TW201120367A - Heat dissipating member for led light bulb - Google Patents

Heat dissipating member for led light bulb Download PDF

Info

Publication number
TW201120367A
TW201120367A TW099121995A TW99121995A TW201120367A TW 201120367 A TW201120367 A TW 201120367A TW 099121995 A TW099121995 A TW 099121995A TW 99121995 A TW99121995 A TW 99121995A TW 201120367 A TW201120367 A TW 201120367A
Authority
TW
Taiwan
Prior art keywords
heat
coating film
resin
dissipating
weight
Prior art date
Application number
TW099121995A
Other languages
Chinese (zh)
Other versions
TWI425167B (en
Inventor
Keiichiro Hatsuno
Nobuyuki Mutoh
Kenji Katou
Mitsuhiro Tamaki
Original Assignee
Sumitomo Light Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Light Metal Ind filed Critical Sumitomo Light Metal Ind
Publication of TW201120367A publication Critical patent/TW201120367A/en
Application granted granted Critical
Publication of TWI425167B publication Critical patent/TWI425167B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

To provide a heat dissipating member for LED light bulbs, which has improved heat radiation performance, has simple structure, has improved productivity, and has low costs. Disclosed is the heat dissipating member 1 for the LED light bulb incorporating an LED element. The heat dissipating member 1 is formed by press-molding an aluminum alloy plate into a generally conical shape, and recessed and projecting parts 12 are formed on an outer circumferential surface 10. The aluminum alloy plate is a pre-coated aluminum alloy plate that is obtained by pre-coating both surfaces or one surface of a substrate with a synthetic resin-coating film. The synthetic resin-coating film applied to at least one surface preferably includes a heat-dissipating coating film which contains a heat-dissipating substance in a base resin that has a number-average molecular weight of 10,000-40,000 and is composed of one or more resins selected from among urethane resin, ionomer resin, polyethylene resin, epoxy resin, fluororesin, and polyester resin.

Description

201120367 六、發明說明: 【發明所屬之技術領域】 本發明係關於內藏LED (發光二極體)元件而成之 LED電球的散熱構件。 【先前技術】 伴隨著LED的高性能化,現正探討將以LED爲光源之 燈(LED燈)用作爲次世代的照明裝置者。led燈有各種 型態,目前特別受到矚目的是,可取代一般家庭中所廣泛 普及之白熾電球之電球型的LED燈(以下稱爲LED電球) 〇 L E D電球,與以往的白熾電球相比,可發揮消耗電力 約1/8、壽命約40倍之性能,因此可視爲與目前以防止地 球暖化思想爲背景之省能源要求爲一致的優異產品。 另一方面,LED元件,該光輸出一般是隨著溫度上升 而降低,此外,環境溫度較高者,與較低時相比,光輸出 隨時間經過而降低之程度較大,且壽命較短。因此,LE D 電球中,係嘗試在該本體中設置散熱構件,來促進LED元 件所產生之熱的散熱。至目前所提出者,例如有專利文獻 1〜5之構成。 專利文獻1爲具有喇叭狀金屬散熱部者。專利文獻2爲 具有以輻射狀形成散熱葉片之散熱部者。專利文獻3、4爲 具有在軸方向上重疊之散熱葉片構造的散熱部者。專利文 獻5係顯示設置有覆蓋基體的外周圍之散熱部之構成者。 201120367 〔先前技術文獻〕 〔專利文獻〕 〔專利文獻1〕日本特開2001_243809號公報 〔專利文獻2〕日本特開2〇〇5_93〇97號公報 〔專利文獻3〕日本特開2〇〇5_166578號公報 〔專利文獻4〕日本特開2〇〇8_186758號公報 〔專利文獻5〕日本特開2〇〇8_311〇〇2號公報 【發明內容】 (發明所欲解決之問題) 然而,上述專利文獻1之喇叭狀金屬散熱部中 得可獲得充分的散熱效果。此外,專利文獻2〜5所 散熱部,不是組合有複數種零件之複雜構造,就是 等的鑄造物或壓鑄品者,其生產性低,重量較重, 亦高。 近來,經實用化之LED電球,已有將具有散熱 狀的鋁鑄造物用作爲散熱部者,但其價格被設定在 熾電球的數十倍程度,其低價格化仍是課題之一。 本發明係鑒於該問題點而創作出之發明,其欲 種散熱性能佳,構造簡單,生產性佳,且成本低之 球用散熱構件,並提供一種可實現高性能且便宜的 球之LED電球用散熱構件。 (用以解決問題之技術手段) ’不見 記載之 使用鋁 且成本 翼之形 以往白 提供一 LED電 LED電 -6- 201120367 本發明係一種LED電球用散熱構件’爲內藏led元件 而成之LED電球的散熱構件,其特徵爲: 該散熱構件係藉由將鋁合金板模壓成形爲大致呈圓錐 狀所形成; 並且在上述外周側面形成有凹凸部(申請專利範圍第 1項)。 發明之效果: '本發明之LED電球用散熱構件,如上述般,係以銘合 金板爲原材所構成。鋁合金板,與鑄造物及壓鑄品不同, 可使用連續生產線,大量且有效率地製造出。 此外,上述散熱構件係藉由將上述鋁合金板予以模壓 成形而成形爲大致呈圓錐狀所製作出。鋁合金板的模壓成 形可容易地進行,以大量生產爲前提時,能夠極具效率且 便宜地加工。 此外,上述散熱構件係在其外周側面具有凹凸部。藉 此’可達成外周側面的表面積增大,而達成散熱特性之更 進一步的提升。 如此,本發明之LED電球用散熱構件,其散熱性能佳 ’構造簡單,生產性佳,且成本低。因此,若使用本發明 之散熱構件,則可實現高性能且便宜的L E D電球。 【實施方式】 本發明之LED電球用散熱構件,係大致呈圓錐狀,並 201120367 在該外周側面設置凹凸部。上述凹凸部,有在外周側面設 置複數個朝向外方突出之凸部使全體成爲凹凸部之形狀, 及在外周側面設置複數個朝向內方凹入之凹部使全體成爲 凹凸部之形狀,以及在外周側面設置複數個朝向外方突出 之凸部與朝向內方凹入之凹部兩者使全體成爲凹凸部之形 狀,任一種均可使用。任一形狀的凹凸部,均可藉由模壓 成形來形成。 此外,上述LED電球用散熱構件用之鋁合金板的材質 ,可使用1000系、’3000系、5000系、6000系等之適合於成 形加工之材質。例如有1050、8021、3003、3004、3104、 5052 ' 5182、 5N01等。 此外,較佳者,上述鋁合金板爲將合成樹脂塗膜預塗 於由該鋁合金板所構成之基板的雙面或單面而成之經預塗 的鋁合金板,被預塗於至少一方的面之上述合成樹脂塗膜 ,係具備:在由胺基甲酸酯樹脂、離子鍵聚合物樹脂、聚 乙烯樹脂、環氧樹脂、氟樹脂、及聚酯樹脂的1種或2種以 上所構成之數量平均分子量爲1 0000〜40 000的基質樹脂中 含有散熱性物質而成之散熱性塗膜(申請專利範圍第2項 )° 上述經預塗的鋁合金板,關於合成樹脂塗膜的塗裝, 亦可使用連續生產線,大量且有效率地實施。此外,經預 塗的鋁合金板之模壓成形,可藉由組合至目前爲止已確立 的技術而容易地進行,以大量生產爲前提時,能夠極具效 率且便宜地加工。 -8 - 201120367 此外’至少一方的面之上述合成樹脂塗膜,係具備含 有上述散熱性物質之散熱性塗膜。因此,經預塗的鋁合金 板’係成爲具有較原材的狀態更大幅地提升散熱性之表面 者。在表面上具備散熱性塗膜之狀態下成形爲大致呈圓錐 形所得之散熱構件,係成爲散熱特性更佳者。上述所謂大 致呈圓錐形,並不限於幾何學上的大致呈圓錐形,亦包含 與軸方向正交之剖面形狀爲槪略圓形狀,且以軸方向一端 的外徑較另一端的外徑更大之方式使外徑沿著軸方向變化 之形狀。_ 此外,當僅在上述基板的單面上形成合成樹脂塗膜時 ,該合成樹脂塗膜必須具備上述散熱性塗膜,在上述基板 的雙面上形成合成樹脂塗膜時,只需在配置於至少一方的 面之合成樹脂塗膜上具備上述散熱性塗膜即可。當然,亦 可在雙面的合成樹脂塗膜上具備上述散熱性塗膜。 此外,上述經預塗的鋁合金板之上述散熱性塗膜,可 因應期望的厚度來選擇單層塗佈或多層塗佈。上述散熱性 塗膜,如上述般,須含有散熱性物質,同時須含有數量平 均分子量爲10000-40000的基質樹脂。 亦即,上述散熱性塗膜,係使用數量平均分子量爲 1 0000〜4 00 00的合成樹脂作爲該基質樹脂。當此合成樹脂 的數量平均分子量未達1 0000時,會產生塗膜變硬導致用 以獲得設置有凹凸部之特徵形狀的成形性惡化之問題,另 一方面,當超過4 0 0 0 0時,會產生塗膜過軟導致耐損傷性 降低之問題。 -9- 201120367 本發明之LED電球用散熱構件中,上述散熱性塗膜較 佳係含有氧化鈦、碳、二氧化矽、氧化鋁、及氧化錯的1 種或2種以上作爲上述散熱性物質(申請專利範圍第3項) 。藉此,可容易地提高上述散熱性塗膜的散熱性。 上述散熱性塗膜之散熱性的特性,可藉由紅外線的積 分輻射率來評估。本發明中,較佳係將紅外線的積分轄射 率調整爲70%以上。藉此可獲得安定的散熱特性。 紅外線的積分輻射率,可藉由FT-IR來比較試樣與理 想黑體的紅外線輻射量而藉此測定出。 此外,上述散熱性塗膜相對於上述基質樹脂100重量 份而言,較佳係含有50〜200重量份之平均粒徑0.1〜1〇〇 y m 的氧化鈦、卜25重量份之微粉末的碳、50〜200重量份之二 氧化矽、50~200重量份之氧化鋁、及50〜200重量份之氧化 锆的1種或2種以上(申請專利範圍第4項)。 亦即,當上述散熱性塗膜中含有氧化鈦時,較佳係將 該平均粒徑設爲0.1〜100//m。當氧化鈦的平均粒徑未達 0.1 y m時,有紅外線積分輻射率降低之問題,另一方面, 當超過1 00 A m時,有氧化鈦從塗膜的脫落數增加之問題。 此外,在上述散熱性塗膜中含有氧化鈦時之含量,相 對於上述基質樹脂100重量份而言,較佳係設爲50〜200重 量份。當氧化鈦的含量未達50重量份時,有紅外線積分輻 射率降低之問題,另一方面,當超過200重量份時,有氧 化鈦從塗膜的脫落數增加之問題。 此外,上述微粉末的碳,較佳係使用粒徑爲 -10- 201120367 lnm~500nm的碳。此外’在上述散熱性塗膜中含有碳時之 含量,較佳爲1〜25重量份。當碳的含量未達1重量份時’ 有紅外線積分轄射率降低之問題’另一方面’當超過2 5重 量份時,有碳從塗膜的脫落數增加之問題。 此外,在上述散熱性塗膜中含有二氧化矽時之含量’ 較佳爲50〜2〇〇重量份。當二氧化砂的含量未達50重量份時 ,有紅外線積分輻射率降低之問題’另一方面’當超過 200重量份時,有二氧化矽從塗膜的脫落數增加之問題。 此外,在上述散熱性塗膜中含有氧化鋁時之含量’較 佳爲50〜2 00重量份。當氧化鋁的含量未達5〇重量份時’有 紅外線積分輻射率降低之問題’另—方面’當超過200重 量份時,有氧化鋁從塗膜的脫落數增加之問題。 此外,在上述散熱性塗膜中含有氧化銷時之含量,較 佳爲50〜200重量份。當氧化锆的含量未達50重量份時’有 紅外線積分輻射率降低之問題,另一方面,當超過200重 量份時,有氧化锆從塗膜的脫落數增加之問題。 此外,上述散熱性塗膜的膜厚,較佳爲0.5-100 # m。 當膜厚未達0.5 e m時,有紅外線積分輻射率降低之問題, 另一方面,當超過1 00 // m時,有成本增加之問題。 此外,上述散熱性塗膜,較佳係含有平均粒徑 0.3〜100/zm之Ni球狀塡充材、或是0.2〜5#m的厚度且具有 2〜50 m的長徑之鱗片狀的Ni塡充材之至少一方’此等兩 者的合計含量,相對於上述基質樹脂1 0 0重量份而言爲 1〜1 000重量份(申請專利範圍第6項)。藉由在散熱性塗 -11 - 201120367 膜中含有此等Ni塡充材,可將導電性賦予至散熱性塗膜, 提高將LED電球的電路所產生之電磁波予以遮蔽之效果, 並將對其他電子機器、家電機器等之影響抑制在最低限度 〇 當上述Ni球狀塡充材的平均粒徑未達0.3 v m時,會有 無法獲得充分的導電性提升效果之問題,另一方面,當超 過100 /Z m時,有Ni球狀塡充材從塗膜的脫落量增加之問題 〇 此外,當上述鱗片狀Ni塡充材的厚度未達0.2 # m時, 會有無法獲得充分的導電性提升效果之問題,另一方面, 當超過5 // m時,有成本增加之問題。此外,當鱗片狀Ni塡 充材的長徑未達2 μ m時,會有導電性降低之問題,另一方 面,當超過50/zm時,有鱗片狀Ni塡充材從塗膜的脫落數 增加之問題。 此外,此等兩者Ni塡充材(Ni球狀塡充材與鱗片狀Ni 塡充材)的合計含量(亦包含僅含有其中一方之情況), 相對於上述基質樹脂1〇〇重量份而言,較佳爲1〜1000重量 份。當此含量未達1重量份時,導電性不足,另一方面, 當超過1 000重量份,有Ni塡充材從塗膜的脫落數增加之問 題。 此外,上述散熱性塗膜相對於上述基質樹脂100重量 份而言,較佳係含有〇.〇5〜3重量份之羊脂膏、棕櫊蠟、聚 乙烯、微晶蠟的1種或2種之內層蠟(申請專利範圍第5項 )。藉此,可獲得耐損傷性提升效果,同時亦可提升加工 -12- 201120367 性。 當上述內層蠟的含量相對於基質樹脂100重量份而言 未達0.0 5重量份時,有耐損傷性降低之問題,另一方面, 當超過3重量份時,有產生結塊之問題。 此外,上述合成樹脂塗膜較佳係形成於上述基板的表 面上所形成之塗佈型或反應型的鉻酸鹽或非鉻酸鹽層的上 層(申請專利範圍第7項)。此時,可提升鋁合金板與上 述預塗層之密著性,並提高加工性、耐久性等。 此外,較佳者’具備上述散熱性塗膜之上述合成樹脂 塗膜,係具備有在上述散熱性塗膜的下層具有底層塗膜之 複數層合構造,上述底層塗膜,係由:由胺基甲酸酯樹脂 、離子鍵聚合物樹脂、聚乙烯樹脂、環氧樹脂、氟樹脂、 及聚酯樹脂的1種或2種以上所構成之數量平均分子量爲 1 0000以上的樹脂所構成(申請專利範圍第8項)。此時, 可在上述散熱性塗膜的下層配置具有種種特性之合成樹脂 塗膜作爲底層塗膜,而更爲提升塗膜的密著性、加工性等 〇 尤其是,藉由選擇上述特定樹脂中之數量平均分子量 爲1 0000以上的樹脂作爲構成上述底層塗膜之樹脂,可更 進一步地提升當進行具有凹凸部之上述散熱構件的加工時 之塗膜的加工性。此外,構成底層塗膜之樹脂的數量平均 分子量的上限値,當底層塗膜的伸長率與散熱性塗膜的伸 長率有較大不同時,加工時容易引起裂痕,就此理由來看 ,較佳係設爲4 0 0 0 0。 -13- 201120367 底層塗膜,除了未含有散熱性物質等之外,可使用與 上述散熱性塗膜爲相同之樹脂,亦可使用其他樹脂。 此外,上述底層塗膜的膜厚,當超過50 v m時,鋁合 金板與散熱性塗膜之密著性降低,故較佳係設爲50 // m以 下,此外,當膜厚過薄時,密著性亦會降低,故較佳係設 爲lym以上。更佳的範圍爲5/zm以上20#m以上下。 此外,上述合成樹脂塗膜中,在不影響散熱性、加工 性、密著性之範圍內,可添加顏料及染料以提升其創意性 〔實施例〕 (實施例1 ) 以下係使用第1圖〜第8圖,說明本發明的實施例之 LED電球用散熱構件。 本例之LED電球用散熱構件1,如第8圖所示,爲內藏 LED元件8而成之LED電球80的散熱構件。 本例中,係製作出複數種類的散熱構件1並評估該特 性。 作爲本發明的實施例之散熱構件1,如第2圖〜第5圖所 示,係藉由將鋁合金板20模壓成形爲大致呈圓錐狀所形成 。在散熱構件1的外周側面1 0形成有凹凸部1 2。 此外,對於一部分者,係使用下列經預塗的鋁合金板 2所形成,該經預塗的鋁合金板2,係將含有散熱性物質 215之散熱性塗膜21預塗於由鋁合金板所構成之基板20的 -14- 201120367 雙面。 以下詳細說明上述散熱構件1的製造工序。 <銘合金板> 鋁合金板20,係準備材質-質別爲5N01-O材、大小爲 1.5111111厚)<100„1111寬xl〇〇mm長之鋁合金板,並在藉由鹼系 脫脂劑對該雙面進行脫脂後之狀態下使用。 <經預塗的鋁合金板> 如第1圖所示,係製作出散熱構件1用之經預塗的鋁合 金板2。 基板20,係準備材質-質別爲5N01-O材、大小爲1.5mm 厚xlOOmm寬xlOOmm長之基板。 在藉由鹼系脫脂劑對基板20的雙面進行脫脂後,將基 板2 0浸漬在磷酸鉻酸鹽浴中進行陽極氧化處理。所得之陽 極氧化皮膜(磷酸鉻酸鹽皮膜)22,該皮膜中的Cr含量被 設定在20±5mg/m2的範圍內。 接著將僅由散熱性塗膜2 1所構成之合成樹脂塗膜形成 於基板20的雙面之各個面上。塗料係使用下列者,亦即以 數量平均分子量10000的聚酯樹脂作爲基質樹脂,以固形 份比計’相對於上述基質樹脂100重量份而言含有50重量 份之平均粒徑1 # m的氧化鈦,且含有1重量份之聚乙烯作 爲內層蠟者。塗裝係使用棒塗佈機來進行,散熱性塗膜2 1 的膜厚設爲3 0 # m。此外’散熱性塗膜2 1的燒結硬化條件 -15- 201120367 ,係構成爲使表面溫度成爲2 3 0t之方式在240 °C的烘箱中 保持60秒之條件。 <模壓成形> 如第2圖所示,對鋁合金板20或經預塗的鋁合金板2施 以複數次的模壓成形。 首先,如第2圖(a ) ( b )所示,對平板狀的鋁合金 板20或經預塗的鋁合金板2進行引伸加工,而成形爲大致 呈圓錐狀的形狀之中間體1 5 1。此時,係處於在中間體1 5 1 的小徑前端部存在有底部材1 5 8之狀態,且在大徑後端部 的周圍上,所成形之部分的周圍作爲空白部分1 59所殘存 〇 接著如第2圖(b ) ( c )所示,將大致呈圓錐狀的中 間體1 5 1之小徑前端部的底部材1 5 8切除,同時將大徑後端 部之周圍的空白部分159切除。 接著如第2圖(c )( d )所示’於中間體1 5 1的外周側 面形成具有凹部1 2 1之凹凸部1 2。凹凸部1 2,係沿著軸方 向以縱長方式設置剖面大致呈圓弧狀的凹部121,並且在 周圍方向上配置16個而形成。 所得之散熱構件1,如第3圖所示’係於圓錐形狀之本 體部分的前後呈現出具有平直部1 8、〗9之形狀。如第3圖 、第5圖所示,大徑部分的外徑D1約爲53mm,小徑D2約爲 25mm,全長L約爲45mm,凹部121的深度D3設爲2mm。 -16- 201120367 <評估材> 將上述經預塗的鋁合金板2用作爲原材並1 〜第5圖的狀態之本發明的實施例設爲評估材1 合成樹脂塗膜之無塗裝的上述鋁合金板20用作 工至第3圖〜第5圖的狀態之本發明的實施例設I 另外並準備作爲比較例之2種評估材。 評估材3,係將上述經預塗的鋁合金板2用 成形至第2圖(c )的狀態者。 評估材4,係將未施以合成樹脂塗膜之無 銘合金板20用作爲原材並成形至第2圖(c)的 估材3、4,在外周側面並未形成凹凸部,而成 呈正圓形的外周側面之形狀。 <評估> 評估,如第8圖所示,係使用將各評估材 構件所製作之LED電球80來進行。LED電球80 示,將對鋁合金板進行模壓成形所製作出之蓋 )與散熱構件1予以組合,於蓋體3的上表面| 元件8 (圖示僅爲2個)及該控制部,將管口部 熱構件1而配置,並蓋上用以覆蓋蓋體3之半球 出。 LED元件8,係構成爲產生溫度8 5 °C的熱 色LED元件。 評估方法,係將溫度測定用的熱電偶(圖 Ή工至第3圖 ,將未施以 爲原材並加 §評估材2, 作爲原材並 塗裝的上述 狀態者。評 爲具有剖面 用作爲散熱 ,如同圖所 體3 (第6圖 丨己置4個LED 8 6***於散 罩8 5而製作 之型式的白 示中省略) -17- 201120367 固定在上述LED電球80的LED元件8附近之蓋體3的表面上 ,並測定出通電發光之每單位時間的溫度上升之方法。 測定結果如第1表所示。 〔第1表〕 (表1) 評估材 溫度(。〇/通電時間 Να 合成樹脂塗膜 凹凸部 0分 20分 40分 60分 80分 100分 1 有 有 28 49 51 52 52 53 2 Art m 有 28 51 54 55 55 55 3 有 28 57 62 63 64 64 4 挑 無 28 58 65 68 68 67 從第1表中所得知般,本發明的實施例之評估材1、2 ,與其他比較例之評估材3、4相比,可得知其散熱性能佳 (實施例2 ) 對於實施例1之具有合成樹脂塗膜的例子’更增加實 施例來進行評估。首先,各評估材係以下列方式製作9 <經預塗的鋁合金板> 與實施例1相同,如第1圖所示,係製作出散熱構件用 之經預塗的鋁合金板2。 基板20,係準備材質-質別爲A1 05 0-0材、大小爲 0.5mm厚xlOOmm寬xlOOmm長之基板。 接著在藉由鹼系脫脂劑對基板20的雙面進行& S旨彳轰’ -18- 201120367 進行第2表、第3表所示之陽極氧化處理。 陽極氧化處理a,爲藉由磷酸鉻酸鹽處理,以使鉻量 成爲2〇mg/m2之方式形成反應型鉻酸鹽皮膜者。具體而言 ,係藉由將試樣浸漬於陽極氧化處理液之液浸法來進行陽 極氧化處理,然後在約1 00°c的環境下進行乾燥。 陽極氧化處理b,爲藉由锆處理,以使銷量成爲 2〇mg/m2之方式形成反應型非鉻酸鹽皮膜者。處理方法與 上述陽極氧化處理a相同。 陽極氧化處理c,爲藉由塗佈型鉻酸鹽處理,以使鉻 量成爲2〇mg/m2之方式形成皮膜者。具體而言,係藉由棒 塗佈機塗佈陽極氧化處理液,然後在約1 2 0 °C的環境下進 行乾燥。 陽極氧化處理d,爲藉由塗佈型锆處理,以使锆量成 爲20mg/m2之方式形成陽極氧化皮膜者。具體而言,係藉 由棒塗佈機塗佈陽極氧化處理液,然後在約1 2 0 t的環境 下進行乾燥。 接著使用棒塗佈機,將數量平均分子量1 6000的聚醋 樹脂塗裝於基板2 0之一方的面,來作爲非散熱性塗膜之合 成 成 成 所 成樹S曰塗膜。塗膜厚度設爲15/zm。並且以使表面溫度 爲23 0°C之方式在240°C的烘箱中保持60秒。 然後將第2表、第3表所示之構成的合成樹脂塗膜形 於由上述聚酯樹脂所構成之塗裝面的相反面。如第2表 第3表所示’對於試樣E 4〜E 6、E 3 7、E 4 0、E 4 2,分別开< 由聚酯樹脂、胺基甲酸酯樹脂、聚酯樹脂、或環氧樹脂 -19- 201120367 構成之塗膜作爲底層塗膜,並形成散熱性塗膜作爲其上層 。其他則不形成底層塗膜來形成最外層。任一塗裝均使用 棒塗佈機來進行,底層塗膜的膜厚設爲l〇Vm,散熱性塗 膜的膜厚設爲25//m。 此外,底層塗膜的燒結條件,係構成爲使表面溫度成 爲23 0 °C之方式在烘箱中保持60秒之條件,上述散熱性塗 膜的燒結硬化條件,係構成爲使表面溫度成爲23 0 °C之方 式在240°C的烘箱中保持60秒之條件》201120367 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat dissipating member for an LED electric ball in which an LED (Light Emitting Diode) element is incorporated. [Prior Art] Along with the high performance of LEDs, LEDs are used as light sources (LED lamps) for the next generation of lighting devices. There are various types of led lights. At present, it is particularly important to replace the electric ball type LED lamps (hereinafter referred to as LED electric balls) and LED electric balls of incandescent electric balls widely used in general households, compared with the conventional incandescent electric balls. It has an performance of about 1/8 of the power consumption and a life expectancy of about 40 times. Therefore, it can be regarded as an excellent product that is consistent with the current energy-saving requirements in the context of preventing global warming. On the other hand, in the LED element, the light output generally decreases as the temperature rises. In addition, when the ambient temperature is higher, the light output decreases more with time than the lower time, and the life is shorter. . Therefore, in the LE D electric ball, it is attempted to provide a heat dissipating member in the body to promote heat dissipation from the heat generated by the LED element. The presently proposed ones have, for example, the constitutions of Patent Documents 1 to 5. Patent Document 1 is a person having a flared metal heat sink. Patent Document 2 is a heat dissipating portion having a heat dissipating fin formed in a radial shape. Patent Documents 3 and 4 are heat dissipating members having a heat dissipating blade structure that overlaps in the axial direction. Patent Document 5 shows a constituting member provided with a heat radiating portion covering the outer periphery of the base. [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-243809 (Patent Document 2) Japanese Laid-Open Patent Publication No. Hei No. Hei. [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. A sufficient heat dissipation effect can be obtained in the flared metal heat sink. Further, the heat radiating portions of Patent Documents 2 to 5 are not complicated structures in which a plurality of types of components are combined, and are cast or die-cast products, etc., which are low in productivity, heavy in weight, and high in weight. Recently, a practically used LED electric ball has been used as a heat dissipating portion of an aluminum casting having a heat dissipation shape, but its price is set to be several tens of times that of a spheroidal ball, and its low price is still one of the subjects. The present invention is an invention created in view of the problem, and is intended to provide a heat-dissipating member with good heat dissipation performance, simple structure, good productivity, and low cost, and to provide a high-performance and inexpensive ball LED ball. Use heat sink components. (Technical means to solve the problem) 'The use of aluminum is not seen and the shape of the cost wing has been provided by a white LED electric LED-6-201120367 The present invention is a heat dissipating member for LED electric ball' which is a built-in LED element A heat dissipating member for an LED electric ball is characterized in that: the heat dissipating member is formed by press molding an aluminum alloy plate into a substantially conical shape; and a concavo-convex portion is formed on the outer peripheral side surface (Application No. 1). Advantageous Effects of Invention: The heat radiating member for an LED electric ball of the present invention is composed of a metal plate as a raw material as described above. Aluminum alloy sheets, unlike cast and die-cast products, can be manufactured in large quantities and efficiently using continuous production lines. Further, the heat dissipating member is formed by molding the aluminum alloy sheet into a substantially conical shape. The molding of the aluminum alloy sheet can be easily performed, and it can be processed extremely efficiently and inexpensively on the premise of mass production. Further, the heat dissipating member has a concavo-convex portion on the outer circumferential side surface thereof. By this, the surface area of the outer peripheral side can be increased to achieve further improvement in heat dissipation characteristics. Thus, the heat dissipating member for an LED electric ball of the present invention has a good heat dissipation performance, a simple structure, good productivity, and low cost. Therefore, if the heat dissipating member of the present invention is used, a high-performance and inexpensive L E D electric ball can be realized. [Embodiment] The heat radiating member for an LED electric ball of the present invention has a substantially conical shape, and 201120367 is provided with a concavo-convex portion on the outer peripheral side surface. In the uneven portion, a plurality of convex portions protruding outward are provided on the outer circumferential side surface to have a shape of the uneven portion as a whole, and a plurality of concave portions recessed inwardly are provided on the outer circumferential side surface to make the entire concave and convex portion shape, and The outer peripheral side surface is provided with a plurality of convex portions that protrude outward and a concave portion that is recessed toward the inner side, so that the entire shape of the concave and convex portions can be used. The uneven portion of any shape can be formed by press molding. Further, as the material of the aluminum alloy plate for the heat radiating member for the LED electric ball, a material suitable for forming processing such as a 1000-series, a '3000-series, a 5000-series, or a 6000-series can be used. For example, there are 1050, 8021, 3003, 3004, 3104, 5052 ' 5182, 5N01 and the like. Further, preferably, the aluminum alloy plate is a precoated aluminum alloy plate obtained by precoating a synthetic resin coating film on both sides or a single side of a substrate composed of the aluminum alloy plate, and is precoated at least. The synthetic resin coating film of the one surface is one or more selected from the group consisting of a urethane resin, an ionomer resin resin, a polyethylene resin, an epoxy resin, a fluororesin, and a polyester resin. A heat-dissipating coating film comprising a heat-dissipating substance in a matrix resin having a number average molecular weight of from 1,000,000 to 40 000 (Patent No. 2). The above-mentioned precoated aluminum alloy sheet, about a synthetic resin coating film The coating can also be carried out in large quantities and efficiently using continuous production lines. Further, the press forming of the precoated aluminum alloy sheet can be easily carried out by combining the techniques established so far, and it can be processed extremely efficiently and inexpensively on the premise of mass production. -8 - 201120367 The synthetic resin coating film of the at least one surface is provided with a heat-dissipating coating film containing the above-mentioned heat-dissipating material. Therefore, the precoated aluminum alloy sheet is a surface having a heat dissipation property which is more greatly improved than the state of the original material. A heat dissipating member which is formed into a substantially conical shape in a state in which a heat-dissipating coating film is provided on the surface thereof is preferable in that heat dissipation characteristics are obtained. The above-mentioned substantially conical shape is not limited to the geometrically substantially conical shape, and includes a cross-sectional shape orthogonal to the axial direction, which is a slightly rounded shape, and the outer diameter of one end in the axial direction is larger than the outer diameter of the other end. The shape of the outer diameter changes along the axial direction. In addition, when a synthetic resin coating film is formed only on one surface of the substrate, the synthetic resin coating film must have the heat-dissipating coating film, and when a synthetic resin coating film is formed on both surfaces of the substrate, it is only necessary to arrange The heat-dissipating coating film may be provided on the synthetic resin coating film on at least one of the surfaces. Of course, the above-described heat-dissipating coating film may be provided on the double-sided synthetic resin coating film. Further, the above-mentioned heat-dissipating coating film of the above-mentioned precoated aluminum alloy sheet can be selected from a single layer coating or a multilayer coating depending on the desired thickness. The above heat-dissipating coating film, as described above, must contain a heat-releasing substance and must contain a matrix resin having an average molecular weight of 10,000 to 40,000. In other words, the heat-dissipating coating film is a synthetic resin having a number average molecular weight of 1,000,000 to 4,000 00 as the matrix resin. When the number average molecular weight of the synthetic resin is less than 1,000,000, there is a problem that the coating film is hardened to deteriorate the formability for obtaining the characteristic shape in which the uneven portion is provided, and on the other hand, when it exceeds 4,000. There is a problem that the coating film is too soft and the damage resistance is lowered. -9-201120367 In the heat dissipating member for an LED electric ball of the present invention, the heat dissipating coating film preferably contains one or more kinds of titanium oxide, carbon, cerium oxide, aluminum oxide, and oxidizing gas as the heat dissipating substance. (Applicant's patent scope item 3). Thereby, the heat dissipation property of the heat dissipation coating film can be easily improved. The heat dissipation property of the heat-dissipating coating film can be evaluated by the integrated radiance of infrared rays. In the present invention, it is preferable to adjust the integral radiance of the infrared ray to 70% or more. Thereby, stable heat dissipation characteristics can be obtained. The integrated radiance of infrared rays can be measured by comparing the amount of infrared radiation between the sample and the ideal black body by FT-IR. Further, the heat-dissipating coating film preferably contains 50 to 200 parts by weight of titanium oxide having an average particle diameter of 0.1 to 1 μm, and 25 parts by weight of fine powder of carbon, based on 100 parts by weight of the above-mentioned matrix resin. One or two or more kinds of 50 to 200 parts by weight of cerium oxide, 50 to 200 parts by weight of alumina, and 50 to 200 parts by weight of zirconia (application patent item 4). In other words, when the heat-dissipating coating film contains titanium oxide, the average particle diameter is preferably 0.1 to 100 / / m. When the average particle diameter of titanium oxide is less than 0.1 y m, there is a problem that the infrared radiance is lowered. On the other hand, when it exceeds 100 Å, there is a problem that the number of detachment of titanium oxide from the coating film increases. In addition, the content of the titanium oxide in the heat-dissipating coating film is preferably 50 to 200 parts by weight based on 100 parts by weight of the matrix resin. When the content of the titanium oxide is less than 50 parts by weight, there is a problem that the infrared radiant radiance is lowered. On the other hand, when it exceeds 200 parts by weight, the number of detached titanium oxide from the coating film increases. Further, carbon of the above fine powder is preferably carbon having a particle diameter of -10-201120367 lnm to 500 nm. Further, the content of carbon in the heat-dissipating coating film is preferably from 1 to 25 parts by weight. When the content of carbon is less than 1 part by weight, there is a problem that the infrared ray integral radiance is lowered. On the other hand, when it exceeds 25 parts by weight, there is a problem that the number of detachment of carbon from the coating film increases. Further, the content 'when the ruthenium dioxide is contained in the heat-dissipating coating film' is preferably 50 to 2 parts by weight. When the content of the silica sand is less than 50 parts by weight, there is a problem that the infrared radiance is lowered. On the other hand, when it exceeds 200 parts by weight, there is a problem that the number of ruthenium dioxide detached from the coating film increases. Further, the content 'when alumina is contained in the heat-dissipating coating film is preferably from 50 to 2,000 parts by weight. When the content of alumina is less than 5 parts by weight, there is a problem that the infrared radiance is lowered. On the other hand, when it exceeds 200 parts by weight, there is a problem that the number of detachment of alumina from the coating film increases. Further, the content of the heat-dissipating coating film in the case of containing an oxidation pin is preferably 50 to 200 parts by weight. When the content of zirconia is less than 50 parts by weight, there is a problem that the infrared radiance is lowered. On the other hand, when it exceeds 200 parts by weight, there is a problem that the number of zirconia detached from the coating film increases. Further, the film thickness of the heat-dissipating coating film is preferably 0.5 to 100 #m. When the film thickness is less than 0.5 em, there is a problem that the infrared radiance is lowered. On the other hand, when it exceeds 100 pm, there is a problem that the cost increases. Further, the heat-dissipating coating film preferably contains a Ni spherical lumped material having an average particle diameter of 0.3 to 100/zm, or a scaly shape having a thickness of 0.2 to 5 m and having a long diameter of 2 to 50 m. The total content of at least one of the Ni 塡 fillers is 1 to 1 000 parts by weight based on 100 parts by weight of the matrix resin (the sixth item of the patent application). By including these Ni 塡 filling materials in the heat-dissipating coating -11 - 201120367 film, conductivity can be imparted to the heat-dissipating coating film, and the electromagnetic wave generated by the circuit of the LED ball can be shielded, and the other The influence of the electronic device, the home electric appliance, and the like is suppressed to a minimum. When the average particle diameter of the Ni spherical spheroidal material is less than 0.3 vm, a sufficient conductivity improving effect may not be obtained. At 100 /Z m, there is a problem that the amount of Ni spherical spheroidal material is increased from the coating film. In addition, when the thickness of the scaly Ni 塡 filling material is less than 0.2 # m, sufficient conductivity may not be obtained. The problem of improving the effect, on the other hand, when it exceeds 5 // m, there is a problem of cost increase. In addition, when the long diameter of the scaly Ni crucible is less than 2 μm, there is a problem that the conductivity is lowered. On the other hand, when it exceeds 50/zm, the scaly Ni crucible is peeled off from the coating film. The problem of increasing numbers. In addition, the total content (including the case where only one of the Ni spherical fillers and the scaly Ni ruthenium) of the Ni ruthenium fillers (including only one of the Ni ruthenium filler materials) is 1 part by weight based on the matrix resin. In other words, it is preferably 1 to 1000 parts by weight. When the content is less than 1 part by weight, the conductivity is insufficient. On the other hand, when it exceeds 1,000 parts by weight, the number of Ni-filled material from the coating film is increased. Further, the heat-dissipating coating film preferably contains one or two kinds of sheep fat cream, palm wax, polyethylene, and microcrystalline wax in an amount of 5 to 3 parts by weight based on 100 parts by weight of the above-mentioned matrix resin. The inner layer of wax (patent application scope 5). In this way, the damage resistance can be improved, and the processing can be improved. When the content of the inner layer wax is less than 0.05 part by weight based on 100 parts by weight of the matrix resin, there is a problem that the scratch resistance is lowered. On the other hand, when it exceeds 3 parts by weight, there is a problem of agglomeration. Further, the synthetic resin coating film is preferably formed on the upper layer of a coating type or a reactive type chromate or non-chromate layer formed on the surface of the substrate (Application No. 7). At this time, the adhesion between the aluminum alloy sheet and the precoat layer can be improved, and workability, durability, and the like can be improved. Further, preferably, the synthetic resin coating film having the heat-dissipating coating film has a plurality of laminated structures having a primer film on a lower layer of the heat-dissipating coating film, and the primer film is made of an amine. A resin composed of one or more of a urethane resin, an ionomer resin, a polyethylene resin, an epoxy resin, a fluororesin, and a polyester resin, and having a number average molecular weight of 1,000,000 or more (application) Article 8 of the patent scope). In this case, a synthetic resin coating film having various properties can be disposed as a primer film under the heat-dissipating coating film, and the adhesion, workability, and the like of the coating film can be further improved, in particular, by selecting the above specific resin. The resin having a number average molecular weight of 10,000 or more as the resin constituting the undercoat film can further improve the processability of the coating film when the heat dissipating member having the uneven portion is processed. Further, the upper limit of the number average molecular weight of the resin constituting the undercoat film is such that when the elongation of the undercoat film is significantly different from the elongation of the heat-dissipating film, cracks are likely to occur during processing, and for this reason, it is preferred. Set to 4 0 0 0 0. -13- 201120367 The primer film may be the same resin as the heat-dissipating coating film or other resin, except that it does not contain a heat-dissipating material. Further, when the film thickness of the undercoat film exceeds 50 vm, the adhesion between the aluminum alloy plate and the heat-dissipating coating film is lowered, so that it is preferably 50 // m or less, and when the film thickness is too thin, The adhesion is also lowered, so it is preferably set to lym or more. A more preferable range is 5/zm or more and 20#m or more. In addition, in the synthetic resin coating film, pigments and dyes can be added to improve the creativity without affecting heat dissipation, workability, and adhesion. [Examples] (Example 1) Fig. 8 is a view showing a heat dissipating member for an LED electric ball according to an embodiment of the present invention. The heat radiating member 1 for LED electric balls of this example is a heat radiating member of the LED electric ball 80 in which the LED element 8 is built as shown in Fig. 8. In this example, a plurality of types of heat dissipating members 1 were produced and evaluated. The heat dissipating member 1 as an embodiment of the present invention is formed by molding the aluminum alloy sheet 20 into a substantially conical shape as shown in Figs. 2 to 5 . The uneven portion 1 2 is formed on the outer peripheral side surface 10 of the heat radiating member 1. Further, for some, it is formed by using the following precoated aluminum alloy sheet 2 which pre-coats the heat-dissipating coating film 21 containing the heat-dissipating substance 215 to the aluminum alloy sheet. The substrate 20 is constructed as 14-201120367 double-sided. The manufacturing process of the heat radiating member 1 described above will be described in detail below. <Ming alloy plate> The aluminum alloy plate 20 is made of an aluminum alloy plate of a material size of 5N01-O and having a size of 1.5111111 thick) <100 „1111 wide x l〇〇mm, and is made of alkali The degreaser is used in a state where the both sides are degreased. <Precoated aluminum alloy sheet> As shown in Fig. 1, a precoated aluminum alloy sheet 2 for the heat radiating member 1 is produced. The substrate 20 is prepared by a substrate having a material size of 5N01-O and a size of 1.5 mm thick x 100 mm wide x 100 mm long. After the both sides of the substrate 20 are degreased by an alkali degreaser, the substrate 20 is immersed in The anodizing treatment is carried out in a phosphoric acid chromate bath. The obtained anodized film (chromate chromate film) 22, the Cr content in the film is set in the range of 20 ± 5 mg/m 2 . A synthetic resin coating film composed of the film 21 is formed on each of both sides of the substrate 20. The coating is used as a matrix resin using a polyester resin having a number average molecular weight of 10,000 as a matrix resin. 50 parts by weight of the average particle diameter 1 # of the above-mentioned matrix resin The titanium oxide of m contains 1 part by weight of polyethylene as the inner layer wax. The coating is performed using a bar coater, and the thickness of the heat-dissipating coating film 2 1 is set to 30 # m. The sinter-hardening condition -15-201120367 of the coating film 21 is maintained in an oven at 240 ° C for 60 seconds in such a manner that the surface temperature is 203°. <Molding > As shown in Fig. 2 Applying a plurality of press moldings to the aluminum alloy sheet 20 or the precoated aluminum alloy sheet 2. First, as shown in Fig. 2 (a) (b), the flat aluminum alloy sheet 20 or precoated The aluminum alloy sheet 2 is subjected to an extension process, and is formed into a substantially conical shape intermediate body 151. At this time, the bottom material 1 5 8 is present at the small-diameter front end portion of the intermediate body 1 5 1 . And around the rear end of the large diameter, the periphery of the formed portion is left as a blank portion 159. Next, as shown in Fig. 2(b)(c), the substantially conical intermediate 15 is formed. The bottom material 1 5 8 at the front end portion of the small diameter is cut off, and the blank portion 159 around the rear end portion of the large diameter is cut off. Next, as shown in Fig. 2 (c) (d) shows that the concave-convex portion 1 2 having the concave portion 1 2 1 is formed on the outer circumferential side surface of the intermediate body 151. The uneven portion 12 is longitudinally arranged along the axial direction to have a substantially circular cross section. The recessed portion 121 is formed by arranging 16 in the peripheral direction. The heat dissipating member 1 obtained as shown in Fig. 3 is shown in the front and rear of the body portion of the conical shape and has a flat portion 18, 9 As shown in Fig. 3 and Fig. 5, the outer diameter D1 of the large diameter portion is about 53 mm, the small diameter D2 is about 25 mm, the total length L is about 45 mm, and the depth D3 of the concave portion 121 is 2 mm. -16-201120367 <Evaluation Material> The embodiment of the present invention in which the precoated aluminum alloy sheet 2 is used as a raw material and in the state of 1 to 5 is used as the evaluation material 1 for the synthetic resin coating film. The above-described aluminum alloy sheet 20 was used as the embodiment of the present invention in the state of FIGS. 3 to 5, and two kinds of evaluation materials as comparative examples were prepared. The evaluation material 3 is obtained by molding the above-mentioned precoated aluminum alloy sheet 2 to the state of Fig. 2(c). In the evaluation material 4, the unnamed alloy sheet 20 to which the synthetic resin coating film was not applied was used as a raw material, and was molded into the evaluation materials 3 and 4 of Fig. 2(c), and the uneven portion was not formed on the outer peripheral side. The shape of the circular outer peripheral side. <Evaluation> The evaluation was carried out using the LED electric ball 80 produced by each evaluation material member as shown in Fig. 8. The LED electric ball 80 shows that the cover made by molding the aluminum alloy plate is combined with the heat dissipating member 1 on the upper surface of the cover 3 | the components 8 (only two are shown) and the control portion The nozzle portion heat member 1 is disposed and covered with a hemisphere for covering the lid body 3. The LED element 8 is configured to generate a thermochromatic LED element having a temperature of 85 °C. The evaluation method is a thermocouple for temperature measurement (the figure is completed to the third figure, and the above-mentioned state which is not applied as the raw material and the § evaluation material 2 is used as the raw material and coated. The heat dissipation is as shown in the figure 3 (the figure 6 is omitted when the four LEDs 8 6 are inserted into the mask 8 5). -17- 201120367 is fixed near the LED element 8 of the above-mentioned LED ball 80 The method of measuring the temperature rise per unit time of energization luminescence is measured on the surface of the lid 3. The measurement results are shown in Table 1. [Table 1] (Table 1) Evaluation of material temperature (. 〇 / energization time Να Synthetic resin coating film unevenness 0 minutes 20 minutes 40 minutes 60 minutes 80 minutes 100 minutes 1 There are 28 49 51 52 52 53 2 Art m There are 28 51 54 55 55 55 3 There are 28 57 62 63 64 64 4 Pick no 28 58 65 68 68 67 As can be seen from the first table, the evaluation materials 1 and 2 of the examples of the present invention can be compared with the evaluation materials 3 and 4 of the other comparative examples, and the heat dissipation performance is good (Example 2) For the example of the synthetic resin coating film of Example 1, the embodiment was further increased for evaluation. First, The evaluation material was produced in the following manner: 9 <Precoated aluminum alloy sheet> As in the first embodiment, as shown in Fig. 1, a precoated aluminum alloy sheet 2 for a heat radiating member was produced. Prepare the material - the material of the size A1 05 0-0 material, the size of 0.5mm thick xlOOmm wide x lOOmm long. Then, the double side of the substrate 20 is subjected to the alkali degreaser & 18- 201120367 The anodizing treatment shown in Tables 2 and 3 is carried out. The anodizing treatment a is a reaction type chromate formed by treating the chromate with a chromate to form a chromium content of 2 〇mg/m2. Specifically, the film is anodized by a liquid immersion method in which a sample is immersed in an anodizing treatment liquid, and then dried in an environment of about 100 ° C. Anodizing treatment b is performed by The zirconium treatment is carried out so that the reaction type is 2 〇mg/m 2 to form a reactive non-chromate film. The treatment method is the same as the above anodizing treatment a. The anodizing treatment c is a coating type chromate treatment, Forming a film so that the amount of chromium becomes 2 〇mg/m 2 . Specifically, The anodizing treatment liquid was applied by a bar coater, and then dried in an environment of about 1 2 ° C. The anodizing treatment d was carried out by coating type zirconium so that the amount of zirconium became 20 mg/m 2 . The anodized film is formed. Specifically, the anodizing treatment liquid is applied by a bar coater, and then dried in an environment of about 120 k. Then, a polystyrene resin having a number average molecular weight of 1,6,000 was applied to one surface of the substrate 20 by a bar coater to form a non-heat-dissipating coating film to form a slab coating film. The film thickness was set to 15/zm. And kept in an oven at 240 ° C for 60 seconds in such a manner that the surface temperature was 23 °C. Then, the synthetic resin coating film having the configuration shown in the second table and the third table is formed on the opposite side of the coating surface composed of the above polyester resin. As shown in Table 3 of Table 2, 'For samples E 4 to E 6 , E 3 7 , E 4 0, and E 4 2, respectively, < Polyester resin, urethane resin, polyester resin Or epoxy resin -19-201120367 The coating film is used as the undercoat film, and a heat-dissipating coating film is formed as the upper layer. Others do not form an undercoat film to form the outermost layer. Any coating was carried out using a bar coater, and the film thickness of the undercoat film was set to 10 Vm, and the film thickness of the heat-dissipating film was set to 25 / m. Further, the sintering conditions of the undercoat film were set to be maintained in an oven for 60 seconds so that the surface temperature became 23 ° C. The sintering hardening conditions of the heat-dissipating coating film were such that the surface temperature became 23 0 . The condition of °C is maintained in an oven at 240 ° C for 60 seconds.

此外,係於散熱性塗膜中含有內層蠟。內層蠘的種類 及含量如第2表、第3表所示,「PE」表示聚乙烯,「CA 」表示棕櫚蠟,「MC」表示微晶蠟,「LL」表示羊脂膏 〇 此外,散熱性塗膜中所含有之散熱性物質,全部試樣 均使用氧化鈦。此外,對於一部分試樣更添加微粉末的碳 或二氧化矽。氧化鈦的粒徑及含量,以及碳及二氧化矽的 含量’係如第2表、第3表所示。 此外’對於試樣的一部分,係於散熱性塗膜中含有Ni 球狀塡充材或鱗片狀的Ni塡充材。此等塡充材的直徑及含 量’係如第2表、第3表所示^ -20- 201120367 se §s) s ·0/·0 90Ό 駿卿 <u J3I —US Ί^, JMH, dH— ~5T" d— d— ~U" "55" Ja— "55Γ "15" llu'2'v3dl s d— 002Further, the heat-dissipating coating film contains an inner layer wax. The types and contents of the inner layer are as shown in Tables 2 and 3. "PE" means polyethylene, "CA" means palm wax, "MC" means microcrystalline wax, and "LL" means sheep fat paste. The heat-dissipating substance contained in the coating film used titanium oxide for all the samples. Further, a fine powder of carbon or cerium oxide is further added to a part of the sample. The particle size and content of titanium oxide, and the content of carbon and cerium oxide are shown in Tables 2 and 3. Further, a part of the sample was contained in a heat-radiating coating film containing a Ni spherical sputum filler or a scaly Ni yttrium filler. The diameter and content of these 塡 filling materials are as shown in Table 2 and Table 3 ^ -20- 201120367 se §s) s · 0/·0 90 骏 Junqing <u J3I — US Ί^, JMH, dH— ~5T"d-d-~U""55" Ja- "55Γ "15" llu'2'v3dl sd- 002

(J *·0 >7o (e>s_) 1(J *·0 >7o (e>s_) 1

OS "W 越《-薅堪<0 § (φ__) s仞 og os 0 (Φ* 細) s - 3i OQI i_) ΪOS "W The more "-薅堪<0 § (φ__) s仞 og os 0 (Φ* thin) s - 3i OQI i_) Ϊ

OS ~55T ΈΤΓ ΙΟ0Γ "όδΓ lolOI "W" OS —001 —001 lolOY nm ~55T "55Γ "WT d— "M" 001 nm —GOT ε.ο 7^7 s 衫1 0 nm TF "101 hl0— Is c.o WT ε·0 is T5" ΤΓ T5~ ·'0 Ho '•o T5" Τϋ" hllo— '·'0 hm s Is _±φ 00001 00091 0Q09II 0Q091I 0009 Γ 0QlglT 00091 0g9I oogl Q0lglr 0—0。|§|「 Qg9I i9i oil QOlslI— 00lglr 00091 Q0lglr Q— 00091 0009ΙΓ QOQ9I 00091 0000寸 s^i 00 i "IS" yFI §SFI 避Fl 1¾. d^« yFI 避Fl s .¾. "IS" d^, d^i (1 «ai 01 ΤΓ 駿娜蠢 i d^i |避^~ 111 哀) 紙】OS ~55T ΈΤΓ ΙΟ0Γ "όδΓ lolOI "W" OS —001 —001 lolOY nm ~55T "55Γ "WT d- "M" 001 nm —GOT ε.ο 7^7 s shirt 1 0 nm TF "101 hl0— Is co WT ε·0 is T5" ΤΓ T5~ ·'0 Ho '•o T5"Τϋ" hllo— '·'0 hm s Is _±φ 00001 00091 0Q09II 0Q091I 0009 Γ 0QlglT 00091 0g9I oogl Q0lglr 0-0. |§|"Qg9I i9i oil QOlslI- 00lglr 00091 Q0lglr Q— 00091 0009ΙΓ QOQ9I 00091 0000 inch s^i 00 i "IS" yFI §SFI Avoid Fl 13⁄4. d^« yFI Avoid Fl s .3⁄4. "IS" d^, d^i (1 «ai 01 骏 Junna stupid id^i | avoid ^~ 111 mourning) paper]

Qgl s. lgllolI OSQI lsl^T —OSOI OSS Qlsll s. δ^δτ 〇g〇i I0SI0T ss TIT —611叫 IZT1MI 9Ιιω1 '"叫 TIT T!f" TtT TIT N, J^— dn -21 - 201120367 (ε«) 【瓒撕】 §s ¥仞 §s) ¥仞 (I) 靼瞰 ie Ϊ sd ι.ε 3d 3d 3d 3d 3d wd 3d wd 3d wd wd 3d 3d 3d ω<1Gl^δτ 〇g〇i I0SI0T ss TIT —611 is called IZT1MI 9Ιιω1 '"TIT T!f" TtT (ε«) [瓒撕] §s ¥仞§s) ¥仞(I) ie ie Ϊ sd ι.ε 3d 3d 3d 3d 3d wd 3d wd 3d wd wd 3d 3d 3d ω<1

Hd 3d wd 3dHd 3d wd 3d

3d "IT 蠢— ss 越驾> 圈醛 s βη §8 ¥邻 s3d "IT stupid - ss more than driving> circle aldehyde s βη §8 ¥ neighbor s

OSOS

OS -OS -

IsIs

OSOS

OS 0 §¥s) ϊ _^φ 既雜謹 (1 s wss (劫頓翠 嫲圈豳) 6.0 •sz 001 °2OS 0 §¥s) ϊ _^φ Both mixed (1 s wss (Robbery 嫲 嫲 豳) 6.0 • sz 001 °2

Is 001 001Is 001 001

0°I 0010°I 001

OS 001 001 02 001 001 02 001 001 001 001 001 001 001 001 "WT Π55Γ so.o ·0 ·0 ·0 ·0 ·0 ·0 ·0 ·0 ·0 ·0 s 0 ·0 ·0 ε.ο ·0 ε.ο ε·0 ε.ο sOS 001 001 02 001 001 02 001 001 001 001 001 001 001 001 "WT Π55Γ so.o ·0 ·0 ·0 ·0 ·0 ·0 ·0 ·0 ·0 ·0 s 0 ·0 ·0 ε. ο ·0 ε.ο ε·0 ε.ο s

s NM oil 00091s NM oil 00091

OOSI oilOOSI oil

G009I 00091 00091 00091 00091 oi 00091 00091 00091 §091 °1 00091 00091 00°2 00091 —91 000- 00091 go1- ooos 00091 豳联 00G009I 00091 00091 00091 00091 oi 00091 00091 00091 §091 °1 00091 00091 00°2 00091 —91 000- 00091 go1- ooos 00091 Couplet 00

I 魎联 00 避账 00 m10 i 避账 00 避账 避联 硼镞 00S0 00s^ ΞI 魉 00 ○ Avoid 00 m10 i Avoid 00 Avoiding Avoiding Boron 00 00S0 00s^ Ξ

I礙趙frg埋I 涯*2联 01 β s 1 sol °sol osoi osl osoiI hindu Zhao frg buried I ya * 2 joint 01 β s 1 sol °sol osoi osl osoi

SOI osl OSOi osoiSOI osl OSOi osoi

SOI ε°οε 30εSOI ε°οε 30ε

SOSSOS

28IS28IS

I osl osl oslI osl osl osl

SOISOI

SOISOI

SOISOI

OSOIOSOI

SOI OS-SOI OS-

0S0I 9S3 β 8Z3 S30S0I 9S3 β 8Z3 S3

OS Ιεω ζεω S3 ss 9εω 卜s 8εω 6C3OS Ιεω ζεω S3 ss 9εω Bu s 8εω 6C3

OSOS

Is ss ε2Is ss ε2

9S9S

9S § ss 13 ΰ -22- 201120367 對所得之各試樣,與實施例1相同’係如第2圖所示’ 對鋁合金板2 0或經預塗的鋁合金板2施以複數次的模壓成 形。模壓成形後所得之散熱構件1 (第3圖)的尺寸、凹凸 部的形狀,亦與實施例〗相同。 以目視來觀察所得之散熱構件的塗膜狀態,來確認塗 膜(合成樹脂塗膜)的裂痕、損傷性、剝離。再者’亦評 估散熱性及創意性(隱蔽性及光澤)。 關於塗膜的裂痕,係藉由目視觀察’在進行模壓加工 後的凸部之中塗膜呈裂開的狀態者當中,以在長度1 mm以 上且寬度1mm以上之範圍內銘材料所暴露出者作爲裂痕。 塗膜裂痕的評估點係設爲5階段。具體而言,無塗膜裂痕 者爲5點,長度1mm以上1.1mm以下或寬度lmm以上1.1mm 以下的塗膜裂痕爲1個時爲4點’長度1 mm以上1 · 1 mm以下 或寬度lmm以上1.1mm以下的塗膜裂痕爲2個時爲3點’長 度超過1.1mm或寬度超過1.1mm的塗膜裂痕爲1個時爲2點 ,長度超過1 .lmm或寬度超過1.1mm的塗膜裂痕爲2個以上 時爲1點,並以3點以上爲合格。 關於損傷性,係藉由目視觀察,在進行模壓加工後的 塗膜表面上,在可認定爲以雜質爲起點之塗膜破壞當中, 以在長度lmm以上且寬度0.5mm以上之範圍內鋁材料所暴 露出者作爲塗膜的損傷。 塗膜損傷的評估點係設爲5階段。具體而言’無損傷 者爲5點,損傷爲1〜2個時爲4點,損傷爲3〜4個時爲3點, 損傷爲5〜6個時爲2點,損傷爲7個以上時爲1點,並以3點 -23- 201120367 以上爲合格。 關於剝離,在將模壓加工後的試樣保持在溫度6 5 °c、 濕度9 0 % RH的環境下3 0小時後,藉由目視觀察’以具有上 述裂痕或損傷的缺陷之部分以外的部分的塗膜產生剝離, 且在長度〇.5mm以上且寬度0.5mm以上之範圍內鋁材料所 暴露出者作爲裂痕。塗膜裂痕的評估點係設爲5階段。具 體而言,無塗膜剝離者爲5點,長度0.5 mm以上且未達 0.7mm或寬度0.5 mm以上且未達0.7mm的剝離爲1個時爲4點 ,長度〇.7mm以上且未達0.9mm或寬度0.7mm以上且未達 0.8mm的剝離爲1個時爲3點,長度0.9mm以上且未達1.1mm 或寬度〇.9mm以上且未達1.1 mm的剝離爲1個時爲2點,長 度1 . 1 mm以上或寬度1 . 1 mm以上的剝離爲2個以上時爲1點 ,並以3點以上爲合格。 散熱性的試驗,係使用將各評估材用作爲散熱構件並 與實施例1相同地製作出之LED電球來進行。 評估方法,係將溫度測定用的熱電偶(圖示中省略) 固定在上述LED電球的LED元件附近之蓋體表面上,並測 定出通電發光之每單位時間的溫度上升之方法。 隱蔽性與光澤,係以成形前的平板來進行測定。首先 製備下列者作爲標準色的塗裝板。使用棒塗佈機,將在數 量平均分子量16 00 0的聚酯樹脂中含有重量份之一次粒 徑0.3 μ m的氧化鈦之塗料,塗裝於厚度3mm的透明玻璃板 。塗膜厚度設爲50#m,並以使表面溫度成爲230 °C之方式 在24〇°C的烘箱中保持60秒。 -24 - 201120367 隱蔽性的評估,係藉由色差計(Konica Minolta公司 製CR 100 )來測定塗裝板的L*値,並算出以標準板的L*値 爲1 00時之相對値。隱蔽性的評估點係設爲5階段。具體而 言,L *値的相對値爲9 6以上1 0 0以下時爲5點,L *値的相對 値爲91以上且未達96時爲4點,L*値的相對値爲86以上且 未達9 1時爲3點,L *値的相對値爲8 1以上且未達8 6時爲2點 ,:L*値的相對値爲未達8 1時爲1點,並以3點以上爲合格。 光澤度的評估,係藉由光澤計(崛場製作所公司製 Gloss Checker IG3 20 )對塗裝板的光澤測定60°的光澤·度, 並算出以標準板的光澤度爲1 〇〇時之相對値來進行。光澤 度的評估點係設爲5階段。具體而言,光澤度的相對値爲 96以上1〇〇以下時爲5點,光澤度的相對値爲91以上且未達 96時爲4點,光澤度的相對値爲86以上且未達91時爲3點, 光澤度的相對値爲8 1以上且未達8 6時爲2點’光澤度的相 對値爲未達8 1時爲1點,並以3點以上爲合格。 加工性的評估,係以塗膜的裂痕性、耐損傷性及塗膜 剝離均合格者爲合格(良),當中任一項目爲不合格者爲 不合格(劣)。此外,加工性的評估爲良且散熱性的評估 爲優時,總合評估爲合格(〇),加工性的評估爲劣且散 熱性的評估爲劣(此次試驗中無相當於此之試樣)時,總 合評估爲不合格(X )。 評估結果如第4表及第5表所示。 -25- 201120367 9椒) f濉】 評估結果. I 總合評估 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 創意性 | 光澤 (評估點) UO LO in in in LO ΙΟ in in LO CO tn LO LO in ΙΛ to CO LO to in m to LC 隱蔽性 (評估點) in in LO 1C in in CO LO in in l〇 in in in in in LO in in in in in in L〇 散熱性 | 散熱性總合 m 圉 m m 嘩 m m 嘩 嘩 嘩 m 擊 m m m m m 曄 m m m m m 嘍 溫度 (°C) CO in CS3 CO CM ΙΛ CM in CO to CO LO CO LO Cv3 to CO ΙΛ CV3 in CO in CM LO CvJ in CO in CO LO CS3 in 寸 in CO 1C CO LO CO LO CO m CO LO CO to CO in CO LT3 加工性 I 加工性總合 曄 曄 m 嗶 嗖 m 噻 曄 m m m m m m m 擊 豳 噢 m m m 噢 豳 m 噢 塗膜剝離 (評估點) 寸 in ΙΛ 寸 in in LO LO LO in in LO in m to in ιο LO m in m ΙΟ LQ tn UO 耐損傷性 寸 呀 L〇 in to LO l〇 in in in in in LO in ΙΛ 寸 LO LO to m LO LO LO 裂痕性 (評估點) IT5 uo in in LO LO 才 LO TT 寸 LT3 to LO in 寸 in in ΙΛ m 寸 LO 試樣 No. ω CQ ω CO ω 寸 ω in ω CD ω 卜 ω 00 ω 0¾ ω 1 Eio | 1 Ell | 1 E12 I 1 E13 I 1 E14 I 1 E15 1 1 E16 1 1 E17 1 1 E18 1 IE19J 1 E20 1 1 E21 I 1 E22 1 1 E23 1 LE24 I 1 E25 -26- 201120367 (sssss9S § ss 13 ΰ -22- 201120367 The obtained samples are the same as in the first embodiment 'as shown in Fig. 2'. The aluminum alloy plate 20 or the precoated aluminum alloy plate 2 is applied plural times. Molded. The size of the heat dissipating member 1 (Fig. 3) obtained after press molding and the shape of the concavo-convex portion are also the same as those in the embodiment. The state of the coating film of the obtained heat dissipating member was visually observed to confirm the crack, damage, and peeling of the coating film (synthetic resin coating film). Furthermore, heat dissipation and creativity (hiddenness and luster) are also evaluated. The crack of the coating film is visually observed. Among the members in which the coating film is cracked in the convex portion after the press working, the material is exposed in a range of 1 mm or more in length and 1 mm or more in width. As a crack. The evaluation point of the coating crack is set to 5 stages. Specifically, when there is no coating crack, it is 5 points, and if the coating film having a length of 1 mm or more and 1.1 mm or less or a width of 1 mm or more and 1.1 mm or less is one, it is 4 points 'length 1 mm or more, 1 · 1 mm or less, or width lmm. When the coating film crack of 1.1 mm or less is 2 points, the coating film having a length of more than 1.1 mm or a width exceeding 1.1 mm is 2 points, and a film having a length exceeding 1.1 mm or a width exceeding 1.1 mm When the number of cracks is two or more, it is one point, and it is qualified by three or more points. Regarding the damage property, by visual observation, in the surface of the coating film after the press working, in the case of coating film damage which can be considered as the starting point of impurities, the aluminum material is in the range of lmm or more and width of 0.5 mm or more. The exposed person is damaged as a coating film. The evaluation point of the film damage is set to 5 stages. Specifically, it is 5 points for no damage, 4 points for damage to 1 to 2, 3 points for damage to 3 to 4, 2 points for damage to 5 to 6 and 7 or more for damage. It is 1 point and is qualified from 3:23 to 201120367. With regard to the peeling, after the molded sample was kept at an environment of a temperature of 65 ° C and a humidity of 90% RH for 30 hours, the portion other than the portion having the above crack or damage was visually observed. The coating film is peeled off, and the aluminum material is exposed as a crack in a range of a length of 〇5 mm or more and a width of 0.5 mm or more. The evaluation point of the coating crack is set to 5 stages. Specifically, when there is no peeling of the coating film, it is 5 points, the length is 0.5 mm or more, and the peeling is less than 0.7 mm, the width is 0.5 mm or more, and the peeling is less than 0.7 mm. When the peeling is one, it is 4 points, and the length is 7.7 mm or more and is not reached. When the peeling of 0.9 mm or the width of 0.7 mm or more and less than 0.8 mm is 3 points, the length is 0.9 mm or more and the length is not more than 1.1 mm, or the width is less than 9 mm and the peeling is less than 1.1 mm. When the peeling of the length of 1.1 mm or more or the width of 1.1 mm or more is 2 or more, it is 1 point, and it is qualified by 3 or more points. The heat dissipation test was carried out by using the LED electric balls produced in the same manner as in Example 1 using each of the evaluation materials as a heat dissipating member. In the evaluation method, a thermocouple for temperature measurement (omitted from the drawing) is fixed to the surface of the lid of the LED bulb in the vicinity of the LED element, and a temperature rise per unit time of the energization luminescence is measured. Concealment and gloss were measured using a flat plate before forming. First, the following were prepared as standard color coated plates. A coating material containing titanium oxide having a primary particle diameter of 0.3 μm in a weight ratio of a polyester resin having an average molecular weight of 10,000 was coated on a transparent glass plate having a thickness of 3 mm by using a bar coater. The coating film thickness was set to 50 #m, and was maintained in an oven at 24 ° C for 60 seconds so that the surface temperature became 230 °C. -24 - 201120367 The evaluation of concealment was carried out by measuring the L*値 of the coated plate by a color difference meter (CR 100 manufactured by Konica Minolta Co., Ltd.), and calculating the relative enthalpy when the L*値 of the standard plate was 100 Å. The hidden evaluation point is set to 5 stages. Specifically, when the relative enthalpy of L * 値 is 9 6 or more and 100 or less, it is 5 points, the relative enthalpy of L * 値 is 91 or more, and when it is less than 96, it is 4 points, and the relative enthalpy of L* 値 is 86 or more. When it is less than 9 1 , it is 3 points, and the relative enthalpy of L * 値 is 8 1 or more and 2 points when it is less than 8 6 , and the relative 値 of L* 値 is 1 point when it is less than 8 1 and is 3 Above the point is qualified. The glossiness was evaluated by measuring the gloss of the coated plate by the gloss meter (Gloss Checker IG3 20 manufactured by Horiba, Ltd.), and calculating the relative gloss of the standard plate when the gloss was 1 〇〇. Let's do it. The evaluation point of gloss is set to 5 stages. Specifically, when the relative enthalpy of the glossiness is 96 or more and 1 〇〇 or less, it is 5 points, the relative enthalpy of gloss is 91 or more, and when it is less than 96, it is 4 points, and the relative enthalpy of gloss is 86 or more and less than 91. When the time is 3 points, the relative enthalpy of the gloss is 8 1 or more, and when it is less than 8 6 , the relative 値 of the glossiness is 1 point when it is less than 8 1 and is equal to 3 points or more. The evaluation of the workability is qualified (good) for those who have passed the cracking, scratch resistance and peeling of the coating film, and any of the items that are unqualified is unqualified (inferior). In addition, the evaluation of the processability is good and the evaluation of the heat dissipation is excellent, the total evaluation is qualified (〇), the evaluation of the workability is inferior and the evaluation of the heat dissipation is inferior (the test is not equivalent in this test) When the sample is evaluated, the total is evaluated as unacceptable (X). The results of the assessment are shown in Tables 4 and 5. -25- 201120367 9 ) 濉 评估 评估 评估 I I ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ Creative | Gloss (evaluation point) UO LO in in LO ΙΟ in in LO CO tn LO LO in ΙΛ to CO LO to in m to LC invisibility (evaluation point) in in LO 1C in in CO LO in in l〇in in in in LO in in In in in in L〇 Heat dissipation | Total heat dissipation m 圉mm 哗mm 哗哗哗m mmmmmm 晔mmmmm 喽temperature (°C) CO in CS3 CO CM CM CM in CO to CO LO CO LO Cv3 to CO ΙΛ CV3 in CO in CM LO CvJ in CO in CO LO CS3 in inch in CO 1C CO LO CO LO CO m CO LO CO to CO in CO LT3 Processability I Processability 晔晔m 哔嗖m 晔 晔mmmmmmm 豳噢mmm 噢豳m 噢film peeling (evaluation point) inch in ΙΛ inch in in LO LO LO in in LO in m to in ιο LO m in m ΙΟ LQ tn UO damage resistance inch L〇in to LO l〇 In in in in LO in LO LO LO to m LO LO LO Crack (evaluation point) IT5 uo in in LO LO LO TT LT3 to LO in inch in in ΙΛ m inch LO sample No. ω CQ ω CO ω inch ω in ω CD ω ω 00 ω 03⁄4 ω 1 Eio | 1 Ell | 1 E12 I 1 E13 I 1 E14 I 1 E15 1 1 E16 1 1 E17 1 1 E18 1 IE19J 1 E20 1 1 E21 I 1 E22 1 1 E23 1 LE24 I 1 E25 -26- 201120367 (sssss

評估結果 1 總合評估 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 ◎ ◎ ◎ ◎ ◎ 〇 〇 〇 〇 〇 〇 〇 〇 X X 創意性 1光澤 | (評估點) CO CO in oo 寸 CS CO LO tn ΙΛ l〇 LO l〇 to LO in uo 1C LO LO LO LO in 隱蔽性 (評估點) CO lO CO 1C ΙΟ LO LO LO LO LO l〇 LO LO LO LO LO LD LO LO LO L〇 LO in in LO 散熱性 丨散熱性總合 蝉 幽 m m 豳 豳 豳 噢 m 鹧 m 蜓 噢 m 噢 |溫度 1 (°〇 CO in CO L〇 CO in CO iO CO in CNJ LO CN] cr> LO CO LC n LO CO in CM LO CM LO in LO CM ΙΛ CV3 ΙΛ CM LO eg LO CNJ LO CM Ln CV3 LO C^3 LO LO LO CO LO 加工性 | 丨加工性總合 吡 碑 硪 賊 啤 啤 啤 赋 啤 豳 噢 m m 賦 啤 碑 吡 砬 吡 賦 袜 轵 塗膜剝離 i (評估點) in LO LO CO ΙΟ ΓΟ CO CO LO uo LO UO LO LO in CO CO CO cr> CO CO CO in |耐損傷性 LO CO LO LO in LO in LO rc CO in LfO in in LO CO CO CO CO CO LO lO CO <>3 裂痕性 (評估點) LO LO LO in 寸 寸 寸 in in in in ID m LO LO LO CO CO uo CN LO 試樣 No. 1 E26 1 1 E27 1 1 E28 1 1 E29 1 LE30 1 E31 1 E32 1 1 E33 1 1 E34 j 1 E35 1 1 E36 1 1 E37 1 1 E38 1 1 E39 1 1 E40 1 1 Ε4Π 1 E42 1 1 E43 1 1 E44 1 1 E45 I 1 E46 1 E47 I 1 E48 ψ' m U U -27 - 201120367 從第4表及第5表中所得知般,作爲LED電球用散熱構 件的基本性能之散熱性,在全部試樣中均爲良好,但對於 用以確保此散熱性之合成樹脂塗膜的加工性,試樣C 1、C 2 爲不合格。從該情況中可得知,含有散熱性物質之散熱性 塗膜之基質樹脂的分子量,對於將具有凹凸部之特殊形狀 的LED電球用散熱構件予以成形時之塗膜的加工性會產生 影響。 此外,關於含有於散熱性塗膜之散熱性物質、Ni塡充 材及內層蠟,藉由在上述較佳範圍內選擇,不僅是散熱性 及導電性,亦包含創意性而提升總合特性。 (實施例3 ) 本例中,係顯示出變更實施例1所示之散熱構件1的形 狀之變形例。 第9圖〜第11圖係顯示與散熱構件1的軸方向正交之方 向的橫向剖面之形狀的變形例。任一圖均相當於實施例1 的第3圖。 第9圖所示之散熱構件1 0 3,係將凹凸部1 3的凸部1 3 1 與凹部132的剖面形狀均構成爲圓弧狀,並交互地平滑連 接者。 第1 0圖所示之散熱構件1 04,係將凹凸部1 4的凸部1 4 1 與凹部1 42的剖面形狀均構成爲去除底邊之梯形狀,並交 互地連接者。 第1 1圖所示之散熱構件1 0 5,係將凹凸部1 5的凸部1 5 1 -28 - 201120367 與凹部1 5 2的剖面形狀均構成爲去除底邊之三角形狀’並 交互地連接者。 第1 2圖爲散熱構件之全體形狀的變形例。同圖所示之 散熱構件1 〇 6,係省略凹凸部的記載’並僅以線來顯示該 方向者。如同圖所示’散熱構件的形狀’並非如實施例1 所示般之相對單純的圓錐形狀,取而代之的是如散熱構件 1 〇 6般’構成爲隨著從大徑部往小徑部接近’其相對於軸 方向之傾斜角度變大之所謂的富士山型形狀。 第13圖、第14圖所示之散熱構件1〇7’與至目前爲止 所說明之凹凸部與形成方向不同’係以沿著與軸方向正交 之方向配置凸部1 7 1與凹部1 7 2間的長條之方式來形成凹凸 部1 7之例子。 採用上述變形例,亦可獲得與實施例1、2同樣之效果 【圖式簡單說明】 第1圖係顯示實施例1之經預塗的鋁合金板的構造之說 明圖。 第2圖係顯示實施例1之散熱構件的成形方法之說明圖 〇 第3圖爲實施例1之散熱構件之側面圖。 第4圖爲實施例1之散熱構件之底面圖。 第5圖爲實施例1之散熱構件之橫向剖面圖(從第3圖 的A-A線箭頭觀看之剖面圖)。 -29- 201120367 第6圖爲實施例1之蓋體之剖面圖(從第7圖的B-B線箭 頭觀看之剖面圖)° 第7圖爲實施例1之蓋體之俯視圖。 第8圖係顯示實施例1之LED電球之說明圖。 第9圖係顯示實施例3之散熱構件的變形例之橫向剖面 圖。 第1 0圖係顯示實施例3之散熱構件的變形例之橫向剖 面圖。 第1 1圖係顯示實施例3之散熱構件的變形例之橫向剖 面圖。 第1 2圖係顯示實施例3之散熱構件的變形例之側視圖 〇 第1 3圖係顯示實施例3之散熱構件的變形例之側視圖 〇 第1 4圖係顯示實施例3之散熱構件的變形例之縱向剖 面圖。 【主要元件符號說明】 1、103~107: LED電球用散熱構件 1 〇 :外周側面 12 、 13〜17 :凹凸部 1 2 1 :凹部 2 :經預塗的鋁合金板 20 :基板 -30- 201120367 2 1 :散熱性塗膜(合成樹脂塗膜) 8 : L E D元件 8 0: L E D電球 -31 -Evaluation result 1 Total evaluation 〇〇〇〇〇〇〇〇〇〇 ◎ ◎ ◎ ◎ ◎ 〇〇〇〇〇〇〇〇 XX Creative 1 gloss | (evaluation point) CO CO in oo inch CS CO LO tn ΙΛ l 〇LO l〇to LO in uo 1C LO LO LO LO in Concealment (evaluation point) CO lO CO 1C ΙΟ LO LO LO LO LO l〇LO LO LO LO LO LD LO LO LO L〇LO in in LO Total heat dissipation 蝉mm 豳豳豳噢m 鹧m 蜓噢m 噢|temperature 1 (°〇CO in CO L〇CO in CO iO CO in CNJ LO CN] cr> LO CO LC n LO CO in CM LO CM LO in LO CM ΙΛ CV3 ΙΛ CM LO eg LO CNJ LO CM Ln CV3 LO C^3 LO LO LO CO LO Processability | 丨Processing total 吡 硪 硪 硪 啤 啤 啤 啤 赋 赋 赋 赋 赋砬 赋 赋 轵 轵 剥离 剥离 ( i (evaluation point) in LO LO CO ΙΟ ΓΟ CO CO LO uo LO UO LO LO in CO CO CO gt; CO CO CO in | damage resistance LO CO LO LO in LO in LO rc CO in LfO in in LO CO CO CO CO CO LO lO CO <>3 Cracking (assessment point) LO LO LO in inch inch in in in ID m LO LO LO CO CO uo CN LO Sample No. 1 E26 1 1 E27 1 1 E28 1 1 E29 1 LE30 1 E31 1 E32 1 1 E33 1 1 E34 j 1 E35 1 1 E36 1 1 E37 1 1 E38 1 1 E39 1 1 E40 1 1 Ε4Π 1 E42 1 1 E43 1 1 E44 1 1 E45 I 1 E46 1 E47 I 1 E48 ψ' m UU -27 - 201120367 As seen in Table 4 and Table 5, as LED batteries The heat dissipation property of the basic performance of the heat dissipating member was good in all the samples, but the samples C 1 and C 2 were unacceptable for the workability of the synthetic resin coating film for ensuring the heat dissipation. In this case, the molecular weight of the matrix resin containing the heat-dissipating coating film of the heat-dissipating material affects the workability of the coating film when the heat-dissipating member for the LED electric ball having the special shape of the uneven portion is molded. In addition, the heat-dissipating material, the Ni-filled material, and the inner layer wax contained in the heat-dissipating coating film are selected in the above preferred range, and are not only heat-dissipating and conductive, but also include creativity to enhance the total blending property. . (Embodiment 3) In this embodiment, a modification of the shape of the heat dissipating member 1 shown in the first embodiment is shown. Figs. 9 to 11 show a modification of the shape of the transverse cross section in the direction orthogonal to the axial direction of the heat radiating member 1. Any of the figures corresponds to the third drawing of the first embodiment. In the heat dissipating member 1 0 3 shown in Fig. 9, the cross-sectional shape of the convex portion 1 3 1 and the concave portion 132 of the uneven portion 13 is formed in an arc shape, and the connection is smoothly smoothed. In the heat dissipating member 104 shown in Fig. 10, the cross-sectional shapes of the convex portion 1 4 1 and the concave portion 1 42 of the uneven portion 14 are both configured to remove the trapezoidal shape of the bottom side, and are connected to each other. The heat dissipating member 205 shown in FIG. 1 is configured such that the cross-sectional shapes of the convex portions 1 5 1 -28 - 201120367 and the concave portion 15 2 of the uneven portion 15 are both removed from the triangular shape of the bottom edge and interactively Connector. Fig. 1 is a modification of the overall shape of the heat dissipating member. In the heat dissipating member 1 〇 6 shown in the figure, the description of the uneven portion is omitted, and the direction is displayed only by the line. As shown in the figure, the 'shape of the heat dissipating member' is not a relatively simple conical shape as shown in the first embodiment, but instead is configured as follows from the large diameter portion to the small diameter portion as the heat dissipating member 1 〇6. The so-called Mount Fuji shape in which the inclination angle with respect to the axial direction becomes large. The heat dissipating members 1〇7' shown in Figs. 13 and 14 are different from the forming directions described above, and the convex portions 1 7 1 and the concave portions 1 are arranged in a direction orthogonal to the axial direction. An example of the formation of the uneven portion 17 by a strip of 7 2 strips. According to the above modification, the same effects as those of the first and second embodiments can be obtained. Brief Description of the Drawings Fig. 1 is an explanatory view showing the structure of the precoated aluminum alloy sheet of the first embodiment. Fig. 2 is an explanatory view showing a method of forming a heat dissipating member of the first embodiment. Fig. 3 is a side view showing a heat radiating member of the first embodiment. Fig. 4 is a bottom plan view showing the heat dissipating member of the first embodiment. Fig. 5 is a transverse sectional view of the heat dissipating member of the first embodiment (a cross-sectional view taken along the line A-A of Fig. 3). -29-201120367 Fig. 6 is a cross-sectional view of the cover of the first embodiment (a cross-sectional view taken from the arrow B-B of Fig. 7). Fig. 7 is a plan view of the cover of the first embodiment. Fig. 8 is an explanatory view showing the LED electric ball of the first embodiment. Fig. 9 is a transverse sectional view showing a modification of the heat dissipating member of the third embodiment. Fig. 10 is a transverse cross-sectional view showing a modification of the heat dissipating member of the third embodiment. Fig. 1 is a transverse cross-sectional view showing a modification of the heat dissipating member of the third embodiment. Fig. 1 is a side view showing a modification of the heat dissipating member of the third embodiment, Fig. 13 is a side view showing a modification of the heat dissipating member of the third embodiment, and Fig. 14 is a view showing the heat dissipating member of the embodiment 3. A longitudinal sectional view of a modified example. [Explanation of main component symbols] 1. 103~107: Heat dissipating member for LED electric ball 1 〇: outer peripheral side 12, 13 to 17: uneven portion 1 2 1 : recess 2: precoated aluminum alloy plate 20: substrate -30- 201120367 2 1 : Heat-dissipating coating film (synthetic resin coating film) 8 : LED component 8 0: LED electric ball -31 -

Claims (1)

201120367 七、申請專利範圍: 1.—種LED電球用散熱構件,爲內藏LED元件而成之 LED電球的散熱構件,其特徵爲: 該散熱構件係藉由將鋁合金板模壓成形爲大致呈圓錐 狀所形成; 並且在上述外周側面形成有凹凸部。 2·如申請專利範圍第1項所述之LED電球用散熱構件 ’其中上述鋁合金板,爲將合成樹脂塗膜預塗於由該鋁合 金板所構成之基板的雙面或單面而成之經預塗的鋁合金板 ’被預塗於至少一方的面之上述合成樹脂塗膜,係具備: 在由胺基甲酸酯樹脂、離子鍵聚合物樹脂、聚乙烯樹脂、 環氧樹脂、氟樹脂、及聚酯樹脂的1種或2種以上所構成之 數量平均分子量爲10000〜4 0000的基質樹脂中含有散熱性 物質而成之散熱性塗膜。 3.如申請專利範圍第2項所述之LED電球用散熱構件 ’其中上述散熱性塗膜係含有氧化鈦、碳、二氧化矽、氧 化鋁、及氧化銷的1種或2種以上作爲上述散熱性物質。 4·如申請專利範圍第3項所述之LED電球用散熱構件 ,其中上述散熱性塗膜相對於上述基質樹脂1 00重量份而 言,係含有50~200重量份之平均粒徑0.1〜lOOgm的氧化鈦 、1~25重量份之微粉末的碳、50〜200重量份之二氧化砂、 50〜200重量份之氧化鋁、及50〜200重量份之氧化鉻的1種 或2種以上。 5.如申請專利範圍第4項所述之LED電球用散熱構件 -32- 201120367 ,其中上述散熱性塗膜相對於上述基質樹脂100重量份而 言,係含有0.05-3重量份之羊脂膏、棕櫚蠟、聚乙烯、微 晶蠟的1種或2種之內層蠟。 6.如申請專利範圍第4或5項所述之LED電球用散熱 構件,其中上述散熱性塗膜,係含有平均粒徑〇_ 3 ~1 〇〇 // m 之Ni球狀塡充材、或是0.2〜5#m的厚度且具有2〜50/zm的 長徑之鱗片狀的N i塡充材之至少—方’此等兩者的合計含 量,相對於上述基質樹脂1〇〇重量份而言爲1〜1 000重量份 〇 7 ·如申請專利範圍第2至5項中任一項所述之L E D電 球用散熱構件’其中上述合成樹脂塗膜係形成於上述基板 的表面上所形成之塗佈型或反應型的鉻酸鹽或非鉻酸鹽層 的上層。 8 _如申請專利範圍第2至5項中任一項所述之L E 〇電 球用散熱構件’其中具備上述散熱性塗膜之上述合成樹脂 塗膜’係具備有在上述散熱性塗膜的下層具有底層塗膜之 複數層合構造’上述底層塗膜’係由:由胺基甲酸酯樹脂 、離子鍵聚合物樹脂、聚乙烯樹脂、環氧樹脂、氟樹脂、 及聚酯樹Sb的1種或2種以上所構成之數量平均分子量爲 1 0000〜4000 0的樹脂所構成。 -33 -201120367 VII. Patent application scope: 1. A heat dissipating member for LED electric ball, which is a heat dissipating member of an LED electric ball formed by incorporating an LED element, wherein: the heat dissipating member is formed by molding an aluminum alloy plate into a substantially The conical shape is formed; and the uneven portion is formed on the outer circumferential side surface. 2. The heat radiating member for LED electric ball according to claim 1, wherein the aluminum alloy plate is formed by precoating a synthetic resin coating film on both sides or one side of a substrate composed of the aluminum alloy plate. The precoated aluminum alloy sheet is precoated on at least one of the synthetic resin coating films, and is provided with: a urethane resin, an ionomer resin, a polyethylene resin, an epoxy resin, A heat-dissipating coating film comprising a heat-dissipating material in a matrix resin having a number average molecular weight of 10,000 to 20,000, which is composed of one or two or more kinds of fluororesin and a polyester resin. 3. The above-mentioned heat-dissipating coating film containing one or two or more kinds of titanium oxide, carbon, cerium oxide, aluminum oxide, and an oxidation pin, as described above, Heat-dissipating substance. 4. The heat dissipating member for an LED electric ball according to claim 3, wherein the heat dissipating coating film contains 50 to 200 parts by weight of an average particle diameter of 0.1 to 100 gm with respect to 100 parts by weight of the matrix resin. Titanium oxide, 1 to 25 parts by weight of finely divided carbon, 50 to 200 parts by weight of silica sand, 50 to 200 parts by weight of alumina, and 50 to 200 parts by weight of chromium oxide, one or more of two or more . 5. The heat dissipating member for a LED electric ball according to claim 4, wherein the heat dissipating coating film contains 0.05 to 3 parts by weight of a sheep fat paste, relative to 100 parts by weight of the matrix resin. One or two inner layer waxes of palm wax, polyethylene, and microcrystalline wax. 6. The heat dissipating member for an LED electric ball according to Item 4 or 5, wherein the heat dissipating coating film contains a Ni spherical spheroidal material having an average particle diameter of 〇 3 to 1 〇〇 / / m, Or a total thickness of at least the square of the scaly N i 塡 filling material having a thickness of 0.2 to 5 #m and having a long diameter of 2 to 50 / zm, relative to the weight of the matrix resin The heat-dissipating member for LED electric ball according to any one of claims 2 to 5, wherein the synthetic resin coating film is formed on the surface of the substrate. The upper layer of the coating or reactive chromate or non-chromate layer is formed. The heat-dissipating member for a LE 〇 electric ball according to any one of claims 2 to 5, wherein the synthetic resin coating film having the heat-dissipating coating film is provided on the lower layer of the heat-dissipating coating film. The plurality of laminated structures having the undercoat film 'the above undercoat film' are composed of: a urethane resin, an ionomer resin, a polyethylene resin, an epoxy resin, a fluororesin, and a polyester tree Sb. A resin composed of two or more kinds of resins having a number average molecular weight of from 1,000,000 to 4,000. -33 -
TW099121995A 2009-07-06 2010-07-05 LED ball with heat dissipation components TWI425167B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009159456 2009-07-06
JP2010116993A JP4637272B2 (en) 2009-07-06 2010-05-21 Heat dissipation member for LED bulb

Publications (2)

Publication Number Publication Date
TW201120367A true TW201120367A (en) 2011-06-16
TWI425167B TWI425167B (en) 2014-02-01

Family

ID=43429153

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121995A TWI425167B (en) 2009-07-06 2010-07-05 LED ball with heat dissipation components

Country Status (6)

Country Link
JP (1) JP4637272B2 (en)
KR (1) KR101677470B1 (en)
CN (1) CN102472445B (en)
HK (1) HK1167446A1 (en)
TW (1) TWI425167B (en)
WO (1) WO2011004731A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465669B (en) * 2012-03-01 2014-12-21 Frontand Technology Corp Heat sink, lamp structure with the heat sink and method for producing the heat sink

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011103283A (en) * 2009-10-16 2011-05-26 Sumitomo Light Metal Ind Ltd Heat radiating member for led bulb
JP2011216309A (en) * 2010-03-31 2011-10-27 Kobe Steel Ltd Manufacturing method of heat radiation part of led bulb, and heat radiation part of led bulb
JP5296122B2 (en) 2011-02-28 2013-09-25 株式会社東芝 Lighting device
WO2012140756A1 (en) * 2011-04-14 2012-10-18 住友軽金属工業株式会社 Heat dissipating member for led lamp
JP2012246365A (en) * 2011-05-26 2012-12-13 Hitachi Chemical Co Ltd Thermal emission coating material, and light-emitting diode (led) illumination, heat sink, back sheet for solar cell module each coated therewith
CN102818132A (en) * 2011-06-07 2012-12-12 黄振隆 Heat-radiating structure for LED bulb
JP5497102B2 (en) * 2011-06-08 2014-05-21 株式会社Uacj Pre-coated aluminum alloy plate for heat dissipation member and heat dissipation member using the same
JP5418861B2 (en) * 2011-06-23 2014-02-19 株式会社デンソー AC generator for vehicles
CN102280538A (en) * 2011-08-11 2011-12-14 东莞巨扬电器有限公司 Composite radiator and production technology thereof
KR101233637B1 (en) 2011-12-20 2013-02-15 주식회사 썬엘이디 Bulb type lamp using pla carbon nano materials
KR101129164B1 (en) 2012-01-20 2012-03-26 후지라이테크 주식회사 Manufacturing method of coating material for led lamp with improved reflecting efficieny and led lamp coated with the same as insulating layer
JP2013251174A (en) * 2012-06-01 2013-12-12 Sumitomo Light Metal Ind Ltd Heat radiation member
JPWO2013183198A1 (en) * 2012-06-07 2016-01-28 パナソニック株式会社 Lamps and lighting equipment
KR101390970B1 (en) * 2012-07-11 2014-05-27 주식회사 파인테크닉스 LED lamp housing for heatsink and the manufacture method
CN102927463B (en) * 2012-07-23 2014-10-29 贵州光浦森光电有限公司 LED screw lamp
CN102818158A (en) * 2012-08-21 2012-12-12 福建百达光电有限公司 Combined type LED (Light Emitting Diode) bulb lamp
JP2014053143A (en) * 2012-09-06 2014-03-20 Aps Japan Co Ltd Luminaire
KR101395014B1 (en) * 2012-10-18 2014-05-30 인하대학교 산학협력단 LED fishing lamp heat sink structure
CN103939754A (en) * 2013-01-18 2014-07-23 合肥杰事杰新材料股份有限公司 LED lamp and making method thereof
KR101497088B1 (en) * 2013-04-17 2015-03-03 박지오 Heat sink for led lamp and led lamp having the heat sink
CN103555087B (en) * 2013-09-25 2016-03-02 天长市天泰光电科技有限公司 Fluororesin heat radiation paint of a kind of LED and preparation method thereof
JP6502183B2 (en) * 2015-06-05 2019-04-17 日立化成株式会社 Coating for thermal radiation, and light emitting diode (LED) illumination having the coating, heat sink, back sheet for solar cell module
JP6517086B2 (en) * 2015-06-05 2019-05-22 日立化成株式会社 Thermal radiation coating, light emitting diode (LED) illumination having the same, heat sink, back sheet for solar cell module
JP6512352B2 (en) * 2018-07-09 2019-05-15 日立化成株式会社 Thermal radiation paint and light emitting diode (LED) illumination coated with the same, heat sink, back sheet for solar cell module
KR102353949B1 (en) * 2021-05-03 2022-01-20 주식회사 이노루체 Light for Tunnel

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001243809A (en) 2000-02-28 2001-09-07 Mitsubishi Electric Lighting Corp Led electric bulb
CN2606967Y (en) * 2003-03-27 2004-03-17 博大科技股份有限公司 Heat radiation layer of awaiting radiator
JP4236544B2 (en) 2003-09-12 2009-03-11 三洋電機株式会社 Lighting device
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module
JP2005166578A (en) 2003-12-05 2005-06-23 Hamai Denkyu Kogyo Kk Electric-bulb-shaped led lamp
KR20050084730A (en) * 2004-02-24 2005-08-29 서울반도체 주식회사 Structure for radiation of heat of electric bulb for light-emitting diode
CN2842171Y (en) * 2005-10-31 2006-11-29 江珏 A kind of light source assembly
JP2007181984A (en) * 2006-01-06 2007-07-19 Furukawa Sky Kk Resin-coated aluminum sheet material which is excellent in heat dissipating property, conductivity and processability
CN101161721A (en) * 2006-10-10 2008-04-16 聚鼎科技股份有限公司 Heat conductive electrical-insulation polymeric material and heat-dissipating substrate including same
JP3129399U (en) * 2006-10-25 2007-02-22 和樹 大日向 LED lamp for automobile
JP2008186758A (en) 2007-01-31 2008-08-14 Royal Lighting Co Ltd Self-ballasted lighting led lamp
JP2008277237A (en) * 2007-04-06 2008-11-13 Toyoda Gosei Co Ltd Vehicle headlamp unit
JP2008311002A (en) 2007-06-13 2008-12-25 Futek Inc Compact bulb type irradiation device
JP2009032466A (en) * 2007-07-25 2009-02-12 Toshiba Lighting & Technology Corp Illuminating device
JP5029822B2 (en) * 2007-07-31 2012-09-19 東芝ライテック株式会社 Light source and lighting device
JP2009136848A (en) * 2007-12-11 2009-06-25 Furukawa Sky Kk Heat radiation coated metal plate
TWM343769U (en) * 2008-06-02 2008-11-01 Daywey Co Ltd Heat dissipation apparatus
CN101431858A (en) * 2008-09-09 2009-05-13 秦玉行 All-metal ultra-high conducting CTP circuit board
TWM353309U (en) * 2008-09-12 2009-03-21 Shi-Ming Chen Improved tight fitting structure for annular heat dissipating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465669B (en) * 2012-03-01 2014-12-21 Frontand Technology Corp Heat sink, lamp structure with the heat sink and method for producing the heat sink

Also Published As

Publication number Publication date
TWI425167B (en) 2014-02-01
CN102472445B (en) 2014-04-09
KR101677470B1 (en) 2016-11-18
CN102472445A (en) 2012-05-23
JP2011034958A (en) 2011-02-17
JP4637272B2 (en) 2011-02-23
KR20120052963A (en) 2012-05-24
WO2011004731A1 (en) 2011-01-13
HK1167446A1 (en) 2012-11-30

Similar Documents

Publication Publication Date Title
TW201120367A (en) Heat dissipating member for led light bulb
RU2573681C1 (en) Sol-gel coating containing anisotropic particles and kitchen utensil with such coating
TWI592474B (en) Heat-dissipating powder coating composition, heat-releasing coating film, and article to be coated
TWI337936B (en) High-reflectivity coated metal plate
TW201532804A (en) Resin-coated metal sheet for container and process for manufacturing same
TWI615449B (en) Water-based coating, heat dissipation member, metal component, electronic device
US20110170302A1 (en) Illumination apparatus with a heat sink
US20100219430A1 (en) Light emitting system, light emitting apparatus and forming method thereof
TWI525187B (en) Precoated aluminum alloy plate for heat dissipating member and heat dissipating member using the precoated aluminum alloy plate
JP2005305993A (en) Resin-coated highly functional aluminum material showing excellent heat radiation
CN105860483A (en) PC and PBT reflective material and preparation method thereof
JP5281619B2 (en) LED bulb member and manufacturing method thereof
WO2016072472A1 (en) Reflective film
KR101306495B1 (en) Precoated aluminum sheet for forming and container-shaped formed article
TW201228817A (en) Metal foil for base material and producing method thereof
JP4523250B2 (en) Precoated aluminum alloy plate with excellent heat dissipation, scratch resistance and conductivity
JP2013018233A (en) Resin-coated aluminum base material and method of manufacturing the same
WO2014104292A1 (en) Fluororesin sheet and method for producing same
CN102261586A (en) Part used for LED bulb and manufacturing method thereof
TW201241357A (en) Heat dissipation components for LED bulb
JP5587016B2 (en) Pre-coated aluminum plate for molding and molded container
JP4832830B2 (en) Heat dissipation sheet and manufacturing method thereof
TWM448880U (en) Covering film and flexible printed circuit board having the same
TW201520051A (en) White polyester film
WO2023120207A1 (en) Cooker top plate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees