料包 含銅及碳。 3 7 ·根據申凊專利範圍第3 1項之熱傳裝置，其中該外殼包含 銅及鹤。 -20- 本紙張尺度適用中國國家標準(CNS) Α4規格(21〇 X 297公董) 02 IX 2 5 A B c D 六、申請專利範圍 3 8.根據申請專利範圍第31項之熱傳裝置，其中該外殼包含 銅及碳化矽。 3 9.根據申請專利範圍第31項之熱傳裝置，其中該外殼包含 鋁及碳化矽。 40.根據申請專利範圍第31項之熱傳裝置，其中該芯包含織 造碳纖維。 4 1.根據申請專利範圍第3 1項之熱傳裝置，其中該芯包含織 造碳纖維，且其中該碳纖維為瀝青碳纖維。 42.根據申請專利範圍第31項之熱傳裝置，其中該芯包含織 造碳纖維，且其中該碳纖維為聚丙烯腈碳纖維。 -21 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)According to the heat transfer device of Patent Application No. i, the shell composition polymer matrix includes polypropylene, and wherein the thermally conductive filler contains carbon fibers. 12. The heat transfer device according to item i of the patent application, wherein the polymer matrix of the shell composition comprises polysulfide, and wherein the thermally conductive filler contains carbon fibers. a The heat transfer device according to item i of the patent claim, wherein the polymer matrix of the shell composition contains a liquid crystal polymer 'and wherein the thermally conductive filler contains carbon fibers. π. The heat transfer device according to item 丨 of the patent application scope, which includes a plurality of heat sinks in a unit structure having at least a part of the casing. υ ·, The heat transfer device of the first patent application range, wherein the shell can define substantially all of the chamber, wherein the shell generally contains a unit structure, and the unit structure with the shell still contains multiple heat sinks . U · A heat transfer device comprising a shell containing a polymer and having a thermal conductivity of at least about 10 watts / meter-Kelvin temperature (w / mK), the shell may be defined to be isolated from the atmosphere At least a part of the chamber; and the operating fluid contained in the chamber. Π. The heat transfer device according to item 16 of the scope of patent application, wherein the housing can define most of the chamber. 18. The heat transfer device according to item 16 of the application, wherein the enclosure may define at least substantially all of the chamber. a According to f, please apply for the heat transfer device of the 16th patent scope, in the patent application scope A BCD outside the opening plug that extends through the shell to hn 6 M to 'the shell can define all the rooms 20. According to the scope of patent application The heat transfer device of item 16 includes a core. 21_ According to claim 16 of the scope of patent application, there is a core containing carbon fiber. 22. The heat transfer device according to item 16 of the scope of patent application has a core containing woven carbon fibers. 23. Heat transfer device according to item 16 of the scope of patent application Heat of at least 15 Watts / meter · Boer 24. Heat transfer device according to step 0 of the scope of patent application, wherein the material includes polypropylene. 25. A heat transfer device according to " Patent Scope 16, wherein the substance comprises polyphenylene sulfide. -A heat transfer device according to claim 16 of the claimed scope, wherein the shell polymer comprises a liquid crystal polymer. 27. —A heat transfer device comprising a peripheral device 'The shell may define at least part of a room that is isolated from the atmosphere; the operating fluid contained in the room; and a core to the inside, the core containing weaving carbon fiber. 28. The heat transfer device according to item 27 of the application, wherein the woven carbon fiber is pitch carbon fiber. 29. The heat transfer device according to item 27 of the scope of the patent application, wherein it is still covered in the room, it is contained in the room, and it is contained in the room. Applicable to China National Standard (CNS) A4 specification (21Gχ 297 issued). The scope of patent application is polyacrylonitrile carbon fiber. 30. According to item 27 of the scope of the patent application, the transmission device, in which the woven carbon fiber, the king of the fiber is to be extended by the first group of fibers that mainly extend along the first axis of the bodhi and the second group is mainly The first axis is ancient straight and the second axis extends carbon fiber to form 0 3! · —A heat transfer device containing extra-species /> The peripheral device defines at least a part of a room isolated from the atmosphere, and the shell contains The thermal expansion margin is less than about i2ppm / u material; the operating fluid contained in the room; and the core in the housing. 32. The heat transfer device according to item 31 of the patent claim, wherein the entirety of the housing is essentially composed of a material having a thermal expansion coefficient of less than about 12 p-C. 3 3 · The heat transfer device according to No. 3 1 # of the patent application scope, wherein the thermal expansion coefficient of the material is less than about 10 ppm / t. Wherein the shell contains 34. The heat transfer device according to item 31. A metal matrix composite material. 35. A heat transfer device according to item 31 of the application for patent-a metal matrix composite rhenium; and wherein the metal matrix composite has a thermal expansion coefficient of less than about 10 ppm / t. 36. According to the heat transfer device of the scope of application for patent No. 31, the shell in the case contains a metal matrix composite material; and the gold composite material contains copper and carbon. 37. The heat transfer device according to item 31 of the patent application, wherein the shell contains copper and crane. -20- This paper size applies Chinese National Standard (CNS) A4 specification (21〇X 297 public directors) 02 IX 2 5 AB c D 6. Application for patent scope 3 8. Heat transfer device according to item 31 of application patent scope, The casing contains copper and silicon carbide. 3 9. The heat transfer device according to item 31 of the scope of patent application, wherein the housing comprises aluminum and silicon carbide. 40. The heat transfer device according to claim 31, wherein the core comprises a woven carbon fiber. 4 1. The heat transfer device according to item 31 of the scope of patent application, wherein the core comprises woven carbon fibers, and wherein the carbon fibers are pitch carbon fibers. 42. The heat transfer device according to item 31 of the application, wherein the core comprises woven carbon fibers, and wherein the carbon fibers are polyacrylonitrile carbon fibers. -21-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
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US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (en) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 Heat transfer device made of conductive plastic and manufacturing method thereof
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US8602092B2 (en) 2003-07-23 2013-12-10 Cooligy, Inc. Pump and fan control concepts in a cooling system
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US7746634B2 (en) 2007-08-07 2010-06-29 Cooligy Inc. Internal access mechanism for a server rack
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
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CN106793670A (en) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 Heat radiator of electronic element

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