TW360958B - Resin sealing type semiconductor device and manufacturing method thereof - Google Patents
Resin sealing type semiconductor device and manufacturing method thereofInfo
- Publication number
- TW360958B TW360958B TW084110036A TW84110036A TW360958B TW 360958 B TW360958 B TW 360958B TW 084110036 A TW084110036 A TW 084110036A TW 84110036 A TW84110036 A TW 84110036A TW 360958 B TW360958 B TW 360958B
- Authority
- TW
- Taiwan
- Prior art keywords
- internal heat
- heat radiator
- semiconductor device
- type semiconductor
- resin sealing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30323894 | 1994-11-11 | ||
JP24541795A JP3367299B2 (ja) | 1994-11-11 | 1995-08-30 | 樹脂封止型半導体装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW360958B true TW360958B (en) | 1999-06-11 |
Family
ID=26537218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084110036A TW360958B (en) | 1994-11-11 | 1995-09-26 | Resin sealing type semiconductor device and manufacturing method thereof |
Country Status (8)
Country | Link |
---|---|
US (1) | US5719442A (zh) |
EP (1) | EP0712158B1 (zh) |
JP (1) | JP3367299B2 (zh) |
KR (1) | KR100414254B1 (zh) |
DE (1) | DE69525420T2 (zh) |
HK (1) | HK1013733A1 (zh) |
SG (1) | SG45124A1 (zh) |
TW (1) | TW360958B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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US6001672A (en) | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
US6090689A (en) * | 1998-03-04 | 2000-07-18 | International Business Machines Corporation | Method of forming buried oxide layers in silicon |
US6159764A (en) * | 1997-07-02 | 2000-12-12 | Micron Technology, Inc. | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages |
US6190945B1 (en) * | 1998-05-21 | 2001-02-20 | Micron Technology, Inc. | Integrated heat sink |
SE512710C2 (sv) * | 1998-07-08 | 2000-05-02 | Ericsson Telefon Ab L M | Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns |
US6146921A (en) * | 1998-09-16 | 2000-11-14 | Intel Corporation | Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink |
US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
US6444501B1 (en) | 2001-06-12 | 2002-09-03 | Micron Technology, Inc. | Two stage transfer molding method to encapsulate MMC module |
US8193633B2 (en) * | 2007-09-26 | 2012-06-05 | Mitsubishi Electric Corporation | Heat conductive sheet and method for producing same, and powder module |
JP5089662B2 (ja) * | 2009-08-04 | 2012-12-05 | 三菱電機株式会社 | 半導体モジュール |
US9054077B2 (en) * | 2010-03-10 | 2015-06-09 | Altera Corporation | Package having spaced apart heat sink |
JP2013183038A (ja) * | 2012-03-02 | 2013-09-12 | Mitsubishi Electric Corp | 半導体装置 |
JP5898575B2 (ja) * | 2012-06-21 | 2016-04-06 | 日立オートモティブシステムズ株式会社 | 半導体装置 |
JP2012199596A (ja) * | 2012-07-25 | 2012-10-18 | Mitsubishi Electric Corp | 半導体モジュール |
US8766102B2 (en) * | 2012-10-29 | 2014-07-01 | Kinsus Interconnect Technology Corp. | Chip support board structure |
US8921989B2 (en) * | 2013-03-27 | 2014-12-30 | Toyota Motor Engineering & Manufacturing North, America, Inc. | Power electronics modules with solder layers having reduced thermal stress |
JP6497036B2 (ja) * | 2014-11-14 | 2019-04-10 | 株式会社デンソー | NOxセンサコントローラ |
CN105047366B (zh) * | 2015-05-09 | 2017-03-08 | 陈学福 | 固接有外翅片可拆卸连接有内翅片的变压器散热器 |
CN105047363B (zh) * | 2015-05-09 | 2017-03-08 | 陈学福 | 固接有内翅片的变压器散热器 |
CN105047364B (zh) * | 2015-05-09 | 2016-11-30 | 陈学福 | 可拆卸连接有外翅片固接有内翅片的变压器散热器 |
DE102017120747B4 (de) * | 2017-09-08 | 2020-07-30 | Infineon Technologies Austria Ag | SMD-Gehäuse mit Oberseitenkühlung und Verfahren zu seiner Bereitstellung |
DE102017120753B4 (de) | 2017-09-08 | 2021-04-29 | Infineon Technologies Austria Ag | SMD-Package mit Oberseitenkühlung |
WO2024004024A1 (ja) * | 2022-06-28 | 2024-01-04 | 三菱電機株式会社 | パワーモジュール及び電力変換装置 |
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JP2602380B2 (ja) * | 1991-10-23 | 1997-04-23 | 富士通株式会社 | 半導体装置及びその製造方法 |
JPH05211262A (ja) * | 1992-01-08 | 1993-08-20 | Nec Corp | 樹脂封止型半導体装置 |
US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
US5262927A (en) * | 1992-02-07 | 1993-11-16 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package |
JPH06120374A (ja) * | 1992-03-31 | 1994-04-28 | Amkor Electron Inc | 半導体パッケージ構造、半導体パッケージ方法及び半導体パッケージ用放熱板 |
JP3572628B2 (ja) * | 1992-06-03 | 2004-10-06 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP3322429B2 (ja) * | 1992-06-04 | 2002-09-09 | 新光電気工業株式会社 | 半導体装置 |
US5367196A (en) * | 1992-09-17 | 1994-11-22 | Olin Corporation | Molded plastic semiconductor package including an aluminum alloy heat spreader |
JPH0697326A (ja) * | 1992-09-14 | 1994-04-08 | Apic Yamada Kk | 半導体装置およびその放熱部材 |
JPH06209054A (ja) * | 1993-01-08 | 1994-07-26 | Mitsubishi Electric Corp | 半導体装置 |
-
1995
- 1995-08-30 JP JP24541795A patent/JP3367299B2/ja not_active Expired - Fee Related
- 1995-09-26 TW TW084110036A patent/TW360958B/zh not_active IP Right Cessation
- 1995-10-31 KR KR1019950039514A patent/KR100414254B1/ko not_active IP Right Cessation
- 1995-11-07 DE DE69525420T patent/DE69525420T2/de not_active Expired - Fee Related
- 1995-11-07 EP EP95117538A patent/EP0712158B1/en not_active Expired - Lifetime
- 1995-11-10 SG SG1995001803A patent/SG45124A1/en unknown
- 1995-11-13 US US08/555,016 patent/US5719442A/en not_active Expired - Lifetime
-
1998
- 1998-12-23 HK HK98115062A patent/HK1013733A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0712158B1 (en) | 2002-02-13 |
DE69525420T2 (de) | 2002-10-17 |
JP3367299B2 (ja) | 2003-01-14 |
KR960019676A (ko) | 1996-06-17 |
JPH08191114A (ja) | 1996-07-23 |
SG45124A1 (en) | 1998-01-16 |
US5719442A (en) | 1998-02-17 |
HK1013733A1 (en) | 1999-09-03 |
DE69525420D1 (de) | 2002-03-21 |
EP0712158A2 (en) | 1996-05-15 |
EP0712158A3 (en) | 1997-03-26 |
KR100414254B1 (ko) | 2004-03-30 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |