TW333647B - The semiconductor IC device - Google Patents

The semiconductor IC device

Info

Publication number
TW333647B
TW333647B TW086103977A TW86103977A TW333647B TW 333647 B TW333647 B TW 333647B TW 086103977 A TW086103977 A TW 086103977A TW 86103977 A TW86103977 A TW 86103977A TW 333647 B TW333647 B TW 333647B
Authority
TW
Taiwan
Prior art keywords
power source
source potential
potential
memory
data
Prior art date
Application number
TW086103977A
Other languages
English (en)
Inventor
Hiroshi Ootori
Wamin Arimoto
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW333647B publication Critical patent/TW333647B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06Sense amplifiers; Associated circuits, e.g. timing or triggering circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
TW086103977A 1996-11-01 1997-03-26 The semiconductor IC device TW333647B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8290963A JPH10135424A (ja) 1996-11-01 1996-11-01 半導体集積回路装置

Publications (1)

Publication Number Publication Date
TW333647B true TW333647B (en) 1998-06-11

Family

ID=17762718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103977A TW333647B (en) 1996-11-01 1997-03-26 The semiconductor IC device

Country Status (4)

Country Link
US (1) US5872737A (zh)
JP (1) JPH10135424A (zh)
KR (1) KR100224960B1 (zh)
TW (1) TW333647B (zh)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW324101B (en) 1995-12-21 1998-01-01 Hitachi Ltd Semiconductor integrated circuit and its working method
US5748547A (en) * 1996-05-24 1998-05-05 Shau; Jeng-Jye High performance semiconductor memory devices having multiple dimension bit lines
US20050036363A1 (en) * 1996-05-24 2005-02-17 Jeng-Jye Shau High performance embedded semiconductor memory devices with multiple dimension first-level bit-lines
JPH10133908A (ja) * 1996-10-29 1998-05-22 Mitsubishi Electric Corp マイクロプロセッサ
US6314523B1 (en) * 1997-04-09 2001-11-06 Compaq Computer Corporation Apparatus for distributing power to a system of independently powered devices
JPH1186548A (ja) * 1997-09-16 1999-03-30 Mitsubishi Electric Corp 半導体記憶装置
JPH11144465A (ja) * 1997-11-10 1999-05-28 Texas Instr Japan Ltd 半導体記憶装置
JP3853513B2 (ja) * 1998-04-09 2006-12-06 エルピーダメモリ株式会社 ダイナミック型ram
US6009023A (en) * 1998-05-26 1999-12-28 Etron Technology, Inc. High performance DRAM structure employing multiple thickness gate oxide
US6144221A (en) * 1998-07-02 2000-11-07 Seiko Epson Corporation Voltage tolerant interface circuit
KR100557568B1 (ko) * 1998-12-31 2006-05-22 주식회사 하이닉스반도체 센스앰프 전원공급회로
JP3233911B2 (ja) * 1999-03-17 2001-12-04 株式会社 沖マイクロデザイン 半導体集積回路装置
US6236605B1 (en) * 1999-03-26 2001-05-22 Fujitsu Limited Semiconductor integrated circuit and semiconductor memory device including overdriving sense amplifier
TW526497B (en) * 1999-05-18 2003-04-01 Nanya Technology Corp Data sensing method of semiconductor memory device
US6078513A (en) * 1999-06-09 2000-06-20 Neomagic Corp. NMOS dynamic content-addressable-memory CAM cell with self-booting pass transistors and local row and column select
JP4308985B2 (ja) 1999-08-12 2009-08-05 株式会社ルネサステクノロジ 半導体装置
JP2011054270A (ja) * 2000-03-24 2011-03-17 Renesas Electronics Corp 半導体記憶装置
US6347058B1 (en) * 2000-05-19 2002-02-12 International Business Machines Corporation Sense amplifier with overdrive and regulated bitline voltage
JP2002025264A (ja) * 2000-07-05 2002-01-25 Toshiba Corp 半導体装置
JP4565716B2 (ja) * 2000-08-30 2010-10-20 ルネサスエレクトロニクス株式会社 半導体装置
JP4656747B2 (ja) * 2001-03-30 2011-03-23 ルネサスエレクトロニクス株式会社 半導体装置
JP2003059273A (ja) * 2001-08-09 2003-02-28 Hitachi Ltd 半導体記憶装置
JP3874655B2 (ja) * 2001-12-06 2007-01-31 富士通株式会社 半導体記憶装置、及び半導体記憶装置のデータアクセス方法
JP3938309B2 (ja) * 2002-01-22 2007-06-27 富士通株式会社 リードディスターブを緩和したフラッシュメモリ
EP1331627B1 (en) 2002-01-24 2012-04-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving the semiconductor device
US6584002B1 (en) * 2002-01-31 2003-06-24 Hewlett-Packard Development Company, L.P. Method of querying a four-transistor memory array as a content addressable memory by rows or columns
JP2003282823A (ja) 2002-03-26 2003-10-03 Toshiba Corp 半導体集積回路
TW556226B (en) * 2002-04-09 2003-10-01 Winbond Electronics Corp Dual-phase pre-charging circuit and the assembled static-current elimination circuit
US7170179B1 (en) * 2002-04-29 2007-01-30 Cypress Semiconductor Corp. Chip select method through double bonding
JP2004040960A (ja) * 2002-07-05 2004-02-05 Mitsubishi Electric Corp 半導体モジュール
JP2004213722A (ja) * 2002-12-27 2004-07-29 Matsushita Electric Ind Co Ltd 半導体記憶装置及び半導体集積回路装置
JP2005174432A (ja) * 2003-12-10 2005-06-30 Matsushita Electric Ind Co Ltd 半導体記憶装置
US7341765B2 (en) * 2004-01-27 2008-03-11 Battelle Energy Alliance, Llc Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates
US7400167B2 (en) * 2005-08-16 2008-07-15 Altera Corporation Apparatus and methods for optimizing the performance of programmable logic devices
EP1619687A1 (en) * 2004-07-21 2006-01-25 STMicroelectronics S.r.l. Distribution of a reference voltage through a circuit
US7012841B1 (en) * 2004-08-24 2006-03-14 Freescale Semiconductor, Inc. Circuit and method for current pulse compensation
JP4792034B2 (ja) * 2005-08-08 2011-10-12 スパンション エルエルシー 半導体装置およびその制御方法
US20070090385A1 (en) * 2005-10-21 2007-04-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2007273072A (ja) * 2006-03-09 2007-10-18 Matsushita Electric Ind Co Ltd 半導体記憶装置および半導体装置
JP2007251351A (ja) 2006-03-14 2007-09-27 Renesas Technology Corp 半導体装置
JP2008011446A (ja) * 2006-06-30 2008-01-17 Toshiba Corp 半導体集積回路
JP2009009680A (ja) * 2007-05-25 2009-01-15 Nec Electronics Corp 半導体装置
JP5202248B2 (ja) 2008-11-26 2013-06-05 パナソニック株式会社 半導体記憶装置
US8958263B2 (en) * 2011-06-10 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6100460B2 (ja) * 2011-12-21 2017-03-22 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. 半導体装置
JP5408274B2 (ja) * 2012-02-20 2014-02-05 富士通セミコンダクター株式会社 半導体出力回路及び外部出力信号生成方法並びに半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101679B2 (ja) * 1985-06-21 1994-12-12 株式会社日立製作所 半導体集積回路装置
US5264743A (en) * 1989-12-08 1993-11-23 Hitachi, Ltd. Semiconductor memory operating with low supply voltage
JPH03228368A (ja) * 1990-02-02 1991-10-09 Hitachi Ltd 半導体集積回路装置
US5202855A (en) * 1991-01-14 1993-04-13 Motorola, Inc. DRAM with a controlled boosted voltage level shifting driver
JPH0562467A (ja) * 1991-09-05 1993-03-12 Hitachi Ltd センスアンプ駆動回路
JP3085782B2 (ja) * 1992-05-29 2000-09-11 株式会社東芝 半導体記憶装置
JP3068377B2 (ja) * 1993-06-30 2000-07-24 日本電気株式会社 ダイナミック形半導体記憶装置
JP3755911B2 (ja) * 1994-11-15 2006-03-15 富士通株式会社 半導体回路

Also Published As

Publication number Publication date
KR19980033971A (ko) 1998-08-05
US5872737A (en) 1999-02-16
JPH10135424A (ja) 1998-05-22
KR100224960B1 (ko) 1999-10-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees